CN117826957A - Automatically controlled constant temperature's heat dissipation anchor clamps - Google Patents
Automatically controlled constant temperature's heat dissipation anchor clamps Download PDFInfo
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- CN117826957A CN117826957A CN202311872570.5A CN202311872570A CN117826957A CN 117826957 A CN117826957 A CN 117826957A CN 202311872570 A CN202311872570 A CN 202311872570A CN 117826957 A CN117826957 A CN 117826957A
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- motherboard
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000012546 transfer Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
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- 238000007747 plating Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 230000010365 information processing Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 239000003507 refrigerant Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 230000005676 thermoelectric effect Effects 0.000 description 1
Abstract
The invention provides an electric control constant temperature heat radiation fixture, which is applied to temperature control of a micro system, wherein the micro system is arranged on a motherboard, and the heat radiation fixture comprises: the shell is detachably connected with the motherboard, and the microsystem is limited in the accommodating cavity after the shell is assembled and fixed with the motherboard; the TEC refrigerating sheet is arranged on the surface of the shell, and the microsystem in the accommodating cavity exchanges heat with the TEC refrigerating sheet through the shell; the temperature sensing element is arranged on the heat transfer path of the micro system and the TEC refrigerating sheet and is used for generating a temperature signal which is used for representing real-time temperature information of the micro system in the accommodating cavity; and the TEC refrigerating sheet regulates output power according to the temperature signal so as to keep the temperature in the accommodating cavity within a set range in a heating or radiating mode. The electric control constant temperature clamp can be used for the conditions of severe space and heat dissipation conditions, and solves the application requirements of heat dissipation, high reliability and the like of a high-density packaging micro-system.
Description
Technical Field
The invention relates to the technical field of microsystems, in particular to an electric control constant temperature heat radiation clamp.
Background
As the process of silicon-based circuits gradually approaches the limit, moore's law also goes to the end, and the processing power of the monolithic circuit approaches the limit. In the current information processing field, the processing capacity of breaking through the unit area of the system can be stacked by a micro-system micro-process means, but as the number of stacked devices increases, the power consumption of the micro-system increases, and heat dissipation becomes a big bottleneck for micro-system application. The traditional air cooling or liquid cooling heat dissipation is used, so that the space and the weight are huge, and the meaning of a microsystem is lost.
The semiconductor refrigerator TEC (Thermoelectric cooler) is a device for producing cold by using the thermoelectric effect of a semiconductor, and is also called a thermoelectric refrigerator. Two different metals are connected by a conductor, and when direct current is conducted, the temperature at one junction is reduced, and the temperature at the other junction is increased. The semiconductor refrigerator has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and has the advantages of reliable work, simple and convenient operation and easy cold quantity adjustment.
Although the application of a plurality of semiconductor refrigerator TECs in the aspect of micro-system heat dissipation technology is proposed in the traditional scheme, the defect of insufficient integration level still exists, the advantages of small size, easy adjustment and the like of the semiconductor refrigerator are not fully exerted, the situation of severe space and heat dissipation conditions is difficult to adapt, and the heat dissipation requirement of a high-density packaging micro-system cannot be met.
Disclosure of Invention
The invention aims at least solving one of the technical problems that the prior art has insufficient integration level, the semiconductor refrigerator has small volume, is easy to adjust and the like, is difficult to adapt to the situation of severe space and heat dissipation conditions, and cannot meet the heat dissipation requirement of a high-density packaging micro-system.
Therefore, the invention provides the electric control constant temperature heat radiation fixture.
The invention provides an electric control constant temperature heat radiation fixture, which is applied to temperature control of a micro system, wherein the micro system is arranged on a motherboard, and the heat radiation fixture comprises:
the shell is detachably connected with the motherboard, and the microsystem is limited in the accommodating cavity after the shell is assembled and fixed with the motherboard;
the TEC refrigerating sheet is arranged on the surface of the shell, and the microsystem in the accommodating cavity exchanges heat with the TEC refrigerating sheet through the shell;
the temperature sensing element is arranged on the heat transfer path of the micro system and the TEC refrigerating sheet and is used for generating a temperature signal which is used for representing real-time temperature information of the micro system in the accommodating cavity;
and the TEC refrigerating sheet regulates output power according to the temperature signal so as to keep the temperature in the accommodating cavity within a set range in a heating or radiating mode.
According to the technical scheme, the electric control constant temperature heat radiation fixture can also have the following additional technical characteristics:
in the above technical solution, further includes:
the TEC refrigerating piece is arranged between the shell and the cover plate, and a first gold-plated conduction band is arranged on one surface of the cover plate, which is contacted with the TEC refrigerating piece;
the TEC refrigerating sheet comprises a plurality of PN junctions, the surface of the shell is provided with a second gold-plated conduction band, two groups of PN junctions are welded on the second gold-plated conduction band on the surface of the shell in series, all PN junctions are connected in series through a first gold-plated conduction band arranged on the cover plate, and an anode and a cathode integrally formed after PN junctions are connected in series are led out through the second gold-plated conduction band on the surface of the shell.
In the above technical solution, the temperature sensing element includes:
the temperature signal is the resistance value of the NTC thermistor, the NTC thermistor is arranged in the accommodating cavity, a third gold-plated conduction band is arranged on the wall surface of the accommodating cavity, the NTC thermistor is provided with a first end and a second end, and the first end and the second end of the NTC thermistor are welded on the third gold-plated conduction band on the wall surface of the accommodating cavity and led out through the third gold-plated conduction band.
In the above technical scheme, the wall surface of the accommodating cavity forms an auxiliary accommodating groove, the auxiliary accommodating groove is communicated with the accommodating cavity, and the NTC thermistor is buried in the auxiliary accommodating groove.
In the technical scheme, the shell is provided with at least four fixing screw holes, and the shell is connected with the motherboard through the fixing screw holes by bolts;
the two fixing screw holes are used as power supply electrodes of the TEC refrigerating sheet and are respectively connected with an anode and a cathode which are integrally formed after PN junctions are connected in series through gold plating conduction bands;
the other two fixing screw holes are used as electrode connection parts of the NTC thermistor and are respectively connected with the first end and the second end of the NTC thermistor through gold plating conduction bands.
In the above technical scheme, the shell and the cover plate are made of heat-conducting ceramic materials.
In the above technical solution, the gap between the housing and the cover plate is filled with an insulating material.
In the above technical scheme, the motherboard is provided with a power supply, and the power supply is used for supplying power to the TEC refrigerating sheet.
In the above technical solution, the motherboard is provided with:
and the MCU is used for receiving the temperature signal and controlling the power supply current provided by the power supply to the TEC refrigerating sheet according to the temperature signal.
In the technical scheme, when the temperature in the accommodating cavity is higher than the set temperature range, the current in the TEC refrigerating sheet has a first flow direction, and the heat emitted by the micro system in the accommodating cavity is transferred to the TEC refrigerating sheet; when the temperature in the accommodating cavity is lower than the set temperature range, the current in the TEC refrigerating sheet has a second flow direction, and the TEC refrigerating sheet heats the microsystem; wherein the first and second flow directions are opposite.
In summary, due to the adoption of the technical characteristics, the invention has the beneficial effects that:
the invention provides a constant temperature clamp with high heat radiation coupling degree with a micro-system circuit, which can normally work under the condition of ensuring that the micro-system is limited in heat radiation volume application. The electric control constant temperature clamp can be used for the conditions of severe space and heat dissipation conditions, and solves the application requirements of heat dissipation, high reliability and the like of a high-density packaging micro-system.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a top perspective view of an electronically controlled thermostatic heat sink fixture in accordance with one embodiment of the present invention;
FIG. 2 is a side cross-sectional view of an electronically controlled thermostatic heat sink fixture in accordance with one embodiment of the present invention;
fig. 3 is an assembly schematic diagram of an electrically controlled constant temperature heat dissipating clip according to an embodiment of the present invention assembled on a motherboard.
The correspondence between the reference numerals and the component names in fig. 1 to 3 is:
1. a motherboard; 2. a microsystem; 3. a housing; 4. TEC refrigerating sheets; 5. a cover plate; 6. an NTC thermistor; 7. a power supply; 8. an MCU;
31. an auxiliary receiving groove; 32. fixing the screw holes; 33. a second gold-plated conduction band; 34. a third gold-plated conduction band; 35. a receiving chamber;
41. PN junction.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
An electronically controlled thermostatic heat sink fixture provided according to some embodiments of the present invention is described below with reference to fig. 1-3.
Some embodiments of the present application provide an electronically controlled constant temperature heat sink fixture.
As shown in fig. 1 to 3, a first embodiment of the present invention proposes an electrically controlled and constant temperature heat dissipation fixture for controlling the temperature of a micro system 2, wherein the micro system 2 is disposed on a motherboard 1, and the motherboard 1 is a substrate of an integrated circuit, and the micro system 2 is soldered on the motherboard 1.
In some embodiments, the heat sink clip includes at least a housing 3, a TEC cooling plate 4, and a temperature sensing element. Wherein, the shell 3 forms a containing cavity 35, the shell 3 is detachably connected with the motherboard 1, and the microsystem 2 is limited in the containing cavity 35 after the shell 3 is assembled and fixed with the motherboard 1; specifically, in order to facilitate the disassembly and assembly of the heat dissipation fixture, the shell 3 and the motherboard 1 are detachably connected, such as by bolting, buckling, etc., so that the heat dissipation fixture can be separated from the motherboard 1 and the microprocessor as a whole, and replacement or reuse is facilitated. After the shell 3 and the motherboard 1 are assembled, the shell 3 covers the microsystem 2 and is matched with the motherboard 1 to enclose the microprocessor, so that the microprocessor is completely positioned in the accommodating cavity 35, and the heat emitted by the microprocessor is limited in the accommodating cavity 35.
The TEC refrigerating plate 4 is arranged on the surface of the shell 3, and the microsystem 2 positioned in the accommodating cavity 35 exchanges heat with the TEC refrigerating plate 4 through the shell 3; it will be appreciated that the housing 3 should be made of a material that facilitates heat conduction, while also compromising insulation properties, such as thermally conductive ceramics, etc.; the heat in the accommodating cavity 35 exchanges heat with the TEC refrigerating sheet 4 through the shell 3 so as to achieve the function of controlling the temperature. Through the arrangement, the TEC refrigerating sheet 4 and the shell 3 form an integrated structure, so that the space can be further saved.
The temperature sensing element is arranged on the heat transfer path of the micro system 2 and the TEC refrigerating plate 4 and generates a temperature signal which is used for representing real-time temperature information of the micro system 2 in the accommodating cavity 35; the temperature sensing element is used for monitoring the temperature of the micro system 2 in real time, wherein the temperature can be the temperature of the micro system 2, the temperature of the environment where the micro system 2 is located, and the generated temperature signal is not necessarily temperature data, but can be current information, resistance information and the like which can represent the temperature.
After the heat radiation fixture starts to operate, the TEC cooling plate 4 adjusts output power according to the temperature signal, so as to keep the temperature in the accommodating cavity 35 within a set range by heating or heat radiation. Specifically, when the temperature signal indicates that the temperature in the accommodating cavity 35 is higher than the set temperature range, the current in the TEC refrigerating plate 4 has a first flow direction, and the heat emitted by the micro system 2 in the accommodating cavity 35 is transferred to the TEC refrigerating plate 4; when the temperature in the accommodating cavity 35 is lower than the set temperature range, the current in the TEC refrigerating plate 4 has a second flow direction, and the TEC refrigerating plate 4 heats the micro system 2; wherein the first and second flow directions are opposite. Meanwhile, in the heating or refrigerating process of the TEC refrigerating plate 4, the heating or refrigerating power can be controlled within a proper range according to the degree of deviation from the set temperature range.
In some embodiments, the integrated structure of the shell 3 and the TEC refrigerating plate 4 is further designed, specifically, the heat dissipation fixture further comprises a cover plate 5, the TEC refrigerating plate 4 is arranged between the shell 3 and the cover plate 5, and a first gold plating conduction band is arranged on the surface, contacted with the TEC refrigerating plate 4, of the cover plate 5;
the TEC refrigerating sheet 4 comprises a plurality of PN junctions 41, the surface of the housing 3 is provided with a second gold-plated conduction band 33, two groups of the PN junctions 41 are welded on the second gold-plated conduction band 33 on the surface of the housing 3 in series, all the PN junctions 41 are connected in series through a first gold-plated conduction band arranged on the cover plate 5, and an anode and a cathode integrally formed after the PN junctions 41 are connected in series are led out through the second gold-plated conduction band 33 on the surface of the housing 3. An external power supply is connected with the positive electrode and the negative electrode of the TEC refrigerating sheet 4 led out by the second gold-plated conduction band 33 to supply power to the TEC refrigerating sheet 4.
In a specific embodiment, the housing 3 and the cover 5 are made of the same heat conductive ceramic material.
In a specific embodiment, the gap between the housing 3 and the cover plate 5 is filled with an insulating material, and the insulating material is filled in the hollow part between the PN junctions 41, so that on one hand, the insulating performance between the PN junctions 41 is ensured, and on the other hand, the compactness of the housing 3, the TEC refrigerating plate 4 and the cover plate 5 can be further enhanced, so as to form an integrated structure.
In some embodiments, the temperature sensing element comprises an NTC thermistor 6.
The NTC thermistor 6 is a negative temperature coefficient thermistor (NTC thermistor, negative Temperature Coefficient thermistor), which is a semiconductor device whose resistance value decreases with an increase in temperature. The temperature signal is the resistance value of the NTC thermistor 6, the NTC thermistor 6 is arranged in the accommodating cavity 35, a third gold-plated conduction band 34 is arranged on the wall surface of the accommodating cavity 35, the NTC thermistor 6 is provided with a first end and a second end, and the first end and the second end of the NTC thermistor are welded on the third gold-plated conduction band 34 on the wall surface of the accommodating cavity 35 and led out through the third gold-plated conduction band 34.
In one embodiment, as shown in fig. 2, an auxiliary accommodating groove 31 is formed on the upper wall surface of the accommodating cavity 35, i.e., the bottom of the housing 3, the auxiliary accommodating groove 31 communicates with the accommodating cavity 35, and the NTC thermistor 6 is embedded in the auxiliary accommodating groove 31. It can be understood that the auxiliary accommodating groove 31 is formed on the heat transfer path of the micro system 2 and the TEC refrigerating plate 4 and is relatively close to the micro system 2, and whether the temperature in the micro system 2 is within the set range can be detected by measuring the resistance value of the auxiliary accommodating groove, so as to further control the output power of the TEC refrigerating plate 4. Since the NTC thermistor 6 has the advantage of small size and easy measurement, it is embedded in the auxiliary receiving groove 31 on the housing 3, and the thickness of the heat radiation jig can be further reduced.
In some embodiments, the housing 3 is provided with at least four fixing screw holes 32, and the housing 3 is connected with the motherboard 1 through the fixing screw holes 32 by bolts; specifically, screw holes corresponding to the positions of the fixing screw holes 32 are formed around the microsystem 2 on the motherboard 1, and the integral fixing of the heat radiation fixture on the motherboard 1 is realized through a bolt connection mode. In a specific embodiment, four fixing screw holes 32 are respectively arranged at four corners of the shell 3, wherein the two fixing screw holes 32 are respectively connected with an anode and a cathode integrally formed after being connected in series with the PN junction 41 through a second gold-plated conduction band 33 as a power supply electrode of the TEC refrigeration piece 4; the other two fixing screw holes 32 are respectively connected with the first end and the second end of the NTC thermistor 6 through third gold-plated conduction bands 34 as electrode connection parts of the NTC thermistor 6.
In some embodiments, the power supply for supplying power to the TEC cooling plate 4 directly adopts the power supply 7 on the motherboard 1, and the power supply 7 supplies power to the TEC cooling plate 4 through two fixing screw holes 32 connected as power supply electrodes of the TEC cooling plate 4.
In some embodiments, the MCU8 for controlling the output power of the TEC cooling plate 4 is also disposed on the motherboard 1, the MCU8 receives a temperature signal, and controls the magnitude and the current direction of the power supply current provided by the power supply 7 to the TEC cooling plate 4 according to the temperature signal, specifically, the MCU8 collects the resistance value of the NTC thermistor 6 through two fixing screw holes 32 connected to the electrode connection of the NTC thermistor 6, makes a judgment, and then controls the output current and the current direction of the power supply 7.
The specific working principle of the heat radiation fixture provided by the present disclosure is as follows: as shown in fig. 3, the micro system 2 is welded on the motherboard 1, the heat dissipation clamp is sleeved above the micro system 2, and the micro system 2 and the clamp are clamped by four corner bolts to ensure heat conduction. The power supply 7 on the motherboard 1 supplies power to the TEC refrigerating plate 4, the MCU8 collects the resistance of the NTC thermistor 6, and the current of the TEC refrigerating plate 4 is adjusted through a built-in algorithm. In a high temperature environment, the heat of the micro system 2 is brought from the bottom to the top by the TEC refrigerating plate 4 to dissipate heat, and in a low temperature environment, the current direction of the TEC refrigerating plate 4 is changed, so that the micro system 2 is heated. This ensures that the microsystem 2 operates in a relatively isothermal environment.
In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description of the present invention, it should be understood that the terms "front," "back," "interior," "side," "bottom," "top," "side," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electrically controlled and thermostatted heat sink fixture, characterized by being applied to temperature control of a microsystem (2), the microsystem (2) being arranged on a motherboard (1), the heat sink fixture comprising:
the shell (3) forms a containing cavity (35), the shell (3) is detachably connected with the motherboard (1), and the microsystem (2) is limited in the containing cavity (35) after the shell (3) is assembled and fixed with the motherboard (1);
the TEC refrigerating sheet (4) is arranged on the surface of the shell (3), and the microsystem (2) positioned in the accommodating cavity (35) exchanges heat with the TEC refrigerating sheet (4) through the shell (3);
the temperature sensing element is arranged on the heat transfer path of the micro system (2) and the TEC refrigerating sheet (4) and generates a temperature signal which is used for representing real-time temperature information of the micro system (2) in the accommodating cavity (35);
the TEC refrigerating plate (4) adjusts output power according to the temperature signal so as to keep the temperature in the accommodating cavity (35) within a set range in a heating or radiating mode.
2. The electrically controlled, constant temperature heat sink clip of claim 1, further comprising:
the TEC refrigerating piece (4) is arranged between the shell (3) and the cover plate (5), and a first gold-plated conduction band is arranged on one surface of the cover plate (5) contacted with the TEC refrigerating piece (4);
the TEC refrigerating sheet (4) comprises a plurality of PN junctions (41), the surface of the shell (3) is provided with a second gold-plated conduction band (33), a plurality of PN junctions (41) are welded on the second gold-plated conduction band (33) on the surface of the shell (3) in series, all PN junctions (41) are connected in series through a first gold-plated conduction band arranged on the cover plate (5), and an anode and a cathode integrally formed after the PN junctions (41) are connected in series are led out through the second gold-plated conduction band (33) on the surface of the shell (3).
3. The electrically controlled, constant temperature heat sink fixture of claim 2 wherein said temperature sensing element comprises:
NTC thermistor (6), temperature signal is the resistance of NTC thermistor (6), NTC thermistor (6) set up in holding chamber (35), the wall of holding chamber (35) is equipped with third gilding conduction band (34), NTC thermistor (6) have first end and second end, and its first end and second end weld in third gilding conduction band (34) of holding chamber (35) wall to draw forth through third gilding conduction band (34).
4. An electrically controlled thermostatic heat sink fixture as claimed in claim 3, wherein the wall surface of said housing chamber (35) forms an auxiliary housing groove (31), said auxiliary housing groove (31) being in communication with the housing chamber (35), said NTC thermistor (6) being embedded in the auxiliary housing groove (31).
5. An electrically controlled thermostatic heat radiation fixture according to claim 3, characterized in that said housing (3) is provided with at least four fixing screw holes (32), said housing (3) being bolted to the motherboard (1) through the fixing screw holes (32);
wherein, the two fixing screw holes (32) are respectively connected with the positive electrode and the negative electrode which are integrally formed after being connected in series with the PN junction (41) through gold-plated conduction bands as power supply electrodes of the TEC refrigerating sheet (4);
the other two fixing screw holes (32) are used as electrode connection parts of the NTC thermistor (6) and are respectively connected with the first end and the second end of the NTC thermistor (6) through gold plating conduction bands.
6. An electrically controlled thermostatic heat sink clamp according to claim 2, characterized in that the housing (3) and cover plate (5) are made of a heat conducting ceramic material.
7. An electrically controlled thermostatic heat sink clamp according to claim 2, characterized in that the gap between the housing (3) and the cover plate (5) is filled with an insulating material.
8. The electrically controlled and constant temperature heat dissipation clamp according to claim 1, wherein a power supply (7) is arranged on the motherboard (1), and the power supply (7) is used for supplying power to the TEC refrigerating plate (4).
9. An electrically controlled thermostatic heat dissipation clamp according to claim 8, characterized in that said motherboard (1) is provided with:
and the MCU (8) receives the temperature signal and controls the power supply current provided by the power supply (7) to the TEC refrigerating sheet (4) according to the temperature signal.
10. The electrically controlled and thermostatted heat sink clamp of claim 1, wherein, when the temperature in the holding chamber (35) is higher than the set temperature range, the current in the TEC cooling plate (4) has a first flow direction, and the heat emitted by the microsystem (2) in the holding chamber (35) is transferred to the TEC cooling plate (4); when the temperature in the accommodating cavity (35) is lower than the set temperature range, the current in the TEC refrigerating sheet (4) has a second flow direction, and the TEC refrigerating sheet (4) heats the microsystem (2); wherein the first and second flow directions are opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311872570.5A CN117826957A (en) | 2023-12-29 | 2023-12-29 | Automatically controlled constant temperature's heat dissipation anchor clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311872570.5A CN117826957A (en) | 2023-12-29 | 2023-12-29 | Automatically controlled constant temperature's heat dissipation anchor clamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117826957A true CN117826957A (en) | 2024-04-05 |
Family
ID=90523947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311872570.5A Pending CN117826957A (en) | 2023-12-29 | 2023-12-29 | Automatically controlled constant temperature's heat dissipation anchor clamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117826957A (en) |
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2023
- 2023-12-29 CN CN202311872570.5A patent/CN117826957A/en active Pending
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