CN117393443A - A seal equipment for semiconductor diode - Google Patents
A seal equipment for semiconductor diode Download PDFInfo
- Publication number
- CN117393443A CN117393443A CN202311698805.3A CN202311698805A CN117393443A CN 117393443 A CN117393443 A CN 117393443A CN 202311698805 A CN202311698805 A CN 202311698805A CN 117393443 A CN117393443 A CN 117393443A
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- China
- Prior art keywords
- polishing
- fluted disc
- diode
- sleeve
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000005498 polishing Methods 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000007789 sealing Methods 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 238000001746 injection moulding Methods 0.000 claims description 45
- 230000000903 blocking effect Effects 0.000 claims description 29
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 19
- 238000002360 preparation method Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000012528 membrane Substances 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000005622 photoelectricity Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor diode processing, in particular to a sealing device for a semiconductor diode, which comprises a bearing mechanism, a glue injection polishing mechanism arranged on the bearing mechanism and a clamping mechanism arranged on the glue injection polishing mechanism. Until the sealing glue material is solidified on the end heads of two polar posts in the diode, until the glue head on the polar posts is solidified, along with the reset of a hydraulic sub-rod in the hydraulic rod, the sleeve can drive the sealing fluted disc and the fixed diode to move towards the middle parts of two polishing outer covers, meanwhile, along with the two auxiliary traction pieces which are transversely moved along with the sleeve, the two inclined frames can be driven to apply closed tension to the two polishing outer covers, finally, the solidified glue head of the diode can be clamped by the two polishing outer covers, and along with the rotation of a threaded rod body on a transmission shaft in a transmission mechanism, the sealing fluted disc can also drive the diode to integrally rotate, so that the diode can be effectively ensured to be subjected to integrated operation from preparation to polishing.
Description
Technical Field
The invention relates to the technical field of semiconductor diode processing, in particular to a sealing device for a semiconductor diode.
Background
The semiconductor diode is divided into germanium, silicon or gallium arsenide according to materials; the structure is divided into point contact, pn junction, pin, schottky barrier and heterojunction; the principle is divided into tunnel, varactor, avalanche and step recovery, etc. and is mainly used for detecting, mixing, parametric amplification, switching, voltage stabilization, rectification, etc. after the development of optical communication, diodes such as luminescence, photoelectricity, avalanche photoelectricity, pin photoelectricity, semiconductor laser, etc. appear.
Because the diode structure is smaller, special equipment is needed to carry out glue injection operation on two polar posts in the light-emitting diode in the process of preparing the light-emitting diode, but the light-emitting diode has small structure, and after the polar posts are sealed, small burrs and protrusions which are difficult to remove exist on the surface of a solidified end, so that the light-emitting diode has no equipment for precisely polishing the end of the light-emitting diode with the small structure at present.
The invention aims at the integrated polishing operation of the end after the light-emitting diode is sealed and solidified, so as to improve the integrity of the light-emitting diode to a finished product, namely the technical difficulty to be solved by the invention.
Disclosure of Invention
The present invention aims to solve one of the technical problems existing in the prior art or related technologies.
The technical scheme adopted by the invention is as follows:
the utility model provides a seal gum equipment for semiconductor diode, including bear the weight of the mechanism, install the injecting glue polishing mechanism on bearing the weight of the mechanism and install the fixture on injecting glue polishing mechanism, bear the weight of the mechanism including the base, install in the inside anchor clamps of base and the vertically distributed drive mechanism, the baffle of fixed mounting in the base and be close to drive mechanism one side, the fixed mounting is in two places splint inside the base, two locating levers of fixed mounting in the base top both sides, fix the base holder of putting at the base top, the backing plate of movable mounting outside two locating levers, the movable mounting is at the base bottom sleeve pipe of backing plate put the top holder and connect the first spring in the base sleeve pipe of backing plate, the injection molding polishing mechanism comprises an injection molding film right above a base and horizontally arranged, a guide pipe fixed in an arc hole at one end of the injection molding film, a second spring connected to the end head at the top of the guide pipe, a flow control pipe fitting movably mounted at the top of the guide pipe and positioned outside the second spring, a core rod movably mounted inside the flow control pipe fitting, two external cross pipes mounted inside the flow control pipe fitting, two clamps fixedly mounted on the injection molding film, a third spring connected to the clamps and a polishing outer cover connected to the other end of the third spring and movably mounted in a vertical groove inside the clamps, wherein the clamping mechanism comprises a clamping plate mounted at the outer end of a hydraulic sub-rod in a hydraulic rod, a sleeve fixed at the top of the clamping plate, a boosting traction piece mounted outside the sleeve, two inclined frames movably mounted on the boosting traction piece, a ring buckle movably mounted outside the boosting traction piece and the sleeve, a fluted disc mounted outside the ring buckle by bolts, a polishing outer cover movably mounted on the ring buckle, two groups of anti-seepage plugs inserted into two holes in the blocking fluted disc and diodes clamped between the two groups of anti-seepage plugs.
The present invention may be further configured in a preferred example to: the transmission mechanism is formed by combining a servo motor and a threaded rod body arranged on a transmission shaft of the servo motor, and the servo motor is fixed in a clamp inside the base.
Through adopting above-mentioned technical scheme, with servo motor fixed mounting in the anchor clamps of base inboard, after shutoff fluted disc atress shifts to between two anchor clamps, with two polishing covers pressurized and centre gripping on the end after the diode solidification, the threaded rod body by servo motor drive alright drive shutoff fluted disc rotates.
The present invention may be further configured in a preferred example to: the injection molding film is made of ceramic materials, a cylindrical cavity is formed in the injection molding film, and an arc hole is formed in a column head of the injection molding film, which is far away from one end of the blocking fluted disc.
Through adopting above-mentioned technical scheme, utilize the bottom frictional resistance of moulding plastics membrane utensil self, after the shutoff fluted disc atress and laminating encapsulation are at the port of moulding plastics membrane utensil inner, along with the honeycomb duct is with the material of sealing glue filling into the inner chamber of moulding plastics membrane utensil, the terminal of two utmost point posts in the diode can obtain quick sealing glue until safe solidification this moment, is improving diode preparation rate.
The present invention may be further configured in a preferred example to: the flow control pipe fitting is formed by combining a vertical pipe and a T-shaped pipeline arranged at the top of the vertical pipe.
Through adopting above-mentioned technical scheme, with standpipe movable mounting in the outside of honeycomb duct, cooperation second spring is to the elastic support of standpipe in the accuse pipe fitting, when needs have the inner chamber to the plastic film and pack or stop the transport of material, alright press the backing plate and drive the lift of core bar and realize, and then conveniently regulate and control material flow.
The present invention may be further configured in a preferred example to: the inner cavity of the flow guide pipe is fixedly provided with a gasket, and a rod body penetrating through the inner cavity of the flow guide pipe from the core rod is provided with an end post which is adapted to penetrate through the gasket.
Through adopting above-mentioned technical scheme, run through the terminal post of core bar bottom to the inside of honeycomb duct to the suitability butt joint of packing ring to core bar bottom terminal post in the honeycomb duct inner chamber is fixed in the cooperation, and when the material that fills accuse flow pipe fitting needs to be along the honeycomb duct to carry out the transfer, the selective butt joint of terminal post and packing ring, alright regulate and control the material delivery volume.
The present invention may be further configured in a preferred example to: the casing that mould plastics membrane utensil one end was kept away from to anchor clamps is the U font structure, and the interior rectangular frame adaptation of polishing dustcoat is laminated on the inner wall of U font casing.
Through adopting above-mentioned technical scheme, with two anchor clamps fixed mounting respectively at the top and the bottom of moulding plastics membrane utensil, U font casing provides the guide to two polishing dustcoat vertical lift in the cooperation two anchor clamps, and when the sleeve pipe horizontal sideslip and drive helping and move the traction element, two inclined frames of swing joint on helping and moving the traction element alright drive two polishing dustcoats and fix a position the centre gripping to the diode solidification end after transferring.
The present invention may be further configured in a preferred example to: the auxiliary traction piece consists of two beam rods and a backing ring, one end of the sleeve close to the blocking fluted disc is fixed on the inner side of the backing ring, and an annular groove which is adaptively clamped on the backing ring is formed in one side of the ring buckle close to the blocking fluted disc.
Through adopting above-mentioned technical scheme, the annular protruding outside movable installation sloping of two beam rods in helping move the traction element to but connect elastic support's third spring between sloping top and polishing dustcoat, along with helping move the traction element and behind the sleeve pipe atress sideslip, two third springs alright provide enough stable elasticity expansion force for the vertical shrink and the expansion of two polishing dustcoats, are laminating the backing ring in helping move the traction element on the outer wall of shutoff fluted disc simultaneously, after the backing ring is restrained in the outside of shutoff fluted disc by the latch closure, helping move traction element and the sleeve pipe of atress and driving shutoff fluted disc stable sideslip.
The present invention may be further configured in a preferred example to: two holes which are adapted to be clamped on two groups of anti-seepage plugs are formed in the blocking fluted disc, and annular teeth which are circumferentially distributed are arranged on the outer side edge of the blocking fluted disc.
Through adopting above-mentioned technical scheme, with two sets of prevention of seepage stopper movable mounting in the inside two holes of shutoff fluted disc, after two adjacent prevention of seepage stopper carry out the centre gripping to diode inner polar post, by two polar posts of two sets of prevention of seepage stopper centre gripping alright stable compaction in the inside two holes of shutoff fluted disc.
By adopting the technical scheme, the beneficial effects obtained by the invention are as follows:
1. according to the invention, through arranging the horizontally arranged injection molding film, fixedly installing the flow guide pipe for guiding the delivery of the sealing material in the end head of the outer end of the injection molding film, movably installing the flow control pipe and the core rod for controlling the delivery amount of the material by using the second spring at the top of the flow guide pipe, arranging the sealing fluted disc at the end head of the inner end of the injection molding film, clamping and fixing the two polar posts in two groups of anti-seepage plugs in two holes in the sealing fluted disc, driving the clamping plate, the sleeve and the sealing fluted disc integrally to carry out adaptive encapsulation against the end head of the inner end of the injection molding film along with the backing plate, transferring the material in the inner end of the flow guide pipe along with the external transverse pipe into the cavity of the injection molding film and sealing fluted disc, until the sealing material is solidified on the end heads of the two polar posts, driving the fluted disc and the fixed diode to move towards the middle parts of the two polishing covers along with the reset of the two groups of the anti-seepage plugs, simultaneously driving the polishing sleeve and driving the two polishing covers to rotate along with the two polishing shafts, and simultaneously driving the two polishing covers to rotate along with the rotation of the polishing sleeve, thereby ensuring that the polishing shafts are integrally driven to rotate and finally, and the polishing shafts can be integrally clamped to be clamped.
2. According to the invention, two holes are formed in the blocking fluted disc, two groups of anti-seepage plugs capable of being clamped on two polar posts in the diode are movably installed in the two holes, a core bar is installed on one side of the blocking fluted disc, which is far away from the injection molding membrane, and meanwhile, a transverse auxiliary traction piece and a sleeve are movably installed in a ring groove on the inner side of the core bar, when the sleeve is stressed to drive the auxiliary traction piece and the blocking fluted disc to horizontally move transversely, the unconstrained blocking fluted disc can be conveniently and adaptively driven by an internal threaded rod body of the driving mechanism, so that the end of the diode after solidification is polished, and the polished diode can be conveniently and rapidly taken out.
Drawings
FIG. 1 is a schematic illustration of the present invention in use;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic view of a carrier according to the present invention;
FIG. 4 is a partial schematic view of the present invention;
FIG. 5 is a schematic view of a clamping mechanism according to the present invention;
FIG. 6 is a schematic view of the internal dispersion of the clamping mechanism of the present invention;
FIG. 7 is a schematic view of a dispensing polishing mechanism according to the present invention;
fig. 8 is an enlarged schematic view of fig. 7 a in accordance with the present invention.
Reference numerals:
100. a carrying mechanism; 110. a base; 120. a transmission mechanism; 130. a partition plate; 140. a hydraulic rod; 150. a bottom clamping seat is arranged; 160. a positioning rod; 170. a backing plate; 180. a top clamping seat is arranged; 190. a first spring;
200. a glue injection polishing mechanism; 210. injection molding a film tool; 220. a flow guiding pipe; 230. a flow control pipe fitting; 240. a second spring; 250. a core bar; 260. externally connected transverse pipes; 270. a clamp; 280. a third spring; 290. polishing the outer cover;
300. a clamping mechanism; 310. a clamping plate; 320. a sleeve; 330. plugging the fluted disc; 340. an impermeable plug; 350. a ring buckle; 360. a power-assisted traction member; 370. an inclined frame; 380. a diode.
Detailed Description
The objects, technical solutions and advantages of the present invention will become more apparent by the following detailed description of the present invention with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present invention and features in the embodiments may be combined with each other.
It is to be understood that this description is merely exemplary in nature and is not intended to limit the scope of the present invention.
An encapsulation apparatus for a semiconductor diode according to some embodiments of the present invention is described below with reference to the accompanying drawings.
Embodiment one:
referring to fig. 1 to 8, the present invention provides a sealing device for a semiconductor diode, which includes a carrier 100, a glue injection polishing mechanism 200 mounted on the carrier 100, and a clamping mechanism 300 mounted on the glue injection polishing mechanism 200.
The bearing mechanism 100 comprises a base 110, a transmission mechanism 120, a partition 130, a hydraulic rod 140, a bottom clamping seat 150, a positioning rod 160, a base plate 170, a top clamping seat 180 and a first spring 190, the glue injection polishing mechanism 200 comprises an injection molding mold 210, a flow guide pipe 220, a flow control pipe 230, a second spring 240, a core rod 250, an external transverse pipe 260, a clamp 270, a third spring 280 and a polishing housing 290, and the clamping mechanism 300 comprises a clamping plate 310, a sleeve 320, a blocking fluted disc 330, an anti-seepage plug 340, a ring buckle 350, a boosting traction piece 360, a inclined frame 370 and a diode 380.
Specifically, the vertically distributed transmission mechanism 120 is installed in a fixture inside the base 110, the partition 130 close to one side of the transmission mechanism 120 is fixedly installed in the base 110, the hydraulic rod 140 is fixedly installed in two clamping plates inside the base 110, two positioning rods 160 are fixedly installed on two sides of the top of the base 110, the base clamping seat 150 is fixedly installed on the top of the base 110, the base plate 170 is movably installed outside the two positioning rods 160, the top clamping seat 180 is movably installed in a sleeve at the bottom of the base plate 170, the first spring 190 is connected in the sleeve at the bottom of the base plate 170, the horizontally arranged injection molding film 210 is positioned right above the base 110, the guide pipe 220 is fixedly installed in an arc hole at one end of the injection molding film 210, the second spring 240 is connected to the end at the top of the guide pipe 220, the flow control pipe 230 at the outer part of the second spring 240 is movably installed at the top of the guide pipe 220, the core rod 250 is movably mounted in the flow control pipe 230, the two external cross pipes 260 are mounted in the flow control pipe 230, the two clamps 270 are fixedly mounted on the injection molding film 210, the third spring 280 is connected on the clamps 270, the polishing outer cover 290 movably mounted in the vertical groove in the clamp 270 is connected at the other end of the third spring 280, the clamping plate 310 is mounted at the outer end of the hydraulic sub-rod in the hydraulic rod 140, the sleeve 320 is fixed at the top of the clamping plate 310, the auxiliary traction member 360 is mounted at the outer part of the sleeve 320, the two inclined frames 370 are movably mounted on the auxiliary traction member 360, the ring buckle 350 is movably mounted at the outer parts of the auxiliary traction member 360 and the sleeve 320, the blocking fluted disc 330 is mounted at the outer part of the ring buckle 350 by bolts, the two groups of impermeable plugs 340 are inserted into the two holes in the blocking fluted disc 330, and the diode 380 is clamped between the two groups of impermeable plugs 340.
The flow control pipe 230 and the core rod 250 for controlling the material delivery amount are movably arranged at the top of the flow guide pipe 220, meanwhile, the plugging fluted disc 330 is arranged at the port at the inner end of the injection molding film 210, when two polar posts are clamped by two groups of anti-seepage plugs 340 and fixed in two holes inside the plugging fluted disc 330, the internal hydraulic sub-rod drives the clamping plate 310, the sleeve 320 and the plugging fluted disc 330 to carry out adaptive encapsulation on the port at the inner end of the injection molding film 210 along with the running of the hydraulic rod 140, the material filled into the cavity of the flow control pipe 230 along with the falling of the core rod 250 by the backing plate 170 can be transferred from the flow guide pipe 220 to the injection molding film 210 and the plugging fluted disc 330 until the sealing material is solidified on the end heads of the two polar posts in the diode 380, until the glue heads are solidified, the sleeve 320 drives the plugging fluted disc 330 and the middle parts of the two fixed diode 380 to move towards the two polishing outer covers 290 along with the running of the hydraulic rod 140, and simultaneously, the polishing auxiliary members 360 of the sleeve 320 drive the two polishing outer covers 380 to drive the two inclined frames 380 to rotate along with the running of the sleeve 320 to carry out the whole, and the whole screw joint operation can be guaranteed, and the whole screw joint operation is guaranteed after the two polishing mechanism is completed, and the sealing fluted disc is completely solidified, and the sealing material is completely solidified.
Embodiment two:
referring to fig. 3-7, on the basis of the first embodiment, the transmission mechanism 120 is formed by combining a servo motor and a threaded rod body installed on a transmission shaft of the servo motor, the servo motor is fixed in a fixture inside the base 110, two holes adapted to be clamped on two groups of anti-seepage plugs 340 are formed in the plugging fluted disc 330, and ring teeth distributed circumferentially are installed on the outer side edge of the plugging fluted disc 330.
After the blocking fluted disc 330 is stressed and transferred between the two clamps 270, the blocking fluted disc 330 can be driven to rotate along with the pressing of the two polishing outer covers 290 and clamped on the cured end of the diode 380 by utilizing the servo motor fixedly arranged in the clamps on the inner side of the base 110, the two groups of anti-seepage plugs 340 are movably arranged in two holes inside the blocking fluted disc 330, after the polar posts inside the diode 380 are clamped by the two adjacent anti-seepage plugs 340, the two polar posts clamped by the two groups of anti-seepage plugs 340 can be stably pressed in the two holes inside the blocking fluted disc 330, so that the diode 380 can be conveniently used for preparing the sealing adhesive, and meanwhile, the blocking fluted disc 330 can be matched with the transmission of the transmission mechanism 120 to realize polishing operation.
Embodiment III:
referring to fig. 3-8, on the basis of the first embodiment, the injection molding mold 210 is made of ceramic material, a cylindrical cavity is formed in the injection molding mold 210, an arc hole is formed in a column head of the injection molding mold 210 far away from one end of the plugging fluted disc 330, the flow control pipe 230 is formed by combining a vertical pipe and a T-shaped pipe installed at the top of the vertical pipe, a gasket is fixedly installed in an inner cavity of the flow guide pipe 220, and an end post adapted to penetrate into the gasket is installed on a rod body penetrating through the inner cavity of the flow guide pipe 220 by the core rod 250.
By utilizing the self bottom friction resistance of the injection molding film 210, after the sealing fluted disc 330 is stressed to be attached to and sealed at the port at the inner end of the injection molding film 210, along with the filling of the sealing material into the inner cavity of the injection molding film 210 by the guide pipe 220, the ends of two polar posts in the diode 380 can be rapidly sealed until the sealing material is solidified safely, the preparation rate of the diode 380 is improved, the problem of mass adhesion of materials can be avoided, and the elastic support of the second spring 240 on the vertical pipe in the flow control pipe 230 is combined, when the inner cavity of the injection molding film 210 is required to be filled or the material is required to be stopped to be conveyed, the lifting of the core rod 250 can be driven by pressing the backing plate 170, the material flow is regulated, and meanwhile, the material conveying path can be shortened, and the problem of material waste is reduced;
and the gasket fixed in the inner cavity of the flow guide pipe 220 is utilized to adaptively butt-joint the end column at the bottom of the core rod 250, and as the material poured into the flow control pipe 230 needs to be transferred along the flow guide pipe 220, the end column and the gasket are selectively butt-jointed, so that the material delivery amount can be regulated and controlled, and the problem that the diode 380 is overflowed due to excessive material in the sealing operation is avoided.
Embodiment four:
referring to fig. 5-8, in the first embodiment, the housing of the end of the clamp 270 far away from the injection molding mold 210 is in a U-shaped structure, the rectangular frame in the polishing outer cover 290 is adapted to be attached to the inner wall of the U-shaped housing, the auxiliary traction member 360 is composed of two beam rods and a backing ring, one end of the sleeve 320 near the blocking fluted disc 330 is fixed on the inner side of the backing ring, and one side of the ring buckle 350 near the blocking fluted disc 330 is provided with a ring groove adapted to be clamped on the backing ring.
The two clamps 270 are respectively and fixedly arranged at the top and the bottom of the injection molding film 210, the U-shaped shell in the two clamps 270 is matched to provide guidance for the vertical lifting and lowering of the two polishing outer covers 290, when the sleeve 320 horizontally moves transversely and drives the auxiliary traction piece 360 to move, the two inclined frames 370 movably connected to the auxiliary traction piece 360 can drive the two polishing outer covers 290 to position and clamp the solidification end of the transferred diode 380, meanwhile, the inclined frames 370 are movably arranged outside the annular protrusions of the two beam rods in the auxiliary traction piece 360, the third springs 280 capable of being elastically supported are connected between the top of the inclined frames 370 and the polishing outer covers 290, and after the auxiliary traction piece 360 and the sleeve 320 move transversely under the stress, the two third springs 280 can provide stable enough elastic expansion force for the vertical shrinkage and expansion of the two polishing outer covers 290, meanwhile, the cushion rings in the auxiliary traction piece 360 are attached to the outer walls of the fluted disc 330, after the cushion rings are restrained outside the plugging 330 by the ring buckles 350, the stressed auxiliary traction piece 360 and the sleeve 320 are driven to stably, and the two subsequent polishing outer walls of the plugging and the two polishing outer covers 330 can be clamped by the annular protrusions 380 and the two plugging outer walls of the sealing discs 330 simultaneously, and the two subsequent sealing and the sealing and sealing off the sealing discs 330 can be conveniently clamped.
The working principle and the using flow of the invention are as follows: the bottom end of the core rod 250 is movably mounted in the inner cavity of the flow control pipe fitting 230 in advance, the flow control pipe fitting 230 is movably mounted at the top of the flow guide pipe 220, at this time, the top end of the second spring 240 is connected to the end of the top of the flow guide pipe 220, the bottom end of the second spring 240 is connected to the bottom of the inner cavity of the flow control pipe fitting 230, then the flow guide pipe 220 is fixedly mounted in the arc-shaped duct inside the injection molding film 210, two external cross pipes 260 are respectively mounted in the T-shaped outer pipe at the top of the flow control pipe fitting 230, then two clamps 270 are respectively fixedly mounted at the top and the bottom of the injection molding film 210, a third spring 280 is connected to a cushion block inside the clamps 270, the other end of the third spring 280 is connected to an L-shaped bracket outside the polishing outer cover 290, the L-shaped bracket outside the polishing outer cover 290 is adapted to penetrate into a vertical groove inside the clamps 270, at this time, the two clamps 270 are symmetrically distributed along the vertical direction, the bottom clamping seat 150 and the top clamping seat 180 are respectively and fixedly arranged at the bottom and the top of the injection molding film 210, a guide rod at the top of the top clamping seat 180 is movably arranged in a sleeve at the bottom of the base plate 170, the bottom end of the first spring 190 is connected at the top of the guide rod in the top clamping seat 180, the top end of the first spring 190 is connected at the top of a sleeve cavity, the combined base plate 170 is movably arranged at the outer part of two positioning rods 160, at the moment, the two symmetrically distributed positioning rods 160 provide stable enough bearing force for the whole glue filling operation of the glue filling polishing mechanism 200, when a diode is inserted along the inner parts of two anti-seepage plugs 340 until two polar posts clamped by the two anti-seepage plugs 340 are fixed in the inner parts of a blocking fluted disc 330, the sleeve 320 and the blocking fluted disc 330 driven by the clamping plate 310 are integrally pushed towards the slotted hole at the outer end of the injection molding film 210 along with the inward shrinkage of a hydraulic sub rod in the hydraulic rod 140, until the two clamped polar posts penetrate into the middle of the cavity of the injection molding film 210, when the backing plate 170 is pressed downwards, the core rod 250 fixed on one side end plate of the backing plate moves downwards along the cavity of the flow control pipe 230 until the external cross pipe 260, the flow control pipe 230 and the cavity of the flow guide pipe 220 are in a communicated state, glue liquid transferred into the cavity of the flow guide pipe 220 along the external cross pipe 260 at this time is poured into a sealed cavity formed by the injection molding film 210 and the blocking fluted disc 330, then the backing plate 170 is released until the core rod 250 is restored to an initial state, after waiting for a certain time until the glue liquid is solidified, the two polar posts penetrate into the end of the cavity of the injection molding film 210, after the glue liquid is solidified, the end of the two polar posts can be wrapped, after the external glue head of the diode 380 is solidified, the hydraulic sub-rod in the hydraulic rod 140 can be controlled to move outwards, and then the sleeve 320 and the blocking fluted disc 330 can be controlled to move outwards, at this time, the clamped and the fixed diode 380 can be separated from the cavity of the injection molding film 210, after the glue head solidified outside the diode 380 is transferred between the two external polishing covers 290, the two polishing covers 370 are pulled by the two inclined frames and the two polishing heads 270 are guided by the two polishing heads, the two external polishing heads 380 can be synchronously clamped on the external polishing heads 380, the transmission mechanism can be screwed on the spindle rod body and the external screw 120 can be solidified, and the whole, and the external glue head can be solidified, and the external glue head can be tightly, and the transmission mechanism can be tightly and screwed, and the whole tightly, and the external glue can be tightly and screwed.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (9)
1. A glue sealing device for a semiconductor diode, which is characterized by comprising a bearing mechanism (100), a glue injection polishing mechanism (200) arranged on the bearing mechanism (100) and a clamping mechanism (300) arranged on the glue injection polishing mechanism (200);
the glue injection polishing mechanism (200) comprises an injection molding film tool (210) which is positioned right above the bearing mechanism (100) and transversely arranged, a guide pipe (220) which is fixed in an arc hole at one end of the injection molding film tool (210), a second spring (240) which is connected to the top end of the guide pipe (220), two clamps (270) which are fixedly arranged on the injection molding film tool (210), a third spring (280) which is connected to the clamps (270), a polishing outer cover (290) which is connected to the other end of the third spring (280) and is movably arranged in a vertical groove in the clamps (270), a flow control pipe fitting (230) which is movably arranged at the top of the guide pipe (220) and is positioned outside the second spring (240), a core rod (250) which is movably arranged in the flow control pipe fitting (230) and two external transverse pipes (260) which are arranged in the flow control pipe fitting (230);
the clamping mechanism (300) comprises a clamping plate (310), a sleeve (320) fixed at the top of the clamping plate (310), a boosting traction piece (360) arranged outside the sleeve (320), two inclined frames (370) movably arranged on the boosting traction piece (360), a ring buckle (350) movably arranged outside the boosting traction piece (360) and the sleeve (320), a blocking fluted disc (330) arranged outside the ring buckle (350) by bolts, two groups of anti-seepage plugs (340) inserted into two holes inside the blocking fluted disc (330) and a diode (380) clamped between the two groups of anti-seepage plugs (340).
2. A molding apparatus for a semiconductor diode as defined in claim 1, wherein,
the bearing mechanism (100) comprises a base (110), a transmission mechanism (120) which is arranged in a clamp in the base (110) and is vertically distributed, a baffle plate (130) which is fixedly arranged in the base (110) and is close to one side of the transmission mechanism (120), and a hydraulic rod (140) which is fixedly arranged in two clamping plates in the base (110), wherein the clamping plates (310) are arranged at the outer ends of hydraulic sub-rods in the hydraulic rod (140);
the bearing mechanism (100) further comprises two positioning rods (160) fixedly installed on two sides of the top of the base (110), a bottom placing clamping seat (150) fixed on the top of the base (110), a base plate (170) movably installed outside the two positioning rods (160), a top placing clamping seat (180) movably installed in a sleeve at the bottom of the base plate (170) and a first spring (190) connected in the sleeve at the bottom of the base plate (170).
3. A sealing device for semiconductor diodes according to claim 2, characterized in that the transmission mechanism (120) is composed of a servomotor and a threaded rod mounted on the transmission shaft of the servomotor, and the servomotor is fixed in a fixture inside the base (110).
4. The encapsulating device for semiconductor diode according to claim 1, wherein the injection molding die (210) is made of ceramic material, a cylindrical cavity is formed in the injection molding die (210), and an arc hole is formed in a column head of the injection molding die (210) at one end far away from the blocking fluted disc (330).
5. A sealing device for semiconductor diodes according to claim 1, characterized in that the flow control tube (230) is composed of a stack and a T-shaped tube mounted on top of the stack.
6. The encapsulation apparatus for semiconductor diodes according to claim 1, wherein the inner cavity of the flow guide tube (220) is fixedly provided with a gasket, and the stem body of the core rod (250) penetrating into the inner cavity of the flow guide tube (220) is provided with an end post adapted to penetrate into the gasket.
7. The encapsulating device for semiconductor diodes according to claim 1, characterized in that the housing of the end of the clamp (270) remote from the injection molding die (210) is of a U-shaped structure, and the rectangular frame in the polishing housing (290) fits on the inner wall of the U-shaped housing.
8. The encapsulating device for the semiconductor diode according to claim 1, wherein the auxiliary traction member (360) is composed of two beam rods and a backing ring, one end of the sleeve (320) close to the blocking fluted disc (330) is fixed on the inner side of the backing ring, and a ring groove adapted to be clamped on the backing ring is formed on one side of the ring buckle (350) close to the blocking fluted disc (330).
9. The sealing device for semiconductor diodes according to claim 1, wherein two holes adapted to be clamped between two sets of anti-seepage plugs (340) are formed in the sealing fluted disc (330), and ring teeth distributed circumferentially are mounted on the outer side of the sealing fluted disc (330).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311698805.3A CN117393443B (en) | 2023-12-12 | 2023-12-12 | A seal equipment for semiconductor diode |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311698805.3A CN117393443B (en) | 2023-12-12 | 2023-12-12 | A seal equipment for semiconductor diode |
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| CN117393443A true CN117393443A (en) | 2024-01-12 |
| CN117393443B CN117393443B (en) | 2024-02-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117697606A (en) * | 2024-02-06 | 2024-03-15 | 中国科学院长春光学精密机械与物理研究所 | Wafer cleaning device and wafer cleaning method |
| CN117697606B (en) * | 2024-02-06 | 2024-05-10 | 中国科学院长春光学精密机械与物理研究所 | Wafer cleaning device and wafer cleaning method |
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| US20150255949A1 (en) * | 2013-12-18 | 2015-09-10 | Jds Uniphase Corporation | Packaged laser diode and method of packaging a laser diode |
| CN110125785A (en) * | 2019-05-22 | 2019-08-16 | 宁波复洋光电有限公司 | A kind of encapsulating structure |
| CN217122798U (en) * | 2021-10-11 | 2022-08-05 | 佛山市新铂桥电子有限公司 | Silicon chip burnishing device is used in diode production |
| CN116273713A (en) * | 2023-05-18 | 2023-06-23 | 苏州双远电子科技有限公司 | Uniform gluing device for diode |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20150255949A1 (en) * | 2013-12-18 | 2015-09-10 | Jds Uniphase Corporation | Packaged laser diode and method of packaging a laser diode |
| CN110125785A (en) * | 2019-05-22 | 2019-08-16 | 宁波复洋光电有限公司 | A kind of encapsulating structure |
| CN217122798U (en) * | 2021-10-11 | 2022-08-05 | 佛山市新铂桥电子有限公司 | Silicon chip burnishing device is used in diode production |
| CN116273713A (en) * | 2023-05-18 | 2023-06-23 | 苏州双远电子科技有限公司 | Uniform gluing device for diode |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117697606A (en) * | 2024-02-06 | 2024-03-15 | 中国科学院长春光学精密机械与物理研究所 | Wafer cleaning device and wafer cleaning method |
| CN117697606B (en) * | 2024-02-06 | 2024-05-10 | 中国科学院长春光学精密机械与物理研究所 | Wafer cleaning device and wafer cleaning method |
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| CN117393443B (en) | 2024-02-06 |
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