CN117438339A - Wafer cleaning device - Google Patents

Wafer cleaning device Download PDF

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Publication number
CN117438339A
CN117438339A CN202311357142.9A CN202311357142A CN117438339A CN 117438339 A CN117438339 A CN 117438339A CN 202311357142 A CN202311357142 A CN 202311357142A CN 117438339 A CN117438339 A CN 117438339A
Authority
CN
China
Prior art keywords
wafer
rotating wheel
detecting member
cleaning apparatus
speed measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311357142.9A
Other languages
Chinese (zh)
Inventor
张丰达
王剑
李长坤
许振杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huahaiqingke Co Ltd
Original Assignee
Huahaiqingke Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huahaiqingke Co Ltd filed Critical Huahaiqingke Co Ltd
Priority to CN202311357142.9A priority Critical patent/CN117438339A/en
Publication of CN117438339A publication Critical patent/CN117438339A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/36—Devices characterised by the use of optical means, e.g. using infrared, visible, or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/42—Devices characterised by the use of electric or magnetic means
    • G01P3/44—Devices characterised by the use of electric or magnetic means for measuring angular speed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a wafer cleaning device, which comprises: a case; the clamping mechanism is arranged in the box body to clamp the wafer to be processed; the rotating speed measuring mechanism is arranged in the box body and used for measuring the rotating speed of the wafer; the rotational speed measuring mechanism includes: the detecting piece is hinged in the box body, one end of the detecting piece is provided with a rotating wheel, and the rotating wheel can be abutted against the outer edge of the wafer and sense the notch of the wafer; and the sensor is arranged at the other end of the detection piece to measure the swing information of the detection piece and further calculate the rotating speed of the wafer.

Description

Wafer cleaning device
Technical Field
The invention belongs to the technical field of wafer post-treatment, and particularly relates to a wafer cleaning device.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. The chip is a carrier of an integrated circuit, and the chip manufacturing involves the process flows of integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, dicing packaging, testing, and the like. Among them, chemical mechanical polishing belongs to one of five main core processes in the wafer manufacturing process.
The wafer subjected to chemical mechanical polishing needs to be subjected to post-treatment such as cleaning, drying and the like so as to avoid pollution of trace ions and metal particles to the semiconductor device and ensure the performance and qualification rate of the semiconductor device. The wafer cleaning method comprises the following steps: roll brush cleaning, megasonic cleaning, etc., wherein roll brush cleaning is one of the common cleaning modes.
In the process of rolling brush cleaning, the control of the rotation speed of the wafer is an important means for ensuring the cleaning effect of the wafer; however, the wafer rotation speed is often difficult to detect because the wafer is in the environment of various chemicals such as water, chemical liquid, etc.
In the wafer cleaning device disclosed in the patent CN113976498A, a tachometer wheel is used to attach to a wafer, and a tachometer module is arranged at the rear end of the tachometer wheel; the speed measuring module obtains the rotating speed of the speed measuring wheel by utilizing the principles of a Hall switch or a photoelectric switch and the like, and further obtains the rotating speed of the wafer.
However, in the process of cleaning the wafer, the speed wheel is easy to slip, which can affect the accuracy of the measurement of the rotating speed of the wafer, further affect the control effect of the rotating speed of the wafer, and cause the cleaning effect of the wafer to be poor.
Disclosure of Invention
The embodiment of the invention provides a wafer cleaning device, which aims at solving at least one of the technical problems existing in the prior art.
A first aspect of an embodiment of the present invention provides a wafer cleaning apparatus, including:
a case;
the clamping mechanism is arranged in the box body to clamp the wafer to be processed;
the rotating speed measuring mechanism is arranged in the box body and used for measuring the rotating speed of the wafer;
the rotational speed measuring mechanism includes:
the detecting piece is hinged in the box body, one end of the detecting piece is provided with a rotating wheel, and the rotating wheel can be abutted against the outer edge of the wafer and sense the notch of the wafer;
and the sensor is arranged at the other end of the detection piece to measure the swing information of the detection piece and further calculate the rotating speed of the wafer.
In some embodiments, the hinge point of the sensing element is positioned proximate to the wheel such that the other end of the sensing element is capable of amplifying movement of the wheel.
In some embodiments, the rotation speed measuring mechanism further comprises a limiting assembly disposed on a side portion of the detecting member, so that the detecting member can swing around the hinge point along a fixed direction.
In some embodiments, one end of the detecting piece is a columnar structure, and the other end of the detecting piece is a sheet-shaped structure; the rotating wheel is rotatably connected to the end part of the columnar structure, and the sensor is arranged on the side part of the sheet-shaped structure.
In some embodiments, the rotation speed measuring mechanism further comprises a protective cover, wherein the protective cover is sleeved on the outer side of the detecting piece and covers the hinge point.
In some embodiments, the sensor is a photoelectric sensor to measure the frequency of the sensing member swinging about the hinge point.
In some embodiments, the rotation speed measuring mechanism further includes an elastic member connected to a side portion of the detecting member to adjust a contact force between the rotating wheel of the detecting member and the wafer.
In some embodiments, the rotation speed measuring mechanism further comprises a pushing member capable of pushing the detecting member to rotate around the hinge point, so that the rotating wheel at the end of the detecting member is not higher than the plane where the clamping mechanism holds the wafer.
In some embodiments, the number of the rotation speed measuring mechanisms is at least two, and the rotation speed measuring mechanisms are uniformly distributed on the outer peripheral side of the wafer holding area of the clamping mechanism.
A second aspect of an embodiment of the present invention provides a wafer cleaning apparatus, including:
a case;
the clamping mechanism is arranged in the box body to clamp the wafer to be processed;
the rotating speed measuring mechanism is arranged in the box body and used for measuring the rotating speed of the wafer;
the rotational speed measuring mechanism includes:
the detection piece is connected in the box body in a sliding way, one end of the detection piece is provided with a rotating wheel, the rotating wheel can be abutted against the outer edge of the wafer, and the rotating wheel contacted with the wafer is moved by the wafer notch;
the sensor is a torque sensor and is connected to the other end of the detection piece; the moving rotating wheel enables the torque value of the sensor to change and generates an output signal, and then the rotating speed of the wafer is calculated according to the frequency of the output signal.
The beneficial effects of the invention include:
a. the rotating speed measuring mechanism configured by the wafer cleaning device is not subjected to the wafer slipping, so that the accuracy of rotating speed measurement is effectively ensured, the flexible regulation and control of the cleaning process is facilitated, and a good cleaning effect is obtained;
b. one end of the detecting piece of the rotating speed measuring mechanism is of a sheet structure, so that the self weight of the detecting piece is reduced, the rotational inertia of the detecting piece is reduced, and the swing flexibility of the detecting piece is improved;
c. the side part of the detection piece is provided with the limiting component, so that the detection piece can swing around the hinge point along the fixed direction, and the detection piece is prevented from being deviated in the swing direction to influence the detection accuracy;
d. the side part of the detection part is provided with an elastic part and a matched adjusting part, the elastic part is arranged between the supporting plate and the detection part, and the acting force of the rotating wheel on the edge of the wafer is changed by adjusting the expansion and contraction of the elastic part so as to prevent the rotating wheel from pressing the wafer tightly to influence the normal rotation of the wafer.
Drawings
The advantages of the present invention will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the invention, wherein:
FIG. 1 is a schematic view of a wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a rotational speed measuring mechanism according to an embodiment of the present invention;
FIG. 3 is a top view of the corresponding wafer cleaning apparatus of FIG. 2;
FIG. 4 is a schematic view of a detecting member according to an embodiment of the present invention;
FIG. 5 is a schematic view of a rotational speed measurement mechanism according to another embodiment of the present invention;
FIG. 6 is a schematic view of a rotational speed measurement mechanism according to yet another embodiment of the present invention;
fig. 7 is a schematic view of a wafer cleaning apparatus according to another embodiment of the invention
FIG. 8 is a schematic diagram of a relay measurement mechanism in the embodiment of FIG. 7;
FIG. 9 is a side view of the relay measurement mechanism of FIG. 8;
fig. 10 is a schematic view of a wafer cleaning apparatus according to another embodiment of the present invention.
Detailed Description
The following describes the technical scheme of the present invention in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present invention for illustrating the concept of the present invention; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the invention in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims of the present application and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present invention, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for purposes of clarity in illustrating the structure of various components of embodiments of the invention, the same reference numbers will be used in the drawings to identify similar elements in the drawings and to delineate the same scale between the various drawings.
In the present invention, "chemical mechanical polishing (Chemical Mechanical Polishing, CMP)" is also referred to as "chemical mechanical planarization (Chemical Mechanical Planarization, CMP)", and Wafer (W) is also referred to as Substrate (Substrate), and the meaning and actual function are equivalent. The term "comprising" and its like are to be construed as open-ended, i.e., including, but not limited to. The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first," "second," and the like, may refer to different or the same object and are used solely to distinguish one from another without implying a particular spatial order, temporal order, order of importance, etc. of the referenced objects. In some embodiments, the values, processes, selected items, determined items, devices, means, parts, components, etc. are referred to as "best," "lowest," "highest," "smallest," "largest," etc. It should be understood that such description is intended to indicate that a selection may be made among many available options of functionality, and that such selection need not be better, lower, higher, smaller, larger, or otherwise preferred in further or all respects than other selections.
In the present invention, "wafer cleaning" is defined as substantially the same as "wafer post-processing" and includes rinsing and drying, both of which are spraying chemical liquid toward the wafer surface to clean particles remaining on the wafer surface and to strip off a water film attached to the wafer surface. Thus, in embodiments of the present invention, wafer cleaning and wafer post-processing have substantially equivalent meanings.
Fig. 1 is a schematic view of a wafer cleaning apparatus 100 according to an embodiment of the present invention, where the wafer cleaning apparatus 100 includes:
the box body 10 is used for limiting the cleaning operation of the wafer W in a relatively closed space, avoiding the interference of the external environment on the cleaning effect of the wafer, and reducing the interference of the cleaning operation on other functional modules; it will be appreciated that the sides or top of the housing 10 may be configured with a door to allow the transfer robot to place the wafer in the housing 10 or to remove the wafer from the housing 10;
a clamping mechanism 20 disposed in the case 10 for clamping a wafer W to be processed; the clamping mechanism 20 generally includes a plurality of support members uniformly disposed on the outer peripheral side of the wafer clamping area; the top of the supporting component is provided with a clamping roller which is abutted against the edge of the wafer so as to horizontally clamp the wafer to be cleaned; meanwhile, a driving mechanism is arranged at the lower part of the supporting component so as to drive the clamping roller to rotate; the friction force between the clamping roller and the wafer can drive the wafer to rotate around the central axis;
a pair of rolling brushes 30 are further provided inside the case 10, which are provided on the upper and lower sides of the horizontally clamped wafer W to simultaneously clean the front and rear sides of the wafer W; specifically, the end of the roller brush 30 is provided with a driving motor capable of driving the roller brush 30 to rotate about its central axis; meanwhile, the end of the rolling brush 30 is further provided with an up-down driving mechanism to drive the rolling brush 30 to move along the vertical direction so as to be close to or far away from the wafer to be cleaned.
In fig. 1, the wafer cleaning apparatus 100 further includes a spray pipe 40 capable of spraying chemical liquid toward the roll brush 30 and the surface of the wafer W; the chemical liquid infiltrated rolling brush 30 rotates around the central axis, and the rolling brush 30 contacts with the rotating wafer to strip the residual particles on the surface of the wafer, so as to clean the surface of the wafer.
In order to secure the cleaning effect of the wafer, the rotation speed of the wafer needs to be controlled. Specifically, the rotation speed of the wafer needs to be stabilized within a set range to ensure the contact frequency between the rolling brush 30 and the wafer surface.
In the embodiment shown in fig. 1, the wafer cleaning apparatus 100 further includes a rotation speed measuring mechanism 50 disposed in the housing 10 to measure the rotation speed of the wafer.
Further, as shown in fig. 2, the rotation speed measuring mechanism 50 includes a detecting member 51 hinged in the case 10 such that the detecting member 51 can swing around the hinge point; one end of the detecting member 51 is provided with a rotating wheel 52, and the rotating wheel 52 can be abutted against the outer edge of the wafer to sense a notch (notch) of the wafer. That is, when the wafer notch contacts the rotating wheel 52, the rotating wheel 52 is slightly shifted along the radial direction of the wafer notch.
Fig. 3 is a top view of the wafer cleaning apparatus 100 of fig. 1 (without the housing 10), wherein the contact state of the rotating wheel 52 and the wafer gap is changed when the rotating wheel is in contact with the wafer gap. This change of state causes a slight movement of the wheel 52 along the radius of the wafer gap.
The rotational speed of the wafer may be obtained by monitoring the frequency of minute movements of the wheel 52 as the wafer rotates. In the invention, the micro-movement of the rotating wheel 52 is amplified by utilizing the lever amplification principle so as to improve the accuracy of rotating speed detection. Namely, the swinging condition of the other end of the hinged and fixed detecting member 51 is monitored, so that the detecting difficulty is reduced, and the accuracy of swinging information detection is ensured.
Specifically, the rotational speed measuring mechanism 50 further includes a sensor 53, as shown in fig. 2. The sensor 53 is disposed at the other end of the detecting member 51 to measure the swing information of the detecting member 51, thereby calculating the rotation speed of the wafer. Specifically, the sensor 53 is disposed at an end of the detecting member 51 away from the rotating wheel 52 to measure the swinging of the detecting member 51.
In fig. 2, the hinge point of the detecting member 51 is disposed near the rotating wheel 52, so that the other end of the detecting member 51 can amplify the movement of the rotating wheel 52, so as to obtain the swinging condition of the detecting member 51 more accurately, and further indirectly obtain the information of the micro displacement of the rotating wheel 52, thereby calculating the rotation speed of the wafer. The technical scheme can avoid the influence of wafer slip on the rotation speed measurement, and is beneficial to ensuring the accuracy of the rotation speed measurement.
Further, the sensor 53 may be a photoelectric sensor to measure the frequency of the swing of the detecting member 51 around the hinge point, thereby calculating the rotation speed of the wafer.
In the present invention, the rotation speed measuring mechanism 50 further includes a limiting component 54, as shown in fig. 2; the limiting component 54 is disposed on a side portion of the detecting member 51, so that the detecting member 51 can swing around the hinge point along a fixed direction, so as to prevent the swing direction of the detecting member 51 from being deviated to affect the accuracy of detection.
Further, the limiting assembly 54 includes a limiting seat 54a and a limiting roller 54b, the limiting seat 54a is fixed in the box 10, and the limiting roller 54b is disposed at an end of the limiting seat 54a and can rotate around the central axis. The outer peripheral side of the stopper roller 54b abuts against the side surface of the detecting piece 51 to ensure that the detecting piece 51 moves in the fixed direction.
As an embodiment of the present invention, the detecting member 51 has a columnar structure 51a at one end and a sheet-like structure 51b at the other end, as shown in fig. 4. The sheet structure 51b of the detecting member 51 can reduce its own weight to reduce the moment of inertia of the detecting member 51, thereby improving the flexibility of swinging of the detecting member 51.
Further, the rotating wheel 52 is rotatably connected to the end of the columnar structure 51a, and in particular, a corrosion-resistant bearing is disposed between the columnar structure 51a and the rotating wheel 52, so as to ensure that the rotating wheel 52 can smoothly rotate around the central axis of the columnar structure 51 a.
In some embodiments, the detecting member 51 is made of a non-metallic material resistant to corrosion such as polyetheretherketone, polyphenylene sulfide, etc., to ensure structural strength of the detecting member 51 and to extend the service life of the detecting member 51; the rotating wheel 52 arranged at the end of the detecting element 51 can be made of polyurethane, and has certain wear resistance; the rotating wheel 52 is in contact with the edge of the wafer, and the friction force between the rotating wheel 52 and the wafer can drive the rotating wheel 52 to rotate freely.
In the embodiment shown in fig. 2, the sensor 53 is disposed at a side portion of the sheet structure 51b, and the sensor 53 can detect movement information of the detecting member 51 that swings flexibly, so as to obtain micro displacement information of the rotating wheel 52, so as to calculate the rotation speed of the wafer.
Further, the rotation speed measuring mechanism 50 further includes a protective cover 55, which is sleeved on the outer side of the detecting member 51 and covers the hinge point, as shown in fig. 2. In the present invention, the protection cover 55 configured in the case 10 can effectively prevent contaminants such as particulate matters from adhering to the surfaces of the detecting member 51 and the corresponding hinge points in the cleaning process, so as to ensure flexible swinging of the detecting member 51, and avoid the contaminants adhering to the hinge points and interfering with measurement of the wafer rotation speed.
In some embodiments, the shield 55 is made of a rubber material that wraps around the upper end of the detecting member 51 to ensure flexibility in swinging the detecting member 51 while ensuring that the operating environment of the detecting member 51 is clean.
In fig. 2, the protection cover 55 is a bellows made of rubber, and can swing along with the detecting member 51 around the hinge point, so as to prevent the contamination generated by cleaning from adhering to the hinge point and affecting the accuracy of the wafer rotation speed measurement.
As an embodiment of the present invention, the rotation speed measuring mechanism 50 further includes an elastic member 56, and the elastic member 56 is connected to a side portion of the detecting member 51 to adjust a contact force between the rotating wheel 52 of the detecting member 51 and the wafer.
Specifically, the elastic member 56 is a spring, one end of which is fixed to the support plate 57a at the lower portion of the case 10, and the other end of which is connected to the detecting member 51, as shown in fig. 2; and, the end of the elastic member 56 is further provided with an adjusting member 57b, and the adjusting member 57b abuts against the other side of the supporting plate 57a, so that the elastic member 56 can be pulled to adjust the expansion and contraction amount of the elastic member 56, the acting force of the rotating wheel 52 on the edge of the wafer is changed, and the rotating wheel 52 is prevented from pressing the wafer too tightly to influence the normal rotation of the wafer.
Further, the rotation speed measuring mechanism 50 further includes a pushing member 58, which can push the detecting member 51 to rotate around the hinge point, so that the rotating wheel 52 at the end of the detecting member 51 is not higher than the plane where the clamping mechanism 20 holds the wafer, and when the wafer is picked and placed by the turnover manipulator, the rotating wheel 52 of the rotation speed measuring mechanism 50 is not on the moving path of the wafer, so as to ensure the smoothness of the wafer transmission.
In fig. 2, the pushing member 58 is an air cylinder, the air cylinder seat is fixed on the case 10, and a piston rod of the air cylinder can abut against the detecting member 51, so that the detecting member 51 can rotate around the hinge point, and the rotating wheel 52 is further changed from a vertical state to an inclined state, so as to prevent the wafer from interfering with the rotating wheel 52.
It is understood that the pushing member 58 may be an electric cylinder or other driving mechanism formed by a four-bar mechanism, so long as the technical solution of pushing the detecting member 51 to rotate around the hinge point falls within the protection scope and the disclosure scope of the present embodiment.
In the embodiment shown in fig. 1, the wafer cleaning apparatus 100 is configured with two rotation speed measuring mechanisms 50 uniformly distributed on the outer peripheral side (shown in fig. 3) of the wafer holding area of the clamping mechanism 20 to ensure that the wafer to be cleaned is relatively uniformly subjected to side loads. It will be appreciated that the rotational speed measuring mechanism 50 may be of other numbers, such as three pieces, four pieces, etc. It should be appreciated that the rotational speed measuring mechanism 50 should not be too much, so as not to increase the complexity of the wafer cleaning apparatus 100 and reduce the operation stability of the wafer cleaning apparatus 100.
When the wafer cleaning device 100 provided by the invention is used for performing a wafer cleaning process, the rotation speed of the wafer is monitored in real time by using the rotation speed measuring mechanism 50; and the cleaning process of the wafer is flexibly controlled according to the rotating speed of the wafer so as to obtain a good cleaning effect.
The steps of the wafer cleaning process are briefly described below in connection with the embodiment shown in fig. 1:
first, the moving end of the pushing member 58 moves forward to abut against the sheet-like structure 51b (shown in fig. 4) of the detecting member 51, so that the detecting member 51 can rotate about the hinge point; the rotating wheel 52 at the end part of the detecting piece 51 is changed into an inclined state from a vertical state, and the rotating wheel 52 is lower than the plane of the moving path of the turnover manipulator for placing the wafer; the turnover manipulator places the wafer to be cleaned in the box body 10, and the clamping mechanism 20 horizontally clamps the wafer;
then, the moving end of the pushing piece 58 is restored to the original position, and the rotating wheel 52 at the end part of the detecting piece 51 is abutted against the edge of the wafer;
then, the wafer is driven to rotate, the rolling brush 30 moves towards the rotating wafer and is filled with deionized water and/or chemical liquid, and the liquid spraying pipe 40 sprays cleaning liquid towards the surface of the wafer; the roller brush 30 rotates around its central axis and contacts the rotating wafer surface, thereby cleaning the wafer surface of residual particles in a contact manner.
In the wafer cleaning process, the detecting member 51 monitors the minute displacement of the rotating wheel 52, and the sensor 53 acquires the swinging condition of the sheet-like structure 51b at the lower part of the detecting member 51 in real time, so as to calculate the rotation speed of the wafer.
According to the invention, the notch (notch) arranged on the edge of the wafer is utilized, the swing information of the detection piece 51 is monitored through the sensor 53, the influence of wafer slip on the rotation speed measurement is effectively avoided, and the accuracy of the rotation speed measurement of the wafer is improved.
Fig. 5 is a schematic diagram of a rotation speed measuring mechanism 50 according to another embodiment of the present invention, in which the detecting member 51 has an approximately L-shaped structure compared with the embodiment shown in fig. 2. Specifically, the lower portion of the detecting member 51 is provided with a transverse sheet structure 51b, so as to reduce the space occupation of the detecting member 51 along the vertical direction and expand the application range of the rotation speed measuring mechanism 50.
Other components and connection relationships in fig. 5 are similar to those in the embodiment of fig. 2, and are not described here again. When the wafer notch is abutted against the rotating wheel 52, the rotating wheel 52 is slightly displaced along the radial direction of the wafer notch; the detecting piece 51 rotates along the hinge point, and then drives the sheet-shaped structure 51b arranged transversely to move in the vertical direction; since the hinge point of the detecting member 51 is located at a distance from the end of the sheet-like structure 51b, the end of the sheet-like structure 51b can enlarge the rotating wheel 52.
A sensor 53 for monitoring is provided at a side portion of the sheet structure 51b to detect a moving frequency of the sheet structure 51b, and further calculate a rotation speed of the wafer according to the swing frequency of the sheet structure 51 b.
Fig. 6 is a schematic diagram of a rotation speed measuring mechanism 50 according to another embodiment of the present invention, in which, compared with the embodiment shown in fig. 2, a sensor 53 is disposed between an elastic member 56 and a supporting plate 57a to monitor the swinging of a detecting member 51.
In this embodiment, by using the amplification principle of the hinged and fixed detecting member 51, the small swing of the rotating wheel 52 can form a larger swing of the lower end of the detecting member 51, so as to change the pressing degree of the detecting member 51 to the sensor 53.
Further, the sensor 53 is a pressure sensor, which is disposed at the tail end of the elastic member 56; when the set sensor 53 reaches the set threshold, a switching value signal is sent to the system, and the frequency of contact between the notch of the wafer and the rotating wheel 52 is obtained according to the frequency of the switching value signal, so as to calculate the rotation speed of the wafer.
Fig. 7 is a schematic view of a wafer cleaning apparatus 100 according to an embodiment of the present invention, where the wafer cleaning apparatus 100 includes a case 10, and a clamping mechanism 20 is disposed inside the case 10 to horizontally clamp a wafer to be cleaned; two rotation speed measuring mechanisms 50 are also provided inside the case 10 to measure the rotation speed of the wafer.
Further, as shown in fig. 8 and 9, the rotational speed measuring mechanism 50 includes:
a detection member 51 slidably coupled to the case 10; specifically, the detecting member 51 is disposed on the sliding assembly 59, and the sliding assembly 59 includes a slide rail 59a and a slide block 59b fixed to the case 10, the slide block 59b being connected to the detecting member 51 and being movable in the horizontal direction; one end of the detecting member 51 is provided with a rotating wheel 52, the rotating wheel 52 can be abutted against the outer edge of the wafer W, and the wafer notch enables the rotating wheel 52 contacted with the wafer W to move;
a sensor 53 which is a torque sensor and is connected to the other end of the detecting member 51; the moving wheel 52 causes the torque value of the sensor 53 to change and generates an output signal, and the wafer speed is calculated based on the frequency of the output signal.
In fig. 8, the rotation speed measuring mechanism 50 further includes a shield 55 provided on the outer peripheral side of the detecting member 51 to prevent contaminants generated by the cleaning from adhering to the moving parts of the rotation speed measuring mechanism 50 to affect the normal movement of the detecting member 51.
Further, the rotation speed measuring mechanism 50 further includes an elastic member 56, and in this embodiment, the elastic member 56 is a spring. One end of the elastic member 56 is fixed to the support plate 57a, and the other end thereof is connected to the slider 59b; the elastic member 56 is pressed against the sliding block 59b, so that the rotating wheel 52 at the upper end of the detecting member 51 is pressed against the edge of the wafer W.
When the wheel 52 contacts the wafer gap, the wheel 52 moves such that the detecting member 51 acts on the sensor 53 at the lower portion thereof.
When the sensor 53 reaches the set threshold, the sensor 53 outputs a switching value signal, and the frequency of contact between the notch of the wafer and the rotating wheel 52 can be calculated by detecting the frequency of the switching value signal, so as to calculate the rotation speed of the wafer.
Further, the rotation speed measuring mechanism 50 further includes a pushing member 58, the moving end of which can be abutted against the sliding block 59b, so that the detecting member 51 and the rotating wheel 52 thereon move towards the outside, so as to facilitate the transfer robot to pick and place the wafer.
In the wafer cleaning apparatus 100 of fig. 1, a wafer is horizontally held and cleaned on the front and rear surfaces by the roller brush 30, and a pair of rotation speed measuring mechanisms 50 are disposed in the case 10 to measure the rotation speed of the wafer. It will be appreciated that the rotational speed measurement mechanism 50 may also be used with a wafer vertical cleaning apparatus.
Fig. 10 is a schematic view of a wafer cleaning apparatus 100 according to another embodiment of the present invention, in which a wafer is surface-post-processed in a vertical state. Specifically, the wafer cleaning apparatus 100 includes a case 10, and a pair of driving wheels 21 disposed at intervals are disposed inside the case 10 to vertically fix a wafer to be cleaned and to drive the wafer to rotate about a central axis.
Further, the wafer W is provided with the rolling brushes 30 at both sides thereof, and the end portions of the rolling brushes 30 are connected with a driving motor (not shown) which drives the rolling brushes 30 to rotate about the axis thereof. The upper portion of the cabinet 10 is provided with a spray pipe 40 to spray DIW and/or cleaning liquid toward the wafer W.
When the wafer is cleaned, a driving motor (not shown) arranged at the side part of the driving wheel 21 drives the wafer to rotate in the same direction; under the action of friction force, the vertically arranged wafer W rotates around the axis of the wafer. The rotating brush roller 30 contacts the rotating wafer W to remove contaminants such as particles remaining on the surface of the wafer W.
The inside of the case 10 is also provided with three rotation speed measuring mechanisms 50 uniformly distributed on the outer peripheral side of the wafer W to measure the rotation speed of the wafer in real time. Specifically, one rotation measuring mechanism 50 is disposed between two driving wheels 21, and the other two rotation measuring mechanisms 50 are disposed on the upper side of the rolling brush 30 and symmetrically disposed on two sides of the wafer, so as to ensure uniformity of stress of the wafer, and further obtain a good cleaning effect.
In the embodiment shown in fig. 10, the rotation speed measurement mechanism 50 is not affected by the slip of the wafer, so that the accuracy of the rotation speed measurement of the wafer is effectively ensured, and the wafer cleaning process is effectively regulated and controlled, so as to ensure the cleaning effect of the wafer.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A wafer cleaning apparatus, comprising:
a case;
the clamping mechanism is arranged in the box body to clamp the wafer to be processed;
the rotating speed measuring mechanism is arranged in the box body and used for measuring the rotating speed of the wafer;
the rotational speed measuring mechanism includes:
the detecting piece is hinged in the box body, one end of the detecting piece is provided with a rotating wheel, and the rotating wheel can be abutted against the outer edge of the wafer and sense the notch of the wafer;
and the sensor is arranged at the other end of the detection piece to measure the swing information of the detection piece and further calculate the rotating speed of the wafer.
2. The wafer cleaning apparatus of claim 1, wherein the hinge point of the sensing member is disposed adjacent to the rotating wheel such that the other end of the sensing member can amplify the movement of the rotating wheel.
3. The wafer cleaning apparatus of claim 1, wherein the rotational speed measuring mechanism further comprises a limiting assembly disposed on a side of the detecting member such that the detecting member can swing around the hinge point in a fixed direction.
4. The wafer cleaning apparatus according to claim 1, wherein one end of the detecting member has a columnar structure and the other end has a sheet-like structure; the rotating wheel is rotatably connected to the end part of the columnar structure, and the sensor is arranged on the side part of the sheet-shaped structure.
5. The wafer cleaning apparatus of claim 1, wherein the rotational speed measuring mechanism further comprises a protective cover that is sleeved on the outer side of the detecting member and covers the hinge point.
6. The wafer cleaning apparatus of claim 1, wherein the sensor is a photoelectric sensor to measure the frequency of oscillation of the sensing member about a hinge point.
7. The wafer cleaning apparatus of claim 1, wherein the rotational speed measuring mechanism further comprises an elastic member coupled to a side portion of the detecting member to adjust a contact force between the rotating wheel of the detecting member and the wafer.
8. The wafer cleaning apparatus of claim 1, wherein the rotational speed measuring mechanism further comprises a pushing member capable of pushing the detecting member to rotate about the hinge point such that a wheel at an end of the detecting member is not higher than a plane in which the clamping mechanism holds the wafer.
9. The wafer cleaning apparatus according to claim 1, wherein at least two of the rotation speed measuring mechanisms are uniformly distributed on an outer peripheral side of a region where the wafer is held by the holding mechanism.
10. A wafer cleaning apparatus, comprising:
a case;
the clamping mechanism is arranged in the box body to clamp the wafer to be processed;
the rotating speed measuring mechanism is arranged in the box body and used for measuring the rotating speed of the wafer;
the rotational speed measuring mechanism includes:
the detection piece is connected in the box body in a sliding way, one end of the detection piece is provided with a rotating wheel, the rotating wheel can be abutted against the outer edge of the wafer, and the rotating wheel contacted with the wafer is moved by the wafer notch;
the sensor is a torque sensor and is connected to the other end of the detection piece; the moving rotating wheel enables the torque value of the sensor to change and generates an output signal, and then the rotating speed of the wafer is calculated according to the frequency of the output signal.
CN202311357142.9A 2023-10-19 2023-10-19 Wafer cleaning device Pending CN117438339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311357142.9A CN117438339A (en) 2023-10-19 2023-10-19 Wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311357142.9A CN117438339A (en) 2023-10-19 2023-10-19 Wafer cleaning device

Publications (1)

Publication Number Publication Date
CN117438339A true CN117438339A (en) 2024-01-23

Family

ID=89545469

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311357142.9A Pending CN117438339A (en) 2023-10-19 2023-10-19 Wafer cleaning device

Country Status (1)

Country Link
CN (1) CN117438339A (en)

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