CN112735940B - Dynamically adjustable wafer cleaning method - Google Patents
Dynamically adjustable wafer cleaning method Download PDFInfo
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- CN112735940B CN112735940B CN202011469122.7A CN202011469122A CN112735940B CN 112735940 B CN112735940 B CN 112735940B CN 202011469122 A CN202011469122 A CN 202011469122A CN 112735940 B CN112735940 B CN 112735940B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 204
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000001680 brushing effect Effects 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000005406 washing Methods 0.000 claims description 27
- 239000007788 liquid Substances 0.000 claims description 18
- 238000005259 measurement Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 113
- 239000000126 substance Substances 0.000 description 8
- 239000000356 contaminant Substances 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000007517 polishing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a dynamically adjustable wafer cleaning method, which comprises the following steps: measuring the load torque of a driving motor for driving the cleaning brush to rotate in the process that the cleaning brush moves from the initial position to be in contact with the wafer for cleaning; and adjusting the moving clamping stroke of the cleaning brush according to the load torque so as to keep the friction force during brushing stable. The invention can realize that the friction force between the cleaning brush and the wafer is maintained in a required range in the wafer cleaning process, thereby ensuring the stability of the wafer cleaning process and improving the cleaning effect.
Description
Technical Field
The invention belongs to the technical field of cleaning after chemical mechanical polishing, and particularly relates to a dynamically adjustable wafer cleaning method.
Background
Chemical Mechanical Polishing (CMP) is a globally planarizing ultra-precise surface processing technique. Since the chemical agents and abrasives used in the chemical mechanical polishing process are in large quantities, a large amount of contaminants such as abrasive particles and abrasive byproducts remain on the wafer surface after the polishing process is completed, and the contaminants adversely affect the subsequent process and may cause the wafer yield loss. Since the cleanliness of the wafer surface is one of the important factors affecting the reliability of the semiconductor device, in order to achieve the purpose of being contaminant-free, the contaminants on the wafer surface need to be removed to prevent the contaminants from being re-remained on the wafer surface before the process. Therefore, in the wafer manufacturing process, it is necessary to perform surface cleaning many times to remove contaminants such as metal ions, atoms, organic substances, and particles attached to the wafer surface.
The wafer cleaning method includes roller brush cleaning, megasonic cleaning, etc., wherein the roller brush cleaning is widely applied. The method comprises the steps of separating pollutants on the surface of the wafer into the cleaning liquid by using a mechanical action, and dissolving the pollutants into the cleaning liquid by using a chemical reaction between the cleaning liquid and the pollutants on the surface of the wafer, so that the pollutants are removed from the surface of the wafer. Patent CN102768974B discloses a wafer cleaning apparatus. The wafer cleaning equipment comprises: a frame; the wafer cleaning device is arranged on the rack; the wafer brushing device is arranged on the rack and is positioned at the downstream side of the wafer cleaning device; the wafer drying device is arranged on the rack and is positioned on the downstream side of the wafer brushing device; and the mechanical arm is movably arranged on the rack and used for vertically clamping the wafer and carrying the wafer.
However, in the prior art, during actual operation, the left and right cleaning brushes grip and clean the wafer at a set pitch, and a zero pitch point is provided at a position where the cleaning brush and the wafer are just in contact with each other. Therefore, when the wafer is clamped at the set pitch for cleaning, the wafer clamping degree may be unstable, the friction force between the cleaning brush and the wafer may be unstable, and the friction force between the cleaning brush and the wafer may be changed due to problems such as abrasion of the cleaning brush and change in the thickness of the wafer, which may eventually cause the wafer cleaning effect to be unstable.
Disclosure of Invention
The embodiment of the invention provides a dynamically adjustable wafer cleaning method, which aims to at least solve one of the technical problems in the prior art.
The embodiment of the invention provides a dynamically adjustable wafer cleaning method, which comprises the following steps:
measuring the load torque of a driving motor for driving the cleaning brush to rotate in the process that the cleaning brush moves from a start position to be in contact with the wafer for brushing;
and adjusting the moving clamping stroke of the cleaning brush according to the load torque so as to keep the friction force during the cleaning.
In one embodiment, adjusting the moving clamping stroke of the washing brush according to the load torque includes:
calculating a difference Δ T between the load torque and a torque set point;
and calculating the moving clamping stroke S by utilizing the functional relation between the difference value delta T and the strain sigma of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of brushing and the moving clamping stroke S.
In one embodiment, the strain σ of the washing brush is a function of (S-S ') as a variable, where S is the moving clamping stroke and S' is the fixed clamping stroke when the washing brush just contacts the wafer.
In one embodiment, the elastic modulus E of the washing brush is a function of the hardness K of the washing brush and the flow rate V of the liquid.
In one embodiment, the coefficient of friction f of the brushing is a function of the time T of use of the washing brush and the flow rate V of the liquid.
In one embodiment, the moving clamp stroke is calculated according to the following equation:
ΔT＝σ(S-S′)*E(K,V)*f(T,V)*(R+S′-S)
where Δ T is a difference between the load torque and a torque set value, σ (S-S ') is a strain of the cleaning brush, S is the moving clamping stroke, S' is a fixed clamping stroke when the cleaning brush just contacts a wafer, E (K, V) is an elastic modulus of the cleaning brush, K is a hardness of the cleaning brush, V is a flow rate of liquid supplied to a surface of the cleaning brush during cleaning, f (T, V) is a friction coefficient of the cleaning brush, T is a use time of the cleaning brush, and R is a radius of a cylindrical surface of the cleaning brush.
In one embodiment, the strain σ of the washing brush is a function corresponding to a relational curve with (S-S') as a variable, which is obtained by fitting experimental data obtained by performing experimental measurement on washing brushes of different consumable types.
In one embodiment, the elastic modulus E of the cleaning brush is a function corresponding to a relationship curve with the hardness K of the cleaning brush and the liquid flow rate V as variables, which is obtained by fitting experimental data obtained by performing experimental measurement on cleaning brushes of different consumable types.
In one embodiment, the friction coefficient f of the brushing is a function corresponding to a relationship curve which is obtained by fitting experimental data obtained by performing experimental measurement on cleaning brushes of different consumable types and takes the service time T of the cleaning brush and the liquid flow rate V as variables.
The embodiment of the invention has the beneficial effects that: the friction force between the cleaning brush and the wafer can be maintained in a required range in the wafer cleaning process, so that the stability of the wafer cleaning process is ensured, and the cleaning effect is improved.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic diagram of a wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a wafer cleaning operation according to one embodiment of the present invention;
fig. 3 is a schematic diagram of a cleaning process according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the invention, and are presented to illustrate the concepts of the invention; the description is illustrative and exemplary in nature and is not to be construed as limiting the embodiments of the invention and the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other embodiments that are obvious based on the disclosure of the claims and their description, including those that employ any obvious substitutions and modifications to the embodiments described herein. It should be understood that, unless otherwise specified, the following description of the embodiments of the present invention is made for the convenience of understanding, and the description is made in a natural state where relevant devices, apparatuses, components, etc. are originally at rest and no external control signals and driving forces are given.
Further, it is also noted that terms used herein such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, and the like, to denote orientation, are used merely for convenience of description to facilitate understanding of relative positions or orientations, and are not intended to limit the orientation of any device or structure.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
In the present application, chemical Mechanical Polishing (Chemical Mechanical Polishing) is also referred to as Chemical Mechanical Planarization (Chemical Mechanical Planarization). The substrate (also called wafer) is equivalent in meaning and function to the actual wafer.
Fig. 1 is a schematic structural diagram of a dynamically adjustable wafer cleaning apparatus 1 according to an embodiment of the present invention, and the wafer cleaning apparatus 1 includes a base 10, a wafer rotating assembly 20, two cleaning brushes 30, a cleaning brush supporting assembly 40, a cleaning brush moving assembly 50, a cleaning brush rotating assembly 60, and a controller (not shown).
As shown in fig. 1, a wafer rotating assembly 20 is disposed at an upper portion of the pedestal 10, and a wafer W to be cleaned is supported by the wafer rotating assembly 20 and rotates about an axis of the wafer W.
The wafer rotating assembly 20 comprises a fixing seat, a pair of driving rollers and driven rollers, wherein the driving rollers and the driven rollers are provided with clamping grooves for supporting wafers, and the clamping grooves are arranged around the outer peripheral sides of the rollers. The driving roller and the driven roller are arranged on the fixing seat, and the clamping grooves are located in the same plane. Driven roller set up in the middle part of fixing base, initiative running roller symmetry sets up in driven roller's both sides. The pair of driving rollers and the driven rollers are arranged along the outline of the outer edge of the wafer, the wafer W placed on the wafer rotating assembly 20 is limited by the clamping groove, and the outer edge of the wafer is tangent to the bottom surface of the clamping groove. The driving roller is provided with a roller driving motor, and the roller driving motor drives the driving roller to rotate. The friction between the outer edge of the wafer and the roller drives the wafer to rotate around the axis of the wafer.
As shown in fig. 1, the washing brush 30 has a cylindrical structure, and is made of a material having good water absorbency, such as polyvinyl alcohol. The two cleaning brushes 30 are a first cleaning brush and a second cleaning brush, which are respectively disposed on two sides of the wafer W to be cleaned, and can roll around their own axes to contact the surface of the wafer W to be cleaned.
As shown in fig. 1, a cleaning brush support assembly 40 for supporting two cleaning brushes 30 positioned at both sides of the wafer W to be cleaned. The washing brush supporting assembly 40 includes supporting plates which are provided to both ends of the washing brush 30 perpendicular to the axis of the washing brush 30, and are fixed to the base 10 to support the washing brush 30 on the base 10.
As shown in fig. 1, the cleaning brush moving assembly 50 is connected to the cleaning brush supporting assembly 40 to drive the cleaning brush supporting assembly 40 and the cleaning brush 30 thereon to move integrally, so that the two cleaning brushes move oppositely and clamp the wafer at a predetermined angle to perform the cleaning. The cleaning brush moving assembly 50 includes a guide rail, a lead screw and a driving member, the guide rail and the lead screw are respectively connected to the cleaning brush supporting assembly 40 to move the cleaning brush supporting assembly 40 along the guide rail under the driving of the lead screw, the driving member is disposed at the end portion of the lead screw, and the driving member drives the lead screw to move, so as to drive the cleaning brush supporting assembly 40 and the cleaning brush 30 to integrally move, so that both ends of the cleaning brush 30 are simultaneously contacted with or away from the wafer. Furthermore, the two ends of the cleaning brush are respectively provided with the screw rods, so that the moving distances of the two ends of the cleaning brush can be respectively adjusted.
As shown in fig. 1, the washing brush rotation assembly 60 includes a driving motor provided to an end portion of the washing brush 30 for driving the rotation of the washing brush 30. The driving motor drives the washing brush 30 to roll along its axis. The drive motor has a torque monitoring module capable of monitoring a load torque of the drive motor. The load torque is related to the distance of the cleaning brush 30 from the wafer. The closer the distance between the cleaning brush 30 and the wafer is, the larger the friction force between the cleaning brush and the wafer is, and the larger the load torque of the driving motor is; conversely, the longer the distance between the cleaning brush 30 and the wafer is, the smaller the friction force between the cleaning brush and the wafer is, and the smaller the load torque of the drive motor is. Therefore, the moving position of the washing brush 30 can be indirectly controlled by monitoring the load torque of the driving motor. In the wafer cleaning process, the contact state of the cleaning brush 30 and the wafer can be accurately monitored through the load torque of the driving motor, and a good wafer cleaning effect is achieved.
The controller provided by the embodiment of the invention is used for acquiring the load torque of the driving motor in the process that the cleaning brush moves from the start position to be in contact with the wafer for brushing; and controlling the cleaning brush moving assembly to adjust the moving clamping stroke of the cleaning brush according to the load torque so as to keep the friction force during cleaning stable.
In one embodiment of the invention, the controller comprises:
the first calculation module is used for calculating a difference value delta T between the load torque and a torque set value;
and the second calculation module is used for calculating the moving clamping stroke S by utilizing the functional relation between the difference value delta T and the strain sigma of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of the cleaning brush and the moving clamping stroke S.
Referring to fig. 2, the operation of wafer cleaning will be briefly described with reference to fig. 1.
Firstly, a wafer W to be cleaned is placed on the wafer rotating assembly 20 by a manipulator, and at the moment, a certain distance is reserved between the cleaning brush 30 and the side surface of the wafer W, so that an operation space is provided for the manipulator;
secondly, the wafer W is rotated around its axis by the wafer rotation assembly 20, and a fluid spraying device (not shown) sprays a cleaning solution, such as an acidic or alkaline cleaning solution, toward the rotating wafer W;
in the third step, the two cleaning brushes 30 are rolled around the axes thereof and moved toward the position of the wafer W so that the cleaning brushes 30 are in contact with the surface of the wafer W and the first cleaning brush and the second cleaning brush are not perfectly parallel with each other with a certain angle therebetween. For example, the first end of the first cleaning brush and the first end of the second cleaning brush grip the wafer, and the second end of the first cleaning brush and the second end of the second cleaning brush slightly contact the wafer. In other words, the distance between the first end of the first cleaning brush and the first end of the second cleaning brush is smaller than the distance between the second end of the first cleaning brush and the second end of the second cleaning brush;
fourthly, the cleaning brush 30 rolls to brush the surface of the wafer W, so that pollutants on the surface of the wafer are removed, and the surface of the wafer is brushed;
fifthly, after the wafer is scrubbed, the cleaning brush 30 moves towards the outer side of the wafer W, and the cleaning brush 30 is separated from the surface of the wafer W;
sixthly, the fluid spraying device (not shown) continues to spray the cleaning solution toward the rotating wafer W, the wafer rotation is stopped after the rinsing is continued for a while, and the robot hand transfers the wafer W that has been cleaned to the next process.
As can be seen from the operation method of cleaning the wafer, the position of the cleaning brush 30 needs to be moved at the start stage and the end stage of the wafer cleaning. Since the distance between the brush 30 and the wafer W determines the contact state of the brush 30 and the wafer W, the contact state of the both is directly related to the wafer surface cleaning effect. Therefore, it is required to precisely control the moving grip stroke of the two washing brushes 30.
Based on the above analysis, an embodiment of the present invention provides a dynamically adjustable wafer cleaning method, including:
step S1, measuring the load torque of a driving motor for driving the cleaning brush to rotate in the process that the cleaning brush moves from a start position to be in contact with a wafer for brushing;
and S2, adjusting the moving clamping stroke of the cleaning brush according to the load torque so as to keep the friction force during brushing stable.
In this embodiment, the friction force between the cleaning brush and the wafer is in a direct proportion to the load torque of the driving motor for driving the cleaning brush to rotate, the friction force during cleaning can be represented by the load torque, and the friction force is controlled by adjusting the moving clamping stroke of the cleaning brush to control the load torque.
Specifically, step S2 may include: comparing the load torque with a torque set value; when the load torque reaches a torque set value, the moving clamping stroke is unchanged, even if the two cleaning brushes keep the current clamping distance; when the load torque is smaller than the set torque value, the mobile clamping stroke is increased so as to reduce the clamping distance between the two cleaning brushes; and when the load torque is greater than the set torque value, the moving clamping stroke is reduced to increase the clamping distance between the two cleaning brushes.
The embodiment of the invention can realize that the friction force between the cleaning brush and the wafer is maintained in a required range in the wafer cleaning process, thereby ensuring the stability of the wafer cleaning process and improving the cleaning effect.
In one embodiment of the present invention, step S2 comprises:
step S21, calculating a difference value delta T between the load torque and a torque set value;
and step S22, calculating the moving clamping stroke S by using the functional relation between the difference value delta T and the strain sigma of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of the cleaning brush and the moving clamping stroke S.
In one embodiment of the present invention, the strain σ of the washing brush is a function of (S-S ') as a variable, where S is the moving clamping stroke and S' is the fixed clamping stroke when the washing brush just contacts the wafer.
It is understood that the moving grip stroke S is a stroke during which the cleaning brush moves from the start position toward the wafer, and is a variable. The fixed clamping stroke S' is a fixed empirical value, and can be the stroke of the cleaning brush moving from the start position to just contacting the wafer.
Further, the strain σ of the washing brush is a function corresponding to a relational curve with (S-S') as a variable, which is obtained by fitting experimental data obtained by performing experimental measurement on washing brushes of different consumable types.
In one embodiment of the invention, the elasticity modulus E of the washing brush is a function of the hardness K of the washing brush and the flow rate V of the liquid.
Furthermore, the elastic modulus E of the cleaning brush is a function corresponding to a relationship curve with the hardness K of the cleaning brush and the liquid flow V as variables, which is obtained by fitting experimental data obtained by performing experimental measurement on cleaning brushes of different consumable types.
In one embodiment of the invention, the friction coefficient f of the brushing is a function of the time T of use of the washing brush and the flow rate V of the liquid as variables.
Further, the friction coefficient f of the brushing is a function corresponding to a relationship curve which is obtained by fitting experimental data obtained by performing experimental measurement on cleaning brushes of different consumable types and takes the service time T of the cleaning brush and the liquid flow V as variables.
In one embodiment of the present invention, step S2 may calculate the moving clamping stroke according to the following equation:
ΔT＝σ(S-S′)*E(K,V)*f(T,V)*(R+S′-S)
where Δ T is a difference between the load torque and a torque set value, σ (S-S ') is a strain of the cleaning brush, S is the moving clamping stroke, S' is a fixed clamping stroke when the cleaning brush just contacts a wafer, E (K, V) is an elastic modulus of the cleaning brush, K is a hardness of the cleaning brush, V is a flow rate of liquid supplied to a surface of the cleaning brush during cleaning, f (T, V) is a friction coefficient of the cleaning brush, T is a use time of the cleaning brush, and R is a radius of a cylindrical surface of the cleaning brush.
For convenience of understanding, as shown in fig. 3, a specific application scenario is taken as an example to illustrate the wafer cleaning method provided by the embodiment of the present invention.
1) After starting, the wafer rotates, and the two cleaning brushes move towards the wafer for clamping;
2) Judging whether the cleaning time reaches the end time;
3) If the end time is not reached, recording the cleaning time length, and comparing the load torque with a torque set value;
4) If the load torque reaches a set torque value, the moving clamping stroke is unchanged, and the two cleaning brushes keep the current positions;
5) If the load torque is smaller than the torque set value, the moving clamping stroke is increased, and the clamping distance between the two cleaning brushes is reduced;
6) If the load torque is larger than the set torque value, the mobile clamping stroke is reduced, and the clamping distance between the two cleaning brushes is increased;
7) And if the brushing finish time is reached, driving the cleaning brush to open, and stopping rotating after the wafer is washed to finish cleaning.
In summary, the embodiment of the invention can avoid the problem of unstable brushing friction force caused by zero determination error of the clamping distance, can avoid the problem of unstable brushing friction force caused by factors such as abrasion of the cleaning brush and thickness change of the wafer, can ensure stable cleaning process of the wafer, and can improve cleaning effect.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A method for cleaning a dynamically adjustable wafer, comprising:
measuring the load torque of a driving motor for driving the cleaning brush to rotate in the process that the cleaning brush moves from the initial position to be in contact with the wafer for cleaning;
adjusting a moving clamping stroke of the cleaning brush according to the load torque, wherein the moving clamping stroke is a stroke of the cleaning brush in the process of moving from a starting position to a wafer so as to keep the friction force during cleaning stable, and the moving clamping stroke comprises the following steps:
calculating a difference Δ T between the load torque and a torque set point;
calculating the moving clamping stroke S by utilizing the functional relation between the difference value delta T and the strain sigma of the cleaning brush, the elastic modulus E of the cleaning brush, the friction coefficient f of brushing and the moving clamping stroke S;
calculating the moving clamping stroke according to the following equation:
ΔT＝σ(S-S^')*E(K,V)*f(T,V)*(R+S^'-S)
where Δ T is a difference between the load torque and a torque set value, σ (S-S ^ ') is a strain of the cleaning brush, S is the moving clamping stroke, S ^' is a fixed clamping stroke when the cleaning brush just contacts a wafer, E (K, V) is an elastic modulus of the cleaning brush, K is a hardness of the cleaning brush, V is a flow rate of a liquid supplied to a surface of the cleaning brush during cleaning, f (T, V) is the friction coefficient of the cleaning, T is a use time of the cleaning brush, and R is a radius of a cylindrical surface of the cleaning brush.
2. The wafer cleaning method according to claim 1, wherein the strain σ of the cleaning brush is a function having (S-S ') as a variable, wherein S is the moving clamping stroke, and S' is a fixed clamping stroke when the cleaning brush just contacts the wafer.
3. The wafer cleaning method according to claim 1, wherein the elastic modulus E of the cleaning brush is a function of the hardness K of the cleaning brush and the flow rate V of the liquid as variables.
4. The wafer cleaning method according to claim 1, wherein the friction coefficient f of the brushing is a function of the time T of use of the washing brush and the liquid flow rate V as variables.
5. The wafer cleaning method as claimed in claim 2, wherein the strain σ of the brush is a function corresponding to a relationship curve with (S-S ^') as a variable fitted to experimental data obtained by performing experimental measurement on brushes of different consumable types.
6. The wafer cleaning method according to claim 3, wherein the elastic modulus E of the cleaning brush is a function corresponding to a relationship curve having the hardness K of the cleaning brush and the liquid flow rate V as variables, which is obtained by fitting experimental data obtained by performing experimental measurement on cleaning brushes of different consumable types.
7. The wafer cleaning method according to claim 4, wherein the friction coefficient f of the brushing is a function corresponding to a relationship curve with the time T of use of the cleaning brush and the liquid flow rate V as variables, which is obtained by fitting experimental data obtained by performing experimental measurement on the cleaning brush of different consumable types.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011469122.7A CN112735940B (en) | 2020-12-15 | 2020-12-15 | Dynamically adjustable wafer cleaning method |
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| CN202011469122.7A CN112735940B (en) | 2020-12-15 | 2020-12-15 | Dynamically adjustable wafer cleaning method |
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| CN112735940A CN112735940A (en) | 2021-04-30 |
| CN112735940B true CN112735940B (en) | 2023-01-03 |
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