CN213437852U - Light path structure and laser cutting equipment - Google Patents
Light path structure and laser cutting equipment Download PDFInfo
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- CN213437852U CN213437852U CN202022004458.8U CN202022004458U CN213437852U CN 213437852 U CN213437852 U CN 213437852U CN 202022004458 U CN202022004458 U CN 202022004458U CN 213437852 U CN213437852 U CN 213437852U
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Abstract
The utility model provides a light path structure and have light path structure's laser cutting equipment. The laser transmission assembly comprises a first reflector, a second reflector and a third reflector, and laser emitted by the laser emission assembly sequentially passes through the first reflector, the second reflector and the third reflector; the guide rail includes X axle guide rail and Y axle guide rail, X axle guide rail set up in Y axle guide rail top can be followed Y axle guide rail motion, third speculum and X axle guide rail are connected and can be followed X axle guide rail motion, the second mirror set up in on the X axle guide rail, first speculum set up in on the Y axle guide rail, the second mirror with first speculum is followed Y axle guide rail parallel arrangement, the second mirror with the third speculum is followed X axle guide rail parallel arrangement. Therefore, the utility model provides a can improve the light path structure of laser beam machining precision.
Description
Technical Field
The utility model relates to a laser beam machining technical field especially relates to a light path structure and application the laser cutting equipment of light path structure.
Background
The laser cutting equipment focuses laser emitted from a laser into a laser beam with high power density through an optical path system. The laser beam irradiates the surface of the workpiece to make the workpiece reach a melting point or a boiling point, and simultaneously, the high-pressure gas coaxial with the laser beam blows away the molten or gasified metal. The laser beam propagates in the air to generate a divergence effect, and when the precision requirement of a workpiece needing laser processing is very high, the fluctuation of the light path influences the laser cutting effect. Therefore, it is necessary to provide an optical path structure of a laser cutting apparatus capable of being precisely controlled to improve the precision of laser cutting.
SUMMERY OF THE UTILITY MODEL
The utility model provides a light path structure and application the laser cutting equipment of light path structure aims at improving laser cutting's precision.
Specifically, the utility model provides a light path structure, light path structure includes laser emission subassembly, laser propagation subassembly and guide rail. The laser transmission assembly comprises a first reflector, a second reflector and a third reflector, and laser emitted by the laser emission assembly sequentially passes through the first reflector, the second reflector and the third reflector; the guide rail includes X axle guide rail and Y axle guide rail, X axle guide rail set up in Y axle guide rail top can be followed Y axle guide rail motion, third speculum and X axle guide rail are connected and can be followed X axle guide rail motion, the second mirror set up in on the X axle guide rail, first speculum set up in on the Y axle guide rail, the second mirror with first speculum is followed Y axle guide rail parallel arrangement, the second mirror with the third speculum is followed X axle guide rail parallel arrangement.
In an alternative embodiment, the first mirror is fixedly disposed on the Y-axis guide rail, and the second mirror is fixedly disposed on the X-axis guide rail.
In an optional embodiment, the guide rails include two Y-axis guide rails and an X-axis guide rail, the two Y-axis guide rails are arranged in parallel, two ends of the X-axis guide rail are respectively disposed above the Y-axis guide rail and perpendicular to the Y-axis guide rail, and the first mirror and the second mirror are both disposed on one of the Y-axis guide rails.
In an optional embodiment, the laser emission assembly includes a laser and a beam expander, the laser is connected to the beam expander, and the laser is configured to emit laser light and inject the laser light into the beam expander.
In an optional embodiment, the laser propagation assembly comprises a cutting head connected with the third reflector, the cutting head being configured to receive and cut with the laser.
The utility model also provides a laser cutting equipment for the cutting work piece, laser cutting equipment includes the light path structure, laser cutting equipment includes the workstation, the workstation includes stage body and mesa, the light path structure set up in on the mesa.
In an optional embodiment, the laser cutting equipment comprises a station for placing the workpiece, the station is arranged on the table top, the station is arranged between the two Y-axis guide rails, and the station is arranged below the X-axis guide rail.
In an alternative embodiment, the laser cutting device comprises a camera, which is arranged on the X-axis guide rail and connected with the third reflector.
In an optional embodiment, the laser cutting equipment further comprises a protective cover, the protective cover covers the workbench, a window is formed in the protective cover, the window is used for placing and taking out the workpiece, and a manual door used for opening and closing the window is further arranged on the protective cover.
In an alternative embodiment, the laser cutting device comprises a waste collection box arranged inside the table body.
Therefore, the utility model discloses a provide a light path structure and have light path structure's laser cutting equipment. Specifically, the light path structure comprises a laser emitting component, a laser transmission component and a guide rail. The laser transmission assembly comprises a first reflector, a second reflector and a third reflector, and laser emitted by the laser emission assembly sequentially passes through the first reflector, the second reflector and the third reflector; the guide rail includes X axle guide rail and Y axle guide rail, X axle guide rail set up in Y axle guide rail top can be followed Y axle guide rail motion, third speculum and X axle guide rail are connected and can be followed X axle guide rail motion, the second mirror set up in on the X axle guide rail, first speculum set up in on the Y axle guide rail, the second mirror with first speculum is followed Y axle guide rail parallel arrangement, the second mirror with first speculum is followed X axle guide rail parallel arrangement. Therefore, the utility model provides an optical path structure that the optical path is short and can control in a flexible way to improve laser cutting's precision.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the optical path structure of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the laser cutting apparatus of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 2.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
11 | |
| 110 | |
111 | |
| 12a | |
12b | Second reflecting |
| 12c | |
13 | |
| 130 | X-axis guide rail | 131 | Y- |
| 20 | |
21 | Working table |
| 210 | |
211 | |
| 211a | Waste |
22 | Camera with a camera module |
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. If there is a description in an embodiment of the present invention referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Laser cutting is to irradiate a workpiece with a focused high-power-density laser beam to quickly melt, vaporize and ablate the irradiated material or reach a burning point, and simultaneously blow off the molten material by means of a high-speed airflow coaxial with the beam, thereby realizing the cutting of the workpiece. Laser cutting is one of the thermal cutting methods. However, compared with other cutting methods, the laser cutting method has a narrow cut width and is often used for products with high cutting precision requirements. Therefore, it is necessary to improve the cutting accuracy of the laser cutting apparatus.
Referring to fig. 1, the present invention provides an optical path structure 10, where the optical path structure 10 includes a laser emitting component 11, a laser transmitting component, and a guide rail 13. The laser transmission assembly comprises a first reflecting mirror 12a, a second reflecting mirror 12b and a third reflecting mirror 12c, and the laser emitted by the laser emission assembly 11 passes through the first reflecting mirror 12a, the second reflecting mirror 12b and the third reflecting mirror 12c in sequence; guide rail 13 includes X axle guide rail 130 and Y axle guide rail 131, X axle guide rail 130 set up in Y axle guide rail 131 top and can follow Y axle guide rail 131 moves, third speculum 12c and X axle guide rail 130 are connected and can follow X axle guide rail 130 moves, second speculum 12b set up in on the X axle guide rail 130, first speculum 12a set up in on the Y axle guide rail 131, second speculum 12b with first speculum 12a is followed Y axle guide rail 131 parallel arrangement, second speculum 12b with third speculum 12c is followed X axle guide rail 130 parallel arrangement. As such, the optical path length is the length of the laser beam from the laser emitting assembly 11 to the third reflecting mirror 12 c. Specifically, the optical path from the laser emitting component 11 to the first reflecting mirror 12a is a first optical path, the optical path from the first reflecting mirror 12a to the second reflecting mirror 12b is a second optical path, and the optical path from the second reflecting mirror 12b to the third reflecting mirror 12c is a third optical path. As such, the first and third optical paths are parallel, and the second optical path is perpendicular to the first and third optical paths. Further, since the third mirror 12c is movable along the X-axis guide 130, the length of the third optical path may be changed according to the movement of the third mirror 12 c. And the X-axis guide 130 is movable along the Y-axis guide 131, so that the length of the second optical path is also variable.
In an alternative embodiment, the first mirror 12a is fixedly disposed on the Y-axis rail 131, and the second mirror 12b is fixedly disposed on the X-axis rail 130. In this way, it is ensured that the first reflecting mirror 12a can receive the laser beam emitted from the laser generating assembly and reflect the laser beam onto the second reflecting mirror 12 b. Meanwhile, since the second reflecting mirror 12b is fixedly disposed on the X-axis guide rail 130, the second reflecting mirror 12b can move along the Y-axis guide rail 131 along with the X-axis guide rail 130, so as to change the length of the second optical path, thereby adjusting the length of the optical path more conveniently, and achieving a better laser cutting effect.
In an alternative embodiment, the guide rails include two Y-axis guide rails 131 and one X-axis guide rail 130, the two Y-axis guide rails 131 are arranged in parallel, two ends of the X-axis guide rail 130 are respectively arranged above the Y-axis guide rails 131 and are arranged perpendicular to the Y-axis guide rails 131, and the first reflector 12a and the second reflector 12b are both arranged on one of the Y-axis guide rails 131. Furthermore, two ends of the X-axis guide rail 130 are movably connected to the two Y-axis guide rails 131, so that the movement track of the X-axis is more stable. The first reflector 12a and the second reflector 12b are disposed on the same Y-axis guide rail 131. The second light path is formed at one side of the X-axis guide 130. The specific adjusting direction of the light path can be set according to actual needs.
In an optional embodiment, the laser emitting assembly 11 includes a laser 110 and a beam expander 111, the laser 110 is connected to the beam expander 111, and the laser 110 is configured to emit laser light and emit the laser light into the beam expander 111. The beam expander 111 is a lens assembly capable of changing the diameter and divergence angle of the laser beam. The beam expander 111 may function to improve the focusing effect of the laser.
In an alternative embodiment, the laser propagation assembly comprises a cutting head connected to the third mirror 12c for receiving and cutting with laser light. The cutting head comprises the following components: a nozzle, a focusing lens and a focus tracking system. Cutting is performed by using the energy of the laser beam, and the original beam emitted from the laser 110 must be focused by a lens to form a high-energy-density spot. According to the gaussian optical theory, the power density is highest at the focus. The longer the focal length of the lens, the larger the focal spot and the lower the power density, but the larger the focal depth (the focal depth is the distance between two spots where the diameter of both sides of the focal point changes to 5%, and is also referred to as the effective cutting range in cutting), the larger the operation tolerance. The tracking system is generally composed of a focusing cutting head and a tracking sensor system. The cutting head comprises a light guide focusing part, a water cooling part, an air blowing part and a mechanical adjusting part; the sensor is composed of a sensing element and an amplification control part. Tracking systems are completely different depending on the sensor element, and there are mainly two types of tracking systems, one is a capacitive sensor tracking system, also known as a non-contact tracking system. The other is an inductive sensor tracking system, which is also called a contact tracking system.
Referring to fig. 2 to fig. 3, the present invention further provides a laser cutting apparatus 20 for cutting a workpiece, wherein the laser cutting apparatus 20 includes the optical path structure 10, the laser cutting apparatus 20 includes a worktable 21, the worktable 21 includes a table body 211 and a table top 210, and the optical path structure 10 is disposed on the table top 210. Specifically, the optical path structure 10 is disposed on the table 210, and functions to cut a workpiece to be cut. Other components for improving the cutting accuracy may also be disposed on the table 210. Further, a station for placing a workpiece to be cut is further disposed on the table 210.
In an alternative embodiment, the laser cutting apparatus 20 includes a station for placing the workpiece, the station is disposed on the table 210, the station is disposed between the two Y-axis guide rails 131, and the station is disposed below the X-axis guide rail 130. Therefore, when the workpiece needs to be machined, a user can place the workpiece to be cut on the station. The laser cutting device 20 is then turned on. The laser cutting apparatus 20 further includes a bracket that is disposed on the X-axis guide 130 and is movable along the X-axis guide 130. The cutting head and the third reflector 12c are arranged on the bracket and driven by the bracket to move. Thus, the support, the X-axis guide 130, and the Y-axis guide 131 pass through. The cutting head effects movement over the workpiece to effect cutting. Further, the laser cutting device 20 further comprises a control assembly, and the control assembly can be used for controlling the motion track of the cutting head, so as to realize the cutting of the workpiece.
In an alternative embodiment, the laser cutting device 20 includes a camera 22, and the camera 22 is disposed on the X-axis guide 130 and connected to the third reflector 12 c. Further, the camera 22 is a CCD camera 22, the CCD camera 22 is a key component in a machine vision system, and CCD, english full name: charge coupled Device, chinese full name: a charge coupled device. A CCD is a semiconductor device that can convert an optical image into a digital signal. The selection of the appropriate camera 22 is also an important part of the design of the machine vision system, and the camera 22 not only directly determines the resolution, quality and the like of the acquired image, but also directly relates to the operation mode of the whole system.
In an optional embodiment, the laser cutting device 20 further includes a protection cover, the protection cover covers the workbench 21, a window is formed in the protection cover, the window is used for placing and taking out the workpiece, and the protection cover is further provided with a manual door for opening and closing the window. The safety of the laser cutting device 20 during operation is ensured by the protective cover, since the temperature during the laser cutting process is relatively high. Furthermore, the protective cover is further provided with a window, and the window is used for placing the workpiece to the station. In an alternative embodiment, the protective cover is further provided with a manual door for opening and closing the window. Furthermore, a transparent window is formed in the manual door so as to observe the working state of the workpiece during machining. Specifically, the laser cutting device 20 is a semi-automatic laser cutting device 20, and when a workpiece needs to be cut, the manual door is opened, the workpiece to be machined is placed in the manual door, and the workpiece is positioned through the fixing device. And then the manual door is closed, and the laser cutting equipment 20 is started to cut the workpiece. And taking out the processed workpiece after the cutting is finished. Thus, the machining process of one workpiece is completed. Due to the high temperature during the laser cutting process, the laser cutting device 20 is provided with two start buttons for safety, and the laser cutting device 20 can be started only by pressing the two start buttons at the same time. Meanwhile, the laser cutting device 20 is further provided with a three-color lamp for prompting the working state of the laser cutting device 20.
In an alternative embodiment, the laser cutting apparatus 20 includes a waste collecting box 211a, and the waste collecting box 211a is disposed inside the table body 211. The waste collecting box 211a is integrally arranged in the working table 21, so that the waste after being processed can be timely treated. Enabling the laser cutting device 20 to be used more conveniently.
It should be noted that the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Claims (10)
1. An optical path structure, comprising:
a laser emitting assembly;
the laser transmitting assembly comprises a laser transmitting assembly, a laser receiving assembly and a laser transmitting assembly, wherein the laser transmitting assembly comprises a first reflector, a second reflector and a third reflector;
the guide rail, the guide rail includes X axle guide rail and Y axle guide rail, X axle guide rail set up in Y axle guide rail top can be followed Y axle guide rail motion, third speculum and X axle guide rail are connected and can be followed X axle guide rail motion, the second mirror set up in on the X axle guide rail, first speculum set up in on the Y axle guide rail, the second mirror with first speculum is followed Y axle guide rail parallel arrangement, the second mirror with the third speculum is followed X axle guide rail parallel arrangement.
2. The optical circuit structure according to claim 1, wherein the first reflecting mirror is fixedly disposed on the Y-axis guide rail, and the second reflecting mirror is fixedly disposed on the X-axis guide rail.
3. The optical path structure of claim 1, wherein the guide rails include two Y-axis guide rails and an X-axis guide rail, the two Y-axis guide rails are disposed in parallel, two ends of the X-axis guide rail are respectively disposed above the Y-axis guide rails and are disposed perpendicular to the Y-axis guide rails, and the first mirror and the second mirror are disposed on one of the Y-axis guide rails.
4. The optical circuit structure of claim 1, wherein the laser emitting assembly comprises a laser and a beam expander, the laser and the beam expander being connected, the laser being configured to emit laser light and to enter the beam expander.
5. The optical circuit structure of claim 1, wherein the laser propagation assembly comprises a cutting head, the cutting head being connected to the third reflector, the cutting head being configured to receive and cut with the laser.
6. A laser cutting apparatus for cutting a workpiece, comprising the optical path structure according to any one of claims 1 to 5, the laser cutting apparatus comprising a table including a table body and a table top, the optical path structure being provided on the table top.
7. The laser cutting apparatus of claim 6, wherein the laser cutting apparatus includes a station for placing the workpiece, the station being disposed on the table, the station being disposed between the two Y-axis rails, the station being disposed below the X-axis rail.
8. The laser cutting apparatus of claim 6, wherein the laser cutting apparatus includes a camera disposed on the X-axis rail and coupled to the third mirror.
9. The laser cutting apparatus according to claim 6, further comprising a protective cover provided on the table, the protective cover having a window for placing and taking out the workpiece, the protective cover further having a manual door for opening and closing the window.
10. The laser cutting apparatus of claim 6, wherein the laser cutting apparatus includes a waste collection box disposed inside the stage body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022004458.8U CN213437852U (en) | 2020-09-14 | 2020-09-14 | Light path structure and laser cutting equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022004458.8U CN213437852U (en) | 2020-09-14 | 2020-09-14 | Light path structure and laser cutting equipment |
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| CN213437852U true CN213437852U (en) | 2021-06-15 |
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| CN202022004458.8U Active CN213437852U (en) | 2020-09-14 | 2020-09-14 | Light path structure and laser cutting equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114985968A (en) * | 2022-06-06 | 2022-09-02 | 深圳泰德激光技术股份有限公司 | Laser cutting equipment |
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2020
- 2020-09-14 CN CN202022004458.8U patent/CN213437852U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114985968A (en) * | 2022-06-06 | 2022-09-02 | 深圳泰德激光技术股份有限公司 | Laser cutting equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 401m-2, bike technology building, No.9, scientific research road, Maling community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Taide Laser Technology Co.,Ltd. Address before: Room 1005, 10th floor, SAIC building, 4050 Nanhai Avenue, Maling community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN TETE LASER TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |