CN117884643B - Copper powder, copper powder preparation method and application thereof - Google Patents
Copper powder, copper powder preparation method and application thereof Download PDFInfo
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- CN117884643B CN117884643B CN202410269266.XA CN202410269266A CN117884643B CN 117884643 B CN117884643 B CN 117884643B CN 202410269266 A CN202410269266 A CN 202410269266A CN 117884643 B CN117884643 B CN 117884643B
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- liquid metal
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 214
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 187
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 145
- 229910052802 copper Inorganic materials 0.000 claims abstract description 138
- 239000010949 copper Substances 0.000 claims abstract description 138
- 239000002245 particle Substances 0.000 claims abstract description 36
- 238000001704 evaporation Methods 0.000 claims abstract description 16
- 230000008020 evaporation Effects 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000000889 atomisation Methods 0.000 claims description 130
- 238000002156 mixing Methods 0.000 claims description 50
- 230000007246 mechanism Effects 0.000 claims description 32
- 238000003860 storage Methods 0.000 claims description 27
- 239000011261 inert gas Substances 0.000 claims description 26
- 238000012216 screening Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 238000004321 preservation Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 238000007873 sieving Methods 0.000 claims description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007858 starting material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 20
- 230000009471 action Effects 0.000 description 8
- 238000004062 sedimentation Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001856 aerosol method Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- -1 at present Chemical compound 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
- B22F5/106—Tube or ring forms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0896—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid particle transport, separation: process and apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention relates to copper powder, a preparation method and application thereof, and belongs to the technical field of copper powder preparation. The preparation method of copper powder comprises atomizing molten copper liquid into copper liquid drops; atomizing liquid metal into liquid metal droplets, wherein the melting point of the liquid metal is lower than that of copper, and the particle size of the liquid metal droplets is smaller than that of the copper droplets; driving the copper liquid drops and the liquid metal liquid drops to move in opposite directions, so that the liquid metal liquid drops and the copper liquid drops collide with each other, pits are formed on the surfaces of the copper liquid drops when the copper liquid drops are collided, heat is transferred to the liquid metal liquid drops to be solidified into copper powder, and the liquid metal liquid drops are kept in a liquid state; separating the liquid metal from the copper powder. The copper powder prepared by the invention has pits on the surface, so that the copper powder has higher porosity, can contain more working media when being used as a capillary structure layer at the evaporation end of the heat pipe, improves the hottest power which can be born by the heat pipe, and can ensure the heat transfer efficiency.
Description
Technical Field
The invention belongs to the technical field of copper powder preparation, and in particular relates to copper powder, a copper powder preparation method and application thereof.
Background
A heat pipe is a very common heat conducting pipe, and is commonly used for fan heat of electronic equipment. One end of the heat pipe is an evaporation end, the other end of the heat pipe is a cooling end, a porous capillary structure layer is arranged on the inner wall of the heat pipe, the inside of the heat pipe is vacuumized, a liquid working medium is arranged in the heat pipe, and the liquid working medium can be absorbed by the capillary structure layer. When the evaporator works, the evaporation end absorbs heat, the liquid working medium at the evaporation end evaporates into a gas state and flows to the cooling end, and the working medium is liquefied at the cooling end and releases heat, so that heat transfer is realized. After the working medium is liquefied, the working medium returns to the evaporation end again along the capillary structure layer under the capillary action of the capillary structure layer, so that the circulating flow is realized.
In theory, when the heat pipe operates, the liquid level of the working medium in the capillary structure layer should just cover the capillary structure layer, but in practice, when the heat pipe operates, the working medium at the evaporation end evaporates into a gaseous state, so that the liquid level of the working medium in the capillary structure at the evaporation end is lowered. When the thermal power is continuously increased, the liquid level of the working medium is continuously decreased until the liquid level is zero, so that the evaporation section local dry combustion (dry-out) is formed, and the heat dissipation efficiency is rapidly reduced. Therefore, in order to increase the thermal power that the heat pipe can withstand, the wick layer should be able to accommodate as much of the working medium as possible, i.e. the wick layer of the inner wall of the evaporation end should have a high porosity.
The heat transfer performance of the heat pipe is affected by the particle size of copper powder, and the heat transfer performance of the heat pipe can be guaranteed by keeping the particle size of copper powder within a certain range, and reference can be made to 'influence of the particle size of copper powder on the heat transfer performance of a sintered heat pipe' published by Li Yong, chen Chunyan et al, university of south China university of technology (natural science edition), volume 40, 3 rd phase, 3 rd month of 2013. The porosity of the capillary structure layer is also related to the particle size of copper powder, at present, copper powder is generally prepared by an atomization method, the prepared copper powder particles are similar to spheres, the shapes are regular, and the porosity is difficult to improve after the particle size is determined.
Disclosure of Invention
The invention aims to solve the technical problems of providing copper powder, a preparation method of the copper powder and application thereof, which are used for preparing copper powder with pits on the surface, improving the porosity of the copper powder, and using the copper powder for preparing a capillary structure layer at the evaporation end of a heat pipe, increasing the work mass which can be accommodated, thereby improving the hottest power which can be born by the heat pipe.
In order to solve the problems, the invention adopts the following technical scheme: copper powder preparation method comprises
Atomizing the molten copper liquid into copper droplets;
Atomizing liquid metal into liquid metal droplets, wherein the melting point of the liquid metal is lower than that of copper, and the particle size of the liquid metal droplets is smaller than that of the copper droplets;
Driving the copper liquid drops and the liquid metal liquid drops to move in opposite directions, so that the liquid metal liquid drops and the copper liquid drops collide with each other, pits are formed on the surfaces of the copper liquid drops when the copper liquid drops are collided, heat is transferred to the liquid metal liquid drops to be solidified into copper powder, and the liquid metal liquid drops are kept in a liquid state;
separating the liquid metal from the copper powder.
Further, the process of atomizing the molten copper liquid into copper droplets includes: driving molten copper liquid to pass through a first atomization plate, wherein a plurality of first atomization through holes which are uniformly distributed are formed in the first atomization plate, and copper liquid drops are formed after the copper liquid passes through the first atomization through holes;
the process of atomizing liquid metal into liquid metal droplets includes: the liquid metal is driven to pass through the second atomization plate, a plurality of second atomization through holes which are uniformly distributed are formed in the second atomization plate, the diameter of each second atomization through hole is smaller than that of each first atomization through hole, and liquid metal liquid drops are formed after the liquid metal passes through the second atomization through holes.
Further, the equipment for atomizing molten copper liquid into copper liquid drops comprises a heat preservation furnace, wherein a first liquid outlet is formed in the bottom of the heat preservation furnace, a first atomization plate is horizontally arranged below the first liquid outlet, a first coaming is arranged at the edge of the first atomization plate, and the first atomization plate is connected with a first driving mechanism for driving the first atomization plate to reciprocate;
The equipment for atomizing liquid metal into liquid metal liquid drops comprises a storage box, a second liquid outlet is formed in the bottom of the storage box, a second atomization plate is horizontally arranged below the second liquid outlet, a second coaming is arranged at the edge of the second atomization plate, and the second atomization plate is connected with a second driving mechanism for driving the second atomization plate to reciprocate.
Further, the mixing device also comprises a mixing chamber, wherein a first window and a second window are arranged on the top wall of the mixing chamber, the first atomization plate and the second atomization plate are in sliding fit with the top surface of the mixing chamber, the first atomization plate is positioned above the first window, and the second atomization plate is positioned above the second window; a first jet head is arranged on one side, far away from the second window, of the first window, a second jet head is arranged on one side, far away from the first window, of the second window, the first jet head and the second jet head are connected with an inert gas source, the jet direction of the first jet head horizontally faces the second jet head, and the jet direction of the second jet head horizontally faces the first jet head;
The first jet head and the second jet head jet inert gas flowing at high speed at the same time, after copper liquid drops enter the mixing chamber through the first window, liquid metal liquid drops move along with the inert gas jetted by the first jet head and enter the mixing chamber through the second window, and the liquid metal liquid drops move along with the inert gas jetted by the second jet head, so that the liquid metal liquid drops and the copper liquid drops move in opposite directions and collide with each other.
Further, an inclined screening groove is formed in the bottom of the inner cavity of the mixing chamber, and a copper powder collecting box is arranged at the right end of the screening groove; the mixing chamber lateral wall or the diapire below the screening groove are provided with the back flow, the back flow links to each other with the bin, be provided with the circulating pump on the back flow.
Further, the equipment for atomizing molten copper liquid into copper liquid drops comprises a heat preservation furnace, wherein a first liquid outlet is formed in the bottom of the heat preservation furnace, the first atomization plate is in a cylinder shape which is vertically arranged, an upper sealing plate is fixedly arranged at the upper end of the first atomization plate, a lower sealing plate is fixedly arranged at the lower end of the first atomization plate, a connecting port which is communicated with the first liquid outlet is formed in the upper sealing plate, and a third driving mechanism which is used for driving the lower sealing plate to rotate is connected with the lower sealing plate;
The equipment for atomizing the liquid metal into liquid metal liquid drops comprises a plurality of storage boxes, wherein the storage boxes are uniformly distributed around a heat preservation furnace, a second liquid outlet is formed in the bottom of each storage box, a vertical atomizing chamber is arranged below each storage box, the second liquid outlet is communicated with the atomizing chamber, fan blades are arranged in the atomizing chamber and are connected with a fourth driving mechanism for driving the fan blades to rotate, and the side wall of the atomizing chamber, facing the first atomizing plate, is the second atomizing plate;
The copper liquid in the heat preservation furnace enters the first atomization plate, the third driving mechanism drives the first atomization plate to rotate, copper liquid in the heat preservation furnace forms copper liquid drops through a first atomization through hole on the first atomization plate under the action of centrifugal force, and the copper liquid drops move along the radial direction of the first atomization plate;
After the liquid metal in the storage box enters the atomizing chamber, the fourth driving mechanism drives the fan blades to rotate, the fan blades drive the liquid metal to flow, when the liquid metal reaches the second atomizing plate, liquid metal liquid drops are formed through the second atomizing through holes and move towards the first atomizing plate, and in the moving process, the liquid metal liquid drops and the copper liquid drops collide with each other.
Further, the atomizing chamber and the first atomizing plate are both arranged in the mixing chamber, the center of the bottom plate of the mixing chamber protrudes upwards to form a cylindrical mounting cavity, and the third driving mechanism is arranged in the mounting cavity; the bottom of the inner cavity of the mixing chamber is provided with a spiral screening groove, and the right end of the screening groove is provided with a copper powder collecting box; the mixing chamber lateral wall or the diapire below the screening groove are provided with the back flow, the back flow links to each other with the bin, be provided with the circulating pump on the back flow.
Further, the particle size of the liquid metal droplets is 1/4 to 1/3 of the particle size of the copper droplets.
Copper powder is prepared by the method.
The copper powder prepared by the method is used as the raw material of the capillary structure layer at the evaporation end of the heat pipe.
The beneficial effects of the invention are as follows: 1. according to the invention, liquid metal liquid drops with smaller particle sizes are adopted to collide copper liquid drops with larger particle sizes, so that pits are formed on the surfaces of the copper liquid drops, after the copper liquid drops are cooled into copper powder, the copper powder with pits on the surfaces is obtained.
2. The liquid metal according to the present invention does not refer to a molten metal formed after melting a conventional metal, but refers to an amorphous metal, unlike a conventional metal. The liquid metal liquid drops are collided with the copper liquid drops, and the liquid metal, such as metal gallium, has the melting point of only 29.76 ℃, the boiling point of 2400 ℃, has the characteristics of low melting point and high boiling point, can be liquefied with little heat when being used for the first time, can absorb the heat of the copper liquid drops to keep in a liquid state in the subsequent use process, does not need to be heated and kept warm continuously, and has low energy consumption. In addition, the liquid metal can bear larger temperature change and keep stable, can not volatilize and solidify, can not be lost under the high temperature condition, can be recycled, reduces the cost, and can be conveniently separated from copper powder.
Drawings
Fig. 1 is a schematic flow chart of a method for preparing copper powder according to the present invention;
Fig. 2 is a schematic representation of copper powder particles produced in accordance with the present invention;
FIG. 3 is a schematic illustration of a first embodiment of the present invention;
FIG. 4 is a schematic top view of a first atomization plate and a second atomization plate in accordance with a first embodiment;
FIG. 5 is a schematic diagram of a second embodiment of the present invention;
Reference numerals: 1-a first atomization plate; 2-a second atomization plate; 3-a heat preservation furnace; 4-a first liquid outlet; 5-a first coaming; 6-a first driving mechanism; 7, a storage box; 8-a second liquid outlet; 9-a second coaming; 10-a second drive mechanism; 11-a mixing chamber; 12—a first window; 13-a second window; 14—a first jet; 15-a second jet head; 16—an inert gas source; 17-a screening groove; 18-a copper powder collecting box; 19-a return pipe; 20-a circulation pump; 21-upper sealing plate; 22-lower sealing plate; 23-a third drive mechanism; 24-an atomization chamber; 25-fan blades; 26-fourth drive mechanism.
Detailed Description
The invention will be further described with reference to the drawings and examples.
The copper powder preparation method of the present invention, as shown in FIG. 1, comprises
Atomizing the molten copper liquid into copper droplets;
Atomizing the liquid metal into liquid metal droplets, wherein the melting point of the liquid metal is lower than that of copper, and the particle size of the liquid metal droplets is smaller than that of the copper droplets;
Driving the copper liquid drops and the liquid metal liquid drops to move in opposite directions, so that the liquid metal liquid drops and the copper liquid drops collide with each other, pits are formed on the surfaces of the copper liquid drops when the copper liquid drops are collided, heat is transferred to the liquid metal liquid drops to be solidified into copper powder, and the liquid metal liquid drops are kept in a liquid state;
separating the liquid metal from the copper powder.
The copper raw material is heated to be melted, so as to obtain molten copper liquid, wherein the copper raw material can be pure copper or copper alloy, and the copper raw material can be heated to be melted by adopting the existing heating furnace. Atomization refers to the dispersion of the copper liquid that is gathered together to form small particles of copper droplets.
Conventional metals are crystalline metals, liquid metals, i.e. amorphous metals, with the property of having a low melting point. The liquid metal can be specifically metal gallium, has the melting point of 29.76 ℃ and the boiling point of 2400 ℃, has the characteristics of low melting point and high boiling point, can be liquefied with little heat when being used for the first time, can absorb the heat of copper liquid drops to keep in a liquid state in the subsequent use process, and has low energy consumption without continuous heating and heat preservation. In addition, the liquid metal can bear larger temperature change to keep stable, cannot volatilize and solidify, and is convenient to separate from copper powder.
If the particle size of the liquid metal droplet is larger than or equal to the particle size of the copper droplet, the impact force generated when the liquid metal droplet collides with the copper droplet may be larger, the copper droplet is easily dispersed into smaller particles, pits cannot be formed on the surface of the copper droplet, and the particle size of the copper droplet is affected due to the fact that the generated pit size is too large, so that the particle size of the liquid metal droplet is smaller than the particle size of the copper droplet, preferably, the particle size of the liquid metal droplet is 1/4 to 1/3 of the particle size of the copper droplet, and pits with proper sizes can be formed on the surface of the copper droplet.
The copper liquid drop and the liquid metal liquid drop are driven to move in opposite directions, namely the movement track of the liquid metal liquid drop can be intersected with the movement track of the copper liquid drop, specifically, the movement track of the liquid metal liquid drop and the movement track of the copper liquid drop can be on the same straight line, but the movement directions of the liquid metal liquid drop and the movement track of the copper liquid drop are opposite, for example, the movement track of the liquid metal liquid drop and the movement track of the copper liquid drop can be obtuse angles, for example, the liquid metal liquid drop moves towards the lower right, the copper liquid drop moves towards the lower left, and the liquid metal liquid drop and the copper liquid drop can be intersected.
By driving the copper liquid drops and the liquid metal liquid drops to move in opposite directions, the copper liquid drops and the liquid metal liquid drops collide with each other, so that pits are generated on the surfaces of the copper liquid drops, meanwhile, the heat of the copper liquid drops is transferred to the liquid metal liquid drops, the copper liquid drops are rapidly cooled and solidified into copper powder, and the liquid metal is kept in a liquid state and can be easily separated from the copper powder.
The copper powder prepared by the traditional atomization method is in a regular sphere shape, and as shown in fig. 2, the copper powder prepared by the invention has pits on the surfaces of copper powder particles, and compared with the traditional copper powder, under the condition of the same particle size, the copper powder has higher porosity, and can contain more working media when being used as a capillary structure layer at the evaporation end of a heat pipe, and meanwhile, the heat transfer efficiency can be ensured. The particle size of the copper powder according to the present invention is the distance between any two points of the surface, for example, in fig. 2, the particle size is d.
The atomization of the molten copper and the liquid metal can adopt a conventional aerosol method, but the aerosol method is not easy to control the particle size of copper liquid drops or liquid metal liquid drops, and as a preferred embodiment of the invention, the process of atomizing the molten copper into copper liquid drops comprises the following steps: driving molten copper liquid to pass through the first atomization plate 1, wherein a plurality of first atomization through holes which are uniformly distributed are formed in the first atomization plate 1, and copper liquid drops are formed after the molten copper liquid passes through the first atomization through holes;
The process of atomizing liquid metal into liquid metal droplets includes: the liquid metal is driven to pass through the second atomization plate 2, a plurality of second atomization through holes which are uniformly distributed are formed in the second atomization plate 2, the diameter of each second atomization through hole is smaller than that of each first atomization through hole, and liquid metal drops are formed after the liquid metal passes through the second atomization through holes.
The first atomization plate 1 adopts a high-temperature-resistant plate, after copper liquid passes through a first atomization through hole of the first atomization plate 1, the particle size of formed copper liquid drops is matched with that of the first atomization through hole, and the particle size of the copper liquid drops can be controlled by controlling the aperture of the first atomization through hole, so that the copper liquid drops with the particle size meeting the requirement and uniform particle size are obtained. Likewise, liquid metal droplets having a particle size satisfying the requirements and having a uniform particle size can be obtained.
The invention particularly provides the following two devices capable of realizing atomization of copper liquid and liquid metal and collision.
Example 1
As shown in fig. 3 and 4, the device for atomizing molten copper into copper droplets comprises a holding furnace 3, a first liquid outlet 4 is formed in the bottom of the holding furnace 3, a first atomization plate 1 is horizontally arranged below the first liquid outlet 4, a first coaming 5 is arranged at the edge of the first atomization plate 1, and the first atomization plate 1 is connected with a first driving mechanism 6 for driving the first atomization plate 1 to reciprocate.
In this embodiment, the first atomization plate 1 is a flat plate, the shape is rectangular, the first coaming 5 is 4, the vertical setting is at four limits of the first atomization plate 1, the first coaming 5 and the first atomization plate 1 enclose into the cavity. The heat preservation furnace 3 is made of high temperature resistant materials, a heat preservation layer can be arranged on the outer wall of the heat preservation furnace, and meanwhile, an electric heating element can be arranged to ensure that copper liquid in the heat preservation furnace 3 is at a proper temperature and prevent the copper liquid from being cooled. The copper liquid in the holding furnace 3 can flow onto the first atomization plate 1 through the first liquid outlet 4, and the first driving mechanism 6 drives the first atomization plate 1 to continuously move back and forth, so that the copper liquid can be dispersed onto the first atomization plate 1. The copper liquid passes through the first atomization through hole under the action of gravity and then drops downwards.
The equipment for atomizing liquid metal into liquid metal liquid drops comprises a storage box 7, a second liquid outlet 8 is formed in the bottom of the storage box 7, a second atomization plate 2 is horizontally arranged below the second liquid outlet 8, a second coaming 9 is arranged at the edge of the second atomization plate 2, and a second driving mechanism 10 for driving the second atomization plate 2 to reciprocate is connected with the second atomization plate 2.
The storage box 7 is used for storing liquid metal, and the liquid metal in the storage box 7 flows onto the second atomization plate 2 through the second liquid outlet 8, and the second driving mechanism 10 drives the second atomization plate 2 to continuously move back and forth, so that the liquid metal is promoted to be paved on the second atomization plate 2 and pass through the second atomization through holes.
The first driving mechanism 6 and the second driving mechanism 10 may be hydraulic cylinders, linear motors, or the like.
In addition, can also be provided with the jetting head in the top of first atomizing board 1 and second atomizing board 2, carry inert gas to the jetting head, the jetting head spouts inert gas downwards to first atomizing board 1 and second atomizing board 2, can promote the copper liquid to pass through first atomizing board 1 more fast, promote liquid metal to pass through second atomizing board 2 more fast, simultaneously, inert gas is full of the space above first atomizing board 1 and second atomizing board 2, avoid liquid metal and copper liquid to contact the oxygen in the air, prevent by the oxidation.
The embodiment also comprises a mixing chamber 11, wherein a first window 12 and a second window 13 are arranged on the top wall of the mixing chamber 11, the first atomization plate 1 and the second atomization plate 2 are in sliding fit with the top surface of the mixing chamber 11, the first atomization plate 1 is positioned above the first window 12, and the second atomization plate 2 is positioned above the second window 13; the side of the first window 12 far away from the second window 13 is provided with a first jet head 14, the side of the second window 13 far away from the first window 12 is provided with a second jet head 15, the first jet head 14 and the second jet head 15 are both connected with an inert gas source 16, the jet direction of the first jet head 14 horizontally faces the second jet head 15, and the jet direction of the second jet head 15 horizontally faces the first jet head 14.
The mixing chamber 11 is a cuboid-shaped chamber body, a high-temperature-resistant material is adopted, the first window 12 and the second window 13 are rectangular windows, the first atomization plate 1 is located above the first window 12, the second atomization plate 2 is located above the second window 13, copper liquid drops passing through the first atomization plate 1 can fall into the mixing chamber 11 downwards through the first window 12, and liquid metal liquid drops passing through the second atomization plate 2 can fall into the mixing chamber 11 downwards through the second window 13. The first atomization plate 1 and the second atomization plate 2 are both in sliding fit with the top surface of the mixing chamber 11, so that the movement stability of the first atomization plate 1 and the second atomization plate 2 is guaranteed, specifically, guide rails can be arranged on two sides of the first window 12 and the second window 13, the guide rails are fixed on the top surface of the mixing chamber 11, the first atomization plate 1 and the second atomization plate 2 are in sliding fit with the guide rails, the guide rails can play a role in guiding and limiting, and therefore the movement stability of the first atomization plate 1 and the second atomization plate 2 can be improved.
The first jet head 14 and the second jet head 15 are used for jetting inert gas flowing at a high speed, and the inert gas is utilized to drive the liquid metal liquid drops and the copper liquid drops to move so as to promote the liquid metal liquid drops and the copper liquid drops to move and collide with each other. The inert gas source 16 is used to supply inert gas, the inert gas may be nitrogen, etc., the inert gas source 16 may be a pressure tank for storing inert gas, and an air pump may be used to increase the flow rate of inert gas.
The first jet head 14 and the second jet head 15 jet inert gas flowing at high speed at the same time, after copper liquid drops enter the mixing chamber 11 through the first window 12, liquid metal liquid drops move in opposite directions and collide with copper liquid drops along with the movement of the inert gas jetted by the first jet head 14, after the liquid metal liquid drops enter the mixing chamber 11 through the second window 13, and along with the movement of the inert gas jetted by the second jet head 15.
Before the liquid metal droplets and the copper droplets enter the mixing chamber 11, inert gas may be introduced into the mixing chamber 11 to extrude air in the mixing chamber 11, so as to prevent the liquid metal droplets and the copper droplets from being oxidized.
In order to facilitate separation of liquid metal and copper powder, an inclined screening groove 17 is arranged at the bottom of the inner cavity of the mixing chamber 11, and a copper powder collecting box 18 is arranged at the right end of the screening groove 17; the side wall or bottom wall of the mixing chamber 11 below the sieving trough 17 is provided with a return pipe 19, the return pipe 19 is connected with the storage tank 7, and the return pipe 19 is provided with a circulating pump 20.
The liquid metal drops and the copper drops drop downwards simultaneously after collision, the copper drops solidify into copper powder after cooling, the liquid metal is kept in a liquid state, the liquid metal drops onto the screening groove 17 simultaneously, fine filtering holes are formed in the screening groove 17, the liquid metal can reach the lower side of the screening groove 17 through the filtering holes and is gathered together, and the copper powder rolls downwards into the copper powder collecting box 18 along with the screening groove 17. The liquid metal below the sieving groove 17 returns to the storage box 7 again under the action of the circulating pump 20, so that the recycling is realized.
In addition, because the densities of the liquid metal and the copper powder are different, for example, when the liquid metal adopts metal, the density is 5.9g/cm 3, and the density of the pure copper is 8.960g/cm 3, a sedimentation tank can be arranged at the bottom of the mixing chamber 11, the liquid metal and the copper powder simultaneously fall into the sedimentation tank, after sedimentation, the copper powder is sedimented to the bottom of the sedimentation tank, and the upper liquid metal can be reused.
Example two
As shown in fig. 5, the device for atomizing molten copper into copper droplets comprises a holding furnace 3, a first liquid outlet 4 is arranged at the bottom of the holding furnace 3, a first atomization plate 1 is in a vertically arranged cylinder shape, an upper sealing plate 21 is fixedly arranged at the upper end of the first atomization plate 1, a lower sealing plate 22 is fixedly arranged at the lower end of the first atomization plate, a connecting port communicated with the first liquid outlet 4 is arranged on the upper sealing plate 21, and a third driving mechanism 23 for driving the lower sealing plate 22 to rotate is connected with the lower sealing plate 22.
In this embodiment, the first atomization plate 1 is cylindrical, and the upper sealing plate 21 and the lower sealing plate 22 seal the upper end and the lower end of the first atomization plate 1 respectively, and the upper sealing plate 21 and the lower sealing plate 22 are fixedly connected with the first atomization plate 1. The holding furnace 3 is the same as in the first embodiment and is used for storing the melted solution. Copper liquid in the holding furnace 3 enters the first atomization plate 1 through the first liquid outlet 4, the lower sealing plate 22 and the first atomization plate 1 are driven by the third driving mechanism 23 to rotate at a high speed, the copper liquid in the first atomization plate 1 generates centrifugal force, and under the action of the centrifugal force, the copper liquid passes through the first atomization through hole and is thrown out along the radial direction of the first atomization plate 1, so that atomization of the copper liquid is realized. The first liquid outlet 4 may be a pipe, which penetrates the upper sealing plate 21, and the clearance fit between the upper sealing plate 21 and the pipe does not affect the rotation of the upper sealing plate 21 along with the first atomization plate 1.
The equipment for atomizing liquid metal into liquid metal liquid drops comprises a plurality of storage boxes 7, the storage boxes 7 are evenly distributed around the heat preservation furnace 3, a second liquid outlet 8 is formed in the bottom of each storage box 7, a vertical atomizing chamber 24 is arranged below each storage box 7, the second liquid outlet 8 is communicated with the atomizing chamber 24, fan blades 25 are arranged in the atomizing chamber 24, the fan blades 25 are connected with a fourth driving mechanism 26 for driving the fan blades 25 to rotate, and the side wall of the atomizing chamber 24 facing the first atomizing plate 1 is the second atomizing plate 2.
The copper liquid in the heat preservation furnace 3 enters the first atomization plate 1, the third driving mechanism 23 drives the first atomization plate 1 to rotate, and the copper liquid in the heat preservation furnace forms copper liquid drops through a first atomization through hole on the first atomization plate 1 under the action of centrifugal force and moves along the radial direction of the first atomization plate 1; after the liquid metal in the storage box 7 enters the atomizing chamber 24, the fourth driving mechanism 26 drives the fan blades 25 to rotate, the fan blades 25 drive the liquid metal to flow, when the liquid metal reaches the second atomizing plate 2, liquid metal liquid drops are formed through the second atomizing through holes and move towards the first atomizing plate 1, and in the moving process, the liquid metal liquid drops collide with copper liquid drops.
The storage box 7 is used for storing liquid metal, the second liquid outlet 8 is used for carrying the liquid metal in the storage box 7 to the atomizing chamber 24, the atomizing chamber 24 is fixedly installed, a cylindrical chamber body can be adopted, a cuboid chamber body can also be adopted, and a plurality of atomizing chambers 24 are evenly distributed around the first atomizing plate 1. After the liquid metal enters the atomizing chamber 24, the fourth driving mechanism 26 drives the fan blades 25 to rotate at a high speed, the liquid metal forms vortex under the action of the fan blades 25 and also has a certain centrifugal force, when the liquid metal passes through the second atomizing plate 2, the liquid metal can be discharged through the second atomizing through holes on the second atomizing plate 2, and because the second atomizing plate 2 is arranged on one side facing the first atomizing plate 1, formed liquid metal liquid drops can move towards the first atomizing plate 1 and can collide with copper liquid drops sprayed out of the first atomizing plate 1.
The third drive mechanism 23 and the fourth drive mechanism 26 may employ motors.
In order to create a stable space, the atomizing chamber 24 and the first atomizing plate 1 are both arranged in the mixing chamber 11, the center of the bottom plate of the mixing chamber 11 protrudes upwards to form a cylindrical installation cavity, and the third driving mechanism 23 is arranged in the installation cavity; the bottom of the inner cavity of the mixing chamber 11 is provided with a spiral screening groove 17, and the right end of the screening groove 17 is provided with a copper powder collecting box 18; the side wall or bottom wall of the mixing chamber 11 below the sieving trough 17 is provided with a return pipe 19, the return pipe 19 is connected with the storage tank 7, and the return pipe 19 is provided with a circulating pump 20.
The mixing chamber 11 may be a cylindrical chamber body or a rectangular chamber body, the atomizing chamber 24 and the first atomizing plate 1 are disposed inside the mixing chamber 11, and the storage box 7 and the holding furnace 3 are disposed above the mixing chamber 11. In the process of preparing copper powder, inert gas can be continuously introduced into the mixing chamber 11 to prevent oxygen from entering the mixing chamber 11 to cause oxidation of liquid metal or copper. The center of the bottom plate of the mixing chamber 11 is protruded upward to form a cylindrical installation cavity, and the third driving mechanism 23 is disposed in the installation cavity so that the third driving mechanism 23 is located outside the mixing chamber 11, and the influence of high temperature on the third driving mechanism 23 can be reduced, and similarly, the fourth driving mechanism 26 is also installed outside the mixing chamber 11.
The liquid metal drops and the copper drops drop downwards simultaneously after collision, the copper drops solidify into copper powder after cooling, the liquid metal is kept in a liquid state, the liquid metal drops onto the screening groove 17 simultaneously, fine filtering holes are formed in the screening groove 17, the liquid metal can reach the lower side of the screening groove 17 through the filtering holes and is gathered together, and the copper powder rolls downwards into the copper powder collecting box 18 along with the screening groove 17. The liquid metal below the sieving groove 17 returns to the storage box 7 again under the action of the circulating pump 20, so that the recycling is realized.
In addition, because the densities of the liquid metal and the copper powder are different, for example, when the liquid metal adopts metal, the density is 5.9g/cm 3, and the density of the pure copper is 8.960g/cm 3, a sedimentation tank can be arranged at the bottom of the mixing chamber 11, the liquid metal and the copper powder simultaneously fall into the sedimentation tank, after sedimentation, the copper powder is sedimented to the bottom of the sedimentation tank, and the upper liquid metal can be reused.
The copper powder prepared by the method is used as the raw material of the capillary structure layer at the evaporating end of the heat pipe, namely the copper powder prepared by the method is used as the raw material, and the capillary structure layer at the evaporating end of the heat pipe is obtained through sintering, so that the total amount of working media at the evaporating end of the heat pipe can be increased, and the hottest power which can be born by the heat pipe is improved. Of course, the capillary structure layers at other parts of the heat pipe can also be sintered by adopting the copper powder of the invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A method for producing copper powder, comprising
Atomizing the molten copper liquid into copper droplets;
Atomizing liquid metal into liquid metal droplets, wherein the melting point of the liquid metal is lower than that of copper, the liquid metal adopts metal gallium, the particle size of the liquid metal droplets is smaller than that of the copper droplets, and the particle size of the liquid metal droplets is 1/4 to 1/3 of that of the copper droplets;
Driving the copper liquid drops and the liquid metal liquid drops to move in opposite directions, so that the liquid metal liquid drops and the copper liquid drops collide with each other, pits are formed on the surfaces of the copper liquid drops when the copper liquid drops are collided, heat is transferred to the liquid metal liquid drops to be solidified into copper powder, and the liquid metal liquid drops are kept in a liquid state;
separating the liquid metal from the copper powder;
the process of atomizing molten copper into copper droplets includes: driving molten copper liquid to pass through a first atomization plate (1), wherein a plurality of first atomization through holes which are uniformly distributed are formed in the first atomization plate (1), and copper liquid drops are formed after the copper liquid passes through the first atomization through holes;
the process of atomizing liquid metal into liquid metal droplets includes: driving the liquid metal to pass through a second atomization plate (2), wherein a plurality of second atomization through holes which are uniformly distributed are formed in the second atomization plate (2), the diameter of each second atomization through hole is smaller than that of each first atomization through hole, and liquid metal drops are formed after the liquid metal passes through each second atomization through hole;
The equipment for atomizing molten copper liquid into copper liquid drops comprises a heat preservation furnace (3), wherein a first liquid outlet (4) is formed in the bottom of the heat preservation furnace (3), a first atomization plate (1) is horizontally arranged below the first liquid outlet (4), a first coaming (5) is arranged at the edge of the first atomization plate (1), and the first atomization plate (1) is connected with a first driving mechanism (6) for driving the first atomization plate (1) to reciprocate and translate;
The equipment for atomizing liquid metal into liquid metal liquid drops comprises a storage box (7), wherein a second liquid outlet (8) is formed in the bottom of the storage box (7), a second atomization plate (2) is horizontally arranged below the second liquid outlet (8), a second coaming (9) is arranged at the edge of the second atomization plate (2), and the second atomization plate (2) is connected with a second driving mechanism (10) for driving the second atomization plate (2) to reciprocate and translate;
The mixing device comprises a mixing chamber (11), wherein a first window (12) and a second window (13) are formed in the top wall of the mixing chamber (11), the first atomization plate (1) and the second atomization plate (2) are in sliding fit with the top surface of the mixing chamber (11), the first atomization plate (1) is located above the first window (12), and the second atomization plate (2) is located above the second window (13); a first jet head (14) is arranged on one side, far away from the second window (13), of the first window (12), a second jet head (15) is arranged on one side, far away from the first window (12), of the second window (13), the first jet head (14) and the second jet head (15) are connected with an inert gas source (16), the jet direction of the first jet head (14) horizontally faces the second jet head (15), and the jet direction of the second jet head (15) horizontally faces the first jet head (14);
The first jet head (14) and the second jet head (15) jet inert gas flowing at high speed at the same time, after copper liquid drops enter the mixing chamber (11) through the first window (12), liquid metal liquid drops move along with the inert gas jetted by the first jet head (14) and enter the mixing chamber (11) through the second window (13), and then move along with the inert gas jetted by the second jet head (15), so that the liquid metal liquid drops and the copper liquid drops move towards each other and collide with each other.
2. A copper powder preparation method according to claim 1, wherein an inclined screening groove (17) is formed in the bottom of the inner cavity of the mixing chamber (11), and a copper powder collecting box (18) is arranged at the right end of the screening groove (17); the side wall or the bottom wall of the mixing chamber (11) below the sieving groove (17) is provided with a return pipe (19), the return pipe (19) is connected with the storage box (7), and the return pipe (19) is provided with a circulating pump (20).
3. Copper powder produced by the method of claim 1.
4. Use of copper powder produced by the method of claim 1 as a starting material for a capillary structure layer at the evaporation end of a heat pipe.
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