CN117790374A - Semiconductor refrigerator grain cleaning device, semiconductor refrigerator grain cleaning method, electronic equipment and storage medium - Google Patents

Abstract

The utility model relates to a semiconductor refrigerator crystal grain cleaning device, a method, electronic equipment and a storage medium, wherein an electric cabinet is provided with a control module and an operation time sequence storage module, the control module controls a movement module to adjust the relative position of a cleaning clamp and a cleaning tank according to the preset operation time sequence stored by the operation time sequence storage module, so that each semiconductor refrigerator crystal grain clamped by the cleaning clamp is soaked in cleaning liquid stored in the cleaning tank, and the cleaning clamp and each semiconductor refrigerator crystal grain clamped by the cleaning clamp are separated from the cleaning liquid. The cleaning process is completed automatically by the equipment without binding operators, so that the manpower resource is saved greatly; compared with the traditional manual cleaning, the cleaning efficiency is greatly improved by at least 50% or even multiple level improvement; the non-uniformity of traditional manual cleaning can be avoided, so that the semiconductor refrigerator crystal grains have higher uniformity in cleaning, and poor products caused by cleaning procedures are avoided.

Description

Semiconductor refrigerator grain cleaning device, semiconductor refrigerator grain cleaning method, electronic equipment and storage medium

Technical Field

The present application relates to the field of die cleaning, and in particular, to a semiconductor refrigerator die cleaning apparatus, a semiconductor refrigerator die cleaning method, an electronic device, and a storage medium.

Background

The conventional process for cleaning the die, i.e., the wafer, is mainly performed manually, and is exemplified by the die cleaning of a semiconductor refrigerator (TEC), which is briefly described as follows: firstly, three cleaning boxes A, B, C with proper volumes are prepared, proper cleaning solutions are respectively poured into the three cleaning boxes, the cut wafers are firstly placed into the box A for soaking, and an alarm clock is turned on to set proper time. When the alarm clock rings, the forceps are used for clamping and putting the box B into the box B for soaking, and the alarm clock is initialized. The soaking is completed when ringing, then the C box is clamped to be soaked, the alarm clock is initialized, and the wafer is taken out to be dried when ringing.

As can be seen from the above flow, the conventional crystal grain cleaning process requires binding operators, requires a fixed person to wait for an alarm clock signal every time the soaking time is strictly required, and needs to be operated immediately once the alarm rings; this also causes a problem of a small throughput, that is, when a plurality of wafers, for example, four or more wafers are immersed at a time, the wafer immersing time for later chucking is too long, resulting in poor cleaning, and inconvenient operation.

Disclosure of Invention

Accordingly, it is desirable to provide a semiconductor refrigerator die cleaning apparatus, method, electronic device, and storage medium.

In one embodiment, a semiconductor refrigerator die cleaning device comprises a cleaning clamp, a cleaning tank, a motion module and an electric cabinet;

the cleaning clamp is arranged on the motion module and is provided with at least two clamping positions, and each clamping position clamps a semiconductor refrigerator crystal grain to be cleaned;

the motion module is in conductive connection with the electric cabinet, the electric cabinet is provided with a control module and an operation time sequence storage module, and the control module controls the motion module to adjust the relative positions of the cleaning clamp and the cleaning tank according to the preset operation time sequence stored by the operation time sequence storage module, so that the semiconductor refrigerator crystal grains clamped by the cleaning clamp are soaked in the cleaning liquid stored in the cleaning tank, and the cleaning clamp and the semiconductor refrigerator crystal grains clamped by the cleaning clamp are separated from the cleaning liquid.

According to the semiconductor refrigerator grain cleaning device, a plurality of semiconductor refrigerator grains can be cleaned at one time, and the operation is sequentially performed by adopting the preset operation time sequence, so that on one hand, the cleaning process is completely and automatically completed by equipment without binding operators, the manpower resources are greatly saved, and the operators are also protected from being far away from cleaning liquid; on the other hand, compared with the traditional manual cleaning, the cleaning efficiency is greatly improved by at least 50% or even multiple level improvement; on the other hand, the non-uniformity of the traditional manual cleaning can be avoided, so that the semiconductor refrigerator crystal grains have higher uniformity in cleaning, and the defect of products caused by the cleaning procedure is avoided.

In one embodiment, the electric cabinet is further provided with an indication module electrically connected with the control module; and, in addition, the processing unit,

the electric cabinet is also provided with a soaking timing module connected with the control module, and is used for accumulating the using time of the cleaning liquid and controlling the indication module to send out prompt information of cleaning liquid replacement through the control module when the using time reaches a preset time threshold; and/or, the semiconductor refrigerator grain cleaning device further comprises a detection module, wherein the detection module is arranged on the motion module and is in conductive connection with the control module, and the detection module is used for controlling the indication module to send out abnormal prompt information of the cleaning liquid through the control module when the cleaning liquid stored in the cleaning tank is abnormal.

In one embodiment, the cleaning fixture comprises a reciprocating half-turn driver, a rotating shaft and a chuck, wherein each clamping position is arranged on the chuck and is regularly arranged in a matrix;

the reciprocating type half-rotation driver is in conductive connection with the electric cabinet, and drives the clamp to rotate 180 degrees around the rotating shaft in a reciprocating manner after the clamp disc enters the cleaning tank each time, so that the semiconductor refrigerator crystal grains which enter the cleaning tank first are taken out from the cleaning tank after being soaked; or,

The motion module is a two-dimensional motion mechanism and is used for enabling the cleaning clamp to move up and down relative to the cleaning tank to enter and exit the cleaning tank and enabling the cleaning clamp to move left and right relative to the cleaning tank to align or leave the cleaning tank; or,

the cleaning clamp or the chuck thereof is provided with two side surfaces which are arranged in opposite directions, and each side surface is provided with at least two clamping positions.

In one embodiment, the semiconductor refrigerator grain cleaning device further includes a control terminal, the control terminal is electrically connected with the electric cabinet, and the control terminal is used for sending a control signal to the control module and sending the preset operation time sequence to the operation time sequence storage module; or,

the semiconductor refrigerator grain cleaning device further comprises a frame, and the cleaning tank, the motion module and the electric cabinet are respectively arranged on the frame.

Further, in one embodiment, the housing of the electric cabinet and the frame are integrally disposed, and the cleaning tank and the motion module are respectively disposed on the housing of the electric cabinet.

In one embodiment, the cleaning tank includes three tanks arranged side by side, and the motion module sequentially adjusts the relative positions of the cleaning clamp and the three tanks, so that each semiconductor refrigerator grain clamped by the cleaning clamp is respectively soaked in the cleaning liquid stored in the three tanks in sequence.

In one embodiment, the cleaning tank further comprises a chassis and a sealing cover, wherein the sealing cover is rotatably arranged on the chassis and forms an enclosing area together with the chassis, and the three tank bodies are regularly arranged on the chassis and are positioned in the enclosing area;

the sealing cover is provided with a through groove, and the movement module penetrates through the through groove and is movably arranged in the through groove, so that the relative positions of the cleaning clamp and the three groove bodies are adjusted in the enclosing area.

Further, in one embodiment, the chassis is provided with an overflow liquid collecting pipe for collecting the cleaning liquid dropped from the gaps of the three tanks and delivering the cleaning liquid to the recovery container.

In one embodiment, a method for cleaning a semiconductor refrigerator die includes the steps of:

s100, clamping each semiconductor refrigerator grain to be cleaned on a clamping position of a cleaning clamp;

s200, setting a preset operation time sequence;

s300, judging whether the cleaning liquid stored in the cleaning tank is available or not, and executing S400 if the cleaning liquid stored in the cleaning tank is available;

s400, controlling a motion module to adjust the relative positions of the cleaning clamp and the cleaning tank by the control module according to the preset operation time sequence so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the cleaning tank;

S500, the control module controls the motion module to adjust the relative positions of the cleaning clamp and the cleaning tank according to the preset operation time sequence so as to separate the semiconductor refrigerator crystal grains from the cleaning liquid.

In one embodiment, in step S400, the control module controls the motion module to adjust the relative position of the cleaning clamp and the first tank body of the cleaning tank according to the preset operation time sequence, so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the tank body;

in step S500, the control module controls the motion module to adjust the relative position of the cleaning clamp and the tank body according to the preset operation time sequence, so that each semiconductor refrigerator grain is separated from the cleaning liquid;

after step S500, the method further includes the steps of:

s600, judging whether cleaning is completed, otherwise executing S700;

s700, the control module controls the motion module to adjust the relative position of the cleaning clamp and the next tank body of the cleaning tank according to the preset operation time sequence so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the next tank body; execution returns to S500.

In one embodiment, an electronic device includes a memory storing a computer program and a processor that when executing the computer program performs the steps of the semiconductor refrigerator die cleaning method of any of the embodiments.

In one embodiment, a computer readable storage medium stores a computer program, wherein the computer program when executed by a processor implements the steps of the semiconductor refrigerator die cleaning method of any of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of an embodiment of a semiconductor refrigerator die cleaning apparatus according to the present application.

Fig. 2 is a schematic view of a part of the structure of the embodiment shown in fig. 1.

Fig. 3 is a schematic structural view of another embodiment of the semiconductor refrigerator die cleaning apparatus described in the present application.

Fig. 4 is a flow chart of an embodiment of a method for cleaning a semiconductor refrigerator die according to the present application.

Fig. 5 is a flow chart of another embodiment of a method for cleaning semiconductor refrigerator dies according to the present application.

Reference numerals: semiconductor refrigerator grain cleaning device 100, cleaning jig 200, cleaning tank 300, motion module 400, electric cabinet 500, control terminal 600, clamping position 210, mounting plate 220, first cell 310, second cell 320, third cell 330, first direction movement module 410, second direction movement module 420, and mounting position 510.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used in the description of the present application for purposes of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be a direct contact of the first feature with the second feature, or an indirect contact of the first feature with the second feature via an intervening medium. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" as used in the specification of this application includes any and all combinations of one or more of the associated listed items.

The application discloses a semiconductor refrigerator grain cleaning device, a semiconductor refrigerator grain cleaning method, electronic equipment and a storage medium, wherein the semiconductor refrigerator grain cleaning device comprises part of technical features or all of the technical features of the following embodiments; that is, the semiconductor refrigerator die cleaning device includes a part of or all of the following structures. In one embodiment of the application, a semiconductor refrigerator grain cleaning device comprises a cleaning clamp, a cleaning tank, a motion module and an electric cabinet; the cleaning clamp is arranged on the motion module and is provided with at least two clamping positions, and each clamping position clamps a semiconductor refrigerator crystal grain to be cleaned; the motion module is in conductive connection with the electric cabinet, the electric cabinet is provided with a control module and an operation time sequence storage module, and the control module controls the motion module to adjust the relative positions of the cleaning clamp and the cleaning tank according to the preset operation time sequence stored by the operation time sequence storage module, so that the semiconductor refrigerator crystal grains clamped by the cleaning clamp are soaked in the cleaning liquid stored in the cleaning tank, and the cleaning clamp and the semiconductor refrigerator crystal grains clamped by the cleaning clamp are separated from the cleaning liquid. According to the semiconductor refrigerator grain cleaning device, a plurality of semiconductor refrigerator grains can be cleaned at one time, and the operation is sequentially performed by adopting the preset operation time sequence, so that on one hand, the cleaning process is completely and automatically completed by equipment without binding operators, the manpower resources are greatly saved, and the operators are also protected from being far away from cleaning liquid; on the other hand, compared with the traditional manual cleaning, the cleaning efficiency is greatly improved by at least 50% or even multiple level improvement; on the other hand, the non-uniformity of the traditional manual cleaning can be avoided, so that the semiconductor refrigerator crystal grains have higher uniformity in cleaning, and the defect of products caused by the cleaning procedure is avoided.

The semiconductor refrigerator die cleaning apparatus, method, electronic device, and storage medium will be described in detail with reference to fig. 1 to 5.

In one embodiment, a semiconductor refrigerator die cleaning apparatus 100 is shown in fig. 1, and includes a cleaning jig 200, a cleaning tank 300, a motion module 400, and an electric cabinet 500. The cleaning jig 200 is used for holding semiconductor refrigerator dies to be cleaned. The cleaning tank 300 stores cleaning liquid for cleaning the semiconductor refrigerator die, and embodiments of the present application are not limited to a specific cleaning liquid or a specific composition of the cleaning liquid. The motion module 400 drives the cleaning jig 200 to move to adjust the position of the cleaning jig 200. The electric cabinet 500 controls the movement module 400.

In various embodiments, the cleaning jig 200 is disposed on the motion module 400, and the cleaning jig 200 is provided with at least two clamping positions 210, and each clamping position 210 clamps one semiconductor refrigerator die to be cleaned. In one embodiment, the cleaning jig 200 is provided with two opposite sides, and each side is provided with at least two clamping positions 210. Further, in one embodiment, in conjunction with fig. 2, the cleaning fixture 200 is provided with a mounting plate 220, and the mounting plate 220 is provided with two side surfaces disposed opposite to each other, which may also be referred to as a surface or a bottom surface, and each side surface is provided with at least two clamping positions 210. By means of the design, the semiconductor refrigerator crystal grains can be cleaned at one time, and compared with a traditional manual independent clamping cleaning mode, the cleaning efficiency is greatly improved.

In each embodiment, the motion module 400 is electrically connected to the electric cabinet 500, and the electric cabinet 500 controls the relative positions of the cleaning jig 200 and the cleaning tank 300 by controlling the motion module 400, so as to implement the soaking and taking out of the semiconductor refrigerator dies.

In one embodiment, the motion module 400 is a two-dimensional motion mechanism for moving the cleaning jig 200 up and down with respect to the cleaning tank 300 to enter and exit the cleaning tank 300, and for moving the cleaning jig 200 left and right with respect to the cleaning tank 300 to align with or leave the cleaning tank 300. In one embodiment, as shown in fig. 2, the motion module 400 includes a first direction moving module 410 and a second direction moving module 420, the second direction moving module 420 is disposed on the first direction moving module 410, the cleaning jig 200 is disposed on the second direction moving module 420, the first direction moving module 410 drives the second direction moving module 420 to move along the first direction, and the second direction moving module 420 drives the cleaning jig 200 to move along the second direction, so that each semiconductor refrigerator die clamped by the cleaning jig is soaked in the cleaning solution stored in the cleaning tank, and each semiconductor refrigerator die clamped by the cleaning jig is separated from the cleaning solution. In this embodiment, the first direction is a Y-axis direction, the second direction is a Z-axis direction, the first direction moving module 410 drives the second direction moving module 420 to move left and right along the Y-axis direction to align with the cleaning tank 300 or separate from the cleaning tank 300, and each semiconductor refrigerator die held by the cleaning tank 300, that is, the cleaning jig, can enter the cleaning tank 300 or be taken out from the cleaning tank 300 in a state of moving along the second direction, that is, the Z-axis direction; the semiconductor refrigerator dies leaving the cleaning tank 300, that is, the cleaning jig and the semiconductor refrigerator dies held by the cleaning jig leave the upper side of the cleaning tank 300, and at this time, the semiconductor refrigerator dies cannot enter the cleaning tank 300 even if moving in the second direction. In such a design, the motion module 400 has the advantages of simple control, low cost, convenient implementation and small occupied space, and is particularly suitable for cleaning the crystal grains of the semiconductor refrigerator.

Because the semiconductor refrigerator grain products have very strict requirements on soaking time, the traditional cleaning equipment needs to bind cleaning personnel which are subjected to strict training, and operators need to count time by a stopwatch during the cleaning period and replace the cleaning tank immediately; and because the time is accurate, therefore can not handle a large amount of semiconductor refrigerator crystal grains once, in order to satisfy the time requirement, can only wash 4 semiconductor refrigerator crystal grains such as wafer once, and the washing tank capacity is less simultaneously. In contrast, in the embodiments of the present application, the electric cabinet 500 is provided with a control module and an operation timing storage module, and the control module controls the motion module 400 to adjust the relative positions of the cleaning jig 200 and the cleaning tank 300 according to the preset operation timing stored in the operation timing storage module, so that each semiconductor refrigerator die clamped by the cleaning jig 200 is soaked in the cleaning solution stored in the cleaning tank 300, and the cleaning jig 200 and each semiconductor refrigerator die clamped by the cleaning jig are separated from the cleaning solution. The preset operation time sequence comprises where to soak, how long to stand, and the like; in combination with other embodiments, the method can also comprise the steps of soaking in what sequence, matching with ultrasonic cleaning, matching with heating cleaning and the like, so that the method has extremely high upgradeability and universality. The design can clean a plurality of semiconductor refrigerator crystal grains at one time, and adopts the preset operation time sequence to operate, and the cleaning process is completely and automatically completed by equipment without binding operators, thereby greatly saving human resources, being beneficial to protecting operators from cleaning liquid and being capable of processing relatively more semiconductor refrigerator crystal grains at one time.

Further, in one embodiment, the preset operation sequence includes a correspondence between at least two operation positions and an operation time, where the operation positions include, but are not limited to, at least one soaking position and one waiting position; the operating time includes, but is not limited to, at least one soak time and one wait time. Further, in one embodiment, the predetermined operation sequence further includes an additional process and a processing time thereof, such as ultrasonic cleaning for 10 seconds. Further, in one embodiment, the preset operation sequence includes: transferring the cleaning jig 200 to the upper side of the first tank body 310 to be in a state to be cleaned, transferring the cleaning jig 200 to a preset height so that each semiconductor refrigerator grain clamped by the cleaning jig 200 is soaked in the cleaning solution stored in the first tank body 310, soaking for a first time, resetting the cleaning jig 200 to the upper side of the first tank body 310 and waiting for a second time; the cleaning of the semiconductor refrigerator crystal grain in the first groove body is completed, and excessive loss of cleaning liquid can be avoided. Transferring the cleaning jig 200 to the upper side of the second tank body 320 to be in a state to be cleaned, transferring the cleaning jig 200 to a preset height so that each semiconductor refrigerator grain clamped by the cleaning jig 200 is soaked in the cleaning solution stored in the second tank body 320, soaking for a third time, resetting the cleaning jig 200 to the upper side of the second tank body 320 and waiting for a fourth time; the cleaning of the semiconductor refrigerator grain in the second tank body is completed. Transferring the cleaning jig 200 to above the third tank 330 to be in a state to be cleaned, transferring the cleaning jig 200 to a preset height so that each semiconductor refrigerator grain clamped by the cleaning jig 200 is soaked in the cleaning solution stored in the third tank 330, soaking for a fifth time, resetting the cleaning jig 200 to above the third tank 330 and waiting for a sixth time; the cleaning of the semiconductor refrigerator grain in the second tank body is completed. For the embodiment shown in fig. 1 in which only three tanks are provided, the entire cleaning process is completed. For embodiments with more slots, the cleaning jig 200 may be further transferred and soaked and waiting may be continued, and the rest of the embodiments are analogized, which is not repeated.

In view of the requirement for multi-tank cleaning, in one embodiment, the cleaning tank 300 includes three tanks arranged side by side, and the motion module 400 sequentially adjusts the relative positions of the cleaning jig 200 and the three tanks, so that each semiconductor refrigerator die held by the cleaning jig 200 is sequentially soaked in the cleaning liquid stored in the three tanks. As shown in fig. 1, in this embodiment, the cleaning tank 300 includes three tanks, namely, a first tank 310, a second tank 320 and a third tank 330, which are arranged side by side, and each semiconductor refrigerator die held by the cleaning jig 200 is sequentially soaked in the cleaning solution stored in the three tanks, for example, firstly soaked in the cleaning solution stored in the first tank 310, then soaked in the cleaning solution stored in the second tank 320, then soaked in the cleaning solution stored in the third tank 330, and finally taken out to complete cleaning. And so on, the method can be also applied to cleaning the semiconductor refrigerator crystal grains by other numbers of groove bodies. It is understood that in various embodiments, the semiconductor refrigerator die may be granular, may be in a sheet form, such as a wafer, or may be in a wafer form, such as a wafer.

In order to avoid overflow of the cleaning solution caused by transfer between the tanks, in one embodiment, the cleaning tank 300 further includes a chassis and a cover, the cover is rotatably disposed on the chassis and forms a surrounding area together with the chassis, and the three tanks are regularly arranged on the chassis and are located in the surrounding area; the cover is provided with a through groove, and the movement module 400 passes through the through groove and is movably arranged in the through groove, so that the relative positions of the cleaning clamp 200 and the three groove bodies are adjusted in the enclosing area. Further, in one embodiment, the chassis is provided with an overflow liquid collecting pipe for collecting the cleaning liquid dropped from the gaps of the three tanks and delivering the cleaning liquid to the recovery container. Such a design is advantageous in that cleaning liquid dripping from the cleaning jig 200 due to cleaning is concentrated on the chassis for cleaning; on the other hand, the cleaning solution is protected by the sealing cover in the cleaning process, and the movement of the cleaning clamp 200 driven by the movement module 400 is not influenced; in still another aspect, the more the number of tanks and the more the number of semiconductor refrigerator dies held by the cleaning jig 200, the more the improvement is at least 50% or even multiple, as compared to conventional manual cleaning, and the more the improvement is apparent, thereby greatly improving cleaning efficiency.

In order to facilitate giving some feedback information, in one embodiment, the electric cabinet 500 is further provided with an indication module electrically connected with the control module; the indication module can give indication by means of sound, words and light.

The traditional crystal grain cleaning process is to replace the cleaning solution in a mode of registering the service time, so that the saturation of the cleaning solution cannot be visually presented, and the service time of the corresponding cleaning box solution can be manually registered, so that the condition that the saturated solution is not replaced in time easily occurs, the cleaning effect is affected, and the cleaning failure is caused. In order to avoid cleaning failure caused by excessive cleaning time of the cleaning solution, in one embodiment, the electric cabinet 500 is further provided with a soaking timing module connected with the control module, and the soaking timing module is used for accumulating the use time of the cleaning solution and controlling the indication module to send out prompt information of cleaning solution replacement through the control module when reaching a preset time threshold. Such a design is advantageous in that a prompt for replacement of the cleaning liquid is given by the length of time of use. The cleaning liquid replacement prompt information comprises, but is not limited to, sound, words, light and the like.

In the process of operation of the conventional cleaning device, the saturation of the solution does not have obvious supersaturation early warning, so that the soaking effect of the solution is affected, and in order to avoid cleaning failure caused by insufficient saturation due to excessive cleaning times of the cleaning solution, in one embodiment, the electric cabinet 500 is further provided with a soaking metering module connected with the control module, and the soaking metering module is used for accumulating the use times of the cleaning solution and controlling the indication module to send out prompt information for replacing the cleaning solution when reaching a preset time threshold value.

In order to avoid cleaning failure caused by abnormal cleaning solution, in one embodiment, the semiconductor refrigerator grain cleaning device 100 further includes a detection module, where the detection module is disposed on the motion module 400 and is electrically connected to the control module, and the detection module is configured to control the indication module to send out abnormal cleaning solution prompt information through the control module when the cleaning solution stored in the cleaning tank 300 is abnormal. In one embodiment, the detection module is a video detection module or a humidity sensor, etc.

In order to facilitate control of the electric cabinet 500, in one embodiment, as shown in fig. 3, the semiconductor refrigerator die cleaning apparatus 100 further includes a control terminal 600, the control terminal 600 is electrically connected to the electric cabinet 500, and the control terminal 600 is configured to send a control signal to the control module and send the preset operation timing to the operation timing storage module; further, in one embodiment, the indication module is disposed in the control terminal 600 and is electrically connected to the control module. In one embodiment, the control terminal 600 is a PC, a single-chip microcomputer, an industrial computer, or the like. In one embodiment, the control terminal 600 is a PC host computer.

In order to facilitate the overall movement of the semiconductor refrigerator die cleaning apparatus 100, in one embodiment, the semiconductor refrigerator die cleaning apparatus 100 further includes a frame, and the cleaning tank 300, the motion module 400, and the electric cabinet 500 are respectively disposed on the frame. Further, in one embodiment, the housing of the electric cabinet 500 is integrally disposed with the rack, and the cleaning tank 300 and the motion module 400 are respectively disposed on the housing of the electric cabinet 500. Further, in one embodiment, referring to fig. 1 and 2, a housing of the electric cabinet 500 is provided with mounting locations 510, and each of the mounting locations 510 is used for positioning and mounting a cleaning tank 300 or a tank body thereof, where the tank body includes a first tank body 310, a second tank body 320, a third tank body 330, and so on. Such a design facilitates the overall movement of the semiconductor refrigerator die cleaning apparatus 100; and is also beneficial to connecting other structural members.

In order to precisely control the soaking time of each semiconductor refrigerator die, in one embodiment, the cleaning jig 200 includes a reciprocating half-turn driver, a rotation shaft, and a chuck on which the clamping bits 210 are disposed and regularly arranged in a matrix; the reciprocating type half-rotation driver is electrically connected with the electric cabinet 500, and drives the clamp to rotate 180 degrees around the rotating shaft in a reciprocating manner after each time the clamping chuck enters the cleaning tank 300, so that the semiconductor refrigerator crystal grains which enter the cleaning tank 300 first are taken out from the cleaning tank 300 after being soaked; in one embodiment, the chuck is provided with two side surfaces arranged opposite to each other, and each side surface is provided with at least two clamping positions 210; further, in one embodiment, the chuck is semi-circular, and at least two clamping locations 210 are provided on both sides thereof. The design is beneficial to uniformly distributing the soaking time of the semiconductor refrigerator crystal grains in the cleaning tank 300, so that the soaking time of each semiconductor refrigerator crystal grain to be cleaned can keep almost consistent in the cleaning tank 300 according to the principle of first-in first-out (First In First Out), and the soaking time of each semiconductor refrigerator crystal grain can be controlled to be 0.1 second time level even reaching smaller difference.

In one embodiment, a semiconductor refrigerator die cleaning method is implemented using the semiconductor refrigerator die cleaning apparatus 100 of any of the embodiments. In one embodiment, a semiconductor refrigerator die cleaning method is shown in fig. 4, comprising the steps of: s100, clamping each semiconductor refrigerator grain to be cleaned on a clamping position 210 of a cleaning clamp 200; s200, setting a preset operation time sequence; s300, judging whether the cleaning solution stored in the cleaning tank 300 is available or not, if yes, executing S400; s400, the control module controls the motion module 400 to adjust the relative positions of the cleaning clamp 200 and the cleaning tank 300 according to the preset operation time sequence, so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the cleaning tank 300; s500, the control module controls the motion module 400 to adjust the relative position of the cleaning clamp 200 and the cleaning tank 300 according to the preset operation sequence, so that each semiconductor refrigerator grain is separated from the cleaning liquid. By the design, a plurality of semiconductor refrigerator crystal grains can be cleaned at one time, and the operation is performed sequentially by adopting a preset operation time sequence, so that on one hand, the cleaning process is completed automatically by equipment without binding operators, thereby greatly saving human resources and being beneficial to protecting the operators from being far away from cleaning liquid; on the other hand, compared with the traditional manual cleaning, the cleaning efficiency is greatly improved by at least 50% or even multiple level improvement; on the other hand, the non-uniformity of the traditional manual cleaning can be avoided, so that the semiconductor refrigerator crystal grains have higher uniformity in cleaning, and the defect of products caused by the cleaning procedure is avoided.

In order to adapt to the multi-tank cleaning tank 300, in one embodiment, in step S400, the control module controls the motion module 400 to adjust the relative positions of the cleaning jig 200 and the first tank of the cleaning tank 300 according to the preset operation sequence, so that each semiconductor refrigerator die is soaked in the cleaning liquid stored in the tank; in step S500, the control module controls the motion module 400 to adjust the relative position of the cleaning jig 200 and the tank body according to the preset operation sequence, so as to separate each semiconductor refrigerator grain from the cleaning solution; after step S500, the method further includes the steps of: s600, judging whether cleaning is completed, otherwise executing S700; s700, the control module controls the motion module 400 to adjust the relative position of the cleaning clamp 200 and the next tank body of the cleaning tank 300 according to the preset operation time sequence, so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the next tank body; execution returns to S500. In one embodiment, a semiconductor refrigerator die cleaning method is shown in fig. 5, comprising the steps of: s100, clamping each semiconductor refrigerator grain to be cleaned on a clamping position 210 of a cleaning clamp 200; s200, setting a preset operation time sequence; s300, judging whether the cleaning solution stored in the cleaning tank 300 is available or not, if yes, executing S400; s400, the control module controls the motion module 400 to adjust the relative position of the cleaning clamp 200 and the first tank body of the cleaning tank 300 according to the preset operation time sequence, so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the tank body; s500, the control module controls the motion module 400 to adjust the relative positions of the cleaning clamp 200 and the tank body according to the preset operation time sequence so as to separate each semiconductor refrigerator grain from the cleaning liquid; s600, judging whether cleaning is completed, otherwise executing S700; s700, the control module controls the motion module 400 to adjust the relative position of the cleaning clamp 200 and the next tank body of the cleaning tank 300 according to the preset operation time sequence, so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the next tank body; execution returns to S500.

The semiconductor refrigerator die cleaning apparatus and method described herein will be described with continued reference to fig. 1-5. In one embodiment, the semiconductor refrigerator die cleaning apparatus 100 includes a cleaning jig 200, a cleaning tank 300, a motion module 400, an electric cabinet 500, and a control terminal 600.

The cleaning jig 200 is used for clamping the die to be cleaned, and in one embodiment, six fixing devices are arranged inside the cleaning jig 200 as the clamping positions 210; for the number of grains to be cleaned, the actual volumes of the cleaning jig 200 and the cleaning tank 300 are mainly involved, and in theory, the application can be realized by only increasing the volumes of related mechanisms at the same time, which cannot be realized by the conventional cleaning equipment due to the problem of cleaning time control.

The cleaning tank 300 is used for containing cleaning solvent, namely cleaning liquid, scale marks are arranged in the cleaning tank 300 and used for prompting the use amount of the solution, and the cleaning clamp 200 is soaked and cleaned by adopting the cleaning liquid in the cleaning tank 300; the ultrasonic cleaning and the heating cleaning functions can also be used in combination.

The motion module 400 provides a motion function for the cleaning clamp 200, the illustrated embodiment adopts two stepping motors to respectively provide reciprocating motion in the Y-axis and Z-axis directions, a control circuit of the motion module 400 is arranged in the electric cabinet 500, and the whole automatic cleaning process can be controlled by matching with the software of the control terminal 600 such as a PC upper computer with the electric cabinet 500; the motion module 400 is illustrated as a two-dimensional motion mechanism, and in other cases, the motion module 400 may be replaced by another motor system or a two-axis manipulator.

The electric cabinet 500 is used for placing the cleaning tank 300 and the motion module 400 and internally arranging a control circuit of the motion module 400; the PC upper computer is used as a software running carrier, can adopt a configuration development environment and is combined with a drive card of a stepping motor to complete motion control; the control terminal 600 can be replaced by a touch screen, an industrial personal computer, a PLC or a singlechip besides a PC upper computer.

Specific cleaning processes are exemplified below.

The operator places the wafer to be cleaned in the fixture of the cleaning jig 200, and the illustrated embodiment places a total of 6 wafers as semiconductor refrigerator dies to be cleaned.

And opening a software part of the PC upper computer, setting the cleaning time of soaking in three stages as a preset operation time sequence, and then starting cleaning.

The motion module 400 moves the cleaning jig 200 to above the first tank body 310 through the Y-axis motor, and then moves the cleaning jig 200 to the working point inside the first tank body 310 through the Z-axis motor, so as to start the first stage soaking.

After the first stage soaking is completed, the motion module 400 moves the cleaning jig 200 to a safe position through the Z-axis motor, then moves the cleaning jig 200 to a position above the second tank body 320 through the Y-axis motor, and after the first stage soaking is completed, moves the cleaning jig 200 to an internal working point of the second tank body 320, and starts the second stage soaking.

The Y-axis of the third stage soaking may be referred to as the aforementioned movement, and the cleaning jig 200 may be moved to the relevant position of the third tank 330. After the cleaning is finished, the PC upper computer prompts that the cleaning product needs to be replaced, and cleaning is continued after the product to be cleaned is replaced.

The solution in the cleaning tank 300 can reflect the saturation degree through total soaking service time, when the service time is overtime, the PC upper machine prompts to replace the solution, and after the solution of all cleaning tanks 300 is manually replaced, the cleaning is continued to be restarted.

Such a way of handling is on the one hand advantageous for freeing up manpower, since the cleaning process is completely carried out automatically by the apparatus, so that the operator can be freed up. On the other hand, the illustrated embodiment advantageously increases the capacity by 50% compared to the throughput of the conventional process by cleaning 6 wafers at a time, and in fact, a greater number of wafers may be cleaned at a time due to precise time control. In some embodiments, a solution oversaturation prompt is also designed, for example, by automatically accumulating the use time of the solution at 300 positions of each cleaning tank, and the saturation degree of the solution is fed back in real time through the use time, and a replacement prompt appears on a software interface when the solution oversaturates. Whether the solution is saturated or not can also be judged by a detection module such as a vision system according to the actual condition of the final crystal grain.

In one embodiment, an electronic device includes a memory storing a computer program and a processor that when executing the computer program performs the steps of the semiconductor refrigerator die cleaning method of any of the embodiments. The electronic device may also be referred to as a device or an electronic control device, and in one embodiment, an electronic device is further provided, including a memory and a processor, where the memory stores a computer program, and the processor implements the steps of the semiconductor refrigerator die cleaning method in the above embodiments when the processor executes the computer program.

In one embodiment, a computer readable storage medium stores a computer program, wherein the computer program when executed by a processor implements the steps of the semiconductor refrigerator die cleaning method of any of the embodiments. Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like.

Other embodiments of the present application also include a semiconductor refrigerator die cleaning apparatus, a semiconductor refrigerator die cleaning method, an electronic device, and a storage medium, each of which is formed by combining the technical features of the embodiments.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.

Claims (10)

1. The semiconductor refrigerator grain cleaning device is characterized by comprising a cleaning clamp, a cleaning tank, a motion module and an electric cabinet;

The cleaning clamp is arranged on the motion module and is provided with at least two clamping positions, and each clamping position clamps a semiconductor refrigerator crystal grain to be cleaned;

the motion module is in conductive connection with the electric cabinet, the electric cabinet is provided with a control module and an operation time sequence storage module, and the control module controls the motion module to adjust the relative positions of the cleaning clamp and the cleaning tank according to the preset operation time sequence stored by the operation time sequence storage module, so that the semiconductor refrigerator crystal grains clamped by the cleaning clamp are soaked in the cleaning liquid stored in the cleaning tank, and the cleaning clamp and the semiconductor refrigerator crystal grains clamped by the cleaning clamp are separated from the cleaning liquid.

2. The semiconductor refrigerator grain cleaning device of claim 1, wherein the electric cabinet is further provided with an indication module electrically connected with the control module; and, in addition, the processing unit,

the electric cabinet is also provided with a soaking timing module connected with the control module, and is used for accumulating the using time of the cleaning liquid and controlling the indication module to send out prompt information of cleaning liquid replacement through the control module when the using time reaches a preset time threshold; and/or, the semiconductor refrigerator grain cleaning device further comprises a detection module, wherein the detection module is arranged on the motion module and is in conductive connection with the control module, and the detection module is used for controlling the indication module to send out abnormal prompt information of the cleaning liquid through the control module when the cleaning liquid stored in the cleaning tank is abnormal.

3. The semiconductor refrigerator die cleaning apparatus of claim 1, wherein the cleaning jig comprises a reciprocating half-turn driver, a spindle, and a chuck, each of the clamping positions being disposed on the chuck and being regularly arranged in a matrix;

the reciprocating type half-rotation driver is in conductive connection with the electric cabinet, and drives the clamp to rotate 180 degrees around the rotating shaft in a reciprocating manner after the clamp disc enters the cleaning tank each time, so that the semiconductor refrigerator crystal grains which enter the cleaning tank first are taken out from the cleaning tank after being soaked; or,

the motion module is a two-dimensional motion mechanism and is used for enabling the cleaning clamp to move up and down relative to the cleaning tank to enter and exit the cleaning tank and enabling the cleaning clamp to move left and right relative to the cleaning tank to align or leave the cleaning tank; or,

the cleaning clamp or the chuck thereof is provided with two side surfaces which are arranged in opposite directions, and each side surface is provided with at least two clamping positions.

4. The semiconductor refrigerator die cleaning apparatus of claim 1, further comprising a control terminal electrically connected to the electric cabinet, the control terminal for transmitting a control signal to the control module and transmitting the preset operation timing to the operation timing storage module; or,

The semiconductor refrigerator grain cleaning device further comprises a frame, and the cleaning tank, the motion module and the electric cabinet are respectively arranged on the frame.

5. The semiconductor refrigerator die cleaning apparatus according to any one of claims 1 to 4, wherein the cleaning tank includes three tanks arranged side by side, and the movement module sequentially adjusts the relative positions of the cleaning jig and the three tanks so that each semiconductor refrigerator die held by the cleaning jig is sequentially immersed in the cleaning liquid stored in the three tanks, respectively.

6. The semiconductor refrigerator die cleaning device of claim 5, wherein the cleaning tank further comprises a chassis and a cover, the cover is rotatably arranged on the chassis and forms an enclosing area together with the chassis, and the three tank bodies are regularly arranged on the chassis and are positioned in the enclosing area;

the sealing cover is provided with a through groove, and the movement module penetrates through the through groove and is movably arranged in the through groove, so that the relative positions of the cleaning clamp and the three groove bodies are adjusted in the enclosing area.

7. A method for cleaning semiconductor refrigerator grains, comprising the steps of:

S100, clamping each semiconductor refrigerator grain to be cleaned on a clamping position of a cleaning clamp;

s200, setting a preset operation time sequence;

s300, judging whether the cleaning liquid stored in the cleaning tank is available or not, and executing S400 if the cleaning liquid stored in the cleaning tank is available;

s400, controlling a motion module to adjust the relative positions of the cleaning clamp and the cleaning tank by the control module according to the preset operation time sequence so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the cleaning tank;

s500, the control module controls the motion module to adjust the relative positions of the cleaning clamp and the cleaning tank according to the preset operation time sequence so as to separate the semiconductor refrigerator crystal grains from the cleaning liquid.

8. The method according to claim 7, wherein in step S400, the control module controls the movement module to adjust the relative position of the cleaning jig and the first tank body of the cleaning tank according to the predetermined operation sequence, so that each semiconductor refrigerator die is immersed in the cleaning solution stored in the tank body;

in step S500, the control module controls the motion module to adjust the relative position of the cleaning clamp and the tank body according to the preset operation time sequence, so that each semiconductor refrigerator grain is separated from the cleaning liquid;

After step S500, the method further includes the steps of:

s600, judging whether cleaning is completed, otherwise executing S700;

s700, the control module controls the motion module to adjust the relative position of the cleaning clamp and the next tank body of the cleaning tank according to the preset operation time sequence so that each semiconductor refrigerator grain is soaked in the cleaning liquid stored in the next tank body; execution returns to S500.

9. An electronic device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor, when executing the computer program, implements the steps of the semiconductor refrigerator die cleaning method of any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, characterized in that the computer program, when executed by a processor, implements the steps of the semiconductor refrigerator grain cleaning method of any one of claims 1 to 7.