CN117884643B - Copper powder, copper powder preparation method and application thereof - Google Patents
Copper powder, copper powder preparation method and application thereof Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
- B22F5/106—Tube or ring forms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0896—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid particle transport, separation: process and apparatus
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Abstract
Description
技术领域Technical Field
本发明属于铜粉制备技术领域,尤其是一种铜粉、铜粉制备方法及其应用。The invention belongs to the technical field of copper powder preparation, in particular to copper powder, a copper powder preparation method and application thereof.
背景技术Background technique
热管是一种十分常见的导热管道,常用于电子设备的扇热。热管的一端为蒸发端,另一端为冷却端,热管内壁设置多孔的毛细结构层,热管内部抽真空,且内部设置液态工质,液态工质能够被毛细结构层吸收。工作时,蒸发端吸热,蒸发端的液态工质蒸发成为气态并流动到冷却端,工质在冷却端液化并释放热量,实现热量的传递。工质液化后,在毛细结构层的毛细作用下,沿着毛细结构层重新回到蒸发端,实现循环流动。Heat pipes are a very common heat-conducting pipe, often used for cooling electronic devices. One end of the heat pipe is the evaporation end, and the other end is the cooling end. A porous capillary structure layer is set on the inner wall of the heat pipe. The inside of the heat pipe is evacuated, and a liquid working medium is set inside. The liquid working medium can be absorbed by the capillary structure layer. During operation, the evaporation end absorbs heat, and the liquid working medium at the evaporation end evaporates into gas and flows to the cooling end. The working medium liquefies at the cooling end and releases heat to achieve heat transfer. After the working medium is liquefied, it returns to the evaporation end along the capillary structure layer under the capillary action of the capillary structure layer to achieve a circulating flow.
从理论上来说,热管运作时,毛细结构层内的工质液面高度,应恰好能覆盖毛细结构层,但实际上热管运作时,蒸发端的工质蒸发为气态,使蒸发端毛细结构里的工质液面下降。当热功率不断上升,工质液面不断下降,直到液面高度为零,形成蒸发段局部干烧(dry-out),散热效率快速降低。因此,为了提高热管可以承受的热功率,毛细结构层应当能够尽可能多地容纳工质,即蒸发端内壁的毛细结构层应当具有较高的孔隙率。Theoretically, when the heat pipe is operating, the height of the working fluid liquid level in the capillary structure layer should just cover the capillary structure layer. However, in reality, when the heat pipe is operating, the working fluid at the evaporation end evaporates into gas, causing the working fluid liquid level in the capillary structure at the evaporation end to drop. When the thermal power continues to rise, the working fluid liquid level continues to drop until the liquid level is zero, forming a local dry-out in the evaporation section, and the heat dissipation efficiency decreases rapidly. Therefore, in order to increase the thermal power that the heat pipe can withstand, the capillary structure layer should be able to accommodate as much working fluid as possible, that is, the capillary structure layer on the inner wall of the evaporation end should have a higher porosity.
热管的传热性能受到铜粉的粒径的影响,需要将铜粉的粒径保持在一定的范围内才能够保证热管具有较佳的传热性能,可参照李勇、陈春燕等人发表的《铜粉粒径对烧结式热管传热性能的影响》,华南理工大学报(自然科学版),第40卷第3期,2013年3月。毛细结构层的孔隙率也与铜粉粒径相关,目前,铜粉一般采用雾化法制备,制得的铜粉颗粒类似于圆球形,形状较为规则,当粒径确定后,孔隙率难以提高。The heat transfer performance of the heat pipe is affected by the particle size of the copper powder. The particle size of the copper powder needs to be kept within a certain range to ensure that the heat pipe has better heat transfer performance. Please refer to "The Influence of Copper Powder Particle Size on the Heat Transfer Performance of Sintered Heat Pipes" published by Li Yong, Chen Chunyan, etc., Journal of South China University of Technology (Natural Science Edition), Vol. 40, No. 3, March 2013. The porosity of the capillary structure layer is also related to the particle size of the copper powder. At present, copper powder is generally prepared by atomization. The copper powder particles obtained are similar to spheres and have a relatively regular shape. When the particle size is determined, the porosity is difficult to increase.
发明内容Summary of the invention
本发明所要解决的技术问题是提供一种铜粉、铜粉制备方法及其应用,用于制得表面具有凹坑的铜粉,提高铜粉的孔隙率,且将该铜粉用于制备热管蒸发端的毛细结构层,增加可容纳的工质量,从而提高热管可以承受的最热功率。The technical problem to be solved by the present invention is to provide a copper powder, a copper powder preparation method and its application, which are used to prepare copper powder with pits on the surface, improve the porosity of the copper powder, and use the copper powder to prepare a capillary structure layer at the evaporation end of a heat pipe, increase the work mass that can be accommodated, thereby increasing the maximum thermal power that the heat pipe can withstand.
为解决上述问题,本发明采用的技术方案为:铜粉制备方法,包括To solve the above problems, the technical solution adopted by the present invention is: a method for preparing copper powder, comprising:
将熔融的铜液雾化为铜液滴;Atomizing molten copper liquid into copper droplets;
将液态金属雾化为液态金属液滴,所述液态金属的熔点低于铜的熔点,所述液态金属液滴的粒径小于铜液滴的粒径;Atomizing liquid metal into liquid metal droplets, wherein the melting point of the liquid metal is lower than the melting point of copper, and the particle size of the liquid metal droplets is smaller than the particle size of the copper droplets;
驱动铜液滴和液态金属液滴相向运动,使液态金属液滴和铜液滴相互碰撞,铜液滴受到碰撞时表面产生凹坑,且将热量传递至液态金属液滴而凝固为铜粉,液态金属液滴保持为液态;The copper droplets and the liquid metal droplets are driven to move toward each other, so that the liquid metal droplets and the copper droplets collide with each other, a pit is generated on the surface of the copper droplets when the copper droplets collide, and heat is transferred to the liquid metal droplets to solidify into copper powder, and the liquid metal droplets remain in liquid state;
将液态金属与铜粉分离。Separate the liquid metal from the copper powder.
进一步地,将熔融的铜液雾化为铜液滴的过程包括:驱动熔融的铜液通过第一雾化板,所述第一雾化板上设置有多个均匀分布的第一雾化通孔,铜液通过第一雾化通孔后形成铜液滴;Further, the process of atomizing the molten copper liquid into copper droplets includes: driving the molten copper liquid through a first atomizing plate, the first atomizing plate being provided with a plurality of evenly distributed first atomizing through holes, and the copper liquid forming copper droplets after passing through the first atomizing through holes;
将液态金属雾化为液态金属液滴的过程包括:驱动液态金属通过第二雾化板,所述第二雾化板上设置有多个均匀分布的第二雾化通孔,第二雾化通孔的直径小于第一雾化通孔的直径,液态金属通过第二雾化通孔后形成液态金属液滴。The process of atomizing liquid metal into liquid metal droplets includes: driving the liquid metal through a second atomizing plate, on which a plurality of evenly distributed second atomizing through holes are arranged, the diameter of the second atomizing through holes is smaller than the diameter of the first atomizing through holes, and the liquid metal forms liquid metal droplets after passing through the second atomizing through holes.
进一步地,熔融的铜液雾化为铜液滴的设备包括保温炉,所述保温炉的底部设置有第一出液口,所述第一雾化板水平设置在第一出液口的下方,且第一雾化板的边缘设置有第一围板,所述第一雾化板连接有驱动第一雾化板往复平移的第一驱动机构;Furthermore, the device for atomizing the molten copper liquid into copper droplets comprises a heat preservation furnace, a first liquid outlet is arranged at the bottom of the heat preservation furnace, the first atomizing plate is horizontally arranged below the first liquid outlet, and a first enclosure plate is arranged at the edge of the first atomizing plate, and the first atomizing plate is connected to a first driving mechanism for driving the first atomizing plate to reciprocate and translate;
将液态金属雾化为液态金属液滴的设备包括存储箱,所述存储箱的底部设置有第二出液口,所述第二雾化板水平设置在第二出液口的下方,且第二雾化板的边缘设置有第二围板,所述第二雾化板连接有驱动第二雾化板往复平移的第二驱动机构。The device for atomizing liquid metal into liquid metal droplets includes a storage box, a second liquid outlet is arranged at the bottom of the storage box, the second atomizing plate is horizontally arranged below the second liquid outlet, and a second enclosure plate is arranged at the edge of the second atomizing plate, and the second atomizing plate is connected to a second driving mechanism for driving the second atomizing plate to reciprocate.
进一步地,还包括混合室,所述混合室的顶壁设置有第一窗口和第二窗口,所述第一雾化板和第二雾化板均与混合室的顶面滑动配合,且所述第一雾化板位于第一窗口的上方,第二雾化板位于第二窗口的上方;所述第一窗口远离第二窗口的一侧设置有第一喷气头,第二窗口远离第一窗口的一侧设置有第二喷气头,所述第一喷气头和第二喷气头均连接有惰性气体源,且第一喷气头的喷气方向水平朝向第二喷气头,第二喷气头的喷气方向水平朝向第一喷气头;Furthermore, it also includes a mixing chamber, the top wall of the mixing chamber is provided with a first window and a second window, the first atomizing plate and the second atomizing plate are both slidably matched with the top surface of the mixing chamber, and the first atomizing plate is located above the first window, and the second atomizing plate is located above the second window; a first jet head is provided on the side of the first window away from the second window, and a second jet head is provided on the side of the second window away from the first window, the first jet head and the second jet head are both connected to an inert gas source, and the jet direction of the first jet head is horizontally toward the second jet head, and the jet direction of the second jet head is horizontally toward the first jet head;
第一喷气头和第二喷气头同时喷出高速流动的惰性气体,铜液滴通过第一窗口进入混合室后,随着第一喷气头喷出的惰性气体运动,液态金属液滴通过第二窗口进入混合室后,随着第二喷气头喷出的惰性气体运动,使得液态金属液滴与铜液滴相向运动并相互碰撞。The first nozzle and the second nozzle simultaneously spray high-speed flowing inert gas. After the copper droplets enter the mixing chamber through the first window, they move with the inert gas sprayed by the first nozzle. After the liquid metal droplets enter the mixing chamber through the second window, they move with the inert gas sprayed by the second nozzle, so that the liquid metal droplets and the copper droplets move towards each other and collide with each other.
进一步地,所述混合室内腔的底部设置有倾斜的筛分槽,所述筛分槽的右端设置有铜粉收集箱;所述筛分槽下方的混合室侧壁或底壁设置有回流管,所述回流管与存储箱相连,所述回流管上设置有循环泵。Furthermore, an inclined screening trough is provided at the bottom of the inner cavity of the mixing chamber, and a copper powder collection box is provided at the right end of the screening trough; a reflux pipe is provided on the side wall or bottom wall of the mixing chamber below the screening trough, the reflux pipe is connected to the storage box, and a circulating pump is provided on the reflux pipe.
进一步地,将熔融的铜液雾化为铜液滴的设备包括保温炉,所述保温炉的底部设置有第一出液口,所述第一雾化板呈竖直设置的圆筒形,且第一雾化板的上端固定设置有上封板,下端固定设置有下封板,所述上封板上设置有与第一出液口连通的连接口,所述下封板连接有驱动下封板转动的第三驱动机构;Further, the device for atomizing the molten copper liquid into copper droplets comprises a heat preservation furnace, a first liquid outlet is arranged at the bottom of the heat preservation furnace, the first atomizing plate is vertically arranged cylindrical, and an upper sealing plate is fixedly arranged at the upper end of the first atomizing plate, and a lower sealing plate is fixedly arranged at the lower end, the upper sealing plate is provided with a connecting port communicating with the first liquid outlet, and the lower sealing plate is connected to a third driving mechanism for driving the lower sealing plate to rotate;
将液态金属雾化为液态金属液滴的设备包括多个存储箱,多个所述存储箱围绕保温炉均匀分布,每个存储箱的底部均设置有第二出液口,每个存储箱的下方设置有竖直的雾化室,所述第二出液口与雾化室连通,所述雾化室内设置有扇叶,所述扇叶连接有驱动扇叶转动的第四驱动机构,雾化室朝向第一雾化板的侧壁即为第二雾化板;The device for atomizing liquid metal into liquid metal droplets comprises a plurality of storage boxes, the plurality of storage boxes are evenly distributed around the holding furnace, a second liquid outlet is provided at the bottom of each storage box, a vertical atomization chamber is provided below each storage box, the second liquid outlet is communicated with the atomization chamber, a fan blade is provided in the atomization chamber, the fan blade is connected to a fourth driving mechanism for driving the fan blade to rotate, and the side wall of the atomization chamber facing the first atomization plate is the second atomization plate;
保温炉中的铜液进入第一雾化板,第三驱动机构带动第一雾化板转动,内部的铜液在离心力的作用下通过第一雾化板上的第一雾化通孔形成铜液滴,并沿第一雾化板径向运动;The copper liquid in the insulation furnace enters the first atomizing plate, and the third driving mechanism drives the first atomizing plate to rotate. Under the action of centrifugal force, the copper liquid inside passes through the first atomizing through hole on the first atomizing plate to form copper droplets, and moves radially along the first atomizing plate.
存储箱中的液态金属进入雾化室后,第四驱动机构带动扇叶转动,扇叶带动液态金属流动,当液态金属到达第二雾化板时,通过第二雾化通孔形成液态金属液滴,并朝着第一雾化板运动,在运动的过程中,液态金属液滴与铜液滴相互碰撞。After the liquid metal in the storage box enters the atomization chamber, the fourth driving mechanism drives the fan blades to rotate, and the fan blades drive the liquid metal to flow. When the liquid metal reaches the second atomization plate, liquid metal droplets are formed through the second atomization through holes and move toward the first atomization plate. During the movement, the liquid metal droplets collide with the copper droplets.
进一步地,所述雾化室和第一雾化板均设置在混合室内,所述混合室底板的中心向上凸起形成圆柱形的安装腔,所述第三驱动机构设置在安装腔中;所述混合室的内腔底部设置有螺旋形的筛分槽,所述筛分槽的右端设置有铜粉收集箱;所述筛分槽下方的混合室侧壁或底壁设置有回流管,所述回流管与存储箱相连,所述回流管上设置有循环泵。Furthermore, the atomization chamber and the first atomization plate are both arranged in a mixing chamber, the center of the mixing chamber bottom plate protrudes upward to form a cylindrical installation cavity, and the third driving mechanism is arranged in the installation cavity; a spiral screening groove is arranged at the bottom of the inner cavity of the mixing chamber, and a copper powder collection box is arranged at the right end of the screening groove; a reflux pipe is arranged on the side wall or bottom wall of the mixing chamber below the screening groove, and the reflux pipe is connected to the storage box, and a circulating pump is arranged on the reflux pipe.
进一步地,所述液态金属液滴的粒径为铜液滴粒径的1/4至1/3。Furthermore, the particle size of the liquid metal droplets is 1/4 to 1/3 of the particle size of the copper droplets.
铜粉,采用上述方法制得。Copper powder is prepared by the above method.
将上述方法制得的铜粉作为热管蒸发端毛细结构层原料的应用。The copper powder prepared by the above method is used as the raw material of the capillary structure layer at the evaporation end of the heat pipe.
本发明的有益效果是:1、本发明采用粒径更小的液态金属液滴对粒径较大的铜液滴进行碰撞,使得铜液滴表面产生凹坑,铜液滴冷却成为铜粉后,即得到表面具有凹坑的铜粉,与传统粒径相同、形状较为规则的铜粉相比,本发明制得的铜粉具有更高的孔隙率,将其作为热管蒸发端毛细结构层时,能够容纳更多的工质,提高热管可以承受的最热功率,同时能够保证传热效率。The beneficial effects of the present invention are as follows: 1. The present invention uses liquid metal droplets with smaller particle sizes to collide with copper droplets with larger particle sizes, so that pits are generated on the surface of the copper droplets. After the copper droplets are cooled to become copper powder, copper powder with pits on the surface is obtained. Compared with traditional copper powder with the same particle size and relatively regular shape, the copper powder prepared by the present invention has a higher porosity. When it is used as a capillary structure layer at the evaporation end of a heat pipe, it can accommodate more working fluids, increase the maximum thermal power that the heat pipe can withstand, and at the same time ensure the heat transfer efficiency.
2、本发明所述的液态金属不是指常规金属熔融后形成的金属液,而是指非晶态金属,与常规金属不同。采用液态金属液滴与铜液滴进行碰撞,液态金属,例如金属稼,熔点只有29.76℃,沸点为2400℃,具有熔点低、沸点高的特性,初次使用时,只需要很少的热量就能够使其液化,后续使用过程中,可以吸收铜液滴的热量而保持为液态,无需持续加热保温,能耗低。此外,液态金属能够承受较大的温度变化而保持稳定,不会挥发、凝固,在高温条件下不会损耗,可以重复利用,降低成本,且液态金属能够方便地与铜粉分离。2. The liquid metal described in the present invention does not refer to the molten metal formed after conventional metal is melted, but refers to amorphous metal, which is different from conventional metal. Liquid metal droplets are used to collide with copper droplets. Liquid metal, such as metal gallium, has a melting point of only 29.76°C and a boiling point of 2400°C. It has the characteristics of low melting point and high boiling point. When used for the first time, only a small amount of heat is needed to liquefy it. During subsequent use, it can absorb the heat of the copper droplets and remain in liquid state. There is no need for continuous heating and heat preservation, and the energy consumption is low. In addition, liquid metal can withstand large temperature changes and remain stable, will not volatilize or solidify, will not be lost under high temperature conditions, can be reused, reduce costs, and liquid metal can be easily separated from copper powder.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明铜粉制备方法的流程示意图;FIG1 is a schematic flow diagram of a method for preparing copper powder according to the present invention;
图2是本发明制备的铜粉颗粒示意图;FIG2 is a schematic diagram of copper powder particles prepared by the present invention;
图3是本发明实施例一的示意图;FIG3 is a schematic diagram of a first embodiment of the present invention;
图4是实施例一中第一雾化板和第二雾化板的俯视示意图;FIG4 is a schematic top view of the first atomizing plate and the second atomizing plate in Example 1;
图5是本发明实施例二的示意图;FIG5 is a schematic diagram of a second embodiment of the present invention;
附图标记:1—第一雾化板;2—第二雾化板;3—保温炉;4—第一出液口;5—第一围板;6—第一驱动机构;7—存储箱;8—第二出液口;9—第二围板;10—第二驱动机构;11—混合室;12—第一窗口;13—第二窗口;14—第一喷气头;15—第二喷气头;16—惰性气体源;17—筛分槽;18—铜粉收集箱;19—回流管;20—循环泵;21—上封板;22—下封板;23—第三驱动机构;24—雾化室;25—扇叶;26—第四驱动机构。Figure numerals: 1—first atomizing plate; 2—second atomizing plate; 3—insulating furnace; 4—first liquid outlet; 5—first enclosure; 6—first driving mechanism; 7—storage box; 8—second liquid outlet; 9—second enclosure; 10—second driving mechanism; 11—mixing chamber; 12—first window; 13—second window; 14—first nozzle; 15—second nozzle; 16—inert gas source; 17—screening trough; 18—copper powder collecting box; 19—reflux pipe; 20—circulating pump; 21—upper sealing plate; 22—lower sealing plate; 23—third driving mechanism; 24—atomizing chamber; 25—fan blades; 26—fourth driving mechanism.
具体实施方式Detailed ways
下面结合附图和实施例对本发明进一步说明。The present invention is further described below in conjunction with the accompanying drawings and embodiments.
本发明的铜粉制备方法,如图1所示,包括The copper powder preparation method of the present invention, as shown in FIG1, comprises:
将熔融的铜液雾化为铜液滴;Atomizing molten copper liquid into copper droplets;
将液态金属雾化为液态金属液滴,液态金属的熔点低于铜的熔点,液态金属液滴的粒径小于铜液滴的粒径;Atomizing the liquid metal into liquid metal droplets, the melting point of the liquid metal is lower than the melting point of copper, and the particle size of the liquid metal droplets is smaller than the particle size of the copper droplets;
驱动铜液滴和液态金属液滴相向运动,使液态金属液滴和铜液滴相互碰撞,铜液滴受到碰撞时表面产生凹坑,且将热量传递至液态金属液滴而凝固为铜粉,液态金属液滴保持为液态;The copper droplets and the liquid metal droplets are driven to move toward each other, so that the liquid metal droplets and the copper droplets collide with each other, a pit is generated on the surface of the copper droplets when the copper droplets collide, and heat is transferred to the liquid metal droplets to solidify into copper powder, and the liquid metal droplets remain in liquid state;
将液态金属与铜粉分离。Separate the liquid metal from the copper powder.
将铜原料加热,使其熔化,从而得到熔融的铜液,铜原料可以是纯铜,也可以采用铜合金,可以采用现有的加热炉将铜原料加热至熔化。雾化是指将聚集在一起的铜液分散,形成小颗粒的铜液滴。The copper raw material is heated to melt, thereby obtaining molten copper liquid. The copper raw material can be pure copper or a copper alloy. The copper raw material can be heated to melt using an existing heating furnace. Atomization refers to dispersing the gathered copper liquid to form small particles of copper liquid droplets.
常规的金属为晶态金属,液态金属即非晶态金属,具有熔点低的特性。液态金属具体可以是金属稼,熔点只有29.76℃,沸点为2400℃,具有熔点低、沸点高的特性,初次使用时,只需要很少的热量就能够使其液化,后续使用过程中,可以吸收铜液滴的热量而保持为液态,无需持续加热保温,能耗低。此外,液态金属能够承受较大的温度变化而保持稳定,不会挥发、凝固,且方便与铜粉分离。Conventional metals are crystalline metals, while liquid metals are amorphous metals with low melting points. Liquid metals can be specifically metal cadmium, which has a melting point of only 29.76°C and a boiling point of 2400°C. It has the characteristics of low melting point and high boiling point. When used for the first time, only a small amount of heat is needed to liquefy it. During subsequent use, it can absorb the heat of copper droplets and remain in liquid state. There is no need for continuous heating and heat preservation, and the energy consumption is low. In addition, liquid metal can withstand large temperature changes and remain stable, will not volatilize or solidify, and is easy to separate from copper powder.
如果液态金属液滴的粒径大于或等于铜液滴的粒径,液态金属液滴与铜液滴碰撞时,可能导致产生的冲击力较大,容易导致铜液滴分散为更小的颗粒,而无法在铜液滴表面形成凹坑,也可能导致产生的凹坑尺寸过大而影响铜液滴的粒径,因此,液态金属液滴的粒径小于铜液滴的粒径,优选的,液态金属液滴的粒径为铜液滴粒径的1/4至1/3,能够在铜液滴表面形成大小合适的凹坑。If the particle size of the liquid metal droplet is greater than or equal to the particle size of the copper droplet, when the liquid metal droplet collides with the copper droplet, the impact force generated may be relatively large, which may easily cause the copper droplet to disperse into smaller particles and fail to form pits on the surface of the copper droplet. It may also cause the size of the pit to be too large and affect the particle size of the copper droplet. Therefore, the particle size of the liquid metal droplet is smaller than the particle size of the copper droplet. Preferably, the particle size of the liquid metal droplet is 1/4 to 1/3 of the particle size of the copper droplet, so that pits of appropriate size can be formed on the surface of the copper droplet.
驱动铜液滴和液态金属液滴相向运动,相向运动是指液态金属液滴的运动轨迹能够与铜液滴运动轨迹交叉的运动,具体地,液态金属液滴的运动轨迹和铜液滴的运动轨迹可以在一条直线上,但两者的运动方向相反,液态金属液滴的运动轨迹和铜液滴的运动轨也可以呈钝角,例如液态金属液滴朝着右下方运动,铜液滴朝着左下方运动,两者能够交汇。The copper droplet and the liquid metal droplet are driven to move toward each other. The movement toward each other refers to the movement in which the movement trajectory of the liquid metal droplet can intersect with the movement trajectory of the copper droplet. Specifically, the movement trajectory of the liquid metal droplet and the movement trajectory of the copper droplet can be on a straight line, but the movement directions of the two are opposite. The movement trajectory of the liquid metal droplet and the movement trajectory of the copper droplet can also form an obtuse angle. For example, the liquid metal droplet moves toward the lower right and the copper droplet moves toward the lower left, and the two can intersect.
通过驱动铜液滴和液态金属液滴相向运动,使得铜液滴和液态金属液滴相互碰撞,从而在铜液滴表面产生凹坑,同时铜液滴的热量传递至液态金属液滴,使得铜液滴快速冷却而凝固为铜粉,而液态金属保持为液态,可以轻易与铜粉分离。By driving the copper droplets and the liquid metal droplets to move toward each other, the copper droplets and the liquid metal droplets collide with each other, thereby generating pits on the surface of the copper droplets. At the same time, the heat of the copper droplets is transferred to the liquid metal droplets, causing the copper droplets to cool rapidly and solidify into copper powder, while the liquid metal remains in liquid state and can be easily separated from the copper powder.
传统雾化法制备的铜粉为较为规则的球形,而本发明制得的铜粉如图2所示,可以看出,铜粉颗粒表面具有一些凹坑,与传统铜粉相比,在粒径相同的情况下,本发明的铜粉具有更高的孔隙率,将其作为热管蒸发端毛细结构层时,能够容纳更多的工质,同时能够保证传热效率。本发明铜粉的粒径是指表面任意两点中,距离最大的两点之间的间距,例如图2中,粒径为d。The copper powder prepared by the traditional atomization method is a relatively regular sphere, while the copper powder prepared by the present invention is shown in FIG2 . It can be seen that there are some pits on the surface of the copper powder particles. Compared with the traditional copper powder, the copper powder of the present invention has a higher porosity when the particle size is the same. When it is used as the capillary structure layer of the evaporation end of the heat pipe, it can accommodate more working fluids and ensure the heat transfer efficiency. The particle size of the copper powder of the present invention refers to the distance between any two points on the surface with the largest distance between them. For example, in FIG2 , the particle size is d.
铜液和液态金属的雾化可以采用常规的气雾法,但气雾法不容易控制铜液滴或液态金属液滴的粒径大小,作为本发明优选的实施方式,本发明将熔融的铜液雾化为铜液滴的过程包括:驱动熔融的铜液通过第一雾化板1,第一雾化板1上设置有多个均匀分布的第一雾化通孔,铜液通过第一雾化通孔后形成铜液滴;The atomization of the copper liquid and the liquid metal can be carried out by a conventional atomization method, but the atomization method is not easy to control the particle size of the copper droplets or the liquid metal droplets. As a preferred embodiment of the present invention, the process of atomizing the molten copper liquid into copper droplets comprises: driving the molten copper liquid through a first atomization plate 1, the first atomization plate 1 is provided with a plurality of uniformly distributed first atomization through holes, and the copper liquid forms copper droplets after passing through the first atomization through holes;
将液态金属雾化为液态金属液滴的过程包括:驱动液态金属通过第二雾化板2,第二雾化板2上设置有多个均匀分布的第二雾化通孔,第二雾化通孔的直径小于第一雾化通孔的直径,液态金属通过第二雾化通孔后形成液态金属液滴。The process of atomizing liquid metal into liquid metal droplets includes: driving the liquid metal through the second atomizing plate 2, on which a plurality of evenly distributed second atomizing through holes are provided, the diameter of the second atomizing through holes is smaller than the diameter of the first atomizing through holes, and the liquid metal forms liquid metal droplets after passing through the second atomizing through holes.
第一雾化板1采用耐高温的板材,铜液经过第一雾化板1的第一雾化通孔后,形成的铜液滴粒径与第一雾化通孔适配,即可以通过控制第一雾化通孔的孔径来控制铜液滴的粒径,从而得到粒径满足要求且粒径大小均匀的铜液滴。同样的,可以得到粒径满足要求且粒径大小均匀的液态金属液滴。The first atomizing plate 1 is made of a high temperature resistant plate. After the copper liquid passes through the first atomizing through hole of the first atomizing plate 1, the particle size of the copper droplets formed is adapted to the first atomizing through hole, that is, the particle size of the copper droplets can be controlled by controlling the aperture of the first atomizing through hole, thereby obtaining copper droplets with a particle size that meets the requirements and is uniform. Similarly, liquid metal droplets with a particle size that meets the requirements and is uniform can be obtained.
本发明具体提供了以下两种可实现铜液和液态金属雾化以及相互碰撞的设备。The present invention specifically provides the following two devices which can realize the atomization of copper liquid and liquid metal and the mutual collision.
实施例一Embodiment 1
如图3和图4所示,将熔融的铜液雾化为铜液滴的设备包括保温炉3,保温炉3的底部设置有第一出液口4,第一雾化板1水平设置在第一出液口4的下方,且第一雾化板1的边缘设置有第一围板5,第一雾化板1连接有驱动第一雾化板1往复平移的第一驱动机构6。As shown in Figures 3 and 4, the equipment for atomizing molten copper liquid into copper droplets includes a heat-insulating furnace 3, a first liquid outlet 4 is arranged at the bottom of the heat-insulating furnace 3, a first atomizing plate 1 is horizontally arranged below the first liquid outlet 4, and a first enclosure 5 is arranged at the edge of the first atomizing plate 1, and the first atomizing plate 1 is connected to a first driving mechanism 6 for driving the first atomizing plate 1 to reciprocate.
本实施例中,第一雾化板1为平板,形状为矩形,第一围板5为4块,竖直设置在第一雾化板1的四个边,第一围板5和第一雾化板1围成腔体。保温炉3采用耐高温材料,可以在其外壁设置保温层,同时可以设置电加热元件,以保证保温炉3中的铜液处于合适的温度,防止铜液降温冷却。保温炉3中的铜液可以通过第一出液口4流动到第一雾化板1上,第一驱动机构6带动第一雾化板1不断地来回移动,可以使得铜液分散到第一雾化板1上。铜液在重力的作用下通过第一雾化通孔,然后向下滴落。In the present embodiment, the first atomizing plate 1 is a flat plate in a rectangular shape, and the first enclosure 5 is 4 pieces, which are vertically arranged on the four sides of the first atomizing plate 1, and the first enclosure 5 and the first atomizing plate 1 surround a cavity. The insulation furnace 3 is made of high temperature resistant material, and an insulation layer can be arranged on its outer wall, and an electric heating element can be arranged at the same time to ensure that the copper liquid in the insulation furnace 3 is at a suitable temperature to prevent the copper liquid from cooling down. The copper liquid in the insulation furnace 3 can flow to the first atomizing plate 1 through the first liquid outlet 4, and the first driving mechanism 6 drives the first atomizing plate 1 to move back and forth continuously, so that the copper liquid can be dispersed on the first atomizing plate 1. The copper liquid passes through the first atomizing through hole under the action of gravity and then drips downward.
将液态金属雾化为液态金属液滴的设备包括存储箱7,存储箱7的底部设置有第二出液口8,第二雾化板2水平设置在第二出液口8的下方,且第二雾化板2的边缘设置有第二围板9,第二雾化板2连接有驱动第二雾化板2往复平移的第二驱动机构10。The device for atomizing liquid metal into liquid metal droplets includes a storage box 7, a second liquid outlet 8 is arranged at the bottom of the storage box 7, a second atomizing plate 2 is horizontally arranged below the second liquid outlet 8, and a second enclosure 9 is arranged at the edge of the second atomizing plate 2, and the second atomizing plate 2 is connected to a second driving mechanism 10 for driving the second atomizing plate 2 to reciprocate.
存储箱7用于存储液态金属,存储箱7中的液态金属通过第二出液口8流动到第二雾化板2上,第二驱动机构10带动第二雾化板2不断地来回移动,促进液态金属铺满第二雾化板2并通过第二雾化通孔。The storage box 7 is used to store liquid metal. The liquid metal in the storage box 7 flows to the second atomization plate 2 through the second liquid outlet 8. The second driving mechanism 10 drives the second atomization plate 2 to move back and forth continuously, promoting the liquid metal to cover the second atomization plate 2 and pass through the second atomization through hole.
第一驱动机构6和第二驱动机构10可以采用液压缸、直线电机等设备。The first driving mechanism 6 and the second driving mechanism 10 can be implemented by hydraulic cylinders, linear motors and other devices.
此外,还可以在第一雾化板1和第二雾化板2的上方设置有喷吹头,将惰性气体输送至喷吹头,喷吹头将惰性气体朝下喷向第一雾化板1和第二雾化板2,可以促进铜液更快地通过第一雾化板1,促进液态金属更快地通过第二雾化板2,同时,惰性气体充满第一雾化板1和第二雾化板2上方的空间,避免液态金属和铜液接触到空气中的氧气,防止被氧化。In addition, a blowing head can be arranged above the first atomizing plate 1 and the second atomizing plate 2 to transport the inert gas to the blowing head, and the blowing head sprays the inert gas downward toward the first atomizing plate 1 and the second atomizing plate 2, which can promote the copper liquid to pass through the first atomizing plate 1 faster, and promote the liquid metal to pass through the second atomizing plate 2 faster. At the same time, the inert gas fills the space above the first atomizing plate 1 and the second atomizing plate 2, preventing the liquid metal and the copper liquid from contacting the oxygen in the air and preventing them from being oxidized.
本实施例还包括混合室11,混合室11的顶壁设置有第一窗口12和第二窗口13,第一雾化板1和第二雾化板2均与混合室11的顶面滑动配合,且第一雾化板1位于第一窗口12的上方,第二雾化板2位于第二窗口13的上方;第一窗口12远离第二窗口13的一侧设置有第一喷气头14,第二窗口13远离第一窗口12的一侧设置有第二喷气头15,第一喷气头14和第二喷气头15均连接有惰性气体源16,且第一喷气头14的喷气方向水平朝向第二喷气头15,第二喷气头15的喷气方向水平朝向第一喷气头14。The present embodiment also includes a mixing chamber 11, the top wall of the mixing chamber 11 is provided with a first window 12 and a second window 13, the first atomizing plate 1 and the second atomizing plate 2 are both slidably matched with the top surface of the mixing chamber 11, and the first atomizing plate 1 is located above the first window 12, and the second atomizing plate 2 is located above the second window 13; a first nozzle 14 is provided on the side of the first window 12 away from the second window 13, and a second nozzle 15 is provided on the side of the second window 13 away from the first window 12, the first nozzle 14 and the second nozzle 15 are both connected to an inert gas source 16, and the jet direction of the first nozzle 14 is horizontally toward the second nozzle 15, and the jet direction of the second nozzle 15 is horizontally toward the first nozzle 14.
混合室11为长方体形的室体,采用耐高温材质,第一窗口12和第二窗口13为矩形窗口,第一雾化板1位于第一窗口12的上方,第二雾化板2位于第二窗口13的上方,通过第一雾化板1的铜液滴能够通过第一窗口12向下落入混合室11,通过第二雾化板2的液态金属液滴能够通过第二窗口13向下落入混合室11。第一雾化板1和第二雾化板2均与混合室11的顶面滑动配合,保证第一雾化板1和第二雾化板2运动的稳定性,具体地,可以在第一窗口12和第二窗口13两侧设置导轨,导轨固定在混合室11的顶面,第一雾化板1和第二雾化板2与导轨滑动配合,导轨可以起到导向和限位的作用,因此能够提高第一雾化板1和第二雾化板2运动的稳定性。The mixing chamber 11 is a rectangular chamber body, made of high temperature resistant material, the first window 12 and the second window 13 are rectangular windows, the first atomizing plate 1 is located above the first window 12, and the second atomizing plate 2 is located above the second window 13, the copper droplets passing through the first atomizing plate 1 can fall downward into the mixing chamber 11 through the first window 12, and the liquid metal droplets passing through the second atomizing plate 2 can fall downward into the mixing chamber 11 through the second window 13. The first atomizing plate 1 and the second atomizing plate 2 are both slidably matched with the top surface of the mixing chamber 11 to ensure the stability of the movement of the first atomizing plate 1 and the second atomizing plate 2. Specifically, guide rails can be set on both sides of the first window 12 and the second window 13, and the guide rails are fixed on the top surface of the mixing chamber 11. The first atomizing plate 1 and the second atomizing plate 2 are slidably matched with the guide rails, and the guide rails can play a role of guiding and limiting, so the stability of the movement of the first atomizing plate 1 and the second atomizing plate 2 can be improved.
第一喷气头14和第二喷气头15用于喷出高速流动的惰性气体,利用惰性气体带动液态金属液滴和铜液滴运动,促使液态金属液滴和铜液滴运动相互碰撞。惰性气体源16用于提供惰性气体,惰性气体可以采用氮气等,惰性气体源16可以是存储惰性气体的压力罐,可以采用气泵提高惰性气体的流速。The first nozzle 14 and the second nozzle 15 are used to spray high-speed inert gas, and use the inert gas to drive the liquid metal droplets and the copper droplets to move, so as to cause the liquid metal droplets and the copper droplets to move and collide with each other. The inert gas source 16 is used to provide inert gas, and the inert gas can be nitrogen or the like. The inert gas source 16 can be a pressure tank for storing inert gas, and an air pump can be used to increase the flow rate of the inert gas.
第一喷气头14和第二喷气头15同时喷出高速流动的惰性气体,铜液滴通过第一窗口12进入混合室11后,随着第一喷气头14喷出的惰性气体运动,液态金属液滴通过第二窗口13进入混合室11后,随着第二喷气头15喷出的惰性气体运动,使得液态金属液滴与铜液滴相向运动并相互碰撞。The first nozzle 14 and the second nozzle 15 simultaneously spray high-speed flowing inert gas. After the copper droplets enter the mixing chamber 11 through the first window 12, they move with the inert gas sprayed by the first nozzle 14. After the liquid metal droplets enter the mixing chamber 11 through the second window 13, they move with the inert gas sprayed by the second nozzle 15, so that the liquid metal droplets and the copper droplets move toward each other and collide with each other.
在液态金属液滴与铜液滴进入混合室11之前,可以先向混合室11中通入惰性气体,将混合室11中的空气挤出,防止液态金属液滴与铜液滴被氧化。Before the liquid metal droplets and the copper droplets enter the mixing chamber 11 , an inert gas may be introduced into the mixing chamber 11 to squeeze out the air in the mixing chamber 11 to prevent the liquid metal droplets and the copper droplets from being oxidized.
为了便于分离液态金属与铜粉,混合室11内腔的底部设置有倾斜的筛分槽17,筛分槽17的右端设置有铜粉收集箱18;筛分槽17下方的混合室11侧壁或底壁设置有回流管19,回流管19与存储箱7相连,回流管19上设置有循环泵20。In order to facilitate the separation of liquid metal and copper powder, an inclined screening trough 17 is provided at the bottom of the inner cavity of the mixing chamber 11, and a copper powder collecting box 18 is provided at the right end of the screening trough 17; a reflux pipe 19 is provided on the side wall or bottom wall of the mixing chamber 11 below the screening trough 17, and the reflux pipe 19 is connected to the storage box 7, and a circulating pump 20 is provided on the reflux pipe 19.
液态金属液滴与铜液滴碰撞后同时向下掉落,铜液滴冷却后凝固为铜粉,液态金属保持为液态,两者同时掉落在筛分槽17上,筛分槽17上设置有细小的过滤孔,液态金属能够通过过滤孔到达筛分槽17下方并汇集在一起,而铜粉则随着筛分槽17向下滚动至铜粉收集箱18中。筛分槽17下方的液态金属在循环泵20的作用下重新回到存储箱7,实现循环利用。After the liquid metal droplets collide with the copper droplets, they fall downward at the same time. After the copper droplets cool, they solidify into copper powder, and the liquid metal remains in liquid state. Both fall onto the screening tank 17 at the same time. The screening tank 17 is provided with fine filter holes. The liquid metal can pass through the filter holes to reach the bottom of the screening tank 17 and gather together, while the copper powder rolls down along the screening tank 17 to the copper powder collection box 18. The liquid metal below the screening tank 17 returns to the storage box 7 under the action of the circulation pump 20 to achieve recycling.
此外,由于液态金属与铜粉的密度不同,例如液态金属采用金属稼时,密度为5.9g/cm3,纯铜的密度为8.960g/cm3,因此也可以在混合室11的底部设置沉淀槽,液态金属和铜粉同时落入沉淀槽中,经过沉淀后,铜粉沉淀至沉淀槽的底部,而上层的液态金属可以重复利用。In addition, since the density of liquid metal and copper powder is different, for example, when the liquid metal is made of metal gallium, the density is 5.9g/ cm3 , and the density of pure copper is 8.960g/ cm3 , a sedimentation tank can also be set at the bottom of the mixing chamber 11, and the liquid metal and copper powder fall into the sedimentation tank at the same time. After sedimentation, the copper powder settles to the bottom of the sedimentation tank, and the liquid metal on the upper layer can be reused.
实施例二Embodiment 2
如图5所示,将熔融的铜液雾化为铜液滴的设备包括保温炉3,保温炉3的底部设置有第一出液口4,第一雾化板1呈竖直设置的圆筒形,且第一雾化板1的上端固定设置有上封板21,下端固定设置有下封板22,上封板21上设置有与第一出液口4连通的连接口,下封板22连接有驱动下封板22转动的第三驱动机构23。As shown in Figure 5, the equipment for atomizing molten copper liquid into copper droplets includes a heat-insulating furnace 3, a first liquid outlet 4 is arranged at the bottom of the heat-insulating furnace 3, a first atomizing plate 1 is vertically arranged cylindrical, and an upper sealing plate 21 is fixedly arranged at the upper end of the first atomizing plate 1, and a lower sealing plate 22 is fixedly arranged at the lower end, a connecting port communicating with the first liquid outlet 4 is arranged on the upper sealing plate 21, and the lower sealing plate 22 is connected to a third driving mechanism 23 for driving the lower sealing plate 22 to rotate.
本实施例中,第一雾化板1呈圆筒形,上封板21和下封板22分别对第一雾化板1的上端和下端进行封口,上封板21和下封板22和第一雾化板1固定连接一体。保温炉3与实施例一相同,用于存储熔化后的溶液。保温炉3中的铜液通过第一出液口4进入第一雾化板1内部,利用第三驱动机构23带动下封板22和第一雾化板1高速转动,第一雾化板1内部的铜液产生离心力,在离心力的作用下,铜液通过第一雾化通孔并沿第一雾化板1径向的甩出,实现铜液的雾化。第一出液口4可以是一根管道,该管道贯穿上封板21,并且上封板21与该管道之间间隙配合,不影响上封板21随着第一雾化板1转动。In the present embodiment, the first atomizing plate 1 is cylindrical, and the upper sealing plate 21 and the lower sealing plate 22 respectively seal the upper and lower ends of the first atomizing plate 1, and the upper sealing plate 21 and the lower sealing plate 22 are fixedly connected to the first atomizing plate 1. The insulation furnace 3 is the same as the first embodiment, and is used to store the melted solution. The copper liquid in the insulation furnace 3 enters the inside of the first atomizing plate 1 through the first liquid outlet 4, and the lower sealing plate 22 and the first atomizing plate 1 are driven to rotate at high speed by the third driving mechanism 23. The copper liquid inside the first atomizing plate 1 generates centrifugal force. Under the action of centrifugal force, the copper liquid passes through the first atomizing through hole and is thrown out radially along the first atomizing plate 1 to achieve the atomization of the copper liquid. The first liquid outlet 4 can be a pipeline, which runs through the upper sealing plate 21, and the clearance between the upper sealing plate 21 and the pipeline is matched, and the upper sealing plate 21 does not affect the rotation of the first atomizing plate 1.
将液态金属雾化为液态金属液滴的设备包括多个存储箱7,多个存储箱7围绕保温炉3均匀分布,每个存储箱7的底部均设置有第二出液口8,每个存储箱7的下方设置有竖直的雾化室24,第二出液口8与雾化室24连通,雾化室24内设置有扇叶25,扇叶25连接有驱动扇叶25转动的第四驱动机构26,雾化室24朝向第一雾化板1的侧壁即为第二雾化板2。The equipment for atomizing liquid metal into liquid metal droplets includes a plurality of storage boxes 7, which are evenly distributed around the insulation furnace 3. A second liquid outlet 8 is provided at the bottom of each storage box 7. A vertical atomization chamber 24 is provided below each storage box 7. The second liquid outlet 8 is connected to the atomization chamber 24. A fan blade 25 is provided in the atomization chamber 24. The fan blade 25 is connected to a fourth driving mechanism 26 for driving the fan blade 25 to rotate. The side wall of the atomization chamber 24 facing the first atomization plate 1 is the second atomization plate 2.
保温炉3中的铜液进入第一雾化板1,第三驱动机构23带动第一雾化板1转动,内部的铜液在离心力的作用下通过第一雾化板1上的第一雾化通孔形成铜液滴,并沿第一雾化板1径向运动;存储箱7中的液态金属进入雾化室24后,第四驱动机构26带动扇叶25转动,扇叶25带动液态金属流动,当液态金属到达第二雾化板2时,通过第二雾化通孔形成液态金属液滴,并朝着第一雾化板1运动,在运动的过程中,液态金属液滴与铜液滴相互碰撞。The copper liquid in the insulation furnace 3 enters the first atomizing plate 1, and the third driving mechanism 23 drives the first atomizing plate 1 to rotate. Under the action of centrifugal force, the internal copper liquid passes through the first atomizing through hole on the first atomizing plate 1 to form copper droplets, and moves radially along the first atomizing plate 1; after the liquid metal in the storage box 7 enters the atomizing chamber 24, the fourth driving mechanism 26 drives the fan blades 25 to rotate, and the fan blades 25 drive the liquid metal to flow. When the liquid metal reaches the second atomizing plate 2, liquid metal droplets are formed through the second atomizing through hole and move toward the first atomizing plate 1. During the movement, the liquid metal droplets collide with the copper droplets.
存储箱7用于存储液态金属,第二出液口8用于将存储箱7中的液态金属输送至雾化室24,雾化室24固定安装,可以采用圆柱形室体,也可以采用长方体形的室体,多个雾化室24围绕第一雾化板1均匀分布。当液态金属进入雾化室24后,第四驱动机构26带动扇叶25高速转动,在扇叶25的作用下,液态金属形成涡流,也具有一定的离心力,当液态金属经过第二雾化板2时,即可通过第二雾化板2上的第二雾化通孔排出,由于第二雾化板2设置在朝向第一雾化板1的一侧,形成的液态金属液滴会朝着第一雾化板1运动,即可与第一雾化板1喷出的铜液滴碰撞。The storage box 7 is used to store liquid metal, and the second liquid outlet 8 is used to transport the liquid metal in the storage box 7 to the atomizing chamber 24. The atomizing chamber 24 is fixedly installed and can adopt a cylindrical chamber body or a rectangular chamber body. Multiple atomizing chambers 24 are evenly distributed around the first atomizing plate 1. After the liquid metal enters the atomizing chamber 24, the fourth driving mechanism 26 drives the fan blades 25 to rotate at high speed. Under the action of the fan blades 25, the liquid metal forms a vortex and also has a certain centrifugal force. When the liquid metal passes through the second atomizing plate 2, it can be discharged through the second atomizing through hole on the second atomizing plate 2. Since the second atomizing plate 2 is set on the side facing the first atomizing plate 1, the formed liquid metal droplets will move toward the first atomizing plate 1, and can collide with the copper droplets sprayed from the first atomizing plate 1.
第三驱动机构23和第四驱动机构26可以采用电机。The third driving mechanism 23 and the fourth driving mechanism 26 may be motors.
为了营造稳定的空间,雾化室24和第一雾化板1均设置在混合室11内,混合室11底板的中心向上凸起形成圆柱形的安装腔,第三驱动机构23设置在安装腔中;混合室11的内腔底部设置有螺旋形的筛分槽17,筛分槽17的右端设置有铜粉收集箱18;筛分槽17下方的混合室11侧壁或底壁设置有回流管19,回流管19与存储箱7相连,回流管19上设置有循环泵20。In order to create a stable space, the atomization chamber 24 and the first atomization plate 1 are both arranged in the mixing chamber 11. The center of the bottom plate of the mixing chamber 11 protrudes upward to form a cylindrical installation cavity, and the third driving mechanism 23 is arranged in the installation cavity; a spiral screening groove 17 is arranged at the bottom of the inner cavity of the mixing chamber 11, and a copper powder collection box 18 is arranged at the right end of the screening groove 17; a reflux pipe 19 is arranged on the side wall or bottom wall of the mixing chamber 11 below the screening groove 17, and the reflux pipe 19 is connected to the storage box 7, and a circulating pump 20 is arranged on the reflux pipe 19.
混合室11可以采用圆柱形室体,也可以采用长方体形的室体,雾化室24和第一雾化板1设置在混合室11内部,存储箱7和保温炉3设置在混合室11的上方。在制备铜粉的过程中,可以持续向混合室11内通入惰性气体,防止氧气进入混合室11而导致液态金属或者铜氧化。混合室11底板的中心向上凸起形成圆柱形的安装腔,并将第三驱动机构23设置在安装腔中,使得第三驱动机构23位于混合室11外部,可以降低高温对第三驱动机构23的影响,同样的,将第四驱动机构26也安装在混合室11外部。The mixing chamber 11 can adopt a cylindrical chamber body or a rectangular chamber body. The atomizing chamber 24 and the first atomizing plate 1 are arranged inside the mixing chamber 11, and the storage box 7 and the insulation furnace 3 are arranged above the mixing chamber 11. In the process of preparing copper powder, an inert gas can be continuously introduced into the mixing chamber 11 to prevent oxygen from entering the mixing chamber 11 and causing oxidation of liquid metal or copper. The center of the bottom plate of the mixing chamber 11 bulges upward to form a cylindrical installation cavity, and the third drive mechanism 23 is arranged in the installation cavity, so that the third drive mechanism 23 is located outside the mixing chamber 11, which can reduce the influence of high temperature on the third drive mechanism 23. Similarly, the fourth drive mechanism 26 is also installed outside the mixing chamber 11.
液态金属液滴与铜液滴碰撞后同时向下掉落,铜液滴冷却后凝固为铜粉,液态金属保持为液态,两者同时掉落在筛分槽17上,筛分槽17上设置有细小的过滤孔,液态金属能够通过过滤孔到达筛分槽17下方并汇集在一起,而铜粉则随着筛分槽17向下滚动至铜粉收集箱18中。筛分槽17下方的液态金属在循环泵20的作用下重新回到存储箱7,实现循环利用。After the liquid metal droplets collide with the copper droplets, they fall downward at the same time. After the copper droplets cool, they solidify into copper powder, and the liquid metal remains in liquid state. Both fall onto the screening tank 17 at the same time. The screening tank 17 is provided with fine filter holes. The liquid metal can pass through the filter holes to reach the bottom of the screening tank 17 and gather together, while the copper powder rolls down along the screening tank 17 to the copper powder collection box 18. The liquid metal below the screening tank 17 returns to the storage box 7 under the action of the circulation pump 20 to achieve recycling.
此外,由于液态金属与铜粉的密度不同,例如液态金属采用金属稼时,密度为5.9g/cm3,纯铜的密度为8.960g/cm3,因此也可以在混合室11的底部设置沉淀槽,液态金属和铜粉同时落入沉淀槽中,经过沉淀后,铜粉沉淀至沉淀槽的底部,而上层的液态金属可以重复利用。In addition, since the density of liquid metal and copper powder is different, for example, when the liquid metal is made of metal gallium, the density is 5.9g/ cm3 , and the density of pure copper is 8.960g/ cm3 , a sedimentation tank can also be set at the bottom of the mixing chamber 11, and the liquid metal and copper powder fall into the sedimentation tank at the same time. After sedimentation, the copper powder settles to the bottom of the sedimentation tank, and the liquid metal on the upper layer can be reused.
将本发明制得的铜粉作为热管蒸发端毛细结构层原料,即以本发明制得的铜粉为原料,通过烧结而得到热管蒸发端毛细结构层,可以增加热管蒸发端的工质总量,提高热管可以承受的最热功率。当然热管其他部位的毛细结构层也可以采用本发明的铜粉烧结而成。The copper powder prepared in the present invention is used as the raw material of the capillary structure layer at the evaporation end of the heat pipe, that is, the copper powder prepared in the present invention is used as the raw material, and the capillary structure layer at the evaporation end of the heat pipe is obtained by sintering, which can increase the total amount of working fluid at the evaporation end of the heat pipe and improve the maximum thermal power that the heat pipe can withstand. Of course, the capillary structure layer at other parts of the heat pipe can also be sintered using the copper powder of the present invention.
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
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