CN117517729A - High-low temperature test board assembly and test system for multipath optical coupler device - Google Patents
High-low temperature test board assembly and test system for multipath optical coupler device Download PDFInfo
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- CN117517729A CN117517729A CN202311573294.2A CN202311573294A CN117517729A CN 117517729 A CN117517729 A CN 117517729A CN 202311573294 A CN202311573294 A CN 202311573294A CN 117517729 A CN117517729 A CN 117517729A
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- 238000001514 detection method Methods 0.000 claims description 89
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/206—Switches for connection of measuring instruments or electric motors to measuring loads
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention relates to a high-low temperature test board assembly of a multipath optical coupler device and a test system, comprising an optical coupler connecting board for connecting a plurality of optical coupler devices to be tested, a connection control board for selecting one optical coupler device to be tested from the plurality of optical coupler devices to be tested to be electrically connected with a test instrument, and an electric connection connecting cable for realizing the optical coupler connecting board and the connection control board. According to the invention, the to-be-tested optocoupler devices can be sequentially switched under the condition of not interrupting the work of the testing instrument by arranging the connection control board, so that the time for testing all the to-be-tested optocoupler devices on the optocoupler connection board is saved; the optical coupler is simple in structure, convenient to manufacture, low in economic cost and suitable for testing a small number of optical coupler devices.
Description
Technical Field
The invention belongs to the technical field of testing of optical coupler devices, and relates to a high-low temperature testing board assembly and a testing system of a multipath optical coupler device.
Background
In the production process of the optocoupler device, because of the difference between chip batches or the comparison between abnormal devices and normal devices, there is a need to compare and test a small number of devices (for example, 2 to 10 devices) under the same test condition. The existing high-low temperature test methods for a plurality of optocoupler devices are mainly two.
The first method is manual wire bonding or PCB single-device testing, which is divided into multiple tests. The defects are that:
the method due to the high and low temperatures is typically incubator control. In order to ensure the temperature of the device, the temperature of the device can be ensured to reach the set temperature of the temperature box after at least 30 minutes of switching the temperature box each time. To shorten the test time, multiple sets of test fixtures are typically placed into the incubator at the same time. And by marking the name of the outgoing line, the wiring form is manually switched every time of test. Therefore, the test method has low test efficiency, and only one device can be tested at a time; the lead wires are numerous, the possibility of error is high when changing each time, and the device is difficult to check in the incubator, and the device is easy to damage.
The second method is a high-speed automatic switching test using a solid state relay. The defects are that:
because the solid state relay has higher cost and complex system, special test program and computer are usually needed to be matched for testing. This test method is advantageous because of its high efficiency if the number of devices is large. However, if only a few devices are tested, a lot of time and economic cost are consumed due to the need of program debugging and specialized equipment, software matching, etc.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to solve the technical problems that: a multi-path optocoupler high-low temperature test board assembly and a test system are provided.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a high-low temperature test board assembly for multi-path optocoupler device comprises
The optical coupler connecting plate is used for connecting a plurality of optical coupler devices to be tested;
the connection control board is provided with a test interface for connecting a test instrument and is used for selecting one optocoupler device to be tested from a plurality of optocoupler devices to be tested to be electrically connected with the test interface; and
and the connecting cable is used for realizing the electric connection between the optical coupling connecting plate and the connecting control board.
Further, a first connecting seat is arranged on the optocoupler connecting plate, and a second connecting seat is arranged on the connecting control plate; when the optical coupler connecting plate and the connection control board are required to be connected, the first end of the connecting cable is connected with the first connecting seat, and the second end of the connecting cable is connected with the second connecting seat, so that the connecting terminal of the first connecting seat is electrically connected with the connecting terminal of the second connecting seat through the connecting cable.
Further, the connecting cable is a flat cable with a plurality of wires, and the number of wires in the flat cable, the number of connecting terminals of the first connecting seat and the number of connecting terminals of the second connecting seat are all the same.
Further, the optical coupling connecting plate is provided with a plurality of chip sockets for installing optical coupling devices, the first connecting seat is provided with a first input signal end and a first output power supply end corresponding to each chip socket respectively, and the first connecting seat is also provided with a first input detection end and a first output detection end;
the pin of the output positive end of the chip socket corresponding to the optocoupler device is electrically connected with a first output power supply end of the first connecting seat respectively; and pins of the chip sockets corresponding to the input negative terminals of the optocoupler devices are electrically connected with the first input detection ends of the first connecting seats, and pins of the chip sockets corresponding to the output negative terminals of the optocoupler devices are electrically connected with the first output detection ends of the first connecting seats.
Further, each first input signal end of the second connecting seat corresponding to the first connecting seat is provided with a second input signal end respectively, each first output power supply end of the second connecting seat corresponding to the first connecting seat is provided with a second output power supply end respectively, and the first input detection end and the first output detection end of the second connecting seat corresponding to the first connecting seat are provided with a second input detection end and a second output detection end respectively;
each first input signal end of the first connecting seat is electrically connected with a corresponding second input signal end on the second connecting seat through a connecting cable, and each first output power supply end of the first connecting seat is electrically connected with a corresponding second output power supply end on the second connecting seat through a connecting cable; the first input detection end of first connecting seat is connected with the second input detection end electricity on the second connecting seat through connecting cable, the first output detection end of first connecting seat is connected with the second output detection end electricity on the second connecting seat through connecting cable.
Further, the connection control board is provided with a plurality of physical switches, and the test interface of the connection control board comprises an input signal interface, an output power supply interface, an input detection interface and an output detection interface; each second input signal end of the second connecting seat is electrically connected with the input signal interface through a physical switch respectively, and each second output power supply end of the second connecting seat is electrically connected with the output power supply interface through a physical switch; the input detection end of the second connecting seat is electrically connected with the input detection interface, and the input detection end of the second connecting seat is grounded through a first resistor; the output detection end of the second connecting seat is electrically connected with the output detection interface, and the output detection end of the second connecting seat is grounded through a second resistor.
Further, the physical switch is a multi-way switch with at least two ways of switch control channels, and the multi-way switch corresponds to the chip socket one by one; the multi-way switch is provided with a first input end, a first output end, a second input end and a second output end, wherein the first output end is used for forming a switch control channel with the first input end; the first input ends of the multiple switches are electrically connected with the input signal interface, and the first output ends of the multiple switches are electrically connected with a second input signal end of the second connecting seat respectively; the second input ends of the multiple switches are electrically connected with the output power supply interface, and the second output ends of the multiple switches are electrically connected with a second output power supply end of the second connecting seat.
Furthermore, the input signal interface, the output power supply interface, the input detection interface and the output detection interface are all SMA interfaces.
The utility model provides a multichannel opto-coupler device high low temperature test system, includes high low temperature box, signal generator, DC power supply, oscilloscope and multichannel opto-coupler device high low temperature test board subassembly, the first end of connecting cable is located high low temperature box inside, and the second end is located high low temperature box outside, signal generator, DC power supply, oscilloscope are connected with the corresponding test interface electricity of connection control panel respectively.
Furthermore, the oscilloscope is a dual-channel oscilloscope, the test interface of the connection control board comprises an input signal interface, an output power supply interface, an input detection interface and an output detection interface, the input signal interface of the connection control board is electrically connected with the signal generator, the output power supply interface is electrically connected with the direct-current power supply, and the input detection interface and the output detection interface are respectively connected with two test ports of the oscilloscope.
According to the invention, the connecting control board is arranged outside the high-low temperature box, so that the connected optocoupler devices to be tested can be sequentially switched under the condition of not interrupting the work of the testing instrument, and the testing of all the optocoupler devices to be tested on the optocoupler connecting board 11 is completed, so that the testing time is saved. Because the multi-way switch on the connection control board is a physical switch, the operation can be performed manually, professional control equipment is not needed, program debugging is not needed to be performed on software, the structure is simple, the manufacture is convenient, the economic cost is low, and the device is suitable for testing a small number of optocoupler devices.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a circuit diagram of an optocoupler test.
Fig. 2 is a schematic structural view of a preferred embodiment of the high and low temperature test board assembly of the multiple optocoupler of the present invention.
Fig. 3 is a wiring diagram of an optocoupler connection board in one embodiment.
Fig. 4 is a wiring diagram of the connection control board in one embodiment.
FIG. 5 is a schematic diagram of a high and low temperature test system for multiple optocouplers according to a preferred embodiment of the invention.
The meaning of the reference numerals in the drawings are:
an optocoupler connecting plate-11; connecting a control panel-12; a connection cable-13; high-low temperature box-20; a signal generator-30; an input signal cable-31; -40 dc power supply; a DC cable-41; oscilloscopes-50; test signal cables-51, 52;
chip sockets-P1 to P10; multiple switches-K1-K10; a first connection base-J1; a second connecting seat-J2; a first resistor-R1; a second resistor-R2; an input signal interface-signalinput; output power supply interface-output source; input of an input detection interface; output detection interface-output.
Detailed Description
The following description of the embodiments of the invention is given by way of specific examples, the illustrations provided in the following examples merely illustrate the basic idea of the invention, and the following examples and features of the examples can be combined with one another without conflict.
Referring to fig. 1, when the optocoupler U1 performs a test, its input positive terminal (i.e., pin 1 of U1) is connected to a test signal Vi n, which is generally generated by a signal generator; the input negative terminal (namely the 2 pin of U1) is grounded through a resistor, and the voltage of the input negative terminal can be divided through the resistor so as to be convenient for collecting signals for testing; the output positive end (namely 3 pins of U1) is connected with a direct current supply voltage VCC, and the direct current supply voltage VCC is generally provided by a direct current stabilized power supply; the negative output end (namely the 4 pins of U1) is grounded through a resistor, and the voltage of the second output end can be divided through the resistor so as to collect signals for testing.
Referring to fig. 2, the invention discloses a multi-path optocoupler device high-low temperature test board assembly. A preferred embodiment of the multi-path optocoupler device high and low temperature test board assembly of the present invention includes an optocoupler connection board 11, a connection control board 12, and a connection cable 13. The optocoupler connection board 11 is used for connecting a plurality of optocoupler devices (not shown in the figure) to be tested. The connection control board 12 is provided with a test interface for connecting with a test instrument, and is used for selecting one optocoupler to be tested from a plurality of optocouplers to be tested to be electrically connected with the test interface, so that the optocoupler to be tested is electrically connected with the test instrument. The connection cable 13 is used for electrically connecting the optocoupler connection board 11 and the connection control board 12. Through setting up opto-coupler connecting plate 11 and connection control board 12, can put into the high low temperature case with the opto-coupler connecting plate 11 that is connected with a plurality of opto-coupler devices that await measuring when the test to be connected with the outside connection control board 12 of high low temperature case through connecting cable 13, thereby need not open the high low temperature case, can switch the relation of connection of a plurality of opto-coupler devices that await measuring in the high low temperature case through connection control board 12, accomplish the test of each opto-coupler device that awaits measuring in proper order.
In order to facilitate connection and disconnection between the optocoupler connection board 11 and the connection control board 12, in this embodiment, a first connection seat J1 is disposed on the optocoupler connection board 11, and a second connection seat J2 is disposed on the connection control board 12. When the optocoupler connection board 11 and the connection control board 12 need to be connected together, the first end of the connection cable 13 is connected with the first connection socket J1, and the second end is connected with the second connection socket J2, so that the connection terminal of the first connection socket J1 is electrically connected with the connection terminal of the second connection socket J2 through the connection cable 13. When the connection between the optocoupler connection board 11 and the connection control board 12 is required to be disconnected, the first end of the connection cable 13 is pulled out of the first connection seat J1, and the second end is pulled out of the second connection seat J2. The connection cable 13 is a flat cable with a plurality of wires, and in general, the number of wires in the flat cable, the number of connection terminals of the first connection socket J1, and the number of connection terminals of the second connection socket J2 are all the same.
In order to facilitate connection and removal of the optocoupler to be tested on the optocoupler connection board 11, a plurality of chip sockets for mounting the optocoupler are disposed on the optocoupler connection board 11, in this embodiment, 10 chip sockets, namely, chip sockets P1 to P10, are disposed on the optocoupler connection board 11. The first connection seat J1 is provided with 10 first input signal ends and 10 first output power supply ends corresponding to the chip sockets P1 to P10. The first connecting seat J1 is further provided with a first input detection end and a first output detection end, in this embodiment, 2 first input detection ends and 2 first output detection ends are disposed on the first connecting seat J1, and the 2 first input detection ends are electrically connected with each other, and the 2 first output detection ends are electrically connected with each other.
The number of pins of the chip sockets (P1-P10) should be not less than that of the optocoupler, and in this embodiment, in order to adapt to the test of multiple optocouplers, the chip sockets (P1-P10) adopt 32-pin chip sockets. The 1 pin of the chip socket (P1-P10) is used for connecting the input positive end of the optocoupler (namely the 1 pin of the optocoupler), the 2 pin of the chip socket (P1-P10) is used for connecting the input negative end of the optocoupler (namely the 2 pin of the optocoupler), the 32 pin of the chip socket (P1-P10) is used for connecting the output positive end of the optocoupler (namely the 3 pin of the optocoupler), and the 31 pin of the chip socket (P1-P10) is used for connecting the output negative end of the optocoupler (namely the 4 pin of the optocoupler).
The 1 pins of the chip sockets P1 to P10 (i.e. pins corresponding to the input positive end of the optocoupler device) are respectively and electrically connected with 10 first input signal ends of the first connecting seat J1; the 3 pins of the chip sockets P1 to P10 (i.e. pins corresponding to the output positive ends of the optocoupler device) are respectively and electrically connected with 10 first output power supply ends of the first connecting seat J1. The pins 2 of the chip sockets P1-P10 (i.e. pins corresponding to the input negative terminal of the optocoupler) are electrically connected with each other and then electrically connected with the first input detection end of the first connecting seat J1; the 4 pins (i.e. pins corresponding to the output negative terminal of the optocoupler) of the chip sockets P1-P10 are electrically connected with each other and then electrically connected with the first output detection terminal of the first connection seat J1.
The second connecting seat J2 is provided with 10 second input signal ends corresponding to 10 first input signal ends of the first connecting seat J1; the second connecting seat J2 is provided with 10 second output power supply ends corresponding to 10 first output power supply ends of the first connecting seat J1. The second connecting seat J2 is provided with 2 second input detection ends corresponding to 2 first input detection ends of the first connecting seat J1, and the 2 second input detection ends are electrically connected with each other. The second connecting seat J2 is provided with 2 second output detection ends corresponding to 2 first output detection ends of the first connecting seat J1 respectively, and the 2 second output detection ends are mutually and electrically connected.
The 10 first input signal ends of the first connecting seat J1 are respectively and correspondingly electrically connected with the 10 second input signal ends on the second connecting seat J2 one by one through connecting cables 13; the 10 first output power supply ends of the first connecting seat J1 are respectively and electrically connected with the 10 second output power supply ends of the second connecting seat J2 in one-to-one correspondence through connecting cables 13. The 2 first input detection ends of the first connecting seat J1 are respectively and correspondingly electrically connected with the 2 second input detection ends on the second connecting seat J2 one by one through connecting cables 13; the 2 first output detection ends of the first connecting seat J1 are respectively and electrically connected with the 2 second output detection ends on the second connecting seat J2 in a one-to-one correspondence manner through connecting cables 13.
The connection control board 12 is provided with a plurality of physical switches (i.e. manually controlled switches), and the test interface of the connection control board 12 comprises an input signal interface singalinput, an output power supply interface output source, an input detection interface input and an output detection interface output; the input signal interface singallinput, the output power supply interface output source, the input detection interface input and the output detection interface output can all adopt SMA interfaces. The input signal interface singallinuut is used for accessing a test signal Vin, the output power supply interface outputsource is used for accessing a direct current power supply voltage VCC, the input detection interface input is used for detecting signals of an input negative terminal of an optical coupler to be detected, and the output detection interface output is used for detecting signals of an output negative terminal of the optical coupler to be detected. The 10 second input signal ends of the second connecting seat J2 are respectively and electrically connected with the input signal interface singalinput through a physical switch, and the 10 second output power supply ends of the second connecting seat J2 are respectively and electrically connected with the output power supply interface outputsource through a physical switch. The input detection end of the second connecting seat J2 is electrically connected with the input detection interface input, and the input detection end of the second connecting seat J2 is grounded through a first resistor R1; the output detection end of the second connection seat J2 is electrically connected with the output detection interface output, and the output detection end of the second connection seat J2 is grounded through a second resistor R2.
In this embodiment, the physical switch is a multi-way switch having at least two switch control channels, and the connection control board 12 is provided with 10 multi-way switches K1 to K10, where the multi-way switches K1 to K10 are in one-to-one correspondence with the chip sockets P1 to P10. The 3 pins of the multi-way switch (K1-K10) are the first input end, the 5 pins are the first output end forming a switch control channel with the first input end, the 4 pins are the second input end, and the 6 pins are the second output end forming a switch control channel with the second input end. The 3 pins of the multi-way switches K1 to K10 are electrically connected with the input signal interface sigalinput after being electrically connected with each other; and pins 5 of the multi-way switches K1 to K10 are respectively and electrically connected with 10 second input signal ends of the second connecting seat J2. The 4 pins of the multi-way switch K1-the multi-way switch K10 are electrically connected with the output power supply interface output power after being mutually electrically connected, and the 6 pins of the multi-way switch K1-the multi-way switch K10 are respectively electrically connected with the 10 second output power supply ends of the second connecting seat J2.
Referring to fig. 3 and fig. 4, the wiring diagrams of the optocoupler connection board 11 and the connection control board 12 are respectively shown, and it should be noted that the optocoupler connection board 11 and the connection control board 12 both adopt two layers of wiring, and the two wirings at the intersection in the drawing are not in the same layer, i.e. the two wirings at the intersection position are not directly electrically connected.
Referring to fig. 5, the invention also discloses a high-low temperature test system for the multi-path optocoupler device. A preferred embodiment of the multi-path optocoupler high and low temperature test system of the present invention includes a high and low temperature box 20, a signal generator 30, a dc power supply 40, an oscilloscope 50, and a multi-path optocoupler high and low temperature test board assembly according to any of the above embodiments. The oscilloscope 50 is typically a dual channel oscilloscope. The first end of the connecting cable 13 is located inside the high-low temperature box 20, and the second end is located outside the high-low temperature box 20. The signal generator 30, the direct current power supply 40 and the oscilloscope 50 are respectively and electrically connected with the corresponding test interfaces of the connection control board 12; specifically, the input signal interface singallinput of the connection control board 12 is electrically connected with the signal generator 30, the output power supply interface outputsource is electrically connected with the dc power supply 40, and the input detection interface input and the output detection interface output are respectively connected with two test ports of the oscilloscope 50.
The working principle of this embodiment is as follows:
referring to fig. 1 to 5, when testing is required, firstly, 10 optocoupler devices to be tested are respectively mounted on the chip sockets P1 to P10 of the optocoupler connection board 11, so that the 1 pins of the 10 optocoupler devices to be tested are respectively connected with the 1 pins of the chip sockets P1 to P10, the 2 pins of the 10 optocoupler devices to be tested are respectively connected with the 2 pins of the chip sockets P1 to P10, the 3 pins of the 10 optocoupler devices to be tested are respectively connected with the 32 pins of the chip sockets P1 to P10, and the 4 pins of the 10 optocoupler devices to be tested are respectively connected with the 31 pins of the chip sockets P1 to P10. Then, the high-low temperature box 20 is opened, the optocoupler connection plate 11 is placed inside the high-low temperature box 20, and the first end of the connection cable 13 is connected with the first connection seat J1 of the optocoupler connection plate 11. Thereafter, the high-low temperature box 20 is closed, the second end of the connection cable 13 is connected to the second connection seat J2 of the connection control board 12, the signal generator 30 is connected to the input signal interface signalinput of the connection control board 12 through the input signal cable 31, the direct current power supply 40 is connected to the output power supply interface output of the connection control board 12 through the direct current cable 41, and the two test ports of the oscilloscope 50 are connected to the input detection interface input and the output detection interface output of the connection control board 12 through the test signal cable 51 and the test signal cable 52, respectively, and connected thereto.
Before testing, the switch control channels of the multi-way switches K1 to K10 are disconnected. And then, starting the high-low temperature box 20 to work, setting the temperature of the high-low temperature box 20, and after the temperature of the optical coupler device to be tested and the temperature of the temperature box are consistent, closing two switch control channels of the multi-way switch K1, testing the optical coupler device to be tested mounted on the chip socket P1, and after the test is completed, disconnecting the two switch control channels of the multi-way switch K1, thus completing the test of one optical coupler device. And then, repeating the steps, and sequentially closing two switch control channels of the multi-way switches K2-K10, so that the optocoupler devices to be tested mounted on the chip sockets P2-P10 can be tested, and the test of 10 optocoupler devices to be tested can be completed without reconnecting test equipment.
In this embodiment, by arranging the connection control board 12 outside the high-low temperature box 20, the connected optocoupler devices to be tested can be sequentially switched under the condition of not interrupting the operation of the test instruments such as the high-low temperature box 20, so as to complete the test of all the optocoupler devices to be tested on the optocoupler connection board 11, and save the test time. Because the multi-way switch on the connection control board 12 is a physical switch, the operation can be performed manually, professional control equipment is not needed, program debugging is not needed to be performed on software, the structure is simple, the manufacture is convenient, the economic cost is low, and the device is suitable for testing a small number of optocoupler devices.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the claims of the present invention.
Claims (10)
1. A multichannel opto-coupler device high-low temperature test board subassembly, its characterized in that: comprising
The optical coupler connecting plate is used for connecting a plurality of optical coupler devices to be tested;
the connection control board is provided with a test interface for connecting a test instrument and is used for selecting one optocoupler device to be tested from a plurality of optocoupler devices to be tested to be electrically connected with the test interface; and
and the connecting cable is used for realizing the electric connection between the optical coupling connecting plate and the connecting control board.
2. The multi-channel optocoupler high and low temperature test board assembly of claim 1, wherein: the optical coupler connecting plate is provided with a first connecting seat, and the connecting control board is provided with a second connecting seat; when the optical coupler connecting plate and the connection control board are required to be connected, the first end of the connecting cable is connected with the first connecting seat, and the second end of the connecting cable is connected with the second connecting seat, so that the connecting terminal of the first connecting seat is electrically connected with the connecting terminal of the second connecting seat through the connecting cable.
3. The multi-channel optocoupler high and low temperature test board assembly of claim 2, wherein: the connecting cable is a flat cable with a plurality of wires, and the number of wires in the flat cable, the number of connecting terminals of the first connecting seat and the number of connecting terminals of the second connecting seat are all the same.
4. The multi-channel optocoupler high and low temperature test board assembly of claim 2, wherein: the optical coupler comprises an optical coupler connecting plate, a first connecting seat, a second connecting seat, a first output power supply end, a second input detection end, a first output detection end and a second output detection end, wherein the optical coupler connecting plate is provided with a plurality of chip sockets for installing optical coupler devices;
the pin of the output positive end of the chip socket corresponding to the optocoupler device is electrically connected with a first output power supply end of the first connecting seat respectively; and pins of the chip sockets corresponding to the input negative terminals of the optocoupler devices are electrically connected with the first input detection ends of the first connecting seats, and pins of the chip sockets corresponding to the output negative terminals of the optocoupler devices are electrically connected with the first output detection ends of the first connecting seats.
5. The multi-channel optocoupler high and low temperature test board assembly of claim 4, wherein: each first input signal end of the second connecting seat corresponding to the first connecting seat is provided with a second input signal end respectively, each first output power supply end of the second connecting seat corresponding to the first connecting seat is provided with a second output power supply end respectively, and each first input detection end and each first output detection end of the second connecting seat corresponding to the first connecting seat are provided with a second input detection end and a second output detection end respectively;
each first input signal end of the first connecting seat is electrically connected with a corresponding second input signal end on the second connecting seat through a connecting cable, and each first output power supply end of the first connecting seat is electrically connected with a corresponding second output power supply end on the second connecting seat through a connecting cable; the first input detection end of first connecting seat is connected with the second input detection end electricity on the second connecting seat through connecting cable, the first output detection end of first connecting seat is connected with the second output detection end electricity on the second connecting seat through connecting cable.
6. The multi-channel optocoupler high and low temperature test board assembly of claim 5, wherein: the test interface of the connection control board comprises an input signal interface, an output power supply interface, an input detection interface and an output detection interface; each second input signal end of the second connecting seat is electrically connected with the input signal interface through a physical switch respectively, and each second output power supply end of the second connecting seat is electrically connected with the output power supply interface through a physical switch; the input detection end of the second connecting seat is electrically connected with the input detection interface, and the input detection end of the second connecting seat is grounded through a first resistor; the output detection end of the second connecting seat is electrically connected with the output detection interface, and the output detection end of the second connecting seat is grounded through a second resistor.
7. The multi-channel optocoupler high and low temperature test board assembly of claim 6, wherein: the physical switch is a multi-way switch with at least two ways of switch control channels, and the multi-way switch corresponds to the chip socket one by one; the multi-way switch is provided with a first input end, a first output end, a second input end and a second output end, wherein the first output end is used for forming a switch control channel with the first input end; the first input ends of the multiple switches are electrically connected with the input signal interface, and the first output ends of the multiple switches are electrically connected with a second input signal end of the second connecting seat respectively; the second input ends of the multiple switches are electrically connected with the output power supply interface, and the second output ends of the multiple switches are electrically connected with a second output power supply end of the second connecting seat.
8. The multi-channel optocoupler high and low temperature test board assembly of claim 6, wherein: the input signal interface, the output power supply interface, the input detection interface and the output detection interface are all SMA interfaces.
9. A high-low temperature test system of a multipath optical coupler device is characterized in that: the high-low temperature test board assembly comprises a high-low temperature box, a signal generator, a direct-current power supply, an oscilloscope and the multi-path optical coupler device high-low temperature test board assembly according to any one of claims 1-8, wherein the first end of the connecting cable is positioned inside the high-low temperature box, the second end of the connecting cable is positioned outside the high-low temperature box, and the signal generator, the direct-current power supply and the oscilloscope are respectively and electrically connected with corresponding test interfaces of the connecting control board.
10. The multi-channel optocoupler high and low temperature test system of claim 9, wherein: the oscilloscope is a dual-channel oscilloscope, the test interface of the connection control board comprises an input signal interface, an output power supply interface, an input detection interface and an output detection interface, the input signal interface of the connection control board is electrically connected with the signal generator, the output power supply interface is electrically connected with the direct-current power supply, and the input detection interface and the output detection interface are respectively connected with two test ports of the oscilloscope.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311573294.2A CN117517729A (en) | 2023-11-23 | 2023-11-23 | High-low temperature test board assembly and test system for multipath optical coupler device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311573294.2A CN117517729A (en) | 2023-11-23 | 2023-11-23 | High-low temperature test board assembly and test system for multipath optical coupler device |
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| CN117517729A true CN117517729A (en) | 2024-02-06 |
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|---|---|---|---|
| CN202311573294.2A Pending CN117517729A (en) | 2023-11-23 | 2023-11-23 | High-low temperature test board assembly and test system for multipath optical coupler device |
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| Country | Link |
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| CN (1) | CN117517729A (en) |
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