CN117590138B - Copper sheet inspection method and device, electronic equipment and medium - Google Patents
Copper sheet inspection method and device, electronic equipment and medium Download PDFInfo
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- CN117590138B CN117590138B CN202410059862.5A CN202410059862A CN117590138B CN 117590138 B CN117590138 B CN 117590138B CN 202410059862 A CN202410059862 A CN 202410059862A CN 117590138 B CN117590138 B CN 117590138B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 291
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 291
- 239000010949 copper Substances 0.000 title claims abstract description 291
- 238000000034 method Methods 0.000 title claims abstract description 70
- 238000007689 inspection Methods 0.000 title claims abstract description 57
- 238000004590 computer program Methods 0.000 claims description 11
- 238000013461 design Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention provides a copper sheet inspection method, a copper sheet inspection device, electronic equipment and a copper sheet inspection medium, and relates to the field of printed circuit board design. The method comprises the following steps: acquiring a copper sheet to be marked and acquiring a coverage area of the copper sheet to be marked on a circuit board; searching pin coordinates related to current input and output of copper sheets to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the pin coordinates related to the current input and/or the current output are multiple; planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths; searching a maximum closed area surrounded by the through flow path; and marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet. According to the scheme provided by the invention, the copper sheet without through-flow effect can be automatically detected and marked, and the inspection efficiency of the copper sheet is obviously improved.
Description
Technical Field
The present invention relates to the field of printed circuit board design, and in particular, to a copper sheet inspection method, apparatus, electronic device, and medium.
Background
In recent years, with the development of the wide application of cloud computing, informatization gradually covers various fields of society. The daily work and life of people are more and more communicated through networks, the network data volume is also increasing, and the performance requirement on the server is higher. The rate of the signal increases exponentially, the speed of the chip calculation increases comparably, and the power consumption increases. The server is a system composed of a large number of operation, storage and management chips, and is required to be powered and supported at all times. It is well known that current will heat up when passing through a conductor, and at a given current, the rate of heat up depends on the cross-sectional area of the conductor, which is directly related to the heat dissipation of the conductor itself. When the heat generated by the current passing through the conductor and the heat emitted by the conductor reach a balance, the temperature of the PCB (Printed Circuit Board, the printed circuit board or simply the circuit board) carrying the electronic device is in a certain range, and the designed through flow can be determined to be reasonable. Copper sheets are common conductors on circuit boards, and the design of the copper sheets is required to conform to the through-flow design principle, so that the copper sheets are inevitably required to be inspected after the preliminary design of the copper sheets is completed.
At present, the existing copper sheet inspection method mainly comprises the following two steps: the first method is as follows: according to the manual observation method, according to the principle that the current is transmitted along the shortest path, the general path of the current is visually examined to judge which part of copper sheets are not on the current path, so that the copper sheets are manually searched and identified one by one, and the efficiency is low. The second method is as follows: simulation software is used for simulating the through-flow design of the PCB, the simulation result is analyzed to determine where the current density is low, the position with low current density is the position of the invalid copper sheet, but the simulation model and parameters are required to be set independently, the simulation time is long, the positions of the copper sheets are confirmed one by one according to the analysis result, the simulation is required to be carried out again after the optimization is finished, and the process is complicated.
Disclosure of Invention
The invention provides a copper sheet inspection method, a copper sheet inspection device, electronic equipment and a copper sheet medium, which are used for solving the problems of low inspection efficiency and complicated process caused by the fact that copper sheet detection depends on a manual or simulation instrument in the prior art, realizing automatic detection and identifying copper sheets without through flow effect.
According to a first aspect of the present invention, there is provided a copper sheet inspection method comprising:
acquiring a copper sheet to be marked, and acquiring a coverage area of the copper sheet to be marked on a circuit board;
Searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple;
carrying out shortest through flow path planning on any two elements in the coordinate set to obtain a plurality of through flow paths;
searching a maximum closed area surrounded by the through flow path;
and marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet.
In some possible implementations, the obtaining the copper sheet to be marked includes:
acquiring all copper sheets of at least one layer on a circuit board;
and selecting one copper sheet from all the obtained copper sheets in a traversing manner as the copper sheet to be marked.
In some possible implementations, the acquiring the coverage area of the copper sheet to be marked on the circuit board includes:
determining a copper sheet boundary line according to the DBID of the copper sheet to be marked;
and taking the area formed by surrounding the copper sheet boundary line as the coverage area.
In some possible implementations, the searching the pin coordinates related to the current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set includes:
the method comprises the steps of obtaining DBIDs of all power input pins and DBIDs of all power output pins in a coverage area, and obtaining DBIDs of copper sheets to be marked;
respectively acquiring corresponding network names according to the DBID of each power input pin, the DBID of each power output pin and the DBID of the copper sheet to be marked;
judging whether the network name of each power input pin is the same as the network name of the copper sheet to be marked;
if the network name of any power input pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of the any power input pin on a circuit board;
judging whether the network name of each power output pin is the same as the network name of the copper sheet to be marked;
if the network name of any power output pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of the any power output pin on a circuit board;
and putting all the acquired coordinates into a set to obtain the coordinate set.
In some possible implementations, the planning the shortest through flow path for any two elements in the coordinate set to obtain a plurality of through flow paths includes:
acquiring all avoidance areas on the copper sheet to be marked;
selecting two target elements from the coordinate set in a manner of traversing all combinations, and performing the following operations on the two selected target elements:
connecting two target elements to obtain a linear path;
judging whether the straight line path is intersected with any avoidance area or not;
if the straight line path and any avoidance area are not crossed, the straight line path is used as a through flow path corresponding to two target elements;
if the straight line path and any avoidance area are intersected, the shortest circulation path is re-planned for the two target elements based on a preset path planning rule.
In some possible implementations, the re-planning the shortest flow path for the two target elements based on the preset path planning rule includes:
finding tangential points of the two target elements and the arbitrary avoidance areas respectively;
respectively connecting two target elements with corresponding tangent points to obtain two new linear paths, and returning to the step of judging whether the linear paths intersect any avoidance areas or not until all the linear paths do not intersect any avoidance areas;
And performing path splicing according to all the obtained straight paths and the tangent points on each avoidance area to generate through flow paths corresponding to the two target elements.
In some possible implementations, the searching for the tangential points of the two target elements and the arbitrary avoidance region includes:
acquiring the number of the avoidance areas with the intersections;
if the straight line path is intersected with the avoidance areas, selecting the avoidance area closest to the target element as a target avoidance area;
if the straight line path only crosses one avoidance zone, the avoidance zone with the crossing is taken as a target avoidance zone;
and respectively searching tangential points of the two target elements and the target avoidance area on the boundary of the target avoidance area.
In some possible implementations, the searching for the tangential points of the two target elements and the target avoidance area on the boundary of the target avoidance area includes:
taking the intersection point of the straight line path and the boundary line of the target avoidance zone as a starting point;
and moving the target avoidance area boundary line for a preset length from the starting point every time until the tangential point coordinates of the two target elements and the target avoidance area are found.
In some possible implementations, the method further includes:
and under the condition that the coordinate of the tangential point of any one target element and the target avoidance area is not found, the step of moving the preset length along the boundary line of the target avoidance area every time from the starting point is executed again after the preset length is reduced.
In some possible implementations, the generating a through-flow path corresponding to two target elements according to the path splicing performed by all the obtained straight-line paths and the tangent points on each avoidance area includes:
finding out the shortest curve path connecting the two tangent points according to the two tangent points of each avoidance area;
and connecting each linear path to the corresponding position of the shortest curve path comprising the same tangent point according to the tangent point included in each linear path to obtain the through flow path.
In some possible implementations, the searching for the maximum enclosed area surrounded by the through flow path includes:
searching all closed areas surrounded by the through flow paths;
calculating the area of each closed area;
and taking the closed area with the largest area as the largest closed area.
In some possible implementations, the searching for the maximum enclosed area surrounded by the through flow path includes:
Traversing the copper sheet boundary line corresponding to the copper sheet to be marked, and searching a through flow path nearest to the copper sheet boundary line;
and taking all the closed areas formed by surrounding the through flow paths closest to the copper sheet boundary line as the maximum closed area.
According to a second aspect of the present invention, there is also provided a copper sheet inspection apparatus, the apparatus comprising:
the acquisition module is used for acquiring the copper sheet to be marked and acquiring the coverage area of the copper sheet to be marked on the circuit board;
the coordinate searching module is used for searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple;
the through flow path planning module is used for planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths;
the closed area searching module is used for searching a maximum closed area surrounded by the through flow path;
The marking module is used for marking the part of the copper sheet to be marked, which is positioned in the maximum sealing area, as an effective copper sheet and marking the part of the copper sheet to be marked, which is positioned outside the maximum sealing area, as an ineffective copper sheet.
According to a third aspect of the present invention, there is also provided an electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing any of the copper skin inspection methods described above when executing the program.
According to a fourth aspect of the present invention there is also provided a non-transitory computer readable storage medium having stored thereon a computer program which when executed by a processor implements a copper skin inspection method as described in any of the above.
According to the copper sheet inspection method provided by the invention, the coverage area of the copper sheet to be marked on the circuit board is firstly obtained, then the pin coordinates related to the current input and the current output of the copper sheet to be marked are searched by using the coverage area to obtain the coordinate set, and then the shortest through flow path planning is carried out on any two elements in the coordinate set to obtain the through flow paths corresponding to any two coordinate elements, then the surrounding area searching is carried out on all the through flow paths obtained through the planning to obtain the maximum closed area, and finally the effective and ineffective automatic marking is carried out on the copper sheet according to the maximum closed area, so that the copper sheet without the through flow effect can be automatically detected, the area where the ineffective copper sheet and the effective copper sheet are located is also marked on the copper sheet, complex parameters are not required to be set, the operation is convenient, the inspection result is accurate and reliable, and the inspection efficiency of the copper sheet is remarkably improved.
In addition, the copper sheet inspection device, the electronic device and the non-transitory computer readable storage medium of the present embodiment can achieve the above technical effects as well, and are not described herein again.
Drawings
In order to more clearly illustrate the invention or the technical solutions in the related art, the following description will briefly explain the drawings used in the embodiments or the prior art descriptions, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic view of a copper sheet structure in the related art;
FIG. 2 is a schematic diagram of copper sheet through-flow in the related art;
FIG. 3 is a schematic flow chart of the copper sheet inspection method provided by the invention;
fig. 4 is a schematic diagram of a copper sheet structure on a circuit board according to the present invention;
FIG. 5 is a schematic diagram of a process for performing shortest path finding on two pins within the coverage area of the copper sheet in FIG. 4;
FIG. 6 is a schematic illustration of the results provided by the present invention for marking the copper sheet of FIG. 4;
fig. 7 is a schematic structural view of a copper sheet inspection device provided by the invention;
Fig. 8 is a schematic structural diagram of an electronic device provided by the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the related art, referring to fig. 1, a PCB is generally formed by laminating multiple copper sheets and a medium, and different devices are connected to each other on the PCB by the copper sheets. From another aspect, the current is always transmitted along the shortest path, as shown in fig. 2, three pins on the right are power input ends, two pins indicated by arrows on the left are pins consuming current (corresponding to copper sheets, namely current output ends), which are interconnected and conducted through the copper sheets, the copper sheets around the edges of the pins are avoided from being opened and closed along the edges of the pins when passing through other pins, so that no short circuit occurs, as shown by a circular solid line, no copper sheet exists in the circular inner area, when copper laying design is performed by using design software, the shape of the copper sheet manually drawn by an engineer cannot be realized, as shown in the lower left corner of fig. 2, the copper sheet in the rectangular frame part is not located on the through flow path, the copper sheet does not have a through flow effect and occupies the wiring space on the PCB board, the simulation software can see that the current density at the point is very low, and the design software does not automatically detect functions similar to the ineffective copper sheet.
A copper sheet inspection method, a copper sheet inspection apparatus, an electronic device, and a non-transitory computer-readable storage medium of the present invention are described below with reference to fig. 3 to 8.
Fig. 3 is a schematic flow chart of a copper sheet inspection method according to an embodiment of the present invention, and referring to fig. 1, the present embodiment provides a copper sheet inspection method, which may be implemented through steps S301 to S305, and the following details will be described with reference to each step:
step S301, obtaining a copper sheet to be marked, and obtaining a coverage area of the copper sheet to be marked on a circuit board.
In this embodiment, the copper sheet to be marked refers to a copper sheet to be inspected and marked, and the copper sheet to be marked may be any copper sheet on any layer of the circuit board. The copper sheet to be marked can be obtained by a unique identification of the copper sheet, such as DBID. The coverage area refers to the area of the copper sheet on the surface of the cover plate of the circuit board, and the coverage areas corresponding to different copper sheets are different. The coverage area may be obtained by a specific query command using a unique identifier of the copper sheet in combination with a circuit board design file.
Step S302, searching pin coordinates related to current input and current output of copper sheets to be marked in a coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple.
In this embodiment, the pin related to the current input of the copper sheet to be marked refers to a connection terminal connected to the power supply end on the copper sheet to be marked, and the pin coordinate related to the current output of the copper sheet to be marked refers to a connection terminal connected to the power consumption end on the copper sheet to be marked; including but not limited to chip pins, pads or vias, and the like.
In this embodiment, the total number of pins associated with the current input and the current output satisfies three or more, that is, the coordinate set includes at least three coordinate elements. For example, referring to fig. 4, the pins related to the current input of the copper sheet include three pins on the right side, and the pins related to the current output of the copper sheet include two pins on the left side. It should be noted that the specific number of pins associated with current inputs and outputs above is for illustration only.
And step S303, carrying out shortest through flow path planning on any two elements in the coordinate set to obtain a plurality of through flow paths.
In this embodiment, the shortest through-flow path planning refers to searching for a through-flow path with the smallest distance between two coordinate elements, and the number of through-flow paths obtained after the shortest through-flow path planning is performed is related to the number of element combinations in the coordinate set, and each pair of coordinate element combinations corresponds to one through-flow path. For example, it is not necessary to assume that three coordinate elements exist in a certain coordinate set, and then the possible combination of the coordinate elements is C 2 3 And the shortest through flow path planning is carried out on the coordinate set, so that three through flow paths can be obtained.
Step S304, searching for a maximum closed area surrounded by the through flow path.
In this embodiment, the maximum closed area search can be implemented not only by calculating the area of the closed area, but also by calculating the boundary distance between the through-flow path and the copper sheet to be marked.
In step S305, the portion of the copper sheet to be marked located in the maximum enclosed area is marked as an effective copper sheet, and the portion located outside the maximum enclosed area is marked as an ineffective copper sheet.
In this embodiment, the marking may be implemented by adding a specific character or adding a specific color to the region. For example, copper sheets outside the maximum enclosed area may be marked with invalid and copper sheets inside the maximum enclosed area may be marked with valid. For example, copper sheets outside the maximum enclosed area are marked with 0, and copper sheets inside the maximum enclosed area are marked with 1. Note that the symbols for the marked areas listed in the present embodiment are only for illustration, and should not be construed as limiting the present invention.
According to the copper sheet inspection method, the coverage area of the copper sheet to be marked on the circuit board is firstly obtained, then pin coordinates related to current input and current output of the copper sheet to be marked are searched by using the coverage area to obtain a coordinate set, and then any two elements in the coordinate set are subjected to shortest through-flow path planning to obtain through-flow paths corresponding to any two coordinate elements, then all through-flow paths obtained through planning are subjected to surrounding area searching to obtain the largest closed area, and finally effective and ineffective automatic marking is carried out on the copper sheet according to the largest closed area, so that not only can the copper sheet without through-flow effect be automatically detected, but also the areas where the ineffective copper sheet and the effective copper sheet are located are marked on the copper sheet, complex parameters are not required to be set, the operation is convenient, the inspection result is accurate and reliable, and the inspection efficiency of the copper sheet is remarkably improved.
In some possible implementations, the obtaining the copper sheet to be marked in the step S301 may be specifically implemented by the following steps:
acquiring all copper sheets of at least one layer on a circuit board;
and selecting one copper sheet from all the obtained copper sheets in a traversing manner as the copper sheet to be marked.
According to the copper sheet inspection method, the copper sheets on all layers of the circuit board are obtained, the copper sheets to be marked are selected from the obtained copper sheets in a traversing mode, all the copper sheets on the whole circuit board can be automatically grabbed without user intervention, manual workload is greatly reduced, copper sheet grabbing omission can be avoided, and extremely high accuracy is achieved.
In some possible implementations, the acquiring the coverage area of the copper sheet to be marked on the circuit board in the step S301 may be specifically implemented by the following steps:
determining a copper sheet boundary line according to the DBID of the copper sheet to be marked;
and the area formed by surrounding the boundary line of the copper sheet is taken as a coverage area.
According to the copper sheet inspection method, automatic acquisition of boundaries is achieved for each grabbed copper sheet, so that the positions of the copper sheets on a circuit board are accurately marked, and references are provided for pins corresponding to the subsequent automatic grabbed copper sheets.
In some possible implementations, the foregoing step S302 searches pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, which may be specifically implemented by the following steps:
the method comprises the steps of obtaining DBIDs of all power input pins and DBIDs of all power output pins in a coverage area, and obtaining DBIDs of copper sheets to be marked;
respectively acquiring corresponding network names according to the DBID of each power input pin, the DBID of each power output pin and the DBID of the copper sheet to be marked;
judging whether the network name of each power input pin is the same as the network name of the copper sheet to be marked;
if the network name of any power input pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of any power input pin on the circuit board;
judging whether the network name of each power supply output pin is the same as the network name of the copper sheet to be marked;
if the network name of any power output pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of any power output pin on the circuit board;
and putting all the acquired coordinates into a set to obtain a coordinate set.
According to the copper sheet inspection method, pins and through holes of the copper sheet areas and the copper sheet same network are automatically identified by means of the coverage areas of the copper sheets on the circuit board, manual participation is not needed in the whole process, and pins of the copper sheets related to through flow can be accurately screened out.
In some possible implementations, in the foregoing step S303, the shortest through-flow path planning is performed on any two elements in the coordinate set, so as to obtain a plurality of through-flow paths, which may be specifically implemented by the following steps:
acquiring all avoidance areas on the copper sheet to be marked;
selecting two target elements from the coordinate set in a manner of traversing all combinations, and performing the following operations on the two selected target elements:
connecting two target elements to obtain a linear path;
judging whether the straight line path intersects any avoidance area or not;
if the straight line path and any avoidance area are not crossed, the straight line path is used as a through flow path corresponding to two target elements;
if the straight line path and any avoidance area are intersected, the shortest circulation path is re-planned for the two target elements based on a preset path planning rule.
The copper sheet inspection method of the embodiment carries out the shortest through flow path planning on any two coordinate elements in the coordinate set in a traversing way, can automatically calculate the shortest through flow path between any two pins and the through holes, does not need to use a simulation test instrument or observe manually in the whole process, can obviously reduce the occurrence of missing pin phenomena, has higher accuracy,
In some possible implementations, the shortest flow path is re-planned for the two target elements based on the preset path planning rule, specifically by the following steps:
finding tangential points of two target elements and any avoidance areas respectively;
respectively connecting the two target elements with the corresponding tangent points to obtain two new linear paths, and returning to the step of judging whether the linear paths intersect any avoidance area or not until all the linear paths do not intersect any avoidance area;
and performing path splicing according to all the obtained straight paths and the tangent points on each avoidance area to generate through flow paths corresponding to the two target elements.
In some possible implementations, finding a tangent point between two target elements and any avoidance regions includes:
acquiring the number of the avoidance areas with the intersections;
if the straight line path intersects with the avoidance areas, the avoidance area closest to the target element is selected as the target avoidance area;
if the straight line path only crosses one avoidance zone, the avoidance zone with the crossing is taken as a target avoidance zone;
and respectively searching tangential points of the two target elements and the target avoidance area on the boundary of the target avoidance area.
According to the copper sheet checking method, aiming at the situation that the straight through flow path and the avoidance area are crossed, the selection rules of different target avoidance areas are set for various crossing situations, so that preparation is made for searching for the shortest through flow path again, and the searching efficiency of the shortest through flow path can be further improved.
In some possible implementations, finding tangent points of two target elements and the target avoidance area on the boundary of the target avoidance area includes:
taking the intersection point of the straight line path and the boundary line of the target avoidance zone as a starting point;
and moving the target avoidance zone along the boundary line of the target avoidance zone for a preset length each time from the starting point until the tangential point coordinates of the two target elements and the target avoidance zone are found.
According to the copper sheet inspection method, aiming at the situation that a straight line path and an avoidance area have an intersection point, the coordinates of the tangent points are searched on the boundary of the avoidance area by taking a specific step length as a unit from the intersection point, so that a through-flow path can automatically bypass the avoidance area, and the path searching efficiency is high.
In some possible implementations, the copper sheet inspection method further includes:
and under the condition that the tangential point coordinates of any one target element and the target avoidance area are not found, the step of moving the preset length along the boundary line of the target avoidance area every time from the starting point is executed again after the preset length is reduced.
According to the copper sheet checking method, the corresponding tangent points are searched for by adopting the coarse-granularity tangent point searching mode for the target elements in the avoidance area, and the fine-granularity searching mode can be automatically switched to under the condition that the tangent points are not found, so that the calculated amount can be saved by adopting the two different-granularity searching modes, and the copper sheet checking efficiency is further improved.
In some possible implementations, path splicing is performed according to all the obtained straight paths and tangent points on each avoidance area, so as to generate through-flow paths corresponding to two target elements, including:
finding out the shortest curve path connecting the two tangent points according to the two tangent points of each avoidance area;
and connecting each linear path to the corresponding position of the shortest curve path comprising the same tangent point according to the tangent point included in each linear path to obtain the through flow path.
In some possible implementations, the foregoing step S304, searching for the maximum enclosed area surrounded by the through flow path may specifically be implemented by the following steps:
searching all closed areas surrounded by the through flow paths;
calculating the area of each closed area;
the enclosed area with the largest area is taken as the largest enclosed area.
According to the copper sheet checking method, through searching all possible closed areas, the corresponding area of each closed area is calculated, so that the largest closed area can be obtained by finding the closed area with the largest area, automatic identification and searching of the through-flow effective area are realized, and higher accuracy is achieved.
In some possible implementations, the foregoing step S304, searching for the maximum enclosed area surrounded by the through flow path may specifically be implemented by the following steps:
traversing a copper sheet boundary line corresponding to the copper sheet to be marked, and searching a through flow path nearest to the copper sheet boundary line;
and taking all the closed areas formed by surrounding the through flow paths closest to the boundary line of the copper sheet as the maximum closed area.
According to the copper sheet checking method, the through-flow path closest to the boundary line is searched in a manner of traversing the boundary line of the copper sheet to be marked, and then the largest closed area is found out through the closed area formed by surrounding the through-flow paths closest to all the boundary lines of the copper sheet, so that the automatic identification and searching of the through-flow effective area are realized, and the method is more suitable for the condition that the number of current input/output pins is relatively large compared with the method for searching through the through-flow area, and can improve the searching efficiency of the largest closed area, so that the copper sheet checking efficiency is further improved.
In some possible implementations, in order to facilitate understanding of the solution of the present invention, the copper sheet inspection method of the present invention will be described in detail below by taking the copper sheet shown in fig. 4 as an example, and the specific implementation procedure of the method refers to the following:
step one, all copper sheets of each layer of the PCB are obtained through an axlDBGetshape ("etch") command and stored in an array l_dbid_shape_all.
And step two, after l_dbid_shape_all is obtained, the parts which are invalid on all copper sheets can be automatically searched by taking out the parts one by one from the l_dbid_shape_all for analysis processing, so that one DBID is taken out from the l_dbid_shape_all for illustration and is marked as dbid_shape_A.
And thirdly, acquiring the network name of the copper sheet by a dbid_shape_A- > net- > name command, and recording the network name as a dbid_shape_A- > net, wherein the network name can be used as a frame selection area of device pins and through holes according to the boundary of the copper sheet, so that the dbid of the device pins and the through holes covered by the area is acquired and stored in the l_dbid_pin_via.
And step four, taking out the elements one by one, namely db id_pin_via_1, finding out the network name of a pin or a via through the db id_pin_via_1- > net- > name, namely db id_pin_via_1_net, comparing the network name with the db id_shape_A_net, and storing the network name into the l_dbid_pin_via_same_net if the network names are the same.
Step five, two element examples are arbitrarily taken out from the l_dbid_pin_via_same_net and are marked as dbid_pin_same_net_a and dbid_pin_via_same_net_b, as shown in fig. 4, the coordinates of the central points of the two elements are taken out to be (x_ A Y _a) (x_ B Y _b), a straight line is drawn between the a and the B, the straight line represents the shortest path of the through flow between the a and the B, but an area (namely a white ring-shaped area) is formed on the copper sheet shown in fig. 4, if the straight line intersects with the avoiding area, and the first intersection point is marked as (x_1y_1), the obstacle is formed on the shortest path, and the avoiding area needs to be bypassed.
Taking (X_1Y_1) as a starting point, taking a second point (X_2Y_2) along the boundary of the avoidance area at an interval of 1mil, referring to FIG. 5, communicating A with the second point, communicating B with the second point, detecting whether two lines are tangential to the avoidance area on the copper sheet or not again, if one line is tangential to the boundary of the avoidance area, recording the coordinate of the point as (X_ a Y _a), continuing to take the point along the avoidance area until the other line is tangential to the boundary of the avoidance area, and recording the coordinate of the point as (X_ B Y _b), wherein the shortest through flow path is from A to (X_ a Y _a), (X_ a Y _a) to (X_ B Y _b), (X_ B Y _b) to B; furthermore, if there is no avoidance area between A and B, the straight line distance from A to B is the shortest through flow path.
In step seven, the shortest paths between all the elements in the_dbid_pin_via can be found through the above process, and referring to fig. 6, the shortest paths are interwoven with each other to form a region, and copper sheets outside the region are marked as invalid copper sheets for engineers to refer to modification.
According to the copper sheet inspection method, all copper sheets on the whole circuit board can be automatically grabbed without user intervention, pins and through holes of the copper sheet areas and the copper sheet same network can be automatically identified, shortest through flow paths between any two pins and through holes can be automatically calculated, areas outside the shortest through flow paths can be identified and marked, and a user can refer to and modify invalid copper sheets. The defect that manual inspection is omitted, simulation software is tedious and time-consuming is overcome, an invalid copper sheet area is automatically marked after automatic detection, and the method is convenient and quick and free of omission.
The copper sheet inspection device provided by the invention is described below, and the copper sheet inspection device described below and the copper sheet inspection method described above can be referred to correspondingly.
Referring to fig. 7, the present embodiment provides a copper sheet inspection apparatus, specifically, the apparatus includes: the acquisition module 710, the coordinate lookup module 720, the through-flow path planning module 730, the closed region lookup module 740, and the marking module 750 are described in detail below:
The acquisition module 710 is configured to acquire a copper sheet to be marked, and acquire a coverage area of the copper sheet to be marked on the circuit board;
the coordinate searching module 720 is used for searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple;
the through flow path planning module 730 is configured to perform shortest through flow path planning on any two elements in the coordinate set, so as to obtain a plurality of through flow paths;
the closed region searching module 740 is used for searching the maximum closed region surrounded by the through flow path;
the marking module 750 is used for marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet.
According to the copper sheet inspection device, the coverage area of the copper sheet to be marked on the circuit board is firstly obtained, then the pin coordinates related to current input and current output of the copper sheet to be marked are searched by using the coverage area, so that a coordinate set is obtained, and then the shortest through flow path planning is carried out on any two elements in the coordinate set, so that through flow paths corresponding to any two coordinate elements are obtained, then surrounding area searching is carried out on all through flow paths obtained through planning, so that the largest closed area is obtained, finally, effective and ineffective automatic marking is carried out on the copper sheet according to the largest closed area, not only can the copper sheet without through flow effect be automatically detected, but also the areas where the ineffective copper sheet and the effective copper sheet are located are marked on the copper sheet, complex parameters are not required to be set, the operation is convenient, the inspection result is accurate and reliable, and the inspection efficiency of the copper sheet is remarkably improved.
It should be noted that, each module in the copper sheet inspection device may be implemented in whole or in part by software, hardware, or a combination thereof. The above modules may be embedded in hardware or independent of a processor in the electronic device, or may be stored in software in a memory in the electronic device, so that the processor may call and execute operations corresponding to the above modules.
Fig. 8 illustrates a physical structure diagram of an electronic device, as shown in fig. 8, which may include: processor 810, communication interface (Communications Interface) 820, memory 830, and communication bus 840, wherein processor 810, communication interface 820, memory 830 accomplish communication with each other through communication bus 840. The processor 810 may call logic instructions in the memory 830 to perform a copper skin inspection method comprising: acquiring a copper sheet to be marked and acquiring a coverage area of the copper sheet to be marked on a circuit board; searching pin coordinates related to current input and output of copper sheets to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the pin coordinates related to the current input and/or the current output are multiple; planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths; searching a maximum closed area surrounded by the through flow path; and marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet.
Further, the logic instructions in the memory 830 described above may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as a stand-alone product. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In another aspect, the present invention also provides a computer program product, the computer program product comprising a computer program, the computer program being storable on a non-transitory computer readable storage medium, the computer program, when executed by a processor, being capable of performing the copper sheet inspection method provided by the above methods, the method comprising: acquiring a copper sheet to be marked and acquiring a coverage area of the copper sheet to be marked on a circuit board; searching pin coordinates related to current input and output of copper sheets to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the pin coordinates related to the current input and/or the current output are multiple; planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths; searching a maximum closed area surrounded by the through flow path; and marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet.
In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, is implemented to perform the copper skin inspection method provided by the above methods, the method comprising: acquiring a copper sheet to be marked and acquiring a coverage area of the copper sheet to be marked on a circuit board; searching pin coordinates related to current input and output of copper sheets to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the pin coordinates related to the current input and/or the current output are multiple; planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths; searching a maximum closed area surrounded by the through flow path; and marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A method of inspecting copper sheet, the method comprising:
acquiring a copper sheet to be marked, and acquiring a coverage area of the copper sheet to be marked on a circuit board;
searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple;
carrying out shortest through flow path planning on any two elements in the coordinate set to obtain a plurality of through flow paths;
searching a maximum closed area surrounded by the through flow path;
marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet, and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet;
the shortest through flow path planning is performed on any two elements in the coordinate set to obtain a plurality of through flow paths, and the method comprises the following steps:
acquiring all avoidance areas on the copper sheet to be marked;
selecting two target elements from the coordinate set in a manner of traversing all combinations, and performing the following operations on the two selected target elements:
Connecting two target elements to obtain a linear path;
judging whether the straight line path is intersected with any avoidance area or not;
if the straight line path and any avoidance area are not crossed, the straight line path is used as a through flow path corresponding to two target elements;
if the straight line path and any avoidance area are intersected, re-planning the shortest circulation path for the two target elements based on a preset path planning rule;
the re-planning the shortest circulation path for the two target elements based on the preset path planning rule includes:
finding tangential points of the two target elements and the arbitrary avoidance areas respectively;
respectively connecting two target elements with corresponding tangent points to obtain two new linear paths, and returning to the step of judging whether the linear paths intersect any avoidance areas or not until all the linear paths do not intersect any avoidance areas;
and performing path splicing according to all the obtained straight paths and the tangent points on each avoidance area to generate through flow paths corresponding to the two target elements.
2. The method for inspecting copper sheets according to claim 1, wherein the step of obtaining the copper sheets to be marked comprises:
Acquiring all copper sheets of at least one layer on a circuit board;
and selecting one copper sheet from all the obtained copper sheets in a traversing manner as the copper sheet to be marked.
3. The copper sheet inspection method according to claim 1, wherein the acquiring the coverage area of the copper sheet to be marked on the circuit board comprises:
determining a copper sheet boundary line according to the DBID of the copper sheet to be marked;
and taking the area formed by surrounding the copper sheet boundary line as the coverage area.
4. The copper sheet inspection method according to claim 1, wherein searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set includes:
the method comprises the steps of obtaining DBIDs of all power input pins and DBIDs of all power output pins in a coverage area, and obtaining DBIDs of copper sheets to be marked;
respectively acquiring corresponding network names according to the DBID of each power input pin, the DBID of each power output pin and the DBID of the copper sheet to be marked;
judging whether the network name of each power input pin is the same as the network name of the copper sheet to be marked;
if the network name of any power input pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of the any power input pin on a circuit board;
Judging whether the network name of each power output pin is the same as the network name of the copper sheet to be marked;
if the network name of any power output pin is the same as the network name of the copper sheet to be marked, acquiring the coordinates of the central point of the any power output pin on a circuit board;
and putting all the acquired coordinates into a set to obtain the coordinate set.
5. The method for inspecting copper sheet according to claim 1, wherein the finding the tangent points of the two target elements and the arbitrary avoiding areas respectively includes:
acquiring the number of the avoidance areas with the intersections;
if the straight line path is intersected with the avoidance areas, selecting the avoidance area closest to the target element as a target avoidance area;
if the straight line path only crosses one avoidance zone, the avoidance zone with the crossing is taken as a target avoidance zone;
and respectively searching tangential points of the two target elements and the target avoidance area on the boundary of the target avoidance area.
6. The copper sheet inspection method according to claim 5, wherein the searching for the tangential points between the two target elements and the target avoiding area on the boundary of the target avoiding area includes:
Taking the intersection point of the straight line path and the boundary line of the target avoidance zone as a starting point;
and moving the target avoidance area boundary line for a preset length from the starting point every time until the tangential point coordinates of the two target elements and the target avoidance area are found.
7. The copper skin inspection method according to claim 6, further comprising:
and under the condition that the coordinate of the tangential point of any one target element and the target avoidance area is not found, the step of moving the preset length along the boundary line of the target avoidance area every time from the starting point is executed again after the preset length is reduced.
8. The method of claim 1, wherein the performing path splicing according to all the obtained straight paths and the tangent points on each avoidance area to generate the through-flow paths corresponding to the two target elements includes:
finding out the shortest curve path connecting the two tangent points according to the two tangent points of each avoidance area;
and connecting each linear path to the corresponding position of the shortest curve path comprising the same tangent point according to the tangent point included in each linear path to obtain the through flow path.
9. A copper skin inspection method according to claim 1, wherein said finding a maximum enclosed area surrounded by said through-flow path comprises:
searching all closed areas surrounded by the through flow paths;
calculating the area of each closed area;
and taking the closed area with the largest area as the largest closed area.
10. A copper skin inspection method according to claim 3, wherein said finding a maximum enclosed area surrounded by said through-flow path comprises:
traversing the copper sheet boundary line corresponding to the copper sheet to be marked, and searching a through flow path nearest to the copper sheet boundary line;
and taking all the closed areas formed by surrounding the through flow paths closest to the copper sheet boundary line as the maximum closed area.
11. A copper sheet inspection device, the device comprising:
the acquisition module is used for acquiring the copper sheet to be marked and acquiring the coverage area of the copper sheet to be marked on the circuit board;
the coordinate searching module is used for searching pin coordinates related to current input and output of the copper sheet to be marked in the coverage area to obtain a coordinate set, wherein at least one pin related to the current input and the current output is arranged, and the number of the pin coordinates related to the current input and/or the current output is multiple;
The through flow path planning module is used for planning the shortest through flow path of any two elements in the coordinate set to obtain a plurality of through flow paths;
the closed area searching module is used for searching a maximum closed area surrounded by the through flow path;
the marking module is used for marking the part of the copper sheet to be marked, which is positioned in the maximum enclosed area, as an effective copper sheet and marking the part of the copper sheet to be marked, which is positioned outside the maximum enclosed area, as an ineffective copper sheet;
wherein, the flow path planning module is further to:
acquiring all avoidance areas on the copper sheet to be marked;
selecting two target elements from the coordinate set in a manner of traversing all combinations, and performing the following operations on the two selected target elements:
connecting two target elements to obtain a linear path;
judging whether the straight line path is intersected with any avoidance area or not;
if the straight line path and any avoidance area are not crossed, the straight line path is used as a through flow path corresponding to two target elements;
if the straight line path and any avoidance area are intersected, re-planning the shortest circulation path for the two target elements based on a preset path planning rule;
The re-planning the shortest circulation path for the two target elements based on the preset path planning rule includes:
finding tangential points of the two target elements and the arbitrary avoidance areas respectively;
respectively connecting two target elements with corresponding tangent points to obtain two new linear paths, and returning to the step of judging whether the linear paths intersect any avoidance areas or not until all the linear paths do not intersect any avoidance areas;
and performing path splicing according to all the obtained straight paths and the tangent points on each avoidance area to generate through flow paths corresponding to the two target elements.
12. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the copper skin inspection method of any one of claims 1 to 10 when the program is executed by the processor.
13. A non-transitory computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when executed by a processor, implements the copper skin inspection method according to any one of claims 1 to 10.
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