CN117684150A - Wafer feeding conveying system - Google Patents
Wafer feeding conveying system Download PDFInfo
- Publication number
- CN117684150A CN117684150A CN202410094527.9A CN202410094527A CN117684150A CN 117684150 A CN117684150 A CN 117684150A CN 202410094527 A CN202410094527 A CN 202410094527A CN 117684150 A CN117684150 A CN 117684150A
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- China
- Prior art keywords
- wafer
- skip
- heating assembly
- platform
- linear guide
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Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 52
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 267
- 239000011521 glass Substances 0.000 claims description 4
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 abstract description 11
- 230000008021 deposition Effects 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 8
- 239000010453 quartz Substances 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 238000005234 chemical deposition Methods 0.000 abstract description 2
- 230000010354 integration Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer feed conveying system, which relates to the technical field of normal pressure chemical deposition and comprises an equipment body, wherein a wafer carrying platform, a robot, a wafer cooling rotating platform, a wafer lifting system, a main support plate, a first linear guide rail, a first driving motor, a wafer heating assembly support and a vacuum generating system are arranged in the equipment body. According to the system, the wafer is prevented from being polluted by arranging the nonmetallic material layer of high-purity quartz, si or SiC; after the wafer is moved out through the wafer lifting system and the first linear guide rail, the wafer is independently deposited under the wafer heating assembly; the deposition surface of each wafer can finish film deposition at one time, the limitation of gas diffusion and transmission is eliminated, and the thickness and quality uniformity of the deposited film are better. And the transportation measures such as high-purity quartz and robots are adopted, and the wafer is isolated from personnel pollution in a closed system, so that the wafer coating efficiency and the equipment integration level are improved.
Description
Technical Field
The invention relates to the technical field of normal pressure chemical deposition, in particular to a wafer feeding material conveying system.
Background
The atmospheric pressure chemical vapor deposition refers to spraying a gaseous reaction source onto the surface of a heated solid substrate at a constant speed under the environment that the pressure is close to the atmospheric pressure, so that the reaction source is subjected to chemical reaction on the surface of the substrate, and a reaction product is deposited on the surface of the substrate to form a film.
As shown in fig. 4, the wafer transportation and deposition are generally realized by placing the wafer substrate on a flexible conveyor belt 05 and continuously moving, loading and unloading the wafer by rollers, loading a graphite substrate 06 on the conveyor belt 05, introducing a process gas 01 from above the conveyor belt 05, arranging a belt cleaner 02 at the bottom of the conveyor belt 05 and arranging an exhaust gas 03 to exhaust the process gas 01; a heater 05 is provided below the conveyor belt 05. Conventional transport methods are prone to certain non-uniformities in the thickness and quality of the deposited film on the substrate surface due to gas diffusion and transport limitations, resulting in variability and non-uniformity in device performance.
Disclosure of Invention
In order to solve the technical problems, the invention provides a wafer feeding and conveying system, which adopts transportation measures such as high-purity quartz, robots and the like to isolate the pollution of personnel to wafers and improve the wafer coating efficiency.
In order to achieve the above object, the present invention provides the following solutions:
the invention provides a wafer feeding and conveying system, which comprises an equipment body, wherein a wafer carrying platform, a robot, a wafer cooling and rotating platform, a wafer lifting system, a main support plate, a first linear guide rail, a first driving motor, a wafer heating assembly support and a vacuum generating system are arranged in the equipment body; the robot is arranged between the wafer carrying platform and the main support plate; the wafer carrying platform is used for carrying a wafer box, and the wafer box is used for placing wafers; a wafer cooling rotating platform is arranged at one end of the main support plate, which is close to the robot; the wafer heating assembly is arranged on the wafer heating assembly support; the first driving motor is used for driving the wafer heating assembly to slide on the first linear guide rail; the wafer heating assembly is communicated with the vacuum generating system; the wafer lifting system is arranged on one side of the wafer cooling rotary platform, which is close to the wafer heating assembly.
Optionally, the wafer cooling rotating platform comprises a wafer supporting platform, a wafer supporting piece, a rotating flat plate, an intermediate rotating shaft, a third driving motor and a pallet supporting piece; the middle rotating shaft penetrates through the main supporting plate; the third driving motor is in transmission connection with the intermediate rotating shaft and is used for driving the intermediate rotating shaft to rotate; the top of the middle rotating shaft is connected with the middle part of the rotating flat plate; the wafer supporting tables are respectively arranged at two ends of the rotating flat plate, and wafer supporting pieces are arranged on the wafer supporting tables.
Optionally, the wafer support is made of a high-purity nonmetallic material.
Optionally, an optical fiber sensor is disposed on the wafer support, and the optical fiber sensor is used for detecting whether a wafer exists on the wafer support.
Optionally, the wafer lifting system comprises a first wafer skip, a second wafer skip, a lifting cylinder, a second linear guide rail and a second driving motor; the wafer first skip penetrates through the main support plate; the wafer second skip is arranged on the wafer first skip; the second driving motor is arranged at the bottom of the second linear guide rail, and the two linear guide rails are connected with the wafer first skip; the lifting cylinder is arranged at the bottom of the wafer second skip and is used for driving the wafer second skip; the wafer second skip is located under the wafer supporting platform, which is close to one side of the wafer heating assembly, of the wafer cooling rotating platform.
Optionally, the first skip of wafer and all be provided with wafer support piece on the second skip of wafer, wafer support piece is used for supporting the wafer.
Optionally, the wafer supports are all made of high-purity nonmetallic materials.
Optionally, a drag chain is disposed on the wafer heating component support, and the drag chain is used for placing the wire harness of the wafer heating component.
Optionally, a glass window is disposed on a side of the device body, which is close to the wafer carrying platform.
Optionally, the vacuum generating system comprises a screw pump.
Compared with the prior art, the invention has the following technical effects:
according to the wafer feeding and conveying system, the wafer is prevented from being polluted by arranging the nonmetallic material layers of high-purity quartz, si or SiC on the wafer supporting table, the rotating flat plate and the vacuum adsorption port; after the wafer is moved out through the wafer lifting system and the first linear guide rail, the wafer is independently deposited under the wafer heating assembly; the deposition surface of each wafer can finish film deposition at one time, the limitation of gas diffusion and transmission is eliminated, and the thickness and quality uniformity of the deposited film are better. And the transportation measures such as high-purity quartz and robots are adopted, and the wafer is isolated from personnel pollution in a closed system, so that the wafer coating efficiency and the equipment integration level are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a side view of a wafer transport process according to an embodiment of the present invention;
FIG. 2 is a top view of a wafer transfer process according to an embodiment of the present invention;
FIG. 3 is a top view of a wafer cooling spin platform in the form of a single wafer pallet according to an embodiment of the invention;
fig. 4 is a schematic diagram of a wafer transportation process for conventional atmospheric pressure chemical vapor deposition.
Reference numerals illustrate: 01. a process gas; 02. a belt cleaner; 03. exhausting; 04. a heater; 05. a conveyor belt; 06. a graphite substrate;
1. an equipment body; 2. a glass window; 3. a wafer mounting platform; 4. a wafer cassette; 401. a first wafer cassette; 402. a second wafer cassette; 403. a third wafer cassette; 5. a robot; 6. a wafer cooling rotary platform; 601. a wafer support; 602. a wafer support; 603. rotating the flat plate; 604. an intermediate rotation shaft; 605. a third driving motor; 606. a pallet support; 7. a wafer lift system; 701. the first skip of the wafer; 702. a second skip for wafers; 703. lifting the cylinder; 704. a second linear guide rail; 705. a second driving motor; 8. a main support plate; 9. a first linear guide rail; 10. a first driving motor; 11. a wafer heating assembly; 12. a wafer heating assembly support; 13. a vacuum generating system; 14. a wafer; 15. a drag chain.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 3, the present embodiment provides a wafer feed transport system, which includes an apparatus body 1, wherein a wafer carrying platform 3, a robot 5, a wafer cooling rotating platform 6, a wafer lifting system 7, a main support plate 8, a first linear guide 9, a first driving motor 10, a wafer heating assembly 11, a wafer heating assembly support 12 and a vacuum generating system 13 are disposed in the apparatus body 1; the robot 5 is arranged between the wafer carrying platform 3 and the main supporting plate 8; the wafer carrying platform 3 is used for carrying a wafer box 4, and the wafer box 4 is used for placing a wafer 14; a wafer cooling rotary platform 6 is arranged at one end of the main support plate 8, which is close to the robot 5; the main support plate 8 is provided with a first linear guide rail 9, the wafer heating component support 12 is arranged on the first linear guide rail 9 in a sliding manner, and the wafer heating component 11 is arranged on the wafer heating component support 12; the first driving motor 10 is used for driving the wafer heating component support 12 to slide on the first linear guide rail 9; the wafer heating assembly 11 is communicated with the vacuum generating system 13; the wafer lift system 7 is disposed on a side of the wafer cooling spin platform 6 proximate to the wafer heating assembly support 12.
In this embodiment, the wafer cooling spin platform 6 includes a wafer support 601, a wafer support 602, a spin plate 603, an intermediate spin shaft 604, a third drive motor 605, and a pallet support 606; the intermediate rotation shaft 604 penetrates the main support plate 8; the third driving motor 605 is in transmission connection with the intermediate rotating shaft 604, and the third driving motor 605 is used for driving the intermediate rotating shaft 604 to rotate; the top of the middle rotating shaft 604 is connected with the middle part of the rotating flat plate 603; the two ends of the rotating flat plate 603 are respectively provided with a wafer supporting platform 601, the wafer supporting platform 601 is provided with a wafer supporting piece 602, and the wafer supporting piece 602 is made of high-purity nonmetallic materials.
The wafer lifting system 7 comprises a first wafer skip 701, a second wafer skip 702, a lifting cylinder 703, a second linear guide 704 and a second drive motor 705; the wafer first skip 701 penetrates the main support plate 8; a wafer second skip 702 is arranged on the wafer first skip 701; the second driving motor 705 is disposed at the bottom of the second linear guide 704, and the two linear guide are connected with the first wafer cart 701; the lifting air cylinder 703 is arranged at the bottom of the wafer second skip 702, and the lifting air cylinder 703 is used for driving the wafer second skip 702; the wafer second skip 702 is located directly below the wafer pallet 601 on the side of the wafer cooling spin platform 6 near the wafer heating assembly support 12.
The wafer pallet 601, the wafer first skip 701, and the wafer second skip 702 are all fabricated from a high purity nonmetallic material. Wafer supports are disposed on the first wafer cart 701 and the second wafer cart 702, and are configured to support the wafer 14, and are made of high-purity nonmetallic materials.
The wafer heating assembly support 12 is provided with a drag chain 15, and the drag chain 15 is used for placing a wire harness of the wafer heating assembly 11, and restraining and protecting the wire harness in the moving process.
The apparatus body 1 is provided with a glass window 2 on a side close to the wafer mounting stage 3.
The vacuum generating system 13 includes a screw pump that creates a clean vacuum system that provides vacuum adsorption capability to the wafer heating assembly 11 and robot 5, avoiding mechanical fixture damage or contamination of the wafer 14.
The wafer feed transport system for atmospheric pressure chemical vapor deposition in this embodiment has the following operation flow:
a, the robot 5 adsorbs a wafer 14 to be deposited with a thin film from the wafer cassette 4 on the wafer mounting platform 3;
b, the robot 5 places the wafer 14 to be coated on a wafer supporting platform 601 on one side of the wafer cooling rotary platform 6 close to the robot 5, and the wafer 14 is supported by a wafer supporting piece 602;
c, after the rotating flat plate 603 rotates 180 degrees around the middle rotating shaft 604, the wafer 14 to be coated is now positioned on one side of the rotating flat plate 603 close to the wafer heating assembly 11, the robot 5 adsorbs the wafer 14 to be coated of the next batch from the wafer box 4 on the wafer carrying platform 3, and the wafer 14 to be coated is placed on the wafer supporting platform 601 on one side of the rotating flat plate 603 close to the robot 5;
d, the wafer heating component support 12 and the wafer heating component 11 thereon move along the first linear guide 9 to a position right above the wafer supporting platform 601 on one side of the wafer cooling rotary platform 6 close to the wafer heating component 11;
e, the wafer lifting system 7 vertically lifts the first wafer skip 701 upwards along the second linear guide rail 704, lifts the wafer supporting platform 601, which is close to one side of the wafer heating assembly 11, on the rotating flat plate 603 together with the wafer 14 to be coated placed on the wafer supporting platform 601, away from the rotating flat plate 603, lifts the wafer 14 to be coated to be close to a vacuum adsorption port below the wafer heating assembly 11, and the lifting cylinder 703 drives the second wafer skip 702 to independently lift the wafer 14 to be coated upwards to be tightly attached to the vacuum adsorption port;
f, after the wafer 14 to be coated is adsorbed by the adsorption device under the wafer heating assembly 11 in vacuum, the wafer second skip 702 is reset downwards, the wafer first skip 701 moves downwards, the wafer supporting platform 601 is lowered back to the rotating flat plate 603, the first driving motor 10 drives the sliding block on the first linear guide rail 9 to move, and the wafer heating assembly support 12 and the wafer heating assembly 11 thereon are driven to return to the initial position, so that a deposition process is performed;
g, in the deposition process, the wafer heating assembly support 12 and the wafer heating assembly 11 thereon are driven by the sliding blocks on the first linear guide rail 9 to reciprocate left and right along the first linear guide rail 9;
h, after the deposition process is finished, the wafer heating assembly 11 and the wafer 14 with the coating film are moved to a position right above the wafer supporting platform 601 on one side of the wafer cooling rotary platform 6, which is close to the wafer heating assembly 11;
i, the first wafer skip 701 is lifted vertically upwards along the second linear guide 704, the wafer cooling rotary platform 6 is lifted by the wafer supporting platform 601 close to one side of the wafer heating assembly 11, then the lifting cylinder 703 drives the second wafer skip 702 to independently support the film-coated wafer 14 upwards, the vacuum adsorption is finished by the adsorption device below the wafer heating assembly 11, the second wafer skip 702 is lowered and reset, and the wafer 14 with the film deposition finished is supported by the wafer supporting platform 601 lifted by the upper end of the first wafer skip 701;
j, the wafer first skip 701 moves downwards, returns to the initial position, and transfers the wafer tray 601 with the wafer 14 on which the film deposition is completed to the pallet support 606 on the side of the rotating flat plate 603 close to the wafer heating assembly 11;
k, after the rotating flat plate 603 rotates 180 degrees around the middle rotating shaft 604, the wafer 14 and the wafer support 601 after film deposition are transferred to one side of the wafer cooling rotating platform 6 close to the robot 5, and at this time, another batch of wafers 14 to be film-deposited are rotated to one side of the wafer cooling rotating platform 6 close to the wafer heating component 11;
after the wafer 14 having completed the film deposition is naturally cooled or forcibly cooled, the robot 5 transfers the wafer 14 having completed the film deposition into the cassette 4 on the wafer mounting stage 3 until the film deposition of the wafer 14 of this lot is completed, and repeats the c-k step.
It should be noted that it will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
The principles and embodiments of the present invention have been described in this specification with reference to specific examples, the description of which is only for the purpose of aiding in understanding the method of the present invention and its core ideas; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (10)
1. The wafer feeding and conveying system is characterized by comprising an equipment body, wherein a wafer carrying platform, a robot, a wafer cooling and rotating platform, a wafer lifting system, a main support plate, a first linear guide rail, a first driving motor, a wafer heating assembly support and a vacuum generating system are arranged in the equipment body; the robot is arranged between the wafer carrying platform and the main support plate; the wafer carrying platform is used for carrying a wafer box, and the wafer box is used for placing wafers; a wafer cooling rotating platform is arranged at one end of the main support plate, which is close to the robot; the wafer heating assembly is arranged on the wafer heating assembly support; the first driving motor is used for driving the wafer heating assembly to slide on the first linear guide rail; the wafer heating assembly is communicated with the vacuum generating system; the wafer lifting system is arranged on one side of the wafer cooling rotary platform, which is close to the wafer heating assembly.
2. The wafer feed transport system of claim 1, wherein the wafer cooling rotation platform comprises a wafer pallet, a wafer support, a rotation plate, an intermediate rotation shaft, a third drive motor, and a pallet support; the middle rotating shaft penetrates through the main supporting plate; the third driving motor is in transmission connection with the intermediate rotating shaft and is used for driving the intermediate rotating shaft to rotate; the top of the middle rotating shaft is connected with the middle part of the rotating flat plate; the wafer supporting tables are respectively arranged at two ends of the rotating flat plate, and wafer supporting pieces are arranged on the wafer supporting tables.
3. The wafer feed transport system of claim 2, wherein the wafer support is fabricated from a high purity non-metallic material.
4. The wafer feed transport system of claim 2, wherein the wafer pallet is provided with an optical fiber sensor for detecting the presence of a wafer on the wafer pallet.
5. The wafer feed transport system of claim 1, wherein the wafer lift system comprises a first wafer skip, a second wafer skip, a lift cylinder, a second linear guide rail, and a second drive motor; the wafer first skip penetrates through the main support plate; the wafer second skip is arranged on the wafer first skip; the second driving motor is arranged at the bottom of the second linear guide rail, and the two linear guide rails are connected with the wafer first skip; the lifting cylinder is arranged at the bottom of the wafer second skip and is used for driving the wafer second skip; the wafer second skip is located under the wafer supporting platform, which is close to one side of the wafer heating assembly, of the wafer cooling rotating platform.
6. The wafer feed transport system of claim 5, wherein the wafer first skip and the wafer second skip are each provided with a wafer support for supporting a wafer.
7. The wafer feed transport system of claim 5, wherein the wafer supports are each fabricated from a high purity non-metallic material.
8. The wafer feed transport system of claim 1, wherein the wafer heating assembly support is provided with a drag chain for positioning a wire harness of the wafer heating assembly.
9. The wafer feed transport system of claim 1, wherein a glass window is provided on a side of the apparatus body proximate to the wafer carrier.
10. The wafer feed transport system of claim 1, wherein the vacuum generation system comprises a screw pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410094527.9A CN117684150A (en) | 2024-01-24 | 2024-01-24 | Wafer feeding conveying system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410094527.9A CN117684150A (en) | 2024-01-24 | 2024-01-24 | Wafer feeding conveying system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117684150A true CN117684150A (en) | 2024-03-12 |
Family
ID=90128481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410094527.9A Pending CN117684150A (en) | 2024-01-24 | 2024-01-24 | Wafer feeding conveying system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117684150A (en) |
-
2024
- 2024-01-24 CN CN202410094527.9A patent/CN117684150A/en active Pending
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