CN212494124U - Wafer cleaning device - Google Patents

Abstract

A wafer cleaning apparatus, comprising: a base; the wafer rotating assembly is arranged at the upper part of the base and is used for supporting the wafer and driving the wafer to rotate around the axis of the wafer; the cleaning brush is of a cylindrical structure, is arranged on two sides of the wafer and rolls around the axis of the wafer; support plates provided at both ends of the cleaning brush; the cleaning brush moving assemblies are arranged at two ends of the cleaning brush and comprise lead screws and guide rails, the lead screws are connected with the supporting plate, and the guide rails are parallel to the lead screws and connected with the supporting plate; drive assembly, it includes drive mechanism and driving piece, the driving piece passes through drive mechanism drive cleaning brush both ends lead screw synchronous revolution to the backup pad edge at drive cleaning brush both ends the guide rail removes.

Description

Wafer cleaning device

Technical Field

The utility model belongs to the technical field of the wafer cleaning, especially, relate to a wafer cleaning device.

Background

In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In wafer processing, for example: deposition, plasma etching, photolithography, electroplating, etc., may introduce contamination and/or particles on the wafer surface, resulting in a reduced wafer surface cleanliness and a low yield of manufactured semiconductor devices.

In order to achieve the purpose of no contamination on the wafer surface, it is necessary to remove the contamination on the wafer surface to prevent the contamination from remaining on the wafer surface before the process. Therefore, in the wafer manufacturing process, it is necessary to perform surface cleaning many times to remove contaminants such as metal ions, atoms, organic substances, and particles attached to the wafer surface.

The wafer cleaning method includes roller brush cleaning, megasonic cleaning, and the like, wherein the roller brush cleaning is widely applied. Patent CN102768974B discloses a wafer cleaning apparatus. The wafer cleaning equipment comprises: a frame; the wafer cleaning device is arranged on the rack; the wafer brushing device is arranged on the rack and is positioned at the downstream side of the wafer cleaning device; the wafer drying device is arranged on the rack and is positioned on the downstream side of the wafer brushing device; and the mechanical arm is movably arranged on the rack and used for vertically clamping the wafer and carrying the wafer.

How to reduce the contamination of the wafer surface is always a technical problem for the continuous improvement of those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer cleaning device aims at solving one of above-mentioned technical problem to a certain extent, and it discloses a wafer cleaning device, and it includes: a base; the wafer rotating assembly is arranged at the upper part of the base and is used for supporting the wafer and driving the wafer to rotate around the axis of the wafer; the cleaning brush is of a cylindrical structure, is arranged on two sides of the wafer and rolls around the axis of the wafer; support plates provided at both ends of the cleaning brush; the cleaning brush moving assemblies are arranged at two ends of the cleaning brush and comprise lead screws and guide rails, the lead screws are connected with the supporting plate, and the guide rails are parallel to the lead screws and connected with the supporting plate; drive assembly, it includes drive mechanism and driving piece, the driving piece passes through drive mechanism drive cleaning brush both ends lead screw synchronous revolution to the backup pad edge at drive cleaning brush both ends the guide rail removes.

In a preferred embodiment, the lead screw is disposed on the upper portion of the base, and is parallel to the axis of the wafer.

In a preferred embodiment, the screw is a ball screw, which is connected to the support plate by a screw nut.

In a preferred embodiment, the guide rail is disposed at one side of the screw rod, and is connected to the support plate through a slider.

In a preferred embodiment, the screw is a bidirectional screw, and the thread sections with different thread turning directions are respectively connected with the supporting plates arranged on the two sides of the wafer; the rotary lead screw drives the supporting plate and the cleaning brush on the supporting plate to move close to or away from each other integrally.

In a preferred embodiment, the transmission mechanism is a belt transmission mechanism, and the driving member drives the lead screws at the two ends of the cleaning brush to synchronously rotate through the belt transmission mechanism.

As a preferred embodiment, drive mechanism includes band pulley and belt, and the output shaft of driving piece is provided with the band pulley, the tip of lead screw is provided with the band pulley, the belt set up in the driving piece with between the band pulley of lead screw and between the band pulley of the lead screw of cleaning brush tip, the lead screw synchronous revolution at driving piece through belt drive cleaning brush both ends.

As a preferred embodiment, the cleaning brush includes a front cleaning brush and a rear cleaning brush, and the cleaning brush moving assembly includes a front cleaning brush moving assembly and a rear cleaning brush moving assembly; the front cleaning brush moving assembly is connected with the front cleaning brush through a supporting plate, and the rear cleaning brush moving assembly is connected with the rear cleaning brush through a supporting plate; the drive assembly includes preceding drive assembly and back drive assembly, the lead screw rotation at cleaning brush both ends before the driving piece drive of preceding drive assembly, the lead screw rotation at cleaning brush both ends behind the driving piece drive of back drive assembly.

In a preferred embodiment, the guide rail of the front cleaning brush moving assembly and the guide rail of the rear cleaning brush moving assembly are the same guide rail.

As a preferred embodiment, the wafer cleaning apparatus further includes a displacement sensor fixed to the support plate to measure a distance between the cleaning brushes.

Compared with the prior art, the embodiment of the utility model beneficial effect who exists includes: the two ends of the cleaning brush are provided with cleaning brush moving assemblies, and the driving piece drives the lead screws arranged at the two ends of the cleaning brush to synchronously rotate through the transmission mechanism so as to drive the cleaning brush to integrally move along the axial direction parallel to the wafer. The wafer cleaning device can effectively improve the accuracy of the position movement of the cleaning brush, and ensure that the two ends of the cleaning brush are simultaneously contacted with or separated from the wafer, so that the load of the cleaning brush acting on the surface of the wafer is more uniform, and the cleaning effect of the surface of the wafer is effectively improved; furthermore, the utility model discloses the distance between monitoring drive cleaning brush pivoted driving motor's load moment of torsion and the cleaning brush, the shift position of cleaning brush is judged to the distance combination between driving motor's load moment of torsion and the cleaning brush, effectively guarantees the contact state of cleaning brush and wafer, effectively guarantees wafer abluent stability.

Drawings

The advantages of the invention will become clearer and more easily understood from the detailed description given with reference to the following drawings, which are given purely by way of illustration and do not limit the scope of protection of the invention, wherein:

fig. 1 is a schematic view illustrating a wafer cleaning apparatus 1 according to the present invention cleaning a wafer W;

fig. 2 is a front view of the wafer cleaning apparatus 1 according to the present invention;

fig. 3 is a bottom view of the wafer cleaning apparatus 1 shown in fig. 2;

fig. 4 is a schematic view of an embodiment of the wafer cleaning apparatus 1 of the present invention;

fig. 5 is a schematic view of another embodiment of the wafer cleaning apparatus 1 according to the present invention;

fig. 6 is a flowchart of a wafer cleaning method according to the present invention.

Detailed Description

The following describes the present invention and its related technical solutions in detail with reference to specific embodiments and the accompanying drawings. The embodiments described herein are specific, non-limiting, embodiments of the present invention, and are presented to illustrate the concepts and concepts of the invention; the description is illustrative, exemplary, and schematic and is not to be construed as limiting the embodiments of the invention or the scope of the invention. In addition to all of the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious or will be easily conceived based on the disclosure of the claims and the specification thereof, and these technical solutions include those which employ any obvious replacement or modification of the embodiments described herein. In order to explain the technical solution of the present invention, the following description is made by using specific examples. In the present application, "Chemical Mechanical Polishing" is also referred to as "Chemical Mechanical Planarization", and a substrate (substrate) is also referred to as a wafer (wafer), which means equivalent to the actual function.

Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus 1 according to the present invention, in which the wafer cleaning apparatus 1 includes a base 10, a wafer rotation assembly 20, and a cleaning brush 30. The wafer rotating assembly 20 is disposed at an upper portion of the pedestal 10, and a wafer W to be cleaned is supported by the wafer rotating assembly 20 and rotates about an axis of the wafer W. The cleaning brush 30 has a cylindrical structure made of a material having good water absorbency such as polyvinyl alcohol, and the cleaning brush 30 is impregnated with a cleaning solution to clean the surface of the wafer in a contact manner. The cleaning brushes 30 are provided on both sides of the wafer W to be cleaned, and are rolled around their axes to contact the surface of the wafer W to be cleaned.

The wafer rotating assembly 20 comprises a fixing seat, a pair of driving rollers and driven rollers, wherein the driving rollers and the driven rollers are provided with clamping grooves for supporting wafers, and the clamping grooves are arranged around the outer peripheral sides of the rollers. The driving roller and the driven roller are arranged on the fixing seat, and the clamping grooves are located in the same plane. Driven running roller set up in the middle part of fixing base, initiative running roller symmetry sets up in driven running roller's both sides. The pair of driving rollers and the driven rollers are arranged along the outline of the outer edge of the wafer, the wafer W placed on the wafer rotating assembly 20 is limited by the clamping groove, and the outer edge of the wafer is tangent to the bottom surface of the clamping groove. The driving roller is provided with a driving motor, and the driving motor drives the driving roller to rotate. The friction between the outer edge of the wafer and the roller drives the wafer to rotate around the axis of the wafer. With regard to the structure of the wafer rotation assembly 20, reference may be made to a vertical cleaning unit for wafers disclosed in patent CN 107516644A.

The operation of wafer cleaning is briefly described below with reference to fig. 1.

Firstly, a wafer W to be cleaned is placed on the wafer rotating assembly 20 by a manipulator, and at the moment, a certain distance is reserved between the cleaning brush 30 and the side surface of the wafer W so as to provide an operation space for the manipulator; the wafer rotating assembly 20 drives the wafer W to rotate around the axis thereof;

next, a not-shown fluid ejection device ejects a cleaning liquid, such as an acidic or alkaline cleaning liquid, toward the rotating wafer W;

next, the brush 30 is rolled around its axis and moved toward the position of the wafer W so that the brush 30 is in contact with the surface of the wafer W; the cleaning brush 30 brushes the surface of the wafer W in a rolling manner to remove contaminants on the surface of the wafer, thereby realizing surface brushing of the wafer;

after the wafer is scrubbed, the cleaning brush 30 moves toward the outer side of the wafer W, and the cleaning brush 30 is separated from the surface of the wafer W;

next, the fluid ejection device, not shown, continues to eject the cleaning fluid toward the rotating wafer W for a while, and after that, the robot hand transfers the wafer W, which has completed cleaning, to the next process.

As can be seen from the operation method of cleaning the wafer, the position of the cleaning brush 30 needs to be moved at the start stage and the end stage of the wafer cleaning. Since the distance between the brush 30 and the wafer W determines the contact state between the brush 30 and the wafer W, the contact state between the two is directly related to the wafer surface cleaning effect. Therefore, the position movement of the washing brush 30 needs to be precisely controlled.

In fig. 1, the wafer cleaning apparatus 1 further includes a supporting plate 40 disposed at an upper portion of the base 10 for supporting the cleaning brushes 30 positioned at both sides of the wafer W to be cleaned. The support plates 40 are provided perpendicular to the axis of the washing brush 30 at both ends of the washing brush 30 such that the axis of the washing brush 30 positioned between the support plates 40 is parallel to the plane of the base 10.

Further, the wafer cleaning apparatus 1 further includes a cleaning brush moving assembly 50 including a lead screw 51. The washing brush moving assemblies 50 are provided at both ends of the washing brush 30. The screw 51 is disposed on the upper portion of the pedestal 10, and is disposed parallel to the axis of the wafer to be cleaned. The screw 51 is provided with a screw nut, and the support plate 40 is connected with the screw 51 through the screw nut. The screw 51 is rotated, and the screw nut thereon moves along the screw 51, i.e., the support plate 40 connected to the screw nut is moved.

In order to ensure the smooth movement of the support plate 40, a guide rail 52 is provided at one side of the screw shaft 51. The guide rail 52 is provided in parallel with the lead screw 51 at the upper portion of the base 10. The guide rail 52 is provided with at least one slider, by means of which the support plate 40 is connected to the guide rail 52. When the screw 51 rotates around the axis thereof, the supporting plate 40 connected with the screw 51 moves along the guide rail 52, which effectively ensures the accuracy of the movement of the supporting plate 40 and the cleaning brush 30 thereon.

Further, the wafer cleaning apparatus 1 further comprises a driving assembly 60, which includes a transmission mechanism 61 and a driving member 62, as shown in fig. 1. The driving member 62 drives the lead screws 51 at both ends of the washing brush 30 to rotate synchronously through the driving mechanism 61 to drive the supporting plate 40 and the washing brush 30 thereon to move integrally along the guide rail 52, thereby achieving accurate movement of the washing brush 30.

In the embodiment shown in fig. 1, the driving mechanism 61 is implemented in the form of a belt drive to realize the synchronous rotation of the lead screws 51 located at both ends of the washing brush 30. Specifically, the transmission mechanism 61 includes a pulley and a belt. The output shaft of the driving member 62 is provided with a first pulley, the end of the lead screw 51 disposed adjacent to the driving member 62 is provided with a second pulley, and the end of the lead screw 51 disposed away from the driving member 62 is provided with a third pulley. The first belt wheel is connected with the second belt wheel through a belt, and the second belt wheel is connected with the third belt wheel through a belt. Thus, the rotation of the output shaft of the driving member 62 is synchronously transmitted to the lead screws 51 of the washing brush moving assembly 50 provided at both ends of the washing brush 30 through the belt. The lead screw 51 rotates synchronously, that is, the brush 30 is driven to move accurately along the guide rail 52, and both ends of the brush 30 contact or are separated from the front and back surfaces of the wafer W at the same time.

In fig. 1, the transmission mechanism 61 is disposed on the upper portion of the base 10 and located at the front of the wafer cleaning apparatus. Wherein, the belt is a gear belt, and the band pulley is synchronous pulley. The driver 62 is provided on the right side of the base 10, and an output shaft of the driver 62 transmits power to the lead screws 51 located at the left and right ends of the washing brush 30 through a belt. The lead screw 51 rotates to drive the support plate 40 connected thereto to move.

As a variant of the embodiment shown in fig. 1, the transmission 61 may also take other forms of transmission, such as rack and pinion transmission, worm and worm gear transmission, etc. As long as the transmission mechanism 61 can stably transmit the power of the driving member 62 to the lead screws 51 at both ends of the cleaning brush 40 in synchronization.

The relevant components of the wafer cleaning apparatus 1 shown in fig. 1 are all disposed on the upper portion of the base 10. The arrangement mode can effectively reduce the occupation of the space in the vertical direction of the wafer cleaning device 1 and save the occupation space of the wafer cleaning module. Meanwhile, the interference of the structural form to the adjacent process modules is small, the modularized disassembly and assembly are convenient to carry out, and the convenience of daily maintenance of the wafer cleaning device is effectively improved.

Fig. 2 is a front view of the wafer cleaning apparatus 1 according to the present invention, and fig. 3 is a top view of the wafer cleaning apparatus 1 corresponding to fig. 2. In the embodiment shown in fig. 2 to 3, the screw 51 is a bidirectional screw, and the screw segments with different thread directions are respectively connected to the supporting plates 40 disposed at both sides of the wafer. The screw 51 is rotated and the screw nut thereon drives the supporting plate 40 and the washing brush 30 as a whole to be close to or away from each other. Since the screw driving form is relatively stable, it can accurately control the transfer distance, and thus, it is possible to realize accurate control of the moving position of the cleaning brush 30.

In fig. 3, the brush 30 is provided at each of the left and right ends thereof with a brush moving assembly 50, and a lead screw 51 of the brush moving assembly 50 is provided in the front-rear direction of the wafer cleaning apparatus 1. Further, the lead screw 51 is disposed parallel to the axis of the wafer to be cleaned. The support plate 40 at the end of the brush 30 is connected to the lead screw 51 by a lead screw nut, the guide rail 52 is positioned between the brush 30 and the lead screw 51, and the guide rail 52 is provided parallel to the lead screw 51. The number of the guide rails 52 corresponding to the brush moving assembly 50 positioned at one end of the brush 30 is one pair, and the support plate 40 of the end portion of the brush 30 is installed on the relatively independent guide rails 52 by means of the slider. As a variation of this embodiment, the guide rail 52 corresponding to the washing brush moving assembly 50 located at one end of the washing brush 30 may also be a one-piece guide rail 52, that is, the support plate 40 at one end of the washing brush 30 is disposed on the same guide rail 52 through a slider, so as to reduce the assembly error caused by the installation of the guide rail 52 and ensure the parallelism of the guide rail 52.

Fig. 4 is a plan view of another embodiment of the wafer cleaning apparatus 1 according to the present invention, and the cleaning brush 30 includes a front cleaning brush 30F and a rear cleaning brush 30B. The wafer to be cleaned is disposed between the front cleaning brush 30F and the rear cleaning brush 30B, and the front cleaning brush 30F and the rear cleaning brush 30B roll around the axes thereof to brush the surface of the wafer in contact therewith, so as to remove the contaminants on the surface of the wafer.

The front cleaning brush 30F is provided at left and right ends thereof with front cleaning brush moving assemblies 50F, respectively. The front cleaning brush moving assembly 50F located at the left end will now be described as an example. The feed screw 51 of the front cleaning brush moving assembly 50F is connected to the support plate 40 at the left side of the front cleaning brush 30F through a feed screw nut. The guide rail 52 of the front washing brush moving assembly 50F is disposed parallel to the lead screw 51 and is located inside the lead screw 51.

In order to drive the front washing brush 30F to move, a front driving module 60F is provided at the front portion of the base 10. In fig. 4, the front driving module 60F drives the lead screws 51 provided at both ends of the front brush 30F to rotate by means of a belt transmission, and the lead screws 51 drive the support plate 40 and the front brush 30F connected thereto to integrally move along the guide rail 52 by rotation.

Similarly, the left and right ends of the rear cleaning brush 30B are provided with rear cleaning brush moving assemblies 50B, respectively. The rear cleaning brush moving assembly 50B located at the left end will now be described as an example. The feed screw 51 of the rear cleaning brush moving assembly 50B is connected to the support plate 40 on the left side of the rear cleaning brush 30B by a feed screw nut. The guide rail 52 of the rear washing moving assembly 50B is disposed parallel to the lead screw 51 and is located inside the lead screw 51. A rear driving assembly 60B is provided at the front of the base 10 in order to drive the movement of the rear washing brush 30B. In fig. 4, the rear drive assembly 60B drives the lead screws 51 provided at both ends of the rear cleaning brush 30B to rotate by belt drive, and the lead screws 51 rotationally drive the support plate 40 and the rear cleaning brush 30B connected thereto to integrally move along the guide rail 52.

In the embodiment shown in fig. 4, the front cleaning brush 30F and the rear cleaning brush 30B are separately provided with the cleaning brush moving assembly 50 and the driving assembly 60. If the driving mechanism matched with the front cleaning brush 30F fails, the normal operation of the driving mechanism matched with the rear cleaning brush 30B is not affected, and the operation reliability of the wafer cleaning device is effectively improved.

Fig. 5 is a perspective view of the wafer cleaning apparatus 1 according to the present invention, in this embodiment, the screw 51 is connected to the support plate 40 through a screw nut. The lead screw 51 may be a slide lead screw or a static pressure lead screw as long as the moving accuracy of the washing brush allows.

As an embodiment of the present invention, the wafer cleaning apparatus 1 further includes a displacement sensor 70, as shown in fig. 5, which is fixed to the supporting plate 40, and the displacement sensor 70 is relatively close to the fixing position of the cleaning brush 30 to accurately measure the distance between the cleaning brushes 30. The displacement sensor 70 can measure the distance between the adjacent support plates 40, and indirectly reflect the distance between the cleaning brushes 30 disposed at both sides of the wafer through the distance.

In fig. 5, the displacement sensor 70 is provided on the inner side surface of the support plate 40 in the front-rear direction. Specifically, the mounting position of the displacement sensor 70 is matched with the vertical height corresponding to the mounting position of the brush 30, and the mounting position of the displacement sensor 70 is substantially identical with the vertical height corresponding to the mounting position of the brush 30. The displacement sensor 70 is provided in such a manner that the distance between the washing brushes 30 can be effectively reflected by the distance between the adjacent supporting plates 40. In one aspect of the present embodiment, the mounting position of the displacement sensor 70 in fig. 5 to the support plate 40 is set within a range in which the axis of the brush 30 vertically floats by 50mm on the projection line of the side surface of the support plate 40. When the displacement sensor 70 is mounted, it should be mounted as close as possible to the fixed position of the washing brush 30.

Further, the displacement sensor 70 is an eddy current displacement sensor for measuring a distance between the adjacent support plates 40 to determine the moving position of the washing brush 30 fixed to the upper portion of the support plate 40. In the embodiment shown in fig. 5, the displacement sensor 70 may also be selected from a potentiometer-type displacement sensor, an inductive displacement sensor, a capacitive displacement sensor, or a hall-type displacement sensor.

In fig. 5, the end of the washing brush 30 is provided with a driving motor 80, and the driving motor 80 drives the same to roll along the axis. The drive motor 80 has a torque monitoring module that is capable of monitoring the load torque experienced by the drive motor. The load torque is related to the distance of the cleaning brush 30 from the wafer. The closer the distance between the cleaning brush 30 and the wafer is, the larger the friction force between the cleaning brush and the wafer is, and the larger the load torque corresponding to the driving motor 80 is; conversely, the longer the distance between the brush 30 and the wafer is, the smaller the friction force between the brush and the wafer is, and the smaller the load torque corresponding to the drive motor 80 is. Therefore, the moving position of the washing brush 30 can be indirectly controlled by monitoring the load torque received by the driving motor 80.

In the wafer cleaning process, the contact state of the cleaning brush 30 and the wafer can be accurately monitored through the load torque of the driving motor 80, and a good wafer cleaning effect is achieved. However, the wafer cleaning apparatus is aged and deformed after a period of use, and the monitoring of the use state of the cleaning brush 30 cannot be realized only by the load torque of the driving motor 80. The life span of the cleaning brush 30 may exceed a rated value to affect the cleaning effect of the wafer.

The following briefly describes a method for using a wafer cleaning device according to the present invention, and a flow chart thereof is shown in fig. 6. The wafer cleaning method comprises the following steps:

s1, moving the rolling cleaning brush to the front side and the back side of the wafer;

s2, moving the cleaning brush to contact with the wafer, and measuring the load torque received by a driving motor for driving the cleaning brush to rotate

S3, measuring the distance between the cleaning brushes on the two sides of the wafer by the displacement sensor;

and S4, when the load torque of the driving motor reaches a preset torque value and the distance between the cleaning brushes reaches a preset distance value, stopping moving the cleaning brushes, and rolling the cleaning brushes to clean the front side and the back side of the wafer.

The preset torque value corresponding to the driving motor for driving the cleaning brush to rotate is a value range, and fluctuates by 15% above and below the optimal load torque value. On the premise that the load torque of the driving motor reaches a preset torque value, the distance value between the washing brushes can reflect the using state of the washing brushes. The preset distance value between the washing brushes is L, the preset distance value is also a value range, and the preset distance value fluctuates by 10% above and below the optimal distance value.

If the actually measured distance between the cleaning brushes is smaller than L, the fact that the cleaning brushes are aged in different degrees is shown, and whether the service life of the cleaning brushes is over-limited needs to be checked and approved or not is judged. If the actually measured distance between the cleaning brushes is larger than L, the wafer cleaning apparatus may have other abnormalities such as wafer clamping. Therefore, the wafer cleaning method can monitor the operation state of the wafer cleaning device, particularly the use state of the cleaning brush more effectively and comprehensively.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the above embodiments, the description of the embodiments is focused on, and these embodiments can be arbitrarily combined, and a new embodiment formed by combining them is also within the scope of the present application. For parts of one or some embodiments that are not described or specified in detail, reference may be made to the description of other embodiments.

The above-mentioned embodiments and implementation modes are only used for illustrating the technical solutions of the present invention, and are not limited or restricted thereto; although the present invention has been described with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be replaced with similar or equivalent ones; such modifications and substitutions are not intended to depart from the spirit or essential characteristics of the embodiments or the scope of the invention, and should be construed as being included within the scope of the invention. In other words, while embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A wafer cleaning apparatus, comprising:

a base;

the wafer rotating assembly is arranged at the upper part of the base and is used for supporting the wafer and driving the wafer to rotate around the axis of the wafer;

the cleaning brush is of a cylindrical structure, is arranged on two sides of the wafer and rolls around the axis of the wafer;

support plates provided at both ends of the cleaning brush;

the cleaning brush moving assemblies are arranged at two ends of the cleaning brush and comprise lead screws and guide rails, the lead screws are connected with the supporting plate, and the guide rails are parallel to the lead screws and connected with the supporting plate;

drive assembly, it includes drive mechanism and driving piece, the driving piece passes through drive mechanism drive cleaning brush both ends lead screw synchronous revolution to the backup pad edge at drive cleaning brush both ends the guide rail removes.

2. The wafer cleaning apparatus as claimed in claim 1, wherein the lead screw is disposed at an upper portion of the base, which is parallel to an axis of the wafer.

3. The wafer cleaning apparatus according to claim 1, wherein the screw is a ball screw connected to the support plate through a screw nut.

4. The wafer cleaning apparatus as claimed in claim 1, wherein the guide rail is disposed at one side of the lead screw and connected to the support plate via a slider.

5. The wafer cleaning device according to claim 1, wherein the screw is a bidirectional screw, and the thread sections with different thread directions are respectively connected with the supporting plates arranged on both sides of the wafer; the rotary lead screw drives the supporting plate and the cleaning brush on the supporting plate to move close to or away from each other integrally.

6. The wafer cleaning device according to claim 1, wherein the transmission mechanism is a belt transmission mechanism, and the driving member drives the lead screws at the two ends of the cleaning brush to synchronously rotate through the belt transmission mechanism.

7. The wafer cleaning device as claimed in claim 6, wherein the transmission mechanism comprises a belt wheel and a belt, the output shaft of the driving member is provided with the belt wheel, the end part of the lead screw is provided with the belt wheel, the belt is arranged between the driving member and the belt wheel of the lead screw and between the belt wheels of the lead screws at the end part of the cleaning brush, and the driving member drives the lead screws at both ends of the cleaning brush to synchronously rotate through belt transmission.

8. The wafer cleaning apparatus according to claim 1, wherein the cleaning brush comprises a front cleaning brush and a rear cleaning brush, and the cleaning brush moving assembly comprises a front cleaning brush moving assembly and a rear cleaning brush moving assembly; the front cleaning brush moving assembly is connected with the front cleaning brush through a supporting plate, and the rear cleaning brush moving assembly is connected with the rear cleaning brush through a supporting plate; the drive assembly includes preceding drive assembly and back drive assembly, the lead screw rotation at cleaning brush both ends before the driving piece drive of preceding drive assembly, the lead screw rotation at cleaning brush both ends behind the driving piece drive of back drive assembly.

9. The wafer cleaning apparatus according to claim 8, wherein the guide rail of the front cleaning brush moving assembly and the guide rail of the rear cleaning brush moving assembly are the same guide rail.

10. The wafer cleaning apparatus as claimed in claim 1, further comprising a displacement sensor fixed to the support plate to measure a distance between the cleaning brushes.

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