CN117697606A - Wafer cleaning device and wafer cleaning method - Google Patents
Wafer cleaning device and wafer cleaning method Download PDFInfo
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- CN117697606A CN117697606A CN202410167915.5A CN202410167915A CN117697606A CN 117697606 A CN117697606 A CN 117697606A CN 202410167915 A CN202410167915 A CN 202410167915A CN 117697606 A CN117697606 A CN 117697606A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 69
- 238000003860 storage Methods 0.000 claims abstract description 49
- 238000005498 polishing Methods 0.000 claims abstract description 43
- 239000002002 slurry Substances 0.000 claims abstract description 29
- 238000001125 extrusion Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims description 82
- 239000007921 spray Substances 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000013461 design Methods 0.000 abstract description 3
- 230000033001 locomotion Effects 0.000 abstract description 3
- 239000012634 fragment Substances 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of wafer production, in particular to a wafer cleaning device and a wafer cleaning method. The invention can realize intermittent movement of the transmission groove, so that the wafer body can stay below the storage hole and below the polishing disc for a period of time in the transmission process, the extrusion plate can intermittently extrude the polishing slurry in the storage cavity onto the wafer body, the polishing disc can move downwards to polish the wafer body, the linkage is high, the design is ingenious, the polishing slurry and fragments can be automatically removed, manual cleaning is not needed, the production quality is improved, and manpower and material resources are saved.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a wafer cleaning device and a wafer cleaning method.
Background
An integrated circuit is a circuit system in which a plurality of electronic circuits are formed into various electronic components such as diodes and transistors on a semiconductor substrate by oxidation, etching, diffusion and the like, and a specific logic function is completed on a small area to achieve a preset circuit function requirement, while a wafer is a basic raw material for manufacturing the integrated circuit, and the wafer is subjected to multiple processes during production and is polished finally.
In the prior art, after polishing the wafer, some scraps or slurry are remained on a plurality of surfaces of the wafer, and the wafer needs to be cleaned, but the wafer is manually taken out for manual cleaning at present, so that manpower and material resources are wasted, and the production efficiency is reduced.
Disclosure of Invention
The invention aims to provide a wafer cleaning device and a wafer cleaning method for solving the technical problems, and the invention is realized by adopting the following technical scheme:
the wafer cleaning device comprises a base, a total support, a transmission mechanism, a polishing mechanism, a slurry outlet mechanism and a cleaning mechanism, wherein the total support is fixedly connected to the top wall of the base, and the transmission mechanism, the polishing mechanism, the slurry outlet mechanism and the cleaning mechanism are all arranged on the total support.
The transmission mechanism comprises a first motor, a first transmission bar, a second transmission bar, a sliding block, pushing teeth, a first rotary table, a second rotary table and a transmission soft belt;
the first motor is fixedly connected to the front wall of the total support, the first output shaft is arranged on the first motor, the first transmission bar is fixedly connected to the first output shaft, the second transmission bar is rotationally connected to the first transmission bar, the sliding block is rotationally connected to the second transmission bar, the sliding block is slidingly connected to the front wall of the total support, the first rotating disc and the second rotating disc are rotationally connected to the front wall of the total support, the first rotating disc is connected with the second rotating disc through a soft transmission belt, more than two transmission grooves are formed in the soft transmission belt, one side wall of each transmission groove is an inclined surface, pushing teeth are rotationally connected to the front wall of the sliding block, and the sliding block is inserted into one of the transmission grooves;
the rear wall of the transmission soft belt is fixedly connected with more than two wafer fixing mechanisms.
The wafer fixing mechanism comprises a conveying plate, a rotating plate, a first wedge block and two clamping mechanisms, wherein the conveying plate is fixedly connected to the rear wall of the transmission soft belt, a first groove is formed in the conveying plate, the rotating plate is rotationally connected to the front wall of the first groove, a first channel is formed in the rotating plate, the first wedge block is fixedly connected to the bottom wall of the rotating plate, the clamping mechanisms comprise a first connecting piece, a first elastic piece and a clamping piece, the first connecting piece is fixedly connected to the top wall of the rotating plate, and the clamping piece is connected with the first connecting piece through the first elastic piece.
The pulp discharging mechanism comprises a first worm gear, a worm, a connecting seat, a second worm gear, a second force application bar, an extension rod, a force application bar, an extrusion plate and a storage box;
the first worm wheel is fixedly connected to the first output shaft, the storage box and the connecting seat are fixedly connected to the front wall of the main support, the worm is rotationally connected to the connecting seat, the second worm wheel is rotationally connected to the front wall of the main support, the first worm wheel and the second worm wheel are respectively meshed with the worm, the second force application bar is fixedly connected to the side wall of the second worm wheel, more than two force bars are fixedly connected to the side wall of the extension rod, the extrusion plate is fixedly connected to the lower end of the extension rod, a storage cavity is formed in the storage box, grinding slurry is filled in the storage cavity, the bottom wall of the storage cavity is communicated with the bottom wall of the storage box through a storage opening, a second channel is formed in the side wall of the storage box, the second channel is communicated with the storage opening, the extrusion plate is slidably connected to the inner wall of the storage cavity, the baffle is connected with the side wall of the second channel through a second elastic piece, a through hole is formed in the baffle plate, the right wall of the baffle extends to the outside of the storage box, and the second wedge block is fixedly connected to the right wall of the baffle plate;
the polishing mechanism comprises a first force application bar, a second motor, a second output shaft, a connecting rod, a polishing disc, a sliding plate, a third wedge block, a fixing plate and a third elastic piece, wherein the first force application bar is fixedly connected to the first output shaft, the second motor is fixedly connected to the top wall of the sliding plate, the third wedge block is fixedly connected to the left wall of the sliding plate, the sliding plate is slidably connected to the front wall of the main support, the connecting rod is fixedly connected to the lower end of the second output shaft on the second motor, the polishing disc is fixedly connected to the lower end of the connecting rod, the fixing plate is fixedly connected to the front wall of the main support, and the bottom wall of the fixing plate is connected with the top wall of the sliding plate through the third elastic piece.
Advantageously, the cleaning mechanism comprises a first runner, a second runner, a steering member, a spray head, a first spur rack, a spur gear, a second spur rack, a second connecting bar, a fourth wedge block, a fourth elastic member, and a second connecting piece;
the first runner and the second runner are all rotationally connected to the back wall of the rotating plate, the steering part, the spray head and the second connecting piece are all fixedly connected to the front wall of the main support, the spray head is connected with an external water supply system, two notches are formed in the steering part, two conducting mechanisms are fixedly connected to the steering part and comprise a guide part, a support bar and a first connecting bar, the guide part is in a triangular prism shape and is fixedly connected to the top wall of the support bar, the support bar is connected to the steering part through the first connecting bar, the two guide parts are respectively located below the two notches, the first straight rack and the second straight rack are respectively and slidingly connected to the front wall of the main support, the straight gear is rotationally connected to the front wall of the main support, the first straight rack and the second straight rack are respectively meshed with the straight gear, the fourth wedge block is connected with the second straight rack through the second connecting bar, and the second connecting bar is connected with the second connecting piece through the fourth elastic piece.
The feeding pipe is arranged on the storage box, and the valve is arranged on the feeding pipe.
Advantageously, the front wall of the main support is fixedly connected with a sliding rail, and the sliding block is connected to the sliding rail in a sliding way.
A wafer cleaning method comprising the steps of:
step one: placing the wafer body on the transmission mechanism, transporting the wafer body to the lower part of the slurry outlet mechanism by the transmission mechanism, and coating grinding slurry on the wafer body by the slurry outlet mechanism;
step two: the transmission mechanism conveys the wafer body to the lower part of the polishing mechanism, and the polishing mechanism polishes the wafer body;
step three: the transmission mechanism conveys the wafer body to the cleaning mechanism, and the cleaning mechanism cleans the wafer body.
The invention has the following beneficial effects:
according to the invention, intermittent movement of the transmission groove can be realized through driving of the first motor, so that the wafer body can stay below the material storage opening and below the polishing disc for a period of time in the transmission process, the extrusion plate can intermittently extrude the polishing slurry in the material storage cavity onto the wafer body, the polishing disc can move downwards to polish the wafer body, and the linkage is high and the design is ingenious; through breach, the guide on first runner, second runner and the steering part, can make the wafer body overturn one hundred eighty degrees twice automatically to make shower nozzle spun hydroenergy clean a plurality of faces and a plurality of lateral walls of wafer body, get rid of lapping paste and piece automatically, need not the manual cleaning, improve production quality, use manpower sparingly material resources.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic view of a wafer cleaning apparatus according to the present invention;
FIG. 2 is an enlarged view of the invention at A in FIG. 1;
FIG. 3 is an enlarged view of the polishing mechanism and the slurry discharge mechanism of FIG. 1 in accordance with the present invention;
FIG. 4 is an enlarged view of the transfer plate, the first spur rack, the spur gear, and the second spur rack of the transfer plate of FIG. 1 in accordance with the present invention;
FIG. 5 is an enlarged view of the steering member of FIG. 1 in accordance with the present invention;
FIG. 6 is a top view of the belt and transfer plate of FIG. 1 in accordance with the present invention;
FIG. 7 is a cross-sectional view taken along the direction B-B in FIG. 5 in accordance with the present invention;
FIG. 8 is a perspective view of the guide, support bar, and first connector bar of the present invention;
fig. 9 is a diagram of the engagement structure of the push teeth and the drive slots of fig. 1 in accordance with the present invention.
Reference numerals: 1. a base; 2. a main support; 3. a first motor; 4. a first output shaft; 5. a first transmission bar; 6. a second transmission bar; 7. a slide block; 8. pushing teeth; 9. a slide rail; 10. a first turntable; 11. a second turntable; 12. a transmission soft belt; 13. a transmission groove; 14. a transfer plate; 15. a first groove; 16. a rotating plate; 17. a first channel; 18. a first wheel; 19. a second wheel; 20. a first connecting piece; 21. a first elastic member; 22. a clamping member; 23. a first wedge block; 24. a wafer body; 25. a first force application bar; 26. a first worm wheel; 27. a worm; 28. a connecting seat; 29. a second worm wheel; 30. a second force application bar; 31. an extension rod; 32. a force bar; 33. an extrusion plate; 34. a storage bin; 35. a storage cavity; 36. a storage port; 37. a second channel; 38. a baffle plate; 39. a through hole; 40. a second wedge block; 41. a second elastic member; 42. a feeding tube; 43. a second motor; 44. a second output shaft; 45. a connecting rod; 46. polishing disk; 47. a slide plate; 471. a third wedge; 48. a fixing plate; 49. a third elastic member; 50. a steering member; 51. a notch; 52. a guide member; 53. a support bar; 54. a first connecting bar; 55. a spray head; 56. a first straight rack; 57. spur gears; 58. a second spur rack; 59. a second connecting bar; 60. a fourth wedge; 61. a fourth elastic member; 62. and a second connecting piece.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected via an intermediary, or connected by communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1-9, a wafer cleaning device comprises a base 1, a main support 2, a transmission mechanism, a polishing mechanism, a slurry discharging mechanism and a cleaning mechanism, wherein the main support 2 is fixedly connected to the top wall of the base 1, and the transmission mechanism, the polishing mechanism, the slurry discharging mechanism and the cleaning mechanism are all arranged on the main support 2.
According to an alternative embodiment of the present invention, the transmission mechanism includes a first motor 3, a first driving bar 5, a second driving bar 6, a sliding block 7, a pushing tooth 8, a first rotating disc 10, a second rotating disc 11, and a soft transmission belt 12, where the first motor 3 is fixedly connected to the front wall of the main support 2, the first output shaft 4 is disposed on the first motor 3, the first driving bar 5 is fixedly connected to the first output shaft 4, the second driving bar 6 is rotatably connected to the first driving bar 5, the sliding block 7 is rotatably connected to the second driving bar 6, the sliding block 7 is slidably connected to the front wall of the main support 2, the first rotating disc 10 and the second rotating disc 11 are rotatably connected to the front wall of the main support 2, the first rotating disc 10 is connected to the second rotating disc 11 through the soft transmission belt 12, two or more transmission grooves 13 are formed on the soft transmission belt 12, one side wall of the transmission grooves 13 is an inclined plane, the pushing tooth 8 is rotatably connected to the front wall of the sliding block 7, and the sliding block 7 is inserted into one of the transmission grooves 13;
the rear wall of the transmission soft belt 12 is fixedly connected with more than two wafer fixing mechanisms.
According to an alternative embodiment of the present invention, the wafer fixing mechanism includes a transfer plate 14, a rotating plate 16, a first wedge block 23, and two clamping mechanisms, where the transfer plate 14 is fixedly connected to the rear wall of the flexible belt 12, a first groove 15 is formed on the transfer plate 14, the rotating plate 16 is rotatably connected to the front wall of the first groove 15, a first channel 17 is formed on the rotating plate 16, the first wedge block 23 is fixedly connected to the bottom wall of the rotating plate 16, the clamping mechanisms include a first connecting piece 20, a first elastic member 21, and a clamping member 22, the first connecting piece 20 is fixedly connected to the top wall of the rotating plate 16, and the clamping member 22 is connected to the first connecting piece 20 through the first elastic member 21.
According to an alternative embodiment of the present invention, the slurry discharging mechanism includes a first worm wheel 26, a worm 27, a connecting seat 28, a second worm wheel 29, a second force bar 30, an extension rod 31, a force bar 32, an extrusion plate 33 and a storage tank 34, wherein the first worm wheel 26 is fixedly connected to the first output shaft 4, the storage tank 34 and the connecting seat 28 are fixedly connected to the front wall of the main support 2, the worm 27 is rotatably connected to the connecting seat 28, the second worm wheel 29 is rotatably connected to the front wall of the main support 2, the first worm wheel 26 and the second worm wheel 29 are respectively meshed with the worm 27, the second force bar 30 is fixedly connected to the side wall of the second worm wheel 29, two or more force bars 32 are fixedly connected to the side wall of the extension rod 31, the extrusion plate 33 is fixedly connected to the lower end of the extension rod 31, a storage cavity 35 is provided in the storage tank 34, the bottom wall of the storage cavity 35 is filled with abrasive slurry, the bottom wall of the storage cavity 35 is communicated with the bottom wall of the storage tank 34 through a storage port 36, the side wall of the storage tank 34 is provided with a second channel 37, the second channel 37 is connected to the inner wall of the storage tank 38 through a second channel 37 and a right baffle wall 38, the second channel 37 is connected to the inner wall of the second channel 38, and the second baffle 38 is fixedly connected to the inner wall of the second channel 38 through a sliding baffle 38, and the second baffle wall 38 is fixedly connected to the second baffle wall 38;
the polishing mechanism comprises a first force application bar 25, a second motor 43, a second output shaft 44, a connecting rod 45, a polishing disc 46, a slide plate 47, a third wedge-shaped block 471, a fixed plate 48 and a third elastic piece 49, wherein the first force application bar 25 is fixedly connected to the first output shaft 4, the second motor 43 is fixedly connected to the top wall of the slide plate 47, the third wedge-shaped block 471 is fixedly connected to the left wall of the slide plate 47, the slide plate 47 is slidably connected to the front wall of the total support 2, the connecting rod 45 is fixedly connected to the lower end of the second output shaft 44 on the second motor 43, the polishing disc 46 is fixedly connected to the lower end of the connecting rod 45, the fixed plate 48 is fixedly connected to the front wall of the total support 2, and the bottom wall of the fixed plate 48 is connected with the top wall of the slide plate 47 through the third elastic piece 49.
In an alternative embodiment according to the present invention, the cleaning mechanism includes a first runner 18, a second runner 19, a steering member 50, a spray head 55, a first straight rack 56, a straight gear 57, a second straight rack 58, a second connecting bar 59, a fourth wedge 60, a fourth elastic member 61, and a second connecting piece 62;
the first rotating wheel 18 and the second rotating wheel 19 are both rotationally connected to the rear wall of the rotating plate 16, the steering piece 50, the spray head 55 and the second connecting piece 62 are all fixedly connected to the front wall of the total support 2, the spray head 55 is connected with an external water supply system, two notches 51 are formed in the steering piece 50, two conducting mechanisms are fixedly connected to the steering piece 50, each conducting mechanism comprises a guide piece 52, a support bar 53 and a first connecting strip 54, the guide piece 52 is in a triangular prism shape, the guide piece 52 is fixedly connected to the top wall of the support bar 53, the support bar 53 is connected to the steering piece 50 through the first connecting strip 54, the two guide pieces 52 are respectively located below the two notches 51, the first straight rack 56 and the second straight rack 58 are respectively and slidingly connected to the front wall of the total support 2, the straight rack 57 is rotationally connected to the front wall of the total support 2, the first straight rack 56 and the second straight rack 58 are respectively meshed with the straight rack 57, the fourth wedge 60 is connected through the second connecting strip 59 and the second straight rack 58, and the second connecting strip 59 is connected through the fourth connecting strip 61 and the second connecting piece 62.
In an alternative embodiment of the present invention, the material storage tank 34 is provided with a material feeding pipe 42, and the material feeding pipe 42 is provided with a valve.
In an alternative embodiment of the present invention, the front wall of the main support 2 is fixedly connected with a sliding rail 9, and the sliding block 7 is slidably connected to the sliding rail 9.
A wafer cleaning method comprising the steps of:
step one: placing the wafer body 24 on the conveying mechanism, conveying the wafer body 24 to the lower part of the slurry outlet mechanism by the conveying mechanism, and coating grinding slurry on the wafer body 24 by the slurry outlet mechanism;
step two: the transmission mechanism conveys the wafer body 24 to the lower part of the polishing mechanism, and the polishing mechanism polishes the wafer body 24;
step three: the transport mechanism transports the wafer body 24 to the cleaning mechanism, which cleans the wafer body 24.
The implementation process comprises the following steps: placing the wafer body 24 on the top wall of the rotating plate 16, wherein the wafer body 24 is positioned above the first channel 17, clamping the wafer body 24 by using the two clamping pieces 22, starting the first motor 3 and the second motor 43, and rotating the first output shaft 4 on the first motor 3 so as to drive the first transmission bar 5, the first force application bar 25 and the first worm wheel 26 to rotate;
the first transmission bar 5 rotates to drive the sliding block 7 to reciprocate left and right along the sliding rail 9 through the second transmission bar 6;
when the sliding block 7 moves leftwards, as one side wall of the transmission groove 13 is in an inclined plane shape, the pushing teeth 8 can pass through part of the transmission groove 13 and can not drive the transmission soft belt 12 to rotate, in the process, the first force application bar 25 can rotate to push the sliding plate 47 downwards, the sliding plate 47 overcomes the elasticity of the third elastic piece 49 to move downwards, the sliding plate 47 drives the third wedge-shaped block 471 to move downwards, the third wedge-shaped block 471 can push the second wedge-shaped block 40 and the baffle plate 38 to move leftwards, the baffle plate 38 which originally seals the storage opening 36 can enable the storage opening 36 to be communicated through the through hole 39 so as to facilitate the extrusion of grinding slurry in the storage cavity 35, the first worm wheel 26 drives the worm 27, the second worm wheel 29 and the second force application bar 30 to rotate, and each turn of the second force application bar 30 can push one of the force application bars 32 downwards for a small distance, so that the extrusion plate 33 moves downwards by a small distance, the extrusion plate 33 extrudes a small part of grinding slurry in the storage cavity 35 from the storage opening 36 onto one of the wafer bodies 24 below the storage opening 36 so as to facilitate subsequent polishing, the second output shaft 44 on the second motor 43 drives the connecting rod 45 and the polishing disc 46 to rotate, so that the polishing disc 46 rotates rapidly, when the polishing disc 46 moves downwards, the polishing disc 46 abuts against the surface of one of the wafer bodies 24 below the polishing disc, the wafer bodies 24 are polished, when the first force application strip 25 is separated from the sliding plate 47, the polishing disc 46 moves upwards under the action of the elastic force of the third elastic piece 49 to reset, the polishing of one of the wafer bodies 24 is completed, and the baffle 38 moves leftwards under the elastic force of the second elastic piece 41 to reset, so that the baffle 38 prevents the grinding slurry from flowing out to cause waste;
when the slide block 7 moves right, the pushing teeth 8 are inserted into one of the transmission grooves 13, so that the transmission soft belt 12 is driven to rotate clockwise, and all the wafer bodies 24 move right, the grinding slurry is not extruded from the storage box 34 in the process, and the polishing disc 46 is not propped against the wafer bodies 24.
When one of the conveying plates 14 moves to the steering part 50, the second rotating wheel 19 enters the left notch 51 under the guide of the left guide part 52, the rotating plate 16 overturns for one hundred and eighty degrees, the first rotating wheel 18 does not enter the left notch 51, after the rotating plate 16 overturns for one hundred and eighty degrees, the first rotating wheel 18 and the second rotating wheel 19 are transposed, then the first rotating wheel 18 enters the right notch 51, so that the rotating plate 16 overturns for one hundred and eighty degrees again to reset, in the process of twice overturning the rotating plate 16, the wafer body 24 is driven to overturn twice, so that the water sprayed by the nozzle 55 washes the two surfaces and the side wall of the first force application bar 25, washes chips and abrasive slurry, increases the cleaning area, improves the cleaning quality, and when the first wedge block 23 and the fourth wedge block 60 on the bottom wall of the conveying plate 14 are propped against, the fourth wedge block 60 and the second straight rack 58 are pushed to move downwards, the second straight rack 58 drives the gear 57 to rotate, so that the first straight rack 57 drives the wafer body 24 to move upwards, and the wafer body 24 can be clamped by the first straight rack 56, and the wafer body 24 can be clamped by the wafer body 24, and the wafer body 24 can be clamped by the operator, and the wafer carrier device can be arranged on the wafer carrier 24.
The intermittent motion of the transmission groove 13 can be realized through the driving of the first motor 3, so that the wafer body 24 can stay below the storage port 36 and below the polishing disc 46 for a period of time in the transmission process, the extrusion plate 33 can intermittently extrude the polishing slurry in the storage cavity 35 onto the wafer body 24, the polishing disc 46 can move downwards to polish the wafer body 24, and the linkage is high and the design is ingenious; through breach 51, the guide 52 on first runner 18, second runner 19 and the steering member 50, can make wafer body 24 carry out automatic upset one hundred eighty degrees twice to make shower nozzle 55 spun hydroenergy clean a plurality of faces and a plurality of lateral walls of wafer body 24, automatic get rid of lapping paste and piece, need not the manual cleaning, improve production quality, use manpower sparingly material resources.
The components, modules, mechanisms and devices of the invention, which do not describe the structure in detail, are all common standard components or components known to those skilled in the art, and the structure and principle thereof are all known to those skilled in the art through technical manuals or through routine experimental methods.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. The wafer cleaning device is characterized by comprising a base (1), a main support (2), a transmission mechanism, a polishing mechanism, a slurry discharging mechanism and a cleaning mechanism, wherein the main support (2) is fixedly connected to the top wall of the base (1), and the transmission mechanism, the polishing mechanism, the slurry discharging mechanism and the cleaning mechanism are all arranged on the main support (2);
the transmission mechanism comprises a first motor (3), a first transmission bar (5), a second transmission bar (6), a sliding block (7), pushing teeth (8), a first rotary table (10), a second rotary table (11) and a transmission soft belt (12), wherein the first motor (3) is fixedly connected to the front wall of the total support (2), a first output shaft (4) is arranged on the first motor (3), the first transmission bar (5) is fixedly connected to the first output shaft (4), the second transmission bar (6) is rotationally connected to the first transmission bar (5), the sliding block (7) is rotationally connected to the second transmission bar (6), the sliding block (7) is slidingly connected to the front wall of the total support (2), the first rotary table (10) and the second rotary table (11) are rotationally connected to the front wall of the total support (2), more than two transmission grooves (13) are formed in the transmission soft belt (12) through the transmission soft belt (12), one side wall of the transmission grooves (13) is a bevel, the pushing teeth (8) are rotationally connected to the front wall of the sliding block (7), and the sliding block (7) is inserted into one of the transmission grooves (13);
the rear wall of the transmission soft belt (12) is fixedly connected with more than two wafer fixing mechanisms;
the cleaning mechanism comprises a first rotating wheel (18), a second rotating wheel (19), a steering piece (50), a spray head (55), a first straight rack (56), a straight gear (57), a second straight rack (58), a second connecting bar (59), a fourth wedge block (60), a fourth elastic piece (61) and a second connecting piece (62);
the first rotating wheel (18) and the second rotating wheel (19) are both rotationally connected to the rear wall of the rotating plate (16), the steering piece (50), the spray head (55) and the second connecting piece (62) are all fixedly connected to the front wall of the total support (2), the spray head (55) is connected with an external water supply system, two notches (51) are formed in the steering piece (50), two conduction mechanisms are fixedly connected to the steering piece (50), each conduction mechanism comprises a guide piece (52), a support bar (53) and a first connecting strip (54), the guide piece (52) is in a triangular prism shape, the guide piece (52) is fixedly connected to the top wall of the support bar (53), the support bar (53) is connected to the steering piece (50) through the first connecting strip (54), the two guide pieces (52) are respectively located below the two notches (51), the first straight racks (56) and the second straight racks (58) are respectively connected to the front wall of the total support (2) in a sliding mode, the straight gears (57) are rotationally connected to the front wall of the total support (2), the first straight racks (56) and the second straight racks (58) are respectively meshed with the second straight racks (58) and the fourth racks (58) through the second straight racks (58) and the second straight racks (59), the second connecting strip (59) is connected with the second connecting piece (62) through a fourth elastic piece (61).
2. The wafer cleaning device according to claim 1, wherein the wafer fixing mechanism comprises a conveying plate (14), a rotating plate (16), a first wedge block (23) and two clamping mechanisms, the conveying plate (14) is fixedly connected to the rear wall of the transmission soft belt (12), a first groove (15) is formed in the conveying plate (14), the rotating plate (16) is rotatably connected to the front wall of the first groove (15), a first channel (17) is formed in the rotating plate (16), the first wedge block (23) is fixedly connected to the bottom wall of the rotating plate (16), the clamping mechanisms comprise a first connecting piece (20), a first elastic piece (21) and a clamping piece (22), the first connecting piece (20) is fixedly connected to the top wall of the rotating plate (16), and the clamping piece (22) is connected with the first connecting piece (20) through the first elastic piece (21).
3. The wafer cleaning device according to claim 2, wherein the pulp discharging mechanism comprises a first worm wheel (26), a worm (27), a connecting seat (28), a second worm wheel (29), a second force application bar (30), an extension rod (31), a force application bar (32), an extrusion plate (33) and a storage box (34), wherein the first worm wheel (26) is fixedly connected to the first output shaft (4), the storage box (34) and the connecting seat (28) are fixedly connected to the front wall of the total support (2), the worm (27) is rotationally connected to the connecting seat (28), the second worm wheel (29) is rotationally connected to the front wall of the total support (2), the first worm wheel (26) and the second worm wheel (29) are respectively meshed with the worm (27), the second force application bar (30) is fixedly connected to the side wall of the second worm wheel (29), the two or more force application bars (32) are fixedly connected to the side wall of the extension rod (31), the extrusion plate (33) is fixedly connected to the lower end of the extension rod (31), a storage box (34) is internally provided with a storage cavity (35), the second storage cavity (35) is internally provided with a bottom wall (37) and a storage cavity (37) is internally communicated with the storage box (37), the extrusion plate (33) is connected to the inner wall of the storage cavity (35) in a sliding manner, the baffle plate (38) is connected to the inner wall of the second channel (37) in a sliding manner, the baffle plate (38) is connected with the side wall of the second channel (37) through a second elastic piece (41), a through hole (39) is formed in the baffle plate (38), the right wall of the baffle plate (38) extends to the outside of the storage box (34), and the second wedge block (40) is fixedly connected to the right wall of the baffle plate (38);
the polishing mechanism comprises a first force application strip (25), a second motor (43), a second output shaft (44), a connecting rod (45), a polishing disc (46), a sliding plate (47), a third wedge block (471), a fixing plate (48) and a third elastic piece (49), wherein the first force application strip (25) is fixedly connected to the first output shaft (4), the second motor (43) is fixedly connected to the top wall of the sliding plate (47), the third wedge block (471) is fixedly connected to the left wall of the sliding plate (47), the sliding plate (47) is slidably connected to the front wall of the main support (2), the connecting rod (45) is fixedly connected to the lower end of the second output shaft (44) on the second motor (43), the polishing disc (46) is fixedly connected to the lower end of the connecting rod (45), the fixing plate (48) is fixedly connected to the front wall of the main support (2), and the bottom wall of the fixing plate (48) is connected to the top wall of the sliding plate (47) through the third elastic piece (49).
4. A wafer cleaning apparatus according to claim 3, characterized in that the feed tank (34) is provided with a feed pipe (42), and the feed pipe (42) is provided with a valve.
5. The wafer cleaning device according to claim 4, wherein the front wall of the main support (2) is fixedly connected with a sliding rail (9), and the sliding block (7) is slidably connected to the sliding rail (9).
6. A wafer cleaning method, characterized by being based on a wafer cleaning device according to any one of claims 1-4, comprising the steps of:
step one: placing the wafer body (24) on a transmission mechanism, transporting the wafer body (24) to the lower part of a slurry outlet mechanism, and coating grinding slurry on the wafer body (24) by the slurry outlet mechanism;
step two: the wafer body (24) is transported to the lower part of the polishing mechanism by the transmission mechanism, and the wafer body (24) is polished by the polishing mechanism;
step three: the wafer body (24) is transported to the cleaning mechanism by the transport mechanism, and the cleaning mechanism cleans the wafer body (24).
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