CN117706328A - Chip temperature testing device - Google Patents
Chip temperature testing device Download PDFInfo
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- CN117706328A CN117706328A CN202311707076.3A CN202311707076A CN117706328A CN 117706328 A CN117706328 A CN 117706328A CN 202311707076 A CN202311707076 A CN 202311707076A CN 117706328 A CN117706328 A CN 117706328A
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- main body
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- box
- temperature
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- 238000012360 testing method Methods 0.000 title claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011120 plywood Substances 0.000 claims description 14
- 238000013461 design Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000004891 communication Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The invention discloses a chip temperature testing device in the technical field related to chip testing, which comprises a support control box and a temperature testing box body arranged above the support control box, wherein a wiring row is fixedly arranged on the outer side of the support control box, wiring holes are formed in the wiring row, an operation box body is arranged on the side edge of the wiring row, and an air filter is fixedly arranged on the side surface, adjacent to the wiring row, of the support control box. The chip temperature testing device is provided with the pin guide plate, the conductive block and the conductive needle on the testing substrate, the built-in structure is connected with the wiring row through the built-in wires, the tested built-in structure is in an automatic communication state, the wiring row is provided with the wiring holes, the whole structure is provided with the wires, no inner wires are needed, the operation of the testing process is simple, the safety is good, the high-temperature resistance test is carried out in the working process of the chip main body, the testing result is similar to the actual use environment, and the testing accuracy is high.
Description
Technical Field
The invention belongs to the technical field related to chip testing, and particularly relates to a chip temperature testing device.
Background
The chip is used as a way of miniaturizing a circuit in electronics, some chips are applied to a high-temperature environment, high-temperature resistant test is needed before use, the chips can be produced and used after the test is qualified, the chips are more and more difficult to test along with the enhancement of functions of integrated chips and the continuous expansion of integrated scale, the test cost is higher and higher, the high-temperature resistant test of the chips in the prior art is carried out in a high-temperature furnace, high-temperature furnace equipment is needed to be purchased, the cost is higher and the space of a test room is occupied, wires are needed to be led out from the side of the blast furnace if data are needed to be detected in the test, the wires are long, are easy to wind, become disordered, the test efficiency is low, potential safety hazards exist, the chips after the high-temperature test are needed to be naturally cooled, and the cycle of the chip test is longer.
The present invention has been made in view of this.
Disclosure of Invention
The invention aims to solve the technical problems and overcome the defects of the prior art, and provides a chip temperature testing device, which adopts the following basic conception in the technical scheme:
the utility model provides a chip temperature testing device, includes support control box and the temperature test box of setting above that, the outside of support control box is fixed to be provided with the wiring row, be provided with the wiring hole on the wiring row, the side of wiring row is provided with the operation box, support on the control box with the fixed air cleaner that is provided with on the side adjacent to the wiring row, air cleaner's the end of giving vent to anger through the intake pipe with the inside intercommunication of temperature test box, the inside intermediate position of temperature test box is provided with the chip rack, the chip rack is three layer structure design, the chip rack has set gradually down the plywood, the intermediate layer board and has placed the plywood on from bottom to top, down the plywood place the plywood on the intermediate layer board be parallel structure design, the intermediate layer board on place the central point of plywood through back shaft interconnect, be provided with test substrate on the last test substrate, the chip rack has seted up the chip rack, the side of chip rack has the pin to correspond the groove, the pin corresponds the pin on the pin, the pin is provided with the side face of the side of side and has set up the pin on the main part, the main part has set up the pin on the main part.
As a further scheme of the invention: the upper cover plate is provided with a hollowed window at a position corresponding to the chip placing groove, the hollowed window is of a rectangular structural design, the size specification of the hollowed window is matched with that of the chip main body, the chip main body passes through the hollowed window to be exposed out of the upper cover plate, the bottom surface of the upper cover plate is in contact with the pin main body at the side edge of the chip main body, and the pin main body is ensured to be in close contact with the lead block by utilizing the pressing force of the upper cover plate.
As still further aspects of the invention: the pin guide plate is made of insulating materials, the pin guide plate is provided with an embedded groove, the conductive blocks are embedded and installed in the embedded groove, the arrangement positions, the number and the spacing of the conductive blocks correspond to those of the pin main bodies on the chip main body, the conductive pins penetrate through the test substrate and are connected with the wiring rows through built-in circuits, and the pin main bodies are not required to be externally connected with wires in the test process.
As still further aspects of the invention: the middle placement layer plate and the lower placement layer plate are provided with the same test substrate and auxiliary structures thereof as those on the upper placement layer plate, and the lower placement layer plate, the middle placement layer plate and the upper placement layer plate are simultaneously placed on the chip main body for testing, so that the number of chips to be tested at one time is large, and the efficiency is high.
As still further aspects of the invention: the inner wall of the temperature test box body is provided with a heating ring through the fixing frame, the heating ring is used for heating the inner part of the temperature test box body, and the temperature test box body is internally provided with a temperature sensor for monitoring the temperature condition of the test, and the accuracy of the test result is ensured by accurately controlling the temperature.
As still further aspects of the invention: install control valve one in the intake pipe, the hookup location of intake pipe is located the lower part side of temperature test box, the temperature test box is kept away from one side of air cleaner is provided with the air exhauster, the air inlet of air exhauster pass through the outlet duct with the inside of temperature test box is linked together, and hookup location is located the upper portion of temperature test box, install control valve two on the outlet duct, the gas outlet department of air exhauster is provided with the exhaust pipe, be used for with hot air in the temperature test box discharges.
As still further aspects of the invention: the temperature testing box is characterized in that a position, located on the upper portion of the operation box, of the outer side wall of the temperature testing box is provided with a chip main body taking and placing door, a sealing box door is installed on the taking and placing door through hinge connection, and an observation window is embedded in the middle position of the sealing box door, so that the testing process is convenient to check.
As still further aspects of the invention: the support control box is located the outer wall of air cleaner side is installed the heat dissipation window, be provided with the display screen on the operation box, the operation box is used for setting for, control the behavior of temperature test box.
As still further aspects of the invention: the middle placement layer plate, the upper placement layer plate and the lower placement layer plate can rotate relative to the supporting shaft, so that the chip main body can be conveniently taken and placed into the chip placement grooves at different positions, and the testing operation is convenient.
By adopting the technical scheme, compared with the prior art, the invention has the following beneficial effects.
The chip temperature testing device is provided with the pin guide plate, the conductive block and the conductive needle on the testing substrate, the built-in structure is connected with the wiring row through the built-in wires, the tested built-in structure is in an automatic communication state, the wiring row is provided with the wiring holes, the whole structure is provided with the wires, no inner wires are needed, the operation of the testing process is simple, the safety is good, the high-temperature resistance test is carried out in the working process of the chip main body, the testing result is similar to the actual use environment, and the testing accuracy is high.
After the temperature test box body is provided with the air filter and the exhaust fan, the chip main body can be rapidly cooled by utilizing the air cooling structure after the temperature test of the chip main body is finished, so that the chips in the next batch can be conveniently replaced, the test period of the chip main body is effectively shortened, and the performance of the chips cannot be influenced by utilizing room temperature air cooling.
The chip rack is of a three-layer structure design, the number of the chip main bodies is large, the efficiency is high, the upper cover plate is arranged on the chip rack, the chip main bodies are pressed and fixed, the contact stability of the pin main bodies and the conductive blocks is ensured, and the temperature test effect is ensured.
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention, without limitation to the invention. It is evident that the drawings in the following description are only examples, from which other drawings can be obtained by a person skilled in the art without the inventive effort. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a schematic diagram of a chip carrier according to the present invention;
FIG. 5 is a top half-sectional view of the chip carrier of the invention;
FIG. 6 is a schematic diagram of a chip mounting of the present invention;
FIG. 7 is a schematic diagram of a pin guide of the present invention.
In the figure: 1. an operation box body; 2. a wiring row; 3. a wiring hole; 4. supporting a control box; 5. an air filter; 6. a heat radiation window; 7. an air inlet pipe; 8. a first control valve; 9. a temperature test box; 10. a second control valve; 11. an air outlet pipe; 12. sealing the box door; 13. an exhaust fan; 14. an observation window; 15. an exhaust pipe; 16. a hinge; 17. a heating ring; 18. a fixing frame; 19. a temperature sensor; 20. a chip placing rack; 21. placing a laminate on the upper surface; 22. a support shaft; 23. placing a laminate in the middle; 24. placing a laminate under; 25. an upper cover plate; 26. a hollowed-out window; 27. a pin guide plate; 28. a chip placement groove; 29. testing the substrate; 30. a conductive needle; 31. a conductive block; 32. a chip main body; 33. a pin body.
It should be noted that these drawings and the written description are not intended to limit the scope of the inventive concept in any way, but to illustrate the inventive concept to those skilled in the art by referring to the specific embodiments.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention, and the following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
As shown in fig. 1 to 7, a chip temperature testing device, including supporting control box 4 and temperature test box 9 of setting above it, the outside of supporting control box 4 is fixed to be provided with wiring row 2, be provided with wiring hole 3 on the wiring row 2, the side of wiring row 2 is provided with operation box 1, fixedly on the side adjacent with wiring row 2 on supporting control box 4, the air cleaner 5 is provided with on the side that supports control box 4, the end of giving vent to anger of air cleaner 5 is linked together with temperature test box 9 inside through intake pipe 7, the inside intermediate position of temperature test box 9 is provided with chip rack 20, chip rack 20 is three layer structure design, chip rack 20 has set gradually down plywood 24 from bottom to top, intermediate layer plywood 23 and last plywood 21, lower plywood 24, intermediate layer plywood 23, the central point of last plywood 21 puts the plywood 21 and is connected each other through back shaft 22, be provided with test substrate 29 on the upper layer plywood 21, set up chip placement groove 28 on test substrate 29, the side edge of chip placement groove 28 is provided with pin corresponding to groove, the pin block 31 has set up the pin on the side of chip placement groove 28, the pin block corresponding to be provided with pin block 31 is provided with on the main part 32 on the main part of chip 32, the main part is contacted with pin block 31 on the main part 32, the main part is contacted with the bottom surface of chip 32 on the main part is 32, the main part is 32 is contacted with the main part of the chip 32.
The upper cover plate 25 is provided with a hollow window 26 at a position corresponding to the chip placing groove 28, the hollow window 26 is in a rectangular structural design, the dimension of the hollow window 26 is matched with the dimension of the chip main body 32, the chip main body 32 passes through the hollow window 26 to be exposed out of the upper cover plate 25, the bottom surface of the upper cover plate 25 is contacted with the pin main body 33 at the side edge of the chip main body 32, and the tight contact between the pin main body 33 and the wire block is ensured by the pressing force of the upper cover plate 25.
The pin guide plate 27 is made of insulating materials, the pin guide plate 27 is provided with embedded grooves, the conductive blocks 31 are embedded and installed in the embedded grooves, the arrangement positions, the number and the spacing of the conductive blocks 31 correspond to those of the pin main bodies 33 on the chip main bodies 32, the conductive pins 30 penetrate through the test substrate 29 and are connected with the wiring row 2 through built-in circuits, and wires are not required to be externally connected through the pin main bodies 33 in the test process.
The middle placement layer plate 23 and the lower placement layer plate 24 are provided with the same test substrate 29 and the auxiliary structure thereof as those on the upper placement layer plate 21, and the lower placement layer plate 24, the middle placement layer plate 23 and the upper placement layer plate 21 are simultaneously provided with the chip main body 32 for testing, so that the number of chips to be tested at one time is large and the efficiency is high.
The heating ring 17 is installed through mount 18 on the inner wall of temperature test box 9, and heating ring 17 is used for heating the inside of temperature test box 9, has set up temperature sensor 19 in the temperature test box 9 for the temperature condition of monitoring test, accurate accuse temperature ensures the accuracy of test result.
Install control valve one 8 on the intake pipe 7, the hookup location of intake pipe 7 is located the lower part side of temperature test box 9, one side that air cleaner 5 was kept away from to temperature test box 9 is provided with air exhauster 13, air inlet of air exhauster 13 is linked together with the inside of temperature test box 9 through outlet duct 11, hookup location is located the upper portion of temperature test box 9, install control valve two 10 on the outlet duct 11, the gas outlet department of air exhauster 13 is provided with exhaust pipe 15 for with the hot air in the temperature test box 9.
The position that is located operation box 1 upper portion on the lateral wall of temperature test box 9 is provided with chip main part 32 and gets and put the door, gets to put and connect through hinge 16 and install sealed chamber door 12 on the door, and the intermediate position of sealed chamber door 12 inlays and establishes installs observation window 14, is convenient for look over the test procedure.
The outer wall of the support control box 4, which is positioned at the side edge of the air filter 5, is provided with a heat radiation window 6, the operation box body 1 is provided with a display screen, and the operation box body 1 is used for setting and controlling the working condition of the temperature test box body 9.
The middle placement layer plate 23, the upper placement layer plate 21 and the lower placement layer plate 24 can rotate relative to the support shaft 22, so that the chip main body 32 can be conveniently taken and placed into the chip placement grooves 28 at different positions, and the testing operation is convenient.
The working principle of the invention is as follows: when the temperature test is carried out on the chip main body 32, the sealing box door 12 is opened, the chip main body 32 is placed in the chip placing groove 28 formed on the test substrate 29, the positions of the pin main bodies 33 at two sides of the chip main body 32 and the pin guide plate 27 are correspondingly arranged, the bottom surface of the pin main body 33 and the positions of the conductive blocks 31 formed on the pin guide plate 27 are correspondingly arranged, after the placement on the chip placing groove 28 at the outer side is finished, the placing laminate corresponding to the test substrate 29 is rotated, the chip main body 32 to be tested is placed in the chip placing groove 28 in sequence, after the placement is finished, the upper cover plate 25 is covered above the chip main body 32, so that the chip main body 32 passes through the hollowed-out window 26, the upper cover plate 25 can be pressed on the pin main body 33 to ensure that the pin main body 33 is in stable contact with the conductive block 31, the wiring holes 3 on the wiring row 2 are connected with elements arranged on the chip main body 32 to form a loop, so that the chip main body 32 is in a working state, then the temperature test box 9 is set by the operation box 1, the heating ring 17 works to heat the inside of the temperature test box 9, and the upper part of the chip main body 32 can be in direct contact with hot air through the hollowed-out window 26 to quickly heat, so that the chip main body 32 works in a high-temperature environment, and further the performance of the chip main body 32 is tested;
after the test is finished, the exhaust fan 13 and the air filter 5 are started, the exhaust fan 13 pumps out high-temperature air in the temperature test box body 9, the air pressure in the temperature test box body 9 is reduced, the air is filtered by the air filter 5 and then is supplied into the temperature test box body 9, the chip main body 32 is cooled by using normal-temperature air, the chips in the next batch are convenient to replace, the test period of the chip main body 32 is effectively shortened, and the performance of the chips cannot be influenced by using room-temperature air cooling;
the chip temperature testing device is characterized in that a pin guide plate 27, a conductive block 31 and a conductive needle 30 are arranged on a testing substrate 29, the built-in structure is connected with a wiring row 2 through built-in wires, the tested built-in structure is in an automatic communication state, wiring holes 3 are formed in the wiring row 2, the whole structure is provided with leads, no inner wires are needed, the operation of a testing process is simple, the safety is good, the high-temperature resistance test is carried out in the working process of a chip main body 32, the testing result is similar to the actual use environment, and the testing accuracy is high;
the chip rack 20 is of a three-layer structure design, the number of the chip main bodies 32 is large, the efficiency is high, the upper cover plate 25 is arranged on the chip rack 20, the chip main bodies 32 are pressed and fixed, the contact stability of the pin main bodies 33 and the conductive blocks 31 is ensured, and the temperature test effect is ensured.
The foregoing description is only illustrative of the preferred embodiment of the present invention, and is not to be construed as limiting the invention, but is to be construed as limiting the invention to any and all simple modifications, equivalent variations and adaptations of the embodiments described above, which are within the scope of the invention, may be made by those skilled in the art without departing from the scope of the invention.
Claims (9)
1. The utility model provides a chip temperature testing device, includes support control box (4) and sets up temperature test box (9) above that, its characterized in that, the outside of support control box (4) is fixed to be provided with wiring row (2), be provided with wiring hole (3) on wiring row (2), the side of wiring row (2) is provided with operation box (1), support control box (4) go up with be provided with air cleaner (5) on the side adjacent to wiring row (2), air cleaner (5) go out the air terminal through intake pipe (7) with temperature test box (9) inside is linked together, temperature test box (9) inside intermediate position is provided with chip rack (20), chip rack (20) are three-layer structure design, chip rack (20) have set gradually down plywood (24), intermediate layer board (23) and upper layer board (21) down, place (24) intermediate layer board (21) up in proper order, upper layer board (21) are parallel structure design, laminate board (21) down laminate board (21) are placed down and laminate board (21) up layer board (21) up through the intermediate layer board (21) is placed down, laminate board (21) up-down layer board (21) is placed down and laminate board (21) up to the connection center (21), the test substrate (29) is provided with a chip placing groove (28), the side edge of the chip placing groove (28) is provided with a pin corresponding groove, a pin guide plate (27) is arranged in the pin corresponding groove, a conductive block (31) is arranged on the pin guide plate (27), a conductive needle (30) is arranged below the conductive block (31), a chip main body (32) is placed in the chip placing groove (28), the side edge of the chip main body (32) is provided with a pin main body (33), the bottom surface of the pin main body (33) is in contact with the upper plane of the conductive block (31), and an upper cover plate (25) is arranged on the test substrate (29).
2. The chip temperature testing device according to claim 1, wherein a hollowed-out window (26) is formed in a position, corresponding to the chip placing groove (28), on the upper cover plate (25), the hollowed-out window (26) is of a rectangular structural design, the size specification of the hollowed-out window (26) is matched with the size specification of the chip main body (32), the chip main body (32) passes through the hollowed-out window (26) to be exposed out of the upper cover plate (25), and the bottom surface of the upper cover plate (25) is in contact with the pin main body (33) on the side edge of the chip main body (32).
3. The chip temperature testing device according to claim 2, wherein the pin guide plate (27) is made of an insulating material, an embedded groove is formed in the pin guide plate (27), the conductive blocks (31) are embedded and installed in the embedded groove, the arrangement positions, the number and the spacing of the conductive blocks (31) correspond to those of the pin main bodies (33) on the chip main bodies (32), and the conductive pins (30) penetrate through the testing substrate (29) and are connected with the wiring row (2) through built-in circuits.
4. A chip temperature testing apparatus according to claim 3, wherein the intermediate placement stage (23) and the lower placement stage (24) are provided with the same test substrate (29) and its attached structure as the upper placement stage (21), and the chip main body (32) is placed on the lower placement stage (24), the intermediate placement stage (23) and the upper placement stage (21) at the same time for testing.
5. The chip temperature testing device according to claim 4, wherein a heating ring (17) is mounted on the inner wall of the temperature testing box body (9) through a fixing frame (18), and a temperature sensor (19) is arranged in the temperature testing box body (9).
6. The chip temperature testing device according to claim 5, wherein the first control valve (8) is installed on the air inlet pipe (7), the connection position of the air inlet pipe (7) is located at the side edge of the lower portion of the temperature testing box body (9), an exhaust fan (13) is arranged at one side, far away from the air filter (5), of the temperature testing box body (9), an air inlet of the exhaust fan (13) is communicated with the inside of the temperature testing box body (9) through an air outlet pipe (11), the connection position is located at the upper portion of the temperature testing box body (9), the second control valve (10) is installed on the air outlet pipe (11), and an exhaust pipe (15) is arranged at the air outlet of the exhaust fan (13).
7. The chip temperature testing device according to claim 6, wherein the chip main body (32) taking and placing door is arranged on the outer side wall of the temperature testing box body (9) and located on the upper portion of the operation box body (1), a sealing box door (12) is connected and installed on the taking and placing door through a hinge (16), and an observation window (14) is embedded and installed in the middle position of the sealing box door (12).
8. The chip temperature testing device according to claim 7, wherein the support control box (4) is provided with a heat radiation window (6) on the outer wall of the side edge of the air filter (5), and the operation box body (1) is provided with a display screen.
9. A chip temperature testing apparatus according to claim 8, wherein the intermediate placement layer (23), the upper placement layer (21) and the lower placement layer (24) are rotatable with respect to the support shaft (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311707076.3A CN117706328A (en) | 2023-12-13 | 2023-12-13 | Chip temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311707076.3A CN117706328A (en) | 2023-12-13 | 2023-12-13 | Chip temperature testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117706328A true CN117706328A (en) | 2024-03-15 |
Family
ID=90150902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311707076.3A Pending CN117706328A (en) | 2023-12-13 | 2023-12-13 | Chip temperature testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117706328A (en) |
-
2023
- 2023-12-13 CN CN202311707076.3A patent/CN117706328A/en active Pending
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