CN117524889A - 一种采用类环氧树脂进行热塑封生产工艺 - Google Patents
一种采用类环氧树脂进行热塑封生产工艺 Download PDFInfo
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 title claims abstract description 16
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 14
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000001746 injection moulding Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 13
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 13
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 10
- 229920006119 nylon 10T Polymers 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 4
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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Abstract
本发明公开了一种采用类环氧树脂进行热塑封生产工艺,其工艺步骤是:步骤一、材料冲压;步骤二、电镀;步骤三、注塑成型;步骤四、固晶焊线;步骤五、烘烤;步骤六、点胶密封;步骤七、落粒。步骤三注塑成型时,注塑用类环氧树脂采用陶瓷改性材料,其各组成成分比例为二氧化锆35%‑45%;钛白粉10%‑20%;PA10T树脂30%‑50%;助剂2%‑5%。本发明的有益效果:(1)采用本发明的工艺封装效率至少提升一倍以上,极大的提高了生产效率;(2)由于添加了二氧化锆和钛白粉,耐温在300℃至360℃,做出的产品功率可以更高;(3)相对于全塑胶壳体,采用二氧化锆、钛白粉和PA10T树脂的组合,导热更快。
Description
技术领域
本发明涉及热塑封技术领域,具体涉及一种采用类环氧树脂进行热塑封生产工艺。
背景技术
传统的模压封装,其工艺步骤是:步骤一、材料冲压;步骤二、电镀;步骤三、固晶焊线;步骤四、烘烤;步骤五、模压成型;步骤六、电镀;步骤七、切角;步骤八、落粒;其封装速度慢,效率低,且耐温低(耐温在260℃-320℃),导致做出的产品功率较低,且胶料散热慢。
发明内容
本发明的目的在于提供一种采用类环氧树脂进行热塑封生产工艺,解决了现有技术封装速度慢,封装效率低,制造出的产品功率较低,且胶料散热慢的问题。
本发明的目的可以通过以下技术方案实现:
一种采用类环氧树脂进行热塑封生产工艺,具体包括如下步骤:
步骤一、材料冲压;
步骤二、电镀;
步骤三、注塑成型;
步骤四、固晶焊线;
步骤五、烘烤;
步骤六、点胶密封;
步骤七、落粒;
步骤三注塑成型时,注塑用类环氧树脂采用陶瓷改性材料,其各组成成分比例为:
二氧化锆35%-45%;
钛白粉10%-20%;
PA10T树脂30%-50%;
助剂2%-5%。
本发明中,步骤六在顶部点胶密封。
本发明中,助剂包括抗氧剂、润滑剂和粘合剂。
本发明的有益效果:
(1)采用本发明的工艺对电子元器件(包括LED灯)等的封装效率至少提升一倍以上,极大的提高了生产效率;
(2)由于添加了二氧化锆和钛白粉,耐温在300℃至360℃,做出的产品功率可以更高;
(3)相对于全塑胶壳体,采用二氧化锆、钛白粉和PA10T树脂的组合,导热更快。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
实施例1
一种采用类环氧树脂进行热塑封生产工艺,其包括如下步骤:
步骤一、材料冲压;
步骤二、电镀;
步骤三、注塑成型;
步骤四、固晶焊线;
步骤五、烘烤;
步骤六、点胶密封;
步骤七、落粒;
步骤三注塑成型时,注塑用类环氧树脂采用陶瓷改性材料,其各组成成分比例为:
二氧化锆45%;
钛白粉20%;
PA10T树脂30%;
助剂5%。
本发明的注塑成型在固晶焊线之前,由于提前将类环氧树脂(陶瓷改性材料)与材料进行固定便于后续操作,且采用陶瓷改性材料可以极大的提升成型效率,整体上使得电子元器件等的封装效率至少提升一倍以上。同时,由于添加了二氧化锆和钛白粉,耐温在300℃至360℃,做出的产品功率可以更高。另外,相对于全塑胶壳体,采用二氧化锆、钛白粉和PA10T树脂的组合,导热更快。本发明采用热塑成型工艺,相对于传统工艺减少了切角工序,且一次电镀即可,避免了传统二次电镀的麻烦,精简了工艺流程。
本发明的类环氧树脂,其冷藏保存,解冻后24小时内使用均可,保持有效性时间长。
本发明中,在电子元器件(如LED灯)等顶部点胶密封。
本发明中,助剂包括抗氧剂、润滑剂和粘合剂。
实施例2
一种采用类环氧树脂进行热塑封生产工艺,其包括如下步骤:
步骤一、材料冲压;
步骤二、电镀;
步骤三、注塑成型;
步骤四、固晶焊线;
步骤五、烘烤;
步骤六、点胶密封;
步骤七、落粒;
步骤三注塑成型时,注塑用类环氧树脂采用陶瓷改性材料,其各组成成分比例为:
二氧化锆40%;
钛白粉10%;
PA10T树脂45%;
助剂5%。
以上内容仅仅是对本发明的构思所作的举例和说明,所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离发明的构思或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。
Claims (5)
1.一种采用类环氧树脂进行热塑封生产工艺,其特征在于:生产工艺步骤为,
步骤一、材料冲压;
步骤二、电镀;
步骤三、注塑成型;
步骤四、固晶焊线;
步骤五、烘烤;
步骤六、点胶密封;
步骤七、落粒;
步骤三注塑成型时,注塑用类环氧树脂采用陶瓷改性材料,其各组成成分比例为,二氧化锆35%-45%;钛白粉10%-20%;PA10T树脂30%-50%;助剂2%-5%。
2.根据权利要求1所述的一种采用类环氧树脂进行热塑封生产工艺,其特征在于:注塑用类环氧树脂各组成成分比例为,二氧化锆35%-45%;钛白粉10%-20%;PA10T树脂30%-50%;助剂2%-5%。
3.根据权利要求1所述的一种采用类环氧树脂进行热塑封生产工艺,其特征在于:注塑用类环氧树脂各组成成分比例为,二氧化锆40%;钛白粉10%;PA10T树脂45%;助剂5%。
4.根据权利要求1所述的一种采用类环氧树脂进行热塑封生产工艺,其特征在于:助剂包括抗氧剂、润滑剂和粘合剂。
5.根据权利要求1所述的一种采用类环氧树脂进行热塑封生产工艺,其特征在于:步骤六在顶部点胶密封。
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