CN117497272A - Alloy foil resistor manufacturing process and alloy foil resistor - Google Patents
Alloy foil resistor manufacturing process and alloy foil resistor Download PDFInfo
- Publication number
- CN117497272A CN117497272A CN202311288666.7A CN202311288666A CN117497272A CN 117497272 A CN117497272 A CN 117497272A CN 202311288666 A CN202311288666 A CN 202311288666A CN 117497272 A CN117497272 A CN 117497272A
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- CN
- China
- Prior art keywords
- substrate
- layer
- alloy foil
- foil resistor
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000956 alloy Substances 0.000 title claims abstract description 80
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 80
- 239000011888 foil Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 111
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000010949 copper Substances 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000007747 plating Methods 0.000 claims abstract description 35
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000002313 adhesive film Substances 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 239000011241 protective layer Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 52
- 238000004544 sputter deposition Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 4
- 230000008439 repair process Effects 0.000 claims description 2
- 229920000297 Rayon Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention discloses a manufacturing process of an alloy foil resistor, which comprises the following steps: adhering an adhesive film to the surface of the alloy sheet; adhering an alloy sheet to the surface of a ceramic sheet through an adhesive film to form a first substrate; pressing the first substrate through a pressing jig; attaching a dry film on the surface of the alloy sheet of the first substrate to form a second substrate; exposing, developing and etching the second substrate in sequence to form a third substrate; film stripping treatment is carried out on the third substrate to form a fourth substrate; printing a copper plating mask on the surface of the fourth substrate to form a fifth substrate; copper plating electrodes are hung on the surface of the fifth substrate to form a sixth substrate; cutting and plating a bridge on the sixth substrate to form a seventh substrate; repairing the alloy sheet between the copper plating electrodes in the seventh substrate to form an eighth substrate; printing a protective layer to form a ninth substrate; solves the problems of complex manufacturing process and poor stability of the manufactured alloy foil resistor in the prior art.
Description
Technical Field
The invention relates to the field of alloy foil resistor manufacturing, in particular to an alloy foil resistor manufacturing process and an alloy foil resistor.
Background
Along with the progress of technology, the development of age and the continuous improvement of miniaturization requirements of electronic products by people, the chip resistor with reliable performance and stable process also presents a diversified development trend according to the characteristic requirements of the electronic products, and the alloy foil chip resistor is a resistor device which is manufactured by adopting a thick film process and has good stability, precision and reliability, and is generally composed of a foil layer, an insulating layer and a welding pad, and is widely applied to electronic equipment and circuits. At present, the manufacturing process of the alloy foil resistor is complicated, and the manufactured alloy foil resistor has poor stability.
Therefore, the invention provides a manufacturing process of alloy foil resistor, which can efficiently prepare the alloy foil resistor and has strong stability.
Disclosure of Invention
The invention aims to provide an alloy foil resistor manufacturing process and an alloy foil resistor, which solve the problems that the existing alloy foil resistor manufacturing process is complicated and the manufactured alloy foil resistor is poor in stability.
In order to achieve the above object, the present invention provides an alloy foil resistor manufacturing process, comprising:
1) Adhering an adhesive film on the surface of the alloy sheet, and cutting;
2) Adhering the alloy sheet to the surface of the ceramic sheet through an adhesive film, and performing lamination treatment to form a first substrate;
3) Laminating the first substrate by using a laminating jig, and baking;
4) Attaching a dry film on the surface of the alloy sheet of the first substrate to form a second substrate;
5) Exposing, developing and etching the second substrate in sequence to form a third substrate;
6) Film stripping treatment is carried out on the third substrate to form a fourth substrate;
7) Printing a copper plating mask on the surface of the fourth substrate, exposing and developing to form a fifth substrate;
8) A copper plating electrode is hung on the surface of the fifth substrate to form a sixth substrate;
9) Cutting and plating a bridge on the sixth substrate to form a seventh substrate;
10 Repairing the alloy sheet between the copper plating electrodes in the seventh substrate to form an eighth substrate;
11 And (3) printing a protective layer between the two copper plating electrodes to form a ninth substrate.
Preferably, the ceramic sheet bottom surface of the ninth substrate is subjected to a marking treatment to form a printed layer.
Preferably, the ninth substrate is diced using a laser dicing saw.
Preferably, both sides and bottom portions of the ninth substrate are subjected to vacuum sputtering treatment.
Preferably, the outside of the vacuum sputtering layer is sequentially subjected to copper-plating nickel-tin layer rolling treatment.
The invention also provides an alloy foil resistor, which is prepared by the manufacturing process;
comprises a copper plating electrode, an alloy sheet, an adhesive film, a ceramic sheet and a printing layer from top to bottom;
an L-shaped vacuum sputtering layer is formed on two sides of the ninth substrate;
the outside of the vacuum sputtering layer is a copper layer, a nickel layer and a tin layer in sequence.
Preferably, the vertical section of the vacuum sputtering layer is sequentially attached to the side surfaces of the copper plating electrode, the alloy sheet, the adhesive film and the ceramic sheet, and the horizontal section of the vacuum sputtering layer is attached to the bottom surface of the ceramic sheet.
Preferably, the copper layer, the nickel layer and the tin layer are all in a U-shaped structure, wherein the copper layer is attached to the copper plating electrode.
The invention provides an alloy foil resistor manufacturing process, which comprises the following steps of: adhering an adhesive film on the surface of the alloy sheet, and cutting; adhering an alloy sheet to the surface of a ceramic sheet through an adhesive film, and performing lamination treatment to form a first substrate; laminating the first substrate by using a laminating jig, and baking; attaching a dry film on the surface of the alloy sheet of the first substrate to form a second substrate; exposing, developing and etching the second substrate in sequence to form a third substrate; film stripping treatment is carried out on the third substrate to form a fourth substrate; printing a copper plating mask on the surface of the fourth substrate, exposing and developing to form a fifth substrate; copper plating electrodes are hung on the surface of the fifth substrate to form a sixth substrate; cutting and plating a bridge on the sixth substrate to form a seventh substrate; repairing the alloy sheet between the copper plating electrodes in the seventh substrate to form an eighth substrate; printing a protective layer between the two copper plating electrodes to form a ninth substrate; the alloy foil resistor manufacturing process provided by the invention greatly improves the manufacturing efficiency of the alloy foil resistor, and the manufactured alloy foil resistor has good stability.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
FIG. 1 is a schematic diagram of a manufacturing process step (1) of an alloy foil resistor provided by the invention;
FIG. 2 is a schematic diagram of the alloy foil resistor manufacturing process step (2) provided by the invention;
FIG. 3 is a schematic diagram of the alloy foil resistor manufacturing process step (4) provided by the invention;
FIG. 4 is a block diagram of a third substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 5 is a block diagram of a fourth substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 6 is a block diagram of a fifth substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 7 is a block diagram of a sixth substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 8 is a block diagram of a seventh substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 9 is a block diagram of an eighth substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 10 is a block diagram of a ninth substrate in the alloy foil resistor manufacturing process provided by the invention;
FIG. 11 is a block diagram of a printed layer in the alloy foil resistor manufacturing process provided by the invention;
fig. 12 is a block diagram of an alloy foil resistor provided by the present invention.
Description of the reference numerals
1-an adhesive film; 2-alloy sheet; 3-ceramic plates; 4-dry film; 5-a third substrate; 6-a fourth substrate; 7-copper plating mask; 8-a fifth substrate; 9-copper plating electrodes; 10-a sixth substrate; 11-a seventh substrate; 12-eighth substrate; 13-a ninth substrate; 14-printing a protective layer; 15-a printed layer; 16-vacuum sputtering the layer; 17-copper layer; 18-a nickel layer; 19-tin layer.
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
As shown in fig. 1-12: the invention provides an alloy foil resistor manufacturing process, which comprises the following steps of: 1. adhering an adhesive film 1 to the surface of an alloy sheet 2, and cutting; 2. adhering an alloy sheet 2 to the surface of a ceramic sheet 3 through an adhesive film 1, and performing lamination treatment to form a first substrate; 3. laminating the first substrate by using a laminating jig, and baking; 4. attaching a dry film 4 on the surface of the alloy sheet 2 of the first substrate to form a second substrate; 5. exposing, developing and etching the second substrate in sequence to form a third substrate 5; 6. film stripping treatment is carried out on the third substrate 5 to form a fourth substrate 6; 7. printing a copper plating mask 7 on the surface of the fourth substrate 6, and exposing and developing to form a fifth substrate 8; 8. a copper plating electrode 9 is hung on the surface of the fifth substrate 8 to form a sixth substrate 10; 9. cutting and plating the sixth substrate 10 to form a seventh substrate 11; 10. performing repair treatment on the alloy sheet 2 between the copper plating electrodes 9 in the seventh substrate 11 to form an eighth substrate 12; 11. a protective layer 14 is printed between the two copper-plated electrodes 9 to form a ninth substrate 13. The alloy foil resistor manufacturing process provided by the invention greatly improves the manufacturing efficiency of the alloy foil resistor, and the manufactured alloy foil resistor has good stability.
In a preferred embodiment of the present invention, the bottom surface of the ceramic sheet 3 of the ninth substrate 13 is subjected to a marking process to form a printed layer 15 in order to mark the alloy foil resistance.
In a preferred embodiment of the invention, the ninth substrate 13 is slit using a laser dicing saw in order to divide the whole alloy foil resistor.
In a preferred embodiment of the present invention, both sides and bottom portions of the ninth substrate 13 are subjected to a vacuum sputtering process in order to facilitate subsequent copper plating with nickel tin.
In a preferred embodiment of the present invention, the outside of the vacuum sputtering layer is sequentially subjected to a copper-plated nickel-tin layer rolling treatment.
The invention also provides an alloy foil resistor, which is prepared by the manufacturing process; comprises a copper plating electrode 9, an alloy sheet 2, an adhesive film 1, a ceramic sheet 3 and a printing layer 15 from top to bottom; an L-shaped vacuum sputtering layer 16 is formed on two sides of the ninth substrate 13; the outside of the vacuum sputtering layer 16 is sequentially provided with a copper layer 17, a nickel layer 18 and a tin layer 19; the vertical section of the vacuum sputtering layer 16 is sequentially attached to the side surfaces of the copper plating electrode 9, the alloy sheet 2, the adhesive film 1 and the ceramic sheet 3, and the horizontal section of the vacuum sputtering layer 16 is attached to the bottom surface of the ceramic sheet 3; the copper layer 17, the nickel layer 18 and the tin layer 19 are all in a U-shaped structure, wherein the copper layer 17 is attached to the copper plating electrode 9.
The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the scope of the technical concept of the present invention, and all the simple modifications belong to the protection scope of the present invention.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the invention can be made without departing from the spirit of the invention, which should also be considered as disclosed herein.
Claims (8)
1. An alloy foil resistor manufacturing process, characterized in that the alloy foil resistor manufacturing process comprises:
1) Attaching the viscose film (1) on the surface of the alloy sheet (2) and cutting;
2) Adhering an alloy sheet (2) to the surface of a ceramic sheet (3) through an adhesive film (1), and performing lamination treatment to form a first substrate;
3) Laminating the first substrate by using a laminating jig, and baking;
4) Attaching a dry film (4) on the surface of the alloy sheet (2) of the first substrate to form a second substrate;
5) Exposing, developing and etching the second substrate in sequence to form a third substrate (5);
6) Film stripping treatment is carried out on the third substrate (5) to form a fourth substrate (6);
7) Printing a copper plating mask (7) on the surface of the fourth substrate (6), and exposing and developing to form a fifth substrate (8);
8) A copper plating electrode (9) is hung on the surface of the fifth substrate (8) to form a sixth substrate (10);
9) Cutting and plating a bridge on the sixth substrate (10) to form a seventh substrate (11);
10 Performing repair treatment on the alloy sheet (2) between the copper plating electrodes (9) in the seventh substrate (11) to form an eighth substrate (12);
11 And a ninth substrate (13) is formed by printing a protective layer (14) between the two copper plating electrodes (9).
2. The alloy foil resistor manufacturing process according to claim 1, wherein the bottom surface of the ceramic sheet (3) of the ninth substrate (13) is subjected to a marking process to form a printed layer (15).
3. The alloy foil resistor manufacturing process according to claim 1, characterized in that the ninth substrate (13) is slit by means of a laser dicing saw.
4. Alloy foil resistor manufacturing process according to claim 1, characterized in that both sides and bottom parts of the ninth substrate (13) are subjected to a vacuum sputtering process.
5. The process for manufacturing an alloy foil resistor according to claim 4, wherein the vacuum sputtering layer is sequentially copper-plated nickel-tin layer-plated outside.
6. An alloy foil resistor, characterized in that the alloy foil resistor is produced by the manufacturing process according to any one of claims 1-5;
comprises a copper plating electrode (9), an alloy sheet (2), an adhesive film (1), a ceramic sheet (3) and a printing layer (15) from top to bottom;
an L-shaped vacuum sputtering layer (16) is formed on two sides of the ninth substrate (13);
the outside of the vacuum sputtering layer (16) is a copper layer (17), a nickel layer (18) and a tin layer (19) in sequence.
7. Alloy foil resistor according to claim 6, characterized in that the vertical section of the vacuum sputtering layer (16) is attached to the side surfaces of the copper plating electrode (9), the alloy sheet (2), the adhesive film (1) and the ceramic sheet (3) in sequence, and the horizontal section of the vacuum sputtering layer (16) is attached to the bottom surface of the ceramic sheet (3).
8. Alloy foil resistor according to claim 7, characterized in that the copper layer (17), nickel layer (18) and tin layer (19) are all of U-shaped structure, wherein the copper layer (17) is attached to the copper-plated electrode (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311288666.7A CN117497272A (en) | 2023-10-07 | 2023-10-07 | Alloy foil resistor manufacturing process and alloy foil resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311288666.7A CN117497272A (en) | 2023-10-07 | 2023-10-07 | Alloy foil resistor manufacturing process and alloy foil resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117497272A true CN117497272A (en) | 2024-02-02 |
Family
ID=89666694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311288666.7A Pending CN117497272A (en) | 2023-10-07 | 2023-10-07 | Alloy foil resistor manufacturing process and alloy foil resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117497272A (en) |
-
2023
- 2023-10-07 CN CN202311288666.7A patent/CN117497272A/en active Pending
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