CN117825768A - Probe card, probe station and probe card application method - Google Patents

Abstract

The application relates to the field of wafer testing, aims at solving the problem of how to improve the signal quality of a probe card, and provides the probe card, a probe table and an application method of the probe card. The probe card includes a substrate and a connection board. The surface of the substrate is provided with a first bonding pad. The connecting plate is located the base plate and is close to one side of first pad, and the connecting plate is equipped with the second pad, and the second pad sets up with first pad relatively, and the second pad includes the contact pad, and the contact pad is constructed to switch on first pad or shielding first pad's structure, and the contact pad is when switching on first pad, and first pad electricity is connected in the signal plate of probe station, and the contact pad is when shielding first pad, and the contact pad replaces first pad and electrically connected in the signal plate of probe station. The probe card of the embodiment is conducted or shielded with the first bonding pad through the contact disc, and the contact disc can replace the first bonding pad and is electrically connected with the signal board of the probe station, so that the effect of rapidly improving the signal quality of the probe card is achieved.

Description

Probe card, probe station and probe card application method

Technical Field

The present application relates to the field of wafer testing, and in particular, to a probe card, a probe station, and a probe card application method.

Background

When the chip is subjected to telecommunications testing, for example WAT (Wafer Acceptance Test) or CP (circuit probing) testing. Taking CP (circuit probing) test as an example before packaging, the CP test device includes a tester and a probe station, through which the tester detects the chip. The probe station includes a probe card that is laminated from a multilayer printed wiring board. The size of the probe card and the internal signal wiring requirements are very strict, and the manufacturing period of the probe card is long and the manufacturing cost is high.

In the prior art, the internal circuit density of the probe card is high, the definition of signals is complex, and when the probe card has the conditions of signal errors and poor signal quality, the use of the probe card can be influenced. How to solve the technical problems is considered by the person skilled in the art.

Disclosure of Invention

The application provides a probe card, a probe station and a probe card application method, so as to solve the problem of how to improve the signal quality of the probe card.

In a first aspect, the present embodiment provides a probe card, including a substrate and a connection board. The surface of the substrate is provided with a first bonding pad. The connecting plate is located the base plate is close to one side of first pad, the connecting plate is equipped with the second pad, the second pad with first pad sets up relatively, the second pad includes the contact pad, the contact pad is constructed to switch on first pad or shielding first pad's structure, the contact pad is when switching on first pad, first pad electricity is connected in the signal plate of probe station, the contact pad shielding when first pad, the contact pad replace first pad and electrically connect in the signal plate of probe station.

Compared with the prior art, the probe card of the embodiment is provided with the connecting plate at one side of the substrate close to the first bonding pad, the connecting plate is provided with the second bonding pad, and the contact disc of the second bonding pad is constructed to be conducted with the first bonding pad or to be shielded with the first bonding pad, so that when the first bonding pad breaks down, the contact disc can replace the first bonding pad and is electrically connected with the signal board of the probe station, thereby achieving the effect of rapidly and conveniently improving the signal quality of the probe card.

In one possible embodiment, the contact pad includes a ring portion and a shielding portion, the shielding portion being separated from or connected to the ring portion, the contact pad shielding the first pad when the shielding portion is connected to the ring portion, and the contact pad conducting the first pad when the shielding portion is separated from the ring portion.

In one possible embodiment, the contact pad is provided with a through hole to form the ring portion, and the shielding portion is provided in the through hole when the shielding portion is connected to the ring portion, and the ring portion is integrally connected to the shielding portion.

In a possible embodiment, the contact pad is provided with a through hole to form the ring portion, and the shielding portion is provided in the through hole when the shielding portion is connected to the ring portion, and the shielding portion is detachably connected to the ring portion.

In one possible implementation manner, the shielding part comprises a shielding sheet and a connecting pin, the shielding sheet and the ring part are arranged at intervals, one end of the connecting pin is connected with the shielding sheet, the other end of the connecting pin is connected with the ring part, and the shielding sheet is electrically connected with the ring part through the connecting pin.

In one possible embodiment, the ring is solder-connected to the first pad when the shield is separated from the ring, the first pad being electrically connected to the signal board of the probe station through the ring.

In one possible embodiment, the ring portion includes a hole wall extending toward the first land, the hole wall being for filling with solder to electrically connect and secure the first land with the ring portion.

In one possible embodiment, the connection plates are provided with a plurality of layers, each layer of connection plates is provided with a via, the contact pads are electrically connected with signal lines, the signal lines pass through the via and extend between two adjacent layers of connection plates, and adjacent signal lines perpendicular to the direction of the substrate shield signals through the connection plates.

In one possible implementation manner, a plurality of contact pads are provided, the contact pads are electrically connected with signal wires, and the plurality of signal wires are respectively arranged on the connecting plate in a differential wiring mode.

In one possible embodiment, the connection board includes a first end portion and a second end portion integrally connected, the second end portion is disposed on a side of the contact pad away from the periphery of the substrate, the first end portion extends from the second end portion toward the periphery of the substrate, the second end portion has a width greater than that of the first end portion, the signal line extends from the first end portion toward the second end portion, and a terminal end of the signal line is electrically connected to the second end portion.

In a second aspect, the present embodiment further provides a probe station, including a signal board, a probe card, and a connector. The connecting plate of the probe card is arranged opposite to the signal plate. One end of the plug connector is electrically connected with the signal board, the other end of the plug connector protrudes towards the substrate of the probe card, the contact disc is electrically connected with the first bonding pad when the first bonding pad is conducted, and the plug connector is electrically connected with the contact disc when the contact disc is shielded by the first bonding pad.

In one possible embodiment, the shielding part is separated from or connected to the ring part, and when the shielding part is separated from the ring part, the ring part is electrically connected to the first pad by welding, and the connector is electrically connected to the first pad by the ring part. When the shielding part is connected with the ring part, the contact disc shields the first bonding pad, and the contact disc replaces the first bonding pad to be electrically connected with the plug connector.

In a third aspect, the present embodiment further provides a probe card application method, including providing a substrate of a probe card, where a surface of the substrate is provided with a first pad; arranging a connecting plate in the area of the corresponding first bonding pad, and when the contact plate of the connecting plate replaces the first bonding pad, shielding the first bonding pad by the contact plate of the connecting plate and electrically connecting the signal plate of the probe station; and when the first bonding pad needs to be conducted, the shielding part of the contact disc is disassembled so that the signal board of the probe station is electrically connected with the first bonding pad.

In one possible embodiment, a connector of the probe station is provided, the connector being in contact with a contact pad of the connection board so that the connection board is electrically connected to a signal board of the probe station instead of the first pad, or a shielding portion of the contact pad is detached so that the connector is in contact with the first pad so as to be electrically connected to the signal board of the probe station.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly describe the drawings in the embodiments, it being understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of a probe station according to one embodiment of the present application;

FIG. 2 is a top view of a portion of the components of a probe card according to one embodiment of the present application;

FIG. 3 is a schematic view of a first configuration of contact pads of the probe card of FIG. 2;

FIG. 4 is a schematic illustration of the probe card of FIG. 2 with the contact pads of the shield removed;

FIG. 5 is a schematic illustration of the contact pads of the probe card of FIG. 3 soldered together with first pads;

FIG. 6 is a schematic view of a second configuration of contact pads of the probe card of FIG. 2;

FIG. 7 is a schematic illustration of the contact pads of the probe card of FIG. 6 soldered together with first pads;

FIG. 8 is a perspective view of the contact pads of the probe card of FIG. 2 in use;

FIG. 9 is a schematic perspective view of the probe card of FIG. 2 with the contact pads of the shield removed for use;

FIG. 10 is a perspective view of the contact tray of the probe card of FIG. 5 in use;

FIG. 11 is a perspective view of the contact tray of the probe card of FIG. 7 in use;

FIG. 12 is a schematic diagram of a first routing method of signal lines of the probe card of FIG. 2;

FIG. 13 is a partial cross-sectional view of the signal lines of the probe card of FIG. 12 along line I-I;

fig. 14 is a schematic diagram of a second routing method of signal lines of the probe card of fig. 2.

1. A probe card; 11. a substrate; 111. a first bonding pad; 12. a connecting plate; 121. a second bonding pad; 122. a contact plate; 123. a ring portion; 1231. a through hole; 1232. a hole wall; 1233. solder paste; 124. a shielding part; 1241. a shielding sheet; 1242. a connecting pin; 125. a via hole; 126. a first end; 127. a second end; 128. a signal panel; 129. a fixed plate; 13. a signal line; 2. a probe station; 21. a signal board; 22. a plug-in component.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments.

Some embodiments of the present application are described in detail. The following embodiments and features of the embodiments may be combined with each other without collision.

In a first aspect, referring to fig. 1 and 2, the present embodiment provides a probe card 1 and a probe station 2. The probe card 1 includes a substrate 11 and a connection board 12. The surface of the substrate 11 is provided with first pads 111. The connection board 12 is disposed on one side of the substrate 11 near the first bonding pad 111, the connection board 12 is provided with a second bonding pad 121, the second bonding pad 121 is disposed opposite to the first bonding pad 111, the second bonding pad 121 includes a contact pad 122, the contact pad 122 is configured to conduct the first bonding pad 111 or to shield the first bonding pad 111, the first bonding pad 111 is electrically connected to the signal board 21 of the probe station 2 when the contact pad 122 conducts the first bonding pad 111, and the contact pad 122 replaces the first bonding pad 111 and is electrically connected to the signal board 21 of the probe station 2 when the contact pad 122 shields the first bonding pad 111.

In the present embodiment, the substrate 11 is provided with a plurality of first pads 111, and the plurality of first pads 111 are spaced apart. When the contact pad 122 is turned on to the first pad 111, the first pad 111 is electrically connected to the signal board 21 of the probe station 2, signals of the signal board 21 are sent to the sample to be tested through the first pad 111, signals corresponding to the test result are returned to the signal board 21 of the probe station 2 through the first pad 111, and then the signals are returned to the testing machine to complete the test. When the contact pad 122 shields the first pad 111, the first pad 111 is not electrically connected to the signal board 21 of the probe station 2, and the contact pad 122 is electrically connected to the signal board 21 of the probe station 2 instead of the first pad 111.

The connection board 12 may be a flexible circuit board, and the connection board 12 may also be other hard circuit boards, which is not limited in this embodiment. The connection board 12 is manufactured with reference to the position of the first pad 111 of the substrate 11, and in some cases, the first pad 111 may have a signal error or a signal quality failure, or the first pad 111 may have a good quality, but the first pad 111 is required to transmit a high-speed signal, and all or part of the first pad 111 of the substrate 11 is covered by the connection board 12 to flexibly provide the connection board 12, which is not limited in this application.

The connection plate 12 is provided with a plurality of second pads 121, the second pads 121 including contact pads 122, signal pads 128 and fixing pads 129.

The contact pads 122 are in one-to-one correspondence with the first pads 111 along a direction perpendicular to the substrate 11, and an outer contour of the contact pads 122 may be circular, and a diameter of the contact pads 122 is greater than or equal to a diameter of the first pads 111, so that the contact pads 122 completely cover the first pads 111 along the direction perpendicular to the substrate 11.

The signal pad 128 is spaced from the contact pad 122, and when the contact pad 122 shields the first pad 111, one end of the signal pad 128 is electrically connected to the contact pad 122, and the other end is electrically connected to the signal plate 21 of the probe station 2, so that the contact pad 122 communicates with the signal plate 21 of the probe station 2. By dispensing glue in the fixing plate 129 to fixedly connect the connection plate 12 with the substrate 11, and insulating the fixing plate 129 from the substrate 11, it is advantageous to reduce warp deformation of the connection plate 12 when the contact plate 122 replaces the first pad 111 and is electrically connected to the signal plate 21 of the probe station 2. The fixing plate 129 is disposed at the middle or the periphery of the connection plate 12, which is advantageous for firmly connecting the connection plate 12 with the base plate 11.

The probe card 1 of the present embodiment is provided with the connecting board 12 on one side of the substrate 11 near the first bonding pad 111, the connecting board 12 is provided with the second bonding pad 121, and the contact pad 122 of the second bonding pad 121 is configured to be conducted with the first bonding pad 111 or shielded from the first bonding pad 111, so that when the first bonding pad 111 fails, the contact pad 122 can replace the first bonding pad 111 and be electrically connected to the signal board 21 of the probe station 2, so as to quickly and conveniently improve the signal quality of the probe card 1.

In an embodiment, referring to fig. 3 and 4, the contact pad 122 includes a ring portion 123 and a shielding portion 124, the shielding portion 124 is separated from or connected to the ring portion 123, when the shielding portion 124 is connected to the ring portion 123, the contact pad 122 shields the first bonding pad 111, and when the shielding portion 124 is separated from the ring portion 123, the contact pad 122 conducts the first bonding pad 111.

The shielding part 124 is connected with the ring part 123 to physically shield the first pad 111, so that the first pad 111 and the signal board 21 of the probe station 2 cannot transmit signals, and the contact pad 122 is electrically connected with the signal board 21 of the probe station 2 to transmit signals; the shielding portion 124 is separated from the ring portion 123 so that the first pads 111 are exposed to the connection board 12, and the first pads 111 can be electrically connected to the signal board 21 of the probe station 2 to transmit signals.

In the present embodiment, the contact pad 122 has two kinds of structures designed to form two kinds of contact pads 122.

Embodiment of the first modality of the contact tray 122:

in one embodiment, the contact pad 122 is provided with a through hole 1231 to form the ring portion 123, and when the shielding portion 124 is connected to the ring portion 123, the shielding portion 124 is disposed in the through hole 1231, and the ring portion 123 is integrally connected to the shielding portion 124.

Referring to fig. 3 to 5, in the present embodiment, the contact pad 122 has three structures: the shielding portion 124 is integral with the ring portion 123, and the shielding portion 124 shields the first pad 111; the shielding portion 124 is cut away, leaving the ring portion 123, and the first pad 111 is exposed at this time; the shielding portion 124 is cut away, leaving the ring portion 123, and the ring portion 123 is soldered to the first pad 111 by solder (e.g., solder paste). The three structures of the contact pad 122 correspond to alternative conduction modes:

in a first manner, as shown in fig. 3 and 8, the contact pad 122 may be a single-sided solid pad, and the contact pad 122 is a solid sheet body made of an insulating material near the first pad 111, so as to be used for shielding the first pad 111; the contact pad 122 is a conductive material at a position distant from the first pad 111 for electrically connecting signals. Specifically, the ring portion 123 of the contact pad 122 is integrally connected with the shielding portion 124, so that the contact pad 122 shields the first pad 111, and the contact pad 122 is not conductive to the signal of the first pad 111; the contact pad 122 contacts the socket 22 of the probe station 2 to conduct signals, so that the contact pad 122 replaces the first pad 111 and is electrically connected to the signal board 21 of the probe station 2.

In a second way, as shown in fig. 4 and 9, the contact pad 122 may be a hollow pad without a hole wall 1232, where the ring portion 123 of the contact pad 122 is separated from the shielding portion 124, so that the contact pad 122 conducts the first pad 111, and the contact pad 122 is not conducted with the signal of the first pad 111; at this time, the first pads 111 are directly in contact with the connectors 22 of the probe stage 2 to conduct signals, so that the first pads 111 are electrically connected to the signal board 21 of the probe stage 2. Alternatively, the contact pad 122 is soldered to the first pad 111 for fixing the contact pad 122, and the first pad 111 is conducted with the contact pad 122 by soldering, and the socket 22 of the probe station 2 contacts the contact pad 122 to conduct the first pad 111.

In a third way, as shown in fig. 5 and 10, the contact pad 122 may be a hollow pad with a hole wall 1232, the hole wall 1232 has a circular cross-section, one end of the hole wall 1232 is connected to the ring portion 123, and the other end extends to the first pad 111, and the first pad 111 is electrically connected to the ring portion 123 by filling the hole wall 1232 with a solder; the cross-sectional shape of the hole wall 1232 may be rectangular or rectangular, as long as the hole wall 1232 can accommodate solder. Preferably, the cross-sectional shape of the aperture wall 1232 is circular for ease of manufacturing. At this time, the ring portion 123 of the contact pad 122 is separated from the shielding portion 124, the contact pad 122 is soldered to the first pad 111 to be electrically connected, and the socket 22 of the probe station 2 contacts the contact pad 122, and at this time, the first pad 111 is electrically connected to the signal board 21 of the probe station 2 through the contact pad 122. The hole wall 1232 is used for containing welding materials, which is beneficial to the leveling of the welding surface between the two plates.

The contact pad 122 may be a hollow pad without a hole wall 1232, in which case the ring portion 123 of the contact pad 122 is separated from the shielding portion 124, and the first pad 111 and the ring portion 123 are soldered together by solder to be electrically connected.

It should be noted that, the contact pad 122 may correspond to different signal types of the substrate 11, for example, the contact pad 122 of the first mode corresponds to a test signal of the first pad 111 with a signal error or a signal quality failure; the contact pad 122 of the second mode corresponds to the test signal of the first pad 111 without problem, or the contact pad 122 of the second mode is electrically connected to the power signal or the ground signal; the third mode of contact pad 122 is electrically connected to the power signal or the ground signal, so that the third mode of contact pad 122 can be electrically connected to the general signal after soldering, so as to reduce the influence on the test signal.

The arrangement of the plurality of contact pads 122 on the surface of the connection plate 12 may be: contact pads 122 for test signals are provided between adjacent contact pads 122 for power signals or ground signals, thus facilitating the return path arrangement of signals for the connection board 12.

In use, when a signal of a partial region of the substrate 11 is problematic, the contact pad 122 shields the first pad 111, and the second pad 121 corresponding to the connection board 12 replaces the partial region of the first pad 111; when the signal of the partial region of the substrate 11 is not problematic, the contact pad 122 conducts the first pad 111, so that the signal board 21 of the probe station 2 continues to use the signal of the first pad 111 through the second pad 121.

The probe card 1 provided in this embodiment does not need to be reassembled, shortens the production time of the probe card 1, reduces the cost, and improves the test performance.

An embodiment of the second aspect of the second pad 121:

in one embodiment, the contact pad 122 is provided with a through hole 1231 to form the ring portion 123, and when the shielding portion 124 is connected to the ring portion 123, the shielding portion 124 is disposed in the through hole 1231, and the shielding portion 124 is detachably connected to the ring portion 123.

In this embodiment, referring to fig. 4 to 11, the contact pad 122 has three structures: the shielding portion 124 is detachably connected to the ring portion 123, and the shielding portion 124 shields the first pad 111; removing the shielding portion 124 from the ring portion 123, while the first pads 111 are exposed from the connection board 12; the shielding portion 124 is detached from the ring portion 123, and the ring portion 123 and the first pad 111 are soldered by solder (e.g., solder paste). The second pad 121 has three alternative conduction modes:

in a first manner, referring to fig. 6 and 11, the contact pad 122 may be a single-sided pad, and the contact pad 122 is a solid sheet body made of an insulating material near the first pad 111, so as to be used for shielding the first pad 111; the contact pad 122 is a conductive material at a position distant from the first pad 111 for electrically connecting signals. Specifically, the shielding portion 124 includes a shielding plate 1241 and a connecting pin 1242, the shielding plate 1241 is spaced from the ring portion 123, one end of the connecting pin 1242 is connected to the shielding plate 1241, the other end is connected to the ring portion 123, and the shielding plate 1241 is electrically connected to the ring portion 123 through the connecting pin 1242. The connector 22 of the probe stage 2 is in contact with the shielding portion 124, and a signal is transmitted through the second pad 121.

The connection pins 1242 are sheet-shaped, and 1 or more connection pins 1242 may be provided, and the number of connection pins 1242 is not limited in this embodiment. Taking 4 connection pins 1242 as an example, an inner angle formed between two adjacent connection pins 1242 and a connecting line of a circle center is 90 degrees, and the 4 connection pins 1242 are uniformly distributed in the circumferential direction of the shielding sheet 1241, so that the shielding sheet 1241 and the ring part 123 are firmly and stably connected together.

In the second embodiment, referring to fig. 4 and 9, when the shielding portion 124 is separated from the ring portion 123, the first pad 111 is electrically connected to the signal board 21 of the probe station 2.

The contact pads 122 may be contacted with the first pads 111 by cutting the connection pins 1242 to remove the shielding pieces 1241, and the connectors 22 of the probe station 2 may be contacted with the first pads 111 through the ring portion 123, and signals may be transferred through the first pads 111.

In the third embodiment, the ring 123 is soldered to the first pad 111, and the first pad 111 is electrically connected to the signal board 21 of the probe stage 2 through the ring 123.

Alternatively, as shown in fig. 7 and 11, the contact pad 122 is not required to cut the connection pin 1242, the shielding piece 1241 is soldered to the first pad 111 by the solder paste 1233, and the shielding piece 1241 is soldered to the first pad 111 and the ring 123 is soldered to the first pad 111 by the solder paste 1233.

Alternatively, the contact pad 122 cuts off the connection pin 1242, and the solder is filled between the ring portion 123 and the first pad 111, thereby conducting the first pad 111 and the second pad 121.

In one embodiment, the ring 123 includes a hole wall 1232, the hole wall 1232 extends toward the first pad 111, and the hole wall 1232 is used to fill with solder to electrically connect and fix the first pad 111 and the ring 123.

It should be noted that, the contact pads 122 of the second aspect may correspond to different signal types of the substrate 11, for example, the contact pads 122 of the first aspect correspond to test signals of the first pads 111 having signal errors or poor signal quality; the contact pad 122 of the second mode corresponds to the test signal of the first pad 111 without problem, or the contact pad 122 of the second mode is electrically connected to the power signal or the ground signal; the third mode of the contact pad 122 is electrically connected to a power signal or a ground signal, so that the third mode of the contact pad 122 can be electrically connected to a general signal after soldering, so as to reduce the influence on the test signal, and meanwhile, the connection strength between the contact pad 122 and the first pad 111 can be increased after soldering.

The arrangement of the plurality of contact pads 122 on the surface of the connection plate 12 may be: contact pads 122 for test signals are provided between adjacent contact pads 122 for power signals or ground signals, thus facilitating the return path arrangement of signals for the connection board 12.

In one embodiment, as shown in fig. 12 to 14, the connection board 12 is provided with a plurality of layers, each layer of connection board 12 is provided with a via 125, and the contact pad 122 is electrically connected to the signal line 13. Alternatively, the signal line 13 has two routing modes.

As shown in fig. 12 and 13, in the first routing manner of the signal lines 13, the signal lines 13 pass through the vias 125 and extend between two adjacent layers of connection plates 12, and the adjacent signal lines 13 perpendicular to the direction of the substrate 11 are shielded from signals by the connection plates 12.

In the present embodiment, the differential signal is transmitted to the signal lines 13 through the second pads 121, and is transmitted to the two pads provided along the edge of the connection board 12 through the signal lines 13, respectively, wherein the signal lines 13 are provided between the adjacent pads. When the differential signal is transmitted in this way, the distance between the signal wires 13 at the second bonding pad 121 is shorter, the coupling between the wires of the signal wires 13 is ensured, the anti-interference capability of the signal wires 13 in signal transmission is improved, and the opposite polarity of the magnetic field is fully utilized to counteract the electromagnetic interference to the outside.

Referring to fig. 14, in the second routing manner of the signal lines 13, a plurality of contact pads 122 are provided, the signal lines 13 are electrically connected to the contact pads 122, and the plurality of signal lines 13 are respectively disposed on the connection board 12 in a differential routing manner.

In the present embodiment, the contact pad 122 is the first mode, the contact pad 122 is electrically connected to the signal pad 128 through a signal line, and the signal in the signal line 13 is the test signal.

In an embodiment, please continue to refer to fig. 14, the connection board 12 includes a first end 126 and a second end 127 integrally connected, the second end 127 is disposed on a side of the contact pad 122 away from the periphery of the substrate 11, the first end 126 extends from the second end 127 toward the periphery of the connection board 12, the width of the second end 127 is larger than that of the first end 126, the signal line 13 extends from the first end 126 toward the second end 127, and the end of the signal line 13 is electrically connected to the second end 127.

In this embodiment, the connection board 12 is a multi-layer board, with a first end 126 provided with contact pads 122 and a second end 127 provided with signal pads 128. A set of differential signals is transmitted through the second pads 121 to the signal lines 13, and through the signal lines 13 to two signal pads 128 directed toward the center along the edge of the probe card 1, respectively, wherein the signal lines 13 are disposed between adjacent pads. When the differential signal is required to be transmitted, the differential signal is transmitted according to the direction from the edge to the center of the substrate 11, and when the single-wire signal is required to be transmitted, the single-wire signal can be transmitted, and the signal transmission mode is flexible. Meanwhile, the second end portion 127 has a larger width than the first end portion 126, which is advantageous for arrangement of the signal panels 128, and for centralized connection of the plurality of signal wires 13.

In a second aspect, referring to fig. 1, the present embodiment further provides a probe station 2, which includes a signal board 21, a probe card 1 and a connector 22. The connection board 12 of the probe card 1 is disposed opposite to the signal board 21. One end of the plug 22 is electrically connected to the signal board 21, the other end protrudes toward the substrate 11 of the probe card 1, the contact pad 122 is electrically connected to the first pad 111 when the first pad 111 is turned on, and the plug 22 is electrically connected to the contact pad 122 when the contact pad 122 is shielded by the first pad 111.

In this embodiment, the plug 22 may be a pogo pin or a pin hole plug. The present embodiment is not limited thereto. The spring pins are telescopically connected with the signal plate 21. The pinhole plug is fixedly connected with the signal board 21.

In one embodiment, the contact pad 122 includes a ring portion 123 and a shielding portion 124, the shielding portion 124 is separated from or connected to the ring portion 123, and when the shielding portion 124 is separated from the ring portion 123, the contact pad 122 conducts the first bonding pad 111, and the plug 22 passes through the ring portion 123 and is electrically connected to the first bonding pad 111.

The ring portion 123 may be electrically connected to the first pad 111 by soldering, and the socket 22 may be electrically connected to the first pad 111 by the contact pad 122. When the shielding portion 124 is connected to the ring portion 123, the contact pad 122 shields the first pad 111, and the contact pad 122 is electrically connected to the connector 22 instead of the first pad 111.

In a third aspect, the present embodiment further provides a probe card application method applied to the probe station shown in fig. 1, and in combination with fig. 1 to 11, the application method includes providing a substrate 11 of the probe card 1, where a surface of the substrate 11 is provided with a first pad 111. The connection board 12 is provided in the region of the corresponding first pad 111, and when the contact pad 122 of the connection board replaces the first pad 111, the contact pad 122 of the connection board 12 shields the first pad 111 and electrically connects the signal board 21 of the probe station 2. When the first pad 111 needs to be turned on, the shielding portion 124 of the contact pad 122 is detached so that the signal board 21 of the probe station 2 is electrically connected to the first pad 111.

In this embodiment, when testing the first pads 111 at certain positions according to actual needs, when the signals of the first pads 111 are in a fault state, a connection board 12 is disposed on a side of the substrate 11 of the probe card 1 close to the first pads 111, where the contact pads 122 of the connection board 12 replace the first pads 111 whose signals are in a fault state, specifically, a structure that the shielding portions 124 of the contact pads 122 are connected to the ring portions 123 is adopted, so that the contact pads 122 replace the first pads 111 and are electrically connected to the signal board 21 of the probe station 2; when the signal of the first pad 111 is in a fault-free state, the shielding portion 124 of the contact pad 122 is separated from the ring portion 123, and the first pad 111 is electrically connected to the signal board 21 of the probe station 2 through the contact pad 122. The detailed structure can be seen in fig. 8 and 9, and will not be described here again.

When the first pad 111 needs to be tested, the shielding portion 124 of the contact pad 122 at the corresponding position may be removed to perform the signal test on the first pad 111 by using the contact pad 122 of the second aspect. If the signal of the first pad 111 is in a fault state, the shielding portion 124 is connected to the ring portion 123 so that the contact pad 122 is electrically connected to the signal board 21 of the probe station 2 instead of the first pad 111, and in particular, an insulating adhesive is added to the shielding portion 124 and the position of the first pad 111 corresponding to the shielding portion, so that the contact pad 122 is ensured not to warp when used instead of the first pad 111; in the case where the signal of the first pad 111 is in a fault-free state, the shielding portion 124 of the contact pad 122 is separated from the ring portion 123, that is, the connection pin 1242 between the shielding portion 124 and the ring portion 123 can be disconnected, and the first pad 111 is electrically connected to the signal board of the probe station 2 through the contact pad 122. The detailed structure can be seen in fig. 6, and will not be described again here. When the first pad 111 is required to transmit a high-speed signal, if a signal to be tested by the first pad 111 for transmitting a high-speed signal is in a failure state, the first or second contact pad 122 is used, and the first pad 111 is replaced by the contact pad 122 to be directly connected to the high-speed signal.

In one embodiment, the connector 22 of the probe station 2 is provided, and the connector 22 is contacted with the contact pad 122 of the connection board 12 to make the connection board 12 electrically connected to the signal board 21 of the probe station 2 instead of the first pad 111, or the shielding portion 124 of the contact pad 122 is removed, so that the connector 22 is contacted with the first pad 111 to be electrically connected to the signal board 21 of the probe station 2.

The above embodiments are only for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims (13)

1. A probe card, comprising:

a substrate, the surface of which is provided with a first bonding pad;

the connecting plate is arranged on one side of the substrate, which is close to the first bonding pad, the connecting plate is provided with a second bonding pad, the second bonding pad is arranged opposite to the first bonding pad, the second bonding pad comprises a contact disc, the contact disc is configured to conduct the first bonding pad or shield the structure of the first bonding pad, the first bonding pad is electrically connected with a signal board of a probe station when the contact disc is conducted with the first bonding pad, and the contact disc replaces the first bonding pad and is electrically connected with the signal board of the probe station when the contact disc is shielded with the first bonding pad.

2. The probe card of claim 1, wherein:

the contact pad comprises a ring part and a shielding part, wherein the shielding part is separated from or connected with the ring part, when the shielding part is connected with the ring part, the contact pad shields the first bonding pad, and when the shielding part is separated from the ring part, the contact pad conducts the first bonding pad.

3. The probe card of claim 2, wherein:

the contact plate is provided with a through hole so as to form the ring part, and when the shielding part is connected with the ring part, the shielding part is arranged on the through hole and is detachably connected with the ring part.

4. A probe card according to claim 3, wherein:

the shielding part comprises a shielding sheet and connecting pins, wherein the shielding sheet and the ring part are arranged at intervals, one end of each connecting pin is connected with the shielding sheet, the other end of each connecting pin is connected with the ring part, and the shielding sheet is electrically connected with the ring part through the connecting pins.

5. The probe card of claim 2, wherein:

when the shielding part is separated from the ring part, the ring part is connected with the first bonding pad in a welding way, and the first bonding pad is electrically connected with the signal board of the probe station through the ring part.

6. The probe card of claim 5, wherein:

the ring includes a hole wall extending toward the first land, the hole wall being for filling with solder to electrically connect and secure the first land with the ring.

7. The probe card of claim 1, wherein:

the connecting plate is provided with a plurality of layers, each layer of connecting plate is provided with a via hole, the contact disc is electrically connected with a signal wire, the signal wire passes through the via holes and extends between two adjacent layers of connecting plates, and the adjacent signal wires perpendicular to the direction of the substrate shield signals through the connecting plates.

8. The probe card of claim 1, wherein:

the contact disc is provided with a plurality of contact discs, the contact disc is electrically connected with signal wires, and the plurality of signal wires are respectively arranged on the connecting plate in a differential wiring mode.

9. The probe card of claim 7 or 8, wherein:

the connecting plate comprises a first end part and a second end part which are integrally connected, the second end part is arranged on one side, far away from the periphery of the substrate, of the contact disc, the first end part extends from the second end part towards the periphery of the substrate, the width of the second end part is larger than that of the first end part, the signal wire extends from the first end part towards the second end part, and the tail end of the signal wire is electrically connected with the second end part.

10. A probe station, comprising:

a signal board;

the probe card of any one of claims 1 to 9, a connection plate of the probe card being disposed opposite the signal plate;

and one end of the plug connector is electrically connected with the signal board, the other end of the plug connector protrudes towards the substrate of the probe card, the plug connector is electrically connected with the first bonding pad when the first bonding pad is conducted, and the plug connector is electrically connected with the contact disc when the contact disc is shielded by the first bonding pad.

11. A probe station as recited in claim 10, wherein:

the contact disc comprises a ring part and a shielding part, the shielding part is separated from or connected with the ring part, when the shielding part is separated from the ring part, the ring part is electrically connected with the first bonding pad through welding, and the plug connector is electrically connected with the first bonding pad through the ring part;

when the shielding part is connected with the ring part, the contact disc shields the first bonding pad, and the contact disc replaces the first bonding pad to be electrically connected with the plug connector.

12. A method of probe card application, comprising:

providing a substrate of a probe card, wherein a first bonding pad is arranged on the surface of the substrate;

arranging a connecting plate in the area of the corresponding first bonding pad, and when the contact plate of the connecting plate replaces the first bonding pad, shielding the first bonding pad by the contact plate of the connecting plate and electrically connecting the signal plate of the probe station;

and when the first bonding pad needs to be conducted, the shielding part of the contact disc is disassembled so that the signal board of the probe station is electrically connected with the first bonding pad.

13. The probe card application method as claimed in claim 12, wherein:

providing a plug connector of the probe station, wherein the plug connector is contacted with a contact disc of the connecting plate so that the connecting plate replaces the first bonding pad to be electrically connected with a signal board of the probe station, or disassembling a shielding part of the contact disc so that the plug connector is contacted with the first bonding pad to be electrically connected with the signal board of the probe station.