CN117858800A - Release film for molding resin sheet - Google Patents
Release film for molding resin sheet Download PDFInfo
- Publication number
- CN117858800A CN117858800A CN202280057972.7A CN202280057972A CN117858800A CN 117858800 A CN117858800 A CN 117858800A CN 202280057972 A CN202280057972 A CN 202280057972A CN 117858800 A CN117858800 A CN 117858800A
- Authority
- CN
- China
- Prior art keywords
- resin sheet
- resin
- release
- release layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 228
- 239000011347 resin Substances 0.000 title claims abstract description 228
- 238000000465 moulding Methods 0.000 title claims abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 62
- 239000000203 mixture Substances 0.000 claims description 21
- 230000003746 surface roughness Effects 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 128
- 239000010408 film Substances 0.000 description 110
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 46
- 238000000576 coating method Methods 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 34
- 239000000463 material Substances 0.000 description 27
- -1 polyethylene terephthalate Polymers 0.000 description 26
- 229920000139 polyethylene terephthalate Polymers 0.000 description 22
- 239000005020 polyethylene terephthalate Substances 0.000 description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 20
- 239000007788 liquid Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 239000002344 surface layer Substances 0.000 description 19
- 238000001035 drying Methods 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- 239000002904 solvent Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005886 esterification reaction Methods 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 229920006267 polyester film Polymers 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
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- 239000004645 polyester resin Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
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- 238000005259 measurement Methods 0.000 description 6
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- 238000006243 chemical reaction Methods 0.000 description 5
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- 239000000178 monomer Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
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- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
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- 238000002360 preparation method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical compound CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007611 bar coating method Methods 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
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- 229920001577 copolymer Polymers 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
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- 229920000578 graft copolymer Polymers 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
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- 239000002994 raw material Substances 0.000 description 2
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- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- DFCCYXLYTZKMBL-UHFFFAOYSA-N 1-(cyclohexen-1-yloxy)cyclohexene Chemical compound C1CCCC(OC=2CCCCC=2)=C1 DFCCYXLYTZKMBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- ZVFWTFHAUOWVFH-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)ethyl-ethylcarbamodithioic acid Chemical compound CCN(CCC1=NC2=CC=CC=C2S1)C(=S)S ZVFWTFHAUOWVFH-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
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- 239000011777 magnesium Substances 0.000 description 1
- 229940097364 magnesium acetate tetrahydrate Drugs 0.000 description 1
- XKPKPGCRSHFTKM-UHFFFAOYSA-L magnesium;diacetate;tetrahydrate Chemical compound O.O.O.O.[Mg+2].CC([O-])=O.CC([O-])=O XKPKPGCRSHFTKM-UHFFFAOYSA-L 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
Abstract
[ problem ] to provide: a release film for molding a resin sheet which is highly smooth and has good slidability and which is free from particles substantially added to the inside of the resin sheet. In particular, the present invention relates to a release film for molding a resin sheet for use in electronic parts and optical applications. Disclosed is a release film for molding a resin sheet, which is characterized in that a release layer is directly laminated on at least one side of a base film or is laminated via another layer, and the degree of deviation Ssk of the surface of the release layer is 1 or less.
Description
Technical Field
The present invention relates to a release film for molding a resin sheet. In particular, the present invention relates to a release film for molding a resin sheet for use in electronic parts and optical applications.
Conventionally, a release film using a polyester film as a base material has high heat resistance and mechanical properties, and is used as a step film for film formation from a solution of a resin sheet such as an adhesive sheet, a protective film, a polymer electrolyte membrane, and a dielectric resin sheet. In recent years, a resin sheet used for electronic parts and optical applications is required to have high smoothness and transparency, and therefore, a release film used as a process film is also required to have high smoothness on its surface. Accordingly, techniques described in patent documents 1 to 3 have been disclosed, and a technique for reducing the surface roughness of the surface of the release layer has been proposed.
However, for example, in optical applications, high smoothness is required to improve transparency or the like, and if the smoothness is high, the slidability is deteriorated, and scratches may be introduced in a conveying process or the like, and the yield may be lowered. In addition, in electronic component applications, smoothness is required to improve electrical characteristics, and if the smoothness is too high, the smoothness is poor, and winding misalignment, mixing of wrinkles, and the like occur when the resin sheet is wound around a roll, and there is a concern that the resin sheet cannot be wound perfectly, and the performance of the electronic component may be degraded.
To improve these, patent documents 4 to 6 propose: specific particles are added to the resin sheet to impart slidability thereto. Patent document 7 proposes: the resin sheet is provided with an easily slidable layer, thereby providing the resin sheet with sliding properties. Patent document 8 proposes: a protective film having constant Ra (arithmetic average roughness) and Sm (average interval of irregularities) is laminated on the surface to improve the surface.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2012-144021
Patent document 2: japanese patent laid-open publication No. 2014-154273
Patent document 3: japanese patent laid-open No. 2015-182261
Patent document 4: japanese patent laid-open publication No. 2019-095661
Patent document 5: japanese patent laid-open No. 7-138471
Patent document 6: japanese patent laid-open publication 2016-053177
Patent document 7: japanese patent laid-open No. 2006-123465
Patent document 8: japanese patent application laid-open No. 2004-130736
Patent document 9: japanese patent application laid-open No. 2012-061712
Disclosure of Invention
Problems to be solved by the invention
However, in the methods of patent documents 4 to 7, since particles are contained in the obtained resin sheet, there is a concern that the transparency such as an increase in the internal haze becomes insufficient, the particles are aggregated and the maximum protrusion height Sp of the surface of the region becomes large, and the resin sheet is damaged. In the method of patent document 8, a member having a concave-convex shape is adhered to a resin sheet, and the concave-convex shape is transferred to the resin sheet, but the transferred resin sheet needs to be softened, and therefore, the resin type and process conditions of the resin sheet are limited. In addition, since the resin sheet is tightly adhered by applying pressure, the resin sheet is damaged. In the method of patent document 9, ra of the roughness after transfer is excessively large, and therefore, in the case of a resin sheet of a film, there is a possibility that damage is caused to the resin sheet.
The present invention solves the above problems and proposes: a release film for molding a resin sheet which is highly smooth and has good slidability and which is free from particles substantially added to the inside of the resin sheet can be provided.
Thus, the present inventors found that: according to the present invention in which fine irregularities are provided by resin phase separation and the proportion of concave portions becomes larger than the proportion of convex portions instead of adding particles to a release film, the convex portions are efficiently transferred to the resin sheet, and even a small area surface roughness Sa can be effectively imparted to the resin sheet.
In addition, the present invention provides: in addition to the above effects, the surface maximum protrusion height Sp of the region is small, and no particles are released, so that the resin sheet is not damaged, and stable sliding property is provided well.
Solution for solving the problem
The present inventors have conducted intensive studies and as a result found that: the smooth base film is preferably coated with a coating liquid containing at least a specific resin under specific conditions and dried and cured, whereby irregularities derived from a phase separation structure are formed on the surface of the laminated film, and good slidability is successfully obtained without containing particles or the like.
That is, the present invention includes the following configurations.
[1] A release film for molding a resin sheet, wherein a release layer is directly laminated on at least one side of a base film or a release layer is laminated via another layer, and the degree of deviation Ssk of the surface of the release layer is 1 or less.
[2] In one embodiment, the surface maximum protrusion height Sp of the surface of the release layer is 500nm or less, and the surface roughness Sa of the surface of the release layer is 2nm or more and 200nm or less.
[3] In one embodiment, the protruding protrusion has a volume at a load area ratio of 10%: vm (10) and the volume of the protruding valley at a load area ratio of 80%: ratio of Vv (80): vm (10)/Vv (80) satisfies the following relationship:
0<Vm(10)/Vv(80)≤1.5。
[4] in one embodiment, the release layer is substantially free of particles.
[5] In one embodiment, the release layer is a layer obtained by curing a composition comprising at least: an energy ray-curable resin (I) having 3 or more reactive groups in 1 molecule, a resin (II) separated from the resin (I) to form an island structure, and a mold release component (III).
[6] In one aspect, the present invention provides a (laminated) resin sheet which can be laminated on the release film for molding a resin sheet, wherein a surface of the resin sheet on a release layer side has a shape of a release surface shape transferred with the release film.
ADVANTAGEOUS EFFECTS OF INVENTION
The release film for molding a resin sheet of the present invention can provide: a release film for a resin sheet having high smoothness and good slidability can be provided.
Detailed Description
The present invention will be described in detail below.
The present invention relates to a release film for molding a resin sheet, wherein a release layer is directly laminated on at least one side of a base film or is laminated via another layer, and the degree of deviation Ssk of the surface of the release layer is 1 or less.
In the present invention, since fine irregularities are preferably formed by separating the resin phase, effects different from those of surface formation by resin addition conventionally performed can be obtained. For example, since particles are substantially not contained in the release layer, it is possible to suppress the increase in internal haze and other insufficient transparency. The present invention has excellent transparency, and therefore, can easily confirm defects in the production of a resin sheet and defects in the release film itself.
Further, since no particles are contained in the release layer, aggregation in the particle release layer can be suppressed, and the maximum protrusion height Sp of the surface of the region can be suppressed from increasing. As a result, for example, the resin sheet formed on the release film can be prevented from being perforated or broken.
In addition, the present invention can form uniform irregularities on the release film, and therefore, uniform-shaped irregularities can be formed on the resin sheet. As a result, a resin sheet exhibiting stable slidability can be provided.
It is considered that the present invention preferably forms the release layer under specific conditions so that the above-described effects can be more remarkably exerted. As a result, for example, the release layer can form a release layer having a proportion of concave portions larger than a proportion of convex portions. While not being limited to a particular theory, the formation of the release layer having a recess ratio greater than that of the protrusion allows the protrusion to be formed efficiently on the resin sheet, and allows good slidability to be imparted to the resin sheet.
Here, the surface shape of the surface of the resin sheet in contact with the release layer has a shape of the release surface on which the release film of the present invention is transferred. The invention adopts the following modes: unlike the conventional transfer film, that is, unlike the conventional manner of pressing the convex portion of the release film against the resin sheet to form the concave portion on the resin sheet, the convex portion is formed efficiently on the resin sheet.
In more detail, the present invention is as follows: the composition for forming the resin sheet flows into the concave portion of the release layer and is cured, whereby the convex portion can be formed on the surface of the resin sheet.
In addition, in the case of the release layer of the present invention, the release layer can be peeled off from the release layer without damaging the shape of the convex portion formed on the resin sheet.
Further, in the present invention, since the convex portion of the release film is not pressed against the resin sheet, the resin sheet can be thinned. For example, even a resin sheet of a thin film can impart good slidability to the resin sheet while having a desired film thickness. While not being limited to a particular theory, in the method of pressing the convex portion of the release film against the resin sheet, a force is applied in the thickness direction of the resin sheet when the release layer is pressed against the resin sheet, and therefore, if the resin sheet is extremely thin, there is a concern that pinholes or the like may occur, and there is a possibility that thickness unevenness may occur in the resin sheet.
However, according to the present invention, since the convex portions can be formed efficiently on the resin sheet, the film thickness required for the resin sheet can be uniformly maintained, and since appropriate convex portions can be formed on the basis of the film thickness, the obtained resin sheet is excellent in winding property, and the original required characteristics can be sufficiently exhibited. Therefore, the present invention can contribute to, for example, greater thinning of the resin sheet.
In addition, the maximum valley depth of the resin sheet can be made shallow, and the obtained resin sheet is not easily broken.
In one embodiment, the present invention comprises a release layer directly on at least one side of a base film or comprising a release layer via another layer, wherein the surface roughness (Sa) of the surface of the release layer is 2nm or more and 200nm or less, and the maximum surface protrusion height (Sp) is 500nm or less. In one aspect, a release film for molding a resin sheet is preferably formed by curing a composition comprising at least: an energy ray-curable resin (I) having 3 or more reactive groups in 1 molecule, a resin (II) separated from the resin (I) to form an island structure, and a mold release component (III).
(substrate film)
The release film of the present invention comprises: the release layer is disposed on the surface of the substrate. If a resin sheet is disposed on the release layer of the release film, the resin sheet may be molded into the same shape as the base material. In addition, since the release layer is easily peeled off from the resin sheet, the shape of the resin sheet can be deformed and maintained to a desired shape. The release layer may be disposed on one surface or both surfaces of the substrate.
As the base material, a known base material can be used. For example, a resin film formed of polyester such as polyethylene terephthalate and polyethylene naphthalate, polyolefin such as polypropylene, polyimide, or the like can be used as the base material. From the viewpoints of cost and productivity, a polyester film is particularly preferable, and a polyethylene terephthalate film is further preferable.
The thickness of the base material is preferably 10 μm or more and 188 μm or less, more preferably 25 μm or more and 100 μm or less. By setting the thickness of the base material to 10 μm or more, deformation can be suppressed by heat during production, processing, and molding of the base material. On the other hand, if the thickness of the base material is 188 μm or less, the physical properties required for the base material are satisfied, and the amount of the base material to be discarded after use can be suppressed, and the burden on the environment can be reduced.
An easy-to-adhere coating for improving adhesion may be disposed between the substrate and the release layer. In addition, a coating layer for imparting slipperiness, heat resistance, antistatic property, and the like may be disposed on the surface of the base material opposite to the surface on which the release layer is disposed.
The area surface average roughness (Sa) of the surface of the laminated release layer of the base film used in the present invention is preferably in the range of 1nm to 50nm, more preferably 2nm to 30nm. The surface maximum protrusion height (Sp) of the surface of the laminated release layer of the base film used in the present invention is preferably 2 μm or less, more preferably 1.5 μm or less. If Sa is 50nm or less and (Sp) is 2 μm or less, the suppression of the thickness unevenness of the release layer and the smoothness of the surface of the release layer can be maintained constantly, and further, the thickness unevenness of the resin sheet can be reduced, and the possibility of cracking from a portion having a small thickness when the resin sheet is peeled from the release film can be suppressed.
The surface average roughness (Sa) of the region of the base film opposite to the surface on which the release layer is laminated is preferably in the range of 10 to 100nm, more preferably 2 to 30nm. The surface maximum protrusion height (Sp) of the region of the base film opposite to the surface on which the release layer is laminated is preferably 2 μm or less, more preferably 1.5 μm or less. If Sa is 10nm or more, the sliding properties between the release surface and the reverse release surface are improved, and the winding property is excellent. If (Sp) is 2 μm or less, the possibility of peeling off a part of the release layer is reduced, and the surface of the release layer is not damaged when winding is performed. Further, the resin sheet can be prevented from being broken starting from the portion from which the release layer is peeled when the resin sheet is peeled from the release film.
The haze of the base film used in the present invention is preferably 10% or less, more preferably 5% or less, and still more preferably 3% or less. If the haze is 10% or less, the appearance of the release film or the resin sheet is easily inspected when the release film is processed.
The base film of the present invention may be polyester film scraps or recycled materials for plastic bottles. In the present invention, the film scraps and the recycled material of the plastic bottle can be used, and thus the environmental load can be greatly reduced. In addition, in the mode of containing film scraps and the regeneration raw material of the plastic bottle, the slidability of the film can be improved, and the air degassing easiness can be maintained. The release layer of the present invention can be used for recycling, treating and reusing polyester films used for various applications.
When such a reclaimed material (material) is contained, fine particles having a size in the range of 1 to 50nm may be contained in the surface of the laminated release layer of the base film, and fine particles having a size of 2 μm or less may be contained in the surface of the laminated release layer of the base film, the surface of the laminated release layer having a maximum protrusion height (Sp).
For example, the size of the fine particles of the substrate of the present invention may be in the range of (0.001 μm or more and 10 μm). If the particles have a size in this range, the above-mentioned surface average roughness (Sa) and surface maximum protrusion height (Sp) of the surface of the laminated release layer of the base film can be satisfied.
In one embodiment, the substrate has a surface layer substantially free of inorganic particles, and the release layer may be laminated on the surface layer.
The polyester film base material may be a single layer or may be a plurality of layers of 2 or more layers. For example, the base film may be a polyester film having a surface layer a substantially free of particles having a particle diameter of 1.0 μm or more and a surface layer B containing the particles. Preferably, the surface layer A contains substantially no inorganic particles having a particle diameter of 1.0 μm or more.
In this embodiment, particles having a particle diameter of less than 1.0 μm and 1nm or more may be present in the surface layer A. The surface layer a is substantially free of particles having a particle diameter of 1.0 μm or more, for example, inorganic particles, so that transfer of the particle shape in the base material to the resin sheet can be reduced, thereby causing defects.
In one embodiment, the surface layer a does not contain particles having a particle diameter of less than 1.0 μm, and thus, the transfer of the particle shape in the base material to the resin sheet can be more effectively suppressed to cause defects.
In one embodiment, the polyester film base material is preferably a laminated film having a surface layer a substantially free of inorganic particles on at least one side. This can further effectively suppress occurrence of defects due to transfer of the particle shape in the base material to the resin sheet.
For example, the surface layer a substantially containing no particles having a particle diameter of less than 1.0 μm is preferably substantially free of particles having a particle diameter of 1.0 μm or more.
Here, in the present invention, "substantially free of particles" means, for example: in the case of inorganic particles smaller than 1.0 μm, the content of the inorganic element is 50ppm or less, preferably 10ppm or less, and most preferably the detection limit or less in the case of quantitative determination of the inorganic element by fluorescent X-ray analysis. This is because, even if particles are not positively added to the film, there are cases where contamination components derived from foreign matters, raw resin, or dirt adhering to a production line or equipment in a process for producing the film are peeled off and mixed into the film. The term "substantially free of particles having a particle diameter of 1.0 μm or more" means that: particles having a particle diameter of 1.0 μm or more are not positively contained.
In the case of a laminated polyester film formed of a multilayer structure of 2 or more layers, it is preferable that the surface layer B which may contain inorganic particles or the like is provided on the opposite side of the surface layer a which does not substantially contain inorganic particles.
When the layer on the side to which the release layer is applied is an a layer, the layer on the opposite side is a B layer, and the core layers other than those are C layers, the layer structure in the thickness direction may be a laminated structure such as a release layer/a/B or a release layer/a/C/B. Of course, the C layer may be formed of a plurality of layers. The surface layer B may not contain inorganic particles. In this case, in order to impart slidability for winding up the film into a roll, it is preferable to provide the surface layer B with a coating layer containing at least inorganic particles and a binder.
(Release layer)
The release layer of the present invention is preferably a layer obtained by curing a composition comprising at least: an energy ray-curable resin (I) having 3 or more reactive groups in 1 molecule, a resin (II) separated from the resin (I) to form an island structure, and a mold release component (III). Since the resin (I) and the resin (II) are separated to form an island structure, and many concave-convex portions can be easily formed without containing particles, even if the area surface roughness Sa is small, the resin sheet can be provided with the convex portions efficiently, and slidability can be imparted. Further, since the area surface roughness Sa is low, coarse protrusions are not generated, and since the area surface maximum protrusion height Sp is low, slidability can be imparted without damaging the resin sheet. Further, since the irregularities are formed by phase separation, it is not necessary to press the resin sheet as in the embossing process, and it is preferable to prevent damage to the resin sheet.
(resin (I))
As the resin (I) used in the present invention, an energy ray curable resin having 3 or more reactive groups in 1 molecule can be used. By having 3 or more reactive groups in 1 molecule, the resin sheet becomes a release layer having a high elastic modulus, and thus deformation of the release layer at the time of peeling of the resin sheet can be suppressed, and re-peeling can be suppressed. In addition, the solvent resistance of the release layer can be improved, and therefore, the release layer is preferably prevented from being corroded by the solvent at the time of coating the resin sheet. The energy ray curable resin having 3 or more reactive groups in 1 molecule is not particularly limited, and may be one in which the reaction is directly performed by energy rays or may be one in which the reaction is indirectly performed by an active material generated. The amount of the resin (I) to be added is preferably 60 to 98% by mass, and more preferably 80 to 97% by mass, based on 100 parts by mass of the solid content in the composition for forming the release layer. By adding 60 mass% or more, a release layer having a high elastic modulus can be maintained.
In the present specification, unless otherwise specified, the solid content in the composition for forming the release layer means 100 parts by mass in total of the solid content of the resin (I), the resin (II), the release component (III), and the initiator component.
Examples of the reactive group of the energy ray-curable resin (I) include (meth) acryl, alkenyl, acrylamide, maleimide, epoxy, and cyclohexenyl oxide. Among them, an energy ray curable resin having a (meth) acryloyl group excellent in processability is preferable.
The energy ray-curable resin having an acryl group may be used without limitation to monomers, oligomers, and polymers. It is necessary to contain at least a resin having 3 or more reactive groups in 1 molecule, but it is also possible to use a resin having 2 or more reactive groups in 1 to 2 molecules by mixing them. By mixing these resins having a small number of reactive groups, curling and the like can be suppressed.
Examples of the energy ray-curable monomer having 3 or more (meth) acryloyl groups in the molecule include polyfunctional (meth) acrylates such as isocyanuric acid triacrylate, glycerol triacrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and ethylene oxide modified products, propylene oxide modified products, and caprolactone modified products thereof.
Examples of the energy ray-curable monomer having 1 to 2 reactive groups in the molecule include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, amyl (meth) acrylate, cyclopentyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, isobornyl (meth) acrylate, cyclic trimethylolpropane formal (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxypropyl (meth) acrylate, t-butyl (meth) acrylate, dicyclopentyloxy ethyl (meth) acrylate, dicyclopentyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, tetrahydroxybutyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, and pentamethylene glycol (meth) acrylate Monomers such as 1, 4-butanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, nonanediol di (meth) acrylate, bisphenol a di (meth) acrylate, neopentyl glycol di (meth) acrylate, and cyclohexanediol di (meth) acrylate, and ethylene oxide modified products, propylene oxide modified products, and caprolactone modified products thereof.
Examples of the energy ray-curable oligomer having 3 or more (meth) acryloyl groups in the molecule include urethane acrylate, polyester acrylate, polyether acrylate, epoxy acrylate, and silicone-modified acrylate, and those generally commercially available can be used. Examples thereof include BEAMSET (registered trademark) series manufactured by Kagaku chemical Co., ltd., NK Oligo series manufactured by Xinzhongcun chemical Co., ltd., EBECRYL series manufactured by Daicel-Allnex Ltd., viscoat series manufactured by Osaka organic chemical Co., ltd., urethane acrylate series manufactured by Kagaku chemical Co., ltd., uniDic series manufactured by DIC Co., ltd.
Examples of the energy ray-curable polymer having 3 or more (meth) acryloyl groups in a molecule include: a graft polymer having a (meth) acryloyl group grafted onto the polymer; block polymers in which a polyfunctional acrylic monomer is added to the polymer terminals, and the like. As the polymer, an acrylic resin, an epoxy resin, a polyester resin, a polyorganosiloxane, or the like can be used, but is not particularly limited.
(resin (II))
The resin (II) used in the present invention is a resin (I) dissolved in the same solvent and uniformly dissolved in the form of a coating agent (composition before formation of a coating film), but it is necessary to form a sea-island structure by drying and curing the solvent so as to be incompatible with each other, using the resin (I) as a sea component and the resin (II) as an island component. The resin (II) may be used without any particular limitation as long as the aforementioned conditions are satisfied. More than 2 kinds of resins may be used simultaneously. The amount of the resin (II) to be added is preferably 1 to 30% by mass, and more preferably 1 to 10% by mass, based on 100 parts by mass of the solid content in the composition for forming the release layer. By adding 1 mass% or more, sufficient irregularities can be formed, and by setting 30 mass% or less, the crosslinking degree of the release layer is high, and the temperature dependence at the time of peeling is low, which is preferable.
The resin (II) is not particularly limited as long as it is a solvent-soluble resin such as a polyester resin, an acrylic resin, a polyimide resin, a polyamideimide resin, a cellulose resin, or the like.
The polyester resin is not particularly limited, and commercially available ones can be used. Examples thereof include Vylon (registered trademark) series manufactured by Toyo corporation, nichigo-Polyester (registered trademark) series manufactured by Nichigo chemical industry Co., ltd.
The acrylic resin is an oligomer or polymer of a polymerized acrylic acid ester, and may be a homopolymer or a copolymer. In addition, commercially available products can be used. Examples thereof include the ACRYDIC (registered trademark) series manufactured by DIC corporation and the ARFON (registered trademark) series manufactured by east Asia Synthesis Co., ltd.
(mold release component (III))
The release component (III) used in the present invention is not particularly limited as long as it is a material that can be peeled from a green sheet such as polyorganosiloxane, fluorine compound, long-chain alkyl compound, wax, etc. Among these materials, those having a functional group such as a (meth) acryloyl group that can react with and bond to the resin (I) are preferable. In addition, 2 or more materials may be mixed and used. The amount of the release component (III) to be added is preferably 0.05 to 10 mass%, more preferably 0.1 to 5 mass% relative to 100 mass parts of the solid content in the composition for forming a release layer. When the amount is 0.05 mass% or more, the peeling force is small, and when the amount is 10 mass% or less, the crosslinking degree of the release layer is high, and the temperature dependence at the time of peeling is low, which is preferable.
As the polyorganosiloxane, in addition to polydimethylsiloxane, polydiethylsiloxane, polyphenylsiloxane, and the like, a siloxane-based compound partially organically modified, a block polymer having polyorganosiloxane, a polymer grafted with polyorganosiloxane, and the like can be used. As a commercially available product, for example, BYK (registered trademark) series manufactured by BYK Japan corporation, modpper (registered trademark) series manufactured by daily oil corporation, and the like can be used.
The fluorine compound is not particularly limited, and commercially available ones can be used. Examples thereof include the MEGAFACE (registered trademark) series manufactured by DIC Co., ltd.
Examples of the long-chain alkyl compound include: acrylic polymers copolymerized with long-chain alkyl acrylates, graft polymers grafted with long-chain alkyl groups, block polymers with long-chain alkyl groups added at the ends, and the like. Further, the method is not particularly limited, and commercially available products can be used. Examples thereof include the Tess Fine (registered trademark) series manufactured by Hitachi chemical Co., ltd., lion Specialty Chemicals Co., ltd., peronyl (registered trademark), and the like.
Examples of the active energy ray include electromagnetic waves such as infrared rays, visible rays, ultraviolet rays, and X-rays, particle rays such as electron beams, ion beams, neutral beams, and α -rays, and ultraviolet rays excellent in manufacturing cost are preferably used.
The atmosphere at the time of irradiation with the active energy rays may be either ordinary air or nitrogen atmosphere. The free radical reaction proceeds smoothly in the nitrogen atmosphere by reducing the oxygen concentration, and the elastic modulus of the release layer can be improved, but if irradiation in air is not practically problematic, it is preferable to perform the irradiation in air from the viewpoint of economy.
(photopolymerization initiator)
In the case of using a radical polymerization resin for the release layer of the present invention, a photopolymerization initiator is preferably added. Specific examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzildimethyl ketal, 2, 4-diethylthioxanthone, 1-hydroxycyclohexylphenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azoisobutyronitrile, benzil, biphenyl acyl, butanedione, β -chloroanthraquinone, (2, 4, 6-trimethylbenzyl diphenyl) phosphine oxide, 2-benzothiazolyl-N, N-diethyldithiocarbamate, and the like. Among them, 2-hydroxy-2-methyl-1-phenyl-propan-1-one and 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinopropan-1-one are particularly preferable, and 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] -phenyl } -2-methylpropan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one and 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinopropan-1-one are preferable, which are considered to be excellent in surface curability. These may be used alone or in combination of 2 or more.
The amount of the photopolymerization initiator to be added is not particularly limited. For example, it is preferable to use about 0.1 to 20 mass% with respect to the resin used.
Additives such as an adhesion improving agent and an antistatic agent may be added to the release layer of the present invention as long as the effects of the present invention are not impaired. In order to improve the adhesion to the substrate, it is also preferable to subject the surface of the polyester film to pretreatment such as anchor coating, corona treatment, plasma treatment, and atmospheric pressure plasma treatment before providing the release coating layer.
In the present invention, the thickness of the release layer is not particularly limited, and is preferably in the range of 0.3 to 5.0 μm, more preferably 0.5 to 3.0 μm, after curing. If the thickness of the release layer is 0.3 μm or more, the energy ray-curable copolymer has good curability, and the elastic modulus of the release layer is improved, so that good release performance is preferably obtained. If the thickness of the release film is 5.0 μm or less, curling is less likely to occur even if the thickness of the release film is reduced, and it is preferable that the resin sheet is not likely to cause poor travelling properties during molding and drying.
The release film of the present invention preferably has an Ssk (also referred to as a skewness) indicating a skewness of the surface of the release layer, and the Ssk is 1 or less. When Ssk is 1 or less, the number of concave portions of the irregularities increases, and therefore, the convex portions can be efficiently formed in the resin sheet. More preferably 0.7 or less, still more preferably 0.5 or less, and most preferably 0 or less.
In one approach, the bias Ssk may also have a negative value. For example, ssk is-1 or more, may be-0.7 or more, and may be-0.5 or more. For example, the degree of deviation Ssk of the irregularities on the surface of the release layer may be-1 or more and 1 or less, and may be-0.7 or more and 1 or less.
In the present invention, when the degree of deviation Ssk of the irregularities on the surface of the release layer shows the above range, the release layer is preferably a layer obtained by curing a composition comprising at least: an energy ray-curable resin (I) having 3 or more reactive groups in 1 molecule, a resin (II) separated from the resin (I) to form an island structure, and a mold release component (III). The inventors found that: the composition is preferably applied and dried/cured under the specific conditions described in the present specification, whereby the degree of deviation Ssk of the irregularities on the surface of the release layer can be adjusted to the above range more effectively.
The release film of the present invention preferably has a protruding protrusion volume at a load area ratio of 10%: vm (10) and the volume of the protruding valley at a load area ratio of 80%: ratio of Vv (80): vm (10)/Vv (80) satisfies the following relational expression.
0<Vm(10)/Vv(80)≤1.5
If Vm (10)/Vv (80). Ltoreq.1.5, the number of concave-convex recesses increases, and the protruding portions can be efficiently formed in the resin sheet, which is preferable. More preferably 1.0 or less, still more preferably 0.7 or less, and most preferably 0.5 or less.
In one embodiment, vm (10)/Vv (80) is 0.1 or more, for example, 0.15 or more, and may be 0.20 or more.
The haze of the release film of the present invention is preferably 15% or less, more preferably 10% or less, and still more preferably 5% or less. If the haze is 15% or less, the appearance inspection is easy when the resin sheet is processed on the release film.
The release film of the present invention preferably has the release layer substantially free of particles. Since the particles are not contained, coarse protrusions due to aggregation of the particles are not generated, and therefore, the resin sheet is preferably not damaged during transfer. Further, since no particles are contained, no particles fall off, and contamination of the resin sheet can be prevented, which is preferable. Further, it is preferable to obtain uniform and stable slidability without the uneven portion of the transfer being unstable due to the falling of the particles, since it is preferable to obtain stable slidability. Further, since the resin sheet contains substantially no particles, it has high transparency in the case of optical applications, and excellent electrical characteristics in the case of electronic components, for example.
The release film of the present invention preferably has moderate irregularities on the surface of the release layer. Therefore, the area surface average roughness (Sa) of the surface of the release layer is preferably 2nm to 200nm, for example, 2nm to 100nm, and may be 2nm to 50nm, more preferably 5nm to 30 nm. If the area surface roughness (Sa) is 2nm or more, the resin sheet may be provided with irregularities, and slidability may be exhibited. Further, if the area surface roughness (Sa) is 200nm or less, it is preferable that the surface shape of the resin sheet is not affected. The maximum protrusion height (Sp) of the surface of the release layer is preferably 500nm or less, more preferably 100nm or less, and even more preferably 60nm or less. If the surface maximum protrusion height (Sp) of the region is 500nm or less, the possibility of pinhole defects occurring in the resin sheet is reduced, and the voids in the wound resin sheet are reduced, so that the winding can be performed more compactly, which is preferable. Further, if the maximum protrusion height (Sp) of the surface of the region is 500nm or less, a smoother resin sheet can be formed, and a resin sheet roll with less torsion can be formed.
For example, the maximum protrusion height (Sp) of the surface of the region is 1nm or more.
In the present invention, the method for forming the release layer is not particularly limited, and the following method is used: the coating liquid in which the releasable resin is dissolved or dispersed is spread on one surface of the polyester film of the base material by coating or the like, and the solvent or the like is removed by drying and then cured. The release layer of the present invention can be formed more effectively by applying the composition under the specific conditions described in the present specification and drying/curing the composition, and a resin sheet having high smoothness and good sliding properties can be provided.
The drying temperature of solvent drying when the release layer of the present invention is applied to a substrate film by solution coating is preferably 50 ℃ or higher and 120 ℃ or lower, more preferably 60 ℃ or higher and 100 ℃ or lower. The drying time is preferably 30 seconds or less, more preferably 20 seconds or less. Further, it is preferable that the solvent is dried and then the curing reaction is performed by irradiation with active energy rays. The active energy rays used in this case may be ultraviolet rays, electron beams, X-rays, or the like, but ultraviolet rays are preferably used easily. The amount of the ultraviolet light to be irradiated is preferably 30 to 300mJ/cm2, more preferably 30 to 200mJ/cm2, based on the amount of light. The curing of the resin is sufficiently performed by setting the ratio to 30mJ/cm2 or more, and the speed at the time of processing can be improved by setting the ratio to 300mJ/cm2 or less, so that a release film can be economically produced, and is preferable.
The atmosphere at the time of irradiation with the active energy rays may be either ordinary air or nitrogen atmosphere. The free radical reaction proceeds smoothly in the nitrogen atmosphere by reducing the oxygen concentration, and the elastic modulus of the release layer can be improved, but if irradiation in air is not practically problematic, it is preferable to perform the irradiation in air from the viewpoint of economy.
In the present invention, the surface tension of the coating liquid at the time of coating the release layer is not particularly limited, and is preferably 30mN/m or less. By setting the surface tension as described above, the coatability after coating is improved, and irregularities on the surface of the dried coating film can be reduced.
As the coating method of the coating liquid, any known coating method can be used, and for example, conventionally known methods such as a roll coating method such as a gravure coating method or a reverse coating method, a bar coating method such as a bar coating method, a die coating method, a spray coating method, and an air knife coating method can be used.
The composition is applied and dried/cured in the above-described manner, so that the release layer is substantially free of particles, and a release layer having a surface deviation Ssk of 1 or less can be obtained.
On the other hand, since the surface shape of the release layer is fine and complex, it is not possible or practical to directly specify the release layer according to the structure or characteristics described in the present specification. Therefore, in the present invention, since the release layer of the present invention can be formed efficiently by a specific manufacturing process using the above specific composition, the expression "release layer formed by the manufacturing method described in the present specification" may have to be used.
Alternatively, it is sometimes necessary to use a mixture ratio of the energy ray curable resin (I) having 3 or more reactive groups in 1 molecule and the resin (II) separated from the resin (I) to form a sea-island structure, various conditions such as the type of the resin (II) and the drying temperature, and such a behavior as a release layer obtained according to such conditions.
Similarly, the surface shape of the obtained resin sheet is also fine and complex, and therefore, it is impossible or impractical to directly specify the resin sheet according to the structure or characteristics described in the present specification. Therefore, in the present invention, the expression "the surface of the resin sheet on the release layer side has the shape of the release surface on which the release film of the present invention is transferred" may have to be used for the resin sheet of the present invention.
(resin sheet)
In one form, the invention relates to: in the medical field, the industrial field, for example, in a process for producing an electronic component, an electronic substrate, a process for producing a thermosetting resin member such as a fiber-reinforced plastic, and the like. In more detail, the following matters are involved. The present invention relates to a release film useful for a release film such as a surface protective film or an adhesive tape, a release liner, a separator for a tape used in the production of a semiconductor product (dicing, die bonding, back grinding), a carrier for forming an unfired sheet in the production of a ceramic capacitor, a carrier in the production of a composite material, a separator for a protective material, and the like.
In particular, the release film used as an optical film or a film for producing electronic parts is not particularly limited, and examples of the resin sheet formed on the release film include vinyl resins, acrylic resins, epoxy resins, polyester resins, styrene resins, fluorine resins, amino resins, and phenolic resins.
The resin sheet formed by using the above resin alone lacks slidability, and has poor handleability, and thus has a low yield and a possibility of blocking. In order to avoid this, particles and wax are added as a slidability imparting agent, but when the particles are added, the particles aggregate to form coarse protrusions, which may damage the resin sheet, and when transparency is required in the resin sheet, haze increases due to aggregation of the particles, which may cause loss of transparency. In addition, when wax is added, the resin sheet is used for electronic components and the like, and the wax is transferred to the electronic components and contaminated, which may cause malfunction.
The present invention can impart slidability to a resin sheet without using particles or wax, and thus can suppress the above-described problems. The resin component forming the resin sheet may be appropriately selected depending on the application.
In one aspect, the present invention provides a method for producing a resin sheet using the release film for molding a resin sheet of the present invention. For example, the method for producing the resin sheet includes the steps of: the resin sheet is treated at a drying temperature of 50 ℃ to 120 ℃, for example, 60 ℃ to 100 ℃, and the drying time is preferably 30 seconds or less, more preferably 20 seconds or less.
If such drying conditions are used, a resin sheet can be formed without impairing the surface shape of the release layer of the present invention.
In one embodiment, the resin sheet is a (laminated) resin sheet which can be laminated on a release film for molding a resin sheet,
the surface of the resin sheet on the release layer side has a shape of a release surface shape on which the release film is transferred.
Examples
The following examples are given to illustrate the present invention in detail, but the present invention is not limited to these examples. The characteristic values used in the present invention were evaluated by the following methods.
(1) Thickness of substrate film
Using Milltron (electronic micro-indicator), 4 samples of 5cm square were cut out from any 4 sites of the film to be measured, and 5 points (20 points total) were measured for each sheet, and the average value was taken as the thickness.
(2) Thickness of release layer
The thickness of the release layer was measured by an optical interferometry film thickness meter (F20, filmetrics, inc.). (refractive index of mold release layer was calculated as 1.52)
(3) Region surface roughness Sa, region surface maximum protrusion height Sp
To use the non-contact surface shape measuring system (manufactured by VertScan R550H-M100, mitsubishi Chemical Systems, inc.) values were measured under the following conditions. The area surface average roughness (Sa) was an average value of 5 measurements, and the area surface maximum protrusion height (Sp) was a maximum value of 5 measurements 7 times except for the maximum value and the minimum value.
(measurement conditions)
Measurement mode: WAVE mode
Objective lens: 50 times of
0.5 Tube lens
(analysis conditions)
Face correction: correction for 4 times
Interpolation processing: complete interpolation
Filter: gaussian (cut-off value: 20 μm)
(4) Volume of protruding protrusion at 10% load area ratio: vm (10) and the volume of the protruding valley at a load area ratio of 80%: ratio of Vv (80): vm (10)/Vv (80)
For the purpose of using the noncontact surface shape measuring system (manufactured by veriscan R550H-M100, mitsubishi Chemical Systems, inc.) values were measured under the following conditions.
(measurement conditions)
Measurement mode: WAVE mode
Objective lens: 50 times of
0.5 Tube lens
(analysis conditions)
Face correction: correction for 4 times
Interpolation processing: complete interpolation
Filter: gaussian (cut-off value: 20 μm)
ISO parameters: void and Material Volume Parameters
(5) Slidability of the slide
Resin sheet coating liquids 1 to 4 having the following compositions were mixed, and the resin sheet was coated on the release surface of the release film for resin sheet molding of the present invention using a wire bar so that the dried resin became 5.0. Mu.m, and after drying at 90℃for 1 minute, the release film was peeled off to obtain a resin sheet.
The resin sheet fixed on the table with the surface facing upward by hand and the back surface of the peeled resin sheet were slid, and the sliding property was determined based on the following criteria.
O: sliding without hooking
Delta: with hooks, but sliding
X: no movement and no sliding
(resin sheet 1)
100.00 parts by mass of resin
(polyester resin, vylon (registered trademark) RV280 manufactured by Toyo Kabushiki Kaisha)
700.00 parts by mass of diluent solvent
(methyl ethyl ketone/toluene=1/1)
(resin sheet 2)
100.00 parts by mass of resin
(polyvinyl butyral resin, BM-S, water-logging chemical Co., ltd.)
700.00 parts by mass of diluent solvent
(ethanol/toluene=1/1)
(resin sheet 3)
100.00 parts by mass of resin
(epoxy resin, manufactured by CELLOXIDE 2021P, daicel Corporation)
40.00 parts by mass of photoinitiator
(boron-based cationic curing UV initiator, CATA211, manufactured by Kagaku Co., ltd., solid content concentration: 18.5% by mass)
500.00 parts by mass of a diluting solvent
(methyl ethyl ketone/toluene=1/1)
(preparation of polyethylene terephthalate pellets (PET (1))
As the esterification reaction apparatus, a continuous esterification reaction apparatus including a 3-stage complete mixing tank having a stirring device, a dephlegmator, a raw material inlet and a product outlet was used. The reaction was carried out at an average residence time of 4 hours and 255℃under normal pressure with the slurry continuously supplied to the 1 st esterification reactor of the esterification reactor, wherein the TPA (terephthalic acid) was 2 tons/hour, EG (ethylene glycol) was 2 moles based on 1 mole of TPA, and antimony trioxide was 160ppm based on the atoms of PET and Sb produced. Then, the reaction product in the 1 st esterification reaction vessel was continuously taken out of the system, supplied to the 2 nd esterification reaction vessel, EG distilled off from the 1 st esterification reaction vessel was 8 mass% with respect to the produced PET, and EG solution containing magnesium acetate tetrahydrate in an amount of 65ppm with respect to the produced PET and Mg atoms and EG solution containing TMPA (trimethyl phosphate) in an amount of 40ppm with respect to the produced PET and P atoms were added, and the reaction was carried out under normal pressure at an average residence time of 1 hour and 260 ℃. Then, the reaction product of the 2 nd esterification reaction vessel was continuously taken out of the system, supplied to the 3 rd esterification reaction vessel, and reacted with a high-pressure disperser (manufactured by Japanese Kogyo Co., ltd.) under a pressure of 39MPa (400 kg/cm 2) at an average residence time of 0.5 hours at 260℃while forming 10% EG slurry of each of 0.2 mass% of porous colloidal silica having an average particle diameter of 0.9 μm, which was subjected to an average treatment number of 5 times, and 0.4 mass% of synthetic calcium carbonate having an average particle diameter of 0.6 μm, to which 1 mass% of an ammonium salt of polyacrylic acid was adhered, under normal pressure. The esterification reaction product produced in the 3 rd esterification reactor was continuously fed to a 3-stage continuous polycondensation reaction apparatus, subjected to polycondensation, filtered by a filter sintered with 95% of stainless steel fibers having a split particle diameter of 20 μm, ultrafiltered, extruded into water, cooled, and cut into pellets to obtain PET pellets having an intrinsic viscosity of 0.60dl/g (hereinafter abbreviated as PET (1)). The lubricant content in the PET pellets was 0.6% by mass.
(preparation of polyethylene terephthalate pellets (PET (2))
On the other hand, in the production of the PET chips, PET chips having an intrinsic viscosity of 0.62dl/g (hereinafter abbreviated as PET (2)) which do not contain particles such as calcium carbonate and silica at all were obtained
(production of laminated film X1)
These PET chips were dried and then melted at 285℃and then melted at 290℃by a separate melt extruder, and then subjected to a 2-stage filtration in which a stainless steel fiber having a 95% split particle size of 15 μm and a stainless steel particle having a 95% split particle size of 15 μm were sintered, and joined in a feed head, PET (1) was laminated so as to be a surface layer B (reverse mold release side layer) and PET (2) was a surface layer A (mold release side layer), and extruded (cast) at a rate of 45 m/min into a sheet, and then electrostatically sealed on a casting drum at 30℃and cooled by an electrostatic sealing method to obtain an unstretched polyethylene terephthalate sheet having an intrinsic viscosity of 0.59 dl/g. The layer ratio was adjusted so that PET (1)/(2) =60%/40% was calculated as the discharge amount of each extruder. The unstretched sheet was then heated in an infrared heater and then stretched 3.5 times in the machine direction at a roll temperature of 80℃using the difference in speed between the rolls. Thereafter, the resultant was introduced into a tenter frame, and stretched at 140℃in the transverse direction by 4.2 times. Then, in the heat-setting zone, heat treatment was performed at 210 ℃. Thereafter, a relaxation treatment of 2.3% was performed at 170℃in the transverse direction to obtain a biaxially stretched polyethylene terephthalate film X1 having a thickness of 31. Mu.m. The Sa of the surface layer A of the obtained film X1 was 2nm, and the Sa of the surface layer B was 29nm.
Example 1
(preparation of release layer coating liquid)
The surface layer a of the laminated film X1 was coated with a coating liquid 1 having the following composition using a reverse gravure so that the film thickness of the dried release layer became 2.0 μm, and after drying at 90 ℃ for 30 seconds, ultraviolet rays were irradiated using a high-pressure mercury lamp so as to become 200mJ/cm2, thereby obtaining a release film for resin sheet molding. The obtained release film was subjected to a release layer thickness, a region surface roughness Sa, a region surface maximum protrusion height (Sp), and a ratio of the volume of protruding protrusions to the volume of protruding valleys: vm (10)/Vv (80), and slidability.
(coating liquid 1)
100.00 parts by mass of resin (I)
(dipentaerythritol hexaacrylate, new Zhongcun chemical industry Co., ltd., A-DPH)
6.59 parts by mass of resin (II-1)
(polyester resin, vylon (registered trademark) RV280 manufactured by Toyo Kabushiki Kaisha)
10.99 parts by mass of resin (II-2)
(polyurethane resin, vylon (registered trademark) UR1400, manufactured by Toyo-yo Co., ltd., solid content 30.0% by mass)
1.26 parts by mass of a mold release agent (III)
(acryl-modified polydimethylsiloxane, BYK-UV3505, BYK Japan Co., ltd., solid content: 40.0% by mass)
Photopolymerization Initiator (IV) 5.49 parts by mass
(OMNIRAD (registered trademark) 907, manufactured by IGM Japan GK Co., ltd.)
425.11 parts by mass of a diluting solvent (V)
(methyl ethyl ketone/cyclohexanone=4/1)
Example 2
The coating was performed so that the film thickness of the release layer after drying became 3.0. Mu.m. A release film was obtained in the same manner as in example 1. The same evaluation as in example 1 was performed.
Example 3
The following coating liquid 3 was used, in which dipropylene glycol diacrylate was added as the resin (II-3) to the coating liquid 1.
(coating liquid 3)
100.00 parts by mass of resin (I)
(dipentaerythritol hexaacrylate, new Zhongcun chemical industry Co., ltd., A-DPH)
6.71 parts by mass of resin (II-1) polyester resin
(Vylon (registered trademark) RV280 manufactured by Toyo Kabushiki Kaisha)
11.18 parts by mass of resin (II-2) polyurethane resin
(Vylon (registered trademark) UR1400, manufactured by TOYOBO Co., ltd., solid content concentration 30.0% by mass)
49.68 parts by mass of resin (II-3) polypropylene acrylate
(dipropylene glycol diacrylate, APG-100)
1.60 parts by mass of a mold release agent (III)
(free radical polymerization type Silicone mold Release agent, KF-2005, made by Xinyue chemical industry Co., ltd.)
11.18 parts by mass of photopolymerization Initiator (IV)
(OMNIRAD (registered trademark) 907, manufactured by IGM Japan GK Co., ltd.)
434.05 parts by mass of a diluting solvent (V)
(methyl ethyl ketone/cyclohexanone=4/1)
The coating was performed so that the film thickness of the release layer after drying became 2.0. Mu.m. A release film was obtained in the same manner as in example 1 except that the coating liquid 3 was used. The same evaluation as in example 1 was performed.
Example 4
The following coating liquid 4 was used, in which the ratio of the resin (II-1) to the resin (II-2) was reduced as compared with example 1.
(coating liquid 4)
100.00 parts by mass of resin (I)
(dipentaerythritol hexaacrylate, new Zhongcun chemical industry Co., ltd.)
Resin (II-1) polyester resin 2.06 parts by mass
(Vylon (registered trademark) RV280 manufactured by Toyo Kabushiki Kaisha)
Resin (II-2) polyurethane resin 3.44 parts by mass
(Vylon (registered trademark) UR1400, manufactured by TOYOBO Co., ltd., solid content concentration 30.0% by mass)
1.19 parts by mass of a mold release agent (III)
(acryl-modified polydimethylsiloxane, BYK-UV3505, BYK Japan Co., ltd., solid content: 40.0% by mass)
Photopolymerization Initiator (IV) 5.15 parts by mass
(OMNIRAD (registered trademark) 907, manufactured by IGM Japan GK Co., ltd.)
403.63 parts by mass of a diluting solvent (V)
(methyl ethyl ketone/cyclohexanone=4/1)
The coating was performed so that the film thickness of the release layer after drying became 2.0. Mu.m. A release film was obtained in the same manner as in example 1 except that the coating liquid 4 was used. The same evaluation as in example 1 was performed.
Comparative example 1
As comparative example 1, a release film for molding a resin sheet containing particles in a release layer was obtained by coating the release layer with a coating liquid 5 having the following composition so that the film thickness of the release layer after drying became 0.1 μm. A release film was obtained in the same manner as in example 1 except that the coating liquid 5 and the film thickness of the dried release layer were used to be 0.1 μm. The same evaluation as in example 1 was performed.
(coating liquid 5)
100.00 parts by mass of resin
(Silicone resin, LTC851, dow Corning Toray Co., ltd., solid content concentration 30.0% by mass)
7.50 parts by mass of particles
(silica gel solution, MEK-ST-40, manufactured by Nissan chemical Co., ltd., solid content: 40.0% by mass)
1.70 parts by mass of a curing catalyst
(platinum catalyst, SRX212, dow Corning Toray co., ltd.)
5000.00 parts by mass of diluting solvent
(methyl ethyl ketone/toluene=1/1)
Comparative example 2
As comparative example 2, a release film was obtained in the same manner as in comparative example 1 using a coating liquid 6 having the following composition. Further, the same evaluation as in comparative example 1 was performed.
(coating liquid 6)
100.00 parts by mass of resin
(Silicone resin, LTC851, dow Corning Toray Co., ltd., solid content concentration 30.0% by mass)
45.00 parts by mass of particles
(silica gel solution, MEK-ST-UP, nissan chemical Co., ltd., solid content: 20.0% by mass)
1.70 parts by mass of a curing catalyst
(platinum catalyst, SRX212, dow Corning Toray co., ltd.)
5000.00 parts by mass of diluting solvent
(methyl ethyl ketone/toluene=1/1)
TABLE 1
In the examples, slidability was shown in any of the resin sheets.
In comparative example 1, ssk was greater than 1, the convex portion was not transferred to the resin sheet, and slidability was not shown in any of the resin sheets. In comparative example 2, sa is also large and Ssk is also small compared to comparative example 1, but Ssk is larger than 1, so that the transferred convex portion is insufficient, and no resin sheet exhibits slidability.
Industrial applicability
The present invention relates to a release film for molding a resin sheet. In particular, the present invention relates to a release film for molding a resin sheet for use in electronic parts and optical applications.
Claims (6)
1. A release film for molding a resin sheet, wherein a release layer is directly laminated on at least one side of a base film or a release layer is laminated via another layer, and the degree of deviation Ssk of the surface of the release layer is 1 or less.
2. The release film for molding a resin sheet according to claim 1, wherein the surface of the release layer has a regional surface maximum protrusion height Sp of 500nm or less and a regional surface roughness Sa of 2nm or more and 200nm or less.
3. The release film for resin sheet molding according to claim 1 or 2, wherein the volume of the protruding protrusion portion at a loading area ratio of 10%: vm (10) and the volume of the protruding valley at a load area ratio of 80%: ratio of Vv (80): vm (10)/Vv (80) satisfies the following relational expression;
0<Vm(10)/Vv(80)≤1.5。
4. the release film for molding a resin sheet according to any one of claims 1 to 3, wherein the release layer contains substantially no particles.
5. The release film for molding a resin sheet according to any one of claims 1 to 4, wherein the release layer is a layer obtained by curing a composition comprising at least: an energy ray-curable resin (I) having 3 or more reactive groups in 1 molecule, a resin (II) separated from the resin (I) to form an island-in-sea structure, and a mold release component (III).
6. A resin sheet which can be laminated on the release film for molding a resin sheet according to any one of claims 1 to 5,
The surface of the resin sheet on the release layer side has a shape in which the release surface shape of the release film is transferred.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-141171 | 2021-08-31 | ||
| JP2021141171 | 2021-08-31 | ||
| PCT/JP2022/031952 WO2023032793A1 (en) | 2021-08-31 | 2022-08-24 | Mold release film for resin sheet molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117858800A true CN117858800A (en) | 2024-04-09 |
Family
ID=85412619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280057972.7A Pending CN117858800A (en) | 2021-08-31 | 2022-08-24 | Release film for molding resin sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023032793A1 (en) |
| KR (1) | KR20240031359A (en) |
| CN (1) | CN117858800A (en) |
| WO (1) | WO2023032793A1 (en) |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07138471A (en) | 1993-11-19 | 1995-05-30 | Mitsubishi Chem Corp | Polyamide resin composition and packaging film prepared therefrom |
| WO2000018555A1 (en) * | 1998-10-01 | 2000-04-06 | Airtech International, Inc. | Method of molding or curing a resin material at high temperatures using a multilayer release film |
| JP2004130736A (en) | 2002-10-11 | 2004-04-30 | Sumitomo Bakelite Co Ltd | Method for manufacturing easily smoothed film, and plastic substrate for displaying using the same |
| JP2006123465A (en) | 2004-11-01 | 2006-05-18 | Unitika Ltd | Laminated polyamide film |
| JP4332204B2 (en) * | 2007-09-21 | 2009-09-16 | 積水化学工業株式会社 | Release film |
| CN102791480B (en) * | 2010-03-12 | 2015-06-17 | 积水化学工业株式会社 | Mold release film and method for manufacturing mold release film |
| JP2012041527A (en) | 2010-07-20 | 2012-03-01 | Ube Industries Ltd | Polyamide resin composition and film |
| JP5565230B2 (en) | 2010-09-16 | 2014-08-06 | 日本ゼオン株式会社 | Optical film roll and method for producing optical film roll |
| JP5774857B2 (en) | 2011-01-14 | 2015-09-09 | ユニチカ株式会社 | Slippery polyester film and method for producing the same |
| JP6085185B2 (en) | 2013-02-06 | 2017-02-22 | 株式会社ダイセル | Release film and laminate for manufacturing fuel cell, and method for manufacturing fuel cell |
| JP2014152240A (en) * | 2013-02-08 | 2014-08-25 | Toray Ind Inc | Release film |
| JP6205874B2 (en) * | 2013-06-07 | 2017-10-04 | 東レ株式会社 | Release film |
| JP6340855B2 (en) | 2014-03-22 | 2018-06-13 | 三菱ケミカル株式会社 | Film laminate |
| JP6531555B2 (en) * | 2014-10-31 | 2019-06-19 | 東レ株式会社 | Polyester film for optical film production |
| JP6981205B2 (en) | 2017-11-24 | 2021-12-15 | コニカミノルタ株式会社 | Optical film and polarizing plate |
| JP6822549B2 (en) * | 2017-12-27 | 2021-01-27 | 東洋紡株式会社 | Release film for manufacturing ceramic green sheets |
| JP7427359B2 (en) * | 2018-09-27 | 2024-02-05 | 東洋紡株式会社 | Release film for ceramic green sheet production and its evaluation method |
| MY194551A (en) * | 2018-09-27 | 2022-12-01 | Toyo Boseki | Release film for production of ceramic green sheet |
-
2022
- 2022-08-24 WO PCT/JP2022/031952 patent/WO2023032793A1/en active Application Filing
- 2022-08-24 KR KR1020247004020A patent/KR20240031359A/en unknown
- 2022-08-24 CN CN202280057972.7A patent/CN117858800A/en active Pending
- 2022-08-24 JP JP2023545500A patent/JPWO2023032793A1/ja active Pending
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| Publication number | Publication date |
|---|---|
| KR20240031359A (en) | 2024-03-07 |
| WO2023032793A1 (en) | 2023-03-09 |
| JPWO2023032793A1 (en) | 2023-03-09 |
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