CN117915572A - Method for improving fine circuit processing quality - Google Patents
Method for improving fine circuit processing quality Download PDFInfo
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- CN117915572A CN117915572A CN202310561963.8A CN202310561963A CN117915572A CN 117915572 A CN117915572 A CN 117915572A CN 202310561963 A CN202310561963 A CN 202310561963A CN 117915572 A CN117915572 A CN 117915572A
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- film
- circuit board
- board
- circuit
- washing
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- 238000000034 method Methods 0.000 title claims abstract description 69
- 238000012545 processing Methods 0.000 title claims abstract description 32
- 238000005406 washing Methods 0.000 claims abstract description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 230000008569 process Effects 0.000 claims abstract description 33
- 238000001035 drying Methods 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 5
- 238000004590 computer program Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 3
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 230000005764 inhibitory process Effects 0.000 abstract description 2
- 239000003814 drug Substances 0.000 description 19
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000669 biting effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a method for improving the processing quality of fine circuits, which comprises the steps of placing a board, enabling a double-sided board element to face downwards, enabling a welding surface to face upwards, enabling a single-sided board solder resist surface to face upwards, and enabling the circuit to face downwards in a dense manner; removing the film, namely removing the dry film by using a circuit board with a certain concentration of film removing liquid after spraying and pressing, and finishing the film removing operation; washing the circuit board with high-pressure water at high pressure and high temperature, and washing the circuit board after film stripping with high-pressure water at high temperature; drying, namely drying the circuit board at a certain temperature, cleaning, adopting an automatic cleaner to clean the surface of the circuit board, baking, adopting a constant-temperature tunnel oven to anneal the circuit board, flashing, adopting a chemical treatment mode to finish circuit etching of the circuit board, and finishing the manufacture of fine circuits. The method is used for manufacturing fine circuit patterns by a semi-additive process, can improve the plate surface cleanliness of a film removing process, and solves the problem of circuit short circuit or quality caused by corrosion inhibition due to poor cleaning effect after film removing in the prior art.
Description
Technical Field
The application relates to the field of processing of PCB circuits, in particular to a method for improving the processing quality of fine circuits.
Background
With the continuous upgrading of the similar carrier boards, the line width and line distance are smaller and smaller. In the manufacturing process, the design of the spacing between the pattern production manuscripts is smaller and smaller, a dry film with high adhesive force is required to be adopted, the composition of the dry film is more and more complex, and the film stripping and cleaning of a circuit board factory are also greatly influenced.
With the increase of dry film adhesion, a film stripping liquid medicine with better film stripping performance is required. The film-removing liquid medicine in the carrier-like plate industry is generally organic film-removing liquid medicine, and the liquid medicine with high film-removing capability has two characteristics, namely, the liquid medicine can dissolve the dry film more finely, so that some resin substances of the dry film are continuously decomposed to be dissolved or remain in the liquid medicine, and the liquid medicine is sprayed to the plate surface again through a spraying system of equipment; the film stripping mechanism is described as follows,
The explanation of the spraying system is shown in figure 1, after the liquid medicine is pumped out from the working medicine water tank and pressurized, the liquid medicine passes through the filtering system and then is sprayed on the board surface through the pipeline and the nozzle; when the liquid medicine is sprayed to the board surface, after the liquid medicine contacts with the dry film, the strong alkaline polymerization quantitative polymer matrix of the film-removing liquid medicine can strongly soak the interior of molecules and break or weaken the combination among the molecules, the film-removing effect is achieved easily, the dry film in the precise circuit is easily stripped and the stripped film can be broken into small pieces or even dissolved along with the increase of the reaction speed, and finally, partial small pieces or resin can be sprayed to the board surface again along with a spraying system. The reaction mechanism of the film stripping liquid medicine and the dry film is shown in figure 2.
Secondly, the film stripping liquid medicine can cause a biting effect on the copper surface, and copper ions (Cupric ion) on the surface of the PCB and the film stripping liquid medicine component form a complex, and the mechanism is shown in figure 3. Along with the film-removing liquid medicine component and Cu start to etch on the copper surface, when the heating temperature is 25-55 ℃, the etching capability can be more enlarged, so that the roughness of the plate surface is increased, the adhesion degree of foreign matters to the copper surface is increased, and the cleaning difficulty of water washing is also increased.
Accordingly, the inventors have recognized that in order to improve the quality of fine lines, it is necessary to provide a method for improving the processing quality of fine lines.
Disclosure of Invention
The embodiment of the application provides a method for improving the processing quality of a fine circuit, which is used for solving the problem that the circuit is short-circuited or the quality is caused by corrosion due to poor cleaning effect after film removal in the prior art.
The embodiment of the application provides a method for improving the processing quality of a fine circuit, which comprises the following steps:
placing the board, wherein the component surface of the double-sided board faces downwards, the welding surface faces upwards, and the solder resist surface of the single-sided board faces upwards;
removing the film, namely spraying and pressing the etched circuit board with a film removing liquid with a certain concentration to remove the dry film, and finishing the film removing operation;
washing the circuit board with high-pressure water at high pressure and high temperature, and washing the circuit board after film stripping with high-pressure water at high temperature;
drying, namely drying the circuit board at a certain temperature to finish the manufacture of a fine circuit;
Cleaning, namely cleaning the surface of the circuit board by adopting an automatic cleaning machine;
baking, wherein a constant-temperature tunnel oven is adopted to anneal the circuit board;
And (3) flashing, namely finishing circuit etching of the circuit board by adopting a chemical treatment mode, and finishing the manufacture of the fine circuit.
Further, the water washing temperature in the high-pressure high-temperature water washing is 50+/-5 ℃, and the water washing pressure is 4.5-6.0Kg/cm 2.
Further, before the drying in the film stripping process, the method further comprises the steps of multistage water washing, acid washing and multistage water washing in sequence.
Further, a cleaning step is included before the drying in the flash etching process.
Further, the flashing process comprises the steps of plate placing, cleaning, material loading baking, wire flashing baking, drying and plate collecting in sequence.
The embodiment of the application also provides a processing system for improving the processing quality of the fine circuit, which comprises the following steps:
A board placing machine, wherein the double-sided board element faces downwards in the board placing machine, the welding surface faces upwards, and the single-sided board solder resist surface faces upwards;
The film stripping machine uses a circuit board subjected to spray-pressure etching by using a film stripping liquid with a certain concentration to enable a dry film to fall off, so that film stripping operation is completed;
The high-pressure high-temperature water washing device adopts high-temperature high-pressure water to wash the circuit board after film stripping;
And the drying device is used for drying the circuit board at a certain temperature to finish the manufacture of the fine circuit.
Further, the water washing temperature in the high-pressure high-temperature water washing is 50+/-5 ℃, and the water washing pressure is 4.5-6.0Kg/cm 2.
Further, the method further comprises the steps of multistage washing, acid washing and multistage washing in sequence before drying in the film stripping process.
The embodiment of the application also provides computer equipment, which comprises a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and the processor realizes the steps of the method when executing the computer program.
Embodiments of the present application also provide a computer readable medium having non-volatile program code executable by a processor, the program code causing the processor to perform the aforementioned method.
The embodiment provided by the application has at least the following beneficial effects:
The invention provides a method for improving the processing quality of a fine circuit, which comprises the steps of placing a board, enabling a double-sided board element to face downwards, enabling a welding surface to face upwards and enabling a single-sided board solder mask to face upwards; removing the film, namely spraying and pressing the etched circuit board with a film removing liquid with a certain concentration to remove the dry film, and finishing the film removing operation; washing the circuit board with high-pressure water at high pressure and high temperature, and washing the circuit board after film stripping with high-pressure water at high temperature; and drying, namely drying the circuit board at a certain temperature to finish the manufacture of the fine circuit. The method is used for manufacturing fine circuit patterns by a semi-additive process, can improve the plate surface cleanliness of a film stripping process, and solves the problems of circuit short circuit or quality caused by corrosion inhibition due to poor cleaning effect after film stripping in the prior art.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
fig. 1 is a schematic structural diagram of a film stripping process spray system provided by an embodiment of the present application;
FIG. 2 is a diagram showing a reaction mechanism between a film remover and a dry film according to an embodiment of the present application;
FIG. 3 is a diagram showing a mechanism of forming a complex of copper ions on the surface of a PCB with a film-removing lotion component;
FIG. 4 is a flow chart of a film stripping process in the prior art;
fig. 5 is a flowchart of a film stripping process according to an embodiment of the present application;
FIG. 6 is a flow chart of a prior art flash etching process;
Fig. 7 is a flow chart of a flash etching process according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The method for improving the processing quality of the fine circuit is applied to a processing mode before processing and forming an improved semi-additive process (mSAP) pattern transfer circuit in the field of carrier-like plates, and two important changes are made through researching and developing a plate surface processing mode from film removal to flash etching (etching) of the mSAP pattern transfer: firstly, after the mSAP pattern is transferred to remove the film, adopting high-temperature high-pressure spraying to clean the plate surface; secondly, cleaning the board surface by adopting an automatic cleaner before the board enters baking; through the increase of these two kinds of processing methods, not only reduced the cleanness of the back face of membrane is removed in the transfer of mSAP figure and reduced the membrane liquid medicine inside resin class material adhesion face of removing and influence the circuit processing quality, thereby also avoided the production line of removing the membrane of mSAP to toast the preceding course of working foreign matter adhesion face of removing the membrane thereby influence circuit processing quality simultaneously, improved the survival rate of meticulous circuit processing. The invention is applied to the mSAP pattern after transferring and removing the film, before baking and flashing (etching).
The method and the system provided by the application can be used for manufacturing and processing the PCB, and the processing of the PCB has various processes, including a film removing process and a flash etching process.
Referring to fig. 1, an embodiment of the present application provides a method for improving fine circuit processing quality, which is applied to a film stripping process, and includes:
placing the board, wherein the component surface of the double-sided board faces downwards, the welding surface faces upwards, and the solder resist surface of the single-sided board faces upwards;
removing the film, namely spraying and pressing the etched circuit board with a film removing liquid with a certain concentration to remove the dry film, and finishing the film removing operation;
washing the circuit board with high-pressure water at high pressure and high temperature, and washing the circuit board after film stripping with high-pressure water at high temperature;
And drying, namely drying the circuit board at a certain temperature to finish the manufacture of the fine circuit.
The water washing temperature in the high-pressure high-temperature water washing is 50+/-5 ℃, and the water washing pressure is 4.5-6.0Kg/cm 2. Specifically, the first water washing temperature after film stripping is designed to be high, and the temperature is kept consistent with that of a film stripping cylinder (the common temperature is 50+/-5 ℃); the purpose is to reduce the temperature difference between the film stripping cylinder and the two sections of the cleaning by the clean water, and directly enter lower-temperature cleaning after the film stripping of the circuit board is reduced, so that the cleaning influence of the liquid temperature difference on the resin substances possibly remained on the PCB surface is reduced to the greatest extent; the two process designs are compared with fig. 4 and 5 as follows. The purpose of the high pressure high temperature water wash is to remove residual resin.
It should be further noted that the first water washing pressure after film stripping is designed to be high pressure (high pressure design 4.5-6.0Kg/cm 2); conventional water washing pressure is 1.0-3.0Kg/cm 2. The aim is to wash the foreign matters of the dry film resin adhered to or remained on the board surface by higher spray pressure, and the film stripping process of the prior art and the film stripping process pair of the application are shown in fig. 4 and 5.
Before the drying, the method further comprises the steps of multistage washing, acid washing and multistage washing in sequence, wherein the purpose of the first multistage washing is to wash off liquid medicine. The acid washing is carried out by 5% sulfuric acid, and the purpose is to form an antioxidation layer. The next multi-stage water washing aims to wash off the sulfuric acid remained on the PCB after pickling.
In the flash etching process, automatic cleaning is added before baking, so that foreign matters which are not firmly adhered to the plate surface are cleaned before baking, the plate surface is firmly adhered in the baking process, and the flash etching is prevented from generating corrosion to form circuit short circuits or circuit bulges. The prior art flash process and the flash process of the present application are illustrated in fig. 6 and 7.
In the step of flashing, a cleaning step is further included before the drying.
Further, the drying comprises the steps of plate placing, cleaning, material feeding baking, wire flashing baking, drying and plate collecting in sequence.
The method can ensure that the board surface is baked after being cleaned, avoid the problem of circuit quality caused by baking the board surface, and play a role in improving and ensuring the quality of products;
according to the method, the defect reject ratio of the plate surface after the foreign matter is stuck back before the flash etching can be reduced by about 20-50%, and the defect reject ratio is specifically determined according to the actual product circuit/pattern design.
The embodiment of the application also provides a processing system for improving the processing quality of the fine circuit, which comprises the following steps:
A board placing machine, wherein the double-sided board element faces downwards in the board placing machine, the welding surface faces upwards, and the single-sided board solder resist surface faces upwards;
The film stripping machine uses a circuit board subjected to spray-pressure etching by using a film stripping liquid with a certain concentration to enable a dry film to fall off, so that film stripping operation is completed;
The high-pressure high-temperature water washing device adopts high-temperature high-pressure water to wash the circuit board after film stripping;
And the drying device is used for drying the circuit board at a certain temperature to finish the manufacture of the fine circuit.
Further, the water washing temperature in the high-pressure high-temperature water washing is 50+/-5 ℃, and the water washing pressure is 4.5-6.0Kg/cm 2.
Further, before the drying, the method further comprises the steps of multistage washing, acid washing and multistage washing in sequence.
The embodiment of the application also provides computer equipment, which comprises a memory and a processor, wherein the memory stores a computer program capable of running on the processor, and the processor realizes the steps of the method when executing the computer program.
Embodiments of the present application also provide a computer readable medium having non-volatile program code executable by a processor, the program code causing the processor to perform the aforementioned method.
The method can improve the panel cleanliness of the film stripping process; foreign matters before baking are prevented from sticking to the plate surface; reducing the rejection rate of circuit short circuit or circuit bulge caused by foreign matter back adhesion; the method improves the overall yield of the circuit manufactured product.
It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (10)
1. A method for improving the quality of fine circuit processing, comprising:
placing the board, wherein the component surface of the double-sided board faces downwards, the welding surface faces upwards, and the solder resist surface of the single-sided board faces upwards;
removing the film, namely removing the dry film by using a circuit board with a certain concentration of film removing liquid after spraying and pressing, and finishing the film removing operation;
washing the circuit board with high-pressure water at high pressure and high temperature, and washing the circuit board after film stripping with high-pressure water at high temperature;
drying, namely drying the circuit board at a certain temperature,
Cleaning, namely cleaning the surface of the circuit board by adopting an automatic cleaning machine,
Baking, annealing the circuit board by adopting a constant-temperature tunnel oven,
And (3) flashing, namely finishing circuit etching of the circuit board by adopting a chemical treatment mode, and finishing the manufacture of the fine circuit.
2. The method for improving the processing quality of a fine circuit according to claim 1, wherein the water washing temperature in the high-pressure high-temperature water washing is 50+ -5 degrees, and the water washing pressure is 4.5-6.0Kg/cm 2.
3. The method of claim 1, further comprising sequential steps of multi-stage washing, acid washing, and multi-stage washing prior to said drying in the film stripping process.
4. The method of improving fine line processing quality of claim 1, further comprising a cleaning step prior to said drying in the flash process.
5. The method of claim 1, wherein the flashing process comprises sequentially placing a board, cleaning, baking a material, baking, flashing a wire, baking, and collecting a board.
6. A processing system for improving the processing quality of fine lines, comprising:
A board placing machine, wherein the double-sided board element faces downwards in the board placing machine, the welding surface faces upwards, and the single-sided board solder resist surface faces upwards;
The film stripping machine uses a circuit board subjected to spray-pressure etching by using a film stripping liquid with a certain concentration to enable a dry film to fall off, so that film stripping operation is completed;
The high-pressure high-temperature water washing device adopts high-temperature high-pressure water to wash the circuit board after film stripping;
And the drying device is used for drying the circuit board at a certain temperature to finish the manufacture of the fine circuit.
7. The processing system for improving the processing quality of a fine circuit according to claim 6, wherein the water washing temperature in the high-pressure high-temperature water washing is 50+ -5 degrees, and the water washing pressure is 4.5-6.0Kg/cm 2.
8. The processing system for improving the processing quality of a fine circuit according to claim 6, further comprising a plurality of steps of washing with water, pickling, and washing with water in sequence before the drying in the film removing process.
9. A computer device comprising a memory, a processor, the memory having stored therein a computer program executable on the processor, characterized in that the processor, when executing the computer program, implements the steps of the method of any of the preceding claims 1 to 5.
10. A computer readable medium having non-volatile program code executable by a processor, the program code causing the processor to perform the method of any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310561963.8A CN117915572A (en) | 2023-05-18 | 2023-05-18 | Method for improving fine circuit processing quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310561963.8A CN117915572A (en) | 2023-05-18 | 2023-05-18 | Method for improving fine circuit processing quality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117915572A true CN117915572A (en) | 2024-04-19 |
Family
ID=90695244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310561963.8A Pending CN117915572A (en) | 2023-05-18 | 2023-05-18 | Method for improving fine circuit processing quality |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117915572A (en) |
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2023
- 2023-05-18 CN CN202310561963.8A patent/CN117915572A/en active Pending
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