CN117438371A - 下压头单体、压接组件、芯片烧结炉 - Google Patents
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Abstract
本申请涉及半导体材料加工装备技术领域,尤其涉及一种下压头单体、压接组件及芯片烧结炉。下压头单体,包括:用于承载待压物的承载台;用于支撑所述承载台的底座;所述承载台与所述底座之间设有角度调节块;所述角度调节块被配置为能够改变所述承载台与所述底座间的倾斜角度。压接组件,包括:上压头;所述上压头下对应多个下压头单体。芯片烧结炉,包括下压头单体,或包括压接组件。贴合后进行烧结,可提高烧结时的贴合度,提高烧结时压力的均匀性。下压头单体是纯机械结构,不受高温、高压、真空的环境影响,稳定性高。
Description
技术领域
本申请涉及半导体材料加工装备技术领域,尤其涉及一种下压头单体、压接组件及芯片烧结炉。
背景技术
在半导体制造技术中,采用烧结技术将芯片与衬底烧结到一起已被广泛应用。目前的芯片-衬底烧结技术主要依靠对上下压头的加工精度来保证上下压头与芯片-衬底的贴合度。
现有技术中,依靠加工精度只能在一定范围内保证设备上下压头的平行度,不能解决芯片-衬底本身的微量厚度差异所产生的角度造成的贴合度差的问题,因此在一定程度上对产品良品率产生影响。
发明内容
本发明的目的在于提供一种下压头单体、压接组件及芯片烧结炉,用于解决现有芯片烧结技术中,芯片-衬底本身的微量厚度差异所产生的角度造成的贴合度差的问题。
为达此目的,本发明采用以下技术方案:
下压头单体,包括:用于承载待压物的承载台;
用于支撑所述承载台的底座;
所述承载台与所述底座之间设有角度调节块;
所述角度调节块被配置为能够改变所述承载台与所述底座间的倾斜角度。
进一步的,所述倾斜角度小于1°。
进一步的,所述承载台与所述角度调节块之间设有承载座;
所述承载台固定连接于所述承载座上。
进一步的,所述底座朝向所述承载台的一面设有凹槽;
所述角度调节块设于所述凹槽中;
所述角度调节块被配置为具有上弧面和下弧面;
所述上弧面与所述下弧面轴线垂直且相交。
进一步的,所述角度调节块设有第一导向面和第二导向面;
所述第一导向面使得所述承载座仅沿上弧面轴线的垂直方向移动;
所述第二导向面使得所述角度调节块仅沿下弧面轴线的垂直方向移动。
进一步的,所述上弧面为半径60mm,0.5弧度的弧面;
所述下弧面为半径50mm,0.5弧度的弧面。
进一步的,所述承载座设有第一限位孔;
所述底座设有第二限位孔;
所述第一限位孔、第二限位孔内分别设有上球面轴承、下球面轴承;
一拉杆,所述拉杆依次穿过上球面轴承、承载座、角度调节块、底座、下球面轴承。
进一步的,所述第二限位孔内,下球面轴承与第二限位孔底面之间,设有穿设在拉杆上的碟簧垫块和碟簧;
锁紧螺母,设于所述拉杆上,用于限位。
进一步的,包括:上压头;
所述上压头下对应多个下压头单体;
所述下压头单体为上述的下压头单体。
芯片烧结炉,包括上述的下压头单体,或上述的压接组件。
本发明的有益效果:
本发明通过下压头单体内设置角度调节块,通过角度调节块调整承载台的倾斜角度。通过拉杆、碟簧、球面轴承的配合,使得上压头未下压时,承载台总是保持固定位置,以提高芯片-衬底放料时的精准度。当上压头下压时,一个上压头对应多个下压头单体,即使每个下压头单体上放置的待压合物厚度不同,下压头单体也能够自适应的调节与上压头的贴合度,以此提高压合物的烧结质量。通过纯机械结构传动,以适应芯片烧结过程中的真空、高温环境。
附图说明
图1是本发明下压头单体第一视角剖视示意图;
图2是本发明下压头单体第二视角剖视示意图;
图3是本发明下压头单体角度调节块示意图;
图中:1、承载台;2、承载座;21、第一限位孔;3、角度调节块;31、上弧面;32、下弧面;33、第一导向面;34、第二导向面;4、底座;41、第二限位孔;5、碟簧垫块;6、下球面轴承;7、锁紧螺母;8、碟簧;9、拉杆;10、拉帽;11、上球面轴承;12、压接面;13、上压头。
具体实施方式
下面结合附图和实施例对本发明作进一步的详细说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本发明,而非对本发明的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本发明相关的部分而非全部结构。
在本发明的描述中,除非另有明确的规定和限定,术语“相连”、“连接”、“固定”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
在本实施例的描述中,术语“上”、“下”、“右”、等方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述和简化操作,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅仅用于在描述上加以区分,并没有特殊的含义。
本实施例提供一种下压头单体,所述下压头单体与上压头配合,用于压接待烧结的芯片-衬底,使芯片-衬底紧密贴合,提高烧结质量。参见图1-3,本实施例提供的下压头单体包括用于承载待压物的承载台1,承载台1用于放置待烧结的芯片-衬底。用于支撑承载台1的底座4,承载台1与底座4之间设有角度调节块3,角度调节块3被配置为能够改变承载台1与底座4间的倾斜角度,所述倾斜角度小于1°。
本实施例中,承载台1与角度调节块3之间设有承载座2,承载台1固定连接于承载座2上。底座4朝向承载台1的一面设有凹槽,角度调节块3设于凹槽中。角度调节3块被配置为具有上弧面31和下弧面32,上弧面31与下弧面32轴线垂直且相交。角度调节块3设有第一导向面33和第二导向面34,第一导向面33使得承载座2仅沿上弧面31轴线的垂直方向移动,第二导向面34使得角度调节块3仅沿下弧面32轴线的垂直方向移动。第一导向面33与承载座2接触面的最大间隙小于0.03mm,第二导向面34与底座4接触面的最大间隙小于0.03mm,作为角度调节块3的活动空间。上弧面31为半径60mm,0.5弧度的弧面,下弧面32为半径50mm,0.5弧度的弧面。
进一步的,本实施例提供的下压头单体的承载座2设有第一限位孔21,底座4设有第二限位孔41,第一限位孔21、第二限位孔41内分别设有上球面轴承11、下球面轴承6。一拉杆9依次穿过上球面轴承11、承载座2、角度调节块3、底座4、下球面轴承6。其中,第二限位孔41内,下球面轴承6与第二限位孔41底面之间,设有穿设在拉杆9上的碟簧垫块5和碟簧8,拉杆9的两端分别设有拉帽10和锁紧螺母7,将穿设在拉杆9上的零部件拉紧。
本实施例还提供一种压接组件,压接组件包括上压头13,上压头13下对应多个下压头单体,例如,一个上压头下对应10个下压头单体,或一个上压头下对应50个下压头单体。
本实施例还提供一种芯片烧结炉,用于烧结芯片-衬底,烧结炉包括上述下压头单体或上述压接组件。
进行芯片-衬底烧结时,将多个芯片-衬底分别放在多个承载台1上,由于拉杆9、碟簧8、球面轴承的配合,使得上压头13未下压时,承载台1总是保持水平位置,放置芯片-衬底时,能够保持放置的精准度。
启动上压头13下压,上压头13会与多个下压头单体接触,并向承载台1施加压力,由于不同承载台1上放置的芯片-衬底厚度会略有差异,当上压头13接触到芯片-衬底最厚处时,由于下压力的持续,承载台1会根据压力的方向适应性的调节倾斜角度以使承载台1、芯片-衬底、上压头13完全贴合,贴合后进行烧结,可提高烧结时的贴合度,提高烧结时压力的均匀性。下压头单体是纯机械结构,不受高温、高压、真空的环境影响,稳定性高。
显然,本发明的上述实施例仅仅是为了清楚说明本发明所作的举例,而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说,能够进行各种明显的变化、重新调整和替代而不会脱离本发明的保护范围。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明权利要求的保护范围之内。
Claims (10)
1.下压头单体,其特征在于,包括:用于承载待压物的承载台;
用于支撑所述承载台的底座;
所述承载台与所述底座之间设有角度调节块;
所述角度调节块被配置为能够改变所述承载台与所述底座间的倾斜角度。
2.根据权利要求1所述的下压头单体,其特征在于:所述倾斜角度小于1°。
3.根据权利要求1所述的下压头单体,其特征在于:所述承载台与所述角度调节块之间设有承载座;
所述承载台固定连接于所述承载座上。
4.根据权利要求1所述的下压头单体,其特征在于:所述底座朝向所述承载台的一面设有凹槽;
所述角度调节块设于所述凹槽中;
所述角度调节块被配置为具有上弧面和下弧面;
所述上弧面与所述下弧面轴线垂直且相交。
5.根据权利要求3所述的下压头单体,其特征在于:所述角度调节块设有第一导向面和第二导向面;
所述第一导向面使得所述承载座仅沿上弧面轴线的垂直方向移动;
所述第二导向面使得所述角度调节块仅沿下弧面轴线的垂直方向移动。
6.根据权利要求4所述的下压头单体,其特征在于:所述上弧面为半径60mm,0.5弧度的弧面;
所述下弧面为半径50mm,0.5弧度的弧面。
7.根据权利要求3所述的下压头单体,其特征在于:所述承载座设有第一限位孔;
所述底座设有第二限位孔;
所述第一限位孔、第二限位孔内分别设有上球面轴承、下球面轴承;
一拉杆,所述拉杆依次穿过上球面轴承、承载座、角度调节块、底座、下球面轴承。
8.根据权利要求7所述的下压头单体,其特征在于:所述第二限位孔内,下球面轴承与第二限位孔底面之间,设有穿设在拉杆上的碟簧垫块和碟簧;
锁紧螺母,设于所述拉杆上,用于限位。
9.压接组件,其特征在于,包括:上压头;
所述上压头下对应多个下压头单体;
所述下压头单体为权利要求1-8任一所述的下压头单体。
10.芯片烧结炉,其特征在于:包括权利要求1-8任一所述的下压头单体,或权利要求9所述的压接组件。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202311781004.3A CN117438371A (zh) | 2023-12-22 | 2023-12-22 | 下压头单体、压接组件、芯片烧结炉 |
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JPH07266097A (ja) * | 1994-03-29 | 1995-10-17 | Honda Motor Co Ltd | プレス装置 |
JP2001284196A (ja) * | 2000-03-30 | 2001-10-12 | Nitto Kogyo Co Ltd | チップテープのトップテープシール装置 |
US6471501B1 (en) * | 1998-03-20 | 2002-10-29 | Fujitsu Limited | Mold for fabricating semiconductor devices |
US20050286989A1 (en) * | 2004-06-24 | 2005-12-29 | Randy Ackley | Lock nut with low on/high off torque control |
US20160082624A1 (en) * | 2014-09-18 | 2016-03-24 | Jian Xiong SU | Molding press and a platen for a molding press |
WO2018003519A1 (ja) * | 2016-06-28 | 2018-01-04 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
CN112427638A (zh) * | 2020-12-04 | 2021-03-02 | 湖南伊澍工业技术有限公司 | 一种具有加压辅助结构的振荡热压烧结炉 |
CN219490083U (zh) * | 2023-02-28 | 2023-08-08 | 西安法士特汽车传动有限公司 | 一种压淬用压头装置 |
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JPH07266097A (ja) * | 1994-03-29 | 1995-10-17 | Honda Motor Co Ltd | プレス装置 |
US6471501B1 (en) * | 1998-03-20 | 2002-10-29 | Fujitsu Limited | Mold for fabricating semiconductor devices |
JP2001284196A (ja) * | 2000-03-30 | 2001-10-12 | Nitto Kogyo Co Ltd | チップテープのトップテープシール装置 |
US20050286989A1 (en) * | 2004-06-24 | 2005-12-29 | Randy Ackley | Lock nut with low on/high off torque control |
US20160082624A1 (en) * | 2014-09-18 | 2016-03-24 | Jian Xiong SU | Molding press and a platen for a molding press |
WO2018003519A1 (ja) * | 2016-06-28 | 2018-01-04 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
CN112427638A (zh) * | 2020-12-04 | 2021-03-02 | 湖南伊澍工业技术有限公司 | 一种具有加压辅助结构的振荡热压烧结炉 |
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