CN117646175A - Target backboard and preparation method thereof - Google Patents
Target backboard and preparation method thereof Download PDFInfo
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- CN117646175A CN117646175A CN202311436086.8A CN202311436086A CN117646175A CN 117646175 A CN117646175 A CN 117646175A CN 202311436086 A CN202311436086 A CN 202311436086A CN 117646175 A CN117646175 A CN 117646175A
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Abstract
The application relates to a target backboard and a preparation method thereof, wherein the preparation method of the target backboard comprises the following steps: processing the blank into a first cover plate and a second cover plate; installing the first cover plate and the second cover plate into a diffusion welding tool, wherein the contact surface of the first cover plate and the second cover plate forms a water cooling channel; performing diffusion welding treatment on the first cover plate and the second cover plate to enable the first cover plate and the second cover plate to be combined into a target backboard; wherein, ultrasonic vibration is applied in the heat preservation process of diffusion welding treatment to make the contact surface combination of first apron and second apron, the vibration type of ultrasonic wave is bending vibration. Compared with the target backboard prepared by the existing brazing, the target backboard prepared by the method has a better heat dissipation effect.
Description
Technical Field
The application relates to the technical field of sputtering targets, in particular to a target backboard and a preparation method thereof.
Background
The backing plate of the sputter target is a support device that is mounted in cooperation with the sputter target. In order to prevent the undesirable phenomena of deformation, cracking, target removal and the like caused by overhigh temperature in the sputtering process, the back plate is required to have good heat conduction performance, and a water cooling channel is usually arranged in the back plate for heat dissipation. The conventional back plate with cooling water channels mainly comprises two cover plates, wherein a groove for forming the cooling water channels is formed on one side of one cover plate and covered by the other cover plate, and then the contact surface gaps of the two cover plates are subjected to sealing welding, so that a sealed water cooling channel is formed between the two cover plates, namely the inside of the back plate.
With the development of new generation ultra-precise semiconductor target technology, the requirements on the heat dissipation effect of the backboard are also higher and higher. However, the sealing welding of the traditional backboard adopts a brazing mode, and the problems of water channel blockage and the like caused by brazing filler metal are found in use, so that the quick passing of high-pressure cooling water flow is not facilitated, the heat dissipation effect of the backboard is greatly reduced, the problems of deformation, cracking and the like of a sputtering target material under the working condition are caused, the film forming quality is influenced, and even the sputtering base station is damaged.
Therefore, how to prepare the target backboard with better heat dissipation effect becomes a problem solved by the lacing of the person skilled in the art.
Disclosure of Invention
In order to prepare a target backboard with better heat dissipation effect, the application provides a target backboard and a preparation method thereof.
The application provides a preparation method of a target backboard, which comprises the following steps:
processing the blank into a first cover plate and a second cover plate;
installing the first cover plate and the second cover plate into a diffusion welding tool, wherein the contact surface of the first cover plate and the second cover plate forms a water cooling channel;
performing diffusion welding treatment on the first cover plate and the second cover plate to enable the first cover plate and the second cover plate to be combined into a target backboard;
and applying ultrasonic vibration in the heat preservation process of the diffusion welding treatment so as to enable the contact surface of the first cover plate and the second cover plate to be combined, wherein the ultrasonic vibration type is bending vibration.
The application provides a target backboard, which is prepared by using a preparation method of the target backboard.
Compared with the prior target backboard which adopts brazing to weld two cover plates, the gap of the solid workpiece is filled with the liquid solder to connect metals, the usage amount of the liquid solder is difficult to confirm, and once the solder is excessive, a cooling water channel is narrowed or blocked, the cooling water flow resistance is increased, and the heat dissipation efficiency is reduced. The application adopts diffusion welding to weld first apron and second apron, and first apron and second apron do not overheat, do not melt when the diffusion welds, carry out solid diffusion and realize connecting, and diffusion welding in-process first apron and second apron do not produce visible deformation and relative movement, rely on solid diffusion to realize connecting, and the deformation is little, and the welding accuracy is higher, can not produce liquid filler inflow and block up the phenomenon of water-cooling pipeline, is favorable to quick through taking away the heat with the high efficiency of high pressure cooling water flow, can effectively improve radiating efficiency, and the splash-proof target takes place deformation and fracture scheduling problem in advance under operating condition, guarantees film forming quality.
Drawings
Fig. 1 shows a flowchart of a method for manufacturing a target backing plate according to an embodiment of the present application;
FIG. 2 shows a schematic structural view of a first cover plate and a second cover plate according to an embodiment of the present application;
FIG. 3 shows a schematic view of the mounting structure of an enclosure of an embodiment of the present application;
fig. 4 shows a schematic structural diagram of a target backing plate according to an embodiment of the present application;
FIG. 5 illustrates a top view of a target backing plate of an embodiment of the present application;
fig. 6 is a schematic view showing the structure of an ultrasonic treatment apparatus according to an embodiment of the present application.
Detailed Description
Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Although various aspects of the embodiments are illustrated in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
It should be understood, however, that the terms "center," "longitudinal," "transverse," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counter-clockwise," "axial," "radial," "circumferential," and the like indicate or are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the invention or simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
In addition, numerous specific details are set forth in the following detailed description in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements, and circuits have not been described in detail as not to unnecessarily obscure the present application.
The application provides a preparation method of a target backboard, which comprises the following steps:
s100, processing and preparing blanks into a first cover plate 100 and a second cover plate 200, so that a contact surface when the first cover plate 100 and the second cover plate 200 are attached forms a water cooling channel;
s200, mounting the first cover plate 100 and the second cover plate 200 into a diffusion welding tool, wherein the first cover plate 100 and the second cover plate 200 are tightly attached in the diffusion welding tool, and a water cooling channel is formed in the contact surface of the first cover plate 100 and the second cover plate 200 after being tightly attached;
s400, performing diffusion welding treatment on the first cover plate 100 and the second cover plate 200 to enable the first cover plate 100 and the second cover plate 200 to be combined into a target backboard. Wherein ultrasonic vibration is simultaneously applied during the heat preservation of the diffusion welding process to bond the contact surfaces of the first and second cover plates 100 and 200.
Diffusion welding refers to a solid state welding process in which a workpiece is pressurized at high temperatures, but without visible deformation and relative movement. The diffusion welding is a welding method that two workpieces to be welded are tightly pressed together and are placed in a vacuum or protective atmosphere furnace for heating, so that microscopic plastic deformation is generated at the tiny uneven parts of the two welding surfaces, the two welding surfaces are in close contact, and atoms are mutually diffused to form metallurgical connection in the subsequent heating and heat preservation processes.
Compared with the prior target backboard which adopts brazing to weld two cover plates, the gap of the solid workpiece is filled with the liquid solder to connect metals, the usage amount of the liquid solder is difficult to confirm, and once the solder is excessive, a cooling water channel is narrowed or blocked, the cooling water flow resistance is increased, and the heat dissipation efficiency is reduced. The application adopts diffusion welding to weld first apron 100 and second apron 200, and first apron 100 and second apron 200 do not overheat, do not melt when the diffusion welds, carry out solid diffusion and realize connecting, and diffusion welding in-process first apron 100 and second apron 200 do not produce visible deformation and relative movement, rely on solid diffusion to realize connecting, and the deformation is little, and the welding accuracy is higher, can not produce the phenomenon that liquid filler flowed into the jam water-cooling pipeline, is favorable to quick the passing through of high-pressure cooling water flow and takes away the heat with the high efficiency, can effectively improve radiating efficiency, and the splash-proof target takes place deformation and fracture scheduling problem in advance under operating condition, guarantees film forming quality.
The temperature of diffusion welding is below the melting point of the base metal, the base metal is not melted in the welding process, diffusion is carried out in a solid state, the atomic diffusion is used for finishing the welding, the deformation is small, and the welded workpiece can be not subjected to additional machining and shaping.
The ultrasonic vibration is performed at the heat-insulating stage of the diffusion welding, so that the atomic diffusion at both sides of the contact surface of the first cover plate 100 and the second cover plate 200 can be promoted, the connection can be promoted, and the welding time can be reduced. In addition, the heating and heat preservation of diffusion welding can promote the grain growth of parent metal atoms, ultrasonic vibration can be applied in the heat preservation process to promote the temperature homogenization of workpieces to be welded, prevent the abnormal growth of the grains of the parent metal and promote the grain refinement in the welding process. The finer the crystal grains of the target backboard are, the larger the obstruction to dislocation movement is, so that the strength of the target backboard is improved. And the refined crystal grains can lead the plastic deformation to be more uniform and the stress concentration is not easy to generate, thereby improving the plasticity and toughness of the target backboard.
Therefore, ultrasonic vibration is applied at least once in the diffusion welding process, so that the mechanical property of the target backboard finished product can be improved, the target backboard performance is stable, the method is more durable, and the film forming quality is effectively ensured.
In one possible implementation manner, in the process of manufacturing the first cover plate 100 in S100, a water cooling groove is provided on one side of the first cover plate 100, the contact surface of the second cover plate 200 is disposed straight, and the second cover plate 200 is attached to one side of the first cover plate 100 where the water cooling groove is provided to form a water cooling channel.
In one possible implementation manner, in the process of manufacturing the second cover plate 200 in S100, a water cooling groove is provided on one side of the second cover plate 200, the contact surface of the first cover plate 100 is disposed straight, and the first cover plate 100 is attached to one side of the second cover plate 200 where the water cooling groove is provided to form a water cooling channel.
In one possible implementation, the water cooling tank is in an S-shaped structure which is bent up and down along an axis, so that the contact area is enlarged, and the auxiliary cooling liquid is contained to quickly take away the heat of the target backboard.
In one possible implementation, the first cover plate 100 is a substrate for a sputtering target, and the target is sputtered and deposited on the first cover plate 100 after being hit by an ion beam to form a thin film.
Sputtering targets are typically composed of a target, a target backing plate, and the like. The target material is a target bombarded by high-speed energy ion beam, and atoms on the surface of the target material are sputtered and deposited on the substrate to form various functional films after the target material is hit by the ion beam in the sputtering coating process. Because the high purity metal used for the target is typically softer, the working environment is also high pressure and vacuum, and the target typically needs to be mounted on special equipment to complete the sputtering process.
The target backplate that this application prepared is a supporting equipment that the cooperation target was installed, openly sets up the base plate, and the back sets up the heat dissipation and uses the water cooling passageway. The target is arranged on the substrate on one side of the target backboard, and the target and the substrate cooperate to jointly finish the sputtering coating work. The preparation of the target backboard requires higher requirements, and the back cooling water pressure and the front vacuum negative pressure are born simultaneously in the magnetron sputtering coating process.
The water cooling channel with good sealing performance is formed between the base plate and the second cover plate 200 through diffusion welding, the welding quality of the diffusion welding head is good, the microstructure and the performance of the joint are close to or the same as those of the base material, the base plate and the second cover plate 200 are good in sealing, and the connection is tight.
In addition, in the diffusion welding process, the workpieces to be welded do not generate visible deformation and relative movement, are integrally heated and cooled, and realize solid state welding by means of relative diffusion among atoms. The application treats that the welded workpiece is heated evenly, does not have overheated tissue, and parent metal self organizational structure is even with mechanical properties, evenly stable the being connected between joint and the parent metal, joint quality and stable performance. Compared with brazing and fusion welding, the target backboard has uneven tissue distribution and mechanical property distribution, cracks and brittle failure are generated in a region which can not be easily observed in a welding line or a overheat affected zone, overhauling and replacement are difficult to find, the target backboard prepared by the method is uniform and stable, joint quality and performance are stable, and inspection and maintenance are easy.
In conclusion, the target backboard prepared by the method can meet the requirements set by the sputtering coating working environment, and can bear the cooling water pressure of the back side and the vacuum negative pressure of the front side.
In one possible implementation, the first cover plate 100 is provided with a preset thickness, and the preset thickness of the first cover plate 100 is 1 to 5mm, preferably 3mm or 4mm.
In one possible implementation manner, the first cover plate 100 and the second cover plate 200 are made of oxygen-free copper, so that heat dissipation is fast, and film forming requirements of the sputtering target material can be met.
In one possible implementation, in S100, the step of processing the sheet material to prepare the first cover plate 100 and the second cover plate 200 adopts machining, and finish milling is performed on the contact surface to be bonded between the first cover plate 100 and the second cover plate 200 until the roughness of the contact surface is less than or equal to 0.8 μm and the flatness is less than or equal to 0.0015mm, so as to meet the roughness requirement before diffusion welding. In the machining process, the rotating speed of the main shaft is as follows: 800-2000r/min, cutting speed: 200-400mm/min, cutter feed: 0.25-0.45mm. The precision of the preparation process of the base plate and the second cover plate 200 is improved, the bonding degree of the contact surfaces of the base plate and the second cover plate is ensured, and the time required by diffusion welding can be properly shortened.
In one possible implementation, the blank is a metal plate, and after the step of processing the blank into the first cover plate 100 and the second cover plate 200 in S100, the step of mounting the first cover plate 100 and the second cover plate 200 to the welding tool in S200 further includes a step of pickling the first cover plate 100 and the second cover plate 200. Pickling is a method of cleaning a metal surface by immersing an article in an acid solution to remove a thin film of oxide or the like from the metal surface.
The pickling process sequentially comprises the following steps: the method comprises the steps of first acid washing, second acid washing, water washing and drying. The acid solution used for pickling is any one or a mixture of sulfuric acid, hydrochloric acid, phosphoric acid, nitric acid, chromic acid and hydrofluoric acid.
In one possible implementation, the acid solution used for the first acid washing is a mixed solution of sodium dichromate and sulfuric acid, the temperature of the solution for the first acid washing is 70-90 ℃, and the acid washing time is 20-120 minutes.
In one possible implementation, the concentration of sodium dichromate in the acid solution employed for the first pickling is 15-37 g/L, preferably 25g/L; the concentration of sulfuric acid is 3 to 5g/L, preferably 3.5g/L. The temperature of the solution for the first acid washing is 71-82 ℃, preferably 75 ℃, and the time for the first acid washing is 70 minutes.
In one possible implementation, the acid solution used for the second acid washing is a mixed acid of nitric acid and hydrofluoric acid, the solution temperature for the second acid washing is 20-50 ℃, and the second acid washing time is 2-25 minutes.
In one possible implementation, the second pickling uses an acid solution with a content of nitric acid of 5% to 8%, preferably 6.5%; the hydrofluoric acid content is 1% to 4%, preferably 2%. The temperature of the solution of the second acid washing is 27-45 ℃, preferably 30 ℃, and the time of the second acid washing is 10-15 minutes, preferably 15 minutes.
In one possible implementation, the second acid wash is followed by a water wash. The water washing step adopts deionized water for washing, the water temperature is 40-50 ℃, preferably 45 ℃, sufficient water flow into the washing tank is ensured, and the water washing is carried out in the final stage of water washing. I.e. the water wash step comprises a hot water wash followed by a running water wash. After the water washing, the first and second cover plates 100 and 200 are dried.
In one possible implementation, the drying step is drying at a preset temperature. Drying by adopting a drying box with a blower, wherein the preset drying temperature is 90-120 ℃, and is preferably 100 ℃; the drying time is 20 to 30 minutes, preferably 25 ℃.
In one possible implementation, the pickling process comprises the following steps in sequence: hanging copper pieces, chemically degreasing, washing with water for the first time, washing with water for the second time, washing with water and drying. Wherein, the chemical degreasing process specifically comprises the following steps: the copper parts were cleaned with trichloroethylene to remove grease, then etched in 10% sulfuric acid solution for 1min, and then rinsed with deionized water.
Further, after chemical degreasing, the blank is annealed at 810-830 ℃, preferably 820 ℃, for 10-30 minutes, preferably 20 minutes, before washing with water and the first acid.
In one possible implementation manner, S200, the first cover plate 100 and the second cover plate 200 are installed in a diffusion welding tool and pressed against the first cover plate 100 and the second cover plate 200, wherein a contact surface of the first cover plate 100 and the second cover plate 200 when pressed against each other forms a water cooling channel.
In one possible implementation, before the step of performing the diffusion welding process on the first cover plate 100 and the second cover plate 200 in S400, a pre-pressing step of the first cover plate 100 and the second cover plate 200 is further included in S300. After bonding, pre-compacting is carried out to ensure that the two parts are close to each other and cannot be displaced at will, and then heating and pressurizing are carried out for diffusion welding.
In one possible implementation, in the pre-compaction step, S300, the pre-compaction pressure is between 0.6 and 1MPa, preferably 0.8MPa.
In one possible implementation, in S400, the diffusion welding process is gradually pressurized at 0.1 to 0.2MPa every ten minutes until a preset working pressure is reached. Because the pressure applied during welding is smaller, the workpiece is mostly heated integrally and cooled along with the furnace, so that the whole plastic deformation of the weldment is very small, and the welded workpiece is generally not machined any more.
In one possible implementation, S400, the diffusion welding process includes the steps of: the first cover plate 100 and the second cover plate 200 which are subjected to the bonding/pre-compression treatment are integrally placed in a vacuum environment, then the temperature is raised to a preset working temperature, heat preservation is carried out after the temperature is raised to the preset working temperature, and pressure is applied to the first cover plate 100 and the second cover plate 200 in the heat preservation process until the heat preservation process is finished. Pressure is applied to bring the first cover plate 100 and the second cover plate 200 closer to each other, and the contact surface gap is reduced. And at least one ultrasonic vibration is applied to the first and second cover plates 100 and 200 during the heat preservation.
In one possible implementation, S400, the diffusion welding process is performed in a vacuum environment with a vacuum level of 2×10 - 3 Pa or more, preferably 2.33X10 -3 Pa or more.
In a possible implementation manner, in the diffusion welding process, the working temperature, that is, the temperature in the heat preservation process is determined according to the material of the base material, so that the atomic diffusion is promoted as much as possible, the welding quality is improved, and the use experience of the target backboard is ensured as a principle. The working temperature is 0.5 to 0.8 times of the melting point of the base metal.
In one possible implementation, the first cover plate 100 and the second cover plate 200 are both copper plates. S400, in the diffusion welding treatment process, the preset working temperature is 500-900 ℃, preferably 800-825 ℃, preferably 810 ℃, 815 ℃ or 820 ℃.
In one possible implementation, during the heating process, the surface temperature always rises faster than the center temperature due to the inevitable difference in internal and external temperatures of the base material due to the thermal resistance of the base material. The expansion of the surface is then greater than that of the centre, so that the surface is stressed in compression and the centre in tension, and a temperature stress, or thermal stress, is generated in the interior of the steel. The magnitude of the thermal stress depends on the magnitude of the temperature gradient, and the higher the heating speed is, the larger the internal and external temperature difference is, and the larger the temperature gradient is, the larger the thermal stress is. If such thermal stress exceeds the fracture strength limit of the base material, cracks are generated in the base material. In order to prevent the inside of the target backboard from cracking, in S400, the diffusion welding process is performed by gradually heating to a preset working temperature and then preserving heat, and the heating per hour is not more than 80 ℃. Preferably, the temperature is raised to 50 to 70℃per hour, and further, 60℃per hour.
In one possible implementation, during the diffusion welding process, the diffusion welding process is performed after heating to the preset working temperature, and the heat preservation period is 30-100 minutes, preferably 35-95 minutes, preferably 40 minutes, 50 minutes, 60 minutes, 70 minutes, 80 minutes or 90 minutes.
In one possible implementation, in S400, during diffusion welding, pressure is applied to the first cover plate 100 and the second cover plate 200, and the pressure is gradually increased to a preset working pressure, and the pressure is increased to be less than 0.4MPa every ten minutes. Preferably 0.1 to 0.2MPa per ten minutes, further 0.15MPa or 0.18MPa per ten minutes.
In one possible implementation, in S400, during diffusion welding, pressure is applied to the first cover plate 100 and the second cover plate 200, the pressure value is increased stepwise, and the step-up pressurization is performed until a preset working pressure is reached.
In one possible implementation, in S400, the pressure applied to the first and second cover plates 100 and 200 during the diffusion welding is provided with a preset working pressure, which is 0.5 to 3MPa. Preferably 1MPa, 1.5MPa, 2MPa or 2.5MPa
In one possible implementation, S400, the ultrasonic vibration is performed for the first 1/3 to 2/3 of the duration of the incubation. At least one ultrasonic vibration is performed, for example, the heat-retaining period is 60 minutes, and the ultrasonic vibration is performed at 20 to 40 minutes, preferably 25 minutes. The number of times and the single time length of the ultrasonic vibration are set according to specific needs as long as the ultrasonic vibration treatment occurs in this time range.
In one possible implementation, S400, the ultrasonic vibration is performed in the early stage of the heat preservation process, and the welding effect is better. The ultrasonic vibration is carried out in the first 1/4-1/3 of the duration of the heat preservation process. And carrying out ultrasonic vibration at least once in the heat preservation process.
One side in the thickness direction of the first cover plate 100 is bonded to one side in the thickness direction of the second cover plate 200, and the thickness directions of the first cover plate 100 and the second cover plate 200 are identical. Based on this:
in one possible implementation, the vibration direction of the first cover plate 100 and the second cover plate 200 during the ultrasonic vibration is identical to the thickness direction thereof.
In one possible implementation, the type of vibration of the ultrasonic vibration is a transverse wave vibration, and the transmission direction of the ultrasonic wave is perpendicular to the thickness direction of the first cover plate 100 and the second cover plate 200.
In one possible implementation, the type of vibration of the ultrasonic vibration is longitudinal wave vibration, and the transmission direction of the ultrasonic wave is parallel to the thickness direction of the first cover plate 100 and the second cover plate 200.
In one possible implementation, the type of vibration of the ultrasonic vibrations is bending vibrations, and the ultrasonic tool head output of the bending vibrations is connected to a side of the first cover plate 100 facing away from the second cover plate 200, and ultrasonic waves of the bending vibrations are applied to the first cover plate 100 and the second cover plate 200.
In one possible implementation, the vibration frequency of the ultrasonic vibration is 20 to 60kHz, preferably 35kHz, 40kHz, 50kHz; the amplitude is 20 to 40. Mu.m, preferably 30 μm or 35. Mu.m. The duration of the ultrasonic vibration is 1 to 5 seconds. Preferably 3 seconds or 4 seconds.
In one possible implementation, after the heat preservation process of the diffusion welding is finished in S400, the method further includes a step of S500 of cooling. Gradually cooling until the target backboard can be taken out smoothly.
Further, the cooling speed is less than 50 ℃ per hour, and the cooling speed is less than or equal to 50 ℃/h. In the cooling process, the vacuum degree is kept at 6 multiplied by 10 -3 Cooling to below 50 ℃ under Pa to obtain the target material backThe plate is removed.
In one possible implementation, after the target backing plate is removed at S500, a step of finish milling the target backing plate is further included at S600. The flatness of the surface of the target backboard and the fine adjustment of the overall size are met to meet the use requirement.
In one possible implementation, as shown in fig. 3, the welding tool is a mechanical encapsulation structure 300, the first cover plate 100 and the second cover plate 200 are installed in the encapsulation structure 300, and are attached inside the encapsulation structure 300, and mechanical pressure is applied to the outside of the encapsulation structure 300, so that damage to the surface of the target backing plate caused by the pressurization process is reduced.
In one possible implementation, as shown in fig. 2 and 3, a protrusion is provided on one side of the second cover plate 200, and a groove matched with the protrusion is provided on the other side of the protrusion, so that a boss is formed in the middle of the second cover plate 200, the first cover plate 100 is matched with the protrusion of the second cover plate 200, the first cover plate 100 is welded on the protruding side of the boss in a fitting manner, and a connection hole 210 is provided on the edge of the second cover plate 200 for being connected with the encapsulation structure 300 to prevent displacement. Further, the number of the connection holes 210 is more than two, the boss of the second cover plate 200 is cylindrical, and the connection holes 210 are circumferentially distributed on the plane of the periphery of the boss.
In one possible implementation, the connection hole 210 is a threaded hole.
In one possible implementation, the encapsulation structure 300 includes an upper half and a lower half, the upper half having a groove shape, the protrusion of the second cover plate 200 being inserted into the groove of the upper half, and the first cover plate 100 being located between the groove of the upper half and the protrusion of the second cover plate 200. The protrusions of the lower half are inserted into the grooves of the second cover plate 200 with one side protruding and the other side being straight. The positioning pins pass through the upper half, the connecting hole 210 of the second cover plate 200 and the lower half in sequence to limit, and prevent displacement.
In one possible implementation, ultrasonic vibrations are applied to the first and second cover plates 100, 200 using an ultrasonic tool head (also called a bonding tool head 700). The output end of the ultrasonic tool head is connected to one side of the first cover plate 100/encapsulation structure 300 to promote atomic diffusion between the first cover plate 100 and the second cover plate 200.
Further, the other side of the second cover plate 200/the encapsulation structure 300 is also provided with an ultrasonic tool head, the first cover plate 100 and the second cover plate 200 on two sides of the contact surface are all subjected to ultrasonic vibration, metal atoms are actively diffused, the metal connection is promoted to finish welding, the welding progress is accelerated, and the welding quality is improved.
In one possible implementation, the ultrasonic tool head output is provided with a joint that abuts one side of the first cover plate 100/envelope structure 300. The other side of the second cover plate 200/envelope structure 300 is placed over another joint, the two joints forming a stack of lap joints. Ultrasonic vibration is applied to the first cover plate 100 through the lap joint.
In one possible implementation, the first cover plate 100 and the second cover plate 200 are attached, pre-compressed, heated to a preset working temperature, then heat-preserved, then the ultrasonic tool head is used for carrying out ultrasonic vibration on the side, away from the second cover plate 200, of the first cover plate 100, and then the combination of the first cover plate 100 and the second cover plate 200 is filled into the encapsulation structure 300 for mechanical pressurization.
In one possible implementation, during the incubation, pressure is applied to the first and second cover plates 100 and 200 while the ultrasonic vibrations are occurring. That is, the ultrasonic vibration treatment and the pressurization/maintenance pressure treatment do not interfere with each other.
In one possible implementation, after gradually pressurizing to a preset working pressure, at least one ultrasonic vibration is applied to the first and second cover plates 100 and 200.
In one possible implementation, the ultrasonic device used in the ultrasonic vibration process includes a power supply 400, a sonic generator 500, a horn, and a welding tool head 700. The ultrasonic generator 500 converts the current into high frequency electrical energy, which is again converted into an equally frequency mechanical motion by the transducer, which is then transferred by the horn to the welding tool head 700, which welding tool head 700 transfers the received vibrational energy to the joint of the workpieces to be welded. Pressure is applied to the top of horn/bonding tool head 700. When the ultrasonic treatment is needed, the device generates ultrasonic waves and transmits the ultrasonic waves to the contact surface; the application of pressure to the envelope structure 300 may be removed without the need for ultrasonic treatment or may be accomplished without the need to directly apply pressure to the top of the horn/welding tool head 700. The selection is flexibly performed on the principle of uniformly pressurizing and ensuring that the first cover plate 100 and the second cover plate 200 do not move relative to each other.
In one possible implementation, the type of vibration of the ultrasonic vibration is flexural vibration and the ultrasonic wave is flexural wave. Bending vibration is understood to mean a mode in which the displacement of each particle in the base material is generally in bending vibration during ultrasonic vibration of the first cover plate and the second cover plate. The atomic diffusion rate can be effectively improved, and the welding speed is increased.
The horn includes a longitudinal vibration horn 600 and a bending vibration horn 800 that cooperate to effect ultrasonic vibration of the first and second cover sheets. The longitudinal vibration horn 600 is connected with an ultrasonic generator, the bending vibration horn 800 is connected with the output end of the longitudinal vibration horn 600, and the output end of the bending vibration horn 800 is connected with a welding tool/lap joint. The ultrasonic generator converts the current into high-frequency electric energy, the high-frequency electric energy is converted into mechanical motion with the same frequency again through the transducer, then the mechanical motion is transmitted to the bending vibration amplitude rod 800 through the longitudinal amplitude rod, the conversion from the longitudinal wave to the bending vibration wave is completed, the bending vibration wave is transmitted to the welding tool head 700, and the welding tool head is led into the first cover plate and the second cover plate.
In order to ensure the bending rigidity of the bending vibration amplitude transformer 800 to avoid the influence of the normal operation of the vibration system due to the generation of displacement nodes at the working end when the resistance is large, the bending vibration amplitude transformer 800 has a circular interface, and the diameter of the bending vibration amplitude transformer 800 is greater than or equal to 4mm, preferably 5mm. Further, in order to avoid shearing vibration by making the vibration of the bending vibration horn 800 close to the faded bending vibration, the joint between the pillow bending vibration horn 800 and the longitudinal vibration horn 600 is not damaged, and the ratio of the output wavelength of the bending vibration horn 800 to the radius of the bending vibration horn 800 is 8 or more, preferably 9 or more. Further, the present application employs a bending vibration horn 800 having a vibration order of 4 to 5 wave steps.
In one possible implementation, the frequency of the ultrasonic vibrations is 20KHz, the output wavelength of the bending vibration horn 800 is 40mm or less and 90mm or less, and the radius of the bending vibration horn 800 is 2mm or less and r or less and 10mm or less.
When used in conjunction with the longitudinal vibration horn 600, the wavelength of the bending vibration horn 800 needs to be sufficiently large compared to the longitudinal dimension of the junction of the two horns bending vibration horn 800 to view the junction as a point and neglect its effect on bending vibration. In the present application, the size of the junction between the longitudinal vibration horn 600 and the bending vibration horn 800 is 5mm or more to satisfy the wavelength requirement of bending waves, preferably 6mm.
Ultrasonic vibration is classified into two types, single-sided and double-sided, according to the manner in which ultrasonic energy is transmitted. The ultrasonic wave is led into the ultrasonic vibration from one side of the upper sound pole, and the upper sound pole and the lower sound pole are oppositely arranged in the upper test ultrasonic vibration, and the ultrasonic wave is led into the ultrasonic vibration from two sides. In one possible implementation, the present application employs double-sided ultrasonic vibration, employs a full-wave welding tool head, and compared to a single-sided half-wave welding head, the welding head is easy to warp due to lateral pressurizing force, high power output is difficult to perform, the present application can output high power, ultrasonic vibration is introduced from both sides, and the welding head is uniformly stressed and cannot warp. The upper and lower sonotrodes respectively guide ultrasonic waves into the first cover plate and the second cover plate. Wherein, according to the vibration condition of the upper sound pole, the vibration is divided into two types of longitudinal vibration and bending vibration. Compared with the longitudinal double-side imported ultrasonic, the ultrasonic welding machine is easy to cause mechanical interference, is not ideal in application convenience and high in danger, adopts bending vibration, is large in workpiece operable range, is not easy to cause mechanical interference, is high in efficiency of a pressurizing system, is free of welding head warping phenomenon, and is convenient and safe.
According to another aspect of the application, a target backboard is provided, and the target backboard is prepared by the preparation method of the target backboard.
Example 1:
an oxygen-free copper sheet is machined into a first cover plate 100 and a second cover plate 200 according to fig. 2. The first cover plate 100 is in a flat plate shape with the thickness of 3mm, the second cover plate 200 is 8mm thick, and the boss protrudes out of the second cover plate 20030mm. An S-shaped water cooling groove with the depth of 3mm is formed on the outer side of the convex surface of the second cover plate 200 on the contact surface of the second cover plate 200. Finish milling the contact surface of the first cover plate 100 and the second cover plate 200 until the roughness is less than or equal to 0.8 mu m and the flatness is less than or equal to 0.0015mm;
acid washing liquid formula for the first acid washing: 18g/L of sodium dichromate and 3.2g/L of sulfuric acid; pickling solution is pickled for 45 minutes at the temperature of 75 ℃;
acid washing for the second time, wherein the formula of the acid washing liquid for the acid washing is as follows: nitric acid 6.5%, hydrofluoric acid 2%, pickling solution at 40 ℃ for 20 minutes, and removing surface oxides;
washing with water, putting the first cover plate 100 and the second cover plate 200 into a washing tank, adding enough deionized water with the temperature of 50 ℃ into the washing tank for immersing and washing, and then washing with the deionized water to ensure that the surfaces of the parts are not polluted;
drying, namely drying in a drying box with a blower at a drying temperature of 100 ℃ for 20 minutes;
the first cover plate 100 and the second cover plate 200 are assembled into the envelope structure 300 as shown in fig. 3, and then placed in the vacuum chamber in the lap joint shown in fig. 5, and pre-compression is performed by applying pressure to the tip of the bonding tool head 700, the pre-compression pressure being 0.8MPa.
Diffusion welding, and vacuumizing to 3×10 -3 Pa, starting to heat, heating to 80 ℃ per hour until reaching the preset working temperature of 810 ℃, and then entering a heat preservation stage. The whole length of the heat preservation process is 90min, the pressurizing process is carried out step by step, the pressurizing is carried out every ten minutes in the heat preservation time to the working pressure, and the working pressure is 2MPa. At 20 minutes of the heat preservation, ultrasonic waves of bending vibration were applied to the envelope structure 300 using the ultrasonic tool head shown in FIG. 5, the vibration frequency was 40kHz, the ultrasonic amplitude was 30 μm, and the operation was stopped after 5 seconds. And cooling after the heat preservation process is finished, not pressurizing, keeping the vacuum degree unchanged, cooling to 50 ℃ per hour, taking the encapsulation structure 300 out of the vacuum chamber, and taking the target backboard out of the encapsulation structure 300.
And detecting the target backboard, and finding that the deformation of the welded part is less than 0.05mm. And (3) performing welding tightness test, wherein the ventilation pressure is 7MPa, and the ventilation times are more than 10000 times without air leakage.
The embodiments of the present application have been described above, the foregoing description is exemplary, not exhaustive, and not limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. The preparation method of the target backboard is characterized by comprising the following steps:
processing the blank into a first cover plate and a second cover plate;
installing the first cover plate and the second cover plate into a diffusion welding tool, wherein the contact surface of the first cover plate and the second cover plate forms a water cooling channel;
performing diffusion welding treatment on the first cover plate and the second cover plate to enable the first cover plate and the second cover plate to be combined into a target backboard;
and applying ultrasonic vibration in the heat preservation process of the diffusion welding treatment so as to enable the contact surface of the first cover plate and the second cover plate to be combined, wherein the ultrasonic vibration type is bending vibration.
2. The method of claim 1, further comprising the step of pickling the first and second cover plates after the step of machining the blank into the first and second cover plates, before the step of mounting the first and second cover plates to a welding tool.
3. The method of claim 1, further comprising a pre-pressing step of the first cover plate and the second cover plate before the step of performing the diffusion welding process on the first cover plate and the second cover plate.
4. The method of claim 1, wherein the backing plate is gradually pressurized during the diffusion welding process, each ten minutes being pressurized by 0.4MPa or less until a predetermined working pressure is reached.
5. The method for manufacturing a target backing plate according to claim 1, wherein the diffusion welding process is performed in a vacuum atmosphere with a vacuum degree of 2.33×10 -3 Pa or more.
6. The method for manufacturing a target backboard according to claim 1, wherein the first cover plate and the second cover plate are copper plates, and the preset working temperature is 800-825 ℃ in the diffusion welding treatment process.
7. The method for preparing the target backboard according to claim 1, wherein in the diffusion welding treatment process, the heat is preserved after the temperature is raised to a preset working temperature, and the heat preservation time is 30-100 minutes.
8. The method for producing a target backing plate according to claim 1, wherein the vibration frequency of the ultrasonic vibration is 20 to 60kHz.
9. The method of claim 1, wherein the amplitude of the ultrasonic vibrations is 20-40 μm.
10. A target backing plate, characterized in that it is prepared by the method for preparing a target backing plate according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311436086.8A CN117646175A (en) | 2023-10-31 | 2023-10-31 | Target backboard and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311436086.8A CN117646175A (en) | 2023-10-31 | 2023-10-31 | Target backboard and preparation method thereof |
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