CN117537642A - Heat pipe, radiator and electronic equipment - Google Patents
Heat pipe, radiator and electronic equipment Download PDFInfo
- Publication number
- CN117537642A CN117537642A CN202410032910.1A CN202410032910A CN117537642A CN 117537642 A CN117537642 A CN 117537642A CN 202410032910 A CN202410032910 A CN 202410032910A CN 117537642 A CN117537642 A CN 117537642A
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- China
- Prior art keywords
- heat
- working medium
- pipe
- section
- liquid storage
- Prior art date
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- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 93
- 238000001816 cooling Methods 0.000 claims abstract description 61
- 238000001704 evaporation Methods 0.000 claims abstract description 43
- 230000008020 evaporation Effects 0.000 claims abstract description 41
- 238000010521 absorption reaction Methods 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 6
- 241001330002 Bambuseae Species 0.000 claims description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 6
- 239000011425 bamboo Substances 0.000 claims description 6
- 230000003204 osmotic effect Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000012266 salt solution Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000008213 purified water Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat pipe, a radiator and electronic equipment, which belong to the field of heat radiation equipment, wherein the heat pipe comprises a pipe body, one end of the pipe body is provided with an evaporation section, the other end of the pipe body is provided with a cooling section, the inner wall of the evaporation section is provided with a capillary structure layer, and a liquid working medium is arranged in the pipe body; the inner wall of the pipe body between the evaporation section and the cooling section is provided with a liquid storage layer, and the absorption capacity of the capillary structure layer to the liquid working medium is larger than that of the liquid storage layer to the liquid working medium under the same volume. The invention increases the total amount of working medium, so that the heat pipe can bear higher heat power, namely, can transfer heat at higher temperature, and prevent dry burning. And the working medium is stored in the liquid storage layer, so that the liquid level of the working medium at the capillary structure layer is not increased, steam is not blocked from being separated from the capillary structure layer, and the increase of thermal resistance is prevented.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a heat pipe, a radiator and electronic equipment.
Background
The heat pipe is a common heat transfer pipeline, one end of the heat pipe is an evaporation section, the other end of the heat pipe is a cooling section, a porous capillary structure layer is arranged on the inner wall of the evaporation section, the interior of the heat pipe is vacuumized, a liquid working medium is arranged in the heat pipe, and the liquid working medium is absorbed by the capillary structure layer. When heat is transferred to the evaporation section, the working medium in the capillary structure layer absorbs heat and evaporates into steam, and the steam flows to the cooling section and then is cooled and liquefied and then returns to the capillary structure layer. The heat pipe transfers heat through the phase change of the liquid working medium, has high heat transfer efficiency and is commonly used for heat dissipation of electronic equipment.
In theory, the liquid level of the working medium in the capillary structure layer should cover the capillary structure layer when the heat pipe operates, but in practice, the vapor pressure of the vapor generated in the evaporation section forces the liquid level of the working medium in the capillary structure to drop when the heat pipe operates. When the thermal power is continuously increased, the steam pressure is continuously increased, so that the liquid level of the working medium is continuously reduced until the liquid level is zero, and the local dry combustion (dry-out) of the evaporation section is formed, and the heat dissipation efficiency is rapidly reduced. Therefore, in order to increase the thermal power that the heat pipe can bear, the amount of the working medium in the heat pipe is generally increased, so that the liquid level of the working medium is higher, but after the amount of the working medium is increased, when the heat pipe does not operate under the highest thermal power, the capillary structure layer is submerged in the working medium, the liquid level of the working medium is relatively higher, and at the moment, steam cannot be separated from the liquid level of the working medium rapidly, so that the flow of the working medium is influenced, and the thermal resistance is increased.
Disclosure of Invention
The invention aims to solve the technical problem of providing a heat pipe, which can improve the maximum heat power which the heat pipe can bear and prevent the increase of thermal resistance when the heat power is lower.
In order to solve the problems, the invention adopts the following technical scheme: the heat pipe comprises a pipe body, wherein one end of the pipe body is provided with an evaporation section, the other end of the pipe body is provided with a cooling section, the inner wall of the evaporation section is provided with a capillary structure layer, and a liquid working medium is arranged in the pipe body;
the inner wall of the pipe body between the evaporation section and the cooling section is provided with a liquid storage layer, and the absorption capacity of the capillary structure layer to the liquid working medium is larger than that of the liquid storage layer to the liquid working medium under the same volume.
Further, the liquid storage layer is a heat-insulating liquid storage layer.
Further, the liquid storage layers are multi-section, and the adsorption capacity of each liquid storage layer to the liquid working medium is decreased from the evaporation section to the cooling section.
Further, the liquid storage layer is a sponge.
Further, the end of evaporation section is sealed through the end plate, fixedly be provided with a support net section of thick bamboo on the end plate, have the interval between support net section of thick bamboo and the capillary structure layer, support net section of thick bamboo inner wall is provided with the osmotic membrane, osmotic membrane inside is provided with the thermal deformation post, and it has the salt solution to fill between thermal deformation post and the osmotic membrane.
Further, the liquid working medium is water.
The radiator comprises a bracket, wherein a plurality of heat pipes are arranged on the bracket.
Further, the support is provided with a heat insulation board, the heat pipe is fixedly connected with the heat insulation board, and the evaporation section and the cooling section of the heat pipe are positioned on two sides of the heat insulation board.
Further, a cooling pipe is arranged on the support, the cooling pipe is connected with an air supply mechanism, cooling sections of the heat pipes extend into the cooling pipe, and the cooling pipe is perpendicular to the heat pipes.
The sub-equipment comprises the radiator.
The beneficial effects of the invention are as follows: according to the invention, the liquid storage layer is arranged on the inner wall of the pipe body between the evaporation section and the cooling section, a certain amount of working medium can be stored in the liquid storage layer, and after the working medium in the capillary structure layer is evaporated, the working medium in the liquid storage layer can be absorbed by the capillary structure layer, so that the working medium is provided for the capillary structure layer by utilizing the liquid storage layer. The invention increases the total amount of working medium, so that the heat pipe can bear higher heat power, namely, can transfer heat at higher temperature, and prevent dry burning. And the working medium is stored in the liquid storage layer, so that the liquid level of the working medium at the capillary structure layer is not increased, steam is not blocked from being separated from the capillary structure layer, and the increase of thermal resistance is prevented.
Drawings
FIG. 1 is a schematic cross-sectional view of a heat pipe of the present invention;
FIG. 2 is a schematic cross-sectional view of a heat sink of the present invention;
reference numerals: 1-a tube body; 2-an evaporation section; 3-a cooling section; 4-a capillary structure layer; 5-a liquid storage layer; 6-end plates; 7, supporting a net drum; 8-a thermosensitive deformation column; 9-a permeable membrane; 10-a bracket; 11-a heat insulation plate; 12-a cooling pipe; 13-air supply mechanism.
Detailed Description
The invention will be further described with reference to the drawings and examples.
The heat pipe comprises a pipe body 1, wherein one end of the pipe body 1 is provided with an evaporation section 2, the other end of the pipe body is provided with a cooling section 3, the inner wall of the evaporation section 2 is provided with a capillary structure layer 4, and a liquid working medium is arranged in the pipe body 1;
the inner wall of the pipe body 1 between the evaporation section 2 and the cooling section 3 is provided with a liquid storage layer 5, and the absorption capacity of the capillary structure layer 4 to the liquid working medium is larger than that of the liquid storage layer 5 under the same volume.
The pipe body 1 is a circular pipe with both ends closed, and may be a copper pipe, an alloy copper pipe or the like, and is made of JIS C1020T oxygen-free copper (deoxidized copper). Through carrying out the evacuation to body 1 inside for body 1 inside is negative pressure, reduces the boiling point of working medium, promotes the working medium evaporation more soon. The evaporation section 2 and the cooling section 3 are respectively positioned at two ends of the pipe body 1, and the evaporation section 2 and the cooling section 3 have proper lengths. The capillary structure layer 4 is a capillary structure with a working medium adsorption function and has good heat conducting performance so as to quickly transfer heat to the working medium, such as the existing structure of the capillary structure formed by sintering copper powder. The cooling section 3 is smooth, so that the flow resistance of working media is reduced, and the working media can rapidly slide along the inner wall of the cooling section 3 after being liquefied.
The liquid storage layer 5 is used for storing a certain amount of working medium, and one end of the liquid storage layer 5 is connected with the capillary structure layer 4, so that the working medium is transmitted from the liquid storage layer 5 to the capillary structure layer 4. The liquid storage layer 5 is made of porous material, and the liquid storage principle is the same as that of the capillary structure layer 4. When the working medium is injected into the pipe body 1, a proper amount of working medium is injected according to the total amount of the working medium which can be stored in the capillary structure layer 4 and the liquid storage layer 5, so that the capillary structure layer 4 and the liquid storage layer 5 can fully adsorb the working medium, and the phenomenon that the working medium in the capillary structure layer 4 is too high in liquid level due to excessive amount of the working medium is avoided. The absorption capacity of the capillary structure layer 4 to the liquid working medium is larger than that of the liquid storage layer 5 to the liquid working medium, namely, the absorption capacity of the capillary structure layer 4 to the working medium is higher than that of the liquid storage layer 5, and after the working medium in the capillary structure layer 4 is reduced, the working medium in the liquid storage layer 5 can be absorbed into the capillary structure layer 4, so that the liquid storage layer 5 can provide the working medium for the capillary structure layer 4.
When the heat pipe works, the evaporation section 2 absorbs heat, so that working media in the capillary structure layer 4 are evaporated, generated steam flows to the cooling section 3, the steam is liquefied after precooling in the cooling section 3, then flows to the liquid storage layer 5 under the adsorption capacity of the capillary structure layer 4 and the liquid storage layer 5, and then flows back to the capillary structure layer 4 after flowing through the liquid storage layer 5. With the rise of thermal power, the evaporation rate of the working medium is accelerated, the working medium in the capillary structure layer 4 is gradually reduced, the liquid level of the working medium is reduced, and at the moment, the capillary structure layer 4 can absorb the working medium in the liquid storage layer 5, so that the working medium in the capillary structure layer 4 is prevented from being completely evaporated to form a dry combustion working condition.
According to the invention, by adding the liquid storage layer 5, a certain amount of working medium is stored in the liquid storage layer 5, when the thermal power is lower, the working medium can be reserved in the liquid storage layer 5, the liquid level of the working medium in the capillary structure layer 4 is not influenced, the steam generated by the capillary structure layer 4 can be smoothly discharged, and the thermal resistance is not increased. When the heat power rises, the working medium in the liquid storage layer 5 is sucked into the capillary structure layer 4, and the working medium is supplemented to the capillary structure layer 4, so that the capillary structure layer 4 is prevented from being burned dry, and the maximum heat power which can be born is improved.
The liquid storage layer 5 can adopt various materials with better liquid absorption performance in the prior art, but according to the working principle of the heat pipe, heat is transferred through the phase change of working medium, and the efficiency of transferring the heat through the phase change is far higher than that of heat transfer, so that in order to ensure the working efficiency of the heat pipe, the working medium is ensured to be evaporated and liquefied as much as possible, the lower the temperature of the cooling section 3 is, the faster the liquefying speed of the working medium is, because the pipe body 1 is integrally formed, the heat of the evaporating section 2 can be transferred to the cooling section 3, so that the temperature of the cooling section 3 is increased, and in order to slow down the speed of heat transfer, the liquid storage layer 5 adopts a heat insulation liquid storage layer, and the heat insulation liquid storage layer has the functions of heat insulation and heat preservation, so that the heat of the evaporating section 2 can be prevented from being transferred to the cooling section 3 through the liquid storage layer 5.
In particular, the liquid storage layer 5 can be made of sponge, and the sponge has the advantages of light weight, high temperature resistance, heat insulation and the like.
Further, the liquid storage layer 5 is multi-section, from the evaporation section 2 to the cooling section 3, the adsorption capacity of each liquid storage layer 5 to liquid working media is gradually decreased, the adsorption capacity of the capillary structure layer 4 to working media is strongest, the adsorption capacity of the multi-section liquid storage layer 5 is gradually decreased, and the liquefied working media can be promoted to quickly return to the capillary structure layer 4. Generally, the higher the porosity, the stronger the adsorption capacity, and therefore, by controlling the porosity of the liquid storage layer 5, the adsorption capacities of the liquid storage layers 5 of different segments can be controlled.
In order to further increase the total amount of working media, the end part of the evaporation section 2 is sealed through an end plate 6, a supporting net barrel 7 is fixedly arranged on the end plate 6, a distance is reserved between the supporting net barrel 7 and the capillary structure layer 4, a permeable membrane 9 is arranged on the inner wall of the supporting net barrel 7, a thermosensitive deformation column 8 is arranged inside the permeable membrane 9, and a salt solution is filled between the thermosensitive deformation column 8 and the permeable membrane 9.
In the invention, the working medium adopts water, in particular to purified water without impurities. The end plate 6 can be welded at the end of the evaporation section 2, the supporting net drum 7 can be a steel net drum, and the steel net drum is welded at the inner side of the end plate 6. The thermosensitive deformation column 8 is made of a material sensitive to temperature, when the temperature is increased, the volume of the thermosensitive deformation column 8 is increased, and when the temperature is reduced, the volume of the thermosensitive deformation column 8 is reduced. The thermosensitive deformation column 8 can be an aluminum alloy column. The salt solution may be an aqueous sodium chloride solution having a concentration of 3 to 6 g/L. The permeable membrane 9 is fixed on the supporting net drum 7, and the permeable membrane 9 is supported by the supporting net drum 7. The working medium is purified water, the salt solution is arranged in the permeable membrane 9, and the concentration difference of the liquid inside and outside the permeable membrane 9 is provided. When the heat power of the heat pipe is higher, the temperature of the evaporation section 2 is higher, at the moment, the thermosensitive deformation column 8 is heated and expanded, the volume is increased, the salt solution in the permeable membrane 9 is extruded, and under the action of pressure, water in the salt solution flows out of the permeable membrane 9 through the permeable membrane 9 and is absorbed by the capillary structure layer 4, and working medium is supplemented to the capillary structure layer 4. When the thermal power of the heat pipe is reduced, the working medium liquid level of the capillary structure layer 4 is increased, redundant working medium overflows the capillary structure layer 4, meanwhile, the temperature of the thermosensitive deformation column 8 is reduced, the volume is reduced, and under the action of concentration difference, working medium outside the permeable membrane 9 can enter the permeable membrane 9 through the permeable membrane 9, so that the working medium liquid level of the capillary structure layer 4 is reduced.
The heat pipe of the invention can increase the total amount of working medium, improve the maximum heat power of the heat pipe, store redundant working medium when the heat power of the heat pipe is lower, and avoid the increase of thermal resistance caused by overhigh working medium liquid level of the capillary structure layer 4.
The radiator of the invention, as shown in fig. 2, comprises a bracket 10, and a plurality of heat pipes shown in fig. 1 are arranged on the bracket 10.
The bracket 10 employs various suitable frame structures for integrally mounting the heat sink to the device. The heat pipes are parallel to each other, and the evaporation sections 2 of all the heat pipes face the same direction.
In order to insulate the evaporation section 2 and the cooling section 3 of the heat pipe, the temperature of the heat source is prevented from being quickly transferred to the cooling section 3 to cause the cooling section 3 to quickly heat, the heat insulating plate 11 is arranged on the support 10, the heat pipe is fixedly connected with the heat insulating plate 11, and the evaporation section 2 and the cooling section 3 of the heat pipe are positioned on two sides of the heat insulating plate 11. The heat insulating board 11 may be made of various conventional heat insulating materials. During operation, the evaporation section 2 is located at a position with higher equipment temperature, the cooling section 3 is located at a position with lower temperature, the evaporation section 2 and the cooling section 3 are separated by the heat insulation plate 11, heat of equipment is prevented from being transferred to the cooling section 3 through air, liquefaction efficiency of working media in the cooling section 3 can be guaranteed, and therefore heat dissipation efficiency is improved.
In order to promote the heat dissipation of the cooling section 3, the support 10 is provided with a cooling pipe 12, the cooling pipe 12 is connected with an air supply mechanism 13, the cooling sections 3 of the heat pipes extend into the cooling pipe 12, and the cooling pipe 12 is perpendicular to the heat pipes. The cooling pipe 12 can adopt a circular pipeline or a rectangular pipeline, the air supply mechanism 13 is used for conveying external cold air into the cooling pipe 12, when the cold air flows through the cooling sections 3 of the heat pipes, the heat of the cooling sections 3 is taken away, the temperature of the cooling sections 3 is reduced, and therefore steam in the cooling sections 3 is promoted to be rapidly cooled and liquefied, and the heat dissipation efficiency can be further improved.
The electronic device of the invention comprises a heat sink as shown in fig. 2. The electronic device may be a desktop computer, a tablet computer, a notebook computer, an all-in-one computer, a server, or other commonly used devices.
After the radiator is installed on the electronic equipment, the cooling section 3 of the heat pipe should be not lower than the evaporation section 2, so that the working medium can be ensured to quickly return to the evaporation section 2 after the cooling section 3 is liquefied.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The heat pipe comprises a pipe body (1), wherein an evaporation section (2) is arranged at one end of the pipe body (1), a cooling section (3) is arranged at the other end of the pipe body, a capillary structure layer (4) is arranged on the inner wall of the evaporation section (2), and a liquid working medium is arranged in the pipe body (1); the method is characterized in that:
the inner wall of the pipe body (1) between the evaporation section (2) and the cooling section (3) is provided with a liquid storage layer (5), and under the same volume, the absorption capacity of the capillary structure layer (4) to the liquid working medium is greater than the absorption capacity of the liquid storage layer (5) to the liquid working medium.
2. The heat pipe of claim 1, wherein: the liquid storage layer (5) is a heat insulation liquid storage layer.
3. A heat pipe as claimed in claim 1 or claim 2, wherein: the liquid storage layers (5) are multi-section, and the adsorption capacity of each liquid storage layer (5) to the liquid working medium is decreased from the evaporation section (2) to the cooling section (3).
4. The heat pipe of claim 2, wherein: the liquid storage layer (5) is a sponge.
5. The heat pipe of claim 1, wherein: the end of evaporation section (2) is sealed through end plate (6), fixedly be provided with on end plate (6) and support net section of thick bamboo (7), support and have the interval between net section of thick bamboo (7) and capillary structure layer (4), support net section of thick bamboo (7) inner wall is provided with osmotic membrane (9), osmotic membrane (9) inside is provided with thermal deformation post (8), is filled with saline solution between thermal deformation post (8) and osmotic membrane (9).
6. The heat pipe of claim 5, wherein: the liquid working medium is water.
7. Radiator, including support (10), its characterized in that: the support (10) is provided with a plurality of heat pipes according to claim 1.
8. The heat sink as recited in claim 7, wherein: the heat pipe is characterized in that the support (10) is provided with a heat insulation plate (11), the heat pipe is fixedly connected with the heat insulation plate (11), and the evaporation section (2) and the cooling section (3) of the heat pipe are positioned on two sides of the heat insulation plate (11).
9. The heat sink as recited in claim 8, wherein: the cooling device is characterized in that a cooling pipe (12) is arranged on the support (10), the cooling pipe (12) is connected with an air supply mechanism (13), the cooling sections (3) of the heat pipes extend into the cooling pipe (12), and the cooling pipe (12) is perpendicular to the heat pipes.
10. An electronic device, characterized in that: comprising a heat sink as claimed in claim 7, 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410032910.1A CN117537642B (en) | 2024-01-10 | 2024-01-10 | Heat pipe, radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410032910.1A CN117537642B (en) | 2024-01-10 | 2024-01-10 | Heat pipe, radiator and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117537642A true CN117537642A (en) | 2024-02-09 |
| CN117537642B CN117537642B (en) | 2024-03-19 |
Family
ID=89792322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410032910.1A Active CN117537642B (en) | 2024-01-10 | 2024-01-10 | Heat pipe, radiator and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117537642B (en) |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07159066A (en) * | 1993-12-03 | 1995-06-20 | Yoshiaki Tsumori | Top heat pipe |
| TW452117U (en) * | 1999-11-24 | 2001-08-21 | Ke Yau Lin | Soft, expandable and retractable film-type heating tube |
| CN1639532A (en) * | 2002-02-26 | 2005-07-13 | 麦克罗斯制造公司 | Capillary evaporator |
| TW200639366A (en) * | 2005-05-05 | 2006-11-16 | Jian-Di Jeng | Manufacturing method of heat pipe |
| CN101025345A (en) * | 2006-02-17 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN101025346A (en) * | 2006-02-18 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
| TW200734593A (en) * | 2006-03-03 | 2007-09-16 | Foxconn Tech Co Ltd | Heat pipe |
| JP2008286480A (en) * | 2007-05-18 | 2008-11-27 | Fuji Electric Systems Co Ltd | Cooling system of power converter |
| JP2012109401A (en) * | 2010-11-17 | 2012-06-07 | Seiko Epson Corp | Heat radiator and heat radiation method |
| CN204987981U (en) * | 2015-06-16 | 2016-01-20 | 河北科煌机械科技有限公司 | Multistage conduction vacuum phase transition heating pipe |
| CN107816908A (en) * | 2017-11-29 | 2018-03-20 | 华南理工大学 | A kind of gradient porosity fiber sintering formula heat pipe and its manufacture method |
| CN108613578A (en) * | 2016-12-13 | 2018-10-02 | 丰田自动车株式会社 | Evaporator |
| CN209605641U (en) * | 2018-12-29 | 2019-11-08 | 中车大连电力牵引研发中心有限公司 | Locomotive radiator and locomotive |
| EP3587985A1 (en) * | 2018-06-21 | 2020-01-01 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
| CN211626203U (en) * | 2019-10-29 | 2020-10-02 | 太仓市华盈电子材料有限公司 | Novel copper water heat pipe with distributed capillary structure |
| US20210310751A1 (en) * | 2020-04-01 | 2021-10-07 | Lenovo (Beijing) Co., Ltd. | Heat conductiing device |
| CN113494865A (en) * | 2020-03-18 | 2021-10-12 | 开文热工股份有限公司 | Thermal ground plane with deformed mesh structure |
| CN114552066A (en) * | 2022-03-01 | 2022-05-27 | 北京理工大学 | Self-adaptive thermal conductivity micro heat pipe array blade battery thermal management system and method |
| CN217821494U (en) * | 2022-03-24 | 2022-11-15 | 四川力泓电子科技有限公司 | Notebook computer with heat dissipation mechanism |
-
2024
- 2024-01-10 CN CN202410032910.1A patent/CN117537642B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07159066A (en) * | 1993-12-03 | 1995-06-20 | Yoshiaki Tsumori | Top heat pipe |
| TW452117U (en) * | 1999-11-24 | 2001-08-21 | Ke Yau Lin | Soft, expandable and retractable film-type heating tube |
| CN1639532A (en) * | 2002-02-26 | 2005-07-13 | 麦克罗斯制造公司 | Capillary evaporator |
| TW200639366A (en) * | 2005-05-05 | 2006-11-16 | Jian-Di Jeng | Manufacturing method of heat pipe |
| CN101025345A (en) * | 2006-02-17 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN101025346A (en) * | 2006-02-18 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
| TW200734593A (en) * | 2006-03-03 | 2007-09-16 | Foxconn Tech Co Ltd | Heat pipe |
| JP2008286480A (en) * | 2007-05-18 | 2008-11-27 | Fuji Electric Systems Co Ltd | Cooling system of power converter |
| JP2012109401A (en) * | 2010-11-17 | 2012-06-07 | Seiko Epson Corp | Heat radiator and heat radiation method |
| CN204987981U (en) * | 2015-06-16 | 2016-01-20 | 河北科煌机械科技有限公司 | Multistage conduction vacuum phase transition heating pipe |
| CN108613578A (en) * | 2016-12-13 | 2018-10-02 | 丰田自动车株式会社 | Evaporator |
| CN107816908A (en) * | 2017-11-29 | 2018-03-20 | 华南理工大学 | A kind of gradient porosity fiber sintering formula heat pipe and its manufacture method |
| EP3587985A1 (en) * | 2018-06-21 | 2020-01-01 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
| CN209605641U (en) * | 2018-12-29 | 2019-11-08 | 中车大连电力牵引研发中心有限公司 | Locomotive radiator and locomotive |
| CN211626203U (en) * | 2019-10-29 | 2020-10-02 | 太仓市华盈电子材料有限公司 | Novel copper water heat pipe with distributed capillary structure |
| CN113494865A (en) * | 2020-03-18 | 2021-10-12 | 开文热工股份有限公司 | Thermal ground plane with deformed mesh structure |
| US20210310751A1 (en) * | 2020-04-01 | 2021-10-07 | Lenovo (Beijing) Co., Ltd. | Heat conductiing device |
| CN114552066A (en) * | 2022-03-01 | 2022-05-27 | 北京理工大学 | Self-adaptive thermal conductivity micro heat pipe array blade battery thermal management system and method |
| CN217821494U (en) * | 2022-03-24 | 2022-11-15 | 四川力泓电子科技有限公司 | Notebook computer with heat dissipation mechanism |
Non-Patent Citations (3)
| Title |
|---|
| 汤广发, 刘娣, 赵福云, 严继光: "分离型热管充液率运行边界探讨", 湖南大学学报(自然科学版), no. 01, 25 February 2005 (2005-02-25) * |
| 高文忠;李长松;徐畅达;刘婷;: "基于热管传热的盐水真空分离", 化工学报, no. 05 * |
| 高文忠;王栋;李长松;徐畅达;: "新型吸附式盐溶液水分离装置设计与机理研究", 机械工程学报, no. 06 * |
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