CN117677069B - Chip mounter and chip mounting method - Google Patents
Chip mounter and chip mounting method Download PDFInfo
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- CN117677069B CN117677069B CN202410151360.5A CN202410151360A CN117677069B CN 117677069 B CN117677069 B CN 117677069B CN 202410151360 A CN202410151360 A CN 202410151360A CN 117677069 B CN117677069 B CN 117677069B
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
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Abstract
The invention discloses a chip mounter and a chip mounting method, and relates to the technical field of chip mounters. When carrying out the paster to the chip, can come automatic corresponding suction nozzle according to the chip of different models, need not artifical the change, reduce artificial working strength, and after changing, other suction nozzles do not influence the normal paster work of chip, convenient and fast, when the suction head absorbs the chip, utilize buffer spring's elasticity for the suction head can play the effect of buffering when absorbing the chip, prevents the too big condition that causes the chip damage of dynamics that the suction head moved down.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a chip mounter and a chip mounting method.
Background
The chip mounter is a device for automatically mounting chips and electronic elements on a printed circuit board, realizes quick, accurate and reliable mounting of the electronic elements through an accurate mechanical control and intelligent control system, is widely applied to the electronic manufacturing industry, such as the fields of communication, computers, consumer electronics and the like, can greatly improve the production efficiency and reduce the production cost, and is in various types such as a full-automatic chip mounter, a semi-automatic chip mounter, a manual chip mounter and the like so as to adapt to different production requirements and scales.
When the chip mounter works, the chip mounter needs to use the suction nozzles with different sizes for chips with different models and sizes, however, at present, the suction nozzles are mostly replaced in a manual mode, so that the manual working strength is increased, and the chip mounter capable of automatically replacing the suction nozzles needs to be developed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a chip mounter and a chip mounting method, and solves the problem that the chip mounter adopts a manual mode to replace a suction nozzle at present.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a chip mounter, includes spacing, the paster mechanism is installed to the lower extreme of spacing, paster mechanism is including the annular plate, and the upper portion equidistance of annular plate vertically runs through slidable mounting and has a plurality of spacing pipe, and the suction nozzle is all installed to the lower extreme of each spacing pipe, and the upper end outer wall of each spacing pipe all is provided with the arch, and the outside of spacing pipe still overlaps and is equipped with spacing spring, and spacing spring's both ends are connected with the upper portion and the bellied lower part of annular plate respectively, the inboard of annular plate is provided with the ring channel, slidable mounting has spacing seat between the both sides of ring channel, and the second servo motor is installed to the bottom of spacing seat, and the upper portion of spacing seat is provided with locating component, and locating component keeps away from the one end of spacing seat and is connected with the lower part of spacing, paster mechanism is still including being used for driving annular plate pivoted actuating mechanism.
Preferably, the driving mechanism comprises a concave seat arranged on the upper part of the limiting seat and close to the inner side of the annular plate, one end of the concave seat, which is far away from the limiting seat, is close to the outer side of the annular plate, a first servo motor is arranged on the inner side of one end, which is far away from the limiting seat, of the concave seat, an output shaft of the first servo motor is connected with a gear column, the driving mechanism further comprises a gear sleeve arranged on the outer wall of the annular plate, and the gear sleeve is meshed with the gear column.
Preferably, the locating component comprises a limiting cylinder arranged on the upper portion of the limiting seat, a movable sleeve is arranged on the outer longitudinal sliding sleeve of the limiting cylinder, a limiting plate is arranged on one side of the movable sleeve, a clamping head is arranged on the lower portion of one end of the limiting plate, which is far away from the movable sleeve, the outer diameter of the clamping head is equal to the inner diameter of a limiting pipe, limiting grooves are formed in two sides of the limiting cylinder, connecting plates are arranged on the inner sides of the movable sleeve, two ends of each connecting plate penetrate through the inner portions of the two limiting grooves and are longitudinally and slidably connected with the limiting cylinder, a screw rod is rotatably arranged in the inner portion of the limiting cylinder, the connecting plates are screwed on the outer portion of the screw rod through threads, the screw rod is driven by a second servo motor, a vacuum pump is arranged on one side of the limiting strip, an output end of the vacuum pump is connected with a gas pipe, and the other end of the gas pipe is fixedly arranged on the upper portion of one end of the limiting plate, which is far away from the movable sleeve, and is communicated with the inner portion of the clamping head.
Preferably, the limiting pipes on the annular plate are arranged in an annular matrix mode, and the clamping heads on the limiting plate are located right above the axes of the limiting pipe rings.
Preferably, the suction nozzle comprises an outer tube arranged at the lower end of the limiting tube, an inner tube is longitudinally and slidably arranged in the outer tube, the lower end of the inner tube extends out of the outer tube and is provided with a suction head, an outer flange is arranged on the outer wall of one end, far away from the suction head, of the inner tube, a buffer spring is sleeved in the outer tube, and two ends of the buffer spring are respectively connected with the lower side of the inner portion of the outer tube and the lower side of the outer flange.
Preferably, the inner wall of the inner tube is provided with an inner flange near the suction head, one side of the inner wall of the outer tube is provided with an L-shaped positioning rod above one end of the inner tube far away from the suction head, the other end of the L-shaped positioning rod penetrates through the hollowed-out part in the middle of the inner flange and is connected with a sealing ball, the diameter of the sealing ball is larger than the inner diameter of the hollowed-out part in the middle of the inner flange, and when the elasticity of the buffer spring is in a natural state, the top of the sealing ball just seals the hollowed-out part in the middle of the inner flange.
Preferably, the inside of sealing ball is hollow structure, and the inside top side of sealing ball installs the LED lamp, and the lower part of sealing ball is provided with the pinhole camera.
The chip mounting method of the chip mounter comprises the following steps of:
the method comprises the steps that S1, the upper end of a limiting strip is connected with a mechanical arm, follow-up patch work is facilitated, a first servo motor drives a gear column to rotate, the gear column is meshed with a gear sleeve on an annular plate, the gear column drives the annular plate to rotate when rotating, a suction nozzle of corresponding size moves to the position of a clamping head according to the size of a chip, namely a limiting pipe at the upper end of the suction nozzle moves to the position right below the suction nozzle, a second servo motor drives a screw to rotate, the screw drives a connecting plate to longitudinally move, the connecting plate drives a movable sleeve to longitudinally slide on the limiting cylinder, the clamping head on the limiting plate is clamped into the upper end of the limiting pipe, then the limiting plate continuously moves downwards, the limiting pipe drives the suction nozzle to downwardly move under the elasticity of a limiting spring, the suction nozzle is lower than the positions of other suction nozzles, and finally the suction nozzle sucks the chip through the movement of the mechanical arm, and the other suction nozzles cannot cause interference;
s2, when the chip is sucked by the suction nozzle, the position of the chip can be accurately found through the pinhole camera, and the accuracy of searching a target by the pinhole camera is improved under the illumination of the LED lamp;
s3, when the pinhole camera catches the chip, make the suction nozzle move downwards, make the suction head contact with the chip, then make the suction nozzle continue to move downwards, under buffer spring 'S elasticity, the inner tube can upwards move, and then when absorbing the chip, can play the effect of buffering, prevent to cause the damage of chip, and when the inner tube upwards moves, the position of sealing ball is fixed, make the sealing ball give out with the fretwork position on the inward flange, afterwards under vacuum pump' S work, the suction head can absorb the chip, then under the effect of arm, make the suction head give the chip transfer to the circuit board, paste the chip, the chip is pasted the back, make the suction head leave the position of chip, buffer spring will make the inner tube reset, the sealing ball will give the fretwork position on the inward flange sealed, prevent the entering of dust.
The invention provides a chip mounter and a chip mounting method, which have the following beneficial effects compared with the prior art:
1. according to the chip mounter and the chip mounting method, when the chip is mounted, corresponding suction nozzles can be automatically replaced according to the chips of different models, manual replacement is not needed, manual working strength is reduced, and after replacement, the other suction nozzles do not influence normal chip mounting operation of the chip, so that the chip mounter is convenient and quick.
2. According to the chip mounter and the chip mounting method, when the chip is sucked by the suction head, the elasticity of the buffer spring is utilized, so that the suction head can play a role in buffering when the chip is sucked, and the situation that the chip is damaged due to overlarge downward moving force of the suction head is prevented.
3. According to the chip mounter and the chip mounting method, when the suction nozzle is not used, the sealing ball can play a role in sealing the suction nozzle, dust is prevented from entering the suction nozzle, and the sealing ball does not influence the suction work of the suction nozzle on the chip.
4. According to the chip mounter and the chip mounting method, the pinhole camera and the LED lamp are arranged, so that the position of the chip can be accurately found when the chip is sucked, and the accurate positioning suction of the chip is realized.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a patch mechanism according to the present invention;
FIG. 3 is a schematic view of a positioning assembly according to the present invention;
FIG. 4 is a schematic view of the structure of the suction nozzle of the present invention;
fig. 5 is a schematic structural view of the sealing ball of the present invention.
In the figure: 1. a limit bar; 101. a vacuum pump; 102. a gas pipe; 2. a patch mechanism; 21. an annular plate; 22. a limiting tube; 23. a suction nozzle; 231. an outer tube; 232. an inner tube; 233. a suction head; 234. an outer flange; 235. a buffer spring; 236. an inner flange; 237. a sealing ball; 2371. an LED lamp; 2372. pinhole camera; 238. an L-shaped positioning rod; 24. a protrusion; 25. a limit spring; 26. an annular groove; 27. a limit seat; 28. a driving mechanism; 281. a concave seat; 282. a first servo motor; 283. a gear post; 284. a gear sleeve; 29. a positioning assembly; 291. a limiting cylinder; 292. a moving sleeve; 293. a limiting plate; 294. a chuck; 295. a limit groove; 296. a connecting plate; 297. a screw; 210. and a second servo motor.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-5, the present invention provides four technical solutions:
example 1
Referring to fig. 1-2, in the embodiment of the invention, a chip mounter comprises a limit bar 1, a chip mounting mechanism 2 is mounted at the lower end of the limit bar 1, the chip mounting mechanism 2 comprises an annular plate 21, a plurality of limit pipes 22 are longitudinally mounted at equal intervals in a penetrating manner on the upper portion of the annular plate 21, suction nozzles 23 are mounted at the lower ends of the limit pipes 22, protrusions 24 are arranged on the outer walls of the upper ends of the limit pipes 22, limit springs 25 are sleeved outside the limit pipes 22, two ends of the limit springs 25 are respectively connected with the upper portion of the annular plate 21 and the lower portion of the protrusions 24, annular grooves 26 are formed in the inner side of the annular plate 21, limit seats 27 are mounted between two sides of the annular grooves 26 in a sliding manner, a second servo motor 210 is mounted at the bottom of the limit seats 27, positioning assemblies 29 are arranged on the upper portions of the limit seats 27, one ends of the positioning assemblies 29, which are far away from the limit seats 27, are connected with the lower portions of the limit bar 1, and the chip mounting mechanism 2 further comprises a driving mechanism 28 for driving the annular plate 21 to rotate.
Referring to fig. 2, in the embodiment of the invention, the driving mechanism 28 includes a concave seat 281 disposed on an upper portion of the limiting seat 27 and close to an inner side of the annular plate 21, an end of the concave seat 281 away from the limiting seat 27 is close to an outer side of the annular plate 21, a first servo motor 282 is mounted on an inner side of an end of the concave seat 281 away from the limiting seat 27, an output shaft of the first servo motor 282 is connected with a gear post 283, the driving mechanism 28 further includes a gear sleeve 284 disposed on an outer wall of the annular plate 21, and the gear sleeve 284 is meshed with the gear post 283.
Referring to fig. 2-3, in the embodiment of the present invention, the positioning assembly 29 includes a limiting cylinder 291 disposed on an upper portion of the limiting seat 27, a moving sleeve 292 is longitudinally sleeved on an outer portion of the limiting cylinder 291, a limiting plate 293 is disposed on one side of the moving sleeve 292, a chuck 294 is disposed on a lower portion of an end of the limiting plate 293 away from the moving sleeve 292, an outer diameter of the chuck 294 is equal to an inner diameter of the limiting tube 22, limiting grooves 295 are disposed on both sides of the limiting cylinder 291, a connecting plate 296 is disposed on an inner side of the moving sleeve 292, two ends of the connecting plate 296 respectively pass through the inner portions of the two limiting grooves 295 and are longitudinally slidably connected with the limiting cylinder 291, a screw 297 is rotatably disposed in the inner portion of the limiting cylinder 291, the connecting plate 296 is screwed on an outer portion of the screw 297, the screw 297 is driven by a second servo motor 210, a vacuum pump 101 is mounted on one side of the limiting rod 1, an output end of the vacuum pump 101 is connected with an air pipe 102, and the other end of the air pipe 102 is fixedly disposed on an upper portion of the end of the limiting plate 293 away from the moving sleeve 292 and is communicated with an inner portion of the chuck 294.
In the scheme, the method comprises the following steps: when the chip is used, the upper end of the limiting strip 1 is connected with the mechanical arm, the subsequent chip mounting operation is facilitated, the first servo motor 282 drives the gear post 283 to rotate, the gear post 283 is meshed with the gear sleeve 284 on the annular plate 21, the gear post 283 drives the annular plate 21 to rotate when rotating, the suction nozzle 23 with the corresponding size moves to the position of the clamping head 294 according to the model size of the chip, namely the limiting tube 22 at the upper end of the suction nozzle 23 moves to the position right below the suction nozzle 23, then the second servo motor 210 drives the screw rod 297 to rotate, the screw rod 297 drives the connecting plate 296 to longitudinally move, the connecting plate 296 drives the movable sleeve 292 to longitudinally slide on the limiting tube 291, the clamping head 294 on the limiting plate 293 is clamped into the upper end of the limiting tube 22, then the limiting plate 293 is enabled to continuously move downwards, the limiting tube 22 is enabled to be driven to move downwards under the elasticity of the limiting springs 25, the suction nozzle 23 is enabled to be lower than the positions of other suction nozzles 23, and finally the chip is enabled to be sucked by the movement of the mechanical arm, and the other suction nozzles 23 cannot cause interference to the chip.
Further, referring to fig. 2, in the embodiment of the present invention, the limiting pipes 22 on the annular plate 21 are arranged in an annular matrix, and the clamping heads 294 on the limiting plate 293 are located right above the axes of the limiting pipes 22, so that the clamping heads 294 can be clamped into the corresponding limiting pipes 22, thereby facilitating replacement of the suction nozzles 23 of different types.
The second embodiment is different from the first embodiment in that:
referring to fig. 4, in the embodiment of the present invention, the suction nozzle 23 includes an outer tube 231 disposed at the lower end of the limiting tube 22, an inner tube 232 is longitudinally slidably mounted inside the outer tube 231, the lower end of the inner tube 232 extends out of the inner tube 231 and is provided with suction heads 233, the suction heads 233 on the suction nozzles 23 are different in model size, an outer flange 234 is disposed on an outer wall of one end of the inner tube 232, which is far from the suction heads 233, a buffer spring 235 is sleeved on the outer wall of the inner tube 232, and two ends of the buffer spring 235 are respectively connected with the lower side of the inner portion of the outer tube 231 and the lower side of the outer flange 234.
In the scheme, the method comprises the following steps: the suction nozzle 23 moves downwards, so that the suction nozzle 233 is in contact with the chip, then the suction nozzle 23 moves downwards continuously, the inner tube 232 moves upwards under the elasticity of the buffer spring 235, and then the effect of buffering can be achieved when the chip is sucked, and the chip is prevented from being damaged.
Embodiment three differs from embodiment one in that:
referring to fig. 4, in the embodiment of the present invention, an inner flange 236 is disposed on the inner wall of the inner tube 232 near the suction head 233, an L-shaped positioning rod 238 is disposed on one side of the inner wall of the outer tube 231 above one end of the inner tube 232 far away from the suction head 233, the other end of the L-shaped positioning rod 238 passes through the hollow portion in the middle of the inner flange 236 and is connected with a sealing ball 237, the diameter of the sealing ball 237 is larger than the inner diameter of the hollow portion in the middle of the inner flange 236, and when the elasticity of the buffer spring 235 is in a natural state, the top of the sealing ball 237 just seals the hollow portion in the middle of the inner flange 236.
In the scheme, the method comprises the following steps: when the inner tube 232 moves upwards, the position of the sealing ball 237 is fixed, so that the sealing ball 237 leaks the hollowed-out part on the inner flange 236, then under the operation of the vacuum pump 101, the chip can be sucked by the suction head 233, then under the action of the mechanical arm, the chip can be transferred to the circuit board by the suction head 233, the chip is attached, after the chip is attached, the suction head 233 leaves the position of the chip, the buffer spring 235 can reset the inner tube 232, and the hollowed-out part on the inner flange 236 can be sealed by the sealing ball 237, so that dust is prevented from entering.
Embodiment four differs from embodiment one in that:
referring to fig. 5, in the embodiment of the invention, the inside of the sealing ball 237 is a hollow structure, the top side of the inside of the sealing ball 237 is provided with an LED lamp 2371, and the lower part of the sealing ball 237 is provided with a pinhole camera 2372.
In the above scheme, when the suction nozzle 23 sucks the chip, the position of the chip can be accurately found through the pinhole camera 2372, and the accuracy of finding the target by the pinhole camera 2372 is improved under the illumination of the LED lamp 2371.
The chip mounting method of the chip mounter comprises the following steps of:
s1, the upper end of a limit bar 1 is connected with a mechanical arm so as to facilitate the subsequent pasting work, a first servo motor 282 drives a gear post 283 to rotate, the gear post 283 is meshed with a gear sleeve 284 on an annular plate 21, so that the gear post 283 drives the annular plate 21 to rotate when rotating, a suction nozzle 23 with corresponding size moves to the position of a clamping head 294 according to the model size of a chip, namely, a limit pipe 22 at the upper end of the suction nozzle 23 moves to the position right below the suction nozzle 23, then a second servo motor 210 drives a screw 297 to rotate, the screw 297 drives a connecting plate 296 to longitudinally move, the connecting plate 296 drives a movable sleeve 292 to longitudinally slide on the limit cylinder 291, the clamping head 294 on the limit plate 293 is clamped into the upper end of the limit pipe 22, then the limit plate 293 is continuously moved downwards, the limit pipe 22 drives the suction nozzle 23 to move downwards under the elasticity of a limit spring 25, and finally the suction nozzle 23 is enabled to suck the chip through the movement of the mechanical arm, and the other suction nozzles 23 cannot cause interference to the chip;
s2, when the suction nozzle 23 sucks the chip, the position of the chip can be accurately found through the pinhole camera 2372, and the accuracy of searching a target by the pinhole camera 2372 is improved under the illumination of the LED lamp 2371;
s3, when the pinhole camera 2372 captures a chip, the suction nozzle 23 moves downwards, so that the suction nozzle 233 is in contact with the chip, then the suction nozzle 23 moves downwards continuously, under the elasticity of the buffer spring 235, the inner tube 232 moves upwards, further, the effect of buffering can be achieved when the chip is sucked, damage to the chip is prevented, when the inner tube 232 moves upwards, the position of the sealing ball 237 is fixed, the sealing ball 237 enables the hollowed-out part on the inner flange 236 to leak out, then under the operation of the vacuum pump 101, the suction nozzle 233 can suck the chip, then under the action of the mechanical arm, the suction nozzle 233 transfers the chip to the circuit board, the chip is attached, after the chip is attached, the suction nozzle 233 leaves the position of the chip, the buffer spring 235 resets the inner tube 232, and the hollowed-out part on the inner flange 236 is sealed by the sealing ball 237, so that dust is prevented from entering.
And all that is not described in detail in this specification is well known to those skilled in the art.
Claims (5)
1. Chip mounter, including spacing (1), its characterized in that: the utility model provides a patch mechanism (2) is installed to the lower extreme of spacing (1), patch mechanism (2) is including annular plate (21), a plurality of spacing pipe (22) are vertically run through in upper portion equidistance of annular plate (21) and slide-mount, suction nozzle (23) are all installed to the lower extreme of each spacing pipe (22), and the upper end outer wall of each spacing pipe (22) all is provided with arch (24), the outside of spacing pipe (22) still overlaps and is equipped with spacing spring (25), the both ends of spacing spring (25) are connected with the upper portion of annular plate (21) and the lower part of arch (24) respectively, the inboard of annular plate (21) is provided with ring channel (26), slidable mounting has spacing seat (27) between the both sides of ring channel (26), second servo motor (210) are installed to the bottom of spacing seat (27), and the upper portion of spacing seat (27) is provided with locating component (29), the one end that spacing seat (27) were kept away from to locating component (29) is connected with the lower part of spacing (1), patch mechanism (2) still includes drive mechanism (28) that are used for driving annular plate (21);
the driving mechanism (28) comprises a concave seat (281) arranged on the upper part of the limiting seat (27) and close to the inner side of the annular plate (21), one end of the concave seat (281) away from the limiting seat (27) is close to the outer side of the annular plate (21), a first servo motor (282) is arranged on the inner side of one end of the concave seat (281) away from the limiting seat (27), an output shaft of the first servo motor (282) is connected with a gear post (283), the driving mechanism (28) further comprises a gear sleeve (284) arranged on the outer wall of the annular plate (21), and the gear sleeve (284) is meshed with the gear post (283);
the positioning assembly (29) comprises a limiting cylinder (291) arranged at the upper part of a limiting seat (27), a moving sleeve (292) is arranged on the outer longitudinal sliding sleeve of the limiting cylinder (291), a limiting plate (293) is arranged on one side of the moving sleeve (292), a clamping head (294) is arranged at the lower part of one end of the limiting plate (293) far away from the moving sleeve (292), the outer diameter of the clamping head (294) is equal to the inner diameter of a limiting pipe (22), limiting grooves (295) are formed in two sides of the limiting cylinder (291), a connecting plate (296) is arranged on the inner side of the moving sleeve (292), two ends of the connecting plate (296) respectively penetrate through the inner parts of the two limiting grooves (295) and are longitudinally and slidably connected with the limiting cylinder (291), a screw rod (297) is arranged in the inner rotation of the limiting cylinder (291), the connecting plate (296) is screwed on the outer part of the screw rod (297), the screw rod (297) is driven by a second servo motor (210), a vacuum pump (101) is arranged on one side of the limiting rod (1), the output end of the vacuum pump (101) is connected with a pipe (102), and the other end of the connecting plate (102) is far away from the inner part of the moving sleeve (292);
the limiting pipes (22) on the annular plate (21) are arranged in an annular matrix mode, and clamping heads (294) on the limiting plates (293) are located right above the annular axes of the limiting pipes (22).
2. The chip mounter according to claim 1, wherein: the suction nozzle (23) is including setting up in outer tube (231) of spacing pipe (22) lower extreme, and the inside longitudinal sliding mounting of outer tube (231) has inner tube (232), and the inside of outer tube (231) is extended to the lower extreme of inner tube (232) and is provided with suction head (233), the one end outer wall that suction head (233) was kept away from to inner tube (232) is provided with outer flange (234), and the outer wall of inner tube (232) is located the endotheca of outer tube (231) and is equipped with buffer spring (235), and the both ends of buffer spring (235) are connected with the inside downside of outer tube (231) and the downside of outer flange (234) respectively.
3. The chip mounter according to claim 2, wherein: the inner wall of inner tube (232) is close to suction head (233) department and is provided with inward flange (236), the one side of inner wall of outer tube (231) is located the one end top department that inner tube (232) kept away from suction head (233) and is provided with L shape locating lever (238), and the other end of L shape locating lever (238) passes the fretwork position in the middle of inward flange (236) and is connected with sealing ball (237), the diameter of sealing ball (237) is greater than the internal diameter in the middle of inward flange (236) fretwork position, when the elasticity of buffer spring (235) is in natural state, the top of sealing ball (237) just in time seals up with the fretwork position in the middle of inward flange (236).
4. A chip mounter according to claim 3, wherein: the inside of sealing ball (237) is hollow structure, and LED lamp (2371) are installed to the inside top side of sealing ball (237), and the lower part of sealing ball (237) is provided with pinhole camera (2372).
5. A chip mounting method of a chip mounter is characterized in that: the chip mounter according to any one of claims 1 to 4, wherein the chip mounter comprises:
s1, accurately positioning a chip through an LED lamp (2371) and a pinhole camera (2372);
s2, after positioning, the suction nozzles (23) of corresponding types are moved to the positions of the clamping heads (294) through the driving mechanism (28), after the positions are reached, the suction nozzles (23) are used for adsorbing chips, the chips are moved to the positions of the circuit boards, and the chips are attached to the circuit boards;
s3, after the attachment, the sealing ball (237) plays a role in sealing the suction head (233) by utilizing the elasticity of the buffer spring (235).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410151360.5A CN117677069B (en) | 2024-02-02 | 2024-02-02 | Chip mounter and chip mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410151360.5A CN117677069B (en) | 2024-02-02 | 2024-02-02 | Chip mounter and chip mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117677069A CN117677069A (en) | 2024-03-08 |
| CN117677069B true CN117677069B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410151360.5A Active CN117677069B (en) | 2024-02-02 | 2024-02-02 | Chip mounter and chip mounting method |
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| CN (1) | CN117677069B (en) |
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| CN219761825U (en) * | 2023-05-15 | 2023-09-26 | 武汉欣昊光电科技有限公司 | Chip mounter |
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| CN103281873A (en) * | 2013-05-17 | 2013-09-04 | 深圳市德士康科技有限公司 | Automatic chip mounter |
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| CN112261797A (en) * | 2020-11-02 | 2021-01-22 | 何海涛 | Chip mounter mounting head |
| CN217846816U (en) * | 2022-07-22 | 2022-11-18 | 深圳市易捷通光电技术有限公司 | High-speed magneto-optical switch |
| CN115551340A (en) * | 2022-11-08 | 2022-12-30 | 深圳市中瑞成通讯设备有限公司 | Automatic chip mounter |
| CN219761825U (en) * | 2023-05-15 | 2023-09-26 | 武汉欣昊光电科技有限公司 | Chip mounter |
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| CN117677069A (en) | 2024-03-08 |
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