CN117584024A - Ultrasonic vibration and electrochemical assisted liquid film shearing efficient polishing device and method - Google Patents
Ultrasonic vibration and electrochemical assisted liquid film shearing efficient polishing device and method Download PDFInfo
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- CN117584024A CN117584024A CN202410022881.0A CN202410022881A CN117584024A CN 117584024 A CN117584024 A CN 117584024A CN 202410022881 A CN202410022881 A CN 202410022881A CN 117584024 A CN117584024 A CN 117584024A
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- 238000005498 polishing Methods 0.000 title claims abstract description 272
- 239000007788 liquid Substances 0.000 title claims abstract description 88
- 238000010008 shearing Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000007517 polishing process Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- 238000001802 infusion Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 25
- 238000012545 processing Methods 0.000 abstract description 12
- 230000005518 electrochemistry Effects 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 24
- 229910010271 silicon carbide Inorganic materials 0.000 description 24
- 230000000694 effects Effects 0.000 description 14
- 238000005457 optimization Methods 0.000 description 7
- 239000003082 abrasive agent Substances 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical group [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 5
- 238000012876 topography Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 235000010333 potassium nitrate Nutrition 0.000 description 3
- 239000004323 potassium nitrate Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- YRIUSKIDOIARQF-UHFFFAOYSA-N dodecyl benzenesulfonate Chemical group CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 YRIUSKIDOIARQF-UHFFFAOYSA-N 0.000 description 1
- 229940071161 dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention discloses a device and a method for efficiently polishing liquid film shearing assisted by ultrasonic vibration and electrochemistry; the polishing device comprises a polishing groove for containing polishing liquid; the bottom of the polishing groove is provided with a polishing disk which is arranged on a polishing disk driving main shaft; the inside of the polishing groove is positioned below the polishing disc and is provided with an ultrasonic generator; a workpiece clamping driving mechanism is arranged above the polishing groove and used for clamping a workpiece and driving the workpiece to perform rotary motion; the workpiece clamping driving mechanism is connected with the adjusting mechanism and can move up and down under the driving of the adjusting mechanism; the polishing groove is connected with the negative electrode of the pulse power supply, the workpiece clamping driving mechanism is connected with the positive electrode of the pulse power supply, and the polishing solution in the polishing groove is combined during polishing to form a closed loop. The polishing device combines three technologies of ultrasonic vibration, electrochemical anodic oxidation and liquid film shearing polishing, polishes the workpiece, and improves the material removal efficiency and the processing uniformity of the workpiece.
Description
Technical Field
The invention relates to the technical field of ultra-precise polishing processing, in particular to a liquid film shearing efficient polishing device and method assisted by ultrasonic vibration and electrochemistry.
Background
With the development of technology, many hard and brittle materials (such as ceramic-based materials, hard alloy materials, metal nitride materials, semiconductor materials and the like) are widely applied in various precision machinery manufacturing fields due to stable chemical properties or special physical properties. For example: ceramic-based materials are widely used in the fields of medical instruments, electronic components and grinding tool manufacturing; the hard alloy material is widely applied to the fields of metal cutting, mining, building and other mechanical manufacturing; metal nitrides and semiconductor materials are widely used in medical, aerospace and energy fields. In these fields, the quality of the material surface and subsurface directly affects the performance and reliability of the device, while the typically difficult processing characteristics of hard and brittle materials make it difficult for some conventional polishing methods to meet the requirements of high precision polishing. Therefore, it is important to explore a new method for realizing high-efficiency planarization polishing of a hard and brittle material.
Compared with the traditional contact type mechanical polishing, the method has the advantages that subsurface processing damage is introduced, a processing deterioration layer is formed, and the like, the workpiece and the polishing disc are not in direct contact during non-contact type polishing, and the surface material of the workpiece is processed and removed only through the shearing action of the polishing liquid, so that the flatter surface morphology and the better surface quality can be obtained. However, the non-contact polishing method in the prior art has the problem of lower material removal rate.
Disclosure of Invention
In order to overcome the problems in the prior art, the application provides an ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device which can realize ultra-precise, high-efficiency, flattening and low-damage processing of a hard and brittle material. The polishing device combines three technologies of ultrasonic vibration, electrochemical anodic oxidation and liquid film shearing polishing, polishes a workpiece, can improve the number of abrasive materials for actual cutting in the polishing process, and simultaneously generates an oxide layer which is easier to remove on the surface of the workpiece, thereby improving the material removal efficiency and the processing uniformity of the workpiece. Correspondingly, the application also provides an ultrasonic vibration and electrochemical assisted liquid film shearing efficient polishing method.
For the polishing device, the technical scheme of the application is as follows:
the liquid film shearing high-efficiency polishing device assisted by ultrasonic vibration and electrochemistry comprises a polishing groove for containing polishing liquid; a polishing disk is arranged at the bottom of the polishing groove; the polishing disc is arranged on the polishing disc driving main shaft; the inside of the polishing groove is positioned below the polishing disc and is provided with an ultrasonic generator; a workpiece clamping driving mechanism is arranged above the polishing groove and can clamp a workpiece and drive the workpiece to perform rotary motion; the workpiece clamping driving mechanism is connected with the adjusting mechanism and can move up and down under the driving of the adjusting mechanism; the polishing groove is connected with the negative electrode of the pulse power supply, the workpiece clamping driving mechanism is connected with the positive electrode of the pulse power supply, and a closed loop can be formed by combining polishing liquid in the polishing groove during polishing; the polishing disk driving main shaft and the workpiece clamping driving mechanism are respectively connected with the first motor and the second motor.
Compared with the prior art, the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device has the advantages of high polishing efficiency and good polishing quality; the polishing device comprises a polishing groove for containing polishing liquid, wherein a polishing disk is arranged in the polishing groove, so that a liquid film with a high-speed shearing effect is generated between the polishing disk and a workpiece by utilizing the rotation motion of the polishing disk in the polishing process, a liquid film shearing effect is formed, the planarization and low-damage processing of the workpiece are realized, the surface processing quality of the workpiece is improved, the polishing groove does not rotate, and the polishing liquid can be prevented from being influenced by centrifugal force in the polishing process; the ultrasonic generator is also arranged in the polishing groove, ultrasonic vibration can be introduced to assist polishing during polishing, and the motion activity of the abrasive in the polishing solution is excited by utilizing ultrasonic cavitation, so that the number of the abrasive in actual cutting action in the polishing process is increased, the friction action of the abrasive on a workpiece is more uniform and strong, and the material removal efficiency of the workpiece is improved; in addition, still be equipped with the pulse power in this burnishing device, its positive and negative pole is connected with work piece centre gripping actuating mechanism and polishing groove respectively, combines the polishing liquid in the polishing groove can constitute closed loop when polishing, according to electrochemistry anodic oxidation characteristic, can produce the oxide layer of more easily getting rid of on the work piece surface, and the abrasive material is got rid of the oxide layer again for the material is got rid of more easily, has further improved the material removal efficiency of work piece, and the work piece surface after polishing is comparatively even.
As optimization, the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device further comprises a polishing liquid circulating device; the polishing solution circulating device comprises a liquid storage tank and a flow pump; the polishing groove, the liquid storage tank and the flow pump are connected into a closed loop circuit through a liquid conveying pipeline; and a flowmeter is arranged on the infusion pipeline. Therefore, the polishing solution can be recycled, the cost is reduced, and the method is economical and environment-friendly.
In the liquid film shearing high-efficiency polishing device assisted by ultrasonic vibration and electrochemistry, as optimization, a group of ladder structures are arranged on the surface of the polishing disk, shearing edges distributed along the horizontal direction are arranged at the tops of the ladder structures, and the shearing edges of the ladder structures are positioned on the same plane. The design of the step structure on the surface of the polishing disc can generate a shearing strengthening effect when the polishing fluid flows, strengthen the horizontal shearing removal effect of the abrasive on the surface material of the workpiece to be processed, and reduce the normal uneven removal.
In the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device, the ultrasonic generator is electrically connected with the controller, and the controller controls the vibration frequency and the vibration amplitude of the ultrasonic wave. Therefore, the frequency and the amplitude of ultrasonic wave emission can be regulated according to the material of a workpiece to be processed and the abrasive adopted in the polishing solution, the shearing effect of a liquid film near the workpiece is effectively controlled, and the polishing effect is ensured.
As optimization, in the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device, the adjusting mechanism is a linear sliding table module; the workpiece clamping driving mechanism is arranged on the sliding table of the linear sliding table module. At this time, the structure is simple, the assembly is easy, and the reliability is high.
As optimization, in the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device, the workpiece clamping driving mechanism comprises a suction plate, a workpiece driving main shaft and a shaft sleeve; the shaft sleeve is fixed on a sliding table of the linear sliding table module; the lower end of the workpiece driving main shaft is connected with the suction plate, and the upper end of the workpiece driving main shaft is connected with the output shaft of the second motor; the shaft sleeve is sleeved outside the workpiece driving main shaft, the lower end of the shaft sleeve is provided with a notch matched with the suction plate, and the suction plate is positioned in the notch; a movable sealing ring is arranged between the suction plate and the shaft sleeve; a vacuum cavity is formed among the shaft sleeve, the workpiece driving main shaft and the suction plate, and the vacuum cavity is communicated with a vacuum pump through a pipeline; a group of through holes are uniformly formed in the suction plate along the circumferential direction; the positive electrode of the pulse power supply is electrically connected with the suction plate. At this time, the assembly is convenient and the implementation is easy.
For the polishing method, the technical scheme of the application is as follows:
the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing method comprises the step of polishing a workpiece to be processed by using the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device; the method comprises the following steps:
fixing a workpiece to be processed on a workpiece clamping driving mechanism, and adjusting the position of the workpiece clamping driving mechanism through an adjusting mechanism to enable a certain gap to exist between the workpiece to be processed and a polishing disc;
step two, adding electrochemical polishing solution into the polishing groove, wherein the liquid level of the polishing solution is higher than the upper surface of the polishing disc, and immersing a workpiece to be processed;
starting the first motor and the second motor to drive the polishing disc and the workpiece to rotate, wherein the rotation directions of the polishing disc and the workpiece are opposite, and polishing the workpiece; meanwhile, an ultrasonic generator and a pulse power supply are started to enable polishing liquid in a polishing groove to vibrate in the polishing process, and the polishing groove, the polishing liquid, a workpiece clamping driving mechanism and the pulse power supply form a closed loop;
step four, after the set polishing time is reached, the first motor, the second motor, the ultrasonic generator and the pulse power supply are turned off; and then the workpiece is taken down for cleaning.
Compared with the prior art, the ultrasonic vibration and electrochemical assisted liquid film shearing high-efficiency polishing method has the advantages that electrochemical polishing liquid is contained in the polishing groove, then a liquid film with a high-speed shearing effect is generated between the polishing disk and a workpiece by utilizing the rotation motion of the polishing disk, a liquid film shearing effect is formed, meanwhile, ultrasonic vibration and electrochemical anodic oxidation are combined to assist polishing, ultra-precise, efficient, flattened and low-damage processing of a hard and brittle material can be realized, polishing efficiency is high, and the surface quality of the polished workpiece is good.
As optimization, in the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing method, the gap between the workpiece and the polishing disk is 1-5 mm. Therefore, a liquid film with a certain thickness can be formed between the workpiece and the polishing disk, and the workpiece surface is prevented from being worn due to direct contact of the workpiece and the polishing disk.
As optimization, in the ultrasonic vibration and electrochemical assisted liquid film shearing high-efficiency polishing method, the electrochemical polishing solution comprises a base solution, an electrolyte, a surfactant and an abrasive; the base solution comprises polyhydroxy polymer and deionized water; the abrasive can be one or more of cerium oxide, aluminum oxide and silicon oxide, and the concentration is 5-10wt%.
Specifically, the electrolyte is potassium nitrate (the potassium nitrate has smaller corrosiveness to silicon materials and can generate a flatter oxide layer on the surface of a workpiece), the surfactant is dodecylbenzene sulfonate (the wettability between the polishing solution and the surface of the workpiece can be enhanced, the uniformity and the stability of the polishing solution are improved), and the abrasive is aluminum oxide with the concentration of 8wt.%.
As optimization, in the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing method, the rotating speed of the polishing disc can be 60-150 r/min, and the rotating speed of the workpiece can be 20-50 r/min. The polishing disk and the workpiece rotate at respective rotating speeds, and relative motion is generated between the polishing disk and the workpiece, so that the stress uniformity of the surface of the workpiece can be improved while the polishing liquid is diffused.
Drawings
FIG. 1 is a schematic diagram of an ultrasonically vibrating, electrochemically assisted liquid film shearing high efficiency polishing device of the present application;
FIG. 2 is a schematic structural view of an ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device in an embodiment of the present application;
FIG. 3 is a schematic view of the structure of the polishing tank in the present application;
FIG. 4 is a schematic illustration of the assembly of the polishing receptacle and the reservoir of the present application;
fig. 5 is a schematic view of the structure of the polishing disk in the present application;
FIG. 6 is a schematic structural view of a workpiece clamping drive mechanism of the present application;
FIG. 7 is a cross-sectional view of the work holding drive mechanism of the present application;
FIG. 8a is a surface topography of silicon carbide prior to polishing in an embodiment of the present application, and FIG. 8b is a surface topography of silicon carbide after polishing;
FIG. 9a is a white light interferometer inspection of the surface topography of the silicon carbide prior to polishing in an embodiment of the present application, and FIG. 9b is a white light interferometer inspection of the surface topography of the silicon carbide after polishing;
FIG. 10a is a white light interferometer inspection of the surface morphology of silicon carbide polished by the mechanical polishing method, and FIG. 10b is a white light interferometer inspection of the surface morphology of silicon carbide polished by the polishing method of the present application;
fig. 11a is a white light interferometer inspection chart of the surface morphology of silicon carbide polished by the ultrasonic vibration assisted liquid film shearing polishing method, and fig. 11b is a white light interferometer inspection chart of the surface morphology of silicon carbide polished by the polishing method of the present application.
The marks in the drawings are: 1-a polishing groove; 2-polishing disc, 201-steps; 3-a polishing disk drives a main shaft; 4-an ultrasonic generator; 5-workpiece clamping driving mechanism, 501-suction plate, 502-workpiece driving main shaft, 503-shaft sleeve, 504-movable sealing ring and 505-T-shaped connecting block; 6-a vacuum pump; 7-an adjusting mechanism; 8-pulse power supply; 9-a liquid storage tank; 10-flow pump; 11-an infusion line; 12-a flow meter; 13-a controller; 14-a first motor; 15-a second motor.
Detailed Description
The present application is further illustrated in the following figures and examples, which are not intended to be limiting.
Referring to fig. 1 to 3, an ultrasonic vibration and electrochemical assisted liquid film shearing high efficiency polishing device comprises a polishing tank 1 for holding polishing liquid; a polishing disc 2 is arranged at the bottom of the polishing groove 1; the polishing disc 2 is arranged on the polishing disc driving main shaft 3; the inside of the polishing groove 1 is positioned below the polishing disc 2 and is provided with an ultrasonic generator 4; a workpiece clamping driving mechanism 5 is arranged above the polishing groove 1, and the workpiece clamping driving mechanism 5 can clamp a workpiece and drive the workpiece to perform rotary motion; the workpiece clamping driving mechanism 5 is connected with the adjusting mechanism 7 and can move up and down under the driving of the adjusting mechanism 7; the polishing groove 1 is connected with the negative electrode of the pulse power supply 8, the workpiece clamping driving mechanism 5 is connected with the positive electrode of the pulse power supply 8, and a closed loop can be formed by combining the polishing liquid in the polishing groove 1 during polishing (namely, the polishing groove 1, the polishing liquid, the workpiece clamping driving mechanism 5 and the pulse power supply 8 form a closed loop); the polishing disk drive spindle 3 and the workpiece clamping drive mechanism 5 are respectively connected with a first motor 14 and a second motor 15.
Examples:
referring to fig. 4, in this embodiment, two sides of the polishing groove 1 are respectively communicated with an inlet and an outlet of the liquid storage tank 9 through a liquid delivery pipeline 11 to form a closed loop route, so as to realize recycling of polishing liquid; the infusion pipeline 11 is provided with a flow pump 10 and a flow meter 12; the liquid storage tank 9 stores electrochemical polishing solution.
Referring to fig. 5, in this embodiment, the surface of the polishing disk 2 is provided with a set of step structures, the top of each step structure has shearing edges 201 distributed along the horizontal direction, and the shearing edges 201 of each step structure are in the same plane. When the polishing liquid passes through the surface of the polishing disk 2, a speed step is generated, and the shearing force of the polishing liquid is enhanced, so that the horizontal shearing removal effect of the abrasive on the surface material of the workpiece to be processed can be enhanced, the normal uneven removal is reduced, and the uniform polishing of the workpiece is realized.
In this embodiment, the ultrasonic generator 4 is electrically connected to the controller 13, and the controller 13 controls the vibration frequency and the vibration amplitude of the ultrasonic wave. Therefore, the frequency and the amplitude of ultrasonic wave emission can be regulated according to the material of a workpiece to be processed and the abrasive adopted in the polishing solution, the shearing effect of a liquid film near the workpiece is effectively controlled, and the polishing effect is ensured. The controller 13 is installed inside the control box; the top of the control box is provided with a bracket for installing an adjusting mechanism 7, a pulse power supply 8 and a vacuum pump 6. The polishing groove 1 is positioned at the top of the control box, one end of the polishing disk drive spindle 3 penetrates through the bottom of the polishing groove 1 and is connected with the polishing disk 2, and the other end of the polishing disk drive spindle is connected with the first motor 14 in the control box.
Referring to fig. 6 and 7, in this embodiment, the adjusting mechanism 7 is a linear sliding table module; the workpiece clamping driving mechanism 5 comprises a suction plate 501, a workpiece driving main shaft 502 and a shaft sleeve 503; the shaft sleeve 503 is fixed on a sliding table of the linear sliding table module through a T-shaped connecting block 505; the lower end of the workpiece driving main shaft 502 is connected with the suction plate 501, and the upper end is connected with the output shaft of the second motor 15; the shaft sleeve 503 is sleeved outside the workpiece driving main shaft 502, the lower end of the shaft sleeve is provided with a notch matched with the suction plate 501, and the suction plate 501 is positioned in the notch; a movable sealing ring 504 is arranged between the suction plate 501 and the shaft sleeve 503; a vacuum cavity is formed among the shaft sleeve 503, the workpiece driving main shaft 502 and the suction plate 501, and the vacuum cavity is communicated with the vacuum pump 6 through a pipeline; a group of through holes are uniformly formed in the suction plate 501 along the circumferential direction; the positive electrode of the pulse power source 8 is electrically connected to the suction plate 501 (in the embodiment, the positive electrode of the pulse power source 8 is connected to the workpiece driving spindle 502 through a conductive slip ring).
The method for efficiently polishing the liquid film shear assisted by ultrasonic vibration and electrochemistry comprises the step of polishing a workpiece to be processed by using the polishing device; the method comprises the following steps:
fixing a workpiece to be processed on a workpiece clamping driving mechanism 5, and adjusting the position of the workpiece clamping driving mechanism 5 through an adjusting mechanism 7 to enable a gap of 1-5 mm to exist between the workpiece and a polishing disc 2;
step two, adding electrochemical polishing solution into the polishing groove 1, wherein the liquid level of the polishing solution is higher than the upper surface of the polishing disc 2, and immersing a workpiece;
step three, starting a first motor 14 and a second motor 15 to drive the polishing disc 2 and the workpiece to rotate, wherein the rotation directions of the polishing disc 2 and the workpiece are opposite, and polishing the workpiece; meanwhile, the ultrasonic generator 4 and the pulse power supply 8 are started to vibrate the polishing solution in the polishing groove 1 in the polishing process, and the polishing groove 1, the polishing solution, the workpiece clamping driving mechanism 5 and the pulse power supply 8 form a closed loop, so that the surface of the workpiece is anodized to generate an oxide layer;
step four, after the set polishing time is reached, the first motor 14, the second motor 15, the ultrasonic generator 4 and the pulse power supply 8 are turned off; and then the workpiece is taken down for cleaning.
Implementation case:
the silicon carbide is polished by the ultrasonic vibration and electrochemical assisted liquid film shearing high-efficiency polishing method. The specific experimental conditions are as follows:
| workpiece | Silicon carbide (60 mm. Times.60 mm, thickness 0.5 mm) |
| Rotation speed of polishing disk | 100r/min |
| Workpiece rotation speed | 30r/min |
| Abrasive material | Alumina with particle size of 1.0 μm |
| Concentration of abrasive | 8wt.％ |
| Polishing liquid base liquid | Polyhydroxy polymer, deionized water |
| Electrolyte composition | 0.8mol/L potassium nitrate |
| Pulse supply voltage | 5V |
| Ultrasonic wave | Frequency 25.4kHz, phase difference ψ=90° |
The polishing steps are as follows:
step one, fixing a silicon carbide workpiece in a notch at the lower end of a shaft sleeve 503 of a workpiece clamping driving mechanism 5, and simultaneously starting a vacuum pump 6 to vacuumize so that a suction plate 501 adsorbs the workpiece; then the position of the workpiece clamping driving mechanism 5 is adjusted through the adjusting mechanism 7, so that the minimum gap between the workpiece and the polishing disk 2 is 1mm;
step two, turning on a flow pump 10 to enable the polishing solution in the liquid storage tank 9 to enter the polishing groove 1, wherein the liquid level of the polishing solution is higher than the upper surface of the polishing disc 2, and immersing a workpiece;
setting the rotation speeds of the polishing disc 2 and the workpiece, starting the first motor 14 and the second motor 15, driving the polishing disc driving spindle 3 and the workpiece driving spindle 502 to reversely rotate, and respectively driving the polishing disc 2 and the workpiece to rotate by the polishing disc driving spindle 3 and the workpiece driving spindle 502 (the polishing disc 2 rotates according to the direction of decreasing the angle of the surface step structure; as shown in fig. 5), so as to polish the workpiece; simultaneously, the ultrasonic generator 4 and the pulse power supply 8 are started to vibrate the polishing solution in the polishing groove 1 in the polishing process, and the polishing groove 1, the polishing solution, the suction plate 501 and the pulse power supply 8 form a closed loop; under the auxiliary effect of ultrasonic vibration, the abrasive material is suspended in the polishing solution and uniformly dispersed on the surface of the workpiece during polishing; under the electrochemical anodic oxidation effect, an oxide layer which mainly contains silicon oxide and is easier to remove is uniformly formed on the surface of the workpiece;
step four, after the set polishing time is reached, the first motor 14, the second motor 15, the ultrasonic generator 4 and the pulse power supply 8 are turned off; and then the workpiece is taken down for cleaning.
After polishing the silicon carbide for 30min according to the steps, the surface roughness of the silicon carbide is rapidly reduced from Ra 43+/-5 nm to Ra 0.3nm, and the material removal efficiency reaches 3.13 mu m/h. A comparison of the surface topography of silicon carbide before and after polishing is shown in fig. 8 and 9.
In order to prove that the polishing method has the advantages of high quality, low damage and the like compared with the existing mechanical polishing method when polishing hard and brittle materials; applicants used conventional mechanical polishing methods to polish silicon carbide of the same size as a comparative experiment. The specific experimental conditions are as follows:
| workpiece | Silicon carbide (60 mm. Times.60 mm, thickness 0.5 mm) |
| Rotation speed of polishing disk | 100r/min |
| Workpiece rotation speed | 30r/min |
| Abrasive material | Diamond with 1.0 mu m grain size |
| Concentration of abrasive | 8wt.％ |
| Polishing liquid base liquid | Deionized water and dispersant |
After polishing for the same time of 30min, the silicon carbide surface roughness was reduced from Ra 43.+ -. 5nm to Ra 1.6nm. Referring to fig. 10, compared with silicon carbide processed by the polishing method of the present invention, silicon carbide after mechanical polishing has higher surface roughness and more processing defects such as holes, scratches, etc. in the surface morphology. Therefore, the polishing method provided by the invention has the advantages that the damage is lower and the surface quality of the workpiece is better when the workpiece is polished.
In addition, in order to verify that the polishing method combining the three technologies of ultrasonic vibration, electrochemical anodic oxidation and liquid film shearing polishing has higher material removal efficiency and processing uniformity; the applicant adopted an ultrasonic vibration assisted liquid film shear polishing method (i.e. without electrochemical assistance) to polish silicon carbide of the same size as a comparative experiment. The specific experimental conditions are as follows:
| workpiece | Silicon carbide (60 mm. Times.60 mm, thickness 0.5 mm) |
| Rotation speed of polishing disk | 100r/min |
| Workpiece rotation speed | 30r/min |
| Abrasive material | Diamond with 1.0 mu m grain size |
| Concentration of abrasive | 8wt.％ |
| Polishing liquid | Polyhydroxy polymer, deionized water |
| Ultrasonic power supply | Frequency 25.4kHz, phase difference ψ=90° |
After polishing for the same time of 30min, the silicon carbide surface roughness was reduced from Ra 43.+ -. 5nm to Ra 7.4nm. Referring to fig. 11, compared with silicon carbide processed by the polishing method of the present invention, the surface roughness of silicon carbide without electrochemical auxiliary polishing is higher, thereby proving that the polishing efficiency is higher and the polishing quality is better when the polishing method of the present invention is used for polishing workpieces.
The above general description of the invention and the description of specific embodiments thereof referred to in this application should not be construed as limiting the scope of the invention. Those skilled in the art can add, subtract or combine the features disclosed in the foregoing general description and/or the detailed description (including examples) to form other technical solutions within the scope of the present application without departing from the disclosure of the present application.
Claims (10)
1. Ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device is characterized in that: comprises a polishing groove (1) for containing polishing liquid; a polishing disc (2) is arranged at the bottom of the polishing groove (1); the polishing disc (2) is arranged on the polishing disc driving main shaft (3); the inside of the polishing groove (1) is positioned below the polishing disc (2) and is provided with an ultrasonic generator (4); a workpiece clamping driving mechanism (5) is arranged above the polishing groove (1), and the workpiece clamping driving mechanism (5) can clamp a workpiece and drive the workpiece to perform rotary motion; the workpiece clamping driving mechanism (5) is connected with the adjusting mechanism (7) and can move up and down under the driving of the adjusting mechanism (7); the polishing groove (1) is connected with the negative electrode of the pulse power supply (8), and the workpiece clamping driving mechanism (5) is connected with the positive electrode of the pulse power supply (8); the polishing disc driving main shaft (3) and the workpiece clamping driving mechanism (5) are respectively connected with a first motor (14) and a second motor (15).
2. The ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device according to claim 1, wherein: the polishing solution recycling device is also included; the polishing solution circulating device comprises a liquid storage tank (9) and a flow pump (10); the polishing groove (1), the liquid storage tank (9) and the flow pump (10) are connected into a closed loop circuit through a liquid delivery pipeline (11); a flowmeter (12) is arranged on the infusion pipeline (11).
3. The ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device according to claim 1, wherein: the surface of the polishing disc (2) is provided with a group of ladder structures, the tops of the ladder structures are provided with shearing edges (201) distributed along the horizontal direction, and the shearing edges (201) of the ladder structures are positioned on the same plane.
4. The ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device according to claim 1, wherein: the ultrasonic generator (4) is electrically connected with the controller (13), and the controller (13) controls the vibration frequency and the vibration amplitude of the ultrasonic wave.
5. The ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device according to claim 1, wherein: the adjusting mechanism (7) is a linear sliding table module; the workpiece clamping driving mechanism (5) is arranged on the sliding table of the linear sliding table module.
6. The ultrasonic vibration and electrochemical assisted liquid film shearing and high efficiency polishing device according to claim 5, wherein: the workpiece clamping driving mechanism (5) comprises a suction plate (501), a workpiece driving main shaft (502) and a shaft sleeve (503); the lower end of the workpiece driving main shaft (502) is connected with the suction plate (501), and the upper end of the workpiece driving main shaft is connected with the output shaft of the second motor (15); the shaft sleeve (503) is sleeved outside the workpiece driving main shaft (502), the lower end of the shaft sleeve is provided with a notch matched with the suction plate (501), and the suction plate (501) is positioned in the notch; a movable sealing ring (504) is arranged between the suction plate (501) and the shaft sleeve (503); a vacuum cavity is formed among the shaft sleeve (503), the workpiece driving main shaft (502) and the suction plate (501), and the vacuum cavity is communicated with the vacuum pump (6) through a pipeline; a group of through holes are uniformly formed in the suction plate (501) along the circumferential direction; the positive electrode of the pulse power supply (8) is electrically connected with the suction plate (501).
7. The ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing method is characterized in that the ultrasonic vibration and electrochemical auxiliary liquid film shearing high-efficiency polishing device is used for polishing a workpiece to be processed; the method comprises the following steps:
fixing a workpiece to be processed on a workpiece clamping driving mechanism (5), and adjusting the position of the workpiece clamping driving mechanism (5) through an adjusting mechanism (7) to enable a certain gap to exist between the workpiece and a polishing disc (2);
step two, adding electrochemical polishing liquid into the polishing groove (1), wherein the liquid level of the polishing liquid is higher than the upper surface of the polishing disc (2), and immersing a workpiece;
starting a first motor (14) and a second motor (15) to drive the polishing disc (2) and the workpiece to rotate, wherein the rotation directions of the polishing disc (2) and the workpiece are opposite, and polishing the workpiece; meanwhile, an ultrasonic generator (4) and a pulse power supply (8) are started to vibrate the polishing solution in the polishing groove (1) in the polishing process, and the polishing groove (1), the polishing solution, the workpiece clamping driving mechanism (5) and the pulse power supply (8) form a closed loop;
step four, after the set polishing time is reached, the first motor (14), the second motor (15), the ultrasonic generator (4) and the pulse power supply (8) are turned off; and then the workpiece is taken down for cleaning.
8. The ultrasonic vibration and electrochemical assisted liquid film shearing and efficient polishing method as defined in claim 7, wherein the method comprises the steps of: in the first step, the gap between the workpiece and the polishing disc (2) is 1-5 mm.
9. The ultrasonic vibration and electrochemical assisted liquid film shearing and efficient polishing method as claimed in claim 8, wherein the method comprises the steps of: in the third step, the rotating speed of the polishing disc (2) is 60-150 r/min; the rotating speed of the workpiece is 20-50 r/min.
10. The ultrasonic vibration and electrochemical assisted liquid film shearing and efficient polishing method as claimed in claim 9, wherein the method comprises the steps of: the electrochemical polishing solution comprises a base solution, electrolyte, a surfactant and an abrasive; the base solution comprises polyhydroxy polymer and deionized water; the abrasive is one or a mixture of cerium oxide, aluminum oxide and silicon oxide, and the concentration is 5-10 wt.%.
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| CN202410022881.0A CN117584024A (en) | 2024-01-08 | 2024-01-08 | Ultrasonic vibration and electrochemical assisted liquid film shearing efficient polishing device and method |
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| CN202410022881.0A CN117584024A (en) | 2024-01-08 | 2024-01-08 | Ultrasonic vibration and electrochemical assisted liquid film shearing efficient polishing device and method |
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