CN1261760C - Ultrasonic imaging non-destructive detection method and detection system for appliance switch contact bonding quality - Google Patents
Ultrasonic imaging non-destructive detection method and detection system for appliance switch contact bonding quality Download PDFInfo
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Abstract
The present invention discloses an ultrasonic imaging non-destructive detection method of bond quality of electric switch contacts and a detection system thereof. Based on an ultrasonic non-destructive detection principle and an image processing method, the method of the present invention adopts a water immersion focusing probe to scan a bond surface of switch contacts point by point, an ultrasonic reflection echo detecting signal of each point is sampled to form an ultrasonic scanning image of the bond surface, a suitable threshold value is selected, a bond region and a region which is not bonded in the ultrasonic image are separated by the image processing method, and the interface bond rate is calculated. The detection system is composed of an ultrasonic signal generator, a probe, a three-dimensional precision scan platform, an image grabber, a drive card of a stepper motor, a drive power supply of a stepper motor, an industrial control computer and system software. The present invention has the characteristics of high automation degree, accurate detection, high efficiency, reliability, etc., and realizes the non-destructive detection of the bond quality of switch contacts.
Description
Technical field
The invention belongs to the ultrasonic non-destructive inspection techniques field, be specifically related to a kind of supersonic image-forming damage-free detection method and detection system thereof of electric appliance switch contact bond quality.
Background technology
Electrical contact is the crucial building block in the electric switch, and electrical contact comprises contact and supporting mass two parts, and the quality of contact and supporting mass bond quality directly has influence on the work that can electric switch reliable and stable.What the classic method that the contact bond quality detects mainly adopted is the destructive test method.The destructive test method is the contact to be rejected along faying face with instrument, and combination interface is exposed, and judges the quality of bond quality by the combination rate of estimating size firmly and faying face.Obviously there are a lot of drawbacks in this method, can not accurately detect bond quality.In addition, some non-destructive testing (NDT) methods such as X ray method and infrared imaging method also are used to the detection of contact bond quality, but because the required apparatus expensive of these methods is lower to the resolving power of defective, generally are difficult to be widely adopted.
Summary of the invention
At defective or deficiency that above prior art exists, one object of the present invention is, a kind of supersonic image-forming damage-free detection method of contact bond quality is provided, and this method and system can be quick, easy, detection contact bond quality accurately.The present invention utilizes Ultrasonic NDT principle and image processing techniques, adopt water immersion focusing probe that the switch contact faying face is carried out point by point scanning, ultrasonic reflection echo rectified signal sampling to every bit, the ultrasonic scanning image of forming faying face, choose appropriate threshold, the utilization image process method is separated the calmodulin binding domain CaM and calmodulin binding domain CaM not in the ultrasonoscopy, and calculates the interface combination rate.
Another object of the present invention provides the detection system that realizes said method.
For achieving the above object, the following technical scheme of employing of the present invention.
A kind of supersonic image-forming damage-free detection method of contact bond quality may further comprise the steps:
(1) measured workpiece is assemblied on the anchor clamps in the detection system tank, makes the tested combination interface of contact of workpiece vertical with ultrasonic incident acoustic beam;
(2) adjust sensed system parameter, detected parameters mainly comprises the material velocity of sound, contact thickness, scanning probe scope;
The described material velocity of sound adopts nominal longitudinal wave velocity, and for the contact of silver alloy, the material velocity of sound is chosen the nominal longitudinal wave velocity 3600m/s of silver;
(3) probe is placed the contact top, according to detected parameters, three-dimensional precision sweep platform drives probe to tested faying face automatic focus;
(4) determine the sampling position of strobe according to the reflection echo rectified signal;
(5) tested faying face is carried out autoscan, and real time imagery;
(6) analyze the faying face ultrasonoscopy, selected threshold is cut apart calmodulin binding domain CaM and calmodulin binding domain CaM not, and is calculated the interface combination rate;
The threshold value of choosing in the calculating with combination rate of cutting apart of ultrasonoscopy is obtained by following method in the described method: the different workpieces to same type detects and writes down ultrasonoscopy, workpiece after detecting is dug mill processing through saw, remove joint supporting mass (copper), up to about the about 0.3mm of copper layer thickness, soak with liquor ferri trichloridi then and corrode, after removing fully on the copper layer, sample is taken out, only remaining faying face of joint and upper strata silver contact, faying face is high-visible, with digital camera faying face is taken pictures, adopt the actual combination rate of image process method calculations incorporated face, choose the combination rate that appropriate threshold value calculates the workpiece ultrasonoscopy according to this result, make the calculations incorporated rate consistent, determine the threshold value of this workpiece with actual combination rate.Different workpieces of the same type is carried out same operation, a plurality of workpiece threshold values are averaged, just obtained the threshold value of the type workpiece.
(7) generate and print examining report automatically.
Described method has broad applicability, is not only applicable to the detection of high-voltage switch contact bond quality, also is applicable to the detection of low tension switch contact bond quality, and this method is applicable to the detection of contact soldering interface, spot welding interface and sintered interface simultaneously.
Described method can be calculated whole combination rate to contact, also can calculate the combination rate of contact part.
Described method can be calculated the combination rate of rectangle contact, also can calculate the combination rate of other shapes (as circular, oval, trapezoidal and non-regular shape) contact.
Realize the ultrasonic imaging nondestructive detection system of a kind of switch contact bond quality of said method, be characterized in: comprise supersonic signal generator, probe, three-dimensional precision sweep platform, image pick-up card, step motor drive card, driving source for step motor, the industrial control computer that has system software and printer, by electrically connecting formation;
Wherein image pick-up card, step motor drive card, printer are connected with industrial control computer respectively; Be connected with driving source for step motor on the step motor drive card, and be connected by driving source for step motor and with three-dimensional precision sweep platform; Image pick-up card is connected with three-dimensional precision sweep Platform Implementation by supersonic signal generator; Probe is connected with three-dimensional precision sweep platform with image pick-up card respectively; Image acquisition is stuck in carries out analog to digital conversion, exchanges data storage and ultrasonic imaging under the system software effect, and by system software ultrasonoscopy is carried out display process, simultaneously bond quality is estimated, and evaluation result is by the pattern output of printer with examining report.
Above-mentioned image pick-up card circuit selects circuit, survey velocity of sound circuit, DMA passage, image data storage and bus management circuit to form by analog to digital conversion passage, clock generator, window controller, A, B, C scan mode; The input signal of image pick-up card comprises echo RF signal and rectified signal, supersonic signal generator synchronous triggering signal and signal strobe.
Described clock generator is made up of start-oscillation circuit and frequency divider, and start-oscillation circuit is the horizontal crystal oscillator of a high-precision band temperature compensation, and it produces the clock signal of 80MHz, produces the clock signal of 40MHz and 20MHz through the frequency divider effect;
Described survey velocity of sound circuit is determined the real velocity of sound of sound wave by the position of calculating signal strobe, determines the defective starting point of sampling simultaneously.
Described DMA passage makes image pick-up card be independent of computing machine, finishes the collection and the storage of view data automatically.
Image acquisition is stuck in carries out analog to digital conversion, exchanges data storage and ultrasonic imaging under the system software effect.And ultrasonoscopy is carried out display process by system software, and simultaneously bond quality to be estimated, evaluation result is by the pattern output of printer with examining report.
The present invention can accurately, reliably realize the Non-Destructive Testing of switch contact bond quality owing to adopted Ultrasonic NDT principle and image processing method.
Description of drawings
Accompanying drawing 1 is the systematic schematic diagram of electric appliance switch contact Ultrasonic NDT detection system.
Accompanying drawing 2 is an autoscan detection system schematic diagram.
Accompanying drawing 3 is the image pick-up card schematic block circuit diagram.
Accompanying drawing 4 is the system software theory diagram.
Accompanying drawing 5 is a coin surface ultrasonic scanning image.
Accompanying drawing 6 is high-voltage switch gear contact detected image and material picture contrast figure, and wherein (a) is detected image, (b) is material picture.
Accompanying drawing 7 is low tension switch contact detected image and material picture contrast figure, wherein (a), (c), (e) are respectively the detected image of rectangle, trapezoidal and irregularly shaped contact, and (b) (d) (f) is respectively the material picture of rectangle, trapezoidal and irregularly shaped contact combination interface.
Embodiment
The present invention is described in further detail below in conjunction with drawings and Examples.
Accompanying drawing 1 goes out a systematic schematic diagram of bond quality Ultrasonic NDT detection system for electric switch.Industrial control computer 7 (to call Industrial PC Computer in the following text) is connected with image pick-up card 4, step motor drive card 5 and printer 8.The step motor drive card is connected with driving power 6.Industrial PC Computer 7 is sent instruction by system software 9 to the step motor drive card, and the power supply effect of overdriving of step motor drive cartoon makes three-dimensional precision sweep platform 3 drive probe 2 motions, finishes automatic focus or autoscan.Probe 2 is subjected to the excitation of ultrasound emission receiver 1, launch the ultrasound wave of certain frequency and intensity, reflect at the contact combination interface, the reflection wave reception of being popped one's head in, by the ultrasound emission receiver reflection wave is sent to image pick-up card, is stuck in by image acquisition and carries out analog to digital conversion, exchanges data storage and ultrasonic imaging under the system software effect.And ultrasonoscopy is carried out display process by system software, and simultaneously bond quality to be estimated, evaluation result is by the pattern output of printer with examining report.
Accompanying drawing 2 is autoscan detection system schematic diagrams.X, Y, Z axle adopt lead screw transmission, provide rotating force by stepper motor or servomotor.Its leading screw can be selected straight line leading screw or ball-screw for use, its movement velocity 10mm/s～200mm/s.X-axis 10 drives the probe tangential movement with Y-axis 11, finishes scan function, and Z axle 12 drives the probe vertical movement, finishes auto-focus function.Water in the tank 13 plays the effect of couplant.The effect of anchor clamps 14 is to guarantee that the tested combination interface of workpiece is vertical with ultrasonic incident acoustic beam.
Accompanying drawing 3 is image pick-up card schematic block circuit diagram.The image pick-up card circuit selects circuit 18, survey velocity of sound circuit 19, DMA passage 20, image data storage 21 and bus management circuit 22 to form by analog to digital conversion passage 15, clock generator 16, window controller 17, A, B, C scan mode.The input signal of image pick-up card comprises echo RF signal and rectified signal, supersonic signal generator synchronous triggering signal and signal strobe.The analog to digital conversion passage is made up of signal adjustment circuit 23 and high-speed A/D converter 24.Signal adjustment circuit is made of low noise, high precision, high-speed broadband operational amplifier, its effect is that input signal is adjusted within the required scope of AD converter, high-speed A/D converter adopts AD9058, conversion accuracy is 8, the highest sample rate is 50MSPS, and RF signal and rectified signal carry out analog to digital conversion and sampling by the analog to digital conversion passage.Clock generator is made up of start-oscillation circuit and frequency divider, and start-oscillation circuit is the horizontal crystal oscillator of a high-precision band temperature compensation, and it produces the clock signal of 80MHz, produces the clock signal of 40MHz and 20MHz through the frequency divider effect.Clock generator makes the entire circuit co-ordination for whole interface circuit provides a clock reference.Survey velocity of sound circuit and forms, survey velocity of sound circuit and determine the real velocity of sound of sound wave, the definite simultaneously defective starting point of sampling by the position of calculating signal strobe by two d type flip flops and a slice 8254 programmable counters.ABC scanning selects circuit to be made of a slice 8254 programmable counters, and its effect is to make circuit finish A, B, C scan function, and when A sweep, the modulus passage is gathered the RF signal, gathers rectified signal when B, C scan.Window controller is by a slice 8254 programmable counters, and a slice GAL16V8A chip and a slice d type flip flop are formed, and its effect is a sweep limit of determining Ultrasonic Detection.The DMA passage is made up of dma controller, address generator and internal bus.The effect of dma controller is to produce the required various control signals of DMA.Address generator is made up of 44 binary counters (74F161), produces 16 bit address.Internal bus comprises 16 bit address buses, 8 bit data bus and control bus.The DMA passage makes image pick-up card be independent of computing machine, finishes the collection and the storage of view data automatically.Data-carrier store adopts 2 CY7C198 static RAM (SRAM)s, and it is the chip of 32K * 8 of a 12ns, and the image data storage total volume is 64K.The bus management circuit is made up of two GAL16V8A chips and two GAL20V8A chips.
Accompanying drawing 4 is system software theory diagrams.System software is under Windows 98 platforms, form by Visual C++ exploitation, form by database management module 25, parameter input module 26, interface circuit initialization module 27, automatic focus module 28, A, B, C scan module 29, sound velocity determination module 30, signal and image processing module 31, defect analysis and determination module 32 etc.Database management module comprises image data base 33 and detected parameters database 34 two parts.The input of image parameter can directly be imported, and also can call the data in the detected parameters database.After the parameter input, interface circuit carries out initialization according to parameter, and at this moment total system can be carried out sound velocity determination or automatic focus.After the automatic focus, select A, B, C scan mode that workpiece is scanned, utilize signal and image processing module that scanning result is handled behind the end of scan, further can utilize defect analysis and determination module that scanning result is estimated.
Adopt method of the present invention, measured workpiece can be a high-voltage switch contact, also can be the low tension switch contact; Measured workpiece can be the solder contacts combination, also can be combination of sintered contact interface or the combination of spot welding contact, described interface combination rate can be the combination rate of contact entire area, also can be the combination rate of contact local area, and contact shape can be that rectangle also can be other shapes.
The material velocity of sound adopts nominal longitudinal wave velocity, and for the contact of silver alloy, the material velocity of sound is chosen the nominal longitudinal wave velocity 3600m/s of silver.
The scanning sample spacing can be regulated according to resolution requirement, and image pixel-class can be selected 256 grades or 16 grades, and image shows can adopt pseudo color image or gray level image dual mode.
Embodiment 1:
With reference to accompanying drawing 5, accompanying drawing 5 is a monobasic coin surface scan image, as seen from Figure 5, use method of the present invention and the detection system can be correctly to the coin surface imaging, and resolution is higher, has therefore proved feasibility of the present invention and validity.
Embodiment 2:
With reference to accompanying drawing 6, accompanying drawing 6 is the detected image and the photo in kind at high-voltage switch contact annular soldering interface.By accompanying drawing 5 as can be seen, detected image and photo in kind have consistance preferably, and detected image has reflected the situation that combines at interface between contact and the supporting mass accurately.The segmentation threshold that adopts method of the present invention to calculate the type workpiece is 120, the segmentation threshold of the contact in the accompanying drawing 6: 120, and combination rate is 72%.
Embodiment 3:
With reference to accompanying drawing 7, accompanying drawing 7 is low tension switch contact detected image and photo in kind.(a), (c), (e) be respectively the detected image of rectangle, trapezoidal and irregularly shaped contact, (b) (d) (f) is respectively the material picture of rectangle, trapezoidal and irregularly shaped contact combination interface.(a) be segmentation threshold: 130, combination rate: 71%; (c) be segmentation threshold: 140, combination rate: 84%; (e) be segmentation threshold: 120, combination rate: 92%.Accompanying drawing 5 as can be seen, detected image and photo in kind have consistance preferably.By calculating the result shown in the table 1.This shows that this invention is not only applicable to the detection of high-voltage switch contact, also be applicable to the detection of low tension switch contact.
The testing result of table 1 difformity contact
| The workpiece shape | Segmentation threshold | Combination rate % |
| Rectangle is trapezoidal irregularly shaped | 130 140 120 | 71 84 92 |
Claims (7)
1. the supersonic image-forming damage-free detection method of a switch contact bond quality is characterized in that, comprises the steps:
(1) measured workpiece is assemblied on the anchor clamps in the detection system tank, makes the tested combination interface of contact of workpiece vertical with ultrasonic incident acoustic beam;
(2) adjust sensed system parameter, detected parameters mainly comprises the material velocity of sound, contact thickness, scanning probe scope;
The described material velocity of sound adopts nominal longitudinal wave velocity, and for the contact of silver alloy, the material velocity of sound is chosen the nominal longitudinal wave velocity 3600m/s of silver;
(3) probe is placed the contact top, according to detected parameters, three-dimensional precision sweep platform drives probe to tested faying face automatic focus;
(4) determine the sampling position of strobe according to the reflection echo rectified signal;
(5) tested faying face is carried out autoscan, and real time imagery;
(6) analyze the faying face ultrasonoscopy, selected threshold is cut apart calmodulin binding domain CaM and calmodulin binding domain CaM not, and is calculated the interface combination rate;
The threshold value of choosing in the calculating with combination rate of cutting apart of described ultrasonoscopy is obtained by following method:
Different workpieces to same type detects and writes down ultrasonoscopy, workpiece after at first will detecting digs mill processing through saw, remove the copper supporting mass of contact, up to copper layer thickness is about 0.3mm, soak with liquor ferri trichloridi then and corrode, after removing fully on the copper layer, sample is taken out, only remaining faying face of joint and upper strata silver contact, faying face is high-visible, with digital camera faying face is taken pictures, adopt the actual combination rate of image process method calculations incorporated face, choose the combination rate that appropriate threshold value calculates the workpiece ultrasonoscopy according to this result, make the calculations incorporated rate consistent, determine the threshold value of this workpiece with actual combination rate; Different workpieces of the same type is carried out same operation, a plurality of workpiece threshold values are averaged, just obtained the threshold value of the type workpiece;
(7) generate and print examining report automatically.
2. according to the supersonic image-forming damage-free detection method of the described switch contact bond quality of claim 1, it is characterized in that described measured workpiece is a high-voltage switch contact, or the low tension switch contact; Measured workpiece is the solder contacts combination, or combination of sintered contact interface or the combination of spot welding contact, and described interface combination rate is the combination rate of contact entire area, or the combination rate of contact local area, and contact shape is a rectangle.
3. according to the supersonic image-forming damage-free detection method of the described switch contact bond quality of claim 1, it is characterized in that, the scanning sample spacing is regulated according to resolution requirement, and image pixel-class is selected 256 grades or 16 grades, and image shows employing pseudo color image or gray level image dual mode.
4. the detection system of the supersonic image-forming damage-free detection method of a switch contact bond quality, it is characterized in that: comprise supersonic signal generator (1), probe (2), three-dimensional precision sweep platform (3), image pick-up card (4), step motor drive card (5), driving source for step motor (6), the industrial control computer (7) that has system software (9) and printer (8), by electrically connecting formation;
Wherein image pick-up card (4), step motor drive card (5), printer (8) are connected with industrial control computer (7) respectively; Be connected with driving source for step motor (6) on the step motor drive card (5), and be connected with three-dimensional precision sweep platform (3) by driving source for step motor (6); Image pick-up card (4) is realized being connected by supersonic signal generator (1) and three-dimensional precision sweep platform (3); Probe (2) is connected with three-dimensional precision sweep platform (3) with image pick-up card (4) respectively; Image pick-up card (4) carries out analog to digital conversion, exchanges data storage and ultrasonic imaging under system software (9) effect, and ultrasonoscopy is carried out display process by system software, simultaneously bond quality is estimated, evaluation result is by the form output of printer with examining report;
Described image pick-up card circuit selects circuit (18), survey velocity of sound circuit (19), DMA passage (20), image data storage (21) and bus management circuit (22) to form by analog to digital conversion passage (15), clock generator (16), window controller (17), A, B, C scan mode; The input signal of image pick-up card comprises echo RF signal and rectified signal, supersonic signal generator synchronous triggering signal and signal strobe;
Described clock generator (16) is made up of start-oscillation circuit and frequency divider, and start-oscillation circuit is the horizontal crystal oscillator of a high-precision band temperature compensation, and it produces the clock signal of 80MHz, produces the clock signal of 40MHz and 20MHz through the frequency divider effect;
Described survey velocity of sound circuit (19) is determined the real velocity of sound of sound wave by the position of calculating signal strobe, determines the defective starting point of sampling simultaneously;
Described DMA passage (20) makes image pick-up card be independent of computing machine, finishes the collection and the storage of view data automatically.
5. the detection system of the supersonic image-forming damage-free detection method of switch contact bond quality as claimed in claim 4, it is characterized in that, described three-dimensional precision sweep platform (3) is made up of X-axis (10), Y-axis (11), Z axle (12) three-dimensional motion module, each dimension motion module is made up of leading screw and motor, X-axis (10) and Y-axis (11) make probe realize tangential movement, and Z axle (12) makes probe realize vertical movement.
6. the detection system of the supersonic image-forming damage-free detection method of switch contact bond quality as claimed in claim 4, it is characterized in that, the leading screw of described three-dimensional precision sweep platform (3) is selected straight line leading screw or ball-screw for use, motor is selected stepper motor or servomotor for use, its movement velocity 10mm/s～200mm/s.
7. the detection system of the supersonic image-forming damage-free detection method of switch contact bond quality as claimed in claim 4, it is characterized in that described system software (9) is made up of database management module (25), interface circuit initialization module (26), parameter input module (27), automatic focus module (28), A, B, C scan module (29), sound velocity determination module (30), signal and image processing module (31), defect analysis and determination module (32).
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| CN 200310105892 CN1261760C (en) | 2003-11-07 | 2003-11-07 | Ultrasonic imaging non-destructive detection method and detection system for appliance switch contact bonding quality |
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