CN117712014A - Wafer expanding device and method and die bonding system - Google Patents
Wafer expanding device and method and die bonding system Download PDFInfo
- Publication number
- CN117712014A CN117712014A CN202310987868.4A CN202310987868A CN117712014A CN 117712014 A CN117712014 A CN 117712014A CN 202310987868 A CN202310987868 A CN 202310987868A CN 117712014 A CN117712014 A CN 117712014A
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- wafer
- dicing tape
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- pressurizing
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 75
- 238000005096 rolling process Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer expanding device and a method capable of making gaps among crystal grains uniform when expanding a wafer and a crystal grain bonding system, which can comprise the following steps: a wafer table for supporting a wafer ring on which a wafer is attached to the dicing tape; a support ring formed on the wafer table for supporting the dicing tape; a dicing tape expanding means formed on the wafer table, at least a part of which moves relative to the support ring so as to pressurize the wafer ring and expand the dicing tape; and an auxiliary pressurizing device for pressurizing the dicing tape expanding device or the tilting part of the wafer ring so that the dicing tape can be uniformly expanded when the dicing tape is expanded.
Description
Technical Field
The present invention relates to a wafer expanding device and method and a die bonding system, and more particularly, to a wafer expanding device and method and a die bonding system capable of making gaps between dies uniform when expanding a wafer.
Background
In general, a wafer is singulated into a plurality of dies, the singulated dies are bonded to a substrate by a die bonding apparatus, so as to manufacture a package product, and when a pick-up head of the die bonding apparatus picks up the dies individually from the wafer, in order to increase a gap between the dies, a wafer expanding apparatus expanding the wafer is developed and widely used.
The wafer placed on such a wafer expanding device may be transferred in the shape of a wafer ring composed of dicing tape to which the wafer is attached, so as to increase the gap between the dies.
Conventionally, when a wafer ring transferred to a wafer stage by a wafer transfer device is introduced into a space between an expansion ring and a support ring and dicing tapes are placed on the support ring, the expansion ring is lowered while pressing the wafer ring, so that the dicing tapes can be expanded, and gaps between dies of the wafer can be increased by the expanded dicing tapes.
In addition, conventionally, the wafer transfer device clamps one or both ends of the wafer ring by a clamp of a transfer arm and transfers the wafer ring to the lower portion of the expansion ring, and the expansion ring may be composed of a left wing portion and a right wing portion so that the clamp passes through the expansion ring.
Disclosure of Invention
Problems to be solved
However, in the conventional wafer expanding device, since the expanding ring is composed of the left wing part and the right wing part, and the front opening part and the rear opening part which are passages of the wafer transfer device are formed between the wing parts, when the expanding ring presses the wafer ring while descending, a raising part may be generated in the vicinity of the front opening part and the rear opening part, which may cause raising due to the fact that the expanding ring cannot uniformly press the wafer ring.
The uneven gaps between the dies when expanding the wafer are caused by the raised parts of the expansion rings.
In particular, since the front opening of the expansion ring into which the wafer ring is introduced cannot be structurally fastened to the expansion frame for lowering the expansion ring, the phenomenon of tilting of the unfastened portion in the vicinity of the front opening becomes more serious, and the dicing tape cannot be sufficiently expanded, resulting in a problem of uneven gaps between the crystal grains in the vicinity.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a wafer expanding device and method and a die bonding system, which can prevent a warp phenomenon by sufficiently pressurizing an unsecured portion of an expanding ring where a warp portion may occur by an auxiliary pressurizing device, thereby making a gap between dies uniform when expanding a wafer. However, such problems are merely illustrative, and the scope of the present invention is not limited by these problems.
Means for solving the problems
The wafer expanding device for solving the above problems based on the inventive concept may include: a wafer table for supporting a wafer ring on which a wafer is attached to the dicing tape; a support ring formed on the wafer table for supporting the dicing tape; a dicing tape expanding means formed on the wafer table, at least a part of which moves relative to the support ring so as to pressurize the wafer ring and expand the dicing tape; and an auxiliary pressurizing device for pressurizing the dicing tape expanding device or the tilting part of the wafer ring so as to uniformly expand the dicing tape when the dicing tape is expanded.
Further, according to the present invention, the auxiliary pressurizing device may include a pressurizing clasp having a structure in which one side rotates in a reverse direction about a hinge shaft in an open mode, and the other side pressurizes the raised portion of the dicing tape-expanding device while rotating in a forward direction about the hinge shaft in a closed mode, so as to avoid interference with a loading path of the wafer ring.
Further, according to the present invention, the pressing clasp may include an L-shaped module formed in a structure in which the one side extends vertically upward along one side surface of the dicing tape expanding device from the hinge shaft in the closed mode, and the other side is bent horizontally from the upper side of the dicing tape expanding device.
Further, according to the present invention, the auxiliary pressurizing device may further include a pressurizing clasp driving device formed in a structure to reversely rotate the pressurizing clasp from the closed mode to the open mode centering on the hinge shaft.
Furthermore, according to the present invention, the pressing clasp driving device may include: a torsion spring provided to the pressurizing clasp to form an elastic restoring force in the closing mode direction; a cam member formed to protrude toward one side of the pressing clasp; a pressing lever that presses the cam member to rotate the pressing clasp from the closed mode to the open mode in a reverse direction; and a pressing lever actuator that advances and retreats or lifts the pressing lever so that the pressing lever presses the cam member.
Further, according to the present invention, the pressurizing rod actuator may include an air cylinder.
Further, according to the present invention, the pressing lever may be provided with a rolling roller at a tip end to reduce friction with the cam member.
Furthermore, according to the present invention, the dicing tape expanding device may include: an expansion ring formed of a pair of first pressing wing parts and a second pressing wing part formed in a partial circular arc shape as a whole so as to press an upper surface edge of the wafer ring entered from one side direction by a wafer transfer device; an expansion frame to which the expansion ring is fixed; and a frame driving device for lifting and lowering the expansion frame.
Further, according to the present invention, the expansion ring may be formed with a first opening portion and a second opening portion between the first and second pressurizing wing portions so as to form a passage of the wafer carrier.
Further, according to the present invention, at least a part of the auxiliary pressurizing means may be formed above the first opening portion so as to cover the vicinity of the first opening portion of the expansion ring where the raising occurs.
Further, according to the present invention, the auxiliary pressurizing means may be in contact with a portion of the upper surface of the first pressurizing wing portion and a portion of the upper surface of the second pressurizing wing portion.
Further, according to the present invention, the auxiliary pressurizing means may be in contact with a portion of the upper surface of the first pressurizing wing portion, a portion of the upper surface of the second pressurizing wing portion, and a portion of the upper surface of the wafer ring.
Further, according to the present invention, the auxiliary pressurizing means may be in contact with a portion of the upper surface of the wafer ring.
Further, according to the present invention, the auxiliary pressurizing device may include: a first auxiliary pressurizing device provided above the first opening to cover a vicinity of the first opening of the expansion ring where the raising occurs; and a second auxiliary pressurizing device provided above the second opening portion to cover a vicinity of the second opening portion of the expansion ring where the raising portion occurs.
In addition, a wafer expanding method for solving the above problems based on the idea of the present invention may include: step (a), the auxiliary pressurizing device is opened in an opening mode to avoid interference with the wafer ring attached with the wafer on the dicing tape; step (b), transferring the wafer ring to a wafer table through a wafer transfer device; step (c) of closing the auxiliary pressurizing means in a closing mode so as to be in contact with at least a portion of the dicing tape-expanding means; and (d) relatively moving at least a part of the dicing tape expanding means with reference to a supporting ring supporting the dicing tape, so that the dicing tape expanding means mainly pressurizes the wafer ring in a manner of expanding the dicing tape, and at the same time, the auxiliary pressurizing means auxiliary pressurizes the dicing tape expanding means or the tilting portion of the wafer ring in the closing mode so as to uniformly expand the dicing tape.
Furthermore, according to the present invention, before the step (a), a step (e) in which the auxiliary pressurizing means is closed in a waiting mode so as to be in contact with at least a portion of the dicing tape-expanding means may be further included.
Further, according to the present invention, in the step (b), the wafer ring may be inserted into a receiving space formed under an expansion ring of the dicing tape-expanding apparatus.
Further, according to the present invention, in the step (c), the auxiliary pressurizing means may perform auxiliary pressurizing in the vicinity of a first opening or a second opening in an expansion ring of the dicing tape expansion means, the first opening or the second opening being a passage of the wafer carrier formed between a first pressurizing wing and a second pressurizing wing of the expansion ring.
Further, according to the present invention, in the step (d), the expansion ring of the dicing tape expansion device and the pressing clasp of the auxiliary pressing device may be lowered simultaneously with reference to the support ring.
In addition, a die bonding system for solving the above problems based on the inventive concept may include: a wafer expanding means for expanding the wafer attached to the dicing tape so as to increase a gap between the dies by expanding the dicing tape; die ejector means for individually separating the die from the dicing tape; and a die pick-up device that picks up the individually separated die so as to bond the separated die to a substrate; the wafer expanding device comprises: a wafer stage supporting the wafer ring; a support ring formed on the wafer table for supporting the dicing tape; the dicing tape expanding device is formed on the wafer table, and at least one part of the dicing tape expanding device moves relatively by taking the supporting ring as a reference so as to pressurize the wafer ring and expand the dicing tape; and an auxiliary pressurizing device for pressurizing the dicing tape expanding device or the tilting part of the wafer ring so as to uniformly expand the dicing tape when expanding the dicing tape; the auxiliary pressurizing device includes: a pressing clasp having a structure in which one side rotates in a reverse direction about a hinge shaft in an open mode, and the other side presses the raised portion of the dicing tape-expanding device while rotating in a forward direction about the hinge shaft in a closed mode, so as to avoid interference with a loading path of the wafer ring; a pressing clasp driving device configured to reversely rotate the pressing clasp from the closed mode to the open mode around the hinge shaft; the pressing clasp driving device includes: a torsion spring provided to the pressurizing clasp to form an elastic restoring force in the closing mode direction; a cam member formed to protrude toward one side of the pressing clasp; a pressing lever that presses the cam member to rotate the pressing clasp from the closed mode to the open mode in a reverse direction; and a pressing lever actuator that advances and retreats or lifts the pressing lever so that the pressing lever presses the cam member.
ADVANTAGEOUS EFFECTS OF INVENTION
According to an embodiment of the present invention constructed as described above, since the unsecured portion of the expansion ring, which may generate a kicked portion, is sufficiently pressurized by the auxiliary pressurizing means, a kicking phenomenon is prevented, and thus the intervals between the dies can be made uniform when the wafer is expanded, with the effect of greatly improving the precision and accuracy of die bonding. Of course, the scope of the present invention is not limited by these effects.
Drawings
FIG. 1 is a conceptual diagram illustrating a die bonding system according to some embodiments of the invention;
FIG. 2 is a front perspective view illustrating a wafer expansion device of the die bonding system of FIG. 1;
fig. 3 is an enlarged perspective view showing an auxiliary pressurizing device of the wafer expanding device of fig. 2 in an enlarged manner;
fig. 4 is a rear perspective view illustrating a wafer expansion device of the die bonding system of fig. 1;
fig. 5 is an enlarged perspective view showing an auxiliary pressurizing device of the wafer expanding device of fig. 4 in an enlarged manner;
fig. 6 to 8 are sectional views showing the operation of the auxiliary pressurizing means of the wafer expanding device of fig. 2 in stages;
fig. 9 is an enlarged perspective view showing an auxiliary pressurizing device of a wafer expanding device according to another partial embodiment of the present invention;
fig. 10 is an enlarged perspective view showing an auxiliary pressurizing device of a wafer expanding device according to still another part of the embodiment of the present invention;
FIG. 11 is an enlarged perspective view showing an auxiliary pressurizing device of a wafer expanding device according to still another embodiment of the present invention;
FIG. 12 is a view showing uniformity of a die gap in a warpage phenomenon of a conventional wafer expanding apparatus;
FIG. 13 is a diagram illustrating gap uniformity of a wafer expansion apparatus in accordance with a portion of an embodiment of the present invention;
FIG. 14 is a sequence diagram illustrating a wafer expanding method in accordance with a portion of an embodiment of the present invention;
fig. 15 is a sequence diagram illustrating a wafer expanding method according to another partial embodiment of the present invention;
reference numerals illustrate:
a WT wafer transporter; GP clamp holder;
a TA transporter arm; 1, cutting an adhesive tape;
a W wafer; 2, a wafer ring;
d, crystal grains; 10 wafer table;
20. a support ring; 30 cutting the tape expansion device;
31. an expansion ring; 31-1 first compression wing;
31-2 second compression wings; a1 a first opening portion;
a2 A second opening portion; 32 expanding the frame;
33. a frame driving device; 40. 50, 60, 70 auxiliary pressurizing means;
41a compression clasp; 41a hinge axis;
41b a buffer member; 42 a pressurized clasp driving means;
421. a torsion spring; 422 cam member;
423. a pressurizing rod; 424 a pressure lever actuator;
425. a rolling roller; s accommodation space;
70-1 a first auxiliary pressurizing device; 70-2 a second auxiliary pressurizing device;
100. 101, 102, 103 wafer expansion devices; 200. a die ejection device;
300. a die pick-up device; 1000 die bonding system.
Detailed Description
Hereinafter, some preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.
The embodiments of the present invention are intended to more fully describe the present invention to those skilled in the art, and the following embodiments may be modified into several different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are intended to make this disclosure more faithful and complete, and to fully convey the concept of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of illustration.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings schematically showing preferred embodiments of the present invention. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Therefore, embodiments of the inventive concept should not be construed as limited to the particular shapes of regions illustrated in this specification and, for example, should include shape variations resulting from fabrication.
Fig. 1 is a conceptual diagram illustrating a die bonding system 1000 according to some embodiments of the invention.
First, as shown in fig. 1, a die bonding system 1000 according to some embodiments of the invention may include: the wafer expanding device 100 expands the wafer W attached to the dicing tape 1 so as to increase the gap between the dies D by expanding the dicing tape 1; a die ejector 200 for separating the die D from the dicing tape 1 individually; and a die pick-up device 300 that picks up the individually separated die D to bond the separated die D to the substrate.
Here, for example, the wafer expanding device 100 may be a device capable of assisting in pressurizing a raised portion or the like where a pressurizing force is unevenly applied, so as to uniformly expand the dicing tape 1 when expanding the wafer.
Further, for example, the die ejector 200 can lift the die D from the dicing tape 1, so that die pickup by the die pickup device 300 can be facilitated.
Further, for example, the die pickup device 300 is a device that picks up individual, separated die D and then transfers it to an intermediate stage, and more specifically, a die transfer unit that picks up die D from dicing tape 1 and transfers it to an intermediate stage, and a die bonding unit that picks up die D of an intermediate stage and bonds it to a substrate, and the like, can be applied in a very wide variety of forms.
Accordingly, the die bonding system 1000 according to a part of the embodiments of the present invention may expand the wafer W adhered to the dicing tape 1, individually separate the die D having the widened gaps between the dies D from the expanded dicing tape 1, and pick up the individually separated die D to bond to a substrate (not shown).
The die bonding system 1000 according to some embodiments of the present invention as such can be applied to various kinds and forms of die bonding devices without departing from the technical spirit of the present invention.
Fig. 2 is a front perspective view illustrating the wafer expansion device 100 of the die bonding system 1000 of fig. 1, and fig. 3 is an enlarged perspective view illustrating the auxiliary pressurizing device 40 of the wafer expansion device 100 of fig. 2 in an enlarged manner;
fig. 4 is a rear perspective view of the wafer expansion device 100 illustrating the die bonding system 1000 of fig. 1; fig. 5 is an enlarged perspective view showing the auxiliary pressurizing device 40 of the wafer expanding device 100 of fig. 4 in an enlarged manner.
For example, as shown in fig. 1-5, a wafer expansion device 100 according to some embodiments of the present invention may generally include a wafer table 10, a support ring 20, a dicing tape expansion device 30, and an auxiliary pressurizing device 40.
The wafer table 10 may be a frame structure having sufficient strength and durability to support the wafer ring 2 having the wafer W attached to the dicing tape 1 at a predetermined height, and may also support the support ring 20, the dicing tape expanding means 30, the auxiliary pressing means 40, and the like.
Such wafer table 10 may be constructed by assembling various panels, vertical members, horizontal members, etc., and may be constructed in a very diverse form so as to firmly support the wafer ring 2.
However, the wafer table 10 is not limited to the drawings, and may be optimally designed according to various operating environments or structures of devices or apparatuses, etc.
As shown in fig. 1 and 2, for example, the support ring 20 may be formed fixedly on the wafer table 10, and may be a structure in the form of a fixing ring for supporting the lower surface of the dicing tape 1 of the wafer ring 2 transferred to the wafer table 10.
Further, as shown in fig. 1 and 2, for example, the dicing tape expanding device 30 may be formed on the wafer table 10, and may be a device that relatively moves at least a part with reference to the support ring 20 so as to press the wafer ring 2 downward with reference to the support ring 20, thereby expanding and stretching the dicing tape 1.
More specifically, for example, as shown in fig. 2, the dicing tape-expanding device 30 may include an expanding ring 31, an expanding frame 32, and a frame driving device 33.
Here, for example, the expansion ring 31 may be constituted by a pair of first pressing wing portions 31-1 and second pressing wing portions 31-2 formed in a partial circular arc (semicircular arc) shape as a whole so as to press the upper surface edge of the wafer ring 2 entered in one side direction by the wafer carrier WT.
As shown in fig. 2 to 5, such an expansion ring 31 has a first opening A1 and a second opening A2 formed between the first pressing wing 31-1 and the second pressing wing 31-2, so that a passage of the gripper GP and the transfer arm TA of the wafer transfer device WT can be ensured when the wafer is introduced.
In addition, for example, the expansion frame 32 for firmly supporting the expansion ring 31 may function to transmit the lowering pressure of the frame driving device to the expansion ring 31.
For example, the frame driving device 33 is a device for lifting and lowering the expansion frame 32, and a very wide variety of driving devices such as a cylinder, a motor, and an electric actuator can be applied.
Here, the first opening A1 and the second opening A2 of the expansion ring 31 serve as passages for the wafer feeder WT when transferring the wafer 2, and when the wafer 2 is lowered and pressurized by the first pressurizing wing 31-1 and the second pressurizing wing 31-2, a reaction force due to an elastic restoring force of the dicing tape 1 of the wafer 2 may be intensively generated mainly in the vicinity of the first opening A1 and the second opening A2.
In particular, for the first opening A1, which is the square opening into which the wafer ring 2 is first introduced, the expansion ring 31 near the first opening A1 may not be fastened to the expansion frame 32, so that the expansion ring 31 near the first opening A1 is prevented from interfering with the wafer ring 2.
Therefore, a kick-up portion may occur mainly on the expansion ring 31 in the vicinity of the first opening A1 of the structure not fastened to the expansion frame 32.
The present invention uses the auxiliary pressurizing device 40 to auxiliary pressurize the tilted part, thereby improving the expansion uniformity of the dicing tape 1 and greatly improving the gap uniformity between the grains D.
As shown in fig. 1 to 5, for example, the auxiliary pressurizing device 40 of the present invention is configured to pressurize the raised portion of the dicing tape expanding device 30 or the wafer ring 2 when the dicing tape 1 is expanded, so that the dicing tape 1 is uniformly expanded.
More specifically, for example, as shown in fig. 3 to 5, the auxiliary pressurizing device 40 may include a pressurizing clasp 41, and the pressurizing clasp 41 may be configured to rotate in the reverse direction about the hinge shaft 41a on one side in the open mode, rotate in the forward direction about the hinge shaft 41a on one side in the closed mode, and pressurize the vicinity of the first opening A1 of the expansion ring 31, which is the raising portion of the dicing tape expanding device 30, on the other side, so as to avoid interference with the loading path of the wafer ring 2.
Here, the buffer member 41b is provided on the inner contact surface of the pressing clasp 41, so that the impact and friction when the pressing clasp 41 presses the expansion ring 31 can be reduced.
For example, as shown in fig. 3, the pressing clasp 41 may be an L-shaped module formed in a structure in which one side extends vertically upward from the hinge shaft 41a along the side surface of the expansion ring 31 of the dicing tape expansion device 30 in the closed mode, and the other side is bent horizontally from the upper side of the expansion ring 31 of the dicing tape expansion device 30.
However, the pressing clasp 41 is not limited to the L-shaped module, and a plurality of pressing clasps having a ring shape, an inverted U-shaped bent shape, or the like, which can press the vicinity of the first opening A1 of the expansion ring 31, may be applied.
Fig. 6 to 8 are sectional views schematically showing the operation of the auxiliary pressurizing device 40 of the wafer expanding device 100 of fig. 2 in stages.
As shown in fig. 3 to 6, the auxiliary pressurizing device 40 of the wafer expanding device 100 according to a part of the embodiment of the present invention may further include a pressurizing clasp driving device 42, and the pressurizing clasp driving device 42 is configured to reversely rotate the pressurizing clasp 41 from the closed mode to the open mode centering around the hinge shaft 41 a.
More specifically, for example, the pressing clasp catcher 42 may include: a torsion spring 421 provided to the pressing clasp 41 and forming an elastic restoring force in the closing mode direction; a cam member 422 formed to protrude toward one side of the pressing clasp 41; a pressing lever 423 that presses the cam member 422 to rotate the pressing clasp 41 from the closed mode to the open mode in the reverse direction; and a pressing lever actuator 424 that advances and retreats or lifts the pressing lever 423 so that the pressing lever 423 presses the cam member 422.
Here, for example, the pressurizing rod actuator 424 may include an air cylinder. However, such a pressurizing rod actuator 424 is not limited to an air cylinder, and a very wide variety of actuators such as a motor or an electric actuator other than a cylinder may be applied.
Further, for example, the pressing lever 423 may be provided with a rolling roller 425 at the tip to reduce friction with the cam member 422. However, various forms of friction reducing means such as rolling balls or rolling bearings may be applied instead of the rolling rollers 425 described above.
Therefore, as shown in fig. 6 to 8, the operation of the auxiliary pressurizing device 40 of the wafer expanding device 100 is described in stages, and first, as shown in fig. 6, the auxiliary pressurizing device 40 may be waited in the waiting mode so as to be in contact with at least a portion of the expanding ring 31 of the dicing tape expanding device 30.
Next, as shown in fig. 7, the auxiliary pressurizing device 40 may be opened to an open mode to avoid interference with the wafer ring 2, to which the wafer W is adhered on the dicing tape 1.
At this time, the pressing lever actuator 424 can lift the pressing lever 423 and press the cam member 422, and can rotate the pressing clasp 41 from the closed mode to the open mode in the reverse direction against the elastic restoring force of the torsion bar 421 when the cam member 422 is pressed.
Therefore, the wafer ring 2 can be inserted into the accommodation space S formed below the expansion ring 31 of the dicing tape expansion device 30 by the wafer feeder WT.
Next, as shown in fig. 8, the auxiliary pressurizing device 40 may be closed in a closing mode so as to be in contact with the expansion ring 31 of the dicing tape expansion device 30, and then the expansion ring 31 of the dicing tape expansion device 30 is lowered at least with reference to the support ring 20 supporting the dicing tape 1 and expands the dicing tape 1.
At this time, the expansion ring 31 may mainly pressurize the wafer ring 2, and at the same time, the auxiliary pressurizing device 40 may auxiliary pressurize the expansion ring 31 of the dicing tape expansion device 30 or the raised portion of the wafer ring 2 in the closed mode so as to uniformly expand the dicing tape 1.
That is, at least a part of the pressing clasp 41 of the auxiliary pressing device 40 is formed above the first opening A1 so as to cover the vicinity of the first opening A1 of the expansion ring 31 where the raising occurs, and can be in contact with a part of the upper surface of the first pressing wing 31-1 and a part of the upper surface of the second pressing wing 31-2.
Therefore, according to the present invention, since the non-fastened portion of the expansion ring 31, which may generate a kick-up portion, is sufficiently pressurized by the auxiliary pressurizing device 40, a kick-up phenomenon is prevented, whereby the interval between the dies can be made uniform when the wafer is expanded, with the effect of greatly improving the precision and accuracy of die bonding.
Fig. 9 is an enlarged perspective view showing the auxiliary pressurizing device 50 of the wafer expanding device 101 according to another partial embodiment of the present invention.
As shown in fig. 9, the auxiliary pressurizing device 50 of the wafer expanding device 101 according to another embodiment of the present invention may be in contact with a portion of the upper surface of the first pressurizing wing 31-1, a portion of the upper surface of the second pressurizing wing 31-2, and a portion of the upper surface of the wafer ring 2.
Therefore, the auxiliary pressurizing device 50 does not pressurize the expanding ring 31, but can simultaneously pressurize the wafer ring 2, thereby uniformly dispersing the pressurizing force and preventing the warpage phenomenon, and thereby making the gaps between the dies uniform when expanding the wafer.
Fig. 10 is an enlarged perspective view of the auxiliary pressurizing device 60 of the wafer expanding device 102 according to still another embodiment of the present invention.
As shown in fig. 10, the auxiliary pressurizing device 60 of the wafer expanding device 102 according to still another embodiment of the present invention may be in contact with only a portion of the upper surface of the wafer ring 2.
Therefore, the auxiliary pressurizing device 50 does not pressurize the expanding ring 31, but only pressurizes the wafer ring 2, so that the wafer ring 2 can be directly pressurized, and the warpage phenomenon can be prevented by uniformly dispersing the pressurizing force, so that the gaps between the dies can be uniform when expanding the wafer.
Fig. 11 is an enlarged perspective view of the auxiliary pressurizing device 70 of the wafer expanding device 103 according to still another embodiment of the present invention.
As shown in fig. 11, the auxiliary pressurizing device 70 of the wafer expanding device 103 according to still another part of the embodiment of the present invention may include: a first auxiliary pressurizing device 70-1 provided above the first opening A1 to cover the vicinity of the first opening A1 of the expansion ring 31 where the raising occurs; and a second auxiliary pressurizing device 70-2 provided above the second opening A2 to cover the vicinity of the second opening of the expansion ring 31 where the raising occurs.
In addition, the auxiliary pressurizing device 70 of the present invention may be provided with a plurality of portions where a tilting portion or a tilting phenomenon may occur, as needed.
Fig. 12 is a view showing the uniformity of a die gap in the warpage phenomenon of the conventional wafer expanding apparatus, and fig. 13 is a view showing the uniformity of the gap of the wafer expanding apparatus 100 according to a part of the embodiment of the present invention.
Therefore, in the prior art, as shown in the red-colored portion of the upper graph of fig. 12, the expansion ring 31 in the vicinity of the first opening A1 is significantly tilted, and as shown in the lower graph of fig. 12, it can be confirmed that the X-axis gap uniformity is 56.6% (the less green, the lower the uniformity), the Y-axis gap uniformity (the less green, the lower the uniformity) is extremely reduced to 39.4%, however, according to the present invention, as shown in the upper graph of fig. 13, it can be confirmed that the entire region of the expansion ring 31 is marked blue without tilting, and as shown in the lower graph of fig. 13, as a simulation result, the X-axis gap uniformity (the more green, the higher the uniformity) is 60.2%, and the Y-axis gap uniformity (the more green, the higher the uniformity) is greatly improved to 81.4%.
Fig. 14 is a sequence diagram of a wafer expanding method in accordance with a portion of an embodiment of the present invention.
As shown in fig. 1 to 14, a wafer expanding method according to a part of embodiments of the present invention may include: step (a), the auxiliary pressurizing device 40 is opened in an opening mode to avoid interference with the wafer ring 2 attached with the wafer W on the dicing tape 1; step (b), transferring the wafer ring 2 to a wafer table 10 by a wafer transfer device WT; step (c) of closing the auxiliary pressurizing means 40 in a closing mode so as to be in contact with at least a portion of the dicing tape-expanding means 30; and (d) relatively moving at least a part of the dicing tape-expanding means 30 with reference to the support ring 20 supporting the dicing tape 1, thereby mainly pressurizing the wafer ring 2 in such a manner as to expand the dicing tape 1, and simultaneously, the auxiliary pressurizing means auxiliary pressurizing the dicing tape-expanding means 30 or the raised portion of the wafer ring 2 in the closing mode, so as to uniformly expand the dicing tape 1.
Here, for example, in the step (b), the wafer ring 2 is inserted into the accommodation space S formed below the expansion ring 31 of the dicing tape-expanding apparatus 30.
In the step (c), for example, the auxiliary pressurizing device 40 performs auxiliary pressurizing in the vicinity of the first opening A1 or the second opening A2 in the expansion ring 31 of the dicing tape expansion device 30, the first opening A1 or the second opening A2 being a passage of the wafer feeder WT formed between the first pressurizing wing 31-1 and the second pressurizing wing 31-2 of the expansion ring 31.
Further, for example, in the step (d), the expansion ring 31 of the dicing tape expansion means 30 and the pressing clasp 41 of the auxiliary pressing means 40 may be lowered simultaneously with reference to the support ring 20.
Fig. 15 is a sequence diagram illustrating a wafer expanding method according to yet another portion of the present invention.
As shown in fig. 1 to 15, a wafer expanding method according to still another part of the embodiment of the present invention may include: step (e) of closing the auxiliary pressurizing means 40 in a waiting mode so as to be in contact with at least a portion of the dicing tape-expanding means; step (a), the auxiliary pressurizing device 40 is opened in an opening mode to avoid interference with the wafer ring 2 attached with the wafer W on the dicing tape 1; step (b), transferring the wafer ring 2 to a wafer table 10 by a wafer transfer device WT; step (c) of closing the auxiliary pressurizing means 40 in a closing mode so as to be in contact with at least a portion of the dicing tape-expanding means 30; and (d) relatively moving at least a part of the dicing tape-expanding means 30 with reference to the support ring 20 supporting the dicing tape 1, thereby mainly pressurizing the wafer ring 2 in such a manner as to expand the dicing tape 1, and simultaneously, the auxiliary pressurizing means auxiliary pressurizing the dicing tape-expanding means 30 or the raised portion of the wafer ring 2 in the closing mode, so as to uniformly expand the dicing tape 1.
The embodiments shown in the figures are described with reference to the present invention, but this is only an example, and it is understood that many variations and equivalent other embodiments can be made by those skilled in the art. Therefore, the true technical scope of the present invention should be determined according to the technical ideas of the appended claims.
Claims (20)
1. A wafer expanding apparatus, comprising:
a wafer table for supporting a wafer ring on which a wafer is attached to the dicing tape;
a support ring formed on the wafer table for supporting the dicing tape;
a dicing tape expanding means formed on the wafer table, at least a part of which moves relative to the support ring so as to pressurize the wafer ring and expand the dicing tape; and
and the auxiliary pressurizing device is used for pressurizing the tilting part of the dicing tape expanding device or the wafer ring so as to uniformly expand the dicing tape when the dicing tape is expanded.
2. A wafer expanding apparatus according to claim 1,
the auxiliary pressurizing device comprises a pressurizing clasp, wherein one side of the pressurizing clasp rotates in the reverse direction by taking a hinge shaft as a center in an opening mode, and the other side of the pressurizing clasp pressurizes the raising part of the dicing tape expanding device by taking the hinge shaft as a center in a closing mode so as to avoid interference with the loading path of the wafer ring.
3. A wafer expanding apparatus according to claim 2,
the pressing clasp includes an L-shaped module formed in a structure in which the one side extends vertically upward from the hinge shaft along one side face of the dicing tape-expanding device in the closed mode, and the other side is bent horizontally from above the dicing tape-expanding device.
4. A wafer expanding apparatus according to claim 2,
the auxiliary pressurizing device further includes a pressurizing clasp driving device configured to reversely rotate the pressurizing clasp from the closed mode to the open mode centering on the hinge shaft.
5. A wafer expanding apparatus as defined in claim 4, wherein,
the pressing clasp driving device includes:
a torsion spring provided to the pressurizing clasp to form an elastic restoring force in the closing mode direction;
a cam member formed to protrude toward one side of the pressing clasp;
a pressing lever that presses the cam member to rotate the pressing clasp from the closed mode to the open mode in a reverse direction; and
and a pressing rod actuator that advances and retreats or lifts the pressing rod so that the pressing rod presses the cam member.
6. A wafer expanding apparatus as defined in claim 5, wherein,
the pressurizing rod actuator includes an air cylinder.
7. A wafer expanding apparatus as defined in claim 5, wherein,
the pressing lever is provided with a rolling roller at a tip end to reduce friction with the cam member.
8. A wafer expanding apparatus according to claim 1,
the dicing tape expanding device includes:
an expansion ring formed of a pair of first pressing wing parts and a second pressing wing part formed in a partial circular arc shape as a whole so as to press an upper surface edge of the wafer ring entered from one side direction by a wafer transfer device;
an expansion frame to which the expansion ring is fixed; and
and a frame driving device for lifting and lowering the expansion frame.
9. A wafer expanding apparatus as defined in claim 8, wherein,
the expansion ring is formed with a first opening and a second opening between the first and second pressurizing wing portions so as to form a passage of the wafer transfer device.
10. A wafer expanding apparatus as defined in claim 9, wherein,
at least a part of the auxiliary pressurizing device is formed above the first opening to cover the vicinity of the first opening of the expansion ring where the raising occurs.
11. A wafer expanding apparatus as defined in claim 10, wherein,
the auxiliary pressurizing device is in contact with a part of the upper surface of the first pressurizing wing part and a part of the upper surface of the second pressurizing wing part.
12. A wafer expanding apparatus as defined in claim 10, wherein,
the auxiliary pressurizing device is in contact with a part of the upper surface of the first pressurizing wing part, a part of the upper surface of the second pressurizing wing part and a part of the upper surface of the wafer ring.
13. A wafer expanding apparatus as defined in claim 10, wherein,
the auxiliary pressurizing device is contacted with a part of the upper surface of the wafer ring.
14. A wafer expanding apparatus as defined in claim 9, wherein,
the auxiliary pressurizing device includes:
a first auxiliary pressurizing device provided above the first opening to cover a vicinity of the first opening of the expansion ring where the raising occurs; and
and a second auxiliary pressurizing device provided above the second opening to cover a vicinity of the second opening of the expansion ring where the raising occurs.
15. A method of expanding a wafer, comprising:
step (a), the auxiliary pressurizing device is opened in an opening mode to avoid interference with the wafer ring attached with the wafer on the dicing tape;
step (b), transferring the wafer ring to a wafer table through a wafer transfer device;
step (c) of closing the auxiliary pressurizing means in a closing mode so as to be in contact with at least a portion of the dicing tape-expanding means; and
and (d) relatively moving at least a part of the dicing tape expanding device with reference to a supporting ring supporting the dicing tape, so that the dicing tape expanding device mainly pressurizes the wafer ring in a manner of expanding the dicing tape, and simultaneously the auxiliary pressurizing device performs auxiliary pressurizing on the dicing tape expanding device or the tilting part of the wafer ring in the closing mode so as to uniformly expand the dicing tape.
16. The method of expanding a wafer of claim 15,
step (e) is also included prior to step (a), wherein the auxiliary pressurizing device is closed in a waiting mode so as to contact at least a portion of the dicing tape-expanding device.
17. The method of expanding a wafer of claim 15,
in the step (b), the wafer ring is inserted into a receiving space formed under an expansion ring of the dicing tape-expanding apparatus.
18. The method of expanding a wafer of claim 15,
in the step (c), the auxiliary pressurizing means performs auxiliary pressurizing in the vicinity of a first opening or a second opening in an expansion ring of the dicing tape expanding means, the first opening or the second opening being a passage of the wafer transfer device formed between a first pressurizing wing and a second pressurizing wing of the expansion ring.
19. The method of expanding a wafer of claim 15,
in the step (d), the expansion ring of the dicing tape expansion device and the pressing clasp of the auxiliary pressing device are simultaneously lowered with reference to the support ring.
20. A die bonding system, comprising:
a wafer expanding means for expanding the wafer attached to the dicing tape so as to increase a gap between the dies by expanding the dicing tape;
die ejector means for individually separating the die from the dicing tape; and
a die pick-up device that picks up the individually separated die so as to bond the separated die to a substrate;
the wafer expanding device comprises:
a wafer stage supporting the wafer ring;
a support ring formed on the wafer table for supporting the dicing tape;
the dicing tape expanding device is formed on the wafer table, and at least one part of the dicing tape expanding device moves relatively by taking the supporting ring as a reference so as to pressurize the wafer ring and expand the dicing tape; and
an auxiliary pressurizing device for pressurizing the tilting part of the dicing tape expanding device or the wafer ring so as to uniformly expand the dicing tape when expanding the dicing tape;
the auxiliary pressurizing device includes:
a pressing clasp having a structure in which one side rotates in a reverse direction about a hinge shaft in an open mode, and the other side presses the raised portion of the dicing tape-expanding device while rotating in a forward direction about the hinge shaft in a closed mode, so as to avoid interference with a loading path of the wafer ring;
a pressing clasp driving device configured to reversely rotate the pressing clasp from the closed mode to the open mode around the hinge shaft;
the pressing clasp driving device includes:
a torsion spring provided to the pressurizing clasp to form an elastic restoring force in the closing mode direction;
a cam member formed to protrude toward one side of the pressing clasp;
a pressing lever that presses the cam member to rotate the pressing clasp from the closed mode to the open mode in a reverse direction; and
and a pressing rod actuator that advances and retreats or lifts the pressing rod so that the pressing rod presses the cam member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2022-0115488 | 2022-09-14 | ||
| KR1020220115488A KR20240036887A (en) | 2022-09-14 | 2022-09-14 | Wafer expanding apparatus, wafer expanding method and die bonding system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117712014A true CN117712014A (en) | 2024-03-15 |
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ID=90146760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310987868.4A Pending CN117712014A (en) | 2022-09-14 | 2023-08-07 | Wafer expanding device and method and die bonding system |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20240036887A (en) |
| CN (1) | CN117712014A (en) |
-
2022
- 2022-09-14 KR KR1020220115488A patent/KR20240036887A/en unknown
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2023
- 2023-08-07 CN CN202310987868.4A patent/CN117712014A/en active Pending
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| KR20240036887A (en) | 2024-03-21 |
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