CN117681540A - Film tearing device of display device and film tearing method of display device - Google Patents

Abstract

The disclosure provides a film tearing device of a display device and a film tearing method of the display device, belongs to the technical field of display, and can solve the problem that bubbles exist between a static conduction passband and an integrated circuit chip when the display device is torn. The film tearing device comprises a vacuumizing structure and an adsorption member, wherein the adsorption member comprises a plurality of first adsorption holes and an exhaust groove, and the vacuumizing structure is configured to vacuumize so that the first adsorption holes form adsorption force; the adsorption component is configured to adsorb the film tearing component under the action of the adsorption force of the first adsorption hole, attach the film tearing component to the surface of the integrated circuit chip, pre-press the film tearing component, wherein the film tearing component is composed of a bearing film, a static conduction passband and a reinforcing plate which are integrally formed and overlapped, and a part of the static conduction passband is positioned in the exhaust groove.

Description

Film tearing device of display device and film tearing method of display device

Technical Field

The disclosure belongs to the technical field of display, and in particular relates to a film tearing device of a display device and a film tearing method of the display device.

Background

The display device includes an integrated circuit chip (integrated circuit, abbreviated as IC), and a Stiffener (Stiffener) is attached to the periphery of the IC to provide force support for the IC. Meanwhile, static electricity is led out to a grounding point through a static conductive band (Electro-Static discharge Tape, ESD Tape for short) to discharge harmful static electricity. Generally, the ESD Tape is attached above the IC, and there are two modes of vacuum attachment and open attachment. The vacuum laminating equipment has high cost and large energy waste, but no bubbles exist on the surface of the IC after lamination in a vacuum laminating mode, and the ESD Tape can completely wrap the IC, so that the ESD risk is avoided; open laminating (laminating in air) is low in equipment cost and small in energy waste, but bubbles are easy to occur above an IC, 100% elimination cannot be achieved, production yield and finished product assembly of a mobile phone are affected, and an ESD risk exists in a bubble area.

Disclosure of Invention

The invention aims at solving at least one of the technical problems in the prior art and provides a film tearing device of a display device and a film tearing method of the display device, wherein the film tearing device is used for eliminating bubbles between a static conduction passband and an integrated circuit chip.

In a first aspect, a technical solution adopted to solve the technical problem of the present invention is a film tearing device of a display device, where the display device includes a display panel and a flexible circuit board bound to the display panel, an integrated circuit chip is disposed on the flexible circuit board, the film tearing device includes a vacuum pumping structure and an adsorption member, the adsorption member has a first area and a second area surrounding the first area, the adsorption member includes a plurality of first adsorption holes and an exhaust slot, the exhaust slot is located in the first area, the plurality of first adsorption holes are located in the second area,

the vacuumizing structure is configured to vacuumize to enable the first adsorption holes to form adsorption force;

the adsorption component is configured to adsorb the film to be torn component under the action of the adsorption force of the first adsorption hole, attach the film to be torn component to the surface of the integrated circuit chip and pre-press the film to be torn component, wherein the film to be torn component is composed of a bearing film, a static conduction passband and a reinforcing plate which are integrally formed and overlapped, and part of the static conduction passband is positioned in the exhaust groove;

the exhaust groove is configured to enable the static electricity conduction band and the display panel to have a gap when the adsorption component is attached to the surface of the integrated circuit chip by the membrane component to be torn, so that gas is exhausted along the gap when the adsorption component is used for prepressing the membrane component to be torn.

In some embodiments, the dyestripping apparatus further comprises a clamping assembly configured to clamp the carrier film and move in the direction of the vent slot to separate the carrier film from the integrally formed and stacked static conductive tape and stiffener.

In some embodiments, the vent slot is further configured to vent gas along the gap when the carrier film is separated from the integrally formed and stacked static conductive pass band and stiffener.

In some embodiments, the adsorption member further includes a first opening located in the first area and integrally disposed with the exhaust slot, and configured to avoid a position where the integrated circuit chip is located when the adsorption member pre-presses the film to be torn assembly.

In some embodiments, the plurality of first adsorption holes are arranged in an array in the second region.

In some embodiments, the interval between two adjacent first adsorption holes is 3.2 mm-3.6 mm.

In some embodiments, the length of the vent slot is 5mm to 15mm.

In some embodiments, the film tearing device further comprises a control unit configured to set a film tearing path and control the clamping assembly to clamp the carrier film and move along the film tearing path toward the vent groove.

In some embodiments, the material of the adsorption member is polyurethane material, and the hardness is 40A-60A.

In some embodiments, the film tearing apparatus further comprises a carrying platform configured to carry the film to be torn assembly.

In some embodiments, the film tearing device further comprises a base configured to place the absorbent member.

In a second aspect, an embodiment of the present disclosure further provides a film tearing method of a display device, where the display device includes a display panel and a flexible circuit board bound to the display panel, and an integrated circuit chip is disposed on the flexible circuit board, the film tearing method includes:

attaching the electrostatic conduction band to the reinforcing plate to form an integrally formed and overlapped electrostatic conduction band and reinforcing plate;

attaching a bearing film to the surfaces of the integrally formed and overlapped electrostatic conducting belt and reinforcing plate to form a film to be torn assembly;

the method comprises the steps that an adsorption component is utilized to adsorb the film component to be torn through a first adsorption hole, the film component to be torn is attached to the surface of an integrated circuit chip, and the adsorption component is utilized to pre-press the film component to be torn, wherein a part of the electrostatic conduction band is positioned in an exhaust groove of a film tearing device, when the adsorption component attaches the film component to be torn to the surface of the integrated circuit chip, a gap exists between the electrostatic conduction band and the display panel, so that gas is discharged along the gap when the adsorption component pre-presses the film component to be torn;

and removing the adsorption member, clamping the bearing film by using a clamping assembly, and moving the bearing film towards the direction of the exhaust groove so as to separate the bearing film from the integrally formed and superposed electrostatic conduction band and reinforcing plate and exhaust gas from the exhaust groove.

In some embodiments, the clamping the carrier film with the clamping assembly and moving toward the exhaust slot specifically includes:

setting a film tearing path;

utilize clamping assembly linkage first direction, second direction and third direction, the centre gripping bear the weight of the membrane, follow tear the membrane route moves to exhaust groove direction removes, so that bear the weight of the membrane adopt S from atress with integrated into one piece and superimposed static conduction area and stiffening plate separate.

In some embodiments, during separation of the carrier film from the integrally formed and stacked static conductive tape and stiffener, the angle between the torn carrier film and the un-torn integrally formed and stacked static conductive tape and stiffener is greater than 0 ° and less than or equal to 60 °.

Drawings

Fig. 1 is a schematic illustration of a display-based film tearing device according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of an adsorption member provided in an embodiment of the present disclosure;

FIG. 3 is a top view of a film to be torn assembly provided in an embodiment of the present disclosure;

FIG. 4 is a side view of a film to be torn assembly provided in an embodiment of the present disclosure;

FIG. 5 is a side view of a tear-away carrier film provided by an embodiment of the present disclosure;

FIG. 6 is a top view of a tear-away carrier film provided in an embodiment of the present disclosure;

FIG. 7 is a perspective view of an adsorption member and base combination provided in an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of an adsorbing member and a base provided in an embodiment of the present disclosure;

fig. 9 is a flowchart of a film tearing method of a display device according to an embodiment of the disclosure.

Detailed Description

The present invention will be described in further detail below with reference to the drawings and detailed description for the purpose of better understanding of the technical solution of the present invention to those skilled in the art.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

In the related art, an electrostatic conduction Tape (ESD Tape) is attached to a carrier film before an integrated circuit chip (IC), and the carrier film needs to be adsorbed by a pressure head buffer material to achieve the ESD Tape capture. When in bonding, the pressure head buffer material needs to avoid the IC, so that the IC is prevented from being pressed by the pressure head buffer material, and meanwhile, the exhaust position is reserved, so that the gas at the bonding position is discharged. After lamination, the carrier film is required to be torn off by a clamp, secondary lamination is carried out, and finally, the complete lamination of the ESD Tape is realized. In the open bonding process, the single ESD Tape may generate gas residues with different degrees between the IC and the ESD Tape, and finally form bubbles. The main reason for this phenomenon is that the adhesion between the ESD Tape and the screen is poor during lamination, and when the film is torn, part of the ESD Tape is carried up, and bubbles are generated after secondary lamination due to incomplete exhaust. And up to now, open bonding has not completely eliminated air bubbles above the IC.

Based on the problems existing in the related art, the embodiments of the present disclosure provide a film tearing device and a film tearing method capable of eliminating bubbles between an electrostatic conduction passband (ESD Tape) and an integrated circuit chip (IC).

Fig. 1 is a schematic view of a display device-based film tearing device according to an embodiment of the present disclosure. Fig. 2 is a schematic view of an adsorption member according to an embodiment of the present disclosure. Fig. 3 is a top view of a film to be torn assembly provided in an embodiment of the present disclosure. Fig. 4 is a side view of a film to be torn assembly provided in an embodiment of the present disclosure. Fig. 5 is a side view of a tear-away carrier film provided in an embodiment of the present disclosure. Fig. 6 is a top view of a tear-away carrier film provided in an embodiment of the present disclosure. The display device comprises a display panel and a flexible circuit board bound with the display panel, and an integrated circuit chip (integrated circuit, IC for short) is arranged on the flexible circuit board. As shown in fig. 1-6, the film tearing device comprises a vacuum pumping structure 200 and an adsorption member 100, wherein the adsorption member 200 is provided with a first area 1 and a second area 2 surrounding the first area 1, the adsorption member 100 comprises a plurality of first adsorption holes 21 and an exhaust groove 12, the exhaust groove 12 is positioned in the first area 1, the plurality of first adsorption holes 21 are positioned in the second area 2, and the vacuum pumping structure 200 is configured to pump vacuum to enable the first adsorption holes 21 to form adsorption force; the adsorption member 100 is configured to adsorb the film to be torn component 3 under the action of the adsorption force of the first adsorption hole, attach the film to be torn component 3 to the surface of the integrated circuit chip 4, and pre-press the film to be torn component 3, wherein the film to be torn component 3 is composed of a bearing film 31, an electrostatic conduction band 32 and a reinforcing plate 33 which are integrally formed and overlapped, and a part of the electrostatic conduction band 32 is positioned in the exhaust groove 12; the exhaust groove 12 is configured such that when the adsorption member 100 attaches the film assembly 3 to be torn to the surface of the integrated circuit chip 4, the electrostatic conduction band 32 and the display panel have a gap, so that when the adsorption member 100 pre-presses the film assembly 3 to be torn, the gas is exhausted along the gap.

Specifically, referring to the third layer in the top view of fig. 3, the stiffener 33 is attached to three sides of the integrated circuit chip 4 and is on the same plane as the integrated circuit chip 4, and provides a force bearing support for the integrated circuit chip 4. The electrostatic conduction band (ESD Tape) 32 is usually attached to the surfaces of the integrated circuit chip 4 and the stiffener 33 by glue or other adhesive, and covers the stiffener 33, which functions to conduct the static electricity to the ground point through the electrostatic conduction band 32, and discharge the harmful static electricity.

Since the materials of the reinforcing plate 33 and the electrostatic conduction band 32 are generally soft and are liable to wrinkle, the reinforcing plate 33 and the electrostatic conduction band 32 need to be bonded to the carrier film 31 before the reinforcing plate 33 and the electrostatic conduction band 32 are bonded to the integrated circuit chip 4. The carrier film 31, the reinforcing plate 33 and the static electricity conducting tape 32 together form the film to be torn assembly 3. After the film to be torn assembly 3 is adsorbed and attached to the integrated circuit chip 4, the carrier film 31 is torn off, so that the reinforcing plate 33 and the electrostatic conduction band 32 are attached to the integrated circuit chip 4. Specifically, before the electrostatic conduction band 32 is attached to the integrated circuit chip 4, the adhesive on one side of the carrier film 31 is attached to the carrier film 31, then the carrier film 31 needs to be adsorbed (that is, the whole film to be torn assembly 3 is adsorbed) by the adsorption member 100 under the action of the adsorption force of the first adsorption hole 21, so that the electrostatic conduction band 32 is grabbed, then the electrostatic conduction band is attached to the corresponding position of the integrated circuit chip 4, and finally the carrier film 31 is torn off.

In the related art, in the process of tearing off the carrier film 31 in the open lamination process, when the static conduction band 32 is laminated on the integrated circuit chip 4, the adhesion between the static conduction band 32 and the screen of the integrated circuit chip 4 is poor, so that when the film is torn off, part of the static conduction band 32 is lifted up, and further, gas residues with different degrees are generated between the integrated circuit chip 4 and the static conduction band 32, and finally, bubbles are formed. Compared with the related art, in the embodiment of the disclosure, since the reinforcing plate 33 and the electrostatic conduction band 32 are integrated into an integrally formed structure, part of the static conduction band 32 can be prevented from being carried up when the film tearing is caused, so that the problem of gas residues with different degrees between the integrated circuit chip 4 and the electrostatic conduction band 32 is caused, and bubbles between the electrostatic conduction band 32 and the integrated circuit chip 4 can be eliminated.

In addition, when the adsorption member 100 is attached to the integrated circuit chip 4 by attaching the film to be torn 3, a vent position needs to be reserved to ensure the gas discharge at the attached position. The first area 1 of the adsorbing member 100 is mainly used for adsorbing the film to be torn assembly 3, and the second area 2 is mainly used for attaching the film to be torn assembly 3 to the integrated circuit chip 4 and tearing the carrier film 31. Specifically, since a portion of the electrostatic conduction band 32 is located in the air discharge groove 12 of the adsorbing member 100, when the adsorbing member 100 attaches the film to be torn assembly 3 to the integrated circuit chip 4, the corresponding portion of the air discharge groove 12 does not press the electrostatic conduction band 32 onto the display panel, so that a gap exists between the electrostatic conduction band 32 and the underlying display panel, which gap is used for discharging the gas. Wherein, the process of attaching the film tearing component 3 to the integrated circuit chip 4 comprises pre-pressing and secondary pressing, wherein pre-pressing refers to that the adsorption component 100 is used for pre-pressing the film tearing component 3 through the self quality after the film tearing component 3 is adsorbed to the integrated circuit chip 4. The secondary lamination refers to further lamination of the electrostatic conduction band 32 after the carrier film 31 is torn off by removing the adsorption member 100 after the film tearing assembly 3 is attached to the integrated circuit chip 4. The slit is used for discharging gas when the adsorption member 100 pre-presses the membrane module 3 to be torn.

In the embodiment of the disclosure, the reinforcing plate 33 and the electrostatic conduction band 32 of the integrated circuit chip 4 are integrated into an integrated structure before a display module (OLED MDL) factory, so that the electrostatic conduction band 32 is prevented from being carried up when the carrier film 31 is torn off, and bad bubbles of the electrostatic conduction band 32 are eliminated; the electrostatic conduction passband 32 bubble manual repair station is not required to be arranged, so that the labor, jig and cost are reduced, and the material maintenance cost is reduced; meanwhile, when the film assembly to be torn 3 is attached to the integrated circuit chip 4, an exhaust position is reserved through the exhaust groove 12 of the adsorption member 100, so that when the adsorption member 100 pre-presses the film assembly to be torn 3, gas is exhausted. Furthermore, the reinforcing plate 33 and the electrostatic conduction band 32 of the integrated circuit chip 4 are integrated into an integrated structure, so that the film tearing speed is faster, the film tearing beat is reduced by 0.4s, the film tearing unit is not a bottleneck any more, and the productivity is indirectly improved; from the macroscopic view, in the related art, the stiffening plate 33 and the static conduction band 32 are of separate two structures, and then two film tearing devices are needed to respectively tear films after the stiffening plate 33 and the static conduction band 32 are attached to the integrated circuit chip 4.

In some embodiments, as shown in fig. 2, the adsorption member 100 includes a ground structure 22 at the second region 2, and the exhaust groove 12 is disposed at one side of the ground structure 22. Specifically, the grounding structure 22 may be disposed at a middle position of the adsorbing member 100 or may be disposed at a peripheral position of the adsorbing member 100, and generally corresponds to a grounding portion of the film to be torn assembly 3. For example, when the electrostatic conduction band 32 is attached to the integrated circuit chip 4 by the adsorbing member 100 so as to be pre-pressed in correspondence with the ground portion of the electrostatic conduction band 32, the electrostatic conduction band can be more tightly pressed, and the generation of bubbles can be avoided. The grounding part of the membrane module 3 to be torn is generally customized and cannot be changed at will.

In some embodiments, the length of the vent slot 12 is 5mm to 15mm. Specifically, the dimensions of the vent slot 12 generally need to take into account venting and appearance quality. If the length of the vent 12 is too small, it may result in poor venting of gas during pre-compression and film tearing; if the length of the air discharge groove 12 is too large, the film to be torn assembly 3 (specifically, the electrostatic conduction band 32) is wrinkled under the action of the adsorption force when the adsorption member 100 adsorbs the film to be torn assembly 3. Therefore, the size of the air vent 12 needs to be flexibly set in consideration of the air vent capability and the requirements of appearance quality, and the length of the air vent 12 is generally 5mm to 15mm, but may be smaller than 5mm or larger than 15mm in specific application scenarios, which is not limited in the present disclosure.

In some embodiments, the height of the air vent 12 is consistent with the height of the adsorption member 100, i.e. the air vent 12 is hollow.

In some embodiments, the adsorption member 100 includes not only the first adsorption hole 21 and the air exhaust groove 22, but also the first opening 11, where the first opening 11 is located in the first area 1 and is integrally disposed with the air exhaust groove 12, and the first opening 11 is configured to avoid the location of the integrated circuit chip 4 when the adsorption member 100 pre-presses the membrane module 3 to be torn.

Specifically, the first region 1 in the adsorbing member 100 is mainly used for adsorbing the film to be torn assembly 3 through the first adsorbing hole 21, and the second region 2 is mainly used for attaching the film to be torn assembly 3 to the integrated circuit chip 4 and tearing the carrier film 31. Specifically, as described above, the exhaust groove located in the first area 1 is used to form a gap between the electrostatic conduction band 32 and the display panel when the adsorbing member 100 attaches the film assembly 3 to be torn on the surface of the integrated circuit chip 4, so that when the adsorbing member 100 pre-presses the film assembly 3 to be torn, the gas is exhausted along the gap. Meanwhile, the exhaust groove 12 is also used to exhaust gas along the slit when the carrier film 31 is separated from the integrally formed and stacked electrostatic conduction band 32 and reinforcing plate 33. The first opening 11 located in the first area 1 is used for exposing the integrated circuit chip 4, so as to avoid pressing the integrated circuit chip 4 when the adsorption member 100 pre-presses the film assembly 3 to be torn.

In some embodiments, the film tearing device not only includes the vacuumizing structure 200 and the adsorption member 100, but also includes a clamping assembly 500, where the clamping assembly 500 is configured to clamp the carrier film 31 and move toward the exhaust slot 12, so as to separate the carrier film 31 from the electrostatic conducting strip 32 and the reinforcing plate 33 that are integrally formed and stacked. Specifically, the clamping assembly 500 may be a clip, but may be other, and the disclosure is not limited thereto.

In some embodiments, the vent slot 12 is further configured to vent gas along the slit when the carrier film 3 is separated from the integrally formed and stacked electrostatic conducting strip 32 and stiffener 33. Specifically, after the adsorption member 100 attaches the film to be torn assembly 3 to the integrated circuit chip 4, the adsorption member 100 is removed, the holding assembly 500 holds the carrier film 31 and moves toward the exhaust slot 12 to start film tearing, and during film tearing, the gas is still discharged through the gap between the electrostatic conduction band 32 and the display panel.

In some embodiments, the film tearing apparatus includes not only the vacuum structure 200, the adsorption member 100, and the clamping assembly 500, but also the control unit 400, where the control unit 400 is configured to set a film tearing path, and control the clamping assembly 500 to clamp the carrier film 31, and move along the film tearing path toward the exhaust slot 12.

Specifically, the control unit 400 may be a Programmable Logic Controller (PLC) in the display device, and is configured to set a film tearing path according to needs, so as to control the clamping assembly 500 to clamp the carrier film 31, and move along the film tearing path toward the exhaust slot 12 for film tearing.

In some embodiments, the carrier film S-shaped self-stressed catch-pressure type tear film is used to catch all gas out according to the linkage X, Y, Z shaft when tearing the film, and a tear film path is provided. In some embodiments, during the separation process of the carrier film 31 from the integrally formed and stacked electrostatic conduction band 32 and the reinforcing plate 33, the included angle between the torn carrier film 31 and the un-torn integrally formed and stacked electrostatic conduction band 32 and reinforcing plate 33 is greater than 0 ° and less than or equal to 60 °, and the direction is the direction of the exhaust slot 12, so as to facilitate the gas exhaust. Table 1 is a configuration diagram of a dyestripping path provided in an embodiment of the present disclosure.

TABLE 1

In some embodiments, the material of the adsorption member 100 is polyurethane, and the hardness is 40A-60A.

In some embodiments, the thickness in the absorbent member 100 is typically 2mm to 3mm.

Specifically, in order to ensure that the adsorption member 100 can better adsorb the film to be torn assembly 3 without wrinkling, the adsorption member 100 generally adopts polyurethane with medium hardness, and has certain strength and wear resistance. In some embodiments, the stiffness of the absorbent member 100 is 50A. Of course, the stiffness and thickness of the absorbent member 100 may be adjusted according to the specific application requirements.

In some embodiments, the plurality of first adsorption holes 21 are disposed in an array arrangement in the second region 2.

Specifically, the first adsorption holes 21 are uniformly arranged in the second area 2, so that when the adsorption member 100 adsorbs the film to be torn assembly 3, uniform adsorption force is generated, and the adsorption member 100 adsorbs the film to be torn assembly 3 more stably. Of course, the plurality of first adsorption holes 21 may be distributed on the adsorption member 100 according to the actual needs and the adsorption forces required by different positions of the membrane module 3 to be torn, which is not limited in the disclosure.

In some embodiments, the spacing between adjacent first adsorption holes 21 is 3.2mm to 3.6mm.

Specifically, the spacing between adjacent first suction holes 21 is generally related to the suction force required to be provided by the suction member 100. For example, the adsorption member 100 is required to provide an adsorption force when adsorbing the film tearing member 3. The adsorption value is generally about 40 to 70 Mpa. At this time, the interval between adjacent two of the first adsorption holes 21 in the adsorption member 100 may be set to 3.2mm to 3.6mm. In some embodiments, the spacing between two adjacent first adsorption holes 21 is generally 3.4mm, and the diameter of the first adsorption holes 21 is 0.6mm.

The first adsorption hole 21 may adjust its adsorption force by adjusting the vacuum degree of the inside thereof; in this way, the adsorption force of the adsorption member 100 to the film to be torn assembly 3 can be adjusted by adjusting the vacuum degrees of the plurality of first adsorption holes 21, thereby avoiding the problem that the film to be torn assembly 21 cannot be grasped.

It should be noted that, the size of the adsorbing member 180 and the number of the plurality of first adsorbing holes 21 may be adjusted according to the size and the dimension of the film tearing assembly 3; in addition, the degree of density and distribution of the plurality of first adsorption holes 21 may be adjusted according to the required adsorption force and the vacuum degree that can be achieved by the vacuum pumping apparatus, which is not limited in the present disclosure.

In some embodiments, the absorbent member 100 may be square in shape, generally similar to the shape of the film assembly 3 to be torn. It should be noted that, in the embodiment of the present disclosure, the shape of the adsorbing member 100 includes, but is not limited to, specifically, the shape of the adsorbing member 180 may be adjusted according to the shape of the film to be torn assembly 3, and the shape of the adsorbing member may also be an elliptical cylinder, a regular polyhedron, or the like.

In some embodiments, the dyestripping device includes not only the evacuation structure 200, the adsorption member 100, the control unit 400, and the clamping assembly 500, but also the carrying platform 300 and the base 600. Wherein the carrying platform 300 is configured to carry the film to be torn assembly 3; the base 600 is configured to house the adsorption member 100. Fig. 7 is a combined perspective view of an adsorption member 100 and a base 600 according to an embodiment of the disclosure. Fig. 8 is a cross-sectional view of an adsorption member 100 and a base 600 according to an embodiment of the present disclosure.

In some embodiments, the material of the carrier film 31 may be polyethylene terephthalate (PET), which is also called polyethylene terephthalate or polyester resin.

In some embodiments, the size of the carrier film 31 is not smaller than the size of the adsorbing member 100 to ensure that the adsorbing member 100 is better able to adsorb the film package 3 to be torn.

The film tearing device provided by the embodiment of the disclosure is applied to a display device, and a film component 3 to be torn in the display device is composed of a carrier film 31, an electrostatic conduction belt 32 and a reinforcing plate 33 which are integrally formed and overlapped. Through material integration, before an OLED MDL factory, the electrostatic conduction band 32 and the reinforcing plate 33 are integrated into an integrated structure, so that the electrostatic conduction band 32 is prevented from being carried up when the carrier film 31 is torn off; meanwhile, the adsorption component 100 of the film tearing device is provided with an exhaust groove 12, and the fixed position is hollowed out, so that the exhaust position is reserved when the adsorption component 100 adsorbs the film tearing component 3 to be torn and when the bearing film 31 is torn off; in addition, the adsorption member 100 has the first opening 11 to avoid the integrated circuit chip 4, preventing the adsorption member 100 from being pressed to the integrated circuit chip 4 when the film assembly 3 is to be torn. Further, when the clamping assembly 500 clamps the carrier film 31 to tear the film, the carrier film S-shaped self-stress driving and pressing type carrier film is adopted for the film tearing linkage X, Y, Z shaft, and the gas between the electrostatic conduction band 32 and the integrated circuit chip 4 is completely discharged.

Based on the same inventive concept, the embodiment of the disclosure also provides a film tearing method of the display device. The display device comprises a display panel and a flexible circuit board bound with the display panel, and an integrated circuit chip is arranged on the flexible circuit board. Fig. 9 is a flowchart of a film tearing method of a display device according to an embodiment of the disclosure. As shown in fig. 9, the film tearing method includes:

901. the electrostatic conduction band 32 is attached to the reinforcing plate 33, and the electrostatic conduction band 32 and the reinforcing plate 33 are integrally formed and stacked.

902. And attaching the bearing film 31 to the surfaces of the electrostatic conduction band 32 and the reinforcing plate 33 which are integrally formed and overlapped to form the film to be torn assembly 3.

903. The adsorption member 100 is utilized to adsorb the film tearing component 3 through the first adsorption hole 21, the film tearing component 3 is attached to the surface of the integrated circuit chip 4, and the adsorption member 100 is utilized to pre-press the film tearing component 3, wherein, the part of the static electricity conducting belt 32 is positioned in the exhaust groove 12 of the film tearing device, and when the adsorption member 100 is attached to the surface of the integrated circuit chip 4, a gap exists between the static electricity conducting belt 32 and the display panel, so that when the adsorption member 100 pre-presses the film tearing component 3, gas is discharged along the gap.

904. The adsorption member 100 is removed, and the carrier film 31 is clamped by the clamping assembly 500 and moved toward the exhaust groove 12, so that the carrier film 31 is separated from the integrally formed and stacked electrostatic conduction band 32 and reinforcing plate 33, and the gas is exhausted from the exhaust groove 12.

In some embodiments, in step 904, the carrier film 31 is clamped by the clamping assembly 500 and moved toward the exhaust slot 12, specifically including: setting a film tearing path; the clamping assembly 500 is used for linking the first direction, the second direction and the third direction, so that the carrier film 31 is clamped, and moves towards the exhaust groove 12 along the film tearing path, so that the carrier film 31 is separated from the electrostatic conduction band 32 and the reinforcing plate 33 which are integrally formed and overlapped by adopting S-shaped self-stress.

In some embodiments, during separation of the carrier film 31 from the integrally formed and stacked electrostatic conduction band 32 and the reinforcing plate 33, the angle between the torn carrier film 31 and the un-torn integrally formed and stacked electrostatic conduction band 32 and reinforcing plate 33 is greater than 0 ° and equal to or less than 60 °.

Other specific details of the film tearing method provided in the embodiments of the present disclosure are similar to those of the film tearing device described above, and the detailed description thereof will not be repeated here.

In the embodiment of the disclosure, in the film tearing method, before an OLED MDL factory, electrostatic conduction band 32 and reinforcing plate 33 are integrated into an integrated structure in advance, so that when carrier film 31 is prevented from being torn off, electrostatic conduction band 32 is prevented from being carried up; meanwhile, by using the exhaust groove 12 of the adsorption member 100, when the adsorption member 100 adsorbs the film to be torn assembly 3 for prepressing, the gas is exhausted, and when the carrier film 31 is torn off, the exhaust gas is exhausted; in addition, by using the first opening 11 of the adsorbing member 100, when the adsorbing member 100 pre-presses the film to be torn assembly 3, the integrated circuit chip 4 is avoided, and the film to be torn assembly 3 is prevented from being pressed to the integrated circuit chip 4. Further, when the carrier film 31 is clamped by the clamping assembly 500 to tear the film, the carrier film is adopted to drive the pressure type carrier film from the stress by the film tearing linkage X, Y, Z shaft, and the gas between the electrostatic conduction band 32 and the integrated circuit chip 4 is completely discharged.

It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.

Claims (14)

1. A film tearing device of a display device, wherein the display device comprises a display panel and a flexible circuit board bound with the display panel, an integrated circuit chip is arranged on the flexible circuit board, the film tearing device comprises a vacuumizing structure and an adsorption member, the adsorption member is provided with a first area and a second area surrounding the first area, the adsorption member comprises a plurality of first adsorption holes and an exhaust groove, the exhaust groove is positioned in the first area, the plurality of first adsorption holes are positioned in the second area,

the vacuumizing structure is configured to vacuumize to enable the first adsorption holes to form adsorption force;

the adsorption component is configured to adsorb the film to be torn component under the action of the adsorption force of the first adsorption hole, attach the film to be torn component to the surface of the integrated circuit chip and pre-press the film to be torn component, wherein the film to be torn component is composed of a bearing film, a static conduction passband and a reinforcing plate which are integrally formed and overlapped, and part of the static conduction passband is positioned in the exhaust groove;

the exhaust groove is configured to enable the static electricity conduction band and the display panel to have a gap when the adsorption component is attached to the surface of the integrated circuit chip by the membrane component to be torn, so that gas is exhausted along the gap when the adsorption component is used for prepressing the membrane component to be torn.

2. The film tearing apparatus of claim 1, further comprising a clamping assembly configured to clamp the carrier film and move in the vent slot direction to separate the carrier film from the integrally formed and stacked static conductive tape and stiffener.

3. The film tearing device of claim 2 wherein the vent slot is further configured to vent gas along the slit when the carrier film is separated from the integrally formed and stacked static conductive pass band and stiffening plate.

4. The film tearing apparatus of claim 1, wherein the suction member further comprises a first opening located in the first region and integrally disposed with the vent slot and configured to avoid a location of the integrated circuit chip when the suction member pre-presses the film tearing assembly.

5. The film tearing device of claim 1, wherein the plurality of first adsorption holes are disposed in an array arrangement in the second region.

6. The film tearing apparatus of claim 5, wherein a distance between two adjacent first adsorption holes is 3.2mm to 3.6mm.

7. The film tearing device of claim 1, wherein the vent slot has a length of 5mm to 15mm.

8. The film tearing apparatus of claim 2, further comprising a control unit configured to set a film tearing path and control the gripping assembly to grip the carrier film and move along the film tearing path in the vent slot direction.

9. The film tearing device according to claim 1, wherein the adsorption member is made of polyurethane and has a hardness of 40A to 60A.

10. The film tearing device of claim 1, wherein the film tearing device further comprises a carrying platform configured to carry the film component to be torn.

11. The film tearing device of claim 1, wherein the film tearing device further comprises a base configured to place the adsorptive member.

12. A film tearing method of a display device, wherein the display device includes a display panel and a flexible circuit board bound to the display panel, an integrated circuit chip is disposed on the flexible circuit board, the film tearing method comprising:

attaching the electrostatic conduction band to the reinforcing plate to form an integrally formed and overlapped electrostatic conduction band and reinforcing plate;

attaching a bearing film to the surfaces of the integrally formed and overlapped electrostatic conducting belt and reinforcing plate to form a film to be torn assembly;

the method comprises the steps that an adsorption component is utilized to adsorb the film component to be torn through a first adsorption hole, the film component to be torn is attached to the surface of an integrated circuit chip, and the adsorption component is utilized to pre-press the film component to be torn, wherein a part of the electrostatic conduction band is positioned in an exhaust groove of a film tearing device, when the adsorption component attaches the film component to be torn to the surface of the integrated circuit chip, a gap exists between the electrostatic conduction band and the display panel, so that gas is discharged along the gap when the adsorption component pre-presses the film component to be torn;

and removing the adsorption member, clamping the bearing film by using a clamping assembly, and moving the bearing film towards the direction of the exhaust groove so as to separate the bearing film from the integrally formed and superposed electrostatic conduction band and reinforcing plate and exhaust gas from the exhaust groove.

13. The film tearing method of claim 12, wherein the clamping the carrier film with a clamping assembly and moving in the direction of the vent slot comprises:

setting a film tearing path;

utilize clamping assembly linkage first direction, second direction and third direction, the centre gripping bear the weight of the membrane, follow tear the membrane route moves to exhaust groove direction removes, so that bear the weight of the membrane adopt S from atress with integrated into one piece and superimposed static conduction area and stiffening plate separate.

14. The film tearing method of claim 13 wherein an angle between the torn carrier film and the un-torn integrated and stacked electrostatic conduction band and stiffener is greater than 0 ° and less than or equal to 60 ° during separation of the carrier film from the integrated and stacked electrostatic conduction band and stiffener.