CN111195790A - Automatic welding system for flexible circuit board - Google Patents
Automatic welding system for flexible circuit board Download PDFInfo
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- CN111195790A CN111195790A CN202010120356.4A CN202010120356A CN111195790A CN 111195790 A CN111195790 A CN 111195790A CN 202010120356 A CN202010120356 A CN 202010120356A CN 111195790 A CN111195790 A CN 111195790A
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- automatic
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- tray
- loading
- flexible circuit
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- 238000003466 welding Methods 0.000 title claims abstract description 60
- 230000007246 mechanism Effects 0.000 claims abstract description 210
- 238000003860 storage Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000001179 sorption measurement Methods 0.000 claims description 39
- 230000033001 locomotion Effects 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 29
- 238000011084 recovery Methods 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000007723 transport mechanism Effects 0.000 abstract description 5
- 210000002105 tongue Anatomy 0.000 description 18
- 230000003028 elevating effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an automatic welding system for a flexible circuit board. And the multiple groups of automatic loading and unloading mechanisms carry out automatic storage, automatic loading and automatic unloading on the subcomponents of each flexible circuit board and the flexible circuit board which is welded. A plurality of tool transfer mechanism transmit the tool between mount table, welding bench, and a plurality of snatch transport mechanism snatch the transport material between mount table, welding bench and automatic unloading mechanism of going up. Therefore, full-automatic carrying, feeding, blanking, welding and storage of all subcomponents and finished products in the welding process of the flexible circuit board are realized, and automation and mass automatic production are realized through the use of the jig.
Description
Technical Field
The invention relates to the field of automatic welding facilities, in particular to an automatic welding system for a flexible circuit board.
Background
The flexible circuit board is a circuit board mainly composed of copper foil, acryl and epoxy resin thermosetting adhesive, thin film and the like, and has the advantages of space saving, weight reduction, high flexibility and the like. The flexible printed circuit board is generally used in various electronic products and equipments such as commercial electronic equipments, car dashboards, printers, hard disks, floppy disks, fax machines, mobile phones for cars, ordinary phones, notebook computers, cameras, video cameras, CD-ROMs, hard disks, watches, computers, cameras, medical instruments and equipments. In the production of flexible circuit boards, it is often necessary to solder together a plurality of components. However, the prior art has the defects of low clamping speed, low welding productivity and the like. In addition, the prior art also has the defects of easy deformation, difficult positioning, low clamping efficiency and the like of the flexible circuit board.
When small electronic components such as flexible circuit boards are processed in a factory, the components are usually placed on a tray or the like because of their small size, and the tray is stacked on a shelf or held on a table by a jig. In the process of processing components, the tray is manually conveyed between the material rack and the workbench in the prior art, the efficiency is low, and the workload of an operator is large. Some automatic handling robots applied to engineering can also automatically carry trays between a material rack and a workbench by installing a clamp with special design, but practice shows that much time is consumed for positioning the trays, grabbing the trays, moving the trays, releasing the trays and the like of the robots, so that the efficiency of loading and unloading is very low. In addition, the robot moves repeatedly among the empty tray frame, the workbench and the tray recovery frame, high-frequency word positioning and steering are needed, time consumption is needed, and the efficiency of loading and unloading is further reduced.
In a factory, a suction cup is a common automatic operation tool, and is used for replacing manual clamping and moving of a workpiece in a suction mode. The prior art suction cup, which includes a deformable plate body and a suction hole at the center of the plate body, has several drawbacks when using the prior art suction cup to operate precision devices, especially small precision electronic devices. For example, the suction force is too large, the positioning is difficult, accurate adsorption is difficult, and the like. For example, the suction cup functions singly. For example, a single electronic device is attracted at a time, resulting in poor efficiency. In addition, among the prior art, when linkage operations such as assembly, combination need be carried out to the work piece, install the sucking disc on moving platform usually to in get and put the material. For various operation actions, a plurality of devices need to be arranged, so that the device cost is high and the occupied space is large.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides an automatic tray loading and unloading system.
Specifically, the technical scheme is as follows:
an automatic soldering system for flexible circuit boards, for automatic soldering of flexible circuit boards preferably comprising flexible circuits, a base plate, a tongue and a carrier plate, comprising:
the device comprises a welding table, a welding mechanism and a plurality of loading and unloading tables, wherein the loading and unloading tables and the welding table are all configured to receive and position jigs, the jigs are configured to position whole or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding table to weld the flexible circuit boards on the jigs;
the automatic feeding and discharging mechanisms are configured to automatically store, automatically feed and automatically discharge the subcomponents of the flexible circuit boards and the welded flexible circuit boards;
a plurality of jig transfer mechanisms configured to transfer jigs between the mounting and dismounting stages and the welding stage;
and the grabbing and carrying mechanisms are configured to grab and carry materials among the loading platform, the welding platform and the automatic loading and unloading mechanism.
The invention has at least the following beneficial effects:
according to the automatic welding system for the flexible circuit board, compared with the prior art, the loading and unloading tables and the welding table receive and position the jig, the jig positions the whole or partial components of the flexible circuit board, and the welding mechanism is arranged above the welding table to weld the flexible circuit board on the jig. And the multiple groups of automatic loading and unloading mechanisms carry out automatic storage, automatic loading and automatic unloading on the subcomponents of each flexible circuit board and the flexible circuit board which is welded. A plurality of tool transfer mechanism transmit the tool between mount table, welding bench, and a plurality of snatch transport mechanism snatch the transport material between mount table, welding bench and automatic unloading mechanism of going up. Therefore, full-automatic carrying, feeding, blanking, welding and storage of all subcomponents and finished products in the welding process of the flexible circuit board are realized, and automation and mass automatic production are realized through the use of the jig.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a perspective view of an automatic soldering system for flexible circuit boards;
FIG. 2 is an exploded view of the welding station of the example;
FIG. 3 is a schematic view of a jig according to an embodiment;
FIG. 4 is a schematic diagram of a jig and a flexible circuit board according to an embodiment;
FIG. 5 is a schematic view of a flexible wiring board in an embodiment;
FIG. 6 is an enlarged view of the area A in FIG. 5;
FIG. 7 is an enlarged view of the area B in FIG. 5;
FIG. 8 is an exploded view of a part of the structure of a flexible wiring board fixing structure in the embodiment;
FIG. 9 is an enlarged partial view of the area C in FIG. 8;
FIG. 10 is a schematic view of a rotary shaft in the embodiment;
FIG. 11 is a partial schematic structural view of a locking assembly in an embodiment;
FIG. 12 is a first schematic view of an embodiment of a platen assembly;
FIG. 13 is a second schematic view of the platen assembly of the example embodiment;
FIG. 14 is a partial enlarged view of the area E in FIG. 12
FIG. 15 is a perspective view of an embodiment of an automatic tray loading and unloading system;
fig. 16 is a first perspective view of the tray storage mechanism in the embodiment;
FIG. 17 is a second perspective view of the tray storage mechanism in the embodiment;
FIG. 18 is a perspective view of an embodiment of an automatic tray picking mechanism;
FIG. 19 is a perspective view of a first set of tray support mechanisms in an embodiment;
FIG. 20 is a first perspective view of the tray recovery mechanism in the embodiment;
FIG. 21 is a second perspective view of the tray recovery mechanism in the embodiment;
FIG. 22 is a perspective view of an automatic retrieval tray mechanism in an embodiment;
FIG. 23 is a perspective view of a second set of tray support mechanisms in an embodiment;
FIG. 24 is a perspective view of a tray conveying mechanism in the embodiment;
FIG. 25 is a perspective view of an embodiment of a three-axis robot pick-and-place material mechanism;
FIG. 26 is a perspective view showing a non-use state of the first adsorption apparatus, the lifting apparatus and the second adsorption apparatus in the embodiment;
FIG. 27 is an enlarged fragmentary view of the area A in FIG. 26;
fig. 28 is an exploded view of the second adsorption device in the example.
Detailed Description
Examples
An automatic soldering system for flexible circuit boards, for automatic soldering of flexible circuit boards preferably comprising flexible circuits, a base plate, a tongue and a carrier plate, comprising: the welding table K1, the welding mechanism and the loading and unloading tables K2, K3 and K4, the loading and unloading tables K2, K3, K4 and the welding table K1 are all configured to receive and position jigs, the jigs are configured to position the whole or partial components of the flexible circuit boards, and the welding mechanism is arranged above the welding table K1 to weld the flexible circuit boards on the jigs; the automatic feeding and discharging mechanisms are configured to automatically store, automatically feed and automatically discharge the subcomponents of the flexible circuit boards and the welded flexible circuit boards; a plurality of jig transfer mechanisms configured to transfer jigs between the mounting/dismounting stages K2, K3, K4 and the welding stage K1; and a plurality of grabbing and conveying mechanisms configured to grab and convey materials among the loading platforms K2, K3, K4, the welding platform K1 and the automatic loading and unloading mechanism.
The welding table K1 includes a first linear moving platform 15, a protective atmosphere mechanism 16, and a pressing plate mechanism, a plurality of sets of flexible circuit boards are positioned on the jig 18, and a bracket assembly for supporting the jig 18 is arranged on the first linear moving platform 15. The protective atmosphere mechanism 16 comprises a nozzle body, a protective atmosphere conveying pipeline and a nozzle pushing mechanism, the nozzle pushing mechanism is installed on the support component, the protective atmosphere conveying pipeline is connected with the nozzle body, and the nozzle body is installed on the nozzle pushing mechanism so as to be inserted into the jig under the driving of the nozzle pushing mechanism to inject the protective atmosphere. The pressing plate mechanism comprises a pressing plate assembly and a pressing plate driving assembly, the pressing plate driving assembly is connected with the pressing plate assembly to drive the pressing plate assembly to move downwards to press the flexible circuit board, and through holes in one-to-one correspondence with welding points of the flexible circuit board are formed in the pressing plate assembly. Wherein the nozzle pushing mechanism may be a cylinder. Wherein, the pressing plate driving component can be a cylinder, a linear motor, a hydraulic cylinder or an electric cylinder and the like.
Preferably, clamp plate drive assembly includes cylinder, spacing seat, pulling plate, and the pulling plate is parallel with the clamp plate subassembly, and the pulling plate can dismantle or non-detachably fixed connection clamp plate subassembly, and spacing seat sets up and is used for supporting the pulling plate below the pulling plate, and the pulling plate is connected to the piston rod of cylinder.
The first linear motion stage 15 includes a linear drive mechanism and a base 20. The output end of the linear branch driving mechanism is connected with the base station 20 to drive the base station 20 to move linearly, the support component comprises a first vertical frame 21, a second vertical frame 22 and a transverse frame 23, the first vertical frame 21 and the second vertical frame 22 are arranged at two ends of the top of the base station 20, two ends of the transverse frame 23 are respectively supported by the first vertical frame 21 and the second vertical frame 22, and the jig 18 is arranged on the transverse frame 23. Illustratively, the linear drive mechanism includes a servo linear motor, or the linear drive mechanism includes a servo rotary motor and a lead screw.
The flexible circuit board comprises flexible circuits 1, tongues 2 and a substrate 3 which are assembled together and welded to form, wherein each flexible circuit 1 is provided with a flexible wire supporting piece 5, the shape of each flexible wire supporting piece 5 is matched with that of each flexible circuit to place the flexible circuit 1 on the upper surface of the corresponding flexible wire supporting piece 5, the corresponding flexible wire supporting piece 5 extends from the head part to the tail part of the corresponding flexible wire 1, the tongues 2 and the substrate 3 are stacked on the lower surface of the corresponding flexible wire supporting pieces 5, clamping feet 51 bent downwards are arranged on the corresponding flexible wire supporting pieces 5, and the clamping feet 51 penetrate through openings 21 in the middles of the tongues 2 and are clamped on the lower surfaces of the tongues 2.
In this embodiment, the flexible circuit board shaping structure includes a carrier board 4, each carrier board 4 is configured to carry a plurality of flexible circuit boards, wherein, for each carried flexible circuit board, the carrier board 4 has a carrying portion 41 for carrying the flexible circuit supporting sheet 5, and the carrier board 4 further has a splicing portion 42 for splicing with the tongue piece 2 and/or the substrate 3. Specifically, the carrier plate 4 is spliced to at least one of the tongue 2 and the base plate 3 by the splices 42, which facilitates subsequent welding of these components together.
The clip 51 includes a T-shaped clip 51, and the T-shaped clip 51 is bent downward from the cord support piece 5. Correspondingly, the opening 21 in the middle of the tongue 2 comprises a T-shaped opening 21.
The jig 18 includes a positioning table 7, and the positioning table 7 is configured to place at least one carrier board 4 and a plurality of flexible circuit boards corresponding to each carrier board 4. Wherein, be provided with a plurality of reference columns 61 on the locating platform 7, be provided with on tongue piece 2, base plate 3, patchcord backing sheet 5 and the loading board 4 respectively with reference column 61 one-to-one and be used for supplying the locating hole that reference column 61 passed, realize the location of tongue piece 2, base plate 3, patchcord backing sheet 5 and loading board 4 on locating platform 7.
In this embodiment, the jig 18 further includes a supporting table, the positioning table 7 is supported on the supporting table, the bottom of the positioning column 61 is fixed on the supporting table, and the top of the positioning column 61 passes through the positioning table 7 and then is matched with the corresponding positioning hole in the tongue 2, the substrate 3, the cord supporting sheet 5 or the bearing plate 4.
In this embodiment, the positioning table 7 is further provided with clamping type positioning pillars 61, the clamping type positioning pillars 61 are arranged in pairs, and a flexible circuit is placed in a gap between each pair of the clamping type positioning pillars 61.
The jig 18 in this embodiment further comprises a locking assembly for locking the positioning table 7. The embodiment provides a specific locking assembly, which includes a motor (not shown in the figure), a rotating shaft 8, a plurality of push rods 13 and a plurality of locking columns 12, wherein the motor is connected to rotate in a transmission manner to drive the rotating shaft 8 to rotate, for example, a connector 82 connected to the motor is arranged at the end of the rotating shaft 8. Be provided with toggle structure 81 (for example, stir the piece or stir ball etc.) in the pivot 8, locking post 12 wears to establish in the opening 21 that corresponds on location platform 7, and locking post 12 is connected to the one end of push rod 13, and the other end cooperates with toggle structure 81 for when pivot 8 drove toggle structure 81 butt push rod 13, push rod 13 promoted locking post 12 and supports tight location platform 7.
The push rod 13 is provided with a return spring 14, and when the rotating shaft 8 drives the toggle structure 81 to leave the push rod 13, the return spring 14 drives the push rod 13 and the locking column 12 to return.
From this, can be fine prevent flexible circuit deformation, realize the effective design to flexible circuit board, especially card foot 51 passes the opening 21 in the middle part of tongue piece 2 and joint in the lower surface of tongue piece 2, has realized the two-sided location to tongue piece 2, prevents better that tongue piece 2 warp or dislocation for flexible circuit or base plate 3.
Furthermore, a smart positioning structure is designed on the jig 18, so that the rapid positioning of a plurality of products on the positioning table 7 can be realized. Not only the positioning effect is good, but also the productivity is higher.
Furthermore, a smart locking structure is designed on the jig 18, so that the positioning table 7 can be locked or unlocked quickly.
The pressing plate assembly 17 comprises an auxiliary pressing plate and a main pressing plate, the pressing plate driving assembly 19 is connected with the main pressing plate to drive the main pressing plate and the auxiliary pressing plate to move downwards to press the flexible circuit board, the auxiliary pressing plate is detachably embedded into the central hole of the main pressing plate, a plurality of positioning grooves are formed in the main pressing plate, detachable splicing blocks are respectively arranged in each positioning groove, through holes are respectively formed in each splicing block, and the splicing blocks are pressed by the auxiliary pressing plate from the top.
Preferably, the positioning groove is a step groove, the top of the splicing block is provided with a through hole, the top of the splicing block is provided with a connecting edge, and the connecting edge is supported on a step of the step groove.
Preferably, the number of platen drive assemblies 19 is at least two, distributed across at least two ends of the platen assembly 17.
Preferably, a positioning column and a positioning hole matched with each other are arranged between the pressing plate assembly 17 and the jig 18 to realize quick positioning.
According to the welding bench in this embodiment, linear moving platform 15 drives tool 18 rapid motion to the assigned position and waits for the welding, and hold-down mechanism pushes down the apron and makes the flexible circuit board compress tightly, and protective atmosphere mechanism 16 injects the protective atmosphere into the nozzle in tool 18, and linear moving platform 15 drives tool 18 rapid motion to next station after the welding is accomplished, has consequently realized the automation mechanized operation of material loading, clamping, removal etc. and the operating accuracy is better, and production efficiency is higher.
In this embodiment, the plurality of loading bays includes a first loading bay K2, a second loading bay K3, and a third loading bay K4, and the plurality of gripper transporting mechanisms includes a first gripper transporting mechanism, a second gripper transporting mechanism, and a third gripper transporting mechanism. The first grabbing and carrying mechanism is used for carrying the base plate, the tongue piece and the bearing plate which are automatically discharged from the multiple groups of automatic loading and unloading mechanisms to the first loading and unloading platform, and carrying the welded flexible circuit board to one or more groups of automatic loading and unloading mechanisms from the first loading and unloading platform for automatic storage. The second grabbing and carrying mechanism is used for carrying the soft circuits and the cover plates which are automatically discharged from one or more groups of automatic feeding and discharging mechanisms to the second loading and unloading platform. The third grabbing and carrying mechanism is used for grabbing the cover plate from the jig of the third loading and unloading platform and carrying the cover plate to one or more groups of automatic loading and unloading mechanisms.
Illustratively, the number of jig transfer mechanisms is two, one jig transfer mechanism for transferring jigs between the third loading and unloading platform and the first loading and unloading platform, and one jig transfer mechanism for transferring jigs between the first loading and unloading platform and the second loading and unloading platform.
Among the multiunit automatic feeding and discharging mechanism, at least a set of automatic feeding and discharging mechanism is used for receiving and storing the flexible circuit board that accomplishes the welding, and at least a set of automatic feeding and discharging mechanism is used for the unloading of base plate, and at least a set of automatic feeding and discharging mechanism is used for the unloading of the assembly of tongue piece and loading board, and at least a set of automatic feeding and discharging mechanism is used for the unloading of flexible circuit.
In a specific embodiment, the automatic loading and unloading mechanism comprises a workbench, a tray storage mechanism, a tray recovery mechanism and a tray conveying mechanism. The tray storage mechanism 180 includes a first frame 1810, a first set of tray support mechanisms 1820, and a tray auto-picking mechanism 1830. Illustratively, the first frame 1810 is a frame structure that includes side walls, a bottom wall, a top wall, and the like. A first set of tray support mechanism 1820 is disposed on the first frame 1810 for supporting a stack of trays formed by trays stacked one on top of the other, and an automatic tray taking mechanism 1830 is disposed for automatically taking out the tray 110 at the bottom of the stack.
Specifically, the number of the tray support mechanisms 1820 is plural, and the plural tray support mechanisms are distributed at different positions on the upper side of the first frame 1810, and the first tray support mechanisms 1820 are located at the sides of the tray stack to support the trays 110 from different directions so as to support the tray stack on the first frame 1810 in an overhead manner.
In this embodiment, the number of the automatic tray taking mechanisms 1830 is at least two, one of the automatic tray taking mechanisms 1830 is installed on the first frame 1810 on the left side and below the tray stack, the other automatic tray taking mechanism 1830 is installed on the first frame 1810 on the right side and below the tray stack, and the tray conveying mechanism 190 is configured to be movable between the two automatic tray taking mechanisms 1830 on the left and right sides to take out the trays.
Specifically, the tray stack of the tray storage mechanism 180 has a gap formed by a rib or a groove between adjacent trays. Accordingly, the first set of tray support mechanisms 1820 includes a first horizontal drive mechanism 18210 and a board 18220, the first horizontal drive mechanism 18210 drivingly couples the board 18220 to drive the board 18220 horizontally into the gap to support the tray above the board 18220. The first horizontal driving mechanism 18210 includes an air cylinder, an electric cylinder, or a linear motor. As an exemplary mounting structure, a base plate 18230 is provided on the top wall, a first horizontal drive mechanism 18210 is mounted on the base plate 18230, and a plug 18220 is mounted on a free end of the first horizontal drive mechanism 18210.
The two automatic tray taking mechanisms 1830 on the left and right sides have the same structure, one of the automatic tray taking mechanisms 1830 includes a first lifting support mechanism and a second lifting support mechanism installed on the side wall of one side of the first frame 1810, and the first lifting support mechanism is located outside the second lifting support mechanism and is used for alternately lifting and lowering the first lifting support mechanism and the second lifting support mechanism to support the tray 110 at the bottom of the tray stack.
Specifically, the automatic tray taking mechanism 1830 further includes a base 18310, the base 18310 is fixed to a side wall of the first frame 1810, the first elevating support mechanism includes a first elevating mechanism 18320, a first connecting arm 18340 and a first supporting plate 18360 which are connected in sequence, the second elevating support mechanism includes a second elevating mechanism 18330, a second connecting arm 18350 and a second supporting plate 18370 which are connected in sequence, the first elevating mechanism 18320 is installed on a front side surface of the base 18310, the second elevating support mechanism is installed on a rear side surface of the base 18310, one of the first connecting arm 18340 and the second connecting arm 3518350 is closer to the side wall of the first frame 1810 than the other, so that one of the first supporting plate 18360 and the second supporting plate 18370 is closer to the side wall of the first frame 1810. The first lifting mechanism 18320 and the second lifting mechanism 18330 may be formed by an air cylinder, an electric cylinder, or a linear motor.
In this embodiment, the tray recycling mechanism 170 includes a second rack 1710, a second group of tray supporting mechanisms 1720, and an automatic tray recycling mechanism 1730, the second group of tray supporting mechanisms 1720 is disposed on the second rack 1710 and is configured to support a tray stack formed by stacking trays disposed up and down, and the automatic tray recycling mechanism 1730 is configured to automatically stack the tray 110 to the bottommost portion of the tray stack.
Specifically, the number of the tray support mechanisms of the second group of tray support mechanisms 1720 is plural, and the plural tray support mechanisms are distributed at different positions on the upper side of the second chassis 1710, and the second group of tray support mechanisms 1720 is located at the side of the tray stack to support the trays from different directions and thus to support the tray stack overhead on the second chassis 1710.
The number of the automatic tray recovery mechanisms 1730 is at least two, one of the automatic tray recovery mechanisms 1730 is installed on the left side of the second rack 1710 and located below the tray stack, the other automatic tray recovery mechanism 1730 is installed on the right side of the second rack 1710 and located below the tray stack, and the tray conveying mechanism 190 is configured to be capable of moving between the two automatic tray recovery mechanisms 1730 on the left and right sides so as to transfer the tray to the two automatic tray recovery mechanisms 1730 on the left and right sides.
Specifically, the two automatic tray recycling mechanisms 1730 at the left and right sides have the same structure, one of the automatic tray recycling mechanisms 1730 includes a base and a third lifting support mechanism 170, the base is fixed on a side wall of the second rack 1710, the third lifting support mechanism 170 includes a third lifting mechanism 17320, a third connecting arm 17330 and a third supporting plate 17340 which are connected in sequence, the third lifting mechanism 17320 is installed on the base, and the supporting plate is used for receiving the trays and stacking the trays upwards. The third lifting mechanism 17320 includes an air cylinder, an electric cylinder, or a linear motor.
Specifically, the composition structure of each tray support mechanism in the second set of tray support mechanisms 1720 is the same, wherein one of the composition structures of the tray support mechanisms includes a connection frame 17210, a rotation support block 17220, a return spring 17240 and a stopper 17230, the connection frame 17210 is fixed on the second frame 1710, the rotation support block 17220 is rotatably installed on the connection frame 17210, the top of one end of the rotation support block 17220 is used for supporting the tray, and the stopper 17230 is arranged on the connection frame 17210 and stops the top of the other end of the rotation support block 17220 from above.
Specifically, one end of the return spring 17240 is disposed on the connection frame 17210, and the other end is connected to the rotation support block 17220, so that when the tray moves upward, the tray contacts the rotation support block 17220 to rotate to let the tray pass through, and the tray pushes the rotation support block 17220 to return through the rear return spring 17240.
Specifically, the first frame 1810 is provided with at least one scale 200 for marking the height of the stack of trays.
Specifically, the second frame 1710 is provided with at least one scale 200 for marking the height of the stack of trays.
The tray conveying mechanism 190 in this embodiment is provided between the table 160, the tray storage mechanism 180, and the tray recovery mechanism 170, and is configured to convey the tray taken out by the automatic tray taking mechanism 1830 to the table 160 or convey the tray on the table 160 to the automatic tray recovery mechanism 1730.
Specifically, the tray conveying mechanism 190 includes a first stage moving platform 1910, a second stage moving platform 1920, and a carrying platform 1930, wherein the first stage moving platform 1910 extends between the workbench 160, the first frame 1810, and the second frame 1710, and the moving direction is configured to be a horizontal direction, the second stage moving platform 1920 is installed on the first stage moving platform 1910, and the moving direction is configured to be a vertical direction, and the carrying platform 1930 is installed on the second stage moving platform 1920 for carrying a tray.
From this, compare with the manual handling among the prior art, automatically take the tray from tray storage mechanism 180 and place workstation 160 to and take away the tray on workstation 160 automatically and pile up on tray recovery mechanism 170, and then realize the automatic unloading of tray on workstation 160, degree of automation is higher, productivity ratio is higher, and has reduced operator's work burden. Compared with the carrying robot in the prior art, the carrying robot has the advantages that the time of carrying processes at each time can be obviously reduced, the production rate and the stability of system operation are improved, and the control difficulty is reduced. Moreover, the space required by the movement of the robot is not required to be reserved, and the system is more compact.
In a specific embodiment, the jig transferring mechanism comprises a first-stage moving platform, a second-stage moving platform and a bearing platform, wherein the moving direction of the first-stage moving platform is configured to be the horizontal direction, the second-stage moving platform is installed on the first-stage moving platform, the moving direction is configured to be the vertical direction, and the bearing platform is installed on the second-stage moving platform and used for bearing the jig.
In a specific embodiment, the first gripping and transporting mechanism and the second gripping and transporting mechanism are three-axis gripping and transporting mechanisms. The embodiment provides a transport mechanism is snatched to three axles formula, includes: the device comprises a support frame 013, a first-stage linear moving platform 01, a second-stage linear moving platform 02, a third-stage linear moving platform 03, a first adsorption device 04, a lifting device 08 and a second adsorption device 05.
Wherein, the first stage linear moving platform 01 is installed on the support frame 013, and the moving direction is the horizontal direction.
The second-stage linear moving platform 02 is installed on the first-stage linear moving platform 01, and the moving direction of the second-stage linear moving platform 02 is the horizontal direction and is perpendicular to the moving direction of the first-stage linear moving platform 01.
Wherein, the third stage linear motion platform 03 is installed on the second stage linear motion platform 02, and the moving direction of the third stage linear motion platform 03 is the vertical direction.
The first-stage linear moving platform 01, the second-stage linear moving platform 02 and the third-stage linear moving platform 03 are all driven by linear driving mechanisms, such as electric cylinders, screw rod mechanisms, linear motors and the like.
From this, this three-axis type snatchs transport mechanism has tertiary rectilinear movement platform, can provide X axle, Y axle, the three-dimensional solid of Z axle and remove, is convenient for get in three-dimensional space and puts the material, and because moving platform is rectilinear movement, the moving structure reliability is stronger, the control degree of difficulty is lower.
In this embodiment, the first adsorption device 04 is mounted on the third stage linear movement platform 03, the lifting device 08 is mounted on the third stage linear movement platform 03, and the second adsorption device 05 is mounted on the lifting device 08 such that the second adsorption device 05 can move up and down with respect to the first adsorption device 04. Wherein, the lifting device 08 can be a cylinder. Therefore, the same three-axis type grabbing and carrying mechanism is provided with two sets of adsorption devices which can be respectively suitable for different operation actions, and the second adsorption device 05 can move up and down relative to the first adsorption device 04 and can adapt to adsorption of various workpieces on different height surfaces.
As a specific first suction device 04, the first suction device 04 includes a first air path 044 plate 041, a second air path plate 042 and at least one elastic suction cup 043, the first air path plate 041 is disposed on the rear surface of the second air path plate 042, the elastic suction cup 043 is disposed on the front surface of the second air path plate 042, a plurality of suction holes 045 are disposed on the elastic suction cup 043, a plurality of vent holes are disposed on the second air path plate 042, the vent holes and the suction holes 045 are communicated in a one-to-one correspondence manner, an air groove is disposed on the rear surface of the second air path plate 042, the vent hole corresponding to each elastic suction cup 043 is disposed in the air groove, and an air path for communicating the air groove is disposed on the first air path plate 041.
As a specific second adsorption device 05, the second adsorption device 05 includes a third air channel plate 051, a fourth air channel plate 052 and at least one elastic sucker 053, the third air channel plate 051 is arranged on the rear surface of the fourth air channel plate 052, the elastic sucker 053 is arranged on the front surface of the fourth air channel plate 052, a plurality of suction holes 055 are arranged on the elastic sucker 053, a plurality of vent holes 057 are arranged on the fourth air channel plate 052, the vent holes 057 are communicated with the suction holes 055 in a one-to-one correspondence manner, an air groove 056 is arranged on the rear surface of the fourth air channel plate 052, the vent hole 057 corresponding to each elastic sucker 053 is arranged in the air groove 056, and an air path for communicating the air groove 056 is arranged on the third air channel plate 051.
In this embodiment, the lowest working surface of the second adsorption apparatus 05 is lower than the lowest working surface of the first adsorption apparatus 04.
Preferably, in the first suction device 04, the number of the elastic suction cups 043 is plural, and the plural elastic suction cups 043 are arranged at intervals in the linear direction on the front surface of the second air path plate 042.
Preferably, in the second suction device 05, the number of the elastic suction cups 053 is plural, and the plural elastic suction cups 53 are provided at intervals in the linear direction on the front surface of the fourth gas passage plate 052.
Based on the design, because each elastic sucker is provided with a plurality of air suction holes, when the adsorption operation is executed, a plurality of adsorption points are formed between each elastic sucker and the corresponding workpiece, and the precise adsorption of small workpieces such as small electronic devices is realized. Moreover, as each elastic sucker is provided with a plurality of air suction holes, for a plurality of staggered and stacked electronic devices, each electronic device can be provided with a corresponding air suction hole, and the simultaneous adsorption capacity of the same elastic sucker on the plurality of electronic devices is realized.
Furthermore, each adsorption device is provided with a plurality of elastic suckers, batch adsorption of small electronic devices is achieved, and operation efficiency can be remarkably improved.
Preferably, a linear guide rail (not shown in the figure) is arranged between the first adsorption device 04 and the third stage linear moving platform 03, and the first adsorption device 04 is movably mounted on the third stage linear moving platform 03 through the linear guide rail.
Preferably, a buffer spring 06 is disposed between the first adsorption device 04 and the third stage linear moving platform 03.
Preferably, a linear guide rail (not shown in the figure) is arranged between the second suction device 05 and the lifting device 08, and the second suction device 05 is movably mounted on the lifting device 08 through the linear guide rail.
Preferably, a buffer spring 07 is disposed between the second adsorption device 05 and the lifting device 08.
Based on the design, the buffer capacity is realized in the process of contacting the electronic device, and the fragile workpiece can be prevented from being damaged.
In this embodiment, the theory of operation of three-axis type snatchs transport mechanism includes: 1. the first adsorption device 04 absorbs the first workpiece 010 from the jig and places the first workpiece 010 in the special tray; 2. the first suction device 04 sucks the second workpiece 011 from another tray and puts the second workpiece 011 into the jig; 3. the lifting device 08 drives the second adsorption device 05 to move downwards, the working surface of the second adsorption device 05 is lower than the first adsorption device 04, and the second adsorption device 05 absorbs the third workpiece 012 from the tray and places the third workpiece 012 into the jig.
In a specific embodiment, the third grabbing and carrying mechanism is a two-axis grabbing and carrying mechanism, and comprises a support frame, a first stage linear moving platform, a second stage linear moving platform and an adsorption mechanism. The first-stage linear moving platform is installed on the support frame, the moving direction of the first-stage linear moving platform is the horizontal direction, the second-stage linear moving platform is installed on the first-stage linear moving platform, the moving direction of the second-stage linear moving platform is the vertical direction, and the adsorption mechanism is installed on the second-stage linear moving platform.
In a particular embodiment, the welding mechanism comprises a laser welding mechanism.
Those skilled in the art will appreciate that the figures are merely schematic representations of one preferred implementation scenario and that the blocks or flow diagrams in the figures are not necessarily required to practice the present invention. Those skilled in the art will appreciate that the modules in the devices in the implementation scenario may be distributed in the devices in the implementation scenario according to the description of the implementation scenario, or may be located in one or more devices different from the present implementation scenario with corresponding changes. The modules of the implementation scenario may be combined into one module, or may be further split into a plurality of sub-modules. The above-mentioned invention numbers are merely for description and do not represent the merits of the implementation scenarios.
The above disclosure is only a few specific implementation scenarios of the present invention, however, the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. An automatic soldering system for flexible circuit boards, applied to automatic soldering of flexible circuit boards preferably including flexible circuits, a base plate, a tongue, and a carrier plate, comprising:
the device comprises a welding table, a welding mechanism and a plurality of loading and unloading tables, wherein the loading and unloading tables and the welding table are all configured to receive and position jigs, the jigs are configured to position whole or partial components of a plurality of flexible circuit boards, and the welding mechanism is arranged above the welding table to weld the flexible circuit boards on the jigs;
the automatic feeding and discharging mechanisms are configured to automatically store, automatically feed and automatically discharge the subcomponents of the flexible circuit boards and the welded flexible circuit boards;
a plurality of jig transfer mechanisms configured to transfer jigs between the mounting and dismounting stages and the welding stage;
and the grabbing and carrying mechanisms are configured to grab and carry materials among the loading platform, the welding platform and the automatic loading and unloading mechanism.
2. The automatic welding system for flexible circuit boards according to claim 1, wherein the welding station comprises a first linear moving platform, a protective atmosphere mechanism and a pressing plate mechanism, and a bracket assembly for supporting a jig is arranged on the first linear moving platform;
the protective atmosphere mechanism comprises a nozzle body, a protective atmosphere conveying pipeline and a nozzle pushing mechanism, the nozzle pushing mechanism is installed on the support assembly, the protective atmosphere conveying pipeline is connected with the nozzle body, and the nozzle body is installed on the nozzle pushing mechanism and is inserted into a jig to inject protective atmosphere under the driving of the nozzle pushing mechanism;
the pressing plate mechanism comprises a pressing plate assembly and a pressing plate driving assembly, the pressing plate driving assembly is connected with the pressing plate assembly to drive the pressing plate assembly to move downwards to press the flexible circuit board, and through holes in one-to-one correspondence with welding points of the flexible circuit board are formed in the pressing plate assembly.
3. The automatic welding system for flexible circuit boards according to claim 1, wherein the plurality of the loading bays includes a first loading bay, a second loading bay, and a third loading bay, and the plurality of the gripping and conveying mechanisms includes a first gripping and conveying mechanism, a second gripping and conveying mechanism, and a third gripping and conveying mechanism;
the first grabbing and carrying mechanism is used for carrying the base plate, the tongue piece and the bearing plate which are automatically discharged from the automatic material loading and discharging mechanisms to the first loading and unloading platform, and carrying the welded flexible circuit board to one or more groups of automatic material loading and discharging mechanisms from the first loading and unloading platform for automatic storage;
the second grabbing and carrying mechanism is used for carrying the soft lines and the cover plates which are automatically discharged from one or more groups of automatic loading and unloading mechanisms to the second loading and unloading platform;
the third grabbing and carrying mechanism is used for grabbing the cover plate from the jig of the third loading and unloading platform and carrying the cover plate to one or more groups of automatic loading and unloading mechanisms;
one of the jig transfer mechanisms is used for transferring jigs between the third loading platform and the first loading platform, and one of the jig transfer mechanisms is used for transferring jigs between the first loading platform and the second loading platform.
4. The automatic soldering system according to claim 1, wherein at least one of the plurality of sets of automatic loading/unloading mechanisms is configured to receive and store the soldered flexible circuit board, at least one of the plurality of sets of automatic loading/unloading mechanisms is configured to load and unload the substrate, at least one of the plurality of sets of automatic loading/unloading mechanisms is configured to load and unload the assembly of the tongue piece and the carrier plate, and at least one of the plurality of sets of automatic loading/unloading mechanisms is configured to load and unload the flexible circuit board.
5. The automatic welding system for flexible circuit boards according to claim 4, wherein the automatic loading and unloading mechanism includes a table, a tray storage mechanism, a tray recovery mechanism, and a tray conveying mechanism, the tray storage mechanism includes a first rack, a first set of tray support mechanisms, and an automatic tray taking mechanism, the first set of tray support mechanisms being provided on the first rack for supporting a stack of trays formed by trays stacked up and down, the automatic tray taking mechanism being provided for automatically taking out a tray at a bottommost tray of the stack of trays;
the tray recycling mechanism comprises a second rack, a second group of tray supporting mechanisms and an automatic tray recycling mechanism, the second group of tray supporting mechanisms are arranged on the second rack and used for supporting a tray stack formed by trays which are stacked up and down, and the automatic tray recycling mechanism is used for automatically stacking the trays to the bottommost part of the tray stack;
the tray conveying mechanism is arranged between the workbench, the tray storage mechanism and the tray recovery mechanism and used for conveying the trays taken out by the automatic tray taking mechanism to the workbench or conveying the trays on the workbench to the automatic tray recovery mechanism.
6. The automatic welding system for flexible circuit boards according to claim 1, wherein the jig transfer mechanism includes a first stage moving platform, a second stage moving platform, and a carrier table, wherein a moving direction of the first stage moving platform is configured in a horizontal direction, the second stage moving platform is mounted on the first stage moving platform, and a moving direction is configured in a vertical direction, and the carrier table is mounted on the second stage moving platform for carrying a jig.
7. The automatic welding system for flexible circuit boards according to claim 3, wherein the first and second gripping and carrying mechanisms are three-axis gripping and carrying mechanisms including a support frame, a first stage linear moving platform, a second stage linear moving platform, a third stage linear moving platform, and an adsorption mechanism;
first order rectilinear movement platform installs support frame, and direction of movement are the horizontal direction, second level rectilinear movement platform installs on the first order rectilinear movement platform, second level rectilinear movement platform's direction of movement is horizontal direction, and perpendicular to first order rectilinear movement platform's direction of movement, third level rectilinear movement platform installs on the second level rectilinear movement platform, third level rectilinear movement platform's direction of movement is vertical direction, adsorption apparatus installs on the third level rectilinear movement platform.
8. The automatic soldering system for a flexible wiring board according to claim 7, wherein said suction mechanism includes a first suction device, a lifting device, and a second suction device, the first suction device being mounted on said third stage linearly moving platform, said lifting device being mounted on said third stage linearly moving platform, said second suction device being mounted on said lifting device so that said second suction device can move up and down with respect to said first suction device.
9. The automatic welding system for flexible circuit boards according to claim 3, wherein the third gripping and carrying mechanism is a two-axis gripping and carrying mechanism including a support frame, a first stage linear moving platform, a second stage linear moving platform and an adsorption mechanism;
the first stage linear motion platform is installed the support frame, and the direction of movement is the horizontal direction, the second level linear motion platform is installed on the first stage linear motion platform, the direction of movement of second level linear motion platform is vertical direction, adsorption device installs on the second level linear motion platform.
10. The automatic welding system for flexible wiring boards according to claim 1, wherein the welding mechanism comprises a laser welding mechanism.
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| CN202010120356.4A CN111195790A (en) | 2020-02-26 | 2020-02-26 | Automatic welding system for flexible circuit board |
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| CN202010120356.4A CN111195790A (en) | 2020-02-26 | 2020-02-26 | Automatic welding system for flexible circuit board |
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Address after: 523078 Building 3, No. 2, Xinke Road, Nancheng Street, Dongguan City, Guangdong Province Applicant after: Guangdong Saide Automation Technology Co.,Ltd. Address before: 523000 Xinke plant area, Hongyuan Industrial Zone, Xinke Road, Nancheng street, Dongguan City, Guangdong Province Applicant before: GUANGDONG HONGYUAN XINKE AUTOMATION TECHNOLOGY DEVELOPMENT Co.,Ltd. |