CN117835578A - Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil - Google Patents
Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil Download PDFInfo
- Publication number
- CN117835578A CN117835578A CN202311474430.2A CN202311474430A CN117835578A CN 117835578 A CN117835578 A CN 117835578A CN 202311474430 A CN202311474430 A CN 202311474430A CN 117835578 A CN117835578 A CN 117835578A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- solder resist
- thermosetting
- resist ink
- laser coding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 42
- 230000015556 catabolic process Effects 0.000 title description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000013461 design Methods 0.000 claims description 5
- 239000013039 cover film Substances 0.000 abstract description 14
- 239000010408 film Substances 0.000 abstract description 14
- 238000011161 development Methods 0.000 abstract description 2
- 239000007888 film coating Substances 0.000 abstract 1
- 238000009501 film coating Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a process method for solving the problem that a circuit board is broken down in a laser coding covering film and thermosetting oil; the method comprises the steps of film coating, preheating, solder resist ink coating, exposure and development of solder resist ink, cleaning of solder resist ink and developing solution, thermosetting white oil printing, curing and laser coding. The method adopts a process method of adding the solder mask ink layer between the cover film and the thermosetting oil at the corresponding position of the two-dimensional code to solve the problem that the cover film and the thermosetting oil are broken down, solves the problem that the circuit board cannot be identified due to laser energy fluctuation and ink thickness difference by adding the solder mask ink layer, can effectively protect the surface of the circuit board, and ensures the stability and reliability of the laser coding quality.
Description
Technical Field
The invention belongs to the field of circuit board production, and particularly relates to a process method for solving the problem that a circuit board is broken down in a laser coding covering film and thermosetting oil.
Background
At present, the laser coding technology of the circuit board has very high precision and control capability, and can realize the marking of tiny characters, complex patterns and high-density two-dimensional codes, but the thickness difference of thermosetting white oil on the circuit board and the fluctuation of laser energy easily cause the breakdown of the thermosetting white oil on a circuit board cover film, and the laser breaks down the cover film simultaneously to cause copper exposure, so that the two-dimensional codes cannot be identified.
In order to solve the problem, the invention provides a process method for solving the problem that the circuit board breaks down in a laser coding covering film and thermosetting oil, and the process method for adding the solder resist oil between the covering film and the thermosetting oil can well solve the problem that the thermosetting white oil on the covering film and the covering film breaks down.
Disclosure of Invention
The above object of the present invention is achieved by the following technical solutions:
a process method for solving the problem that a circuit board is broken down in a laser coding covering film and thermosetting oil is characterized in that: the method comprises the following process steps:
s1, attaching a covering film;
s2, preheating;
s3, coating solder resist ink;
s4, exposing and developing solder resist ink;
s5, cleaning solder resist ink and developing solution;
s6, printing thermosetting white oil;
s7, solidifying;
s8, laser coding.
Preferably, in the process steps of S3 coating the solder resist ink and S6 printing the thermosetting white oil, an on-line thickness measuring device is added on the screen printer to monitor the thickness of the printed coating in real time, the thickness of the printed solder resist ink and the thickness of the thermosetting white oil are set to be between 15 and 30 micrometers, and the thickness and uniformity of the solder resist ink are controlled to ensure that the covering film is completely protected.
Preferably, in the steps of S3 coating the solder resist ink and S4 exposing and developing the solder resist ink, a photomask pattern is designed according to the design requirement of the circuit board, and the transparent area of the photomask pattern corresponds to the area needing to be covered with the solder resist layer and the area needing to be laser coded.
Preferably, the preheating temperature is set to be 50-80 ℃ and the preheating time is set to be 5-15min in the S2 preheating process step, so that the effect and uniformity of the developing process can be improved. .
Preferably, in the step of S7 curing, the developed circuit board is put into curing equipment to be baked and cured, the baking temperature is set to be 150 ℃ +/-5 ℃, the baking time is set to be 2-3min, and the thickness and the drying time of the thermosetting white oil are controlled to obtain a stable protective layer.
In summary, compared with the original process flow, the invention has at least one of the following beneficial technical effects:
1. protective cover film: the technical method of adding the solder resist oil between the cover film and the thermosetting oil is adopted to solve the problem that the cover film and the thermosetting oil are broken down.
2. Optimizing the production process: the method is synchronously carried out with the original welding-resistance procedure without adding extra process flow, thereby improving the production efficiency and the product quality and saving the cost.
3. Thickness monitoring: in the process steps of coating solder resist ink and printing thermosetting white oil, on-line thickness measuring equipment is added, and the thickness of a printing coating is monitored in real time. This ensures that the thickness of the solder resist ink and the thermosetting white oil is uniform and controlled within a desired range.
Drawings
FIG. 1 is a flow chart of a process method for solving the problem that a circuit board breaks down in a laser coding covering film and thermosetting oil;
FIG. 2 is a schematic diagram of the laser coding of the process step S8 of the present invention;
FIG. 3 is a schematic diagram of a conventional laser coding;
reference numerals: 1 a thermosetting white oil layer, 2 a cover film and 3 a solder resist ink layer.
Detailed Description
A process method for solving the problem that a circuit board is broken down in a laser coding covering film and thermosetting oil is characterized in that: the method comprises the following process steps:
s1, attaching a covering film;
s2, preheating;
s3, coating solder resist ink;
s4, exposing and developing solder resist ink;
s5, cleaning solder resist ink and developing solution;
s6, printing thermosetting white oil;
s7, solidifying;
s8, laser coding.
Specifically, in the process steps of S3 coating the solder resist ink and S6 printing the thermosetting white oil, an online thickness measuring device is added on a screen printer to monitor the thickness of a printing coating in real time, the thicknesses of the printing solder resist ink and the thermosetting white oil are set to be 15-30 micrometers, and the thickness and uniformity of the solder resist ink are controlled to ensure that the covering film is completely protected.
Specifically, in the process steps of S3 coating solder resist ink and S4 exposing and developing solder resist ink, a photomask pattern is designed according to the design requirement of the circuit board, and the transparent area of the photomask pattern corresponds to the area needing to be covered with the solder resist layer and the area needing to be laser coded.
Specifically, the preheating temperature is set to be 50-80 ℃ and the preheating time is set to be 5-15min in the S2 preheating process step, so that the effect and uniformity of the developing process can be improved. .
Specifically, in the step of S7 curing, the developed circuit board is put into curing equipment for baking and curing, the baking temperature is set to be 150 ℃ plus or minus 5 ℃, the baking time is set to be 2-3min, and the thickness and the drying time of the thermosetting white oil are controlled to obtain a stable protective layer.
The invention solves the problem of breakdown of the cover film during laser coding of the circuit board by adding the solder resist oil between the cover film and the thermosetting oil, the solder resist oil has good insulating property and coating property, and a layer of insulating protective layer can be formed by coating the solder resist oil between the cover film and the thermosetting oil, so that the thickness of the laser reaching the cover film is increased, and the direct action of the laser on the surface of the circuit board is effectively isolated. The method is synchronous with the original solder mask process, and no extra process flow is needed. When producing a circuit board capable of laser coding, the first step is to paste a cover film, and the cover film is pasted on a circuit board substrate to ensure the stability and quality of the circuit board in the subsequent process production. The second step is preheating, which heats the circuit board to a temperature range of 50 ℃ to 80 ℃ for 5 to 15 minutes, thus improving the developing effect and uniformity. The third step is to apply a solder resist ink, apply the solder resist ink on the preheated circuit board using a screen printer, monitor the thickness of the printed coating in real time by an on-line thickness measuring device, and set the thickness of the solder resist ink between 15 and 30 microns to ensure that the coverlay is fully protected. And the fourth step is to expose and develop the solder resist ink, and design a photomask pattern according to the design requirement of the circuit board. The circuit board is put into exposure equipment, light is transmitted through a photomask and irradiates on the solder resist ink, and a required pattern is formed through the development irradiation process, so that the laser coding area is also covered by the solder resist ink. And the fifth step is to clean the solder resist ink and the developing solution, and clean the circuit board to remove the residual solder resist ink and the developing solution, so as to ensure the clean surface. The sixth step is to print the thermosetting white oil, and the thermosetting white oil is printed on the circuit board by using a screen printer, and parameters of the screen printer can be set: the printing speed is 25-35 mm/s, the screening speed is 0.4 mm/s, and the lower limit value of the scraper pressure is 6KG so as to ensure that the thickness of the thermosetting white oil layer is between 15 and 30 micrometers, and the thickness of the thermosetting white oil can be monitored by on-line thickness measuring equipment. And the seventh step is curing, namely placing the developed circuit board into curing equipment and baking and curing. The parameters were set to a bake temperature of 150 ℃ 5 ℃ and a bake time of 2 to 3 minutes to obtain a stable protective layer. The last step is laser coding, which is performed on the circuit board with the above process steps completed to add the required identification or information.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (5)
1. A process method for solving the problem that a circuit board is broken down in a laser coding covering film and thermosetting oil is characterized in that: the method comprises the following process steps:
s1, attaching a covering film;
s2, preheating;
s3, coating solder resist ink;
s4, exposing and developing solder resist ink;
s5, cleaning solder resist ink and developing solution;
s6, printing thermosetting white oil;
s7, solidifying;
s8, laser coding.
2. The process for solving the problem that the circuit board is broken down in the laser coding covering film and the thermosetting oil according to the claim 1 is characterized in that: in the process steps of S3 coating the solder resist ink and S6 printing the thermosetting white oil, an online thickness measuring device is added on a screen printer to monitor the thickness of a printing coating in real time, and the thicknesses of the solder resist ink and the thermosetting white oil are set to be 15-30 microns.
3. The process for solving the problem that the circuit board is broken down in the laser coding covering film and the thermosetting oil according to the claim 1 is characterized in that: in the process steps of S3 coating the solder resist ink and S4 exposing and developing the solder resist ink, a photomask pattern is designed according to the design requirement of a circuit board, and a transparent area of the photomask pattern corresponds to an area needing to be covered with the solder resist layer and an area needing to be covered with the laser coding.
4. The process for solving the problem that the circuit board is broken down in the laser coding covering film and the thermosetting oil according to the claim 1 is characterized in that: the preheating temperature is set to be 50-80 ℃ in the S2 preheating process step, and the preheating time is set to be 5-15min.
5. The process for solving the problem that the circuit board is broken down in the laser coding covering film and the thermosetting oil according to the claim 1 is characterized in that: and in the S7 curing process step, the developed circuit board is put into curing equipment for baking and curing, and the set parameters are that the baking temperature is 150 ℃ plus or minus 5 ℃ and the baking time is 2-3min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311474430.2A CN117835578A (en) | 2023-11-08 | 2023-11-08 | Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311474430.2A CN117835578A (en) | 2023-11-08 | 2023-11-08 | Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117835578A true CN117835578A (en) | 2024-04-05 |
Family
ID=90516055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311474430.2A Pending CN117835578A (en) | 2023-11-08 | 2023-11-08 | Technological method for solving breakdown of circuit board in laser coding covering film and thermosetting oil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117835578A (en) |
-
2023
- 2023-11-08 CN CN202311474430.2A patent/CN117835578A/en active Pending
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