CN117641858A - Solar control panel - Google Patents
Solar control panel Download PDFInfo
- Publication number
- CN117641858A CN117641858A CN202311675864.9A CN202311675864A CN117641858A CN 117641858 A CN117641858 A CN 117641858A CN 202311675864 A CN202311675864 A CN 202311675864A CN 117641858 A CN117641858 A CN 117641858A
- Authority
- CN
- China
- Prior art keywords
- control chip
- pin
- power transistor
- solar
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011889 copper foil Substances 0.000 claims abstract description 36
- 238000009413 insulation Methods 0.000 claims abstract description 35
- 239000003990 capacitor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000006866 deterioration Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000007257 malfunction Effects 0.000 description 4
- 101100218591 Arabidopsis thaliana BDG1 gene Proteins 0.000 description 3
- 102100039435 C-X-C motif chemokine 17 Human genes 0.000 description 3
- 101000889048 Homo sapiens C-X-C motif chemokine 17 Proteins 0.000 description 3
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 101100123053 Arabidopsis thaliana GSH1 gene Proteins 0.000 description 2
- 101100298888 Arabidopsis thaliana PAD2 gene Proteins 0.000 description 2
- 101000590281 Homo sapiens 26S proteasome non-ATPase regulatory subunit 14 Proteins 0.000 description 2
- 101001114059 Homo sapiens Protein-arginine deiminase type-1 Proteins 0.000 description 2
- 101150092599 Padi2 gene Proteins 0.000 description 2
- 102100023222 Protein-arginine deiminase type-1 Human genes 0.000 description 2
- 102100035735 Protein-arginine deiminase type-2 Human genes 0.000 description 2
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/32—Electrical components comprising DC/AC inverter means associated with the PV module itself, e.g. AC modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to a solar control panel, which comprises a basal layer with insulativity, an insulating layer and a copper foil layer with conductivity, wherein the copper foil layer is provided with a circuit connection pattern and is stacked on the basal layer, and the insulating layer is stacked on the copper foil layer. In addition, the circuit connection patterns of the exposed portions of the insulating layer are used as component connection pads for disposing a plurality of electrical components. In particular, the solar control panel is provided with a heat insulation through hole at the middle part, and the power transistor and the control chip are respectively positioned at two sides of the heat insulation through hole and separated by the heat insulation through hole, so that the heat resistance of heat conduction between the power transistor and the control chip is increased, the heat conduction from the power transistor to the control chip can be reduced, the heat insulation effect is improved, and the performance deterioration or misoperation of the control chip due to temperature rise is avoided.
Description
Technical Field
The invention belongs to the technical field of electronics, and particularly relates to a solar control panel.
Background
Solar energy is a well-known renewable energy source, and mainly uses solar panels (or called solar panels) to convert light energy into electric energy to generate open-circuit voltage, and further can be combined into a solar module with enough direct-current output power through proper serial connection and parallel connection of a plurality of solar panels, and then is matched with a solar control panel to convert the direct-current output power into alternating-current power and generate alternating-current power after boosting, such as 220V and 50Hz alternating current, so that the solar module can be used for supplying power to electric equipment to operate or connected in parallel to the existing power grid system.
Generally, the solar control panel is at least provided with a control chip and a power transistor, the direct current generated by the solar panel is connected to the power transistor of the solar control panel, and the control chip controls the on and off of the power transistor in a switching manner, so that the power transistor generates alternating current power and outputs the alternating current power.
However, the above-mentioned conventional technology has a disadvantage in that the power transistor generates a large amount of heat during operation and is conducted to the control chip through a heat transfer path on the solar control panel, so that the control chip causes a reduction in working efficiency under the influence of heat, incorrect electrical operation, or even malfunction to damage the entire solar control panel.
Therefore, there is a need for an innovative solar control panel, which mainly uses heat insulation holes formed in the solar control panel, and respectively configures the power transistor and the control chip on two opposite sides of the heat insulation holes to be isolated by the heat insulation holes, so as to increase the thermal resistance of heat conduction between the power transistor and the control chip, reduce the heat conducted from the power transistor to the control chip, improve the heat insulation effect, and avoid performance deterioration or malfunction of the control chip due to temperature rise, thereby solving all the problems of the conventional technology.
Disclosure of Invention
The embodiment of the invention provides a solar control panel, which comprises a substrate layer, a copper foil layer and an insulating layer, wherein the substrate layer and the insulating layer are electrically insulated, the copper foil layer is electrically conductive and provided with a circuit connection pattern, the copper foil layer is stacked on the substrate layer, and the insulating layer is stacked on the copper foil layer. In addition, the insulating layer is provided with a plurality of windows, corresponding parts of the circuit connection patterns below are exposed to be used as component connection pads for arranging a plurality of electric components, wherein the electric components at least comprise a power transistor, a capacitor and a control chip.
The beneficial effects of the invention are as follows:
the solar control panel is provided with a heat insulation perforation which is arranged at the middle part of the solar control panel, and the power transistor and the control chip are respectively arranged at two sides of the heat insulation perforation, such as two vertical sides, so that the power transistor and the control chip can be isolated by the heat insulation perforation, the heat resistance of heat conduction between the power transistor and the control chip is increased, the heat conduction from the power transistor to the control chip can be reduced, the heat insulation effect is improved, and the performance deterioration or misoperation of the control chip caused by temperature rise is avoided.
[ brief description of the drawings ]
Fig. 1 shows a schematic view of a solar control panel according to an embodiment of the present invention.
Fig. 2 shows a schematic circuit connection diagram of a solar control panel according to an embodiment of the invention.
Fig. 3 shows an enlarged partial schematic view of the circuit connections in the solar control panel according to an embodiment of the invention.
Fig. 4 is a schematic diagram showing a circuit connection pattern of a copper foil layer in a solar control panel according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the drawings and the specific embodiments thereof in order to make the objects, technical solutions and advantages of the present invention more apparent.
Please refer to fig. 1, fig. 2, and fig. 3, which are schematic diagrams of a solar control panel, a circuit connection schematic diagram, and a partial enlarged schematic diagram of circuit connection according to an embodiment of the present invention. As shown in fig. 1, 2 and 3, the solar control panel PCB according to the embodiment of the invention includes a substrate layer SUB, a copper foil layer CUP and an insulating layer GL, wherein the substrate layer SUB and the insulating layer GL have electrical insulation property, the copper foil layer CUP has electrical conductivity and has a circuit connection pattern, the copper foil layer CUP is stacked on the substrate layer SUB, and the insulating layer GL is stacked on the copper foil layer CUP. In addition, the insulating layer GL has a plurality of windows exposing the corresponding portions of the underlying circuit connection patterns as device connection PADs for disposing a plurality of electrical devices, and positive and negative electrode connection PADs PAD1 and PAD2, wherein the electrical devices at least include a power transistor MOS, a capacitor C1, and a control chip IC.
For example, the insulating layer GL may include a green paint commonly used for a general circuit board.
In particular, the solar control panel PCB of the present invention has the heat insulation through hole H formed at the middle portion thereof, and may have an elliptical shape, a polygonal shape, or an irregular shape, and the shape shown in the drawings is a rectangle combined with an ellipse, which is just an exemplary example. In particular, the power transistor MOS and the control chip IC are respectively located at two opposite sides of the heat insulation through hole H, such as two vertical sides of the heat insulation through hole H in the drawing, so that the power transistor MOS and the control chip IC are isolated by the heat insulation through hole H to increase the thermal resistance of heat conduction between the power transistor MOS and the control chip IC. In short, the main effect of the thermal isolation via H is to isolate the power transistor MOS and the control chip IC from the thermal isolation via H as much as possible.
It should be noted that the relative positions of the power transistor MOS and the control chip IC on the solar control board PCB with respect to the heat insulation through hole H are only illustrated in fig. 1 as an exemplary example, and are not intended to limit the present invention, i.e. the two sides of the power transistor MOS and the control chip IC may be left and right in the horizontal direction or two sides of the diagonal direction, so long as the power transistor MOS and the control chip IC are capable of increasing the thermal resistance of the heat conduction between the power transistor MOS and the control chip IC on the opposite sides of the heat insulation through hole H, and are included in the scope of the present invention.
Referring back to fig. 2, the solar control board PCB is used to connect to the solar panel output power PS, wherein the control chip IC has a power pin VCC1, a ground pin GND1, a positive pin P1, a negative pin N1 and a driving pin DRV, and the power transistor MOS has a power pin VCC2, a ground pin GND2, a source pin S2, a gate pin G2 and a drain pin D2.
The power pin VCC1 of the control chip IC is connected to the first end CP1 of the capacitor C1, and the ground pin GND1 of the control chip IC is connected to the second end CP2 of the capacitor C1.
In addition, the positive electrode pin P1 of the control chip IC is connected to the source electrode pin S2 of the power transistor MOS and the positive electrode P of the solar panel output power PS, the negative electrode pin N1 of the control chip IC is connected to the drain electrode pin D2 of the power transistor MOS and the negative electrode N of the solar panel output power PS, and the gate electrode pin G2 of the power transistor MOS is connected to the driving pin DRV of the control chip IC.
Specifically, the power pin VCC1 of the control chip IC is connected to the first end CP1 of the capacitor C1 by the power wire BDVCC1, the ground pin GND1 of the control chip IC is connected to the second end CP2 of the capacitor C1 by the ground wire BDGND1, and the positive pin P1 of the control chip IC is connected to the positive electrode P of the solar panel output power PS by the circuit connection pattern of the conductive adhesive copper foil layer CUP. In addition, the negative electrode N1 pin of the control chip IC is connected to the negative electrode N of the solar panel output power PS by a circuit connection pattern of the conductive adhesive copper foil layer CUP.
Furthermore, the drain pin D2 of the power transistor MOS is connected to the negative electrode pin N1 of the control chip IC and the negative electrode N of the solar panel output power PS by the circuit connection pattern of the conductive adhesive copper foil layer CUP, the source pin S2 of the power transistor MOS is connected to the positive electrode pin P1 of the control chip IC and the positive electrode P of the solar panel output power PS by the circuit connection pattern of the copper foil layer CUP by at least one source wire BDS2, and the gate pin G2 of the power transistor MOS is connected to the driving pin DRV of the control chip IC by the circuit connection pattern of the copper foil layer CUP by at least one gate wire BDG 2. Particularly, the driving pin DRV of the control chip IC is connected to the circuit connection pattern of the copper foil layer CUP by the gate wire BDG 1.
Referring back to fig. 3, a simplified schematic diagram showing the stacked structure of the substrate SUB, copper foil layer CUP and insulating layer GL of the solar control panel PCB in a side view and showing the power wire BDVCC1 of the control chip IC and the source wire BDS2 of the power transistor MOS connected to the copper foil layer CUP in a partially enlarged manner is shown. In particular, the power supply wire BDVCC1 is firstly connected to the copper foil layer CUP by the control chip IC after crossing up to the upper side of the insulating layer GL, and similarly, the source wire BDS2 is firstly connected to the copper foil layer CUP by the power transistor MOS after crossing up to the upper side of the insulating layer GL, so that the heat generated during the operation of the power transistor MOS can be transferred to the control chip IC only along the source wire BDS2, the copper foil layer CUP and the power supply wire BDVCC1, thereby reducing the heat transfer to the control chip IC as much as possible, avoiding the performance degradation or malfunction of the control chip IC due to the temperature rise, and achieving the heat insulation effect.
Referring back to fig. 1, the solar control panel PCB of the present invention further includes an auxiliary through hole HA, which is located at a horizontal side of the heat insulation through hole H and penetrates through the base layer SUB, the copper foil layer CUP and the insulating layer GL, so as to further isolate the power transistor MOS and the control chip IC, further increase the thermal resistance of heat conduction between the power transistor MOS and the control chip IC, reduce the heat conducted from the power transistor MOS to the control chip IC, and improve the heat insulation effect.
With further reference to fig. 4, in conjunction with fig. 1, a schematic diagram of circuit connection patterns of copper foil layers in a solar control panel according to the present invention is shown. As shown in fig. 4, in the circuit connection pattern of the copper foil layer CUP, the left side is the negative electrode area NPAD for connecting to the negative electrode N of the solar panel output power PS in fig. 1, and the right side is the positive electrode area PPAD for connecting to the positive electrode P of the solar panel output power PS in fig. 1, that is, the positive electrode connection PAD1 and the negative electrode connection PAD2 in fig. 1 are part of the positive electrode area PPAD and the negative electrode area NPAD in fig. 4, respectively. In particular, the gate driving connection line LG2 connected to the gate pin G2 of the power transistor MOS by the gate wire BDG1 is located in the region between the heat insulation through hole H and the auxiliary through hole HA, and the width of the gate driving connection line LG2 is reduced as much as possible within the allowable range of the resistance without affecting the signal transmission quality, which achieves the effect of increasing the thermal resistance from the power transistor MOS to the control chip IC because the gate pin G2 of the power transistor MOS, the gate driving connection line LG2 and the driving pin DRV of the control chip IC form a thermal conduction path, and the smaller the width of the gate driving connection line LG2, the larger the thermal resistance of the thermal conduction path.
In summary, the present invention is characterized in that the heat insulation perforation arranged on the solar control panel is used to increase the thermal resistance of heat conduction between the power transistor and the control chip, reduce the heat conducted from the power transistor to the control chip, improve the heat insulation effect between the power transistor and the control chip, and avoid performance deterioration or malfunction of the control chip due to temperature rise.
In addition, another feature of the present invention is that the power transistor and the control chip are electrically connected to the copper foil layer via wire bonding, so that the heat conduction path is further limited to the wire bonding, and the wire bonding itself is made of a metal material with high electrical conductivity and high thermal conductivity, such as gold wire, and the wire diameter of the wire bonding is far smaller than the connection wire of the circuit connection pattern in the copper foil layer, so that the thermal resistance between the power transistor and the control chip can be greatly increased, and the heat insulation effect is improved.
Furthermore, the present invention is further characterized in that an auxiliary through hole is formed on the horizontal side of the heat insulation through hole and penetrates through the base layer, the copper foil layer and the insulating layer, so as to further isolate the power transistor and the control chip and further increase the thermal resistance of heat conduction between the power transistor and the control chip. It should be noted that the position of the heat insulation perforation and the auxiliary perforation of the solar control panel is not limited to the above-mentioned manner, and the present invention is limited thereto as long as the power transistor and the control chip can be isolated. In addition, the sizes and shapes of the heat insulation through holes and the auxiliary through holes are not limited, and the heat insulation through holes and the auxiliary through holes can be enlarged as much as possible under the area allowable range of the solar control panel, and the heat resistance of heat conduction between the power transistor and the control chip can be increased.
In the whole, the basal layer and the insulating layer of the solar control panel are poor heat conductors, the copper foil layer is a good heat conductor, and the heat resistance of a conduction path formed by the copper foil layer is increased as much as possible to effectively achieve the heat insulation effect, so that the invention mainly adopts a physical connection of a plurality of specific pins in a wire bonding mode. In addition, the base layer and the insulating layer of the poor heat conductor are provided with heat insulation perforations, so that the length of a heat conduction path from the power transistor to the control chip is prolonged as much as possible, the heat resistance between the power transistor and the control chip is increased, and the heat insulation effect is further improved.
The above description is for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention in any way, but is intended to cover any and all modifications or variations of the present invention that fall within the spirit and scope of the invention.
Claims (6)
1. The utility model provides a solar control panel, its characterized in that is used for connecting a solar panel output to be used for placing a plurality of electrical components, just solar control panel has a thermal-insulated perforation, is set up in a middle part of solar control panel, solar control panel contains: a substrate layer having electrical insulation properties;
a copper foil layer with electrical conductivity, which is stacked on the substrate layer and has a circuit connection pattern; and
the insulating layer is provided with a plurality of windows, is used for exposing a corresponding part of the circuit connection pattern below and is used as a component connection pad, the heat insulation perforation penetrates through the substrate layer, the copper foil layer and the insulating layer, the electric component at least comprises a power transistor, a capacitor and a control chip, and the power transistor and the control chip are respectively positioned at two vertical sides of the heat insulation perforation and are isolated by the heat insulation perforation, so that the heat resistance of heat conduction between the power transistor and the control chip is increased.
2. The solar control panel of claim 1, wherein the control chip has a power pin, a ground pin, a positive pin, a negative pin, and a driving pin, the power transistor has a power pin, a ground pin, a source pin, a gate pin, and a drain pin, the power pin of the control chip is connected to a first end of the capacitor, the ground pin of the control chip is connected to a second end of the capacitor, the positive pin of the control chip is connected to the source pin of the power transistor and to a positive electrode of the solar panel output power supply, the negative pin of the control chip is connected to the drain pin of the power transistor and to a negative electrode of the solar panel output power supply, and the gate pin of the power transistor is connected to the driving pin of the control chip.
3. The solar control panel of claim 2, wherein the power supply pins of the control chip are connected to the first end of the capacitor by a power supply wire, the ground pins of the control chip are connected to the second end of the capacitor by a ground wire, the drive pins of the control chip are connected to the circuit connection pattern of the copper foil layer by a gate wire, the positive pins of the control chip are connected to the positive electrode of the solar panel output power supply by a conductive adhesive, the negative pins of the control chip are connected to the negative electrode of the solar panel output power supply by a conductive adhesive, the drain pins of the power transistor are connected to the negative electrode pins of the control chip and the negative electrode of the solar panel output power supply by a conductive adhesive, the source pins of the power transistor are connected to the circuit connection pattern of the copper foil layer by at least one source wire and the positive electrode pins of the control chip are connected to the positive electrode pins of the solar panel output power supply by a conductive adhesive, and the positive electrode pins of the power transistor are connected to the positive electrode pins of the gate wire.
4. The solar control panel of claim 3, wherein the at least one source wire comprises four source wires.
5. The solar control panel of claim 1, comprising an auxiliary via on a horizontal side of the thermal isolation via and extending through the base layer, the copper foil layer and the insulating layer to further isolate the power transistor and the control chip to further increase thermal resistance of thermal conduction between the power transistor and the control chip.
6. The solar control panel of claim 1, wherein the insulating layer comprises a green paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311675864.9A CN117641858A (en) | 2023-12-06 | 2023-12-06 | Solar control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311675864.9A CN117641858A (en) | 2023-12-06 | 2023-12-06 | Solar control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641858A true CN117641858A (en) | 2024-03-01 |
Family
ID=90028659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311675864.9A Pending CN117641858A (en) | 2023-12-06 | 2023-12-06 | Solar control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117641858A (en) |
-
2023
- 2023-12-06 CN CN202311675864.9A patent/CN117641858A/en active Pending
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