JP2000164458A - Manufacture of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method by which electronic parts, in which such a conductor pattern that does not cause disconnection nor short circuits, particularly, the end connections of each layer of the pattern can be formed to a desired thickness and line width, can be manufactured. SOLUTION: After a first solidified resist section is formed by laminating a first photoresist film upon a base film and exposing the photoresist, a second solidified resist section is formed by laminating a second photoresist film upon the first resist section and exposing the photoresist. Then a green sheet 22 is formed by removing the first and second photoresist films and applying and drying slurry. After the base film is stripped, the green sheet 22 is brought to completion by removing the first and second solidified resist sections and forming conductor patterns 28a and 28b, a conductor layer, and a through hole section 27b by filling conductive paste by filling conductive paste. Finally, electronic parts (a green sheet laminate) 30 is completed by laminating the green sheet 22 upon another green sheet 22 and baking the laminate 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component by firing a green sheet laminate in which green sheets in which conductive patterns are embedded are formed.

[0002]

2. Description of the Related Art In order to meet the demand for smaller and thinner electronic components, green sheets (ceramic sheets) are used.
By forming a conductor pattern on the green sheet and laminating the conductor pattern, electronic components such as a built-in substrate of various passive elements as a green sheet laminate are manufactured.
Also, an electronic component having excellent heat resistance, in which a large number of semiconductor elements are mounted on the green sheet laminate, has been manufactured.

[0003] As a method for manufacturing an electronic component comprising such a green sheet laminate, for example, a slurry is prepared by mixing various ceramic powders such as a dielectric, a magnetic substance and an insulator with an organic binder, a plasticizer and an organic solvent. The slurry is applied onto a resin base film by a doctor blade method, dried, and then the base film is peeled to form a green sheet.

[0004] Next, the above-mentioned green sheet is divided (cut) into predetermined dimensions, and holes are punched by punches to form reference holes and via holes (through holes) serving as alignment marks. The via hole is filled with a conductive paste to form a portion to be an end connection portion (via portion) of each layer of the conductor pattern after lamination. Further, a conductor pattern (conductive paste) is printed on the surface of the green sheet by a printing method. After drying the printed conductor pattern, the green sheets are laminated while being aligned with the alignment mark as a reference, and fired at a predetermined atmosphere and temperature to complete an electronic component comprising a green sheet laminate.

[0005] In this case, instead of the above-described method of dividing the green sheet into layers and then laminating the divided green sheets, after laminating the green sheets,
After forming a concave groove with a die saw or forming a V-shaped groove with a half cutter to facilitate division after firing, so-called half-cut processing, the fired product of the green sheet laminate is divided at the half-cut position (Chocolate break) is also used.

[0006]

An electronic component comprising a conventional green sheet laminate formed in this manner is:
Since the conductor pattern is formed on the green sheet by the printing method, there is a problem that the line width of the conductor pattern cannot be formed to several tens μm or less, and the positional accuracy is not good. In addition, since the conductor pattern is formed in a convex shape on the green sheet, local pressure is applied during lamination and pressure bonding, which causes cracks after firing and irregularities on the surface of the green sheet.

Further, when a thin film method is used instead of the above-described printing method as a method of forming a conductor pattern on a green sheet, a film having a thickness exceeding 10 μm cannot be formed even if the film thickness is large. There is a problem that the resistance of the body cannot be reduced.

Further, since the thickness of the green sheet is thick and somewhat soft, when the green sheet on which the conductive pattern is formed by the printing method or the thin film method is pressed during lamination, the conductive pattern is embedded in the green sheet. If the thickness of the green sheet is relatively small, the green sheet is deformed by pressure and cannot absorb the thickness of the conductor pattern, and a gap is formed between the end of the conductor pattern and the green sheet, and the terminal is not plated during plating. The plating solution penetrates from the electrodes and erodes the conductor pattern.

Further, when laminating the green sheets, the via holes connected to the conductor pattern are deformed by the pressing force, the end connection portions of each layer of the conductor pattern are crushed, and the conductor pattern of each layer is disconnected. There is. Instead of the method of forming the via hole, a printing multilayer method in which a slurry for the green sheet and the photosensitive conductive paste are alternately half-printed, dried, and stacked is also used. , Since the coil can be wound only half a turn per layer, the number of times of printing increases,
It is uneconomical to print and remove the conductive paste after etching.

In the case where the electronic component is a laminated inductor composed of a coil-shaped conductor pattern, the terminal connection portions and the terminals (terminal electrodes) of the conductor pattern are sufficiently coated with the conductive paste for the above-described reason. It is necessary to fill a large amount to achieve high density, but there is a disadvantage that the filling is insufficient due to the large depth of the via hole (the depth is larger than the diameter). On the other hand, regarding the coil portion, since the shrinkage ratio during firing of the green sheet is larger in the green sheet than in the conductive paste, the conductive paste is diffused into the green sheet, thereby lowering the insulation resistance. Rather, it is preferable to keep the gap between the filled conductive paste and the green sheet. However, it is difficult to change the filling amount of the conductive paste locally by the conventional method.

The present invention has been made in consideration of such problems, and can form a conductor pattern having a desired thickness and line width with high positional accuracy. The conductor pattern is not deformed, and the end connection portions of each layer of the conductor pattern can be reliably formed. Further, the density of the conductor pattern can be freely adjusted according to the application of each part. An object of the present invention is to provide a method for manufacturing an electronic component that can be performed.

[0012]

A method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component by firing a green sheet laminate in which green sheets having a conductive pattern embedded therein are laminated. Forming a recess in the green sheet in advance for embedding the conductor pattern,
A conductive pattern is formed by filling the recess with a conductive paste.

[0013] This makes it possible to form a conductor pattern having a desired thickness and a desired line width with high positional accuracy, and thus to reduce the size of an electronic component. In addition, there is no problem such as disconnection or short circuit due to deformation of the conductor pattern due to pressure during lamination of the green sheets. Furthermore, the width of the concave portion for embedding the conductor pattern and the groove width of the printing mask are arbitrarily combined, and the filling amount (printing amount) of the conductive paste is adjusted to suit the use of each part of the conductor pattern. The density can be adjusted freely. The present invention can be suitably applied to a so-called high-power product (large component) having a large conductor pattern line width.

In the method of manufacturing an electronic component according to the present invention, a photoresist film is laminated on a base film, the photoresist film is exposed to form a solidified resist portion, and the photoresist film is developed. The solidified resist portion was formed on the base film as a convex portion, and a ceramic slurry was laminated on the base film to a thickness such that the top of the solidified resist portion was exposed, followed by drying, and the solidified resist portion was embedded. Forming a green sheet, removing the solidified resist portion from the green sheet,
Forming a recess in the green sheet, filling the recess with a conductive paste, embedding and forming the conductor pattern in the green sheet, and removing the base film from the green sheet. It is characterized by. At this time, the base film may be peeled off at the time of removing the solidified resist portion, immediately before laminating a predetermined number of green sheets at once, or laminating at least two green sheets. Then, it may be after crimping. In particular, when the green sheet is thin, it is preferable to peel the base film as late as possible in order to secure rigidity. Thereby, the effects of the invention described above can be suitably exhibited.

Further, in the method for manufacturing an electronic component according to the present invention, a first photoresist film is laminated on the base film, and the first photoresist film is exposed to form a first solidified resist portion. And a second on the base film.
Laminating a photoresist film, exposing the second photoresist film and laminating a solidified resist on a part of the first solidified resist portion to provide a second solidified resist portion,
Developing the first and second photoresist films, forming a second solidified resist portion on the base film as a convex portion with the first solidified resist portion partially laminated stepwise; Laminating a ceramic slurry to a thickness that exposes the top of the second solidified resist portion on the base film, followed by drying to form a green sheet in which the first and second solidified resist portions are embedded, The base film is peeled from the green sheet, the first and second solidified resist portions are removed, a concave portion and a through hole having a step are formed in the green sheet, and a conductive paste is formed in the through hole. And filling the recesses with a conductive paste, thereby embedding the conductive pattern and the end connection portions of each layer of the conductive pattern in a green sheet. And wherein the door.

Thus, the effects of the present invention described above can be suitably exhibited. In addition, since the end connection portion of each layer of the conductor pattern can be reliably formed, the step of forming a via hole can be omitted. Furthermore, the end connection portions (via portions) of the conductor patterns are not deformed and crushed when the green sheets are laminated, and therefore, there is no disconnection between the conductor patterns of each layer of the green sheets.

Further, in the method of manufacturing an electronic component according to the present invention, a photoresist film is laminated on a base metal, the photoresist film is exposed and developed to form a concave portion, and the concave portion is plated. Filling and forming a plating layer, removing the photoresist film, and producing a master in which the plating layer is formed as a projection on the base metal; and forming the plating layer on the base metal of the master. After laminating the ceramic slurry to a thickness where the top is exposed, drying is performed to form a green sheet in which the plating layer is embedded, the master is peeled from the green sheet, and a recess is formed in the green sheet, Filling the recess with a conductive paste and embedding and forming the conductive pattern in the green sheet. At this time, as the material of the plating layer, either the same material as the base metal or a material different therefrom can be used.

Thus, the effect of the present invention described above can be suitably exerted, and a master having a projection formed of the plating layer formed on a base metal can be used repeatedly. Simplified.

Further, in the method of manufacturing an electronic component according to the present invention, a first photoresist film is laminated on a base metal, and the first photoresist film is exposed and developed to form a first photoresist film.
And a plating process is applied to the first concave portion to fill and form a first plating layer, a second photoresist film is laminated on the base metal, and the second photoresist film is formed. Exposure and development to form a second recess on a portion of the first plating layer, and perform plating on the second recess to form a second plating layer; Second
Removing the photoresist film of step (a), producing a master formed on the base metal using the first plating layer, in which a second plating layer is partially laminated in a stepped manner, as a projection, A ceramic slurry is laminated on the base metal to a thickness such that the top of the second plating layer is exposed, and then dried to form a green sheet in which the first plating layer and the second plating layer are embedded. Forming a third concave portion and a through-hole portion having a step in the green sheet by separating the master from the green sheet; filling the through-hole portion with a conductive paste; Filling the recesses with a conductive paste, and embedding and forming the end portions of the conductor pattern and each layer of the conductor pattern in the green sheet.

Thus, the effects of the present invention described above can be suitably exhibited. In addition, a master in which the plating layer is formed as a protrusion on the base metal can be used repeatedly, thereby simplifying the manufacturing process,
The end connection portion of each layer of the conductor pattern can be reliably formed.

In the method for manufacturing an electronic component according to the present invention, when filling the through-hole with a conductive paste, the through-hole may be vacuum-evacuated from one end of the through-hole of the green sheet. When the conductive paste is filled from the other end of the green sheet, the conductive paste can be reliably filled into the through hole even when the thickness of the green sheet is large.

Further, in the method of manufacturing an electronic component according to the present invention, a desired through-hole portion can be formed together with the conductor pattern.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a method for manufacturing an electronic component according to the present invention will be described below with reference to FIGS.

First, a method for manufacturing an electronic component according to the first embodiment will be described below with reference to FIGS.

As the external dimensions, for example, a base film 10 such as PET (polyethylene terephthalate) having a width and length of about 300 mm and a thickness of about 300 μm is prepared, and a reference hole (not shown) is provided. As shown in FIG.
In a dark room, a photoresist solution (“PMER-N” manufactured by Tokyo Ohka Kogyo Co., Ltd.) composed of a photosensitive acrylic resin and a solvent such as ethyl cellosolve, toluene, and ethyl acetate is applied to the entire surface of the base film 10. After drying, a first negative photoresist film 12 having a thickness of about 25 μm is formed. In this case, a so-called dry film in which a resist film is already formed on a Mylar tape or a PET tape may be used instead of the base film 10. Such a dry film is, for example, 25 μm
m, 38 μm, and 50 μm in thickness are commercially available.

Next, as shown in FIG. 2, a mask 1 is formed on the base film 10 with reference to the reference hole.
4 and expose a light amount of 200 to 300 mJ / cm ² ,
By developing, the first solidified resist portions 16a to 16
6d is formed. Here, the first solidified resist portion 16
a and 16b correspond to, for example, a conductor pattern, and the first solidified resist portions 16c and 16d correspond to through-hole portions.

Next, as shown in FIG. 3, a second negative photoresist film 18 having a thickness of about 25 μm is formed on the base
Exposure is performed with a light amount of mJ / cm ² . Here, the second negative photoresist film 18 is, for example, a dry film formed by laminating a lower cover film and an upper cover film with the second negative photoresist film 18 interposed therebetween (DuPont MRC Dry Film Co., Ltd.). Company-made "FRA0
63-25 ”), the lower cover film is peeled off, and the first negative photoresist film 1 of the base film 10 is removed.
2, the mask 21 is overlaid and exposed, and the upper cover film is peeled off immediately before development, thereby dissolving the first solidified resist portions 16a to 16d which is a problem when a resist solution is directly applied. prevent. As a result, the second solidified resist portions 20a to 20c are respectively formed on a part of the first solidified resist portion 16b and the entire surface of the first solidified resist portions 16c and 16d. Here, the second
The solidified resist portion 20a corresponds to, for example, an end connection portion (via conductor) of each layer of the conductor pattern of the laminated green sheet, and the end connection portion (via) of the first solidified resist portion 16b. The portion other than the laminated portion where the conductor is laminated corresponds to the main body (inner layer) of the conductor pattern.

Then, as shown in FIG. 4, the first and second negative photoresist films 12 and 18 are developed by spraying a 1% sodium carbonate solution. Thereby, the first solidified resist portions 16a to 16d and the second solidified resist portions 20a to 20c are formed on the base film 10 as convex portions. More preferably, the first negative photoresist film 12 is exposed, developed and rinsed with a dedicated developer, then coated with a photoresist, and the formed second negative photoresist film 18 is exposed. Develop, rinse. In this case, negative and positive types are also optional. Generally, there are two combinations of positive and negative resists and positive and negative exposure masks.
In any case, care is taken so as not to alter the quality of the first resist film during the exposure of the second layer. After development,
Further, it is preferable that the entire surface is exposed because the film strength of the first and second solidified resist portions 16a to 16d and 20a to 20c can be increased.

Next, as shown in FIG. 5, the second solidified resist portions 20a to 20a are formed on the base film 10.
A ceramic slurry is applied by screen printing to a portion other than the top so that the top of c is exposed, and then dried, and the first and second solidified resist portions 16a to 16d, 20a to A green sheet 22 in which 20c is embedded is formed. Here, the raised portions of the second solidified resist portions 20a to 20c are smoothed by polishing. At this time, if a solidified resist portion is formed in the shape of a dike around the conductor pattern formed in order to take a large number of products, and a slurry is applied with a hard squeegee, the slurry does not flow out around, And the thickness of the slurry can be regulated. In the case of mass production, slurry can be continuously applied on a tape-like base film such as PET by a doctor blade method. Also,
Instead of these methods, a curtain coat method or the like may be used.

Here, the slurry is a ceramic powder made of silica (SiO ₂ ), alumina (Al ₂ O ₃ ) or the like, an organic binder made of polyvinyl butyral (PVB) or the like,
A mixture prepared by mixing a plasticizer, an organic solvent and the like is used.
Alternatively, barium titanate (BaTi
O ₃₎ dielectric material such as ferrite (Fe ₂ O ₃₎ a magnetic material such as an insulating material, ruthenium oxide (RuO ₂₎
And the like, a material composed of an oxide semiconductor material such as a varistor and a thermistor, and a material composed of a mixture thereof may be used.

Next, as shown in FIG. 6, the base film 10 is peeled off from the green sheet 22, and as shown in FIG. 7, a peeling liquid such as about 3% sodium hydroxide solution is sprayed. By removing the first and second solidified resist portions 16a to 16d and 20a to 20c, a recess 24, a stepped through-hole 25, and through-holes 27a and 27b are formed. The peeling of the base film 10 may not be performed at this stage, but may be performed at a later-described green sheet 22 laminating stage. When the base film 10 is peeled off from the green sheet 22, the green sheet 22 and the base film 10 are provided with flexibility since they are curved while being mutually bent. If burrs remain around the through-holes 25, 27a, 27b, their surfaces are polished at an appropriate stage.

Next, while vacuum-suctioning from one end (the upper part in FIG. 7) of the through holes 25 and 27a of the green sheet 22 at a degree of vacuum of about 67 MPa using a vacuum device (not shown), the through holes 25 and 27a are removed. Mask 26 from the other end of 27a
And the conductive paste is filled by a printing method, and the recess 24 is also filled with the conductive paste. Here, when the thickness of the green sheet 22 is small, the conductive paste may be filled as it is without vacuum suction.

As a result, as shown in FIG. 8, the conductor pattern 28a and the end connection portions 28c of each layer of the conductor pattern are formed.
Pattern 28b and conductor layer 29 on which
Are embedded in the green sheet 22 and the green sheet 22 having the through hole 27b is completed. Accordingly, although the thickness of the green sheet 22 is slightly reduced due to drying and shrinking of the slurry, the green sheet 22 has a thickness close to about 25 + 25 μm corresponding to the entire thickness of the first and second resist films 12 and 18.
It is more preferable that the end connection portions 28c and the top of the conductor layer 29 (the portion exposed from the green sheet) are polished to remove the adhered dirt and to make the surface smooth. Also, instead of the printing method described above, a mask 26
Without using a squeegee, a conductive paste made of a metalloorganic material (metal organic compound) is directly rubbed into the through holes 25 and 27a of the green sheet 22 by a harder squeegee, and the green paste other than the through holes 25 and 27a is used. Sheet 22
Wipe off the conductive paste attached to the surface of
It is more preferable to use a method of reliably removing the conductive paste remaining on the surface by polishing after drying.

Here, the conductive paste is prepared by blending about 90% by weight of Ag powder, about 10% by weight of glass frit, an organic binder and a solvent. A
Instead of g, AgPd, AgPt, Cu, Pt, Ni or the like may be used.

The conductor pattern 28a is, for example, a thin line portion serving as a routing wiring pattern, has a line width of about 50 μm and a thickness of about 25 μm, and is directly formed on the green sheet 22 by a printing method. The line width is narrower and more precise than the method of forming a thin film, and it is thicker than the thin film method, so that a desired line width and thickness can be obtained.

According to the method of the first embodiment, the depth is increased (the ratio of diameter to depth is from 1: 1 to 1: 1) by vacuum suction from one end of the through holes 25 and 27a. 2
The conductive paste can be reliably filled up to the end portions of the through-hole portions 25 and 27a having a step and the favorable end connection portions 28c and the conductive layer 29 without disconnection or the like can be obtained. Further, if the conductive paste is filled using an opening of the mask 26 having a size smaller than that of the corresponding recess 24 and the through hole 25, the recess 24 and the through hole may be filled. 25 can be adjusted to a small amount, and finally, the filled conductive paste (conductor patterns 28a, 28
A gap can be secured between b) and a green sheet described later. As a result, since the shrinkage ratio when firing the green sheet is higher in the green sheet than in the conductive paste, the conductive paste is diffused into the green sheet and the insulation resistance is reduced. Thus, the conductor patterns 28a and 28b suitable as coil components can be obtained. Note that the filling amount of the conductive paste may be reduced by wiping the surface of the green sheet after printing to partially remove the conductive paste.

Then, as shown in FIG. 9, the green sheets 22 formed by the above method are laminated,
After preheating and pressing at a temperature of 5 ° C., the mixture is placed in a firing furnace, heated from room temperature to a temperature of about 600 ° C. at a rate of 30 to 40 ° C./hour, and held at that temperature for 1 hour to remove the binder. 7
The temperature is raised to about 920 ° C. at a rate of 0 to 80 ° C./hour, and the temperature is maintained for 2 hours and fired (sintered), whereby the electronic component 30 according to the first embodiment is completed. . Here, AgPd, AgP
When noble metals such as t and Pt are used, firing is performed in an oxidizing atmosphere. When a base metal such as Cu and Ni is used, firing is performed in a reducing atmosphere. After firing, a resin layer of polyimide or the like is formed on the uppermost layer of the laminate of the green sheets 22, and I
It is preferable to mount components such as C. In the case where an electrode for mounting this component is provided, the temperature is raised to about 850 ° C. for about 1 hour, held for 10 minutes, and fired.

Next, a method for manufacturing an electronic component according to the second embodiment will be described below with reference to FIGS.

First, for example, a base metal 32 made of phosphor bronze having a width and length of about 200 mm and a thickness of 100 μm is prepared, and a reference hole (not shown) is provided. As shown in FIG. 10, the base metal 32 is buffed and degreased, then immersed in a resist solution (“PMER-P” manufactured by Tokyo Ohka Kogyo Co., Ltd.), dried, and dried to a thickness of about 25 μm. One positive photoresist film 34 is formed. In this case, stainless steel or the like may be used as the material of the base metal 32 instead of phosphor bronze. At this time, when the green sheet is peeled off from the base metal 32 after drying the slurry in a later step, since the flexibility of the base metal 32 is required, stainless steel or the like is used as a thin plate as thin as possible. Is preferred.

Then, as shown in FIG. 11, a mask 3 is formed on the base metal 32 based on the reference hole.
6, the first positive photoresist film 34 is exposed, developed, and rinsed to form first concave portions 38 a to 38 d on the base metal 32. Here, the first concave portions 38a and 38b correspond to, for example, a conductor pattern, and the first concave portions 38c and 38d correspond to through-hole portions.

Next, as shown in FIG. 12, a first plating layer 40a made of copper is formed in the first concave portions 38a to 38d.
~ 40d is formed by filling. Here, the first plating layer 40
The materials a to 40d may use nickel or the like instead of the above-described copper.

Then, as shown in FIG. 13, the second positive photoresist film 34 having a thickness of about 25 μm is formed on the base metal 32 in the same manner as the formation of the first positive photoresist film 34.
Is formed, a mask 44 is overlaid, and the resist film 42 is exposed and developed to form second concave portions 46a to 46c.

Next, as shown in FIG. 14, the second recesses 46a to 46c are plated using the same material and method as those used to form the first plating layers 40a to 40d, and the second recesses 46a to 46c are plated. Of the plating layers 48a to 48c. Here, the plating was performed by immersing the base metal 32 as a negative electrode in an acidic copper sulfate bath, arranging a copper plate as an anode electrode on the conductor pattern surface side, and then applying 1 mA / cm between both electrodes.
^A current was passed at a DC current density of 2 to form the second plating layers 48a to 48c having the same thickness as the resist film 42.

Next, as shown in FIG. 15, the first and second resist films 34 and 42 are removed, and the first plating layer 40a and the first plating layers 40b to 40c are formed on the base metal 32. The second plating layers 48a to 48d
A master 50 is formed in which the portions where the layers 48c are stacked are formed as convex portions. A plurality of masters 50 are prepared for each layer corresponding to different conductor patterns.

Next, as shown in FIG. 16, the second plating layers 48a to 48a are formed on the base metal 32 of the master 50.
A ceramic slurry is laminated so as to have a thickness such that a top portion of the first plating layer 48c is exposed and then dried, and the first plating layers 40a to 40d and the second plating layers 48a to 48c are dried.
Are formed to form a green sheet 52. Here, the material of the slurry and the method of laminating the slurry are the same as in the first embodiment.

Next, as shown in FIG. 17, the master 50 is peeled off from the green sheet 52, and a third concave portion 54 and a stepped through hole 5 are formed in the green sheet 52.
6. The through-holes 58a and 58b are formed.

Next, as shown in FIG. 18, one ends of the through holes 56 and 58a of the green sheet 52 (FIG. 18).
Approximately 67MP using a vacuum device (not shown) from above
While vacuum suction is performed at a degree of vacuum a, the mask 60 is overlapped and the same conductive paste as in the first embodiment is filled from the other end side of the through-holes 56 and 58a. The recesses 54 are filled with a conductive paste, and the respective portions of the conductor patterns 62a and 62b and the conductor layer 64 are buried and formed in the green sheet 52, and the green sheet 52 in which the through hole 58b is formed is completed. It is more preferable that the tops (exposed portions of the green sheet) of the conductor pattern 62b and the conductor layer 64 are polished.

The conductor pattern 62a is, for example, a thin line portion serving as a routing wiring pattern, and has a line width of about 50 μm and a thickness of about 25 μm, which is the same as that of the first embodiment. In addition, a desired line width and thickness are obtained. Further, similarly to the case of the first embodiment, a favorable end connection portion (above the conductor pattern 62b) without disconnection or the like is obtained. Also, in the case of the second embodiment, as in the case of the first embodiment, a suitable conductor can be obtained by appropriately adjusting the filling amount of the conductive paste depending on the application. Pattern 6
2a and 62b can be obtained.

As shown in FIG. 19, various conductor patterns 62a and 62b formed by the above-described method are used.
The green component 52 on which is formed is laminated and baked under the same conditions as in the first embodiment, whereby the electronic component 66 according to the second embodiment is formed.
Is completed.

In the electronic components 30 and 66 according to the first and second embodiments, a conductor pattern having a desired thickness and a desired line width is formed with high positional accuracy. It is planned. In addition, there is no problem such as disconnection or short-circuit due to deformation of the conductor pattern due to pressurization at the time of laminating the green sheet, and each part of the conductor pattern is adjusted to an appropriate density according to the application.

FIGS. 20 and 21 show electronic components according to the first and second examples manufactured by using the method for manufacturing an electronic component according to any one of the first and second embodiments.

The electronic component 68 shown in FIG. 20 is formed by laminating, for example, six layers of green sheets 70, and each green sheet 70 has a conductor pattern (inner conductor).
An end connection portion (via conductor) 74 between the second conductor pattern 72 and another conductor pattern 72 is provided. At the lower part of the electronic component 68, a thick film conductor 76 for mounting the wiring board is provided, which is connected to the end connection part 74, while the upper part is also connected to the end connection part 74. A thick film conductor 76 is provided, and a resistor 80 covered with a protector 78 is provided.
Are connected to the thick film conductor 76.

The electronic component 82 shown in FIG. 21 is formed by stacking green sheets 84, for example, in six layers. A concave portion 86 having a step is formed in the central portion thereof. The electronic component 82 has a conductor pattern 8 similar to the electronic component 68 of FIG.
8, an end connection portion 90, a thick film conductor 92, and an IC component 94 in the recess 86.
The component 94 is a thin wire 9 provided by wire bonding.
6 are connected to the conductor pattern 88. Although not shown, the inner layer of the electronic component 82 includes an insulating material (ε <10), a dielectric material (ε> 20), a magnetic material, a resistance material, and an oxide semiconductor material having the same sintering temperature or shrinkage. Are integrally provided in a three-dimensional, two-dimensional or a combination of the two.

Next, as a method of manufacturing an electronic component according to a first modification of the present embodiment, the first and second electronic components described above are used.
A method of forming a shield wall inside a green sheet laminate using any of the methods of the present embodiment will be described below with reference to FIG.

As shown in FIG. 22, the first embodiment of the present invention
The electronic component 98 made of the green sheet laminate according to the modified example of the first embodiment has the green sheets 10 of the green sheet laminate.
0 to the conductor pattern 102 and the green sheet 100
An end connection portion 104 of the conductor pattern 102 of each layer is formed. Further, a shield wall 106 made of the same material as the conductor pattern 102 is formed so as to penetrate vertically inside the electronic component 98 so as to surround the conductor pattern 102. The shield wall 106 is formed by the conductor layer 29 in the first and second embodiments.
The shield wall 1 penetrates the green sheet 100 at the same position in each green sheet layer using a conductive paste or a magnetic paste such as ferrite that can be fired simultaneously with the green sheet.
After the formation of the part corresponding to the green sheet 10
0 are laminated. Here, the shield wall 106 may be provided only on a specific layer of the green sheet 100 in order to shield a specific portion.

Electromagnetic waves generated around the electronic component 98 are blocked by the shield wall 106 and do not enter the conductor pattern 102 side, and the electromagnetic wave absorbed by the shield wall 106 is absorbed as heat. Alternatively, the light is emitted to the outside of the electronic component 98 via a ground electrode (not shown). On the contrary, the electromagnetic wave generated inside the electronic component 98 is not emitted to the outside.

In the electronic component 98 according to the first modification of the present embodiment, the shield wall 106 is accurately formed inside the electronic component 98 by a simple method.

Next, as a method for manufacturing an electronic component according to a second modification of the present embodiment, the first and second electronic components described above are used.
A method of providing connection terminals for connecting the terminals of the conductor pattern of each layer of the green sheet using any of the methods of the present embodiment will be described below with reference to FIGS.

First, as shown in FIG. 23, in the green sheet laminate 108, large-diameter through-holes 110 are formed at four corners, and small-diameter holes are formed at four sides of each predetermined unit of a conductor pattern (not shown). A through hole 112 is formed. The through-holes 110 and 112 are formed by the through-holes 27b and 58b of the first and second embodiments.
This is provided by laminating the green sheet layers each having a hole at the same position.
Here, the through-hole portion 110 is an alignment mark for positioning when laminating each layer of the green sheet, and the through-hole portion is inserted into a pin erected at each of four corners of a base stand (not shown). Green sheets are laminated.

Using a cutting device such as a dicing saw or cutter (not shown), the green sheet laminate 108 is divided into predetermined units of the conductor pattern as shown in FIG. At eight locations around the divided green sheet laminate 108a, the small-diameter through-hole 112 penetrating through all layers of the green sheet laminate 108a is divided into semicircles to form grooves 114a to 114h. I have. Grooves 114a to 114h of the green sheet laminate 108a
Is provided with a connection terminal (not shown) to complete the electronic component.
Note that the small-diameter through-hole portion 112 may be a semi-through hole that penetrates only a predetermined layer on one terminal surface side, instead of the entire through-hole (see 118e and 118f in FIG. 25 in this manner). An example in which a terminal is provided in the formed semi-through hole is shown). In this case, the lower surface facing the upper surface on which the terminals are formed is a component mounting surface without connection terminals.

The green sheet laminate 108 shown in FIG.
As an example in which a connection terminal is provided at a, an electronic component 122 shown in FIG. 25 includes terminal electrodes 116a to 116f, and a connection terminal that connects the terminal electrodes 116a to 116f and a terminal of a conductor pattern of each layer of a green sheet (not shown). 1
18a to 118h are provided at the positions of the grooves 114a to 114h and then fired.
By providing electronic component elements 120a and 120b on 8a, electronic component 122 is completed. In this case, the terminal electrodes 116a to 116f and the connection terminal 1
18a to 118h are provided at the time when the green sheet laminate 108 is formed, and then fired, so that the complexity of performing the firing operation twice can be avoided. Further, here, the through-holes 112 (that is, the through-holes 27 in FIG. 23) corresponding to the grooves 114a to 114h in FIG.
When the conductive paste is applied to the inner walls of the through-holes 27b, 58b when forming the green sheets b, 58b) on each layer of the green sheet, the semi-cylindrical connection terminals 118a to 118b are applied.
h or the through holes 27b, 58
b, the semi-cylindrical connection terminal 118a
To 118 h. In this case, the terminal electrodes 116a to 116f need only be printed and fired on the upper and lower surfaces of the green sheet laminate 108a, in particular, on the lower surface.
The manufacturing process of the electronic component 122 is simplified.

In the electronic component 122 according to the second modification of the present embodiment, since the grooves 114a to 114h are provided by a simple method, the connection terminals 118a to 118h can be easily attached. Can be.

Next, as a method of manufacturing an electronic component according to a third modification of the present embodiment, the above-described first and second electronic components are described.
The first and second examples of forming a portion corresponding to a through-hole portion or a groove portion in a half-cut processing step for each layer of a green sheet using any one of the methods of the present embodiment will be described with reference to FIG. This will be described below with reference to FIG.

As shown in FIG. 26, the electronic component (fired green sheet laminate) 124 according to the first embodiment has a structure in which each of the green sheets 126 is provided with a predetermined unit of a conductor pattern (not shown). A plurality of long through-holes 128 are formed in order to allow easy division. The elongated through-holes 128 correspond to the through-holes 27b and 58b of the first and second embodiments, and the green sheets 126 are located at the same positions of the green sheets 126. Is formed, and a green sheet 126 is laminated.
At this time, the semi-circular or semi-angular grooves 114a to 114h shown in FIG.
May be formed in a predetermined layer on a predetermined number of layers, and connection terminals may be arranged symmetrically at these positions. The electronic component 124 is divided into predetermined units by cutting a cross-shaped portion of the green sheet 126 that intersects on the extension line of the through-hole portion 128 of the electronic component 124 by a cutting device (not shown). Bake (individual pieces) for each unit. In this case, you may bake before dividing | segmenting a green sheet laminated body. At this time, as a second embodiment, FIG.
As shown in FIG. 7, for example, the lowermost green sheet 132 of the electronic component (green sheet laminate fired product) 130
a, the green sheet 132 has no holes.
Those having a cross-shaped hole formed only in each layer 132b other than a are laminated and pressed to form a cross-shaped groove 134, and a continuous portion of each layer 132b and the green sheet 132a
May be cut and fired, and then divided into individual pieces (individual pieces). Alternatively, a method may be used in which a hole is not provided in a green sheet of an arbitrary intermediate layer instead of the lowermost layer. Instead of dividing the electronic component (green sheet laminated body fired product) 124 described above, after dividing each layer of the green sheet 126 in which the through-hole portion 128 is formed into predetermined units of the conductor pattern, A method of laminating the green sheets 126 can also be used.

The electronic components 124 and 130 according to the third modification of the present embodiment are provided with through-holes for dividing a conductor pattern freely and simply formed at an arbitrary position into predetermined units. 128 or the groove 134,
It can be divided accurately and easily.

Regardless of the above-described respective embodiments, the method of manufacturing an electronic component of the present invention employs a single component of L, C, and R or a composite product thereof, a filter, and a hybrid I / O.
The present invention can be applied to various composite parts including electronic parts such as C and MCM (multi-chip module).

[0067]

As described above, according to the method of manufacturing an electronic component according to the present invention, an electronic component manufactured by firing a green sheet laminate obtained by laminating green sheets in which a conductor pattern is embedded is formed. In the method, a recess for embedding the conductor pattern is formed in a green sheet in advance, and the recess is filled with a conductive paste to form a conductor pattern.

Therefore, the size of the electronic component can be reduced. Also, there is no problem such as disconnection or short-circuit of the conductor pattern. Further, the density of the conductor pattern can be freely adjusted according to the use of each part.

According to the method of manufacturing an electronic component of the present invention, a photoresist film is laminated on a base film, the photoresist film is exposed to form a solidified resist portion, and the photoresist film is developed. Then, the solidified resist portion is formed on the base film as a convex portion, a ceramic slurry is laminated on the base film to a thickness such that the top of the solidified resist portion is exposed, and then dried, and the solidified resist portion is embedded. Forming a green sheet, removing the solidified resist portion from the green sheet, forming a recess in the green sheet, filling the recess with a conductive paste, and applying the conductive pattern to the green sheet. The method includes a step of burying and forming, and a step of peeling the base film from the green sheet. Therefore, the effects of the invention described above can be suitably exhibited.

According to the method of manufacturing an electronic component of the present invention, a first photoresist film is laminated on the base film, and the first photoresist film is exposed to light to form a first solidified resist portion. Forming a second photoresist film on the base film, exposing the second photoresist film, and laminating a solidified resist on a portion of the first solidified resist portion to form a second photoresist film. A second solidified resist portion, and developing the first and second photoresist films to form the first solidified resist portion in which the second solidified resist portion is partially laminated in a stepped manner as a convex portion. The first and second solidified resist portions are embedded after being formed on the base film, laminating a ceramic slurry on the base film to a thickness such that the top of the second solidified resist portion is exposed, and then drying. Was Lean sheet form, and peeling the base film from the green sheet, the first
And removing the second solidified resist portion, forming a concave portion and a through-hole portion having a step in the green sheet, filling the through-hole portion with a conductive paste, and filling the concave portion with a conductive paste. By doing so, the conductor pattern and the end connection portions of each layer of the conductor pattern are buried and formed in the green sheet.

Therefore, the effects of the present invention described above can be suitably exhibited. In addition, the step of forming a via hole is omitted, and no disconnection occurs between the conductor patterns of each layer of the green sheet.

According to the method for manufacturing an electronic component of the present invention, a photoresist film is laminated on a base metal,
Exposing and developing the photoresist film to form a concave portion,
A plating process is applied to the concave portion to fill and form a plating layer,
Removing the photoresist film to produce a master in which the plating layer is formed as a projection on the base metal; and forming the ceramic on the base metal of the master to a thickness such that the top of the plating layer is exposed. The slurry is laminated and dried to form a green sheet in which the plating layer is embedded, the master is peeled from the green sheet, a recess is formed in the green sheet, and a conductive paste is applied to the recess. Filling and embedding the conductor pattern in the green sheet.

Therefore, the effects of the present invention described above can be suitably exhibited. In addition, a master in which the convex portion made of the plating layer is formed on the base metal can be used repeatedly, and the manufacturing process is simplified.

Further, according to the method of manufacturing an electronic component of the present invention, a first photoresist film is laminated on a base metal, and the first photoresist film is exposed and developed to form a first concave portion. Forming a first plating layer by filling the first concave portion with a plating treatment; laminating a second photoresist film on the base metal; exposing and developing the second photoresist film; Forming a second recess on a portion of the first plating layer, performing a plating process on the second recess to form a second plating layer, and forming the first and second Removing the photoresist film to form a master formed on the base metal with the first plating layer in which a second plating layer is partly stacked in a step shape as a projection; The top of the second plating layer is exposed on the base metal. After laminating a ceramic slurry to a desired thickness, the slurry is dried to form a green sheet in which the first plating layer and the second plating layer are embedded, and the master is peeled from the green sheet to remove the green sheet. Forming a third concave portion and a through-hole portion having a step, and filling the conductive paste from the other end side of the through-hole portion while vacuum-suctioning from one end side of the through-hole portion of the green sheet. Filling the third concave portion with a conductive paste, and embedding and forming a conductor pattern and an end connection portion of each layer of the conductor pattern in the green sheet.

For this reason, the effects of the present invention described above can be suitably exhibited. In addition, a master in which the plating layer is formed as a protrusion on the base metal can be used repeatedly, and the manufacturing process is simplified. In addition, the via hole forming step is omitted, and furthermore, it is possible to obtain an effect that there is no disconnection between the conductor patterns of each layer of the green sheet.

According to the method of manufacturing an electronic component of the present invention, when filling the through-hole with the conductive paste, the green sheet is vacuum-sucked from one end of the through-hole while being filled with the conductive paste. When the conductive paste is filled from the other end of the hole, the through hole can be reliably filled with the conductive paste even when the thickness of the green sheet is large.

[Brief description of the drawings]

FIG. 1 is a schematic process diagram for explaining a method of manufacturing an electronic component according to a first embodiment of the present invention, showing a process of applying a photoresist to a base film.

FIG. 2 is a view showing a step of exposing a first photoresist film, following FIG. 1;

FIG. 3 is a view showing a step of applying a photoresist and exposing the same to FIG. 2;

FIG. 4 is a view showing a step of removing the photoresist film, continued from FIG. 3;

FIG. 5 is a view showing a step of applying a slurry and drying the slurry, continued from FIG. 4;

FIG. 6 is a view showing a step of removing the base film, continued from FIG. 5;

FIG. 7 is a view showing a step of removing the solidified resist portion, continued from FIG. 6;

FIG. 8 is a view showing a step of filling a conductive paste and drying to complete a green sheet, continued from FIG. 7;

FIG. 9 is a view showing a step of laminating and firing green sheets to complete a green sheet laminate, continued from FIG. 8;

FIG. 10 is a diagram illustrating a step of applying a photoresist to a base metal in a schematic process chart for describing a method for manufacturing an electronic component according to the second embodiment of the present invention.

FIG. 11 is a view showing a step of exposing the photoresist film, which is continued from FIG. 10;

FIG. 12 is a view showing a step of filling and forming a plating layer in a hole, continued from FIG. 11;

FIG. 13 is a view showing a step of applying a photoresist and exposing the same, following FIG. 12;

FIG. 14 is a view showing a step of filling and forming a plating layer in a hole, continued from FIG. 13;

FIG. 15 is a view showing a step of removing the photoresist film to complete a master, following FIG. 14;

FIG. 16 is a view showing a step of applying a slurry to a master and drying the slurry, continued from FIG. 15;

FIG. 17 is a view showing a step of removing the master, which is continued from FIG. 16;

FIG. 18 is a view showing a step of filling a conductive paste and drying to complete a green sheet, continued from FIG. 17;

FIG. 19 is a view showing a step of laminating and firing green sheets to complete a green sheet laminate, continued from FIG. 18;

FIG. 20 is a diagram showing an electronic component of the first example manufactured by the method of the first or second embodiment.

FIG. 21 is a diagram showing an electronic component according to a second example manufactured by the method according to the first or second embodiment.

FIG. 22 is a cross-sectional view of a green sheet laminate in which a shield wall as an electronic component according to a first modification of the present embodiment is formed.

FIG. 23 is a perspective view of a prepared green sheet laminate in a schematic process diagram for describing a method of manufacturing an electronic component according to a second modification of the present embodiment.

FIG. 24 is a perspective view showing one green sheet laminate formed by dividing the green sheet laminate, continued from FIG. 23;

FIG. 25 is a perspective view of an electronic component in which electronic component elements and connection terminals are provided on a green sheet laminate.

FIG. 26 is a cross-sectional view of the grease sheet laminate of the first example in which a portion corresponding to a through-hole portion in a half-cut processing step is formed by a method of manufacturing an electronic component according to a third modification of the present embodiment. It is a partial perspective view.

FIG. 27 is a cross-sectional view of the grease sheet laminate of the second example in which a portion corresponding to a through-hole portion in a half-cut processing step is formed by a method of manufacturing an electronic component according to a third modification of the present embodiment. It is a partial perspective view.

[Explanation of symbols]

10, 67 base film 12, 18, 34, 42, 68, resist film 14, 21, 26, 36, 44, 60 mask 16a to 16d, 20a to 20c solidified resist part 22, 52, 70, 84 , 100, 126, 132a ...
Green sheets 24, 38a to 38d, 46a to 46c, 54, 86 ...
Recesses 25, 27a, 27b, 56, 58a, 58b, 11
0, 112, 128 ... through-hole portions 28a, 28b, 62a, 62b, 72, 88, 102
... Conductor patterns 29, 64 ... Conductor layers 30, 66, 68, 82, 98, 122, 124, 13
0 ... Electronic component 32 ... Base metal 40a-40d, 48a-48c ... Plating layer 50 ... Master 28c, 74, 90, 104 ... End connection 76, 92 ... Thick film conductor 78 ... Protector 80 ... Resistor 94 ... IC components 106: shield walls 108, 108a: green sheet laminates 116a to 116f: terminal electrodes 118a to 11
8h: Connection terminal 120a, 120b: Electronic component element

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference)

Claims (6)

[Claims] 1. A method for manufacturing an electronic component, comprising: firing a green sheet laminate in which green sheets in which a conductor pattern is embedded are formed, wherein a recess for embedding the conductor pattern is formed in the green sheet in advance. Forming a conductive pattern by filling the recess with a conductive paste. 2. The method for manufacturing an electronic component according to claim 1, wherein a photoresist film is laminated on a base film, the photoresist film is exposed to form a solidified resist portion, and the photoresist film is developed. The solidified resist portion is formed as a convex portion on the base film, a ceramic slurry is laminated on the base film to a thickness such that the top of the solidified resist portion is exposed, and then dried, and the solidified resist portion is embedded. Forming a concave portion in the green sheet by removing the solidified resist portion from the green sheet, filling the concave portion with a conductive paste, and embedding the conductor pattern in the green sheet. Forming, and removing the base film from the green sheet. Manufacturing method of electronic components. 3. The method for manufacturing an electronic component according to claim 2, wherein a first photoresist film is laminated on said base film, and said first photoresist film is exposed to form a first solidified resist portion. Forming a second photoresist film on the base film, exposing the second photoresist film, and laminating a solidified resist on a portion of the first solidified resist portion to form a second photoresist film. The first and second photoresist films are developed, and the first solidified resist portion, in which the second solidified resist portion is partially laminated in a step shape, is used as a convex portion. A ceramic slurry is formed on the base film, and a ceramic slurry is laminated on the base film to a thickness that exposes a top of the second solidified resist portion, and then dried, and the first and second solidified resist portions are embedded. Lean sheet form, and peeling the base film from the green sheet,
The first and second solidified resist portions are removed to form recesses and stepped through holes in the green sheet. The through holes are filled with a conductive paste, and the recesses are filled with a conductive material. A method of manufacturing an electronic component, comprising filling a paste to form a conductor pattern and end connection portions of each layer of the conductor pattern in a green sheet. 4. The method for manufacturing an electronic component according to claim 1, wherein a photoresist film is laminated on the base metal, the photoresist film is exposed and developed to form a recess, and the recess is subjected to plating. Forming a master in which the plating layer is formed as a projection on the base metal by removing and filling the plating layer with a plating layer; and forming the plating layer on the base metal of the master. After laminating a ceramic slurry to a thickness that exposes the top, the ceramic slurry is dried to form a green sheet in which the plating layer is embedded, and the master is peeled from the green sheet to form a recess in the green sheet. Filling the recesses with a conductive paste and embedding and forming the conductive pattern in the green sheet;
A method for manufacturing an electronic component, comprising: 5. The method for manufacturing an electronic component according to claim 4, wherein a first photoresist film is laminated on the base metal, and the first photoresist film is exposed and developed to form a first concave portion. Performing a plating process on the first concave portion to fill and form a first plating layer; laminating a second photoresist film on the base metal; exposing and developing the second photoresist film; Forming a second recess on a portion of the first plating layer, performing a plating process on the second recess to form a second plating layer, and forming the first and second photos. Removing the resist film, producing a master formed on the base metal with the first plating layer in which a second plating layer is partly stacked in a step shape as a projection, and The top of the second plating layer is on the base metal After laminating a ceramic slurry to a thickness to be obtained and drying, a green sheet in which the first plating layer and the second plating layer are embedded is formed. The master is peeled from the green sheet to form the green sheet. A third recess and a stepped through-hole portion are formed in the sheet, and the through-hole portion is filled with a conductive paste, and the third recess is filled with a conductive paste. Embedding and forming an end connection portion of each layer of the conductor pattern in the green sheet. 6. The method for manufacturing an electronic component according to claim 3, wherein the conductive paste is filled in the through-hole while vacuum-sucking from one end of the through-hole in the green sheet. A method for manufacturing an electronic component, comprising filling a conductive paste from the other end of the through hole.