CN117750660A - Manufacturing method of circuit board metalized half slot hole - Google Patents

Manufacturing method of circuit board metalized half slot hole Download PDF

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Publication number
CN117750660A
CN117750660A CN202311844879.3A CN202311844879A CN117750660A CN 117750660 A CN117750660 A CN 117750660A CN 202311844879 A CN202311844879 A CN 202311844879A CN 117750660 A CN117750660 A CN 117750660A
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CN
China
Prior art keywords
circuit board
hole
round hole
manufacturing
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311844879.3A
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Chinese (zh)
Inventor
杨冬华
刘清华
游昆
李顺祥
韩宝森
严少波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Longnan Junya Electronic Technology Co ltd
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Longnan Junya Electronic Technology Co ltd
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Filing date
Publication date
Application filed by Longnan Junya Electronic Technology Co ltd filed Critical Longnan Junya Electronic Technology Co ltd
Priority to CN202311844879.3A priority Critical patent/CN117750660A/en
Publication of CN117750660A publication Critical patent/CN117750660A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a method for manufacturing a circuit board metalized half slot hole, which belongs to the field of circuit board manufacturing and comprises the following steps: step one: fixing the circuit board on a drilling machine platform, and drilling a round hole by using a drilling machine; step two: electroplating the circuit board with the round holes drilled, so that the inner hole walls of the round holes are plated with a layer of metal copper; step three: the invention adopts a U-shaped cutter-moving method to cut a round hole into a half hole, and solves the problems of half hole burrs, copper defect in the hole and the like generated by the conventional one-time groove milling production by adopting a milling cutter through improving a cutting scheme.

Description

Manufacturing method of circuit board metalized half slot hole
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method for manufacturing a circuit board metalized half slot hole.
Background
With the rapid development of the electronic industry, a printed circuit board (Printed Circuit Board, abbreviated as a PCB) is increasingly widely applied, and the metallized half slot hole can realize the conducting function of the round hole, and can also utilize the hole wall of the metallized half slot hole to carry out welding fixation, so that the fixation of the chip pins is realized, thus the printed circuit board is a conventional design in the manufacture of the printed circuit board.
The normal metallized half slot of PCB is obtained by drilling a full round hole, plating to metalize the hole, and milling half of the hole. However, since the feeding direction of the milling machine is fixed to be used for producing the common milling cutter for one-time milling groove production, and the glass fiber is fine and has better ductility of toughness and copper, when the milling cutter is fed to a half orifice, the glass fiber and the copper have no force points, and can be extruded into the half orifice to cause the problems of copper sheet tilting, flash residue and the like.
Disclosure of Invention
The invention aims to provide a method for manufacturing a metalized half slot hole of a circuit board, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a method for manufacturing a circuit board metalized half slot hole comprises the following steps:
step one: fixing the circuit board (110) on a drilling machine platform, and drilling a round hole (120) by using a drilling machine;
step two: electroplating the circuit board (100) with the round hole (120) drilled, so that the wall of the round hole (120) is plated with a layer of metal copper;
step three: the round hole (120) is cut into half holes by adopting a U-shaped cutter feeding method.
Preferably, the center of the round hole (120) is positioned on an intersection line (110) of the effective area and the ineffective area of the circuit board (100).
Preferably, the round hole (120) and the left side of the intersecting line form an intersecting point I (130), and the round hole (120) and the right side of the intersecting line form an intersecting point II (140).
Preferably, when the U-shaped cutter moving method is to cut round holes (120) on the circuit board (100) from left to right, the cutter starts cutting from the intersection point II (140), after the intersection point II (140) is cut, the cutter starts cutting from the intersection point I (130) from right to left, and after one round hole (120) is cut, the rest round holes (120) are cut according to the step.
Preferably, the cutter is a slotting cutter.
The invention has the technical effects and advantages that: when the metallized half slot hole is processed, the U-shaped cutter feeding method is adopted, so that copper has an acting point when copper in the round hole is cut, and meanwhile, a slot cutter is used, so that residual copper can be effectively removed, and the integrity of copper in the hole is ensured.
Drawings
FIG. 1 is a schematic diagram of the present invention.
In the figure: 100 circuit boards, 110 intersecting lines, 120 round holes, 130 intersecting points one and 140 intersecting points two.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a method for manufacturing a circuit board metalized half slot hole as shown in fig. 1, which comprises the following steps:
step one: fixing the circuit board 110 on a drilling machine platform, and drilling a round hole 120 by using a drilling machine;
step two: the circuit board 100 with the round hole 120 drilled is subjected to electroplating treatment, so that the wall of the round hole 120 is plated with a layer of metal copper;
step three: cutting the round hole 120 into half holes by adopting a U-shaped cutter feeding method;
specifically, the center of the circular hole 120 is located on the intersection line 110 of the effective area and the ineffective area of the circuit board 100.
Specifically, the round hole 120 forms an intersection point one 130 with the left side of the intersection line, and the round hole 120 forms an intersection point two 140 with the right side of the intersection line.
Specifically, when the U-shaped cutter moving method is to cut the round hole 120 on the circuit board 100 from left to right, the cutter starts to cut from the intersection point two 140, after the intersection point two 140 is cut, the cutter starts to cut from the intersection point one 130 from right to left, and after one round hole 120 is cut, the rest round hole 120 is cut according to the step.
Specifically, the cutter is a slot cutter.
Working principle:
when the metallized half slot hole is machined, a slot cutter is used for cutting, when the round hole 120 on the circuit board 100 is cut from left to right, the cutter firstly starts to cut from the intersection point II 140, copper can have an acting point when copper in the round hole 120 is cut, after the intersection point II 140 is cut, the cutter starts to cut from the intersection point I130 from right to left, copper can have an acting point when copper in the round hole 120 is cut, one round hole 120 is cut according to the step after the round hole 120 is cut, and the defect caused by the traditional straight line method for cutting is avoided.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.

Claims (5)

1. The manufacturing method of the circuit board metalized half slot hole is characterized by comprising the following steps:
step one: fixing the circuit board (110) on a drilling machine platform, and drilling a round hole (120) by using a drilling machine;
step two: electroplating the circuit board (100) with the round hole (120) drilled, so that the inner hole wall of the round hole (120) is plated with a layer of metal copper;
step three: the round hole (120) is cut into half holes by adopting a U-shaped cutter feeding method.
2. The method for manufacturing the metalized half slot hole of the circuit board according to claim 1, wherein the method comprises the following steps: the circle center of the round hole (120) is positioned on an intersection line (110) of the effective area and the ineffective area of the circuit board (100).
3. The method for manufacturing the metalized half slot hole of the circuit board according to claim 2, wherein the method comprises the following steps: the round hole (120) and the left side of the intersecting line form an intersecting point I (130), and the round hole (120) and the right side of the intersecting line form an intersecting point II (140).
4. The method for manufacturing the metalized half slot hole of the circuit board according to claim 1, wherein the method comprises the following steps: when the U-shaped cutter feeding method is used for cutting round holes (120) on a circuit board (100) from left to right, the cutter firstly starts cutting from an intersection point II (140), after the intersection point II (140) is cut, the cutter starts cutting from an intersection point I (130) from right to left, and after one round hole (120) is cut, the rest round holes (120) are cut according to the step.
5. The method for manufacturing the metalized half slot hole of the circuit board according to claim 4, wherein the method comprises the following steps: the cutter is a slot cutter.
CN202311844879.3A 2023-12-29 2023-12-29 Manufacturing method of circuit board metalized half slot hole Pending CN117750660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311844879.3A CN117750660A (en) 2023-12-29 2023-12-29 Manufacturing method of circuit board metalized half slot hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311844879.3A CN117750660A (en) 2023-12-29 2023-12-29 Manufacturing method of circuit board metalized half slot hole

Publications (1)

Publication Number Publication Date
CN117750660A true CN117750660A (en) 2024-03-22

Family

ID=90252665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311844879.3A Pending CN117750660A (en) 2023-12-29 2023-12-29 Manufacturing method of circuit board metalized half slot hole

Country Status (1)

Country Link
CN (1) CN117750660A (en)

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