CN117936558A - Chip packaging structure and chip packaging method - Google Patents
Chip packaging structure and chip packaging method Download PDFInfo
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- CN117936558A CN117936558A CN202311658455.8A CN202311658455A CN117936558A CN 117936558 A CN117936558 A CN 117936558A CN 202311658455 A CN202311658455 A CN 202311658455A CN 117936558 A CN117936558 A CN 117936558A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 86
- 230000008093 supporting effect Effects 0.000 claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 230000008602 contraction Effects 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 10
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 239000004568 cement Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 201000010099 disease Diseases 0.000 description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000009206 nuclear medicine Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The application discloses a chip packaging structure and a chip packaging method, wherein the chip packaging structure comprises: a chip comprising an optical pixel region; a scintillator comprising a first region and a second region; the second areas are arranged on two sides of the first area, and the first area covers the optical pixel area of the chip; the optical adhesive is arranged between the first area and the chip to fill a gap between the first area and the chip; and a supporting piece is arranged at the position, opposite to the second area, of the two sides of the chip, and curing glue is filled between the supporting piece and the second area. By the mode, only one material is arranged in the gap between the scintillator and the optical pixel area, so that light transmitted through the scintillator can reach integrity and uniformity when the light irradiates the chip pixel area, and the light transmission stability of the optical pixel area of the packaging structure is ensured.
Description
Technical Field
The present application relates to the field of chip packaging technologies, and in particular, to a chip packaging structure and a chip packaging method.
Background
The scintillator is a functional material for converting high-energy rays or particles such as X-rays, gamma-rays and the like into visible light or ultraviolet light, can help people to study the high-energy rays invisible to naked eyes, is an important tool for high-energy ray detection, and can be used for radiation detection and safety protection.
In medicine, the chip packaging structure packaged with the scintillator is a core component of nuclear medicine image equipment, and can help doctors to quickly diagnose, discover diseases early and prevent and treat the diseases in time; likewise, the chip packaging structure can play an irreplaceable role in the fields of article security inspection, nondestructive inspection of large industrial equipment, petroleum well logging, radioactivity detection, environment monitoring and the like.
The inventors found that: in the existing chip packaging structure, when the scintillator is packaged, the scintillator needs to be accurately and completely covered in the corresponding chip optical pixel area and a gap is reserved between the scintillator and the scintillator, and at the moment, the scintillator is filled with optical glue with high fluidity, so that the scintillator cannot be accurately fixed to an installation position before the optical glue is fixedly connected to the optical pixel area, UV glue is needed to be used for auxiliary support, the UV glue needs to be coated on the chip optical pixel area, and due to the fact that components of the UV glue and the optical glue are different in light transmittance, the final product can have deviation of light energy, and the product can possibly fail.
Disclosure of Invention
The application mainly solves the technical problem of providing a chip packaging structure and a chip packaging method, which can realize that only one material is used for a gap between a scintillator and an optical pixel area, so that light transmitted through the scintillator can reach integrity and unification when the light irradiates the chip pixel area, and the light transmission stability of the optical pixel area of the packaging structure is ensured.
In order to solve the above technical problem, a first aspect of the present application provides a chip package structure, including: the chip comprises an optical pixel area; a scintillator including a first region and a second region; the second areas are arranged on two sides of the first area, and the first area covers the optical pixel area of the chip; the optical adhesive is arranged between the first area and the chip to fill a gap between the first area and the chip; and a supporting piece is arranged at the position, opposite to the second area, of the two sides of the chip, and curing glue is filled between the supporting piece and the second area.
The first area and the projection of the optical cement along the arrangement direction of the chip and the scintillator are overlapped.
The support piece on one side of the chip is a cushion block, and the support piece on one side is a non-pixel area of the chip.
The supporting pieces on two sides of the chip are non-pixel areas of the chip.
Wherein the first region and the second region of the scintillator are integrally formed.
The chip packaging structure further comprises a carrier plate, and the chip is arranged on the carrier plate.
In order to solve the above technical problem, a second aspect of the present application provides a chip packaging method, which includes:
Fixing the chip in a preset chip area of the packaging structure; covering the scintillator onto the chip, wherein a first region of the scintillator covers an optical pixel region of the chip; fixing the second region of the scintillator to the support by curing glue; gaps are reserved between the first area of the scintillator and the optical pixel area of the chip, and the gaps are filled and cured through optical glue so as to be connected to the first area of the scintillator and the optical pixel area of the chip in an adhesive mode.
The step of fixing the chip in a preset chip area of the packaging structure comprises the following steps: the preset chip area of the packaging structure is arranged on the carrier plate; and fixing the chip in a preset chip area of the carrier plate.
Wherein the step of fixing the second region of the scintillator to the support by curing glue comprises, prior to: the supporting piece on one side of the chip is a cushion block, and the supporting piece on one side is a non-pixel area of the chip; fixing the gasket in a preset cushion block area of the packaging structure; and selecting a cushion block according to the chip, and determining the position of the preset cushion block according to the position of the preset chip.
Wherein, the step of determining the position of the preset cushion block according to the position of the preset chip comprises the following steps: determining the preset pad locations includes a side of the chip edge away from the non-optical pixel area.
The step of fixing the gasket in a preset cushion block area of the packaging structure comprises the following steps: the preset chip area of the packaging structure is arranged on the carrier plate; and fixing the cushion block in a preset cushion block area of the carrier plate.
Wherein, the cushion block is selected according to at least one of the thickness, the size and the expansion and contraction coefficient of the chip.
The technical scheme is different from the situation in the prior art, the chip packaging structure and the packaging method provided by the application have the advantages that the supporting points of the solidified glue are changed, the scintillator structure is optimized to enlarge the size, the non-optical pixel area is used for providing physical support for the scintillator, only one material is used for a gap between the scintillator and the optical pixel area, so that light passing through the scintillator can reach integrity and unification when the light irradiates the chip pixel area, and the light transmission stability of the optical pixel area of the packaging structure is ensured.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of a chip package structure according to the present application;
FIG. 2 is a top view of a chip package structure according to an embodiment of the application;
FIG. 3 is a cross-sectional view of another embodiment of a chip package structure according to the present application;
FIG. 4 is a top view of another embodiment of a chip package structure according to the present application;
FIG. 5 is a flow chart of an embodiment of a method of packaging a chip according to the present application;
fig. 6 is a flowchart of another embodiment of the chip packaging method of the present application.
Detailed Description
The present application will be described in detail with reference to the drawings and embodiments.
Referring to fig. 1, fig. 1 is a cross-sectional view of a chip package structure according to an embodiment of the application;
as shown in fig. 1, the chip package structure includes:
the chip 110 includes an optical pixel region 111.
The chip optical pixel area 111 is configured to receive the converted light transmitted through the scintillator 120, convert the converted light into an electrical signal, and the chip package structure may be formed by splicing and combining the chip modules of the plurality of optical pixel areas and the non-optical pixel area.
The scintillator 120 includes a first region 121 and a second region 122.
The first region 121 of the scintillator 120 may convert high-energy rays or particles such as X-rays, gamma rays, etc. into visible light or ultraviolet light, and the second region may or may not have a light conversion function.
The second regions 122 are disposed on two sides of the first region 121, and the first region 121 covers the optical pixel region 111 of the chip.
The first area 121 needs to cover the optical pixel area 111 according to the function and the structural position of the optical pixel area of the chip, and the second area 122 is disposed on two sides of the first area 121 for providing a basis of physical support.
The optical adhesive 131 is disposed between the first region 121 and the chip 110 to fill a gap between the first region 121 and the chip 110.
Because the scintillator 120 and the chip 110 are solid materials, the two materials are bonded together, otherwise, gaps cannot be formed by tight bonding, and only the gaps exist to break the light energy to influence signals; if the UV glue is used for gluing, the stress on the chip 110 is too large, which may cause damage and cracking of the chip, and the glue with too large viscosity of the UV glue cannot be uniformly coated on the surface of the object, so that gaps cannot be perfectly filled, so that the optical glue with appropriate stress and viscosity is selected for connection; the optical adhesive 131 is still a liquid with strong fluidity when filling the gaps, and the first area 121 and the optical pixel area 111 of the chip are connected only after being cured by irradiation.
The positions of the two sides of the chip 110 opposite to the second area 122 are further provided with a supporting member, and a curing adhesive 132 is filled between the supporting member and the second area 122.
The supporting member is selected according to the shape, material, shape, etc. of the chip 110, and may be the same material as the chip 110 or a different material, and the supporting member and the curing adhesive 132 thereon provide physical support for the second region 122 of the scintillator, so that the first region 121 and the optical pixel region 111 are precisely fixed.
Referring to fig. 2 in combination, fig. 2 is a top view of a chip package structure according to an embodiment of the application.
The projections of the first region 121 and the optical cement 131 along the arrangement direction of the chip and the scintillator are overlapped.
In order to achieve that the optical pixel region 111 of the chip 110 can fully receive and utilize the converted light transmitted through the scintillator 120, the projection area of the first region 121 of the scintillator covered on the optical pixel region 111 may be greater than or equal to the area of the optical pixel region 111, and the optical adhesive 131 may fully cover the optical pixel region 111 and have the same projection area as the optical pixel region 111.
The supporting members on both sides of the chip 110 are the non-pixel regions 122 of the chip 110.
The chip packaging structure can be formed by splicing and combining a plurality of chip modules in the optical pixel area and the non-optical pixel area, and when the chip modules are combined into a double-row structure, the supporting pieces on two sides are the non-pixel areas of the chip.
Wherein the first region 121 and the second region 122 of the scintillator 120 are integrally formed.
In order to ensure that the scintillator 120 covered on the chip 110 module has a certain light transmittance and does not generate loss, the first area 121 and the second area 122 are integrally formed; when the chip modules are spliced and combined into a chip packaging structure, the whole scintillator for covering the chip packaging structure is also integrally formed.
The chip package structure further includes a carrier 100, and the chip 110 is disposed on the carrier 100.
The carrier board 100 refers to a printed circuit board (Printed Circuit Board, PCB), a package substrate, or a Quad Flat No-lead (QFN) type frame, among others.
Referring to fig. 3 and fig. 4 in combination, fig. 3 is a structural cross-sectional view of another embodiment of a chip package structure according to the present application; FIG. 4 is a top view of another embodiment of a chip package structure according to the present application;
As shown in fig. 3 and 4: the chip packaging structure comprises: a chip 110, the chip 110 including an optical pixel region 111; a scintillator 120 including a first region 121 and a second region 122; the second regions 122 are disposed on two sides of the first region 121, and the first region 121 covers the optical pixel region 111 of the chip 110; the optical adhesive 131 is arranged between the first area 121 and the chip 110 to fill a gap between the first area 121 and the chip 110; the positions of the two sides of the chip 110 opposite to the second area 122 are also provided with supporting pieces, and curing glue 132 is filled between the supporting pieces and the second area 121. The projections of the first region 121 and the optical adhesive 131 along the arrangement direction of the chip 110 and the scintillator 120 overlap. Wherein the first region 121 and the second region 122 of the scintillator 120 are integrally formed. The chip package structure further includes a carrier 100, and the chip is disposed on the carrier 100.
In particular, please refer to the explanation of the chip package structure of fig. 1 and fig. 2, and the description thereof is omitted herein.
The supporting member on one side of the chip 110 is the pad 140, and the supporting member on one side is the non-pixel area 112 of the chip 110.
The chip package structure can be formed by splicing and combining a plurality of optical pixel areas 111 and chip modules of non-optical pixel areas 112, when the chip modules are combined into a single-row structure, a cushion block 140 needs to be added, a supporting piece on one side of the chip 110 is the cushion block 140, and a supporting piece on one side is the non-pixel area 122 of the chip 110.
The length of the pad 140 may not be equal to the length of the side of the chip 110 where the pad 140 is disposed, and may be equal in other embodiments.
Referring to fig. 5, fig. 5 is a flowchart of an embodiment of a chip packaging method according to the present application, as shown in fig. 5:
S501: and fixing the chip in a preset chip area of the packaging structure.
The chip packaging structure can be formed by splicing and combining the chip modules in the plurality of optical pixel areas and the non-optical pixel areas, and each chip module needs to be mounted at each preset chip position according to different packaging requirements.
S502: covering the scintillator onto the chip, wherein a first region of the scintillator covers an optical pixel region of the chip; the second region of the scintillator is secured to the support by a cured glue.
To achieve that the optical pixel area of the chip can sufficiently receive and utilize the converted light transmitted through the scintillator 120, the projected area of the first region of the scintillator covering the optical pixel area may be greater than or equal to the area of the optical pixel area.
The support piece is arranged at the position, opposite to the second area, of the two sides of the chip packaging structure, curing glue is dispensed on the support piece, and after the scintillator covers the chip, the curing glue is cured by using curing light to reach the fixation of the glue.
In a specific embodiment of an embodiment, when the chip modules are combined into a double-row structure, the supporting pieces on two sides are non-pixel areas of the chip; in another embodiment, when the chip module is in a single-row structure, a cushion block needs to be added, a support piece on one side of the chip is the cushion block, and a support piece on one side is a non-pixel area of the chip.
S503: gaps are reserved between the first area of the scintillator and the optical pixel area of the chip, and the gaps are filled and cured through optical glue so as to be connected to the first area of the scintillator and the optical pixel area of the chip in an adhesive mode.
Because the scintillator and the chip are solid substances, the scintillator and the chip are bonded and connected, otherwise, the scintillator and the chip cannot be tightly bonded to generate gaps, and only the gaps exist, so that the signals of the damage influence of light energy are generated, and optical glue with proper stress and viscosity is selected for connection; the optical cement 131 can completely cover the optical pixel region 111 and has the same size as the projection area of the optical pixel region 111; the optical adhesive is still a liquid with strong fluidity when filled between the gaps, and the first area 121 and the optical pixel area 111 of the chip are connected only after light curing is needed.
The step of fixing the chip in a preset chip area of the packaging structure comprises the following steps: the preset chip area of the packaging structure is arranged on the carrier plate; and fixing the chip in a preset chip area of the carrier plate.
The chip packaging structure further comprises a carrier plate, wherein the carrier plate refers to a printed circuit board (Printed Circuit Board, PCB), a packaging substrate, a Quad Flat No-LEADS PACKAGE (QFN) frame or the like, and the chip is arranged in a preset chip area of the carrier plate.
Referring to fig. 6, fig. 6 is a flowchart of another embodiment of a chip packaging method according to the present application, as shown in fig. 6:
S601: and fixing the chip in a preset chip area of the packaging structure. S602: covering the scintillator onto the chip, wherein a first region of the scintillator covers an optical pixel region of the chip; fixing the second region of the scintillator to the support by curing glue; s603: gaps are reserved between the first area of the scintillator and the optical pixel area of the chip, and the gaps are filled and cured through optical glue so as to be connected to the first area of the scintillator and the optical pixel area of the chip in an adhesive mode.
The step of fixing the chip in a preset chip area of the packaging structure comprises the following steps: the preset chip area of the packaging structure is arranged on the carrier plate; and fixing the chip in a preset chip area of the carrier plate.
Specifically, please refer to an explanation of the flow chart of the chip packaging method in fig. 5, which is not described herein.
S6011: wherein the step of fixing the second region of the scintillator to the support by curing glue comprises, prior to: the supporting piece on one side of the chip is a cushion block, and the supporting piece on one side is a non-pixel area of the chip; fixing the gasket in a preset cushion block area of the packaging structure; and selecting a cushion block according to the chip, and determining the position of the preset cushion block according to the position of the preset chip.
In this embodiment, the chip module is combined into a single-row structure, and a pad needs to be added, and a support piece on one side of the chip is the pad, and a support piece on one side is a non-pixel area of the chip.
Because of the different chip modules selected, the number of the combinations is different, corresponding cushion blocks need to be selected according to the chips, the lengths of the cushion blocks can be different from the lengths of one sides of the chips provided with the cushion blocks, and in other embodiments, the cushion blocks can be equal, and the cushion blocks with the projection shapes of rectangle, ellipse, circle and the like can be also selected.
Wherein, the step of determining the position of the preset cushion block according to the position of the preset chip comprises the following steps: determining the preset pad locations includes a side of the chip edge away from the non-optical pixel area.
When two supporting bodies are arranged at the positions relatively far away from the two sides of the chip, the supporting bodies can provide the best physical supporting effect for the second area of the scintillator, in other embodiments, a plurality of supporting pieces can be arranged at the outermost edge of the chip module combination and are respectively positioned at a plurality of positions along the edges of the chip, and a better supporting effect can be achieved.
The step of fixing the gasket in a preset cushion block area of the packaging structure comprises the following steps: the preset chip area of the packaging structure is arranged on the carrier plate; and fixing the cushion block in a preset cushion block area of the carrier plate.
The chip package structure further comprises a carrier plate, wherein the carrier plate refers to a printed circuit board (Printed Circuit Board, PCB), a package substrate, or a Quad Flat No-LEADS PACKAGE (QFN) frame and the like, the chip is arranged in a preset chip area of the carrier plate, and in order to fix the scintillator covered on the chip, a cushion block is required to be fixed in the preset cushion block area on the carrier plate.
Wherein, the cushion block is selected according to at least one of the thickness, the size and the expansion and contraction coefficient of the chip.
In order to ensure the accuracy of the scintillator mounting, the spacer and the supporting part of the non-optical area of the chip are preferably made to have the same height and/or the corresponding size, and expansion and contraction or other conditions which cause the expansion and contraction of the chip and the spacer can occur in the use process of the packaged product, so that the spacer is preferably made of materials with the same expansion and contraction coefficients, and can be preferably a bare silicon wafer.
According to the chip packaging structure and the packaging method, the solid glue supporting points are changed, the size of the scintillator structure is optimized, the non-optical pixel area is used for providing physical support for the scintillator, only one material is used for a gap between the scintillator and the optical pixel area, so that light transmitted through the scintillator can reach integrity and unification when the light irradiates the chip pixel area, and the light transmission stability of the optical pixel area of the packaging structure is ensured.
In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiment.
In addition, each functional unit in each embodiment of the present application may be integrated in one processing unit, each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied in essence or a part contributing to the prior art or all or part of the technical solution in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (12)
1. A chip package structure, characterized in that the chip package structure comprises:
A chip comprising an optical pixel region;
a scintillator comprising a first region and a second region; the second areas are arranged on two sides of the first area, and the first area covers the optical pixel area of the chip;
the optical adhesive is arranged between the first area and the chip to fill a gap between the first area and the chip;
and a supporting piece is arranged at the position, opposite to the second area, of the two sides of the chip, and curing glue is filled between the supporting piece and the second area.
2. The package structure according to claim 1, wherein the first region and the projection of the optical paste along the arrangement direction of the chip and the scintillator coincide.
3. The package structure of claim 1, wherein the support on one side of the chip is a pad and the support on one side is a non-pixel area of the chip.
4. The package structure of claim 1, wherein the support members on both sides of the chip are non-pixel regions of the chip.
5. The chip package structure according to any one of claims 1 to 4, wherein the first region and the second region of the scintillator are integrally formed.
6. The chip package structure according to any one of claims 1 to 4, further comprising a carrier plate, the chip being disposed on the carrier plate.
7. A chip packaging method, characterized in that the chip packaging method comprises:
Fixing the chip in the preset chip area of the packaging structure;
Overlaying the scintillator onto the chip, wherein the first region of the scintillator is overlaid onto the optical pixel area of the chip;
fixing the second region of the scintillator to the support by the cured glue;
And gaps are reserved between the first area of the scintillator and the optical pixel area of the chip, and the gaps are filled and cured through optical glue so as to be connected to the first area of the scintillator and the optical pixel area of the chip in an adhesive mode.
8. The packaging method of claim 7, wherein the step of fixing the chip to the predetermined chip area of the package structure comprises:
The preset chip area of the packaging structure is arranged on the carrier plate;
and fixing the chip in the preset chip area of the carrier plate.
9. The method of packaging of claim 7, wherein the step of securing the second region of the scintillator to the support by the cured glue comprises, prior to:
The supporting piece on one side of the chip is the cushion block, and the supporting piece on one side is a non-pixel area of the chip;
Fixing the gasket to the preset cushion block area of the packaging structure; and selecting a cushion block according to the chip, and determining the position of the preset cushion block according to the position of the preset chip.
10. The packaging method of claim 9, wherein the step of determining the preset pad locations based on preset chip locations comprises: determining the preset pad positions comprises the side, away from the non-optical pixel area, of the chip edge.
11. The method of packaging of claim 9, wherein the step of securing the spacer to the predetermined pad area of the package structure comprises:
The preset chip area of the packaging structure is arranged on the carrier plate;
And fixing the cushion block in the preset cushion block area of the carrier plate.
12. The packaging method of claim 9, wherein the spacer is selected based on at least one of a thickness, a size, and an expansion and contraction coefficient of the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311658455.8A CN117936558A (en) | 2023-12-05 | 2023-12-05 | Chip packaging structure and chip packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311658455.8A CN117936558A (en) | 2023-12-05 | 2023-12-05 | Chip packaging structure and chip packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117936558A true CN117936558A (en) | 2024-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311658455.8A Pending CN117936558A (en) | 2023-12-05 | 2023-12-05 | Chip packaging structure and chip packaging method |
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| Country | Link |
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| CN (1) | CN117936558A (en) |
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- 2023-12-05 CN CN202311658455.8A patent/CN117936558A/en active Pending
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