CN117528898A

CN117528898A - Circuit board and electronic equipment

Info

Publication number: CN117528898A
Application number: CN202210895936.XA
Authority: CN
Inventors: 李志涛; 史少飞
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-07-27
Filing date: 2022-07-27
Publication date: 2024-02-06
Also published as: WO2024021794A1

Abstract

The application provides a circuit board, which comprises a circuit substrate, a heat conducting block and an electronic component electrically connected with the circuit substrate. The surface of the circuit substrate is concavely provided with an accommodating groove. The heat conduction block comprises a first heat conduction part and two second heat conduction parts. The first heat conduction part comprises a first surface and a second surface which are opposite to each other, and a third surface connecting the first surface and the second surface. A containing space is arranged from the first surface to the second surface. The second heat conduction part extends from one end of the third surface, which is close to the first surface, towards a direction away from the accommodating space. The first heat conduction part is embedded in the accommodating groove, and the second heat conduction part is fixed on the surface of the circuit substrate. At least one part of the electronic components is positioned in the accommodating space and contacted with the heat conducting block. In the circuit board of this application, the heat of electronic components conducts to the heat conduction piece fast to reach good radiating effect. The application also provides electronic equipment applying the circuit board.

Description

Circuit board and electronic equipment

Technical Field

The application relates to a circuit board with good heat dissipation effect and electronic equipment using the circuit board.

Background

In order to adapt to higher and higher power demands, power semiconductor devices, particularly power source type power semiconductor devices, are increasingly evolving towards a direction of light weight, short weight and high power density, and therefore, the heat dissipation requirements of the power semiconductor devices are higher and higher. How to make the power semiconductor device radiate heat well is a problem facing the current situation.

Disclosure of Invention

The first aspect of the application provides a circuit board, which comprises a circuit substrate, a heat conducting block and an electronic component. The surface of the circuit substrate is concavely arranged inwards to form an accommodating groove. The heat conducting block comprises a first heat conducting part and two second heat conducting parts at intervals. The first heat conduction part comprises a first surface, a second surface opposite to the first surface and a third surface connecting the first surface and the second surface. A containing space is formed from the first surface towards the second surface. Each second heat conducting part extends from one end of the third surface close to the first surface towards a direction away from the accommodating space. The first heat conduction part is embedded in the accommodating groove, and the second heat conduction part is fixed on the surface of the circuit substrate. At least a part of the electronic component is located in the accommodating space and is in contact with the heat conducting block, and the electronic component is electrically connected with the circuit substrate.

According to the circuit board, the first heat conduction part is embedded in the accommodating groove, the second heat conduction part is fixed on the surface of the circuit substrate, in addition, an accommodating space is formed on the heat conduction block, and at least one part of the electronic component is positioned in the accommodating space and is in contact with the heat conduction block, so that heat of the electronic component is quickly conducted to the heat conduction block, and a good heat dissipation effect is achieved; meanwhile, the heat conducting block and the electronic component are assembled on the same side of the circuit substrate, so that the influence of tolerance on the assembly of the circuit board is reduced, the contact between the electronic component and the heat conducting block is guaranteed, effective heat conduction is performed, heat on the electronic component is further rapidly diffused, the temperature and thermal resistance of the electronic component are reduced, and the service life of the circuit board is prolonged. In addition, the first heat conduction part of the heat conduction block is embedded in the accommodating groove of the circuit substrate, so that the overall thickness of the circuit board is reduced. The second heat conducting part is fixed on the surface of the circuit substrate, and when the heat conducting block and the circuit substrate are fixed, heat on the electronic component can be conducted and diffused transversely through the first heat conducting part, then conducted and diffused longitudinally, namely in the thickness direction of the circuit substrate, to the second heat conducting part and then diffused outwards, so that the temperature and the thermal resistance of the electronic component can be reduced.

In combination with the first aspect, in some embodiments, a side of the second heat conducting portion facing away from the circuit substrate has a concave portion or a convex portion, so as to increase the surface area of the heat conducting block, and facilitate heat dissipation, and further facilitate rapid reduction of the temperature of the electronic component.

With reference to the first aspect, in some embodiments, the first surface has a concave portion or a convex portion, so as to increase the surface area of the heat conducting block, which is beneficial to heat dissipation, and thus is beneficial to quickly reducing the temperature of the electronic component.

In combination with the first aspect, in some embodiments, the accommodating groove penetrates through two opposite surfaces of the circuit substrate, so that heat on the electronic component can be dissipated towards two opposite sides of the circuit substrate through the heat conducting block, which is beneficial to accelerating heat dissipation and improving heat dissipation efficiency.

In combination with the first aspect, in some embodiments, the second surface is provided with a concave portion or a convex portion, so as to increase the surface area of the heat conducting block, which is beneficial to heat dissipation, and thus is beneficial to quickly reducing the temperature of the electronic component.

In combination with the first aspect, in some embodiments, the second surface is flush with the surface of the circuit substrate facing away from the first heat conducting portion or is located on a side of the circuit substrate facing away from the second heat conducting portion, which is favorable for rapidly radiating heat on the electronic component toward two opposite sides of the circuit substrate, so as to improve heat radiating efficiency.

With reference to the first aspect, in some embodiments, the depth of the accommodating groove is smaller than the thickness of the circuit substrate.

In combination with the first aspect, in some embodiments, the accommodating groove includes a bottom wall facing the second surface, and the second surface is fixed on the bottom wall, so as to reduce the shaking situation of the first heat conducting portion when the circuit board is subjected to an external force, thereby facilitating effective heat conduction between the electronic component and the heat conducting block, and improving the stability of the overall structure of the circuit board.

With reference to the first aspect, in some embodiments, a glue layer is disposed between the second surface and the bottom wall, and the glue layer bonds the bottom wall and the second surface, which is beneficial to improving stability of an overall structure of the circuit board.

In combination with the first aspect, in some embodiments, a portion of the electronic component located in the accommodating space is fixed with the heat conducting block, so that the electronic component is tightly combined with the heat conducting block, thereby being beneficial to effective heat conduction between the electronic component and the heat conducting block, and further rapidly diffusing heat on the electronic component.

With reference to the first aspect, in some embodiments, the accommodating groove includes a side wall, a conductive layer is disposed on the side wall, and the circuit substrate includes a circuit, and the circuit is electrically connected with the conductive layer, so that the accommodating groove provided with the conductive layer is used as a via hole in the circuit substrate while accommodating the heat conducting block, which is beneficial to improving the wiring density of the circuit substrate.

With reference to the first aspect, in some embodiments, the heat conducting block has electrical conductivity, the electronic component is electrically connected with the heat conducting block, and the heat conducting block is electrically connected with the conductive layer in contact, so that the electronic component can be prevented from being further provided with pins to be electrically connected with the circuit substrate.

In combination with the first aspect, in some embodiments, the number of the electronic components is multiple, and the accommodating space is provided with multiple electronic components, that is, heat conduction and heat dissipation of the multiple electronic components are simultaneously realized through one heat conduction block, which is favorable for reducing the total space occupied by the heat conduction block on the circuit substrate, thereby being favorable for wiring of the circuit substrate.

With reference to the first aspect, in some embodiments, the two second heat conducting portions are disposed opposite to the first heat conducting portion, so that the heat conducting block is beneficial to be stably disposed on the circuit substrate.

In combination with the first aspect, in some embodiments, the circuit board further includes a heat dissipating device, where the heat dissipating device contacts a side of the second heat conducting portion away from the circuit substrate, so as to dissipate heat of the second heat conducting portion, thereby facilitating dissipation of heat and further reducing a temperature of the electronic component rapidly.

With reference to the first aspect, in some embodiments, the circuit board further includes a heat dissipating device, where the heat dissipating device is in contact with the second surface, so as to dissipate heat of the first heat conducting portion, thereby facilitating dissipation of heat and further facilitating rapid reduction of temperature of the electronic component.

In combination with the first aspect, in some embodiments, the accommodating space forms an opening on the third surface, and a part of the electronic component is located in the accommodating space and is in contact with the heat conducting block, and another part of the electronic component extends out of the opening so as to be matched with the larger electronic component for heat dissipation. At this time, the heat conducting block and the electronic components are assembled on the same side of the circuit substrate, so that the influence of tolerance on the assembly of the circuit board is reduced, the assembly of the electronic components is facilitated, and the inclination probability of the electronic components is reduced.

In combination with the first aspect, in some embodiments, the number of the openings is two, and the two openings are disposed opposite to each other, so that the heat source area of the electronic component is close to the heat conducting block.

In combination with the first aspect, in some embodiments, opposite ends of the electronic component respectively protrude from the two openings so as to be located at opposite sides of the first heat conducting portion, so that a heat source area of the electronic component is convenient to approach the heat conducting block. For example, when the heat source area of the electronic component is close to or located in the middle area of the electronic component, the two openings which are oppositely arranged facilitate the electronic component to pass through the heat conducting block so that the heat source area of the electronic component is close to the heat conducting block, thereby being beneficial to quickly conducting the heat of the heat source area outwards; meanwhile, the situation that the heat source area is approached by arranging the accommodating groove with a larger area and the heat conducting block can be avoided, and therefore the wiring density of the circuit substrate is improved. A second aspect of the present application provides an electronic device comprising a housing and a circuit board as described above, the circuit board being disposed in the housing. The electronic device to which the circuit board is applied is advantageous in reducing the risk of local overheating caused by the electronic components.

Drawings

Fig. 1 is a schematic cross-sectional view of a prior art circuit board.

Fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of another direction of a circuit board according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 8 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 9 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 11 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 12 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 13 is a schematic cross-sectional view of another direction of a circuit board according to an embodiment of the present application.

Fig. 14 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 15 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 16 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 17 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 18 is a top view of a circuit board according to one embodiment of the present application.

Fig. 19 is a top view of a circuit board according to one embodiment of the present application.

Fig. 20 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 21 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

Fig. 22 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application.

FIG. 23 is a schematic structural diagram of an electronic device according to an embodiment of the present application

Description of the main reference signs

Circuit board	100
		Electronic equipment	200
Circuit substrate	10
		Heat conducting block	30
Electronic component	50
		First heat conduction part	31
Second heat conduction part	33
		A first surface	311
A second surface	312
		Third surface	313
Accommodating space	310
		An opening	314
Surface of the body	11、12
		Accommodating groove	101
Bottom wall	102
		Side wall	103
Bottom surface	315
		Side surface	316
Gap of	104
		Connection surface	330
Connecting pad	51
		Tin material	53
Pin	55
		Conductive layer	13
Circuit arrangement	15
		Adhesive layer	21
Concave part	A、B、C
		First heat dissipation device	61
Second heat dissipation device	63

Detailed Description

Embodiments of the present application are described below with reference to the accompanying drawings in the embodiments of the present application. Wherein the features of the embodiments described below may be combined with each other without conflict.

As shown in fig. 1, a conventional power semiconductor device is shown, in which a back surface of a component 1 is soldered on a circuit substrate 2, a plurality of vias 2a are provided on the circuit substrate 2 corresponding to heat dissipation pads 1a of the component 1, and each via 2a is connected to the heat dissipation pad 1a, so that heat on the component 1 is transferred to the other side of the circuit substrate 2. However, the thermal conductivity of the via hole 2a is limited.

In view of this, as shown in fig. 2, in order to improve the heat dissipation effect, the present application provides a circuit board 100. The circuit board 100 may be applied to a terminal. The terminal includes a housing and the circuit board 100 accommodated in the housing. The terminal may be, but is not limited to, an electronic device such as a power supply, a cell phone, a computer, a photovoltaic inverter, a site energy source, an industrial motor drive, and the like. As shown in fig. 23, in some embodiments, the electronic device 200 employing the circuit board 100 is an electric vehicle charging peg.

Referring to fig. 2, 3 and 4, the circuit board 100 includes a circuit substrate 10, a heat conducting block 30 and an electronic component 50. Wherein the heat conducting block 30 comprises a first heat conducting part 31 and two spaced second heat conducting parts 33. The first heat conducting portion 31 includes a first surface 311, a second surface 312, and a third surface 313, the second surface 312 is disposed opposite to the first surface 311, and the third surface 313 connects the first surface 311 and the second surface 312. An accommodating space 310 is formed from the first surface 311 toward the second surface 312, and the accommodating space 310 forms an opening 314 on the third surface 313. Each of the second heat conducting portions 33 extends from an end of the third surface 313 near the first surface 311 in a direction away from the accommodating space 310, and the two second heat conducting portions 33 are spaced apart from each other.

The surface 11 of the circuit substrate 10 is concavely provided with a receiving groove 101, the first heat conducting portion 31 is embedded in the receiving groove 101, and the second heat conducting portion 33 is fixed on the surface 11 of the circuit substrate 10.

A part of the electronic component 50 is located in the accommodating space 310 and contacts with the heat conducting block 30, and another part of the electronic component extends out of the opening 314. The electronic component 50 is also electrically connected to the circuit board 10.

In the above-mentioned circuit board 100, the first heat conducting portion 31 is embedded in the accommodating groove 101, the second heat conducting portion 33 is fixed on the surface 11 of the circuit substrate 10, and an accommodating space 310 is formed on the heat conducting block 30, and a part of the electronic component 50 is located in the accommodating space 310 and contacts with the heat conducting block 30, so that the heat of the electronic component 50 is quickly conducted to the heat conducting block 30, thereby achieving a good heat dissipation effect; meanwhile, the heat conducting block 30 and the electronic component 50 are assembled on the same side of the circuit substrate 10, so that the influence of tolerance on the assembly of a circuit board is reduced, the assembly of the electronic component 50 is facilitated, the inclination probability of the electronic component 50 is reduced, the contact between the electronic component 50 and the heat conducting block 30 is ensured, the effective heat conduction is performed, the heat on the electronic component 50 is further rapidly diffused, the temperature and the thermal resistance of the electronic component 50 are reduced, and the service life of the circuit board 100 is prolonged.

In addition, in the circuit board 100, the first heat conducting portion 31 is embedded in the accommodating groove 101, which is beneficial to reducing the overall thickness of the circuit board 100. The second heat conducting portion 33 is fixed on the surface 11 of the circuit substrate 10, and the heat on the electronic component 50 can be conducted and diffused laterally through the first heat conducting portion 31 while the heat conducting block 30 and the circuit substrate 10 are fixed, and then conducted and diffused to the second heat conducting portion 33 along the longitudinal direction, i.e. the thickness direction of the circuit substrate 10, and then diffused to the outside, so that the temperature and the thermal resistance of the electronic component 50 can be reduced.

The circuit substrate 10 may be a flexible circuit board, a rigid circuit board or a rigid-flex circuit board. The wiring substrate 10 may include a single wiring layer or a plurality of wiring layers. In this application, the circuit board 10 is exemplified as a flexible circuit board including a plurality of layers of circuits.

The circuit substrate 10 further comprises a surface 12 arranged opposite to the surface 11. The accommodating groove 101 is recessed from the surface 11 toward the surface 12. Referring to fig. 3 and 4, the depth of the accommodating groove 101 is smaller than the thickness of the circuit board 10, i.e. the accommodating groove 101 does not penetrate the surface 12. In this way, the area of the surface 12 corresponding to the accommodating groove 101 may be routed, for example, as shown in fig. 3, where a wire or a pad is disposed, so as to facilitate the improvement of the routing density of the circuit substrate 10. The receiving groove 101 is defined by a bottom wall 102 and a side wall 103, wherein the bottom wall 102 faces away from the surface 12, and the side wall 103 connects the bottom wall 102 with the surface 11. The depth and shape of the receiving groove 101 may be selected as desired, for example, as shown in fig. 2, the receiving groove 101 may be, but not limited to, a rectangular parallelepiped shape. The receiving groove 101 may be formed by, but not limited to, laser cutting, mechanical cutting, or etching.

The heat conducting block 30 may include, but is not limited to, a metal block or an alloy block, etc., and may include, but is not limited to, a copper block, an aluminum alloy block, an iron block, a steel block, etc. In some embodiments, the material of the first heat conducting portion 31 is the same as the material of the second heat conducting portion 33. In other embodiments, the material of the first heat conducting portion 31 may be different from the material of the second heat conducting portion 33. In some embodiments, the first heat conducting portion 31 and the second heat conducting portion 33 may be integrally formed, that is, the second heat conducting portion 33 is formed by partially extending the first heat conducting portion 31, for example, the heat conducting block 30 may be formed by cutting a monolithic metal block or an alloy block. In other embodiments, the first heat conducting portion 31 and the second heat conducting portion 33 may be connected by, but not limited to, welding, gluing, or the like.

Referring to fig. 2 and 3, the accommodating space 310 is defined by a bottom surface 315 and a side surface 316. Wherein the bottom surface 315 is opposite to the second surface 312, and the side surface 316 connects the bottom surface 315 and the first surface 311. The shape and size of the accommodating space 310 can be selected according to the needs, and the shape and size of the opening 314 can be set according to the needs. For example, as shown in fig. 2, the accommodating space 310 is substantially rectangular parallelepiped, and the accommodating space 310 forms two openings 314 disposed opposite to each other on the third surface 313. Each of the openings 314 may be rectangular and preferably communicates with the first surface 311 to facilitate assembly of subsequent electronic components. In other embodiments, the accommodating space 310 and the opening 314 may have other regular or irregular shapes.

Referring to fig. 3, the first heat conducting portion 31 is embedded in the accommodating groove 101 and may be spaced apart from the accommodating groove 101, that is, a gap 104 may exist between the first heat conducting portion 31 and the bottom wall 102 and the side wall 103. The second surface 312 faces the bottom wall 102. In some embodiments, the first heat conducting portion 31 may also be in contact with at least one of the bottom wall 102 and the side wall 103.

The shape and size of the first heat conducting portion 31 may be selected according to need, and in some embodiments, the shape of the first heat conducting portion 31 may be contoured with the shape of the accommodating groove 101.

The second heat conducting portion 33 includes a connection surface 330 facing away from the plane of the first surface 311. The connection surface 330 faces the circuit board 10 and is fixed to the circuit board 10. The connection surface 330 of the second heat conducting portion 33 may be fixed to the surface 11 of the circuit substrate 10 by, but not limited to, SMT (surface mount technology) soldering or bonding. In some embodiments, it is preferable that the height difference between the bottom surface 315 and the connection surface 330 in the thickness direction X of the circuit substrate 10 is less than or equal to 0.1mm, so that the height difference between the bottom surface 315 and the surface 11 after the heat conducting block 30 is mounted on the circuit substrate 10 is controlled, thereby facilitating the mounting of the subsequent electronic component 50, so that the electronic component 50 is not easy to incline due to the height difference between the bottom surface 315 and the surface 11, and further facilitating the mounting stability of the electronic component 50 and the overall structure stability of the circuit board 100.

The shape and size of the second heat conducting portion 33 may be selected as needed. For example, the larger the second heat conducting portion 33 is, the more advantageous the heat dissipation is to be accelerated without affecting the wiring of the circuit board 10.

The two second heat conducting portions 33 may be disposed opposite to the first heat conducting portion 31, so as to facilitate the stable disposition of the heat conducting blocks 30 on the circuit substrate 10. The number of the second heat conducting parts 33 may be greater, for example, three, four, etc. At least two of the plurality of second heat conducting portions 33 are spaced apart.

The electronic component 50 may include one or more active devices, such as an active chip including, but not limited to, a power chip, a digital chip, a radio frequency chip, etc., and in this embodiment, the electronic component 50 may include a power chip such as an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT), a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET), a silicon carbide (SiC), or a gallium nitride (GaN). It will be appreciated that the electronic component 50 may also include one or more passive devices including, but not limited to, resistors, capacitors, inductors, filters, couplers, etc.

Referring to fig. 4, the electronic component 50 may pass through two oppositely disposed openings 314, so that two opposite ends of the electronic component 50 respectively protrude from the openings 314 and are located at two opposite sides of the first heat conducting portion 31, so that a heat source area of the electronic component 50 is convenient to approach the heat conducting block 30, and heat of the heat source area is easily and rapidly conducted outwards.

Referring to fig. 3 and 4, the back surface (i.e., inactive surface) of the electronic component 50 contacts the bottom surface 315 of the heat conducting block 30. Further, the back surface of the electronic component 50 may be provided with a plurality of connection pads 51, and the electronic component 50 may be in contact with the bottom surface 315 of the heat conducting block 30 through the connection pads 51. Further, the electronic component 50 may be fixed to the bottom surface 315. Specifically, the portion of the electronic component 50 located in the accommodating space 310 may be welded or adhered to the bottom surface 315 through the connection pad 51. As shown in fig. 3, the connection pad 51 may be soldered to the bottom surface 315 by a solder material 53. The connection pad 51 may be welded to the bottom surface 315 by other welding materials, or bonded to the bottom surface 315 by a heat conductive material such as a heat conductive adhesive. The portion of the electronic component 50 located in the accommodating space 310 is welded or bonded with the heat conducting block 30, so that the electronic component 50 is tightly combined with the heat conducting block 30, thereby facilitating effective heat conduction between the electronic component 50 and the heat conducting block 30, and further rapidly diffusing heat on the electronic component 50.

The plurality of connection pads 51 are disposed as close to the heat source area of the electronic component 50 as possible, so as to facilitate rapid heat conduction from the electronic component 50. The shape and size of each connection pad 51 are not limited, and may be circular, but may be other shapes, such as rectangular, triangular, elongated with a certain length-diameter ratio, or other regular or irregular shapes. When the number of the connection pads 51 is plural, the plural connection pads 51 may be regularly and uniformly arranged, as shown in fig. 3, the plural connection pads 51 are arranged in a row, and the shape and the size of any two connection pads 51 are identical. In some embodiments, the plurality of connection pads 51 may be irregularly or unevenly arranged, and any two of the connection pads 51 may have different shapes and sizes. The position, size and shape of the connection pads 51 can be reasonably arranged according to the actual number of the connection pads 51, so as to improve the heat dissipation efficiency of the circuit board 100.

Referring to fig. 4, a pin 55 may be further disposed on the electronic component 50, and the electronic component 50 is electrically connected to the circuit substrate 10 through the pin 55.

In some embodiments, referring to fig. 5 and 6, the number of the openings 314 may be one, and at this time, one end of the electronic component 50 is located in the accommodating space 310.

In some embodiments, referring to fig. 7, a conductive layer 13 may be further disposed on the sidewall 103, and the circuit substrate 10 includes a plurality of circuits 15, where the plurality of circuits 15 are electrically connected to the conductive layer 13. The accommodating groove 101 provided with the conductive layer 13 accommodates the heat conducting block 30 and also serves as a via hole of the circuit substrate 10, which is beneficial to improving the wiring density of the circuit substrate 10. In this embodiment, the number of the wires 15 is two, and the wires are embedded in the dielectric layer of the circuit substrate 10. In other embodiments, the lines 15 may be other numbers, such as, but not limited to, one, three, four, etc.; the distribution position of the lines 15 can also be adjusted as required, for example, on the surface 11 or the surface 12. The conductive layer 13 may be a conductive metal layer, which may be formed by, but not limited to, metallization.

In some embodiments, referring to fig. 8, the heat conducting block 30 has electrical conductivity, the first heat conducting portion 31 may be electrically connected to the connection pad 51 of the electronic component 50, and the second heat conducting portion 33 may be fixed to and electrically connected to the circuit 15 disposed on the surface 11, so as to electrically connect the electronic component 50 to the circuit substrate 10 through the heat conducting block 30. At this time, there is no need to provide a separate pin to electrically connect the electronic component 50 and the circuit board 10, i.e., the pin 55 may be omitted.

In some embodiments, referring to fig. 9, the conductive block 30 with electrical conductivity may also contact and electrically connect with the conductive layer 13, so as to realize the electrical connection between the electronic component 50 and the circuit substrate 10 through the conductive block 30 and the conductive layer 13. At this time, there is no need to provide a separate pin to electrically connect the electronic component 50 and the circuit board 10, i.e., the pin 55 may be omitted. Similarly, the second heat conducting portion 33 may not be fixed to and electrically connected to the circuit 15 provided on the surface 11.

In some embodiments, referring to fig. 10, the second surface 312 may be further fixed on the bottom wall 102, so as to reduce the shaking of the first heat conducting portion 31 when the circuit board 100 is subjected to an external force, thereby facilitating the effective heat conduction between the electronic component 50 and the heat conducting block 30, and improving the stability of the overall structure of the circuit board 100. The second surface 312 and the bottom wall 102 may be provided with, but not limited to, a glue layer 21, and the second surface 312 is bonded to the bottom wall 102 through the glue layer 21, so as to further fix the heat conducting block 30, which is beneficial to improving the stability of the overall structure of the circuit board. In some embodiments, the glue layer 21 may be, but is not limited to, a heat conductive glue. The heat conducting glue is beneficial to rapidly transferring the heat on the heat conducting block 30 to the circuit substrate 10 and dissipating the heat through the circuit substrate 10, thereby being beneficial to improving the heat dissipation efficiency of the circuit board 100.

In some embodiments, referring to fig. 11, the receiving slot 101 may also penetrate the opposite surfaces 11 and 12 of the circuit substrate 10. At this time, the heat of the electronic component 50 can be dissipated toward the two opposite sides of the circuit substrate 10 through the heat conducting block 30, which is beneficial to accelerating the heat dissipation speed and improving the heat dissipation efficiency. In the present embodiment, the second surface 312 of the first heat conducting portion 31 is located between the surface 11 and the surface 12.

As shown in fig. 12 and 13, the first heat conducting portion 31 may also protrude from the surface 12, i.e. the second surface 312 is located at a side of the circuit substrate 10 facing away from the second heat conducting portion 33. In some embodiments, the second surface 312 may also be flush with the surface 12. Thus, the heat on the electronic component 50 is advantageously dissipated to the two opposite sides of the circuit substrate 10, so as to improve the heat dissipation efficiency.

In some embodiments, referring to fig. 14 and 15, when the accommodating groove 101 penetrates through the opposite surfaces 11 and 12 of the circuit substrate 10, the second surface 312 may further be provided with a concave portion or a convex portion to increase the surface area of the heat conducting block 30, so as to facilitate heat dissipation, and further facilitate rapid temperature reduction of the electronic component 50. The shape and size of the concave portion or the convex portion may be selected as desired. As shown in fig. 14 and 15, the second surface 312 is provided with a plurality of recesses a, so that a side of the first heat conducting portion 31 facing away from the first surface 311 is fin-shaped. It will be appreciated that the distribution of the plurality of recesses a may be adjusted as required, and the shape and size of each recess a may be adjusted as required.

In some embodiments, referring to fig. 16, a side of the second heat conducting portion 33 facing away from the circuit substrate 10 may have a concave portion or a convex portion, so as to increase the surface area of the heat conducting block 30, thereby facilitating heat dissipation, and further facilitating rapid temperature reduction of the electronic component 50. The shape and size of the concave or convex portion of the second heat conducting portion 33 can be selected as required. As shown in fig. 16, a recess B is provided on a side of the second heat conducting portion 33 facing away from the circuit substrate 10, so that a side of the second heat conducting portion 33 facing away from the circuit substrate 10 is fin-shaped. It will be appreciated that the distribution of the plurality of recesses B may be adjusted as required, and the shape and size of each recess B may be adjusted as required.

In some embodiments, referring to fig. 16 and 17, the first surface 311 may also have concave or convex portions to increase the surface area of the heat conducting block 30, so as to facilitate heat dissipation, and thus facilitate rapid temperature reduction of the electronic component 50. As shown in fig. 17, the first surface 311 has a plurality of concave portions C, so that a side of the first heat conducting portion 31 facing away from the second surface 312 is fin-shaped. It will be appreciated that the distribution of the plurality of recesses C may be adjusted as required, and the shape and size of each recess C may be adjusted as required.

The number of the electronic components 50 may be plural, and plural electronic components 50 are disposed in one accommodating space 310. As shown in fig. 18, there are two electronic components 50, one end of one electronic component 50 is located in the accommodating space 310, and the other end extends out from one of the two openings 314; one end of the other electronic component 50 is the electronic component 50, and the other end is protruded from the other opening of the two oppositely arranged openings 314. I.e. two of said electronic components 50 are arranged opposite each other and protrude from opposite sides of said heat conducting block 30, respectively. It will be appreciated that the two openings 314 may be offset, or may not be located on opposite sides of the heat conducting block 30. A plurality of the electronic components 50 may also protrude from the same opening 314, as shown in fig. 19 and 20, with two of the electronic components 50 being disposed side by side and passing through two of the oppositely disposed openings 314 at the same time. In this way, the heat conduction and dissipation of the plurality of electronic components 50 are simultaneously realized by one heat conduction block 30, which is beneficial to reducing the total space occupied by the heat conduction block 30 on the circuit substrate 10, thereby facilitating the wiring of the circuit substrate 10.

Referring to fig. 21, the circuit board 100 may further include a first heat dissipating device 61, where the first heat dissipating device 61 is located on a side of the surface 11 of the circuit substrate 10 facing away from the surface 12, and the first heat dissipating device 61 contacts with a side of the second heat conducting portion 33 facing away from the circuit substrate 10, so as to dissipate heat of the second heat conducting portion 33, thereby facilitating heat dissipation and further reducing the temperature of the electronic component 50 rapidly. The first heat sink 61 may be an air-cooled heat sink or a water-cooled heat sink, but is not limited thereto. The first heat dissipating device 61 may be connected to a side of the second heat conducting portion 33 facing away from the circuit substrate 10 through a heat conducting glue layer (for example, heat conducting silica gel) or a soldering layer.

Referring to fig. 22, when the second surface 312 is flush with the surface 12 or is located on a side of the surface 12 away from the second heat conducting portion 33, the circuit board 100 may further include a second heat dissipating device 63, where the second heat dissipating device 63 is located on a side of the surface 12 of the circuit substrate 10 away from the surface 11, and the second heat dissipating device 63 is in contact with the second surface 312 of the first heat conducting portion 31 to dissipate heat from the first heat conducting portion 31, so as to facilitate heat dissipation, and further facilitate rapid temperature reduction of the electronic component 50. The second heat sink 63 may be an air-cooled heat sink or a water-cooled heat sink, but is not limited thereto. The second heat dissipating device 63 may be connected to the second surface 312 of the first heat conducting part 31 by a heat conducting glue layer (e.g. heat conducting silica gel) or a soldering layer, etc.

In some embodiments, the opening 314 may also be omitted. At this time, the electronic component 50 is entirely located in the accommodating space 310. The electronic component 50 may be electrically connected to the circuit substrate 10 through a conductive wire, or may be electrically connected to the circuit substrate 10 through the heat conductive block 30.

It should be noted that the above is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes or substitutions should be covered in the scope of the present application; in the case of no conflict, the embodiments of the present application and features of the embodiments may be combined with one another. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board, comprising:

the circuit substrate is provided with an accommodating groove in a concave manner;

the heat conducting block comprises a first heat conducting part and two second heat conducting parts at intervals; the first heat conduction part comprises a first surface, a second surface opposite to the first surface and a third surface connecting the first surface and the second surface, a containing space is formed from the first surface towards the second surface, each second heat conduction part extends from one end, close to the first surface, of the third surface towards a direction away from the containing space, the first heat conduction part is embedded in the containing groove, and the second heat conduction part is fixed on the surface of the circuit substrate;

and at least one part of the electronic component is positioned in the accommodating space and is in contact with the heat conducting block, and the electronic component is electrically connected with the circuit substrate.

2. The circuit board of claim 1, wherein a side of the second heat conducting portion facing away from the circuit substrate has a concave portion or a convex portion.

3. The circuit board of claim 1, wherein the first surface has a concave or convex portion.

4. The circuit board of claim 1, wherein the receiving slot extends through opposite surfaces of the circuit substrate.

5. The circuit board of claim 4, wherein the second surface is provided with recesses or protrusions.

6. The circuit board of claim 4, wherein the second surface is flush with a surface of the circuit substrate facing away from the second thermally conductive portion or is located on a side of the circuit substrate facing away from the second thermally conductive portion.

7. The circuit board of claim 1, wherein the depth of the receiving slot is less than the thickness of the circuit substrate.

8. The circuit board of claim 7, wherein the receiving slot includes a bottom wall facing the second surface, the second surface being secured to the bottom wall.

9. The circuit board of claim 8, wherein a glue layer is disposed between the second surface and the bottom wall, the glue layer bonding the bottom wall and the second surface.

10. The circuit board of claim 1, wherein a portion of the electronic component located in the accommodating space is fixed to the heat conducting block.

11. The circuit board of claim 1, wherein the receiving slot includes a sidewall having a conductive layer disposed thereon, and the circuit substrate includes a circuit electrically connected to the conductive layer.

12. The circuit board of claim 11, wherein the thermally conductive block has electrical conductivity, the electronic component is electrically connected to the thermally conductive block, and the thermally conductive block is in contact electrical connection with the electrically conductive layer.

13. The circuit board of claim 1, wherein the number of the electronic components is plural, and the plurality of the electronic components are disposed in the accommodating space.

14. The circuit board of claim 1, wherein two of the second heat conducting portions are disposed opposite to the first heat conducting portion.

15. The circuit board of claim 1, further comprising a heat sink in contact with a side of the second thermally conductive section facing away from the circuit substrate.

16. The circuit board of claim 6, further comprising a heat sink in contact with the second surface.

17. The circuit board of any one of claims 1 to 16, wherein the accommodating space forms an opening in the third surface, and a portion of the electronic component is located in the accommodating space and contacts the heat conductive block, and another portion protrudes from the opening.

18. The circuit board of claim 1, wherein the number of openings is two, and two of the openings are disposed opposite each other.

19. The circuit board of claim 18, wherein opposite ends of said electronic component extend from two of said openings so as to be located on opposite sides of said first thermally conductive portion.

20. An electronic device comprising a housing, wherein the electronic device further comprises a circuit board according to any one of claims 1 to 19, the circuit board being disposed in the housing.