CN117854862A - Surface electrode type NTC thermistor - Google Patents
Surface electrode type NTC thermistor Download PDFInfo
- Publication number
- CN117854862A CN117854862A CN202311857042.2A CN202311857042A CN117854862A CN 117854862 A CN117854862 A CN 117854862A CN 202311857042 A CN202311857042 A CN 202311857042A CN 117854862 A CN117854862 A CN 117854862A
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- electrode
- layer
- ntc
- surface electrode
- ntc thermistor
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- 239000010410 layer Substances 0.000 claims abstract description 62
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000011241 protective layer Substances 0.000 claims abstract description 35
- 238000003466 welding Methods 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- MFIWAIVSOUGHLI-UHFFFAOYSA-N selenium;tin Chemical compound [Sn]=[Se] MFIWAIVSOUGHLI-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005245 sintering Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to the technical field of resistor manufacturing, in particular to a surface electrode type NTC thermistor. The invention relates to a surface electrode type NTC thermistor, which comprises an NTC ceramic substrate, an electrode layer and a protective layer, wherein the electrode layer comprises a surface electrode and two external electrodes, the electrode layer is positioned on the NTC ceramic substrate, and the protective layer is positioned above the electrode layer. The invention has the advantages of high manufacturing precision, simple manufacturing and low cost.
Description
Technical Field
The invention relates to the technical field of resistor manufacturing, in particular to a surface electrode type NTC thermistor.
Background
Along with the continuous development of technology in the future, the chip NTC thermistor gradually realizes the development trend of intelligence, miniaturization and high efficiency, and brings more convenience and innovation for human beings. Negative Temperature Coefficient (NTC) thermistors are widely used in the fields of electronics, automobiles, medical treatment, energy sources and the like, have very rich structural structures and types, and can meet the demands of different fields. The existing NTC thermosensitive products at present mainly have two structures, the first structure is that there is no inner electrode, namely the blocky ceramic NTC thermosensitive resistor, it is made up of five parts, the core material of kernel, silver plating, electroplated nickel layer, electroplated tin layer and glass encapsulation layer, this kind of structure is because the whole is thicker, the temperature reaction time is longer, and welded thermal shock influences its resistance and B value greatly, can cause the resistance drift, and then influences the temperature measurement accuracy, and the resistance that this kind of structure can provide in addition is also inflexible. The second structure is an inner electrode, namely a multi-layer ceramic laminated NTC thermistor, and the product is a multi-layer ceramic structure and is provided with an inner electrode, and similar to the structure of an MLCC, the resistance and the precision are usually adjusted by adjusting the inner electrode, and the product is likely to crack and fail due to the influence of thermal shock caused by welding, mechanical stress difference, thermal shock and bending of a circuit board.
Therefore, a surface electrode type NTC thermistor with high precision, simple fabrication and low cost is needed.
Disclosure of Invention
In order to solve the problems, the invention provides the surface electrode type NTC thermistor which has high precision, simple manufacture and low cost, and adopts the following technical scheme.
The surface electrode type NTC thermistor comprises an NTC ceramic substrate, an electrode layer and a protective layer, wherein the electrode layer comprises a surface electrode and two external electrodes, the electrode layer is positioned on the NTC ceramic substrate, and the protective layer is positioned above the electrode layer.
The resistance and the precision are adjusted through the surface electrode, the stability of the whole resistor is ensured through the protective layer, and the resistor has the advantages of simplicity in manufacturing and low cost.
Preferably, the NTC ceramic substrate is made of two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel and zinc, or one of silicon carbide, tin selenide and tantalum nitride.
The resistivity and material constant of these materials will vary with the ratio of the material components, the sintering atmosphere, the sintering temperature and the structural state. According to the law of resistance, the resistance R of a conductor is proportional to its length L and resistivity ρ, inversely proportional to its cross-sectional area S, and a ceramic substrate prepared from the above materials has good temperature sensitivity.
Preferably, the surface electrode comprises a left electrode and a right electrode, the left electrode and the right electrode comprise a plurality of electrode plates, the electrode plates of the left electrode and the electrode plates of the right electrode are arranged in a staggered mode, the outer electrode comprises a left outer electrode and a right outer electrode, the left outer electrode is connected with the left side of the left electrode, and the right outer electrode is connected with the right side of the right electrode.
The surface electrodes of the invention are designed in an interdigital way, and the surface electrodes have opposite areas, so that the invention can adjust the resistance between the two electrodes more accurately, and the yield of products is ensured.
Preferably, the external electrode comprises a base layer, a barrier layer and a welding layer from inside to outside.
The invention adopts an external electrode structure, and the barrier layer can prevent the electrode from being influenced in the welding process by connecting the base layer with the surface electrode, and the welding layer is connected with the bonding pad.
Preferably, the welding layer is provided with a welding pad outside, the welding pad comprises a top fixing plate, a bottom fixing plate and a side fixing plate, the NTC ceramic substrate, the electrode layer and the protective layer are all located on the top fixing plate and between the bottom fixing plates, and the NTC ceramic substrate, the electrode layer and the protective layer are all located on the inner side of the side fixing plate.
The invention adopts the structure, and the welding is carried out when the invention is installed, thereby playing the role of protecting the resistor.
Preferably, the protective layer is made of glass material.
Preferably, the surface electrode and the external electrode are covered on the NTC ceramic substrate in a screen printing mode.
The invention adopts a screen printing mode to process, on one hand, the production efficiency is enhanced, a large number of elements can be processed in a short time, and on the other hand, the invention is beneficial to reducing the processing cost.
Preferably, the surface electrode further comprises an intermediate electrode, and the intermediate electrode and the left and right electrodes are parallel to each other.
In the processing process, an integral electrode is printed on an NTC ceramic substrate by adopting a screen printing mode, then a left electrode, a right electrode and a middle electrode are cut by laser, and the facing area between the electrodes is adjusted by the laser.
Preferably, the surface electrode changes the facing area of the electrode by cutting with laser light spots, thereby adjusting the resistance of the thermistor.
In the production process, an NTC ceramic substrate is prepared firstly, then an electrode is printed on the ceramic substrate in a screen printing mode, sintering is carried out after drying, then laser is adopted for precise cutting, resistance is controlled, then a layer of protective layer is coated, the protective layer is made of silicon dioxide particles, sintering is carried out after the protective layer is dried, a layer of protective layer is formed after sintering, and finally, the sintered substrate is subjected to strip folding, silver dipping or sputtering, silver burning and electroplating in sequence. The invention adopts the mode of folding strips for processing, and has the advantages of high processing speed and high processing precision.
Preferably, the NTC thermistor has a length of 0.4-2.0mm, a width of 0.2-1.25mm and a height of 0.2-0.85mm.
The resistor of the invention has small size and higher difficulty in processing small-size elements, and the invention adopts a surface printing mode to process a large number of elements in a short time, and then adopts a strip folding mode to enhance the processing precision of the invention.
The invention has the beneficial effects that: 1. the invention has the advantage of high processing precision; 2. the invention has the advantage of low cost; 3. the invention has the advantages of high production efficiency and high yield.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
fig. 2 is a schematic structural view of embodiment 1;
fig. 3 is a schematic structural view of embodiment 2;
fig. 4 is a schematic structural view of embodiment 3;
FIG. 5 is a schematic view of the structure of the left external electrode;
fig. 6 is a production flow chart of the present invention.
Detailed Description
The invention is further explained below in connection with specific embodiments.
Example 1
The surface electrode 4 type NTC thermistor comprises an NTC ceramic substrate 1, an electrode layer 2 and a protective layer 3, wherein the electrode layer 2 comprises a surface electrode 4 and two external electrodes 5, the electrode layer 2 is positioned on the NTC ceramic substrate 1, and the protective layer 3 is positioned above the electrode layer 2. The NTC ceramic substrate 1 is prepared from two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel and zinc, or one of silicon carbide, tin selenide and tantalum nitride. The surface electrode 4 comprises a left electrode 6 and a right electrode 7, the outer electrode 5 comprises a left outer electrode 8 and a right outer electrode 9, the left outer electrode 8 is connected with the left side of the left electrode 6, and the right outer electrode 9 is connected with the right side of the right electrode 7. The outer electrode 5 includes a base layer 10, a barrier layer 11 and a solder layer 12 from inside to outside. The welding layer 12 is externally provided with a welding pad 13, the welding pad 13 comprises a top fixing plate 14, a bottom fixing plate 15 and a side fixing plate 16, the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned between the top fixing plate 14 and the bottom fixing plate 15, and the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned on the inner side of the side fixing plate 16. The protective layer 3 is made of glass material. The surface electrode 4 and the external electrode 5 are covered on the NTC ceramic substrate in a screen printing mode. The surface electrode 4 changes the corresponding area of the electrode by cutting with laser light spots, thereby adjusting the resistance of the thermistor. The NTC thermistor has the length of 0.4mm, the width of 0.2mm and the height of 0.2mm.
In the production process, an NTC ceramic substrate is prepared firstly, then an electrode is printed on the ceramic substrate in a screen printing mode, sintering is carried out after drying, then laser is adopted for precise cutting, resistance is controlled, then a protective layer is coated, sintering is carried out after the protective layer is dried, and finally, the sintered substrate is subjected to strip folding, silver dipping or sputtering, silver burning and electroplating in sequence. The invention adopts the mode of folding strips for processing, and has the advantages of high processing speed and high processing precision.
Example 2
The surface electrode 4 type NTC thermistor comprises an NTC ceramic substrate 1, an electrode layer 2 and a protective layer 3, wherein the electrode layer 2 comprises a surface electrode 4 and two external electrodes 5, the electrode layer 2 is positioned on the NTC ceramic substrate 1, and the protective layer 3 is positioned above the electrode layer 2. The NTC ceramic substrate 1 is prepared from two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel and zinc, or one of silicon carbide, tin selenide and tantalum nitride. The surface electrode 4 comprises a left electrode 6 and a right electrode 7, the left electrode 6 and the right electrode 7 comprise a plurality of electrode plates 17, the electrode plates 17 of the left electrode 6 and the electrode plates 17 of the right electrode 7 are arranged in a staggered mode, the outer electrode 5 comprises a left outer electrode 8 and a right outer electrode 9, the left outer electrode 8 is connected with the left side of the left electrode 6, and the right outer electrode 9 is connected with the right side of the right electrode 7. The outer electrode 5 includes a base layer 10, a barrier layer 11 and a solder layer 12 from inside to outside. The welding layer 12 is externally provided with a welding pad 13, the welding pad 13 comprises a top fixing plate 14, a bottom fixing plate 15 and a side fixing plate 16, the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned between the top fixing plate 14 and the bottom fixing plate 15, and the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned on the inner side of the side fixing plate 16. The protective layer 3 is made of glass material. The surface electrode 4 and the external electrode 5 are covered on the NTC ceramic substrate in a screen printing mode. The surface electrode 4 changes the corresponding area of the electrode by cutting with laser light spots, thereby adjusting the resistance of the thermistor. The NTC thermistor has the length of 0.4mm, the width of 0.2mm and the height of 0.2mm.
Example 3
The surface electrode 4 type NTC thermistor comprises an NTC ceramic substrate 1, an electrode layer 2 and a protective layer 3, wherein the electrode layer 2 comprises a surface electrode 4 and two external electrodes 5, the electrode layer 2 is positioned on the NTC ceramic substrate 1, and the protective layer 3 is positioned above the electrode layer 2. The NTC ceramic substrate 1 is prepared from two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel and zinc, or one of silicon carbide, tin selenide and tantalum nitride. The surface electrode 4 comprises a left electrode 6 and a right electrode 7, the left electrode 6 and the right electrode 7 comprise a plurality of electrode plates 17, the electrode plates 17 of the left electrode 6 and the electrode plates 17 of the right electrode 7 are arranged in a staggered mode, the surface electrode 4 further comprises an intermediate electrode 18, and the intermediate electrode is parallel to the left electrode 6 and the right electrode 7. The outer electrode 5 comprises a left outer electrode 8 and a right outer electrode 9, the left outer electrode 8 is connected with the left side of the left electrode 6, and the right outer electrode 9 is connected with the right side of the right electrode 7. The outer electrode 5 includes a base layer 10, a barrier layer 11 and a solder layer 12 from inside to outside. The welding layer 12 is externally provided with a welding pad 13, the welding pad 13 comprises a top fixing plate 14, a bottom fixing plate 15 and a side fixing plate 16, the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned between the top fixing plate 14 and the bottom fixing plate 15, and the NTC ceramic substrate 1, the electrode layer 2 and the protective layer 3 are all positioned on the inner side of the side fixing plate 16. The protective layer 3 is made of glass material. The surface electrode 4 and the external electrode 5 are covered on the NTC ceramic substrate in a screen printing mode. The surface electrode 4 changes the corresponding area of the electrode by cutting with laser light spots, thereby adjusting the resistance of the thermistor. The NTC thermistor has the length of 0.4mm, the width of 0.2mm and the height of 0.2mm.
In the production process, an NTC ceramic substrate is prepared firstly, then an electrode is printed on the ceramic substrate in a screen printing mode, sintering is carried out after drying, then laser is adopted for precise cutting, resistance is controlled, then a protective layer is coated, sintering is carried out after the protective layer is dried, and finally, the sintered substrate is subjected to strip folding, silver dipping or sputtering, silver burning and electroplating in sequence. The invention adopts the mode of folding strips for processing, and has the advantages of high processing speed and high processing precision.
In addition, when the product is used, the external electrode and the bonding pad are welded and installed.
The detection structure of the invention is as follows:
Claims (10)
1. a surface electrode NTC thermistor characterized by: the electrode layer comprises a surface electrode and two external electrodes, the electrode layer is positioned on the NTC ceramic substrate, and the protective layer is positioned above the electrode layer.
2. The surface electrode NTC thermistor according to claim 1, characterized in that: the NTC ceramic substrate is prepared from two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel and zinc, or one of silicon carbide, tin selenide and tantalum nitride.
3. The surface electrode NTC thermistor according to claim 2, characterized in that: the surface electrode include left electrode and right electrode, left electrode and right electrode all include a plurality of electrode slices, electrode slice of left electrode and the motor slice of right electrode crisscross setting, the outer electrode include left outer electrode and right outer electrode, left outer electrode with the left side of left electrode connect, right outer electrode with the right side of right electrode connect.
4. A surface electrode NTC thermistor according to claim 3, characterized in that: the external electrode comprises a base layer, a barrier layer and a welding layer from inside to outside.
5. The surface electrode NTC thermistor according to claim 4, characterized in that: the welding plate is provided with a welding plate outside, the welding plate comprises a top fixing plate, a bottom fixing plate and a side fixing plate, the NTC ceramic substrate, the electrode layer and the protective layer are all located on the top fixing plate and between the bottom fixing plates, and the NTC ceramic substrate, the electrode layer and the protective layer are all located on the inner side of the side fixing plate.
6. The surface electrode NTC thermistor according to claim 5, characterized in that: the protective layer is made of glass materials.
7. The surface electrode NTC thermistor according to claim 6, characterized in that: the surface electrode and the external electrode are covered on the NTC ceramic substrate in a screen printing mode.
8. The surface electrode NTC thermistor according to claim 7, characterized in that: the surface electrode also comprises an intermediate electrode, and the intermediate electrode is parallel to the left electrode and the right electrode.
9. The surface electrode NTC thermistor according to claim 8, characterized in that: the surface electrode changes the length and width of the electrode by cutting with laser light spots, so as to adjust the resistance of the thermistor.
10. The surface electrode NTC thermistor according to claim 9, characterized in that: the NTC thermistor has a length of 0.4-2.0mm, a width of 0.2-1.25mm and a height of 0.2-0.85mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311857042.2A CN117854862A (en) | 2023-12-29 | 2023-12-29 | Surface electrode type NTC thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311857042.2A CN117854862A (en) | 2023-12-29 | 2023-12-29 | Surface electrode type NTC thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117854862A true CN117854862A (en) | 2024-04-09 |
Family
ID=90544841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311857042.2A Pending CN117854862A (en) | 2023-12-29 | 2023-12-29 | Surface electrode type NTC thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117854862A (en) |
-
2023
- 2023-12-29 CN CN202311857042.2A patent/CN117854862A/en active Pending
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