CN117405772A - Ultrasonic imaging device and method for removing noise of reflected wave - Google Patents
Ultrasonic imaging device and method for removing noise of reflected wave Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 81
- 238000003384 imaging method Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 50
- 238000012935 Averaging Methods 0.000 claims abstract description 39
- 230000010363 phase shift Effects 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 238000012937 correction Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000012285 ultrasound imaging Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 16
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
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Abstract
The invention provides an ultrasonic imaging device and a method for removing noise of reflected waves, which can generate pixelated information by using waveforms after removing noise, thereby generating high-precision image information of a joint interface of objects. The ultrasonic imaging device irradiates ultrasonic waves to an object formed by laminating a plurality of layers to obtain a reflected wave of a joint interface of the object, and generates an image of the joint interface based on the signal intensity of the reflected wave, and comprises: and a matching processing unit (averaging processing unit) for correcting a phase shift of the second reflected wave from the second irradiation point in the object with respect to the first reflected wave from the first irradiation point in the object, removing noise from the first reflected wave based on the first reflected wave and the phase-corrected second reflected wave, and generating pixelized information of a portion returning the interface echo in the joint interface based on a signal intensity of the interface echo representing the waveform from the joint interface in the noise-removed first reflected wave.
Description
Technical Field
The present invention relates to an ultrasonic imaging apparatus and a method for removing noise of reflected waves.
Background
The ultrasonic imaging apparatus irradiates an object to be inspected (subject) with ultrasonic waves from a probe, receives reflected waves thereof, and images an interface of the object. In an ultrasonic inspection apparatus that repeatedly transmits and receives ultrasonic waves to and from an inspection object, as a method for clarifying the object waveform, a method of removing noise by averaging similar reflected waves has been proposed.
Patent document 1 discloses an ultrasonic inspection apparatus including: an ultrasonic wave transmitting unit that repeatedly transmits ultrasonic waves to an object to be inspected; an ultrasonic wave receiving unit that repeatedly receives the ultrasonic wave to be inspected, which is transmitted from the ultrasonic wave transmitting unit and propagates through the object to be inspected; a repetition interval setting unit that sets a repetition interval at which the ultrasonic wave transmission unit transmits the ultrasonic wave, and increases or decreases the repetition interval by a predetermined offset amount each time the ultrasonic wave transmission unit transmits the ultrasonic wave repeatedly; and an averaging unit that averages the ultrasonic waves to be inspected repeatedly received by the ultrasonic wave receiving unit in synchronization with the transmission start timing of the ultrasonic waves by the ultrasonic wave transmitting unit, wherein the offset amount is a value satisfying a condition that an index indicating an absolute value of a ratio of a reverberation component overlapped on the ultrasonic waves to be inspected before and after the averaging by the averaging unit is a minimum value or a predetermined value or less.
Patent document 1: japanese patent laid-open publication No. 2013-29396
Disclosure of Invention
In the technique disclosed in patent document 1, the influence of jitter (fluctuation in the time axis direction) is not considered. In the ultrasonic imaging apparatus, an object is irradiated with ultrasonic waves to obtain reflected waves, but these reflected waves are shifted in phase due to jitter. When averaging is performed in a state where the phase shift occurs, the signal strength of the necessary waveform may be reduced. As a result, a problem arises in that defects should be found in the eye.
The present invention has been made in view of the above-described problems, and an object thereof is to provide an ultrasonic imaging apparatus and a method for removing noise from reflected waves, which can generate high-precision image information of a joint interface of objects by generating pixelated information from a waveform from which noise has been removed.
In order to achieve the above object, an ultrasonic imaging apparatus according to the present invention is an ultrasonic imaging apparatus for irradiating an object having a plurality of layers stacked thereon with ultrasonic waves to obtain a reflected wave at a joint interface of the object, and generating an image of the joint interface based on a signal intensity of the reflected wave, the ultrasonic imaging apparatus including: a matching processing unit that corrects a shift in phase of a second reflected wave from a second irradiation point in the object with respect to a first reflected wave from a first irradiation point in the object; and a pixelized information generation processing unit that removes noise from the first reflected wave based on the first reflected wave and the phase-corrected second reflected wave, generates pixelized information of a portion of the interface echo that is returned to the interface based on a signal intensity of the interface echo representing a waveform from the interface in the first reflected wave after the noise has been removed, and performs processing to match a phase of a peak portion of the interface echo of the second reflected wave with a phase of a peak portion of the interface echo of the first reflected wave when the signal intensity of the interface echo of the first reflected wave has a magnitude equal to or greater than a threshold representing a predetermined value, and performs processing to match a phase of a peak portion of the interface echo of the first reflected wave with a phase of a peak portion of a surface echo of the first reflected wave when the signal intensity of the interface echo of the first reflected wave does not have a magnitude equal to or greater than the threshold. Another embodiment of the present invention will be described in the following embodiments.
According to the present invention, by generating pixelated information using the noise-removed waveform, it is possible to generate high-precision image information of the joint interface of the object formed by stacking a plurality of layers.
Drawings
Fig. 1 is a diagram showing a configuration of an ultrasonic imaging apparatus according to the present embodiment.
Fig. 2 is a diagram showing interface echo and noise as reflected waves.
Fig. 3 is an irradiation point arrangement diagram showing the arrangement of the first irradiation point and the second irradiation point.
Fig. 4 is a diagram showing an example of the averaging process.
Fig. 5 is a diagram showing an example of the matching process.
Fig. 6 is a flowchart showing noise removal processing of reflected waves.
Fig. 7 is a diagram showing waveform data after the averaging process.
Fig. 8 is a diagram showing an image before the averaging process.
Fig. 9 is a diagram showing an image after the averaging process.
Symbol description
10 sink
11 water
15 subject (object)
20 ultrasonic probe
31. 31A, 32, 33 waveform data
50 control part
51 scan control unit
52 transmit-receive control part
53 image generating section
56 matching processing part
57 average processor (pixelated information generation processor)
60 transceiver
70 scanner (mechanical part)
71 X-axis scanner
72 Y-axis scanner
73 Z-axis scanner
100 ultrasonic imaging device.
Detailed Description
Embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings as appropriate.
Fig. 1 is a diagram showing a configuration of an ultrasonic imaging apparatus 100 according to the present embodiment. Fig. 2 is a diagram showing interface echo and noise as reflected waves. The ultrasonic imaging apparatus 100 is used to detect defects in the bonding interface of an object formed by stacking a plurality of layers, such as a plurality of stacked semiconductor layers.
The ultrasonic imaging apparatus 100 includes a control unit 50, a scanner unit 70 (mechanical unit), and an ultrasonic probe 20. The ultrasonic imaging apparatus 100 irradiates ultrasonic waves to irradiation points set at predetermined intervals within an inspection range of an object through a probe to obtain a reflected wave, extracts interface echoes indicating waveforms of joint interfaces to be inspected from the reflected wave, performs processing of converting signal intensities of the interface echoes into positive integer values (0 to 255) for all irradiation points or specific irradiation points to generate pixelated information, and generates an image of the joint interface based on the pixelated information of the generated irradiation points to find defects.
However, as shown in waveform data 31 of fig. 2, noise such as electrical noise may be superimposed on the reflected wave in addition to the surface echo and the interface echo. These noises have an influence in generating pixelated information of the interface echo, and thus it is necessary to remove the noises as much as possible.
Returning to fig. 1, the ultrasonic probe 20 includes an encoder 21 for detecting a scanning position of the ultrasonic probe 20, and a piezoelectric element 22 for converting an electric signal and an ultrasonic signal into each other. The piezoelectric element 22 is a single focus type ultrasonic sensor.
The control unit 50 includes: a scanning control unit 51 for controlling the scanning position of the ultrasonic probe 20; a transmission/reception control unit 52 that controls transmission/reception of ultrasonic waves; an image generation unit 53 that generates an ultrasonic image based on the pixelated information generated by the average processing unit 57; a matching process section 56 that corrects a shift in phase of the second reflected wave from the second irradiation point in the subject 15 (object) with respect to the first reflected wave from the first irradiation point in the subject 15; an average processing unit 57 (pixelated information generation processing unit) that removes noise from the first reflected wave based on the first reflected wave and the phase-corrected second reflected wave, and generates pixelated information of a portion of the interface echo returned to the bonding interface based on the signal intensity of the interface echo representing the waveform from the bonding interface in the first reflected wave after the noise removal; a storage unit 58; and a transceiver unit 60. The first irradiation point and the second irradiation point will be described later with reference to fig. 3. The averaging process will also be described later.
Although not shown, the transmitting/receiving unit 60 includes a transmitter, an amplifier that amplifies a received signal received by the ultrasonic probe 20, an a/D converter that converts the received signal from an analog signal to a digital signal, a signal processing unit that performs signal processing on the received signal, and the like.
The scan control unit 51 is connected to the machine control device 77 so as to be able to input and output. The scan control unit 51 controls the scanning position of the ultrasonic probe 20 by the mechanical control device 77, the X-axis scanner 71, the Y-axis scanner 72, and the Z-axis scanner 73, and receives current scanning position information of the ultrasonic probe 20 from the mechanical control device 77.
The output side of the mechanical control device 77 is connected to the X-axis scanner 71, the Y-axis scanner 72, and the Z-axis scanner 73. The output side of the encoder 21 of the ultrasonic probe 20 is connected to the mechanical control device 77. The mechanical control device 77 detects the scanning position of the ultrasonic probe 20 from the output signal of the encoder 21, and controls the ultrasonic probe 20 to the instructed scanning position by the X-axis scanner 71, the Y-axis scanner 72, and the Z-axis scanner 73. The mechanical control device 77 receives a control instruction of the ultrasonic probe 20 from the scan control unit 51, and responds to scan position information of the ultrasonic probe 20.
The piezoelectric element 22 is formed of zinc oxide (ZnO), ceramic, fluorine-based copolymer, or the like, and has electrodes mounted on both surfaces of a piezoelectric film. The piezoelectric element 22 transmits ultrasonic waves from the piezoelectric film by applying a voltage between the electrodes. The piezoelectric element 22 converts an echo (received wave) received by the piezoelectric film into a received signal, which is a voltage generated between the electrodes.
Water 11 is injected into the water tank 10, and the subject 15 is placed in the water 11 in a submerged state. The water 11 in the water tank 10 is a liquid substance that is a propagation medium required to efficiently propagate ultrasonic waves emitted from the opening surface of the lower end of the ultrasonic probe 20 (ultrasonic probe) into the inside of the subject 15. The subject 15 is, for example, a semiconductor package including a wafer, a multilayer structure (or a stacked structure), or the like.
The ultrasonic probe 20 is immersed in the water 11 filled in the water tank 10, and is disposed so as to face each other with a predetermined distance therebetween in the upper Z direction of the subject 15.
The ultrasonic probe 20 can be freely moved in the XYZ direction by the scanner unit 70. For example, the ultrasonic probe 20 scans in the X-axis direction from a start point (one end point) to an end point (the other end point) of the subject 15 at a predetermined speed while irradiating ultrasonic waves to the subject 15. When the ultrasonic probe 20 reaches the end point, the probe is moved by a predetermined amount in the Y-axis direction, and scanning is performed in the X-axis direction from the start point to the end point in the opposite direction at a predetermined speed.
Based on this movement operation, the ultrasonic probe 20 scans a predetermined measurement range on the surface of the subject 15, transmits ultrasonic waves, receives reflected echoes at a plurality of measurement points set in advance in the measurement range, and can image defects of the internal structure included in the measurement range for inspection.
As shown in fig. 1, the noise removal processing of the reflected wave in the present embodiment is characterized in that the processing is performed in two stages of the processing in the matching processing section 56 (matching processing) and the processing in the averaging processing section 57 (averaging processing).
In the average processing unit 57 of fig. 1, noise is removed by a method (described in detail later) of adding and averaging reflected waves obtained at a plurality of irradiation points and dividing the reflected waves by the number of the added irradiation points (noise removal step). Noise is randomly generated in each reflected wave independently in time, but the interface echoes are acquired at the same time. Therefore, if these reflected waves are added, the interface echo becomes n times (n is the number of irradiation points after addition), and noise is reduced. And, by averaging these results, the interface echo becomes clear.
Fig. 3 is an irradiation point arrangement diagram showing the arrangement of the first irradiation point and the second irradiation point. In fig. 3, the irradiation points (pixelated irradiation points) where the pixelated information is obtained are indicated by ∈,) as the first irradiation points, and the other irradiation points (non-pixelated irradiation points) are indicated by ∈o as the second irradiation points. In the present embodiment, the addition and averaging processing is performed as follows by the averaging processing.
The control unit 50 selects one or more irradiation points from among the irradiation points adjacent to the first irradiation point, and sets a second irradiation point used in the averaging process. The effect of using adjacent irradiation points to obtain the sharpness is because the added reflected waves have similar properties to each other. That is, in the ultrasound imaging apparatus 100, in many cases, the scanning pitch of the scanner is set smaller than the focal size of the ultrasound. As a result, the difference in the acquired reflected wave due to the difference in 1 pitch is extremely small. If the added reflected waves are similar in nature to each other, they do not cancel each other out by the addition. On the other hand, random noise becomes small in time by addition, and therefore a sharpening effect can be obtained. In the embodiment, in the case where P0 is set as the first irradiation point in fig. 3, one or more second irradiation points for the averaging process are selected from P1 to P8. Further, although the more the number of choices is, the more clear pixelated information can be obtained, the longer the processing time is, the setting is made in consideration of the entire processing time.
Fig. 4 is a diagram showing an example of the averaging process (noise removal process). For example, the averaging process based on 8 second irradiation points (P1 to P8) adjacent to the first irradiation point (P0) proceeds as follows. The reflected waves P0 and P1 to P8 are stored in the storage unit 58 (see fig. 1) as time-series data (time, signal strength) of the time-axis values (time based on the time when the reflected wave was acquired) and the signal strength. The signal intensity of the time-series data of P0 at the same time and the signal intensity of the time-series data from P1 to P8 are added, and are divided by 9, which is the number of irradiation points (the sum of the number of first irradiation points and the number of second irradiation points) to which the values are added. The processing is performed on the signal intensities at all times in the time-series data, and noise is removed to clarify the interface echo of the reflected wave at the first irradiation point, thereby obtaining the signal intensity.
The averaging process in the present embodiment has been described above, but in actual processing, time factors are considered. That is, it is necessary to cope with the influence of fluctuation in the time axis direction, that is, jitter. In a reflected wave obtained by irradiating an object with ultrasonic waves, a minute fluctuation occurs in the time axis direction of the waveform. That is, since these minute variations in the time axis are inherent to the reflected waves, when the reflected waves from the pixelized irradiation points are used as references, the reflected waves from the non-pixelized irradiation points used in the averaging process are shifted in phase. When the averaging process is performed in a state where the phase shift occurs, a phenomenon occurs in which waveforms of interface echoes to be used for generating the pixelated information are not added well.
Fig. 5 is a diagram showing an example of the matching process. The waveform data 32 is a waveform before the matching process is performed, and the waveform data 33 is a waveform after the matching process is performed. In the present embodiment, the matching process shown in fig. 5 is used. The phase of the reflected wave from the non-pixelated irradiation point is matched with the template signal by using the reflected wave from the pixelated irradiation point as the template signal. Specifically, the position of the time axis is adjusted so that the peak of the interface echo from the object bonding interface in the reflected wave from the non-pixelated irradiation point which is the object of the averaging process coincides with the peak of the interface echo from the object bonding interface in the template signal, and the phase shift is eliminated.
However, in this method, although the signal intensity of the interface echo from the object joint interface can be handled sufficiently, in the case where the signal intensity is small, it is difficult to extract the interface echo as the object. Therefore, in this case, a surface echo that can be initially extracted in the reflected wave is used. That is, the position of the time axis is adjusted so that the peak of the surface echo in the reflected wave from the non-pixelated irradiation point that is the object of the averaging process coincides with the peak of the surface echo of the average signal, and the phase shift is eliminated.
In the matching process, whether to use the interface echo from the object joining interface or the surface echo is determined according to whether or not the signal intensity of the interface echo is equal to or higher than a predetermined threshold value. When the signal intensity of the interface echo is equal to or higher than a preset threshold value, the interface echo is used for matching processing, and when the signal intensity of the interface echo is lower than the preset threshold value, the surface echo is used for matching processing. The threshold is set to an appropriate value by experiment. As shown in fig. 1, the matching process is performed as a preprocessing of the averaging process.
Fig. 6 is a flowchart showing noise removal processing of reflected waves. First, the control unit 50 determines the number and positions of the second irradiation points, and selects the second irradiation points (step S51). The control unit 50 determines whether or not the processing of all the first irradiation points is completed (processing S52), and when the processing of all the first irradiation points is not completed (processing S52, no), the processing proceeds to processing S53, and when the processing of all the first irradiation points is completed (processing S52, yes), the processing proceeds to processing S57.
The control unit 50 transmits and receives ultrasonic waves to and from the object by aligning the probe at the irradiation position (step S53), and stores the reflected waves as time-series data in the storage unit 58 (step S54). Then, the control unit 50 performs a matching process on the first reflected wave and the second reflected wave (process S55), performs an averaging process (process S56), and returns to process S52.
In the process S57, the image generation process of all the first irradiation points is performed. Specifically, pixelated information is generated by converting the signal strength of the clarified interface echo to a positive integer value. These processes are repeatedly performed over the entire inspection range of the object, and the bonding interface is imaged.
In the process S54, when the ultrasonic waves are irradiated to the object and all the second irradiation points are located on the front side of the first irradiation point, the matching process is performed on the second irradiation points at the time of the completion of the ultrasonic wave transmission/reception process on the first irradiation point, and then the averaging process is performed.
In addition, when the second irradiation point is also located after the first irradiation point, the matching process and the averaging process are performed at the time when the transmission/reception process of the ultrasonic waves with respect to all the associated second irradiation points is completed.
Fig. 7 is a diagram showing waveform data 31A after the averaging process. Fig. 7 shows the result of performing the matching process and the averaging process on the waveform data 31 shown in fig. 2. The signals of the surface echo and the interface echo derived from the sample (derived from the subject 15) do not disappear even if subjected to the averaging process. On the other hand, noise components that are not derived from the sample and randomly generated in time are averaged, and the intensity thereof is reduced.
Fig. 8 is a diagram showing an image before the averaging process. Fig. 9 is a diagram showing an image after the averaging process. In the image generated without the matching process and the averaging process shown in fig. 8, the defect is imaged in the field of view, but since the surrounding noise level is high with respect to the luminance value of the defective portion, visibility and contrast become low.
On the other hand, in the image generated by performing the matching process and the averaging process shown in fig. 9, the signal of the defect does not disappear, and the surrounding noise level is reduced, so that higher visibility and contrast can be obtained.
As described above, the ultrasound imaging apparatus 100 of the present embodiment has the following features.
(1) An ultrasonic imaging device 100 for obtaining a reflected wave at a joint interface of an object by irradiating the object, which is formed by laminating a plurality of layers, with ultrasonic waves and generating an image of the joint interface based on the signal intensity of the reflected wave, the ultrasonic imaging device comprising: a matching process unit 56 that corrects a shift in the phase of the second reflected wave from the second irradiation point (for example, P1 to P8) in the object with respect to the first reflected wave from the first irradiation point (for example, P0) in the object; and a pixelized information generation processing unit (for example, an average processing unit 57) that removes noise from the first reflected wave based on the first reflected wave and the second reflected wave after the phase correction, and generates pixelized information of a portion of the interface echo returned to the joint interface based on the signal intensity of the interface echo representing the waveform from the joint interface in the first reflected wave after the noise removal. In this way, in the ultrasonic imaging apparatus, the pixelated information is generated using the waveform from which the noise is removed, and thus, high-precision image information of the joint interface of the object formed by stacking a plurality of layers can be generated.
(2) In (1), the matching process unit 56 may perform a process of matching the phase of the peak of the interface echo of the second reflected wave with the phase of the peak of the interface echo of the first reflected wave when the signal intensity of the interface echo of the first reflected wave has a magnitude equal to or greater than a threshold value, and may perform a process of matching the phase of the peak of the surface echo of the second reflected wave with the phase of the peak of the surface echo of the first reflected wave when the signal intensity of the interface echo of the first reflected wave does not have a magnitude equal to or greater than the threshold value.
(3) In (2), the pixelized information generation processing unit performs addition averaging of the first reflected wave and the second reflected wave after the phase correction of the first reflected wave.
(4) In (1), the matching process unit 56 selects one or more irradiation points at predetermined positions from among the irradiation points adjacent to the first irradiation point to set a second irradiation point (for example, refer to the process S51 and fig. 3).
(5) A noise removing method for a reflected wave in an ultrasonic imaging device 100, which irradiates an object formed by laminating a plurality of layers with ultrasonic waves to obtain a reflected wave of a joint interface of the object and generates an image of the joint interface based on a signal intensity of the reflected wave, includes: a phase correction step (for example, processing S55, refer to fig. 5) of correcting a shift in phase of the second reflected wave with respect to the first reflected wave by performing a matching process on the first reflected wave from the first irradiation point in the object and the second reflected wave from the second irradiation point in the object; and a noise removing step (for example, processing S56, refer to fig. 4) of removing noise from the first reflected wave based on the first reflected wave and the second reflected wave subjected to phase correction by the phase correcting step.
The present invention is not limited to the above-described embodiments, and includes various modifications. The above-described embodiments are described in detail for the purpose of easily explaining the present invention, and are not limited to the embodiments having all the configurations described. In addition, with respect to a part of the structure of each embodiment, addition, deletion, and substitution of other structures can be performed.
Claims (6)
1. An ultrasonic imaging apparatus for obtaining a reflected wave at a joint interface of an object by irradiating the object, which is formed by laminating a plurality of layers, with ultrasonic waves, and generating an image of the joint interface based on a signal intensity of the reflected wave, the ultrasonic imaging apparatus comprising:
a matching processing unit that corrects a shift in phase of a second reflected wave from a second irradiation point in the object with respect to a first reflected wave from a first irradiation point in the object; and
a pixelated information generation processing unit that removes noise from the first reflected wave based on the first reflected wave and the second reflected wave after the phase correction, and generates pixelated information of a portion of the interface echo in the joint interface that is returned based on a signal intensity of the interface echo representing a waveform from the joint interface in the first reflected wave after the noise removal,
when the signal intensity of the interface echo of the first reflected wave has a magnitude equal to or greater than a threshold value indicating a predetermined value, the matching process unit performs a process of matching the phase of the peak portion of the interface echo of the second reflected wave with the phase of the peak portion of the interface echo of the first reflected wave,
when the signal intensity of the interface echo of the first reflected wave does not have a magnitude equal to or greater than the threshold value, the matching process unit performs a process of matching the phase of the peak portion of the interface echo of the second reflected wave with the phase of the peak portion of the surface echo of the first reflected wave.
2. The ultrasound imaging apparatus of claim 1, wherein,
the pixelized information generation processing unit performs addition averaging of the first reflected wave and the second reflected wave after the phase correction with the first reflected wave.
3. The ultrasound imaging apparatus of claim 1, wherein,
the matching process section selects one or more irradiation points at a predetermined position from among the irradiation points adjacent to the first irradiation point, and sets the second irradiation point.
4. A method for removing noise from reflected waves in an ultrasonic imaging device, comprising irradiating an object having a plurality of layers stacked thereon with ultrasonic waves to obtain reflected waves at a joint interface of the object, and generating an image of the joint interface based on the signal intensity of the reflected waves,
the noise removal method comprises the following steps:
a phase correction step of correcting a phase shift of a second reflected wave with respect to a first reflected wave in the object by performing a matching process on the first reflected wave from a first irradiation point in the object and the second reflected wave from a second irradiation point in the object; and
a noise removing step of removing noise from the first reflected wave based on the first reflected wave and the second reflected wave phase-corrected by the phase correcting step,
when the signal intensity of the interface echo representing the waveform of the first reflected wave from the joint interface has a magnitude equal to or greater than a threshold value representing a predetermined value, the matching process is performed such that the phase of the peak portion of the interface echo of the second reflected wave coincides with the phase of the peak portion of the interface echo of the first reflected wave,
when the signal intensity of the interface echo of the first reflected wave does not have a magnitude equal to or greater than the threshold value, the matching process is performed so that the phase of the peak portion of the surface echo of the second reflected wave coincides with the phase of the peak portion of the surface echo of the first reflected wave.
5. The method for removing noise from reflected waves according to claim 4, wherein,
in the noise removing step, the first reflected wave and the second reflected wave subjected to phase correction with the first reflected wave by the matching process are averaged together.
6. The method for removing noise from reflected waves according to claim 4, wherein,
in the matching process, the second irradiation point is set by selecting one or more irradiation points at predetermined positions from among irradiation points adjacent to the first irradiation point.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2022-113508 | 2022-07-14 | ||
| JP2022113508A JP7201864B1 (en) | 2022-07-14 | 2022-07-14 | Ultrasound imaging device and method for removing noise from reflected waves |
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| CN117405772A true CN117405772A (en) | 2024-01-16 |
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| JP (1) | JP7201864B1 (en) |
| KR (1) | KR20240009879A (en) |
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| JP2009281805A (en) * | 2008-05-21 | 2009-12-03 | Hitachi Engineering & Services Co Ltd | Ultrasonic flaw detecting method and ultrasonic flaw detector |
| JP5195076B2 (en) * | 2008-06-26 | 2013-05-08 | Ｊｆｅスチール株式会社 | Ultrasonic measuring device and ultrasonic measuring method |
| JP2013029396A (en) | 2011-07-28 | 2013-02-07 | Toyota Central R&D Labs Inc | Ultrasonic inspection device |
| JP5874703B2 (en) * | 2013-09-26 | 2016-03-02 | Ｊｆｅスチール株式会社 | Ultrasonic flaw detection method and ultrasonic flaw detection apparatus |
| JP6310814B2 (en) * | 2014-08-22 | 2018-04-11 | 株式会社日立パワーソリューションズ | Image processing method and ultrasonic inspection method and apparatus using the same |
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| JP2024011497A (en) | 2024-01-25 |
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