CN102393420A - Detection method of copper target compact and forming method of copper target component - Google Patents
Detection method of copper target compact and forming method of copper target component Download PDFInfo
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- CN102393420A CN102393420A CN2011103284355A CN201110328435A CN102393420A CN 102393420 A CN102393420 A CN 102393420A CN 2011103284355 A CN2011103284355 A CN 2011103284355A CN 201110328435 A CN201110328435 A CN 201110328435A CN 102393420 A CN102393420 A CN 102393420A
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Abstract
The invention discloses a detection method of a copper target compact, and the method comprises the following steps of: providing a copper target compact which is made from ultra-pure copper; and performing ultrasonic detection on the copper target compact, wherein the ultrasonic frequency is 5-20MHz. The invention also provides a forming method of a copper target component, and the method comprises the following steps of: detecting copper target blanks by the detection method; processing the qualified copper target blank to form a copper target; and welding the copper target on a back plate to form the copper target component. In the invention, the ultrasonic detection has higher accuracy than a traditional radiographing detection method so as to avoid omission of unqualified copper target blank and further avoid the situation that the omitted unqualified blank is processed and the formed target component is determined unqualified.
Description
Technical field
The present invention relates to field of semiconductor manufacture, relate in particular to the detection method of copper target briquet and the formation method of copper target components.
Background technology
In field of semiconductor manufacture, because copper has higher conductance with respect to aluminium, so copper interconnecting line is widely used in the fabricate process.Copper interconnecting line generally through sputter copper target on silicon chip or dielectric layer, carry out etching technics then and form.Generally, the making of copper target comprises: copper target blank is provided, to this target blank according to target the shape of target carry out blanking, afterwards the copper target blank after the blanking is carried out repeatedly machining, obtain the target target.
Before copper target blank carried out blanking; Need carry out quality testing to this blank; The general film radiography that adopts in the prior art, radiography is meant with X ray or gamma-rays and penetrates test specimen, with the lossless detection method of film as the equipment of recorded information; This method is the most basic, most widely used a kind of nondestructive test method.
The radiographic examination (complete) ratio juris is: ray can penetrate the material that naked eyes can't penetrate and make light reaching the film; When X ray or radiation gamma film; The same with ordinary ray, can make the silver halide in the film emulsion layer produce latent image, because the material of different densities is different to the absorption coefficient of ray; Shine film ray energy everywhere and also will produce difference, the egative film after just can handling according to darkroom density difference is everywhere differentiated defective.
After above-mentioned detection is qualified, carry out the making to the copper target, after making finished, the copper target that needs to meet sputtering performance combined to form target material assembly with the backboard with certain intensity.This backboard can be assembled in the sputter base station at copper target components and play a supporting role, and has the effect of conduction heat.
Target material assembly needs target is carried out one-time detection again before dispatching from the factory.In this testing process, target target material assembly off quality needs to be destroyed.Yet; Inventor of the present invention carefully discovers the testing process and the welding technology of target blank; Defective target in before dispatching from the factory, once more target being detected welding technology no thanks to causes, but underproof blank causes because prior art does not detect the detection of copper target blank.
In view of this, be necessary the detection method of copper target blank is improved in fact.
Summary of the invention
The problem that the present invention solves provides a kind of detection method of new copper target blank; Can avoid the omission of defective copper target blank, and then the defective blank of avoiding leak picking is just assert underproof situation by further processing and after causing forming target material assembly.
For addressing the above problem, the present invention provides a kind of detection method of copper target briquet, comprising:
Copper target briquet is provided, and said copper target briquet material is the superelevation fine copper;
Said copper target briquet is carried out ultrasound examination, and wherein, said frequency of ultrasonic is 5～20MHz.
Optional, said frequency of ultrasonic is 15MHz.
Optional, it is with ultra-sonic defect detector said copper target briquet to be detected that said copper target briquet is carried out ultrasound examination.
Optional, said copper target briquet is being carried out also comprising before the ultrasound examination: detect with the standard sample of ultra-sonic defect detector to said copper target briquet.
Optional, the said standard sample of said copper target briquet the detection with ultra-sonic defect detector comprises: the ratio of defects of calculating the standard sample of said copper target briquet; The sensitivity of adjustment ultra-sonic defect detector when the ratio of defects of calculating gained exceeds preset range.
Optional, the preset range of the ratio of defects of said standard sample is set at 2.57%-2.77%, and the sensitivity of said ultra-sonic defect detector is 55～60dB.
Optional, said ultrasound examination is to be medium with water.
Optional, said ultra-sonic defect detector comprises the ultrasonic probe that sends ultrasound wave and reception ultrasonic reflections, the degree of depth that said ultrasonic probe stretches in the water is 6～10mm.
Optional, said ultra-sonic defect detector also comprises the filtrator that said ultrasound wave is carried out filtering, the frequency of said filtrator is 5MHz.
Optional, said ultra-sonic defect detector also comprises the Ultrasound Probe Device that the drive ultrasonic probe moves, the distance of said Ultrasound Probe Device and copper target briquet end face is 55mm.
In addition, the present invention also provides a kind of formation method of copper target components, comprising:
Utilize the detection method of foregoing description that copper target blank is detected;
Qualified copper target blank is processed to form the copper target;
The copper target is soldered to backboard, forms copper target components.
Optional, said processing comprises at least a in cutting, the plastic forming.
Compared with prior art; Technique scheme has the following advantages: copper target briquet is carried out ultrasound examination; This detection need not to destroy copper target briquet; Through the ultrasonic signal characteristic is analyzed, can obtain the quantification result directly perceived of defective locations, size and the shape evaluation of copper target briquet.And the ultrasound examination here has more pin-point accuracy than traditional radiographic examination (complete) method; Thereby can avoid the omission of defective copper target blank, and then the defective blank of avoiding leak picking is just assert underproof situation by further processing and after causing forming target material assembly.
Description of drawings
Fig. 1 is the basic flow sheet of the detection method of embodiment of the present invention copper target briquet;
Fig. 2 is the process flow diagram of the detection method of embodiment of the invention copper target briquet;
Fig. 3 is the electron scanning figure of standard sample of the copper target briquet of the embodiment of the invention;
Fig. 4 is the detection synoptic diagram of the detection method of embodiment of the invention copper target briquet.
Embodiment
Said as background technology, generally be that the copper target after the welding is detected once more in the prior art, underproof target occurs and can be considered to cause, thereby always constantly improve welding technology, to improve the yield of copper target finished product by welding technology.Inventor of the present invention finds; Defective target in before dispatching from the factory, once more target material assembly being detected is not only because welding technology causes, existing detection method is inaccurate and to fail fully to detect underproof blank also be a major reason to the detection of copper target blank.And then; The inventor proposes to adopt ultrasound wave that copper target briquet is detected, and ultrasound examination is that a kind of nondestructive examination detects, through defective locations, size and the shape etc. that can obtain copper target briquet to the analysis of ultrasonic signal characteristic result directly perceived; The film radiography that has overcome available technology adopting is very high to volume type defective (pore, slag inclusion, tungsten inclusion, burn, undercut, overlap, pit etc.) recall rate; And to area-type defective (lack of penetration, incomplete fusion, crackle etc.), if camera angles is inappropriate, omission easily; And the workpiece of the suitable check of film radiography thinner thickness and workpiece that should not be thicker; Because check thick workpiece to need high-octane ray equipment, and along with the increase of thickness, the problem that its check sensitivity also can descend.
For make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, does detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.Because the present invention focuses on interpretation principle, therefore, drawing not in scale.
Fig. 1 is the basic flow sheet of the detection method of embodiment of the present invention copper target briquet, and said method comprises:
Step S11 provides copper target briquet, and said copper target briquet material is the superelevation fine copper; The purity of high purity copper is at least 99.9999%.
Step S12 carries out ultrasound examination to said copper target briquet, and wherein, said frequency of ultrasonic is 5～20MHz.
The sound wave that frequency is higher than 20000Hz is called " ultrasound wave ", and ultrasound wave has good directionality, and penetration capacity is strong, is easy to obtain concentrated acoustic energy, in characteristics such as water transmission distance.Ultrasound examination is one of lossless detection method, and Non-Destructive Testing is not destroy under the workpiece prerequisite, the general designation of the various technical methods of inspection workpiece gross imperfection or measuring workpieces characteristic.Find through inventor's research and analysis, the target briquet of different materials, hyperacoustic penetration capacity is different; Therefore the ultrasonic frequency of corresponding selection is also different, to copper target briquet, confirms to select the frequency of ultrasonic scope at 5～20MHz; For example; 5MHz, 10MHz, 15MHz, 20MHz, wherein, preferable with the effect of 15MHz ultrasound examination.
In step S12, can use ultra-sonic defect detector that said copper target briquet is detected.Ultra-sonic defect detector is the instrument that the method for utilization ultrasound detection detects; Its principle is: when ultrasound wave is propagated in material to be detected; The acoustic characteristic of material and the variation of interior tissue produce certain influence to hyperacoustic propagation, understand material property and structural change through the detection to ultrasound wave degree of susceptibility and situation.
When practical application; For guaranteeing that ultra-sonic defect detector is operated under the stable status; Before said copper target briquet is detected, need elder generation that the standard sample of said copper target briquet is carried out ultrasound examination, comprising: the ratio of defects of calculating the standard sample of said copper target briquet; The controlled variable of adjustment ultra-sonic defect detector, for example sensitivity when the ratio of defects of calculating gained exceeds preset range.
Because the propagation distance of ultrasound wave in water be far away, so ultrasound examination can be medium with water, to reduce the influence of environmental factor (for example air) to testing result.
Fig. 2 is the process flow diagram of the detection method of embodiment of the invention copper target briquet; In the present embodiment; Use ultra-sonic defect detector that the standard sample of copper target briquet is detected earlier,, then adjust the controlled variable of ultra-sonic defect detector if detected ratio of defects exceeds preset range; Do not exceed preset range if detect the ratio of defects that obtains, then copper target briquet is carried out ultrasound examination.
With reference to figure 2, the detection method of present embodiment copper target briquet comprises the steps:
Step S21 provides the standard sample of copper target briquet;
Step S22 uses ultra-sonic defect detector that the standard sample of said copper target briquet is detected, and wherein, ultrasonic frequency is chosen as 15MHz;
Step S23, the ratio of defects of the standard sample of the detected said copper target briquet of calculating ultra-sonic defect detector;
Step S24 judges that whether the said ratio of defects that calculates surpasses preset range, if execution in step S25 then, execution in step S26 then if not;
Step S25, the controlled variable of adjustment ultra-sonic defect detector, then execution in step S22;
Step S26 provides copper target briquet;
Step S27 uses ultra-sonic defect detector that copper target briquet is detected, and wherein, ultrasonic frequency is chosen as 15MHz;
Step S28, according to the ultrasound examination result, the quality of assessment copper target briquet.
Be elaborated below in conjunction with Fig. 3 and 4 pairs of each steps shown in Figure 2.
Step S21 provides the standard sample of copper target briquet.Please refer to Fig. 3, it is a kind of synoptic diagram of standard sample 30 of copper target briquet, and wherein, standard sample 30 has 2 defectives, and wherein first defective 30a (point defect) area is bigger, and the second defective 30b area is less.The standard sample 30 of copper target briquet has identical performance with copper target briquet.
Step S22 uses ultra-sonic defect detector that the standard sample of copper target briquet is detected, and wherein, ultrasonic frequency is chosen as 15MHz.Please refer to Fig. 4, it is the synoptic diagram that the target detection thing is detected with ultra-sonic defect detector.
As shown in Figure 4, target detection thing 40, the standard sample 30 of copper target briquet promptly shown in Figure 3 is placed in the water.Ultra-sonic defect detector comprises ultrasonic probe 41, Ultrasound Probe Device 42 and control system (not shown).Ultrasonic probe 41 is used to send ultrasound wave and receives ultrasonic reflections, and Ultrasound Probe Device 42 is used to drive ultrasonic probe 41 and moves.The inventor finds that the degree of depth h1 that ultrasonic probe 41 stretches in the water is 6～10mm, and Ultrasound Probe Device 42 is when the distance h 2 of target detection thing 40 end faces is 55mm, and it is clear to form images, and the omission probability is low.
Consider the penetration capacity of ultrasound wave to copper target briquet, in the present embodiment, the frequency of operation of ultra-sonic defect detector is chosen as 15MHz.Generally, ultra-sonic defect detector also includes filtrator, is used for ultrasound wave is carried out filtering, disturbs to eliminate outside noise, reaches testing result more accurately.In the present embodiment, be 15MHz to the ultrasonic frequency of selecting, the frequency of filtrator is chosen as 5MHz.
During test; Ultrasound Probe Device 42 is moved in the control system control of ultra-sonic defect detector; To drive moving of ultrasonic probe 41; The ultrasound wave that makes ultrasonic probe 41 send can be propagated on the whole surface of target detection thing 40, and the step-length that ultrasonic probe moves (comprising the distance that horizontal direction and vertical direction move) can be regulated according to the size of target detection thing 40.When ultrasound wave runs into heterogeneous interface (like defective); Acoustic wave segment can be reflected and received by ultrasonic probe 41; The control system of ultra-sonic defect detector can convert the ultrasonic signal of reflection into electric signal; Through analyzing said electrical signal converted, can obtain quantification results such as defective locations, size and shape.
Step S23, the ratio of defects of the standard sample of the detected copper target of calculating ultra-sonic defect detector briquet.Wherein, ratio of defects=defect area/target detection object plane long-pending (%).Specifically, among Fig. 4, the area (%) of the ratio of defects of standard sample 30=(area of the first defective 30a+second defective 30b)/standard sample 30.
Step S24 judges that whether the said ratio of defects that calculates surpasses preset range, if execution in step S25 then, execution in step S26 then if not.In the present embodiment, the preset range of the ratio of defects of standard sample 30 is set at 2.57%-2.77%.If the ratio of defects of the standard sample 30 that calculates explains that ultra-sonic defect detector is in stable duty, then execution in step S26 in 2.57%-2.77%.Otherwise, execution in step S25 then.
Step S25, the controlled variable of adjustment ultra-sonic defect detector, then execution in step S22.Ultra-sonic defect detector comprises a plurality of adjustable controlled variable, and for example, frequency of operation, gain control, decay control, step-length are regulated and sensitivity is regulated or the like.Find through inventor's research and analysis, to the target briquet formula of different materials, the sensitivity scope of different ultra-sonic defect detectors can corresponding be set, detect stability to guarantee it, sensitivity is called flaw detection sensitivity again.In the present embodiment, to copper target briquet, sensitivity is controlled in the scope of 55～60dB, can improves the stability of ultrasound examination, sensitivity can be finely tuned.After sensitivity is finely tuned, continue execution in step S22, the standard sample to copper target briquet detects and calculates ratio of defects again.
Step S26 provides copper target briquet.
Step S27 uses ultra-sonic defect detector that copper target briquet is detected, and wherein, ultrasonic frequency is chosen as 15MHz.Copper target briquet is detected with step S22 basic identical, different is, the target detection thing 40 among Fig. 4 is a copper target briquet, and the ultrasound wave that ultrasonic probe 41 produces is propagated in copper target briquet, to detect the quality of copper target briquet.
Step S28, according to the ultrasound examination result, the quality of assessment copper target briquet.Select for use the ultrasonic of 15MHz to detect, it is fine when flaw size is big, to detect effect, can be directly judges interface quality from the height of the reflection wave of ultrasonic probe reception; For tiny defective; Through converting the ultrasonic signal that reflects into electric signal and it being analyzed; Can obtain position, size and the shape of defective; Thereby realize qualitative and quantitative assessment to copper target briquet quality quality, and, can be as accurate as 2 significant digits through detecting the ratio of defects that can calculate.
After above-mentioned steps is accomplished, then qualified copper target blank is processed to form the copper target; Then the copper target is soldered to backboard, forms copper target components.Technology in above-mentioned two steps can adopt existing processes processing.
In the practical implementation process, said processing comprises at least a in cutting, the plastic forming.
For verifying effect of the present invention, the copper target components that forms is detected, in once more target material assembly being detected before dispatching from the factory, disqualification rate can reduce by 5 percentage points.
In sum; The foregoing description adopts ultrasound wave copper target briquet to carry out quality testing; It need not to destroy copper target briquet, through the analysis to ultrasonic signal characteristic and defect characteristic, can obtain the quantification result directly perceived of defective locations, size and the shape evaluation of copper target briquet; Thereby improved the objectivity and the reliability of the quality testing of copper target briquet, and reduced the omission and the flase drop problem of copper target briquet defects detection.The more important thing is, can avoid since the copper target blank omission cause to the target after the welding when detecting, need the underproof target material assembly of quality is destroyed the problem of the waste of the backboard that causes and the energy consumption in the welding technology.
Though the present invention with preferred embodiment openly as above; But it is not to be used for limiting the present invention; Any those skilled in the art are not breaking away from the spirit and scope of the present invention; Can utilize the method and the technology contents of above-mentioned announcement that technical scheme of the present invention is made possible change and modification, therefore, every content that does not break away from technical scheme of the present invention; To any simple modification, equivalent variations and modification that above embodiment did, all belong to the protection domain of technical scheme of the present invention according to technical spirit of the present invention.
Claims (12)
1. the detection method of a copper target briquet is characterized in that, comprising:
Copper target briquet is provided, and said copper target briquet material is the superelevation fine copper;
Said copper target briquet is carried out ultrasound examination, and wherein, said frequency of ultrasonic is 5～20MHz.
2. the detection method of copper target briquet as claimed in claim 1 is characterized in that, said frequency of ultrasonic is 15MHz.
3. the detection method of copper target briquet as claimed in claim 2 is characterized in that, it is with ultra-sonic defect detector said copper target briquet to be detected that said copper target briquet is carried out ultrasound examination.
4. the detection method of copper target briquet as claimed in claim 3 is characterized in that, said copper target briquet is being carried out also comprising before the ultrasound examination: detect with the standard sample of ultra-sonic defect detector to said copper target briquet.
5. the detection method of copper target briquet as claimed in claim 4 is characterized in that, the said standard sample of said copper target briquet the detection with ultra-sonic defect detector comprises: the ratio of defects of calculating the standard sample of said copper target briquet; The sensitivity of adjustment ultra-sonic defect detector when the ratio of defects of calculating gained exceeds preset range.
6. the detection method of copper target briquet as claimed in claim 5 is characterized in that the preset range of the ratio of defects of said standard sample is set at 2.57%-2.77%, and the sensitivity of said ultra-sonic defect detector is 55～60dB.
7. the detection method of copper target briquet as claimed in claim 3 is characterized in that, said ultrasound examination is to be medium with water.
8. the detection method of copper target briquet as claimed in claim 7 is characterized in that, said ultra-sonic defect detector comprises the ultrasonic probe that sends ultrasound wave and reception ultrasonic reflections, and the degree of depth that said ultrasonic probe stretches in the water is 6～10mm.
9. the detection method of copper target briquet as claimed in claim 7 is characterized in that said ultra-sonic defect detector also comprises the filtrator that said ultrasound wave is carried out filtering, and the frequency of said filtrator is 5MHz.
10. the detection method of copper target briquet as claimed in claim 7 is characterized in that, said ultra-sonic defect detector also comprises the Ultrasound Probe Device that the drive ultrasonic probe moves, and the distance of said Ultrasound Probe Device and copper target briquet end face is 55mm.
11. the formation method of a copper target components is characterized in that, comprising:
Utilize each described detection method of claim 1 to 10 that copper target blank is detected;
Qualified copper target blank is processed to form the copper target;
The copper target is soldered to backboard, forms copper target components.
12. formation method as claimed in claim 11 is characterized in that, said processing comprises at least a in cutting, the plastic forming.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721696A (en) * | 2012-05-22 | 2012-10-10 | 珠海承鸥卫浴用品有限公司 | Method for rapidly detecting leadless copper alloy die casting surface defects |
| CN103792286A (en) * | 2012-11-01 | 2014-05-14 | 宁波江丰电子材料有限公司 | Detection methods of welding defect rate and binding rate of target assembly |
| CN105234306A (en) * | 2015-09-10 | 2016-01-13 | 蒋艳 | Sheet metal machining equipment |
| CN111796027A (en) * | 2020-08-10 | 2020-10-20 | 宁波江丰电子材料股份有限公司 | Method for detecting defect rate of welding layer in copper target assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001092868A2 (en) * | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Methods of testing materials |
| CN101639462A (en) * | 2009-06-16 | 2010-02-03 | 宁波江丰电子材料有限公司 | Method for detecting targets |
| CN101639461A (en) * | 2009-06-16 | 2010-02-03 | 宁波江丰电子材料有限公司 | Method for detecting targets |
| US20100242608A1 (en) * | 2009-03-27 | 2010-09-30 | Maev Roman Gr | Electrode cap for ultrasonic testing |
-
2011
- 2011-10-25 CN CN2011103284355A patent/CN102393420A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001092868A2 (en) * | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Methods of testing materials |
| US20100242608A1 (en) * | 2009-03-27 | 2010-09-30 | Maev Roman Gr | Electrode cap for ultrasonic testing |
| CN101639462A (en) * | 2009-06-16 | 2010-02-03 | 宁波江丰电子材料有限公司 | Method for detecting targets |
| CN101639461A (en) * | 2009-06-16 | 2010-02-03 | 宁波江丰电子材料有限公司 | Method for detecting targets |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721696A (en) * | 2012-05-22 | 2012-10-10 | 珠海承鸥卫浴用品有限公司 | Method for rapidly detecting leadless copper alloy die casting surface defects |
| CN102721696B (en) * | 2012-05-22 | 2014-05-07 | 珠海承鸥卫浴用品有限公司 | Method for rapidly detecting leadless copper alloy die casting surface defects |
| CN103792286A (en) * | 2012-11-01 | 2014-05-14 | 宁波江丰电子材料有限公司 | Detection methods of welding defect rate and binding rate of target assembly |
| CN105234306A (en) * | 2015-09-10 | 2016-01-13 | 蒋艳 | Sheet metal machining equipment |
| CN111796027A (en) * | 2020-08-10 | 2020-10-20 | 宁波江丰电子材料股份有限公司 | Method for detecting defect rate of welding layer in copper target assembly |
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Application publication date: 20120328 |