CN117497462B - Automatic packaging device for accurately positioning integrated circuit - Google Patents
Automatic packaging device for accurately positioning integrated circuit Download PDFInfo
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- CN117497462B CN117497462B CN202311847063.6A CN202311847063A CN117497462B CN 117497462 B CN117497462 B CN 117497462B CN 202311847063 A CN202311847063 A CN 202311847063A CN 117497462 B CN117497462 B CN 117497462B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 230000005540 biological transmission Effects 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 15
- 230000007306 turnover Effects 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 17
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
Abstract
The invention relates to the technical field of integrated circuit packaging, and discloses an automatic packaging device for accurately positioning an integrated circuit, which comprises a packaging table, a feeding mechanism and a carrier plate positioning mechanism; the feeding mechanism comprises a limit feeding rail, the cross section of the limit feeding rail is U-shaped, the width of the limit feeding rail is equal to that of the carrier plate, and the patch surface of the carrier plate contacts with the limit feeding rail to carry out feeding conveying; the carrier plate positioning mechanism comprises a positioning bottom plate, a plurality of pin holes are formed in the positioning bottom plate, the pin holes correspond to pins on the carrier plate one by one, positioning side plates are fixed on two sides of the top surface of the positioning bottom plate, one end of the positioning bottom plate, which is far away from a limiting feeding track, is fixed with a positioning end plate, the distance between the two positioning side plates is equal to the width of the carrier plate, the height of the positioning side plates is smaller than the thickness of the carrier plate, and the length of the positioning bottom plate is equal to the length of the carrier plate. The feeding precision is higher, pins cannot be damaged in the loading process of the carrier plate, the defective rate is reduced, and the packaging quality is improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to an automatic packaging device for accurately positioning an integrated circuit.
Background
An integrated circuit is a type of microelectronic device or component. The components such as transistors, resistors, capacitors, inductors and the like and wiring needed in a circuit are interconnected together by a certain process and are manufactured on a small or several small semiconductor wafers or dielectric substrates. The packaging of an integrated circuit is a process of assembling the integrated circuit into a chip end product, in short, the produced integrated circuit bare chip is placed on a carrier plate with bearing function, pins of the integrated circuit are led out from the side wall of the carrier plate, and finally, a patch cover plate is arranged on the carrier plate to complete the packaging. The packaging device is used for packaging integrated circuits in production, and the current packaging device has the following disadvantages: firstly, the conveying and feeding of the carrier plate is carried out in a manner that the pins are downwards, and although the cover plate is conveniently and directly attached to the top surface of the carrier plate, the pins are soft in material, and in the conveying process, the pins continuously contact the conveying surface, so that the pins are easily deflected or broken, and more defective products are caused; secondly, the loading accuracy of carrier plate is not high, and the carrier plate material loading can appear the skew condition after the paster station, leads to appearing the skew condition of paster between apron and the carrier plate, has reduced encapsulation quality.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides an automatic packaging device for accurately positioning an integrated circuit, has higher feeding precision, and can not damage pins in the feeding process of a carrier plate, thereby reducing the defective rate and improving the packaging quality.
The aim of the invention is realized by the following technical scheme: the automatic packaging device for accurately positioning the integrated circuit comprises a packaging table, a feeding mechanism, a carrier plate positioning mechanism, a carrier plate turnover mechanism and a patch packaging mechanism, wherein the carrier plate positioning mechanism is positioned between the feeding mechanism and the patch packaging mechanism, and the carrier plate turnover mechanism is positioned above the carrier plate positioning mechanism;
the feeding mechanism comprises a limit feeding rail, the cross section of the limit feeding rail is U-shaped, the width of the limit feeding rail is equal to that of the carrier plate, and the patch surface of the carrier plate contacts the limit feeding rail to carry out feeding conveying;
the carrier plate positioning mechanism comprises a positioning bottom plate, positioning side plates and positioning end plates, wherein a plurality of pin holes are formed in the positioning bottom plate, the pin holes are in one-to-one correspondence with pins on the carrier plate, the positioning side plates are fixed on two sides of the top surface of the positioning bottom plate, the positioning end plates are fixed on one end of the positioning bottom plate, which is far away from the limiting feeding track, the distance between the two positioning side plates is equal to the width of the carrier plate, the height of the positioning side plates is smaller than the thickness of the carrier plate, the length of the positioning bottom plate is equal to the length of the carrier plate, the positioning bottom plate has the freedom degree of moving along the feeding direction of the carrier plate, and the positioning bottom plate has the freedom degree of moving along the height direction of the encapsulation table.
The carrier plate tilting mechanism includes roll-over stand, rotary disk and rotatory negative pressure pipe, the shape of roll-over stand is "" font, the roll-over stand has the edge the degree of freedom that encapsulation platform direction of height moved, two inside walls of roll-over stand all rotate and be provided with the rotary disk, coaxial arrangement has on the rotary disk rotatory negative pressure pipe, two rotatory negative pressure pipe acts on the middle part of carrier plate both sides wall respectively.
In some embodiments, a lower limiting plate is fixed at the bottom of the positioning bottom plate, which is close to one end of the limiting feeding rail, the surface of the lower limiting plate, which is far away from the positioning end plate, is flush with the end surface of the positioning bottom plate, an upper limiting plate is fixed at the top of the positioning bottom plate, which is close to one end of the positioning bottom plate, and the surface of the upper limiting plate, which is close to the positioning bottom plate, is flush with the end surface of the limiting feeding rail.
In some embodiments, the top of encapsulation platform is fixed with the installing frame, be equipped with the sunk part on the encapsulation platform, be provided with the linear drive module on the sunk part of encapsulation platform, vertically install the jacking cylinder on the slide of linear drive module, the telescopic shaft of jacking cylinder is connected the bottom of locating bottom plate.
In some embodiments, the lifting cylinder is installed to the interior roof of installing frame, lifting cylinder's telescopic shaft is connected the roll-over stand, the coaxial transmission shaft that is fixed with of rotary disk, the transmission shaft rotates to wear to establish on the roll-over stand, the rotation is provided with the main shaft in the roll-over stand, be provided with the drive chamber between the interior lateral wall of roll-over stand, the drive intracavity is provided with gear wheel and pinion, the pinion suit is in on the main shaft, the gear wheel suit is in on the transmission shaft, the pinion meshing the gear wheel, the steering wheel is installed to the lateral wall of roll-over stand, the output shaft transmission of steering wheel is connected the main shaft.
In some embodiments, a positioning disc is arranged in the driving cavity, the positioning disc is fixedly sleeved on the transmission shaft, two positioning taper holes are formed in the positioning disc, the two positioning taper holes are symmetrically formed in the circle center of the positioning disc, the roll-over stand is provided with a positioning groove on the side wall of the driving cavity, a positioning taper rod is slidably arranged in the positioning groove, an electromagnet is arranged in the positioning groove, one end, close to the electromagnet, of the positioning taper rod is provided with an iron block, a spring is arranged between the iron block and the electromagnet, two ends of the spring are respectively connected with the positioning taper rod and the roll-over stand, and when the spring is in a normal state, the positioning taper rod is matched with one of the positioning taper holes.
In some embodiments, the rotary negative pressure tube comprises a negative pressure tube and a telescopic tube, one end of the telescopic tube is coaxially connected with the rotary disk, the other end of the telescopic tube is coaxially connected with the negative pressure tube, a return spring is sleeved on the telescopic tube, two ends of the return spring respectively abut against the negative pressure tube and the rotary disk, one end, far away from the telescopic tube, of the negative pressure tube is conical, and the side wall of the negative pressure tube is connected with the vacuum pump through a pipeline.
In some embodiments, the patch packaging mechanism comprises a transverse screw linear module, a longitudinal screw linear module and a vertical screw linear module, wherein the transverse screw linear module is installed on the inner top wall of the installation frame, the longitudinal screw linear module is installed on a sliding seat of the transverse screw linear module, the sliding seat of the longitudinal screw linear module is connected with an L-shaped connecting block, the vertical screw linear module is connected with the L-shaped connecting block, a patch tube is vertically arranged on the sliding seat of the vertical screw linear module, the bottom of the patch tube is connected with a negative pressure sucker, and the packaging table is fixedly provided with a plurality of cover plate storage frames on the sinking parts, and the cover plates are stacked in the cover plate storage frames.
In some embodiments, a first positioning plate is fixed on the packaging table, the first positioning plate is located on the moving path of the linear driving module sliding seat, a second positioning plate and a third positioning plate are fixed on the inner top wall of the mounting frame, the second positioning plate is located on the moving path of the transverse screw linear module sliding seat, and the third positioning plate is located on the moving path of the longitudinal screw linear module sliding seat;
when the sliding seat of the linear driving module is propped against the first positioning plate, the sliding seat of the transverse screw linear module is propped against the second positioning plate, and the sliding seat of the longitudinal screw linear module is propped against the third positioning plate, the carrier plate on the positioning bottom plate is positioned under the cover plate on the negative pressure sucker.
In some embodiments, a rectangular frame is fixed on the packaging table, the limit feeding track is located between the rectangular frame and the carrier plate positioning mechanism, the rectangular frame is connected with the limit feeding track, an outlet is formed in the position, corresponding to the limit feeding track conveying channel, of the rectangular frame, pushing air cylinders are arranged on two sides of the rectangular frame, telescopic shafts of the pushing air cylinders movably penetrate into the rectangular frame and are fixedly provided with pushing plates, a plurality of standby feeding tracks are arranged between the two pushing plates, and the standby feeding tracks are sequentially connected with the limit feeding tracks.
In some embodiments, a notch is formed at one end of the rectangular frame away from the limit feeding rail, the notch is opposite to the transfer channel of the limit feeding rail, a pushing linear driving module is arranged on the inner top wall of the mounting frame, a sliding seat of the pushing linear driving module moves along the conveying direction of the carrier plate, a pushing rod is vertically fixed on the sliding seat of the pushing linear driving module, and the bottom of the pushing rod extends into the notch.
The beneficial effects of the invention are as follows:
1. the patch surface of the carrier plate is downwards contacted with the conveying surface of the limiting feeding rail to be conveyed towards the positioning bottom plate, so that pins of the carrier plate are upwards arranged, bending or breaking caused by contact of the pins with the conveying surface is avoided, the defective rate of the carrier plate is greatly reduced, and the cost is reduced.
2. After the patch of the carrier plate is conveyed downwards onto the positioning bottom plate, the positioning bottom plate moves upwards, so that the carrier plate on the positioning bottom plate is separated from the carrier plate at the rear, the mutual influence between the carrier plates is avoided, the two ends of the carrier plate on the positioning bottom plate are limited through the upper limiting plate and the positioning end plate in the ascending process of the positioning bottom plate, the carrier plate is prevented from shifting in the ascending process, the positioning bottom plate drives the lower limiting plate to move upwards, the lower limiting plate is used for blocking a discharge port of a material loading track, the situation that the carrier plate at the rear shifts is avoided, and meanwhile, the carrier plate to be packaged and the carrier plate at the rear of the carrier plate to be packaged are limited, so that the packaging and positioning of the carrier plate are more accurate, and the packaging quality of an integrated circuit is improved.
Drawings
FIG. 1 is a schematic perspective view of a stage in an automatic packaging apparatus for precisely positioning an integrated circuit according to the present invention;
FIG. 2 is a schematic diagram showing a second perspective view of a stage in an automatic packaging apparatus for precisely positioning an integrated circuit according to the present invention;
FIG. 3 is a schematic perspective view of a stage in an automatic packaging apparatus for precisely positioning an integrated circuit according to the present invention;
FIG. 4 is a schematic perspective view of a stage in an automatic packaging apparatus for precisely positioning an integrated circuit according to the present invention;
FIG. 5 is a schematic view of the internal structure of the roll-over stand in an automatic packaging apparatus for precisely positioning integrated circuits according to the present invention'
FIG. 6 is an enlarged view of FIG. 5 at A;
FIG. 7 is a right side view of an automatic packaging apparatus for precisely positioning an integrated circuit according to the present invention;
FIG. 8 is a schematic diagram of the overall structure of an automatic packaging device for precisely positioning an integrated circuit according to the present invention;
in the figure, the device comprises a 1-packaging table, a 2-limit feeding track, a 3-positioning bottom plate, a 4-positioning side plate, a 5-positioning end plate, a 6-pin hole, a 7-roll-over stand, an 8-rotating disk, a 9-rotating negative pressure pipe, a 10-lower limit plate, an 11-upper limit plate, a 12-linear driving module, a 13-jacking cylinder, a 14-mounting frame, a 15-lifting cylinder, a 16-transmission shaft, a 17-main shaft, a 18-large gear, a 19-small gear, a 20-driving cavity, a 21-steering engine, a 22-positioning disk, a 23-positioning taper hole, a 24-positioning groove, a 25-positioning taper rod, a 26-electromagnet, a 27-iron block, a 28-spring, a 29-negative pressure pipe, a 30-telescopic pipe, a 31-reset spring, a 32-transverse screw linear module, a 33-longitudinal screw linear module, a 34-vertical screw linear module, a 35-patch pipe, a 36-negative pressure sucker, a 37-cover plate storage frame, a 38-first positioning plate, a 39-second positioning plate, a 40-third positioning plate, a 41-pushing rectangular frame, a 42-pushing frame, a 43-pushing cylinder, a 43-44 and a 48-pushing linear bar, and a 48-pushing cylinder.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to the accompanying drawings, but the scope of the present invention is not limited to the following description.
An embodiment I, as shown in figures 1 to 8, an automatic packaging device for precisely positioning an integrated circuit, comprising a packaging table 1, a feeding mechanism, a carrier plate positioning mechanism, a carrier plate overturning mechanism and a patch packaging mechanism, wherein the carrier plate positioning mechanism is positioned between the feeding mechanism and the patch packaging mechanism, the carrier plate overturning mechanism is positioned above the carrier plate positioning mechanism, the feeding mechanism comprises a limit feeding track 2, the cross section shape of the limit feeding track 2 is U-shaped, the width of the limit feeding track 2 is equal to the width of the carrier plate, the patch surface of the carrier plate contacts the limit feeding track 2 for feeding and conveying, the conveying mode of the traditional carrier plate is changed, the traditional carrier plate is conveyed forward, namely, the pins of the carrier plate are conveyed downwards, the patch surface of the carrier plate faces upwards, therefore, the chip packaging device can be directly packaged with the cover plate, although the packaging device is simple in structure and high in packaging efficiency, pins of the carrier plate are more or less bent or worn in the conveying process, the situation of breakage is serious even occurs, defective products are high, and the cost is high; in the specific implementation, the integrated circuit is pre-installed in a chip groove of the carrier plate, the patch surface of the carrier plate contacts with the limiting feeding track 2 for conveying, the chip groove of the carrier plate can be blocked by the limiting feeding track 2, the integrated circuit in the chip groove is protected, and magazines are prevented from entering the chip groove to influence the integrated circuit; the carrier plate positioning mechanism comprises a positioning bottom plate 3, positioning side plates 4 and positioning end plates 5, wherein a plurality of pin holes 6 are formed in the positioning bottom plate 3, the pin holes 6 are in one-to-one correspondence with pins on the carrier plate, the positioning side plates 4 are respectively fixed on two sides of the top surface of the positioning bottom plate 3, one end of the positioning bottom plate 3, which is far away from a limiting feeding track 2, is fixedly provided with the positioning end plates 5, the distance between the two positioning side plates 4 is equal to the width of the carrier plate, the height of the positioning side plates 4 is smaller than the thickness of the carrier plate, the side surfaces of the carrier plate can be exposed, the carrier plate turnover mechanism is convenient to clamp, the length of the positioning bottom plate 3 is equal to the length of the carrier plate, the positioning bottom plate 3 has the freedom degree of moving along the feeding direction of the carrier plate, the positioning bottom plate 3 has the freedom degree of moving along the height direction of the encapsulation platform 1, in the feeding process, the positioning bottom plate 3 is connected with the output end of the limiting feeding track 2, so that the carrier plate is conveyed onto the positioning bottom plate 3, and the carrier plate 3 can only be fed with one carrier plate due to the length of the carrier plate, the carrier plate is fed, the carrier plate is finished, the carrier plate is fed in sequence, the carrier plate is fed through the carrier plate, the carrier plate is positioned by the carrier plate, and the carrier plate 3 is completely and the carrier plate is completely prevented from being subjected to positioning by the positioning and the carrier plate 3 through the two sides; the carrier plate tilting mechanism includes roll-over stand 7, rotary disk 8 and rotatory negative pressure pipe 9, the shape of roll-over stand 7 is "" font, roll-over stand 7 has the degree of freedom that moves along encapsulation platform 1 direction of height, the two inside walls of roll-over stand 7 all rotate and are provided with rotary disk 8, coaxial mounting has rotatory negative pressure pipe 9 on rotary disk 8, the middle part at carrier plate both sides wall is acted on respectively to two rotatory negative pressure pipes 9, the bottom that locating bottom plate 3 is close to spacing feeding track 2 one end is fixed with down limiting plate 10, the surface that locating end plate 5 was kept away from down limiting plate 10 flushes with the terminal surface of locating bottom plate 3, the top that locating bottom plate 3 one end was close to spacing feeding track 2 is fixed with limiting plate 11, the surface that upper limiting plate 11 is close to locating bottom plate 3 flushes with the terminal surface of spacing feeding track 2, the upset location process of carrier plate is: after the surface mount of the carrier plate is downwards conveyed onto the positioning bottom plate 3, the positioning bottom plate 3 moves upwards, so that the carrier plate on the positioning bottom plate 3 is separated from the carrier plate at the rear, the mutual influence between the carrier plates is avoided, in the lifting process of the positioning bottom plate 3, the two ends of the carrier plate on the positioning bottom plate 3 are limited through the upper limiting plate 11 and the positioning end plate 5, the carrier plate is prevented from shifting in the lifting process, meanwhile, the positioning bottom plate 3 drives the lower limiting plate 10 to move upwards, the lower limiting plate 10 blocks the discharge port of the limiting feeding track 2, the carrier plate at the rear is prevented from shifting, the carrier plate at the rear can stably stay in the limiting feeding track 2, the next feeding process is ensured to be smoothly carried out, the carrier plate to be sealed and the carrier plate at the rear of the carrier plate to be packaged are limited at the same time, the packaging positioning of the carrier plate is more accurate, the packaging quality of the integrated circuit is improved, the positioning bottom plate 3 is lifted to the working position that the side wall of the carrier plate is positioned on the rotary negative pressure pipe 9, the middle part of the side wall of the carrier plate is acted on by the rotary negative pressure pipe 9, then the turnover frame 7 moves upwards, so that the carrier plate is separated from the positioning bottom plate 3, the carrier plate can not interfere with the positioning bottom plate 3 in the turnover process, the rotary disk 8 drives the rotary negative pressure pipe 9 to rotate, the carrier plate rotates 180 degrees, the pins of the carrier plate face upwards and the surface mount faces upwards, then the turnover frame 7 moves downwards, the carrier plate is in an assembling state and falls on the positioning bottom plate 3, at the moment, the pins of the carrier plate are inserted into the pin holes 6, the pins of the carrier plate are protected, the pins of the carrier plate can not be damaged in the assembling process, the packaging quality is guaranteed, and finally the cover plate is assembled on the carrier plate through the surface mount packaging mechanism, and the assembled packaging shell is sent out.
Further, as shown in fig. 1 to 4, the top of the packaging table 1 is fixed with a mounting frame 14, the packaging table 1 is provided with a sinking part, the packaging table 1 is provided with a linear driving module 12 on the sinking part, a lifting cylinder 13 is vertically mounted on a sliding seat of the linear driving module 12, a telescopic shaft of the lifting cylinder 13 is connected with the bottom of the positioning bottom plate 3, the positioning bottom plate 3 is driven to move between the limiting feeding track 2 and the patch packaging mechanism through the linear driving module 12, the positioning bottom plate 3 is connected with the limiting feeding track 2 to carry out loading of the carrier plate, then the carrier plate is moved to an assembly station of the patch packaging mechanism to carry out assembly, packaging of an integrated circuit is completed, and the lifting cylinder 13 vertically moves the positioning bottom plate 3 to enable the carrier plate on the positioning bottom plate 3 to be separated from the carrier plate in the limiting feeding track 2, so that mutual influence is avoided.
In the second embodiment, as shown in fig. 1 to 6, on the basis of the first embodiment, a lifting cylinder 15 is installed on the inner top wall of a mounting frame 14, a telescopic shaft of the lifting cylinder 15 is connected with a roll-over stand 7, a rotating disc 8 is coaxially fixed with a transmission shaft 16, the transmission shaft 16 is rotatably arranged on the roll-over stand 7 in a penetrating manner, a main shaft 17 is rotatably arranged in the roll-over stand 7, a driving cavity 20 is arranged between the inner side wall and the outer side wall of the roll-over stand 7, a large gear 18 and a small gear 19 are arranged in the driving cavity 20, the small gear 19 is sleeved on the main shaft 17, the large gear 18 is sleeved on the transmission shaft 16, the small gear 19 is meshed with the large gear 18, a steering engine 21 is installed on the outer side wall of the roll-over stand 7, an output shaft of the steering engine 21 is in transmission connection with the main shaft 17, the main shaft 17 is driven to rotate by the steering engine 21, the main shaft 16 is driven by the meshing of the small gear 19 and the large gear 18, the transmission shaft 16 drives the rotating disc 8 to rotate, and the rotating disc 8 drives a rotating negative pressure pipe 9 to rotate, and a negative pressure absorbing carrier plate is generated by rotating the negative pressure through the rotating negative pressure pipe 9.
In the third embodiment, the steering engine 21 is adopted to reduce the volume and weight of the driving device, so that the structure is more compact, but the steering engine 21 generally has no self-locking capability, cannot keep a stable state, cannot lock the state of the carrier after the deflection of the carrier is completed, and cannot accurately fall on the positioning bottom plate 3, therefore, on the basis of the second embodiment, as shown in fig. 5 and 6, a positioning disc 22 is arranged in the driving cavity 20, the positioning disc 22 is fixedly sleeved on the transmission shaft 16, two positioning taper holes 23 are formed in the positioning disc 22, the two positioning taper holes 23 are symmetrically arranged about the center of the positioning disc 22, a positioning groove 24 is formed in the side wall of the driving cavity 20 of the turnover frame 7, a positioning taper rod 25 is slidably arranged in the positioning groove 24, an electromagnet 26 is arranged in the positioning groove 24, one end of the positioning taper rod 25 close to the electromagnet 26 is provided with an iron block 27, a spring 28 is arranged between the iron block 27 and the electromagnet 26, the two ends of the spring 28 are respectively connected with the locating cone rod 25 and the roll-over stand 7, when the spring 28 is in a normal state, the locating cone rod 25 is matched with one locating cone hole 23, when the rotary disk 8 is in a static state, the locating cone rod 25 is matched in one locating cone hole 23, thereby locking the positions of the rotary disk 8 and the rotary negative pressure pipe 9 and preventing automatic deflection, when the rotary negative pressure pipe 9 needs to deflect and drive the carrier plate to rotate, the electromagnet 26 is electrified to absorb the iron block 27, so that the locating cone rod 25 moves into the locating groove 24 after grinding the spring 28, the locating cone rod 25 is separated from the locating cone hole 23, at the moment, the steering engine 21 is started to drive the rotary disk 8 and the rotary negative pressure pipe 9 to rotate, when the locating cone rod 25 and the locating cone hole 23 are staggered, the electromagnet 26 is powered off, the locating cone rod 25 stretches out from the locating groove 24 under the reaction force of the spring 28, at the moment, the locating cone rod 25 is propped against the surface of the locating disk 22, the positioning disc 22 continues to rotate until the next positioning taper hole 23 rotates to the moving path of the positioning taper rod 25, and the positioning taper rod 25 is inserted into the positioning taper hole 23 under the reaction force of the spring 28, so that the rotating disc 8 is locked, at the moment, the steering engine 21 stops rotating, the carrier plate is enabled to turn more accurately, and pins on the carrier plate can be smoothly inserted into the pin holes 6 in the falling process of the carrier plate.
Further, as shown in fig. 1 to 7, the rotary negative pressure tube 9 includes a negative pressure tube 29 and a telescopic tube 30, one end of the telescopic tube 30 is coaxially connected with the rotating disk 8, the other end is coaxially connected with the negative pressure tube 29, a return spring 31 is sleeved on the telescopic tube 30, two ends of the return spring 31 respectively prop against the negative pressure tube 29 and the rotating disk 8, one end of the negative pressure tube 29 far away from the telescopic tube 30 is conical, the side wall of the negative pressure tube 29 is connected with a vacuum pump through a pipeline, the distance between the two negative pressure tubes 29 is smaller than the width of the carrier plate, when the positioning bottom plate 3 carries the carrier plate to move upwards, the carrier plate contacts with the conical section of the negative pressure tube 29, the return spring 31 is compressed by the negative pressure tube 29 to move close to the rotating disk 8 under the guidance of the conical section, the negative pressure tube 29 can smoothly transition the carrier plate, and under the reaction force of the return spring 31, the negative pressure tube 29 is propped against the side wall of the carrier plate with a certain contact force, on one hand, on the other hand, the negative pressure tube 29 is tightly contacts with the side wall of the carrier plate to form a good negative pressure environment, so that the carrier plate has a strong clamping strength, the carrier plate cannot deviate in the process of overturning the carrier plate, and the carrier plate is ensured.
On the basis of the fourth embodiment, as shown in fig. 1 to 4, the patch packaging mechanism comprises a transverse screw linear module 32, a longitudinal screw linear module 33 and a vertical screw linear module 34, the transverse screw linear module 32 is mounted on the inner top wall of the mounting frame 14, the longitudinal screw linear module 33 is mounted on the sliding seat of the transverse screw linear module 32, the sliding seat of the longitudinal screw linear module 33 is connected with an L-shaped connecting block 48, the vertical screw linear module 34 is connected with the L-shaped connecting block 48, a patch tube 35 is vertically arranged on the sliding seat of the vertical screw linear module 34, the bottom of the patch tube 35 is connected with a negative pressure sucking disc 36, the packaging table 1 is fixed with a plurality of cover plate storage frames 37 on a sinking part, the cover plates are stacked in the cover plate storage frames 37, and are stacked in the cover plate storage frames 37 directly upwards due to the sealing effect of the cover plates, the cover plates are not provided with integrated circuit structures, the transverse screw linear module 32, the longitudinal screw linear module 33 and the vertical screw linear module 34 are arranged, the patch tube 35 has the movement freedom degree of three directions of an X axis, a Y axis and Z axis, the patch tube 35 carries the negative pressure sucking disc 36, the negative pressure tube 36 is carried by the automatic sucking disc 36, the negative pressure sucking disc 36 is carried by the suction disc 36, the integrated circuit is carried by the suction disc is automatically or the integrated circuit is automatically carried by the suction disc 36, the suction disc is automatically carried by the suction disc and then the suction disc is packaged by the suction disc, the suction disc is automatically carried by the suction disc, the suction disc is then the suction disc is packaged by the suction device, and the suction device is then the suction device is packaged, and the suction is then the suction and the suction is packaged by the suction is then the suction and the suction is packaged.
On the basis of the fifth embodiment, as shown in fig. 3 and 4, a first positioning plate 38 is fixed on the packaging table 1, the first positioning plate 38 is located on the moving path of the slide of the linear driving module 12, a second positioning plate 39 and a third positioning plate 40 are fixed on the inner top wall of the mounting frame 14, the second positioning plate 39 is located on the moving path of the slide of the transverse screw linear module 32, and the third positioning plate 40 is located on the moving path of the slide of the longitudinal screw linear module 33; when the sliding seat of the linear driving module 12 abuts against the first positioning plate 38, the sliding seat of the transverse screw linear module 32 abuts against the second positioning plate 39, the sliding seat of the longitudinal screw linear module 33 abuts against the third positioning plate 40, the carrier plate on the positioning bottom plate 3 is located under the cover plate on the negative pressure suction disc 36, in order to accurately position the moving precision of the bottom plate 3 and the moving precision of the patch packaging mechanism, a mechanical positioning structure is added, and accurate positioning of the cover plate and the carrier plate is completed, specifically, after the carrier plate is overturned and falls on the positioning bottom plate 3, the linear driving module 12 drives the positioning bottom plate 3 to move close to the patch packaging mechanism, the sliding seat of the linear driving module 12 stops moving when contacting the first positioning plate 38, positioning of the carrier plate is completed, then after the negative pressure suction disc 36 sucks the cover plate, the sliding seat of the transverse screw linear module 32 stops when contacting the second positioning plate 39, and the sliding seat of the longitudinal screw linear module 33 stops when contacting the third positioning plate 40, so that positioning of the cover plate is completed, and the cover plate is located right above the carrier plate, and the cover plate is driven by the vertical screw linear module 34 to move the cover plate downwards to the carrier plate to the position of the carrier plate, thus the accurate positioning quality is improved.
On the basis of the sixth embodiment, as shown in fig. 1 to 4, a rectangular frame 41 is fixed on the packaging table 1, a limit feeding track 2 is located between the rectangular frame 41 and the carrier plate positioning mechanism, the rectangular frame 41 is connected with the limit feeding track 2, an outlet is formed in the position, corresponding to the conveying channel of the limit feeding track 2, of the rectangular frame 41, pushing air cylinders 42 are respectively arranged on two sides of the rectangular frame 41, a telescopic shaft of the pushing air cylinders 42 movably penetrates into the rectangular frame 41 and is fixedly provided with a push plate 43, a plurality of standby feeding tracks 44 are arranged between the two push plates 43, the standby feeding tracks 44 are sequentially connected with the limit feeding track 2, the feeding capacity is enlarged, one end, far away from the limit feeding track 2, of the rectangular frame 41 is provided with a notch 45, the notch 45 is opposite to the conveying channel of the limit feeding track 2, a pushing linear driving module 46 is arranged on the inner top wall of the mounting frame 14, a sliding seat of the pushing linear driving module 46 moves along the conveying direction of the carrier plate, pushing rods 47 are vertically fixed on the sliding seat of the sliding seat, the pushing rods 47 extend into the notch 45, a plurality of standby feeding tracks 44 are arranged, and the standby feeding tracks 44 are sequentially connected with the limit feeding tracks 2, so that the standby feeding tracks 2 can be assembled continuously, and the standby feeding tracks are not interrupted, and the specific feeding tracks 2 are arranged, and the standby feeding tracks are guaranteed to be assembled continuously, and the standby feeding tracks are not required to be separated. The pushing rod 47 is driven to move along the conveying direction of the carrier plate by pushing the linear driving module 46, so that the pushing rod 47 acts in the limiting feeding track 2 to push the carrier plates into the positioning bottom plate 3 one by one to finish the feeding operation, after the carrier plates in the limiting feeding track 2 are fed, the pushing rod 47 is reset by using the packaging time of the carrier plates and the cover plates, so that the pushing rod 47 is positioned at the notch 45, then the carrier plates in the standby feeding track 44 are pushed into the limiting feeding track 2 by the pushing rod 47, the carrier plates are in a state to be fed, then the pushing rod 47 pushes the carrier plates one by one, in the time, one pushing cylinder 42 extends, the other pushing cylinder 42 contracts, so that the standby feeding track 44 loaded with the carrier plates is pushed by the pushing plate 43 to move, the standby feeding track 44 is switched, the carrier plates in the limiting feeding track 2 can be pushed into the limiting feeding track 2 by using the packaging time of the carrier plates, after the pushing rod 47 is reset, when all the carrier plates in the standby feeding track 44 are completely loaded with the carrier plates, and the carrier plates are also fully loaded into the carrier plates in the same carrier plates, and the carrier plates are continuously stored in the carrier plates 37, and the carrier plates are continuously arranged in the carrier plates 37, and the carrier plates are continuously stored in the carrier plates are continuously in the carrier plates, and the carrier plates are continuously arranged in the carrier plates, and the carrier plates are continuously in the carrier plates and the carrier plates are packaged.
In the description of the present invention, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "one side," "top," "inner," "front," "center," "two ends," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention; and those of ordinary skill in the art will appreciate that the benefits achieved by the present invention are merely better than those achieved by the current embodiments of the prior art in certain circumstances and are not intended to be the most excellent uses directly in the industry.
The foregoing is merely a preferred embodiment of the invention, and it is to be understood that the invention is not limited to the form disclosed herein but is not to be construed as excluding other embodiments, but is capable of numerous other combinations, modifications and environments and is capable of modifications within the scope of the inventive concept, either as taught or as a matter of routine skill or knowledge in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (10)
1. The automatic packaging device for accurately positioning the integrated circuit is characterized by comprising a packaging table (1), a feeding mechanism, a carrier plate positioning mechanism, a carrier plate overturning mechanism and a patch packaging mechanism, wherein the carrier plate positioning mechanism is positioned between the feeding mechanism and the patch packaging mechanism, and the carrier plate overturning mechanism is positioned above the carrier plate positioning mechanism;
the feeding mechanism comprises a limit feeding rail (2), the cross section of the limit feeding rail (2) is U-shaped, the width of the limit feeding rail (2) is equal to that of a carrier plate, and the patch surface of the carrier plate is contacted with the limit feeding rail (2) for feeding and conveying;
the carrier plate positioning mechanism comprises a positioning bottom plate (3), positioning side plates (4) and positioning end plates (5), a plurality of pin holes (6) are formed in the positioning bottom plate (3), the pin holes (6) correspond to pins on the carrier plate one by one, the positioning side plates (4) are fixed on two sides of the top surface of the positioning bottom plate (3), the positioning bottom plate (3) is far away from one end of the limiting feeding track (2), the positioning end plates (5) are fixed on one end of the positioning bottom plate (3), the distance between the two positioning side plates (4) is equal to the width of the carrier plate, the height of the positioning side plates (4) is smaller than the thickness of the carrier plate, the length of the positioning bottom plate (3) is equal to the length of the carrier plate, the positioning bottom plate (3) has the freedom degree of moving along the feeding direction of the carrier plate, and the positioning bottom plate (3) has the freedom degree of moving along the height direction of the packaging table (1).
The carrier plate overturning mechanism comprises an overturning frame (7), a rotating disc (8) and rotating negative pressure pipes (9), wherein the overturning frame (7) is in a shape of , the overturning frame (7) has a degree of freedom moving along the height direction of the packaging table (1), the rotating disc (8) is rotatably arranged on two inner side walls of the overturning frame (7), the rotating disc (8) is coaxially provided with the rotating negative pressure pipes (9), and the two rotating negative pressure pipes (9) respectively act on the middle parts of two side walls of the carrier plate;
and reversely conveying the carrier plate, wherein the patch surface of the carrier plate is downward contacted with the conveying surface of the limiting feeding track (2) to convey the carrier plate to the positioning bottom plate (3), so that the pins of the carrier plate are upward arranged.
2. The automatic packaging device for precisely positioning the integrated circuit according to claim 1, wherein a lower limiting plate (10) is fixed at the bottom of one end of the positioning bottom plate (3) close to the limiting feeding rail (2), the surface of the lower limiting plate (10) away from the positioning end plate (5) is flush with the end surface of the positioning bottom plate (3), an upper limiting plate (11) is fixed at the top of one end of the positioning bottom plate (3) close to the limiting feeding rail (2), and the surface of the upper limiting plate (11) close to the positioning bottom plate (3) is flush with the end surface of the limiting feeding rail (2).
3. The automatic packaging device for precisely positioning the integrated circuit according to claim 2, wherein a mounting frame (14) is fixed at the top of the packaging table (1), a sinking part is arranged on the packaging table (1), a linear driving module (12) is arranged on the sinking part of the packaging table (1), a jacking cylinder (13) is vertically arranged on a sliding seat of the linear driving module (12), and a telescopic shaft of the jacking cylinder (13) is connected with the bottom of the positioning bottom plate (3).
4. An automatic packaging device for precisely positioning an integrated circuit according to claim 3, characterized in that the inner top wall of the mounting frame (14) is provided with a lifting cylinder (15), a telescopic shaft of the lifting cylinder (15) is connected with the roll-over stand (7), the rotary disk (8) is coaxially fixed with a transmission shaft (16), the transmission shaft (16) rotates and passes through the roll-over stand (7), a main shaft (17) is arranged in the roll-over stand (7), a driving cavity (20) is arranged between the inner side wall and the outer side wall of the roll-over stand (7), a large gear (18) and a small gear (19) are arranged in the driving cavity (20), the small gear (19) is sleeved on the main shaft (17), the large gear (18) is sleeved on the transmission shaft (16), the small gear (19) is meshed with the large gear (18), the outer side wall of the roll-over stand (7) is provided with a steering engine (21), and the output shaft of the steering engine (21) is in transmission connection with the main shaft (17).
5. The automatic packaging device for precisely positioning the integrated circuit according to claim 4, wherein a positioning disc (22) is arranged in the driving cavity (20), the positioning disc (22) is fixedly sleeved on the transmission shaft (16), two positioning taper holes (23) are formed in the positioning disc (22), the two positioning taper holes (23) are symmetrically arranged relative to the circle center of the positioning disc (22), a positioning groove (24) is formed in the side wall of the driving cavity (20) by the turnover frame (7), a positioning taper rod (25) is arranged in the positioning groove (24) in a sliding mode, an electromagnet (26) is arranged in the positioning groove (24), an iron block (27) is arranged at one end, close to the electromagnet (26), of the positioning taper rod (25), a spring (28) is arranged between the iron block (27) and the electromagnet (26), two ends of the spring (28) are respectively connected with the positioning taper rod (25) and the turnover frame (7), and when the spring (28) is positioned in a taper state, the positioning taper rod (25) is matched with one of the positioning taper rods (23) in a normal state.
6. The automatic packaging device for precisely positioning the integrated circuit according to claim 5, wherein the rotary negative pressure tube (9) comprises a negative pressure tube (29) and a telescopic tube (30), one end of the telescopic tube (30) is coaxially connected with the rotary disc (8), the other end of the telescopic tube is coaxially connected with the negative pressure tube (29), a return spring (31) is sleeved on the telescopic tube (30), two ends of the return spring (31) respectively prop against the negative pressure tube (29) and the rotary disc (8), one end of the negative pressure tube (29) away from the telescopic tube (30) is conical, and the side wall of the negative pressure tube (29) is connected with a vacuum pump through a pipeline.
7. An automatic packaging device for precisely positioning an integrated circuit according to claim 3, wherein the patch packaging mechanism comprises a transverse screw linear module (32), a longitudinal screw linear module (33) and a vertical screw linear module (34), the transverse screw linear module (32) is mounted on the inner top wall of the mounting frame (14), the longitudinal screw linear module (33) is mounted on a sliding seat of the transverse screw linear module (32), the sliding seat of the longitudinal screw linear module (33) is connected with an L-shaped connecting block (48), the vertical screw linear module (34) is connected with the L-shaped connecting block (48), a patch tube (35) is vertically arranged on the sliding seat of the vertical screw linear module (34), the bottom of the patch tube (35) is connected with a negative pressure sucker (36), and the packaging table (1) is fixedly provided with a plurality of cover plate storage frames (37) on the sinking parts, and the cover plates are stacked in the cover plate storage frames (37).
8. An automatic packaging device for precisely positioning an integrated circuit according to claim 7, wherein a first positioning plate (38) is fixed on the packaging table (1), the first positioning plate (38) is located on the moving path of the slide of the linear driving module (12), a second positioning plate (39) and a third positioning plate (40) are fixed on the inner top wall of the mounting frame (14), the second positioning plate (39) is located on the moving path of the slide of the transverse screw linear module (32), and the third positioning plate (40) is located on the moving path of the slide of the longitudinal screw linear module (33);
when the sliding seat of the linear driving module (12) is propped against the first positioning plate (38), the sliding seat of the transverse screw linear module (32) is propped against the second positioning plate (39), and the sliding seat of the longitudinal screw linear module (33) is propped against the third positioning plate (40), the carrier plate on the positioning bottom plate (3) is positioned under the cover plate on the negative pressure sucker (36).
9. An automatic packaging device for precisely positioning an integrated circuit according to claim 3, wherein a rectangular frame (41) is fixed on the packaging table (1), the limit feeding track (2) is located between the rectangular frame (41) and the carrier plate positioning mechanism, the rectangular frame (41) is connected with the limit feeding track (2), an outlet is formed in the position, corresponding to the conveying channel of the limit feeding track (2), of the rectangular frame (41), pushing air cylinders (42) are arranged on two sides of the rectangular frame (41), telescopic shafts of the pushing air cylinders (42) movably penetrate into the rectangular frame (41) and are fixedly provided with push plates (43), a plurality of standby feeding tracks (44) are arranged between the two push plates (43), and the standby feeding tracks (44) are sequentially connected with the limit feeding tracks (2).
10. The automatic packaging device for precisely positioning the integrated circuit according to claim 9, wherein a notch (45) is formed in one end, far away from the limiting feeding rail (2), of the rectangular frame (41), the notch (45) is opposite to a conveying channel of the limiting feeding rail (2), a pushing linear driving module (46) is arranged on the inner top wall of the mounting frame (14), a sliding seat of the pushing linear driving module (46) moves along the conveying direction of the carrier plate, a pushing rod (47) is vertically fixed on the sliding seat of the pushing linear driving module (46), and the bottom of the pushing rod (47) extends into the notch (45).
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| CN202311847063.6A CN117497462B (en) | 2023-12-29 | 2023-12-29 | Automatic packaging device for accurately positioning integrated circuit |
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| CN202311847063.6A CN117497462B (en) | 2023-12-29 | 2023-12-29 | Automatic packaging device for accurately positioning integrated circuit |
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| CN117497462B true CN117497462B (en) | 2024-03-29 |
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