CN117460762A - 用于电子装置的聚合物 - Google Patents
用于电子装置的聚合物 Download PDFInfo
- Publication number
- CN117460762A CN117460762A CN202180099026.4A CN202180099026A CN117460762A CN 117460762 A CN117460762 A CN 117460762A CN 202180099026 A CN202180099026 A CN 202180099026A CN 117460762 A CN117460762 A CN 117460762A
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- CN
- China
- Prior art keywords
- limiting embodiments
- bis
- polyimide
- polyimide film
- polyamic acid
- Prior art date
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- Pending
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- 229920000642 polymer Polymers 0.000 title description 31
- 229920001721 polyimide Polymers 0.000 claims abstract description 154
- 238000000034 method Methods 0.000 claims abstract description 123
- 239000000203 mixture Substances 0.000 claims abstract description 122
- 239000007788 liquid Substances 0.000 claims abstract description 90
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 62
- 239000000654 additive Substances 0.000 claims abstract description 60
- 150000004985 diamines Chemical class 0.000 claims abstract description 46
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000009835 boiling Methods 0.000 claims abstract description 20
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 20
- 239000011574 phosphorus Substances 0.000 claims abstract description 20
- 239000000010 aprotic solvent Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 87
- 230000008569 process Effects 0.000 claims description 85
- 239000000243 solution Substances 0.000 claims description 65
- 239000010408 film Substances 0.000 claims description 57
- -1 phosphinates Chemical class 0.000 claims description 34
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 31
- FPZZZGJWXOHLDJ-UHFFFAOYSA-N trihexylphosphane Chemical compound CCCCCCP(CCCCCC)CCCCCC FPZZZGJWXOHLDJ-UHFFFAOYSA-N 0.000 claims description 27
- 230000000996 additive effect Effects 0.000 claims description 25
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 20
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 18
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 15
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- CNXMDTWQWLGCPE-UHFFFAOYSA-N ditert-butyl-(2-phenylphenyl)phosphane Chemical group CC(C)(C)P(C(C)(C)C)C1=CC=CC=C1C1=CC=CC=C1 CNXMDTWQWLGCPE-UHFFFAOYSA-N 0.000 claims description 6
- LVEYOSJUKRVCCF-UHFFFAOYSA-N 1,3-bis(diphenylphosphino)propane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCCP(C=1C=CC=CC=1)C1=CC=CC=C1 LVEYOSJUKRVCCF-UHFFFAOYSA-N 0.000 claims description 4
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- 125000004427 diamine group Chemical group 0.000 claims description 4
- FNCQSSIMHQVKGF-UHFFFAOYSA-N diphenyl-(2-phenylphenyl)phosphane Chemical group C1=CC=CC=C1P(C=1C(=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 FNCQSSIMHQVKGF-UHFFFAOYSA-N 0.000 claims description 4
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 235000021317 phosphate Nutrition 0.000 claims description 3
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 claims description 3
- HSWZLYXRAOXOLL-UHFFFAOYSA-N (6-diphenylphosphanyl-10h-phenoxazin-4-yl)-diphenylphosphane Chemical compound C=12OC(C(=CC=C3)P(C=4C=CC=CC=4)C=4C=CC=CC=4)=C3NC2=CC=CC=1P(C=1C=CC=CC=1)C1=CC=CC=C1 HSWZLYXRAOXOLL-UHFFFAOYSA-N 0.000 claims description 2
- QNEVKCBGTUWWOH-UHFFFAOYSA-N 1,2,3,4-tetrakis(2,4-ditert-butylphenyl)-5-phenylbenzene Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1C(C(=C1C=2C(=CC(=CC=2)C(C)(C)C)C(C)(C)C)C=2C(=CC(=CC=2)C(C)(C)C)C(C)(C)C)=CC(C=2C=CC=CC=2)=C1C1=CC=C(C(C)(C)C)C=C1C(C)(C)C QNEVKCBGTUWWOH-UHFFFAOYSA-N 0.000 claims description 2
- ZSSWXNPRLJLCDU-UHFFFAOYSA-N 1-diethylphosphorylethane Chemical compound CCP(=O)(CC)CC ZSSWXNPRLJLCDU-UHFFFAOYSA-N 0.000 claims description 2
- GBLNXAZZONXIQE-UHFFFAOYSA-N 2-dipyridin-2-ylphosphanylethyl(dipyridin-2-yl)phosphane Chemical compound C=1C=CC=NC=1P(C=1N=CC=CC=1)CCP(C=1N=CC=CC=1)C1=CC=CC=N1 GBLNXAZZONXIQE-UHFFFAOYSA-N 0.000 claims description 2
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 claims description 2
- QZUPHAGRBBOLTB-UHFFFAOYSA-N NSC 244302 Chemical compound C=1C=CC=CC=1P(C(C)(C)C)C1=CC=CC=C1 QZUPHAGRBBOLTB-UHFFFAOYSA-N 0.000 claims description 2
- CDOMXXVCZQOOMT-UHFFFAOYSA-N [phenoxy(phenyl)phosphoryl]oxybenzene Chemical compound C=1C=CC=CC=1OP(C=1C=CC=CC=1)(=O)OC1=CC=CC=C1 CDOMXXVCZQOOMT-UHFFFAOYSA-N 0.000 claims description 2
- SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical compound CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 claims description 2
- HAKMAMKAFTZXOZ-UHFFFAOYSA-N dioctoxyphosphorylbenzene Chemical compound CCCCCCCCOP(=O)(OCCCCCCCC)C1=CC=CC=C1 HAKMAMKAFTZXOZ-UHFFFAOYSA-N 0.000 claims description 2
- QGBQGMHXBSLYLZ-UHFFFAOYSA-N ditert-butyl-(1-naphthalen-1-ylnaphthalen-2-yl)phosphane Chemical group C1=CC=C2C(C3=C4C=CC=CC4=CC=C3P(C(C)(C)C)C(C)(C)C)=CC=CC2=C1 QGBQGMHXBSLYLZ-UHFFFAOYSA-N 0.000 claims description 2
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 claims description 2
- CGLCDOZYDURWIG-UHFFFAOYSA-N n-(1,3-benzodioxol-5-yl)acetamide Chemical compound CC(=O)NC1=CC=C2OCOC2=C1 CGLCDOZYDURWIG-UHFFFAOYSA-N 0.000 claims description 2
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 claims description 2
- 150000003003 phosphines Chemical class 0.000 claims description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims description 2
- VNFWTIYUKDMAOP-UHFFFAOYSA-N sphos Chemical group COC1=CC=CC(OC)=C1C1=CC=CC=C1P(C1CCCCC1)C1CCCCC1 VNFWTIYUKDMAOP-UHFFFAOYSA-N 0.000 claims description 2
- DMEUUKUNSVFYAA-UHFFFAOYSA-N trinaphthalen-1-ylphosphane Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 DMEUUKUNSVFYAA-UHFFFAOYSA-N 0.000 claims description 2
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 claims description 2
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000013039 cover film Substances 0.000 claims 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 125000006158 tetracarboxylic acid group Chemical group 0.000 abstract description 4
- 230000000670 limiting effect Effects 0.000 description 365
- 239000010410 layer Substances 0.000 description 126
- 238000006243 chemical reaction Methods 0.000 description 110
- 239000000463 material Substances 0.000 description 93
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 46
- 239000004642 Polyimide Substances 0.000 description 38
- 239000002904 solvent Substances 0.000 description 35
- 125000003118 aryl group Chemical group 0.000 description 27
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 26
- 150000001875 compounds Chemical class 0.000 description 26
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 22
- 229910052757 nitrogen Inorganic materials 0.000 description 22
- 239000002245 particle Substances 0.000 description 22
- 239000003054 catalyst Substances 0.000 description 21
- 239000011521 glass Substances 0.000 description 21
- 238000002347 injection Methods 0.000 description 21
- 239000007924 injection Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 17
- 125000000217 alkyl group Chemical group 0.000 description 16
- 238000000576 coating method Methods 0.000 description 15
- 238000004528 spin coating Methods 0.000 description 15
- 238000002834 transmittance Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 125000001072 heteroaryl group Chemical group 0.000 description 14
- 230000008859 change Effects 0.000 description 13
- 239000002019 doping agent Substances 0.000 description 13
- 125000001153 fluoro group Chemical group F* 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 230000005525 hole transport Effects 0.000 description 12
- 230000008901 benefit Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 125000001424 substituent group Chemical group 0.000 description 11
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 10
- 125000000753 cycloalkyl group Chemical group 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 9
- 239000011737 fluorine Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 230000004580 weight loss Effects 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 8
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 125000004433 nitrogen atom Chemical group N* 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 125000000547 substituted alkyl group Chemical group 0.000 description 7
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 description 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 125000004104 aryloxy group Chemical group 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- 125000003709 fluoroalkyl group Chemical group 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 6
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 6
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 6
- 229920001774 Perfluoroether Polymers 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 5
- 125000000304 alkynyl group Chemical group 0.000 description 5
- 150000001491 aromatic compounds Chemical class 0.000 description 5
- 125000003710 aryl alkyl group Chemical group 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 125000004093 cyano group Chemical group *C#N 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 125000005553 heteroaryloxy group Chemical group 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 5
- 150000002903 organophosphorus compounds Chemical class 0.000 description 5
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 5
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 5
- 238000002411 thermogravimetry Methods 0.000 description 5
- 125000005309 thioalkoxy group Chemical group 0.000 description 5
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2,5-dimethylpyridine Chemical compound CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 4
- NURQLCJSMXZBPC-UHFFFAOYSA-N 3,4-dimethylpyridine Chemical compound CC1=CC=NC=C1C NURQLCJSMXZBPC-UHFFFAOYSA-N 0.000 description 4
- HWWYDZCSSYKIAD-UHFFFAOYSA-N 3,5-dimethylpyridine Chemical compound CC1=CN=CC(C)=C1 HWWYDZCSSYKIAD-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- 229940018564 m-phenylenediamine Drugs 0.000 description 4
- 229920000767 polyaniline Polymers 0.000 description 4
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 3
- PPDZLUVUQQGIOJ-UHFFFAOYSA-N 1-dihexylphosphorylhexane Chemical compound CCCCCCP(=O)(CCCCCC)CCCCCC PPDZLUVUQQGIOJ-UHFFFAOYSA-N 0.000 description 3
- DEQUFFZCXSTYJC-UHFFFAOYSA-N 3,4-diphenylbenzene-1,2-diamine Chemical class C=1C=CC=CC=1C1=C(N)C(N)=CC=C1C1=CC=CC=C1 DEQUFFZCXSTYJC-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
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- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
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- 125000006159 dianhydride group Chemical group 0.000 description 3
- NGKCHGKFHQDOPZ-UHFFFAOYSA-N dihexylphosphinic acid Chemical compound CCCCCCP(O)(=O)CCCCCC NGKCHGKFHQDOPZ-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
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- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 125000005541 phosphonamide group Chemical group 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- GETTZEONDQJALK-UHFFFAOYSA-N (trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC=C1 GETTZEONDQJALK-UHFFFAOYSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 2
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Abstract
Description
单位 | 膜11 | 对比膜11 | |
BPA/聚合物 | wt% | 2 | 0 |
固化温度 | ℃ | 450 | 450 |
膜厚度 | μm | 10 | 10 |
1.0%失重温度(Td) | ℃ | 519 | 522 |
CTE 50-350 | ppm/℃ | 24.5 | 30.9 |
模量 | GPa | 4.9 | 5.2 |
拉伸强度 | MPa | 181 | 158 |
断裂伸长率 | % | 27 | 16 |
380-780nm平均透射率 | % | 83.8 | 80.9 |
b* | 4.0 | 9.9 | |
YI | 6.7 | 15.9 | |
雾度 | % | 0.4 | 0.3 |
单位 | 膜12 | 对比膜12 | 膜13 | 对比膜13 | |
TPP/聚合物 | wt% | 3 | 0 | 3 | 0 |
固化温度 | ℃ | 475 | 475 | 475 | 475 |
膜厚度 | μm | 10 | 10 | 10 | 10 |
CTE 50-350 | ppm/℃ | 2 | 3 | 1.4 | 0.8 |
YI | 39 | 38 | 92 | 71 |
Claims (10)
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PCT/CN2021/098525 WO2022256951A1 (en) | 2021-06-07 | 2021-06-07 | Polymers for use in electronic devices |
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CN117460762A true CN117460762A (zh) | 2024-01-26 |
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EP (1) | EP4352134A1 (zh) |
JP (1) | JP2024521539A (zh) |
CN (1) | CN117460762A (zh) |
WO (1) | WO2022256951A1 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2012041473A (ja) * | 2010-08-20 | 2012-03-01 | Kaneka Corp | ポリイミドフィルムおよび該フィルムの製造方法 |
JP5696557B2 (ja) * | 2011-03-28 | 2015-04-08 | 宇部興産株式会社 | ポリイミドフィルムの製造方法およびポリイミドフィルム |
US20140127497A1 (en) * | 2011-06-14 | 2014-05-08 | Ube Industries, Ltd. | Method for producing polyimide laminate, and polyimide laminate |
KR102188483B1 (ko) * | 2013-11-27 | 2020-12-08 | 우베 고산 가부시키가이샤 | 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 폴리이미드, 폴리이미드 필름, 및 기판 |
KR20150077317A (ko) * | 2013-12-27 | 2015-07-07 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 폴리아미드산 조성물, 폴리이미드, 수지 필름 및 금속 피복 적층체 |
JP6575770B2 (ja) * | 2014-11-13 | 2019-09-18 | 日産化学株式会社 | 液晶配向処理剤、液晶配向膜及び液晶表示素子 |
KR102004659B1 (ko) * | 2018-10-31 | 2019-10-01 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름의 접착성을 향상시키기 위한 폴리이미드 전구체 조성물 및 이로부터 제조되는 폴리이미드 필름 |
KR102362385B1 (ko) * | 2019-11-13 | 2022-02-15 | 피아이첨단소재 주식회사 | 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법 |
CN112552514B (zh) * | 2020-12-10 | 2023-05-16 | 武汉柔显科技股份有限公司 | 一种聚酰亚胺前体、聚酰亚胺薄膜及其制备方法 |
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2021
- 2021-06-07 CN CN202180099026.4A patent/CN117460762A/zh active Pending
- 2021-06-07 EP EP21944467.6A patent/EP4352134A1/en active Pending
- 2021-06-07 WO PCT/CN2021/098525 patent/WO2022256951A1/en active Application Filing
- 2021-06-07 JP JP2024518947A patent/JP2024521539A/ja active Pending
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