CN117870526B - Micro displacement sensor - Google Patents

Micro displacement sensor Download PDF

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Publication number
CN117870526B
CN117870526B CN202410269487.7A CN202410269487A CN117870526B CN 117870526 B CN117870526 B CN 117870526B CN 202410269487 A CN202410269487 A CN 202410269487A CN 117870526 B CN117870526 B CN 117870526B
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China
Prior art keywords
plate
polar plate
movable
displacement sensor
micro
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CN202410269487.7A
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Chinese (zh)
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CN117870526A (en
Inventor
崔建国
郭积健
肖田
张鹏
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Chotest Technology Inc
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Chotest Technology Inc
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Priority to CN202410269487.7A priority Critical patent/CN117870526B/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

The disclosure describes a micro-displacement sensor comprising a fixed polar plate, a movable polar plate, a supporting part and a first adjusting part, wherein the fixed polar plate comprises a first polar plate and a second polar plate, and the movable polar plate is arranged between the first polar plate and the second polar plate and can swing relative to the fixed polar plate; the support part comprises a first support piece connected with the fixed polar plate, a second support piece arranged opposite to the first support piece, and a connecting piece used for connecting the first support piece and the second support piece; the connecting piece comprises a first connecting unit connected with the first supporting piece and a second connecting unit connected with the second supporting piece; the first end face of the first connecting unit is connected with the first side face of the first supporting piece, and the contact area of the first end face and the first side face is smaller than the contact area of the first side face; in the assembly process, the first adjusting part is configured to adjust the posture of the fixed polar plate relative to the movable polar plate. Therefore, in the assembly process, the posture of the fixed polar plate relative to the movable polar plate can be easily adjusted.

Description

Micro displacement sensor
Technical Field
The present disclosure relates to intelligent measuring instruments, and in particular, to a micro displacement sensor.
Background
The differential capacitive sensor is a sensor that uses two parallel electrode plates (may be called a fixed electrode plate) and one movable electrode plate to measure displacement change, specifically, a movable electrode plate capable of swinging relative to the fixed electrode plate is arranged between the two parallel electrode plates, the movable electrode plate swings in response to displacement change, and the capacitance difference of two capacitances formed between the movable electrode plate and the two electrode plates is changed due to the swing of the movable electrode plate, and the displacement change can be measured based on the capacitance difference change, and the differential capacitive sensor is also called a variable-pole-distance capacitive displacement sensor. The differential capacitive sensor has the characteristics of high sensitivity, high linearity and strong anti-interference performance, and is widely applied to contact surface topography measuring instruments such as a step instrument, a surface profile measuring instrument and the like.
In the assembly process, the relative posture between the two electrode plates and the movable electrode plate of the differential capacitive sensor is required to meet the preset requirement so as to be applicable to the micro-displacement (nano-scale) measurement field. In practical applications, the relative posture between the fixed plate and the movable plate needs to be adjusted repeatedly to align and parallel the fixed plate and the movable plate as much as possible. In general, the condition that the gesture of the fixed polar plate relative to the movable polar plate meets the preset requirement means that the movable polar plate is arranged between the two polar plates, and the movable polar plate is aligned with the two polar plates. Specifically, in the assembly process, the fixed polar plate is required to be mounted on the substrate, the movable polar plate is required to be mounted on the pivot, and the substrate is deformed to change the posture and the position of the fixed polar plate until the fixed polar plate is parallel to the movable polar plate and is aligned with the movable polar plate.
However, in the process of deformation of the substrate, the position of the stress concentration area relative to the fixed polar plate can affect the difficulty and effect of assembly, if the stress concentration is at an unsuitable position, the difficulty of adjustment can be high, and even the relative posture between the fixed polar plate and the movable polar plate can not meet the preset requirement in a mode of adjusting the relative posture between the fixed polar plate and the movable polar plate.
Disclosure of Invention
The present disclosure has been made in view of the above-mentioned circumstances, and an object thereof is to provide a micro-displacement sensor in which the posture of a fixed plate relative to a movable plate is easily adjusted during assembly.
For this reason, the disclosure provides a micro-displacement sensor, which is a sensor for measuring displacement by swinging a movable polar plate, and comprises a fixed polar plate, the movable polar plate, a supporting part and a first adjusting part, wherein the fixed polar plate comprises a first polar plate and a second polar plate which is opposite to and parallel to the first polar plate, and the movable polar plate is arranged between the first polar plate and the second polar plate and can swing relative to the fixed polar plate to obtain the displacement; the support part comprises a first support piece connected with the fixed polar plate, a second support piece arranged opposite to the first support piece, and a connecting piece used for connecting the first support piece and the second support piece; the connecting piece comprises a first connecting unit connected with the first supporting piece and a second connecting unit connected with the second supporting piece; the first end face of the first connecting unit is connected with the first side face of the first supporting piece, and the contact area of the first end face and the first side face is smaller than the area of the first side face; in the assembly process, the first adjusting part is configured to adjust the posture of the fixed polar plate relative to the movable polar plate.
In the present disclosure, in the process of adjusting the posture of the fixed polar plate relative to the movable polar plate by the first adjusting portion, the fixed polar plate may change in posture with a region located on the connecting member as a center, and for convenience of description, the region is defined as a rotation center; when the contact area of the first end face and the first side face is smaller than that of the first side face, the stress concentration area of the connecting piece is closer to the fixed polar plate in the process of adjusting the gesture of the fixed polar plate, namely the rotating center is closer to the fixed polar plate, the gesture fineness of adjusting the fixed polar plate can be improved, the gesture of adjusting the fixed polar plate relative to the movable polar plate is favorable for meeting the speed of preset requirements, and accordingly the measurement accuracy and precision of the micro-displacement sensor can be improved.
In addition, in the micro displacement sensor according to the present disclosure, optionally, the first connection unit and the first support are connected in a rounded manner. In this case, the rounded design helps to reduce stress concentrations, thereby increasing the overall strength of the connection. In addition, the rounded corner design can enable the rotation center to be far away from the first adjusting part in the Y-axis direction, so that the force arm for adjusting the posture of the fixed polar plate can be increased, the driving force for the first adjusting part can be reduced, the convenience for operating the first adjusting part is improved, and the posture adjustment of the fixed polar plate is facilitated.
In addition, in the micro displacement sensor according to the present disclosure, optionally, the first adjusting portion is disposed on the supporting portion, the first adjusting portion includes a first through hole, a first screw hole, and a first screw rod penetrating through the first through hole and screwed with the first screw hole to form a first screwed structure, the first through hole is disposed on the first supporting member, the first screw hole is disposed on the second supporting member and is disposed opposite to the first through hole, or the first through hole is disposed on the second supporting member, and the first screw hole is disposed on the first supporting member and is disposed opposite to the first through hole. Under this kind of circumstances, first screw rod can pass first through-hole and first screw and form the spiro union structure to through rotatory first screw rod, change the degree of depth of first screw in first screw, can make first support piece's gesture change, and then can adjust first support piece's gesture, thereby can drive the gesture of deciding the polar plate and change.
In addition, in the micro displacement sensor according to the present disclosure, optionally, the first adjusting portion includes a plurality of first screw structures, the plurality of first screw structures are disposed on a side of the supporting portion away from the connecting member, and the plurality of first screw structures are distributed at intervals along a preset direction. Under the condition, the first screw structures are distributed at intervals along the preset direction, and the fixed polar plate rotating gesture around the Y axis and the fixed polar plate rotating gesture around the X axis can be conveniently adjusted through adjusting the first screw structures. Namely, the multiple postures of the fixed polar plate can be adjusted, thereby being beneficial to finely adjusting the postures of the fixed polar plate relative to the movable polar plate.
Additionally, in the micro-displacement sensor according to the present disclosure, optionally, a locking structure is further included, the locking structure configured to limit the relative movement between the first support and the second support. In this case, after the first adjusting portion completes the adjustment of the posture of the fixed electrode plate relative to the movable electrode plate, the first supporting member can be restricted from approaching the second supporting member by providing the locking structure, so that the posture of the fixed electrode plate relative to the movable electrode plate can be fixed more stably.
In addition, in the micro displacement sensor according to the present disclosure, optionally, a plurality of the first screw structures are uniformly arranged on both sides of the locking structure. In this case, the forces of the first screw structures and the locking structures on the supporting portion can be balanced, and the mechanical stability of the micro-displacement sensor can be improved.
In addition, in the micro displacement sensor according to the present disclosure, optionally, a measuring rod connected to the movable plate and used for scanning the object to be measured, and a pivot shaft connected to the second support member are further included, and the measuring rod is pivotally disposed on the pivot shaft. In this case, when the micro-displacement sensor is in operation, the measuring rod can pivot or rotate around the pivot shaft to swing back and forth, so that the micro-displacement sensor can be used for measuring parameters of the surface topography of the object to be measured in the swinging area.
In addition, in the micro displacement sensor related to the present disclosure, optionally, a flexible hinge is further included and disposed on the pivot shaft, a fixed end of the flexible hinge is connected to the pivot shaft, a pivot end of the flexible hinge is connected to the measuring rod, and an axis of the flexible hinge is parallel to or coincides with an axis of the pivot shaft. In this case, on the one hand, due to the elastic properties of the flexible hinge, the influence of vibrations on the micro-displacement sensor can be reduced; in addition, the rotation angle of the flexible hinge and the generated acting force have a linear relation, so that the acting force of the measuring rod contacting the object to be measured can be controlled conveniently, and further, the acting force of the measuring rod contacting the object to be measured can be kept in a specified range conveniently, therefore, in the measuring process, the measuring rod can be kept in contact with the object to be measured all the time, and meanwhile, the surface of the object to be measured cannot be damaged. In addition, through the axis of the flexible hinge parallel or coincident with the axis of the pivot shaft, the structural design of the micro displacement sensor can be simplified, and the fixed end of the pivot shaft is adjusted, so that the postures of the measuring rod and the movable polar plate are adjusted.
In addition, in the micro displacement sensor according to the present disclosure, optionally, the thickness of the first connection unit is made to be a first thickness, and the thickness of the first support member is made to be a second thickness, in a direction orthogonal to the fixed plate, the first thickness being smaller than the second thickness. In this case, it can be facilitated to have the area of the first end face in contact with the first side face smaller than the area of the first side face.
In addition, in the micro displacement sensor related to the present disclosure, optionally, the first connection unit extends in a direction parallel to the stationary plate and is connected to the first support, and the second connection unit extends in a direction orthogonal to the stationary plate and is connected to the second support; in the direction parallel to the fixed polar plate, the thickness of the second connecting unit is made to be a third thickness; the ratio of the first thickness to the third thickness is within a preset range. In this case, as calculated by software simulation, if the first thickness is too thin relative to the third thickness (i.e., the ratio of the first thickness to the third thickness is lower than the lower limit of the preset range), although the rotation center is closer to the fixed polar plate, the stress of the first connection unit is unevenly distributed, and there is a problem of stress concentration, which will cause insufficient mechanical strength of the first connection unit and easy occurrence of stress fatigue; if the first thickness is too thick relative to the third thickness (i.e. the ratio of the first thickness to the third thickness is higher than the upper limit of the preset range), the rotation center will be far away from the fixed polar plate, which is not beneficial to the posture adjustment of the fixed polar plate, although the first connecting unit has better mechanical strength. Thus, the ratio of the first thickness to the third thickness is limited within the preset range, and the position of the rotation center and the mechanical strength of the first connecting unit can be simultaneously considered.
According to the present disclosure, a micro displacement sensor that can easily adjust the posture of a fixed plate relative to a movable plate during an assembly process can be provided.
Drawings
Hereinafter, the present disclosure will be described by way of example with reference to the accompanying drawings.
Fig. 1A is an overall schematic diagram illustrating a micro-displacement sensor according to an example of the present disclosure.
Fig. 1B is a schematic diagram illustrating another view direction of a micro-displacement sensor according to an example of the present disclosure.
Fig. 1C is a schematic diagram illustrating a flexible hinge to which examples of the present disclosure relate.
Fig. 2A is a schematic diagram illustrating alignment of stationary and movable plates in accordance with examples of the present disclosure.
Fig. 2B is a schematic diagram illustrating misalignment of stationary and movable plates in accordance with examples of the present disclosure.
Fig. 3 is a perspective view illustrating a support portion according to an example of the present disclosure.
Fig. 4 is a perspective view showing embodiment 1 of the connector according to the example of the present disclosure.
Fig. 5 is a schematic diagram illustrating a first thickness, a second thickness, and a third thickness according to an example of the present disclosure.
Fig. 6 is a schematic diagram illustrating an adjusted attitude of a stationary plate according to an example of the present disclosure.
Fig. 7A is a perspective view showing embodiment 2 of the connector according to the example of the present disclosure.
Fig. 7B is a schematic diagram showing another view of embodiment 2 of the connector according to the example of the present disclosure.
Fig. 7C is a schematic diagram illustrating the posture adjustment of the stationary plate illustrated in fig. 7A according to an example of the present disclosure.
Fig. 8 is a perspective view showing embodiment 3 of the connector according to the example of the present disclosure.
Fig. 9 is a schematic diagram showing a second adjusting portion according to an example of the present disclosure.
Fig. 10A is a flowchart illustrating an assembly method of a micro displacement sensor according to an example of the present disclosure.
Fig. 10B is a schematic diagram illustrating an adjustment movable plate according to an example of the present disclosure.
Fig. 10C is a schematic diagram showing that the first condition related to the example of the present disclosure is not satisfied.
Fig. 10D is a schematic diagram showing embodiment 1 in which the first condition is satisfied according to the example of the present disclosure.
Fig. 10E is a schematic diagram showing embodiment 2 in which the first condition is satisfied according to the example of the present disclosure.
Fig. 10F is a schematic diagram showing a first pitch of a second condition related to an example of the present disclosure.
Fig. 10G is a schematic diagram showing a second pitch of a second condition related to an example of the present disclosure.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
It should be noted that the terms "first," "second," "third," and "fourth," etc. in the description and claims of the present disclosure and in the above figures are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus. In the following description, the same members are denoted by the same reference numerals, and overlapping description thereof is omitted. In addition, the drawings are schematic, and the ratio of the sizes of the components to each other, the shapes of the components, and the like may be different from actual ones.
In the present disclosure, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, e.g., the term "connected" may be a fixed connection, a removable connection, or an integral body; can be directly connected or indirectly connected through an intermediate medium.
The present disclosure relates to a micro-displacement sensor that may be used for nanoscale displacement measurement. In some examples, the micro-displacement sensor of the present disclosure may be applied to a step gauge. The step instrument is an ultra-precise contact microscopic profile measuring instrument and can be used for measuring microscopic morphological parameters such as step height, film thickness, surface roughness and the like. In some examples, the micro-displacement sensor may be a capacitive sensor. In some examples, the micro-displacement sensor may be a differential capacitive sensor.
Hereinafter, a micro displacement sensor according to the present disclosure will be described in detail with reference to the accompanying drawings.
Fig. 1A is an overall schematic diagram illustrating a micro displacement sensor 10 according to an example of the present disclosure. Fig. 1B is a schematic diagram showing another view direction of the micro displacement sensor 10 according to the example of the present disclosure. Fig. 1C is a schematic diagram illustrating a flexible hinge 181 according to an example of the present disclosure. Fig. 1B is a schematic view of the view direction a shown in fig. 1A.
In some examples, referring to fig. 1A, the micro-displacement sensor 10 may include a stationary plate 11. In some examples, stationary plate 11 may remain stationary during operation of micro-displacement sensor 10.
In some examples, referring to fig. 1A, the micro-displacement sensor 10 may also include a movable plate 12. In some examples, the movable plate 12 may be parallel to the stationary plate 11 when the micro-displacement sensor 10 is not in operation.
In some examples, the movable plate 12 may oscillate relative to the stationary plate 11, and the micro-displacement sensor 10 may be a sensor that measures displacement by oscillation of the movable plate 12. In this case, taking a capacitance sensor as an example, the swing of the movable electrode plate 12 can change the capacitance value of the capacitance sensor formed between the movable electrode plate 12 and the fixed electrode plate 11, so that the displacement of the swing of the movable electrode plate 12 can be measured by measuring the change of the capacitance value, and thus the micro-displacement sensor 10 can measure the displacement by the swing of the movable electrode plate 12.
In the present disclosure, the swinging of the movable plate 12 may include any manner of movement of the movable plate 12 toward or away from the stationary plate 11. For example, the movable plate 12 may be moved closer to or farther from the stationary plate 11 by translation; the movable plate 12 can also be rotated with a pivot shaft 18 (described later) as a rotation axis to be close to or away from the stationary plate 11. The present disclosure does not limit the manner of movement of the movable plate 12 toward or away from the fixed plate 11 and the method of implementation.
In some examples, referring to fig. 1A, stationary plate 11 may include a first plate 111. In this case, the first plate 111 can form a capacitive sensor with the movable plate 12.
In some examples, referring to fig. 1A, the stationary plate 11 may further include a second plate 112. In some examples, the second plate 112 may be disposed opposite the first plate 111. In some examples, the second plate 112 may be parallel to the first plate 111. In this case, the movable electrode plate 12, the first electrode plate 111, and the second electrode plate 112 can constitute a differential capacitive sensor, and thus the sensitivity and measurement accuracy of the micro displacement sensor 10 can be improved.
In some examples, the first plate 111 and the second plate 112 may be disposed in a fixed relative arrangement. That is, the distance between the first plate 111 and the second plate 112 may remain constant.
In some examples, the movable plate 12 may be disposed between the first plate 111 and the second plate 112. In this case, the movable plate 12 can form a first capacitance sensor with the first plate 111, and the movable plate 12 can form a second capacitance sensor with the second plate 112.
In the present disclosure, for convenience of description, the "swing of the movable plate 12 toward the direction approaching the first plate 111" will be briefly described as: "moving plate 12 swings upward"; the "swing of the movable electrode plate 12 toward the second electrode plate 112" will be briefly described as: the movable electrode plate 12 swings downward.
In some examples, movable plate 12 may be disposed intermediate first plate 111 and second plate 112 when micro-displacement sensor 10 is not in operation (alternatively referred to as when micro-displacement sensor 10 is in a zero state). In other words, when the micro displacement sensor 10 is not in operation, the distance between the movable electrode plate 12 and the first electrode plate 111 is equal to the distance between the movable electrode plate 12 and the second electrode plate 112. In this case, the displacement obtained by the upward swing of the movable electrode plate 12 is consistent with the displacement obtained by the downward swing of the movable electrode plate 12, that is, when the movable electrode plate 12 swings upward and the movable electrode plate 12 swings downward by the same distance, the magnitude of the displacement obtained by the micro-displacement sensor 10 is the same or within the allowable error range, so that the micro-displacement sensor 10 can have better consistency, and thus, the design of the micro-displacement sensor 10 can be simplified.
In some examples, the displacement may be obtained based on the oscillation of the movable plate 12 relative to the fixed plate 11. Specifically, the movable electrode plate 12 may swing in response to an external force, so as to change the distance between the movable electrode plate 12 and the first electrode plate 111, and change the distance between the movable electrode plate 12 and the second electrode plate 112, so as to change the capacitance value of the first capacitive sensor and the capacitance value of the second capacitive sensor. In this case, by measuring the difference between the capacitance value of the first capacitance sensor and the capacitance value of the second capacitance sensor, the amount of change in the distance between the movable electrode plate 12 and the first electrode plate 111 can be obtained, or the amount of change in the distance between the movable electrode plate 12 and the second electrode plate 112 can be obtained, so that the micro displacement sensor 10 can be used to measure displacement.
Fig. 2A is a schematic diagram illustrating alignment of stationary plate 11 and movable plate 12 in accordance with examples of the present disclosure. Fig. 2B is a schematic diagram illustrating misalignment of stationary plate 11 and movable plate 12 in accordance with examples of the present disclosure.
In some examples, alignment may refer to the movable plate 12 coinciding with the stationary plate 11, as viewed from a particular direction (e.g., a direction orthogonal to the stationary plate 11). In some examples, referring to fig. 2A, the movable plate 12 may be aligned with the stationary plate 11. In this case, the accuracy, precision, and sensitivity of the micro displacement sensor 10 can be advantageously improved. If the movable plate 12 is not aligned with the fixed plate 11 (see fig. 2B), the distribution of the electric field is affected, thereby reducing the accuracy and sensitivity of the micro-displacement sensor 10.
In some examples, the movable plate 12 may be parallel to the stationary plate 11. In some examples, the movable plate 12 may be parallel to the first plate 111 and the second plate 112. In this case, on the one hand, a better consistency of the micro-displacement sensor 10 is enabled. On the other hand, the micro-displacement sensor 10 can be provided with a good linearity, that is, even if the difference between the capacitance values of the first and second capacitance sensors has a good linear relationship with the swing displacement of the movable electrode plate 12, the measurement error of the micro-displacement sensor 10 can be reduced, and the measurement accuracy can be improved.
In some examples, the attitude of stationary plate 11 relative to movable plate 12 shown in fig. 2A may be deemed to meet preset requirements after micro-displacement sensor 10 is assembled. I.e. the movable plate 12 is parallel and aligned with the fixed plate 11 and the movable plate 12 is located in an intermediate position between the first plate 111 and the second plate 112. In some examples, the movable plate 12 being located midway between the first plate 111 and the second plate 112 may refer to the movable plate 12 being geometrically centered from the first plate 111 the same distance from the geometric center of the movable plate 12 to the second plate 112. In some examples, the movable plate 12 being located midway between the first plate 111 and the second plate 112 may refer to the movable plate 12 being the same distance from the first plate 111 as the movable plate 12 to the second plate 112 when the movable plate 12 is parallel to the stationary plate 11.
In some examples, when the fixed plate 11 is aligned with and parallel to the movable plate 12, and the movable plate 12 is located between the first plate 111 and the second plate 112, the posture of the fixed plate 11 relative to the movable plate 12 may also be considered to meet the preset requirements. I.e., movable plate 12 need not be positioned intermediate first plate 111 and second plate 112.
In the following, the micro-displacement sensor 10 according to the present disclosure will be described in detail by taking a preset requirement as an example that the movable electrode plate 12 is parallel and aligned with the fixed electrode plate 11, and the movable electrode plate 12 is located at a middle position between the first electrode plate 111 and the second electrode plate 112.
Fig. 3 is a perspective view showing the support portion 13 according to the example of the present disclosure. Fig. 3 also shows, among other things, stationary plate 11 and movable plate 12 in accordance with the present disclosure.
In some examples, referring to fig. 1A, the micro-displacement sensor 10 may include a support 13. The support portion 13 may be used to support the stationary plate 11.
In some examples, referring to fig. 1A or 3, the support 13 may include a first support 131. In some examples, the first support 131 may be connected with the stationary plate 11. In this case, the posture of the stationary plate 11 can be adjusted by adjusting the posture of the first support 131.
In some examples, the first support 131 may be detachably connected with the stationary plate 11. For example, the first support 131 may be detachably connected to the stationary plate 11 by a screw structure or a snap structure, etc.
In some examples, the first support 131 may be fixedly connected with the stationary plate 11. For example, the first support 131 may be fixedly coupled to the stationary plate 11 by welding or an adhesive substance.
In some examples, the first support 131 may be integrally formed with the stationary plate 11.
In some examples, referring to fig. 1A or 3, the support 13 may include a second support 132. The second support 132 may be disposed opposite to the first support 131. In this case, the second support 132 can support other components, and flexibility in the structural design of the micro displacement sensor 10 can be increased.
In some examples, the first support 131 may be parallel to the second support 132. This makes it possible to make the micro displacement sensor 10 compact and to increase mechanical strength.
In some examples, the first support 131 may also be disposed at a predetermined angle with respect to the second support 132. For example, the preset included angle may be not more than 30 degrees and not less than 5 degrees. I.e. the first support 131 may not be parallel to the second support 132. This can increase the structural diversity of the micro-displacement sensor 10, thereby increasing the diversity of the application scenarios of the micro-displacement sensor 10.
In some examples, referring to fig. 1A or 3, the support 13 may include a connector 133. The connection member 133 may be used to connect the first support member 131 and the second support member 132. This enables the support portion 13 to form a stable support structure.
In some examples, referring to fig. 3, the connection 133 may include a first connection unit 1331. The first connection unit 1331 may be connected with the first support 131. In some examples, the first connection unit 1331 may be connected with an end of the first support 131. In some examples, referring to fig. 3, the first end surface G1 of the first connection unit 1331 may be connected with the first side surface E1 of the first support 131.
In some examples, referring to fig. 3, the connector 133 may further include a second connection unit 1332. The second connection unit 1332 may be connected with the second support 132. In some examples, the second connection unit 1332 may be connected with an end of the second support 132.
In some examples, referring to fig. 3, the first connection unit 1331 may extend in a direction parallel to the stationary plate 11 and be connected with the first support 131. In some examples, the second connection unit 1332 may extend in a direction orthogonal to the stationary plate 11 and be connected with the second support 132.
In some examples, the first connection unit 1331 may form a right angle structure with the second connection unit 1332. This can improve the mechanical strength of the support portion 13.
In some examples, the first support 131, the second support 132, and the connector 133 may be integrally formed.
Referring back to fig. 1A, in some examples, the micro-displacement sensor 10 may include a stylus 17, where the stylus 17 may be coupled to the movable plate 12 and configured to drive a stylus 171 to scan the object 20 under test. In this case, when the stylus 171 is kept in contact with the surface of the object 20, the stylus 17 moves in a predetermined direction relative to the object 20, and the stylus 17 swings up and down due to the surface topography of the object 20, and further drives the movable plate 12 to swing relative to the fixed plate 11, so that the micro-displacement sensor 10 can measure the parameters of the surface topography of the object 20.
In some examples, referring to fig. 1A, a stylus 171 may be provided at the end of the stylus 17. The stylus 171 may be used to contact the surface of the test object 20. In this case, the stylus 171 is generally a relatively small member, and can enable the micro-displacement sensor 10 to measure a relatively fine surface topography parameter, and can enable the micro-displacement sensor 10 to be used in the precision measurement field.
In some examples, the stylus 17 may be connected to the movable plate 12. In some examples, the stylus 17 may be fixedly connected or removably connected to the movable plate 12.
In some examples, referring to fig. 1A, the micro-displacement sensor 10 may include a pivot shaft 18, and the stylus 17 may be pivotably disposed at the pivot shaft 18. In this case, when the micro displacement sensor 10 is operated, the spindle 17 can be pivoted or rotated about the pivot shaft 18 to oscillate reciprocally, so that the micro displacement sensor 10 can be used in the oscillation region for measuring a parameter of the surface topography of the object 20 to be measured. In some examples, the pivot shaft 18 may be connected with the support 13.
In some examples, referring to fig. 1A, the pivot shaft 18 may be connected with the second support 132. In this case, the oscillation of the spindle 17 and the movable plate 12 can be prevented from affecting the fixed plate 11.
In some examples, referring to fig. 1A, a bearing 182 may be provided on the second support 132, and the pivot shaft 18 may be connected to the second support 132 through the bearing 182.
In some examples, referring to fig. 1A, micro-displacement sensor 10 may include a flexible hinge 181 (also referred to as a flexible pivot). The flexible hinge 181 may be provided on the pivot shaft 18.
In some examples, referring to fig. 1C, the flexible hinge 181 may include a fixed end 1811 and a pivoting end 1812, the pivoting end 1812 being rotatable relative to the fixed end 1811. For example, the pivot end 1812 may rotate relative to the fixed end 1811 in either direction D1 or direction D2.
With continued reference to fig. 1C, in some examples, a fixed end 1811 of the flexible hinge 181 may be connected to the pivot shaft 18 and a pivoting end 1812 of the flexible hinge 181 may be connected to the stylus 17. In this case, on the one hand, due to the elastic property of the flexible hinge 181, the influence of vibration on the micro displacement sensor 10 can be reduced; in addition, the angle of rotation of the flexible hinge 181 has a linear relationship with the generated force, so that it is possible to facilitate control of the force with which the measuring bar 17 contacts the object 20 to be measured, and further, it is possible to facilitate maintaining the force with which the measuring bar 17 contacts the object 20 to be measured within a prescribed range, whereby it is possible to facilitate the measuring bar 17 to remain in contact with the object 20 all the time during measurement without damaging the surface of the object 20 to be measured.
In some examples, the axis of flexible hinge 181 may be parallel or coincident with the axis of pivot shaft 18. In this case, the structural design of the micro displacement sensor 10 can be simplified, and it is also advantageous to adjust the posture of the spindle 17 and the movable plate 12 by adjusting the fixed end 1811 of the flexible hinge 181 (for details, reference will be made to the following description about the second adjusting portion 19).
With continued reference to fig. 1A, the micro-displacement sensor 10 may include a first adjustment portion 15. During assembly, the first adjustment portion 15 may be configured to adjust the attitude of the stationary plate 11 relative to the movable plate 12. In this case, the first adjusting portion 15 adjusts the posture of the fixed polar plate 11 relative to the movable polar plate 12, so that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement, and the measurement accuracy and precision of the micro-displacement sensor 10 can meet the design requirement.
In some examples, the first adjustment portion 15 may be a non-magnetic material. Thus, the disturbance to the micro displacement sensor 10 can be reduced.
In the present disclosure, the manner of adjusting the posture of the fixed polar plate 11 relative to the movable polar plate 12 by the first adjusting portion 15 may be to adjust the posture of the first supporting member 131 by the first adjusting portion 15, so as to drive the posture of the fixed polar plate 11 to change. In the process of adjusting the posture of the stationary plate 11 with respect to the movable plate 12 by the first adjusting portion 15, the stationary plate 11 may be changed in posture centering on a region located on the connecting member 133, which is defined as a rotation center O (see fig. 3) for convenience of description.
The rotation center O located on the link 133 is not limited to a specific point. In some examples, the center of rotation O may be an area located on the connector 133. In the present disclosure, dots are indicated on the drawings for convenience of description and illustration.
In the present disclosure, referring to fig. 3, a three-dimensional coordinate system may be constructed with a rotation center O as an origin, an X-axis may be parallel to the first side E1 of the first support 131, a Y-axis may be parallel to the second side E2 of the first support 131, and a plane X-Y plane formed by the X-axis and the Y-axis may be parallel to the stationary plate 11; the plane Y-Z formed by the Y-axis and the Z-axis may be orthogonal to the stationary plate 11.
In some examples, adjusting the attitude of the stationary plate 11 relative to the movable plate 12 by the first adjustment portion 15 may include adjusting the attitude of the stationary plate 11 to rotate about the Y-axis. In some examples, adjusting the attitude of the stationary plate 11 relative to the movable plate 12 by the first adjustment portion 15 may include adjusting the attitude of the stationary plate 11 to rotate about the X-axis. For a method for adjusting the posture of the fixed polar plate 11 relative to the movable polar plate 12, please refer to the assembling method of the micro-displacement sensor 10 provided in the present disclosure.
In some examples, referring to fig. 1A, the first adjusting portion 15 may be provided to the supporting portion 13. Thereby, the first adjusting portion 15 can facilitate the adjustment of the posture of the supporting portion 13, and the posture of the stationary plate 11 with respect to the movable plate 12 can be adjusted.
In some examples, referring to fig. 1A and 3 in combination, the first adjustment part 15 may include a first through hole 151, a first screw hole 152, and a first screw 153. In some examples, the first screw 153 may pass through the first through hole 151 and be screwed with the first screw hole 152 to form a first screw structure. In other words, the first adjustment portion 15 may include a first screw structure.
In some examples, first screw 153 may pass through first throughbore 151 without forming a threaded connection with first throughbore 151. In some examples, the first through hole 151 may be a hole with a smooth inner wall.
In some examples, referring to fig. 3, a first through hole 151 may be provided to the second support 132, and a first screw hole 152 may be provided to the first support 131 and disposed opposite to the first through hole 151. In this case, the first screw 153 may pass through the first through hole 151 to form a screw structure with the first screw hole 152, and by rotating the first screw 153, the depth of the first screw 153 screwed into the first screw hole 152 is changed, so that the posture of the first support 131 may be changed, and the posture of the first support 131 may be adjusted, so that the posture of the stationary plate 11 may be driven to be changed.
In some examples, the first through hole 151 may be disposed at the first support 131, and the first screw hole 152 may be disposed at the second support 132 opposite to the first through hole 151.
In some examples, the first adjustment portion 15 may include a plurality of first screw structures. For example, the number of first screw structures may be 2,3, or 4. In other words, the number of the first through holes 151 may be plural, and the number and positions of the first screw holes 152 may be matched with those of the first through holes 151.
In some examples, referring to fig. 3, the number of the first through holes 151 provided on the second support 132 may be two (e.g., the first through holes 151a and the first through holes 151b in fig. 3), the number of the first screw holes 152 provided on the first support 131 may be two (e.g., the first screw holes 152a and the first screw holes 152b in fig. 3), and the two first screw holes 152 and the two first through holes 151 may be arranged opposite to each other. In some examples, the number of first screws 153 may be the same as the number of first through holes 151 or the number of first screw holes 152. For example, two first screw structures may be formed by providing two first screws 153 to cooperate with two first screw holes 152 and two first through holes 151. In this case, compared with the case where only one first screw structure is provided, the plurality of first screw structures can variously adjust the posture of the fixed polar plate 11, for example, the fixed polar plate 11 can be rotated around the Y axis, and the fixed polar plate 11 can also be rotated around the X axis, so that fine adjustment of the posture of the fixed polar plate 11 can be more facilitated, and the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement.
In some examples, the first screw structure may be disposed at a side of the support portion 13 away from the connection member 133 (i.e., a side near the third side E3 of the first support member 131 shown in fig. 3). In this case, since the first screw structure is far from the connection member 133 during adjustment of the first screw 153, the first screw structure can obtain a long moment arm with respect to the rotation center O of the connection member 133, and thus can provide a sufficient moment or can drive the first screw 153 with a small driving force to drive the first support 131 to rotate with respect to the rotation center O.
In some examples, the plurality of first screw structures may be disposed at a side of the support portion 13 remote from the connection member 133. In some examples, the plurality of first through holes 151 and the plurality of first screw holes 152 may be provided at a side of the support 13 remote from the connection member 133.
In some examples, the plurality of first screw structures may be spaced apart along the preset direction. In this case, the plurality of first screw structures are spaced apart in the preset direction, and by adjusting the plurality of first screw structures, it is possible to facilitate adjustment of the posture of the stationary plate 11 rotating around the Y axis and the posture of the stationary plate 11 rotating around the X axis. That is, the plurality of postures of the fixed plate 11 can be adjusted, so that the posture of the fixed plate 11 relative to the movable plate 12 can be favorably finely adjusted.
In some examples, the preset direction may be orthogonal to the extension direction of the spindle 17. In some examples, the preset direction may be parallel to the direction in which the X-axis is located. For example, referring to fig. 3, the preset direction may be a direction F1 or a direction F2.
Fig. 4 is a perspective view showing embodiment 1 of the connector 133 according to the example of the present disclosure. Fig. 4 also shows a schematic view of projections of the plurality of first screw structures according to the examples of the present disclosure in the direction of the Z axis on the same side of the rotation center O.
In some examples, projections of at least two of the plurality of first screw structures in a direction along the Z-axis may be distributed on both sides of the rotational center O (i.e., on different sides of the rotational center O). In this case, it can be further facilitated to adjust the posture of the stationary plate 11 rotating around the Y axis and the posture of the stationary plate 11 rotating around the X axis.
In some examples, the projections of the plurality of first screw structures along the direction in which the Z-axis is located may be located on the same side of the rotation center O (see fig. 4). In this case, the range of the posture of the plurality of first screw structure adjustment setting plate 11 rotating around the Y axis is small, and the present invention is applicable to the case where the setting plate 11 needs to rotate around the X axis for posture adjustment.
In some examples, a maximum value of a distance between points of projection of any two of the plurality of first screw structures along a direction in which the Z-axis is located is not less than a first preset value. In other words, the maximum value of the pitches of the plurality of first screw structures in the preset direction is not smaller than the first preset value. If the maximum value of the distances between the projected points of any two of the first screw structures along the direction of the Z axis is smaller than the first preset value, the first screw structures are considered to be too close to be beneficial to adjusting the rotation posture of the polar plate 11 around the Y axis.
In some examples, referring back to fig. 1A, the micro-displacement sensor 10 may include a locking structure 16, and the locking structure 16 may be configured to limit the relative movement between the first support 131 and the second support 132. In this case, after the first adjusting portion 15 completes the adjustment of the posture of the fixed electrode plate 11 with respect to the movable electrode plate 12, the first support 131 can be restricted from approaching the second support 132 by providing the locking structure 16, and the posture of the fixed electrode plate 11 with respect to the movable electrode plate 12 can be fixed more stably.
In some examples, the locking structure 16 may be a non-magnetic material. Thus, the disturbance to the micro displacement sensor 10 can be reduced.
In the present disclosure, the opposite movement between the first support 131 and the second support 132 may refer to a movement in which a distance between the first support 131 and the second support 132 is reduced.
In some examples, the locking structure 16 may include a locking screw hole 161 (see fig. 1B), and a locking screw 162 (see fig. 1A).
In some examples, the locking screw hole 161 may be provided to the second support 132. In this case, the locking screw 162 can be engaged with the locking screw hole 161, and the locking screw 162 can be abutted against the first support member 131 after being screwed into the locking screw hole 161, whereby the first support member 131 and the second support member 132 can be restrained from moving in opposite directions by the screw connection formed by the locking screw 162 and the locking screw 161, in combination with the locking screw 162 being abutted against the first support member 131.
In some examples, the locking structure 16 may also be a snap-fit structure. For example, a locking groove may be provided in the first support 131, and a buckle may be provided in the second support 132, and the buckle may be locked by the locking groove.
In some examples, the plurality of first threaded structures may be evenly disposed on both sides of the locking structure 16. For example, when there are two first screw structures, the two first screw structures may be uniformly arranged on both sides of the locking structure 16. In this case, the forces of the plurality of first screw structures and the locking structure 16 on the supporting portion 13 can be balanced, which is advantageous for improving the mechanical stability of the micro displacement sensor 10.
Fig. 5 is a schematic diagram showing a first thickness H1, a second thickness H2, and a third thickness H3 according to an example of the present disclosure. Fig. 6 is a schematic diagram showing an adjusted posture of the stationary plate 11 according to the example of the present disclosure. Fig. 7A is a perspective view showing embodiment 2 of the connector 133 according to the example of the present disclosure. Also shown in fig. 7A are a first support 131, a second support 132, which are connected to the connector 133, and a stationary plate 11, which is connected to the first support 13. Fig. 7B is a schematic diagram showing another view of embodiment 2 of the connector 133 according to the example of the present disclosure. Fig. 7C is a schematic diagram showing an adjusted posture of the stationary plate 11 shown in fig. 7A according to an example of the present disclosure.
Wherein fig. 5 and 6 are schematic views of the view direction C shown in fig. 3. Fig. 7B is a schematic view of the view direction M shown in fig. 7A. Wherein the second support 132 and the connector 133 of the structure shown in fig. 7B are not shown in fig. 7C.
In the present disclosure, the view direction B shown in fig. 1A, the view direction C shown in fig. 3, and the view direction M shown in fig. 7A may be the same direction.
In fig. 7A and 7B, the posture of the stationary plate 11 with respect to the movable plate 12 is merely an illustration, and the posture of the stationary plate 11 with respect to the movable plate 12 is not limited to the actual one.
Referring to fig. 5, in the present disclosure, in a direction orthogonal to the stationary plate 11 (i.e., in the Z-axis direction), the first connection unit 1331 may have a first thickness H1 and the first support 131 may have a second thickness H2. In the present disclosure, the thickness of the second connection unit 1332 may be made to be the third thickness H3 in a direction parallel to the fixed plate 11 (i.e., in the Y-axis direction).
As described above, in some examples, referring to fig. 3, the first end face G1 of the first connection unit 1331 may be connected with the first side face E1 of the first support 131. In some examples, the area of the first end surface G1 in contact with the first side surface E1 may be the same as the area of the first side surface E1. In this case, the connection stability between the first connection unit 1331 and the first support 131 can be improved, and the connection stability between the connection unit 133 and the support 13 can be improved.
In some examples, the area of the first end surface G1 in contact with the first side surface E1 may be smaller than the area of the first side surface E1. In this case, in the process of adjusting the posture of the fixed polar plate 11, the stress concentration area of the connecting piece 133 is closer to the fixed polar plate 11, that is, the rotation center O is closer to the fixed polar plate 11 (see fig. 6), so that the fineness of adjusting the posture of the fixed polar plate 11 can be improved, and the speed of adjusting the posture of the fixed polar plate 11 relative to the movable polar plate 12 according to the preset requirement can be improved. In some examples, the region of stress concentration of the connector 133 may be calculated. For example, the region of stress concentration of the connector 133 may be calculated by software simulation.
If the area of the first end surface G1 contacting the first side surface E1 is not smaller than the area of the first side surface E1, it is found by software simulation that the rotation center O is located farther from the stationary plate 11, located in the second connection unit 1332 and close to the second support 132 (see fig. 7A and 7B), the posture adjustment of the stationary plate 11 becomes difficult, and particularly, it is difficult to finely adjust the posture of the stationary plate 11. Therefore, the contact area between the first end surface G1 and the first side surface E1 is smaller than the contact area between the first side surface E1 and the first side surface E1, so that the rotation center O is closer to the fixed polar plate 11, the convenience of adjusting the posture of the fixed polar plate 11 can be increased, and the posture of the fixed polar plate 11 relative to the movable polar plate 12 can be facilitated to meet the preset requirement, so that the measurement accuracy and precision of the micro-displacement sensor 10 can be improved.
Taking fig. 7A as an example, the area of the first end surface G1 in contact with the first side surface E1 shown in fig. 7A is not smaller than the area of the first side surface E1, and the rotation center O is farther from the stationary plate 11 than in fig. 6 by software simulation calculation (see fig. 7A and 7B). In this case, when the posture of the fixed plate 11 needs to be finely adjusted, since the rotation center O is far, the rotation radius is large, and the movable plate 12 and the fixed plate 11 may not be aligned after rotation, that is, the movable plate 12 may deviate from the area between the fixed plates 11, so it is relatively difficult to control the adjustment range of the posture of the fixed plate 11, and there is a possibility that the posture of the fixed plate 11 may be adjusted only to the state shown in fig. 7C, and the preset requirement may not be satisfied.
In some examples, the first thickness H1 may be less than the second thickness H2. In this case, it can be convenient to make the area of the first end face G1 in contact with the first side face E1 smaller than the area of the first side face E1.
In some examples, the ratio of the first thickness H1 to the third thickness H3 may be within a preset range. In this case, the ratio of the first thickness H1 to the third thickness H3 is defined within a preset range, and the position of the rotation center O and the mechanical strength of the first connection unit 1331 can be simultaneously made to meet preset requirements.
As calculated by software simulation, if the first thickness H1 is too thin relative to the third thickness H3 (i.e., the ratio of the first thickness H1 to the third thickness H3 is lower than the lower limit of the preset range), the rotation center O is closer to the fixed plate 11, but the mechanical strength of the first connection unit 1331 is insufficient due to the smaller first thickness H1, and stress fatigue is likely to occur. If the first thickness H1 is too thick relative to the third thickness H3 (i.e., the ratio of the first thickness H1 to the third thickness H3 is higher than the upper limit of the preset range), the rotation center O is far away from the fixed plate 11, which is unfavorable for the posture adjustment of the fixed plate 11, although the first connecting unit 1331 has better mechanical strength.
In some examples, the preset range may be 0.8 to 1.2, i.e., the ratio of the first thickness H1 to the third thickness H3 may be not less than 0.8 and not more than 1.2.
In some examples, the ratio of the first thickness H1 to the third thickness H3 may be equal to 1. In this case, the stress distribution of the first connection unit 1331 can be equalized and the rotation center O is located closer to the stationary plate 11, whereby the mechanical strength of the first connection unit 1331 can be improved and the posture of the stationary plate 11 can be easily adjusted. In some examples, the conclusion may be confirmed by software simulation calculations.
Fig. 8 is a perspective view showing embodiment 3 of the connector 133 according to the example of the present disclosure. Fig. 8 may be a perspective view of the view direction C shown in fig. 3.
In some examples, referring to fig. 8, the first connection unit 1331 and the first support 131 may be connected in a rounded manner. In this case, the rounded design helps to reduce stress concentrations, thereby improving the overall strength of the connector 133. Through software simulation calculation, the chamfer design can also make rotation center O keep away from first adjustment portion 15 more in the Y-axis direction to can increase the arm of force of adjusting the gesture of deciding polar plate 11, and then can reduce the driving force to first adjustment portion 15, increase the convenience of operating first adjustment portion 15, be convenient for accomplish the gesture adjustment of deciding polar plate 11.
Fig. 9 is a schematic diagram showing the second regulating portion 19 according to the example of the present disclosure.
In some examples, referring to fig. 1B, the micro-displacement sensor 10 may include a second adjustment portion 19. The second adjusting portion 19 may be configured to adjust the posture of the spindle 17 and the movable plate 12. In this case, when the micro displacement sensor 10 is assembled, the posture of the movable plate 12 with respect to the fixed plate 11 can be adjusted by the second adjusting portion 19. Specifically, during the assembly process, the position of the movable plate 12 relative to the fixed plate 11 can be initially adjusted by the second adjusting portion 19. For example, the movable plate 12 is initially adjusted to the middle position of the first plate 111 and the second plate 112.
In some examples, the second adjustment portion 19 may be a non-magnetic material. Thus, the disturbance to the micro displacement sensor 10 can be reduced.
In some examples, the second adjustment portion 19 may include an adjustment arm 191, and the adjustment arm 191 may be connected with the pivot shaft 18 (see fig. 1A and 1B). In this case, the rotation of the adjustment arm 191 can drive the pivot shaft 18 to rotate, and thus the pivot shaft 18 can drive the fixed end 1811 of the flexible hinge 181 to rotate, and further, the whole flexible hinge 181 can rotate, so that the posture of the movable pole plate 12 relative to the fixed pole plate 11 can be primarily adjusted through the measuring bar 17.
In some examples, referring to fig. 1A, a first resilient member 183 may be disposed between the adjustment arm 191 and the bearing 182. In this case, the direct contact between the adjustment arm 191 and the bearing 182 can be avoided, and the direct friction between the adjustment arm 191 and the bearing 182 can be reduced, thereby reducing the seizing of the adjustment arm 191.
In some examples, the first resilient member 183 may be a spring. For example, the first elastic member 183 may be a wave spring. In some examples, the first elastic component 183 may also be other specifically elastic components.
In some examples, referring to fig. 9, the second adjustment portion 19 may include a second screw hole 192, a second through hole 193, and a second screw 194. Wherein, the second screw hole 192 may be provided on the adjustment arm 191, and the second through hole 193 may be provided on the second support 132. In some examples, the second screw 194 may form a second threaded structure with the second screw hole 192 through the second through hole 193. In this case, by adjusting the depth of the screw connection between the second screw 194 and the second screw hole 192, the posture of the adjustment arm 191, and thus the posture of the movable plate 12, can be adjusted.
In some examples, referring to fig. 9, the second adjusting part 19 may include a second elastic part 195, the second elastic part 195 may be disposed at the second screw 194, and the second elastic part 195 may abut against a head end of the second screw 194 and simultaneously may abut against the second support 132. In this case, the second elastic member 195 having an elastic function is provided between the second screw 194 and the second support 132, and thus can play a role of shock absorption and buffering. And can provide certain fastening force, can reduce the condition that second spiro union structure becomes flexible. At the same time, the tightening force also balances the force on the adjustment arm 191 and stabilizes the adjustment arm 191. In other words, if the second elastic member 195 is not provided, the adjustment arm 191 may be loosened or moved by the external force, thereby affecting the posture of the movable plate 12.
Fig. 10A is a flowchart showing an assembling method of the micro displacement sensor 10 according to the example of the present disclosure. Fig. 10B is a schematic diagram showing the adjustment movable plate 12 according to the example of the present disclosure. Fig. 10B is a schematic view of the view direction B shown in fig. 1A.
The present disclosure also provides an assembly method (hereinafter referred to as an assembly method) of the micro displacement sensor 10. In some examples, referring to fig. 10A, the assembly method may include assembling the respective components of the micro-displacement sensor 10 (step S100), adjusting the second adjustment part 19 (step S200), and adjusting the first adjustment part 15, and locking the locking structure 16 (step S300).
In some examples, in step S100, the various components of the micro displacement sensor 10 may be assembled. That is, the individual components of the micro displacement sensor 10 are first assembled into one body.
In some examples, in step S200, the second adjustment portion 19 may be adjusted. Thereby, the preliminary position of the movable electrode plate 12 can be adjusted. Generally, after step S100 is completed, the distance between the movable electrode plate 12 and the fixed electrode plate 11 does not meet the preset requirement, and it is possible that the distance between the movable electrode plate 12 and the fixed electrode plate 11 is far or near; for the stationary plate 11 having the first plate 111 and the second plate 112, after step S100 is completed, the movable plate 12 may be closer to the first plate 111 (see fig. 10B) or closer to the second plate 112, and by adjusting the second adjusting portion 19, the movable plate 12 can be adjusted to a suitable position so that the distance between the movable plate 12 and the stationary plate 11 is approximately in a reasonable range. For example, by adjusting the second adjusting portion 19, the movable electrode plate 12 can be positioned substantially at the intermediate position between the first electrode plate 111 and the second electrode plate 112, so that the posture of the fixed electrode plate 11 with respect to the movable electrode plate 12 can be further adjusted later, and the assembling efficiency can be improved.
In some examples, in step S200, it may be preliminarily determined whether the movable electrode plate 12 is in a suitable position by manual observation, for example, whether the movable electrode plate 12 is in an intermediate position between the first electrode plate 111 and the second electrode plate 112.
In some examples, in step S300, the first adjustment portion 15 may be adjusted. Therefore, the posture of the fixed polar plate 11 relative to the movable polar plate 12 can be adjusted, so that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement.
In some examples, the steps S200 and S300 are repeated until the posture of the fixed plate 11 relative to the movable plate 12 meets the preset requirement.
Fig. 10C is a schematic diagram showing that the first condition related to the example of the present disclosure is not satisfied. Fig. 10D is a schematic diagram showing embodiment 1 in which the first condition is satisfied according to the example of the present disclosure. Fig. 10E is a schematic diagram showing embodiment 2 in which the first condition is satisfied according to the example of the present disclosure. Fig. 10C, 10D, and 10E are perspective views of the view direction C shown in fig. 3, and fig. 10C, 10D, and 10E show only the movable plate 12 and the fixed plate 11.
In some examples, the movable plate 12 may be swung up and down until being in contact with the fixed plate 11, and one of conditions (which may be referred to as a first condition) for determining whether the posture of the fixed plate 11 relative to the movable plate 12 meets a preset requirement may be selected by observing the contact state between the movable plate 12 and the fixed plate 11. If the contact state between the movable electrode plate 12 and the fixed electrode plate 11 is point contact (see fig. 10C), the parallelism between the movable electrode plate 12 and the fixed electrode plate 11 does not meet the preset requirement (i.e., the first condition is not met), and the first adjusting portion 15 needs to be adjusted until the contact between the movable electrode plate 12 and the fixed electrode plate 11 is line contact (see fig. 10D and 10E), at this time, the parallelism between the movable electrode plate 12 and the fixed electrode plate 11 can be considered to basically meet the preset requirement, i.e., the first condition is met.
Fig. 10F is a schematic diagram of a first pitch S1 showing a second condition related to an example of the present disclosure. Fig. 10G is a schematic diagram of a second pitch S2 showing a second condition related to an example of the present disclosure. Fig. 10F and 10G are perspective views of the view direction C shown in fig. 3, and fig. 10F and 10G show only the movable plate 12 and the fixed plate 11.
In some examples, the movable plate 12 may be swung upward until it is in contact with the first plate 111 of the stationary plate 11 (i.e., the movable plate 12 swings to an upper limit), a first spacing condition between the movable plate 12 and the first plate 111 may be observed; the movable plate 12 may be swung downward until it is in contact with the second plate 112 of the stationary plate 11 (i.e., the movable plate 12 is swung to a lower limit), and a second spacing condition between the movable plate 12 and the second plate 112 may be observed; the relationship between the first pitch state and the second pitch state may be used as one of the conditions (may be referred to as a second condition) for determining whether the posture of the stationary plate 11 relative to the movable plate 12 meets the preset requirement.
In some examples, when the first spacing state is substantially the same as the second spacing state, it may be determined that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets a preset requirement, that is, the second condition meets a requirement.
In some examples, the first spacing state may include a first spacing S1 between an end of the movable plate 12 that is not in contact with the first plate 111 and the first plate 111 (see fig. 10F). The second spacing state may include a second spacing S2 between an end of the movable plate 12 that is not in contact with the second plate 112 and the second plate 112 (see fig. 10G). Whether the posture of the polar plate 11 relative to the movable polar plate 12 meets the preset requirement can be judged by comparing the relation between the first spacing S1 and the second spacing S2; if the first space S1 is substantially the same as the second space S2, it can be determined that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement.
In some examples, the first condition and the second condition may be determined by manual observation. In some examples, the manual observation may include direct visual observation. In some examples, manual observation may also include measurement observation using a measuring instrument.
In some examples, the movable plate 12 may be left in a free state. That is, under the condition that the movable electrode plate 12 is not subject to external force, the first reading of the micro-displacement sensor 10 can be used as one of the conditions (which may be referred to as a third condition) for determining whether the posture of the fixed electrode plate 11 relative to the movable electrode plate 12 meets the preset requirement.
In some examples, when the first reading of the micro-displacement sensor 10 is not greater than the second preset value, it may be determined that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement, that is, the third condition meets the requirement.
In some examples, the second preset value may be approximately equal to 0. In this case, the movable electrode plate 12 is left in a free state, that is, the micro-displacement sensor 10 is not in an operating state (or referred to as leaving the micro-displacement sensor 10 in a zero state), and the first reading should be 0 in theory. Therefore, by comparing the relation between the first reading and the second preset value, whether the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement can be judged.
In some examples, the movable plate 12 may be swung upward until it contacts the first plate 111 of the stationary plate 11, obtaining a second reading of the micro-displacement sensor 10; the movable electrode plate 12 may be swung downward until contacting the second electrode plate 112 of the fixed electrode plate 11, so as to obtain a third reading number of the micro-displacement sensor 10, and the sum of the second reading number and the third reading number may be used as one of conditions (may be referred to as a fourth condition) for determining whether the posture of the fixed electrode plate 11 relative to the movable electrode plate 12 meets a preset requirement.
In some examples, when the sum of the second reading and the third reading is not greater than the third preset value, it may be determined that the posture of the fixed polar plate 11 relative to the movable polar plate 12 meets the preset requirement, that is, the fourth condition meets the requirement.
In some examples, the third preset value may be approximately equal to 0. In this case, the second reading and the third reading should be the same absolute value in theory, but the sign of the sign is opposite, whereby it can be determined whether the posture of the plate 11 with respect to the movable plate 12 meets the preset requirement by the relation between the sum of the second reading and the third preset value.
In some examples, the third condition and the fourth condition may be determined by obtaining readings of the micro displacement sensor 10. Thus, the posture adjustment of the fixed plate 11 with respect to the movable plate 12 can be completed more accurately based on the third condition and the fourth condition, and the accuracy and precision of the micro displacement sensor 10 can be improved.
In some examples, the determination of the third condition or the fourth condition may be made when the first condition and the second condition meet the requirements.
In some examples, the order of determination of the first condition, the second condition, the third condition, and the fourth condition may not be limited. That is, the first condition, the second condition, the third condition, and the fourth condition can be judged in any order.
In some examples, when the third condition and the fourth condition meet the requirements, the posture of the fixed plate 11 with respect to the movable plate 12 may be considered to meet the preset requirements.
In some examples, when the first condition, the second condition, the third condition, and the fourth condition all satisfy the requirements, the posture of the stationary plate 11 with respect to the movable plate 12 may be considered to satisfy the preset requirements.
In some examples, in step S300, the locking structure 16 may be locked. Specifically, the locking structure 16 may be locked after each adjustment of the first adjustment portion 15. In this case, after the adjustment of the posture of the fixed plate 11 with respect to the movable plate 12 is completed, the relative posture between the fixed plate 11 and the movable plate 12 can be kept stable by the lock structure 16. For the description of the first adjusting portion 15, the second adjusting portion 19, and the locking structure 16, reference is made to the foregoing.
According to the present disclosure, it is possible to provide a micro displacement sensor 10 in which the posture of the set plate 11 with respect to the movable plate 12 is easily adjusted during the assembly process.
While the disclosure has been described in detail in connection with the drawings and examples, it is to be understood that the foregoing description is not intended to limit the disclosure in any way. Modifications and variations of the present disclosure may be made as desired by those skilled in the art without departing from the true spirit and scope of the disclosure, and such modifications and variations fall within the scope of the disclosure.

Claims (7)

1. The micro-displacement sensor is a sensor for measuring displacement by swinging a movable polar plate and is characterized by comprising a fixed polar plate, the movable polar plate, a supporting part and a first adjusting part, wherein the fixed polar plate comprises a first polar plate and a second polar plate which is opposite to and parallel to the first polar plate, and the movable polar plate is arranged between the first polar plate and the second polar plate and can swing relative to the fixed polar plate so as to obtain the displacement; the support part comprises a first support piece connected with the fixed polar plate, a second support piece arranged opposite to the first support piece, and a connecting piece used for connecting the first support piece and the second support piece; the connecting piece comprises a first connecting unit connected with the first supporting piece and a second connecting unit connected with the second supporting piece; the first end face of the first connecting unit is connected with the first side face of the first supporting piece, and the contact area of the first end face and the first side face is smaller than the area of the first side face; in the assembly process, the first adjusting part is configured to adjust the gesture of the fixed polar plate relative to the movable polar plate, wherein the first adjusting part is arranged on the supporting part, the first adjusting part comprises a first through hole, a first screw hole and a first screw rod penetrating through the first through hole and in threaded connection with the first screw hole to form a first threaded structure, the first through hole is arranged on the first supporting piece, the first screw hole is arranged on the second supporting piece and is arranged opposite to the first through hole, or the first through hole is arranged on the second supporting piece, and the first screw hole is arranged on the first supporting piece and is arranged opposite to the first through hole; the micro-displacement sensor further comprises a measuring rod connected with the movable polar plate and used for scanning an object to be detected, a pivot shaft connected with the second supporting piece and a flexible hinge arranged on the pivot shaft, wherein the measuring rod is pivotably arranged on the pivot shaft, the fixed end of the flexible hinge is connected with the pivot shaft, the pivot end of the flexible hinge is connected with the measuring rod, and the axis of the flexible hinge is parallel to or coincides with the axis of the pivot shaft.
2. The micro-displacement sensor according to claim 1, wherein,
The first connection unit and the first support are connected in a rounded manner.
3. The micro-displacement sensor according to claim 1, wherein,
The first adjusting part comprises a plurality of first screw structures, the plurality of first screw structures are arranged on one side, far away from the connecting piece, of the supporting part, and the plurality of first screw structures are distributed at intervals along a preset direction.
4. A micro-displacement sensor according to claim 3, wherein,
A locking structure is also included and is configured to limit the relative movement between the first support and the second support.
5. The micro-displacement sensor according to claim 4, wherein,
The plurality of first screw structures are uniformly arranged on both sides of the locking structure.
6. The micro-displacement sensor according to claim 1, wherein,
In the direction orthogonal to the fixed polar plate, the thickness of the first connecting unit is made to be a first thickness, the thickness of the first supporting piece is made to be a second thickness, and the first thickness is smaller than the second thickness.
7. The micro-displacement sensor according to claim 6, wherein,
The first connecting unit extends along a direction parallel to the fixed polar plate and is connected with the first supporting piece, and the second connecting unit extends along a direction orthogonal to the fixed polar plate and is connected with the second supporting piece; in the direction parallel to the fixed polar plate, the thickness of the second connecting unit is made to be a third thickness; the ratio of the first thickness to the third thickness is within a preset range.
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