CN111796027A - Method for detecting defect rate of welding layer in copper target assembly - Google Patents
Method for detecting defect rate of welding layer in copper target assembly Download PDFInfo
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- CN111796027A CN111796027A CN202010796830.5A CN202010796830A CN111796027A CN 111796027 A CN111796027 A CN 111796027A CN 202010796830 A CN202010796830 A CN 202010796830A CN 111796027 A CN111796027 A CN 111796027A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 148
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 148
- 239000010949 copper Substances 0.000 title claims abstract description 148
- 238000003466 welding Methods 0.000 title claims abstract description 77
- 230000007547 defect Effects 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000001514 detection method Methods 0.000 claims abstract description 128
- 239000000523 sample Substances 0.000 claims abstract description 120
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 106
- 238000007654 immersion Methods 0.000 claims abstract description 67
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 238000010586 diagram Methods 0.000 claims description 15
- 238000004364 calculation method Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 14
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000005477 sputtering target Methods 0.000 description 10
- 229910000838 Al alloy Inorganic materials 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005493 welding type Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/043—Analysing solids in the interior, e.g. by shear waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/32—Arrangements for suppressing undesired influences, e.g. temperature or pressure variations, compensating for signal noise
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0234—Metals, e.g. steel
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/101—Number of transducers one transducer
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/267—Welds
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- Acoustics & Sound (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention provides a method for detecting the defect rate of a welding layer in a copper target assembly, which comprises the steps of polishing the surface of the copper target assembly and then carrying out water immersion type ultrasonic flaw detection, so that the roughness of the surface of the copper target is reduced, the influence of the surface roughness on the ultrasonic flaw detection is reduced, the defect rate is calculated according to an ultrasonic flaw detection map, and the welding result is quantized; and the frequency of the ultrasonic probe is further matched, so that the detection efficiency is improved, and the welding effect of the copper target and the back plate can be better determined.
Description
Technical Field
The invention relates to the technical field of sputtering target preparation, relates to a target flaw detection method, and particularly relates to a method for detecting the defect rate of a welding layer in a copper target assembly.
Background
The metal sputtering target material is used as a cathode material in the sputtering deposition technology, and metal on the surface of the metal sputtering target material is separated from the cathode in the form of molecules, atoms or ions and is redeposited on the surface of an anode under the impact action of positive charged cations in a sputtering machine. As the metal sputtering target material is usually made of high-purity aluminum, copper, titanium, nickel, tantalum and other relatively noble metal materials. Because the metal sputtering targets have different strengths, in the practical application process, the metal sputtering targets meeting the performance requirements and the back plate with certain strength need to be combined to form a target assembly, and then the target assembly is arranged on a sputtering machine table to effectively perform sputtering control under the action of a magnetic field and an electric field. The back plate can not only play a supporting role and a cooling role for the metal sputtering target material, but also reduce the raw material cost of the production process. Commonly used materials for the back plate include aluminum alloy, copper alloy and the like.
At present, the metal sputtering target and the back plate need to be processed and welded for forming, so that the successful implementation of the subsequent sputtering can be ensured. If the welding combination degree between the metal sputtering target and the back plate is poor, the metal sputtering target deforms, cracks and even falls off from the back plate under the heated condition, so that the uniform sputtering effect cannot be achieved, and the sputtering base station can be damaged.
The copper target material needs to be welded with an alloy back plate with high hardness because of low hardness. CN111304604A discloses a diffusion welding method of a copper target and an aluminum alloy back plate, which comprises the following steps: (1) plating a titanium film on the welding surface of the copper target, assembling the copper target plated with the titanium film and the aluminum alloy back plate, and then integrally placing the copper target plated with the titanium film and the aluminum alloy back plate into a jacket; (2) sealing the sheath obtained in the step (1) and then degassing; (3) and (3) carrying out hot isostatic pressing welding on the sheath degassed in the step (2), and then removing the sheath to finish diffusion welding of the copper target and the aluminum alloy backboard. The diffusion welding method is beneficial to improving the welding combination degree between the copper target and the aluminum alloy backboard through the good diffusivity of the titanium film.
In order to ensure the welding effect, besides the need of improving the welding method, the welding detection needs to be performed on the copper target assemblies after each welding, so as to ensure that each copper target assembly is welded to be qualified.
In the prior art, tensile tests are generally adopted to detect the tensile strength of a welded product so as to judge whether welding of a welding type copper target is good or not, but the method belongs to destructive tests, and the tensile tests can detect the tensile strength of an experimental part and cannot well reflect the welding condition of the whole target.
CN111060044A discloses a method for measuring the thickness of a welding type target by adopting a water immersion type C-SCAN device, which comprises the steps of immersing the welding type target and a probe in ultrapure water, operating C-SCAN software, measuring the sound velocity of the target by using an ultrasonic longitudinal wave pulse reflection technology and a measurement type taking the wave peak position of an interface wave as an initial point through the known thickness of a target blank, measuring the thickness of the target part at the moment by using the sound velocity of the measured target after subsequent combination with a back plate and machining forming or magnetron sputtering, and judging the welding effect according to the thickness, but the method cannot quantitatively calculate the welding condition.
Therefore, it is necessary to develop a method for detecting a welding layer in a copper target assembly, which is capable of detecting the welding condition in an overall quantitative manner without damaging the product.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a method for detecting the defect rate of a welding layer in a copper target assembly, which reduces surface stains and surface roughness by polishing the surface of the copper target assembly, improves the effect of ultrasonic flaw detection, calculates the defect rate according to an ultrasonic flaw detection map, and quantifies the welding result; and further select the ultrasonic probe of specific frequency, can ensure defect detection effect and detection efficiency simultaneously.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a method for detecting the defect rate of a welding layer in a copper target assembly, which comprises the following steps:
(1) placing the copper target assembly subjected to surface polishing treatment in water, and carrying out water immersion type ultrasonic flaw detection on the copper target assembly, wherein the frequency of an ultrasonic probe used for the water immersion type ultrasonic flaw detection is 1-12 MHz;
(2) and (3) calculating the defect rate of a welding layer in the copper target assembly according to the ultrasonic flaw detection diagram obtained in the step (1).
Compared with the original tensile experiment for detecting the welding strength, the method for detecting the defect rate of the welding layer in the copper target assembly provided by the invention has the advantages that the sample is not damaged, the welding state in the welding layer of the copper target assembly can be detected, the defect rate of the welding of the copper target assembly is obtained through calculation, the detection is convenient, the efficiency is high, and the quantification of the welding result is realized.
In addition, the surface of the copper target assembly is polished and then subjected to water immersion type ultrasonic flaw detection, and the inventor finds that although ultrasonic detection mainly detects internal defects of a welding layer of a sample to be detected, the detection of a welding product after the surface of the copper target assembly is polished improves the accuracy of detection of the defect rate of the welding layer in the copper target assembly.
The water immersion type ultrasonic flaw detection adopted by the invention is a mode that a sample is placed in water, a water layer with a certain thickness is arranged between a probe and the sample to be detected, and sound waves firstly pass through the water layer and then are incident to the surface of the copper target assembly to be detected, so that the influence of environmental factors (such as air) on a detection result is reduced.
The frequency of the ultrasonic probe used in the water immersion type ultrasonic flaw detection in the step (2) is 1-12 MHz, and may be 1MHz, 2MHz, 3MHz, 4MHz, 5MHz, 6MHz, 7MHz, 8MHz, 9MHz, 10MHz, 11MHz, or 12MHz, for example.
Aiming at the detection of a welding layer in a copper target assembly, a probe with the frequency of 1-12 MHz is specially selected, and compared with an ultrasonic probe in the conventional ultrasonic flaw detection of 15-30 MHz, the probe with the frequency of 1-12 MHz can better detect a large-area welding layer and detect larger defects.
Preferably, the roughness Ra of the surface of the copper target assembly after the polishing treatment in the step (1) is less than 1.5 μm, and may be 1.4 μm, 1.35 μm, 1.3 μm, 1.25 μm, 1.2 μm, 1.15 μm, 1.1 μm, 0.8 μm, 0.6 μm or 0.5 μm, for example.
The roughness of the surface of the copper target assembly after polishing treatment is preferably controlled within the range of Ra 0.5-1.5 μm, and the copper target assembly has higher sensitivity under the condition of adopting a specific frequency probe.
Preferably, the frequency of the ultrasonic probe used for the water immersion type ultrasonic flaw detection in the step (1) is 10 MHz.
Preferably, the frequency of the filter used in the water immersion type ultrasonic flaw detection in the step (1) is 1 to 12MHz, for example, 1MHz, 2MHz, 3MHz, 4MHz, 5MHz, 6MHz, 7MHz, 8MHz, 9MHz, 10MHz, or the like, and preferably 10 MHz.
Preferably, the frequency of the filter used for the water immersion type ultrasonic flaw detection is the same as that of the ultrasonic probe.
The frequency of the filter is preferably the same as that of the ultrasonic probe, so that the external noise interference is eliminated, and a more accurate detection result is achieved.
Preferably, the polished copper target assembly in step (1) is placed in water and then the upper surface of the copper target assembly is wiped.
In the invention, the surface of the copper target assembly is preferably wiped after the copper target assembly is placed in water, so that bubbles on the surface of the copper target assembly are removed, and the influence of the bubbles on ultrasonic flaw detection is reduced.
Preferably, the ultrasonic probe used for the water immersion type ultrasonic flaw detection is inserted into water for detection.
Preferably, the ultrasonic probe after being inserted into water is subjected to surface wiping treatment.
The invention also preferably performs wiping treatment on the surface of the ultrasonic probe extending into water, removes surface bubbles and improves the detection effect.
Preferably, the wiping process is wiping the surface of the copper target component by using a wiping cloth.
Preferably, the step size of the water immersion type ultrasonic flaw detection in the step (1) is 0.5-2.8 mm, and may be, for example, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.8mm, 2.0mm, 2.2mm, 2.5mm, 2.8mm, or the like.
Preferably, the focal length of the ultrasonic probe used for the water immersion type ultrasonic flaw detection in the step (1) is 95-105 mm, for example, 95mm, 96mm, 97mm, 98mm, 99mm, 100mm, 101mm, 102mm, 103mm, 104mm, 105mm, etc., preferably 101.6 mm.
Preferably, the diameter of the copper target assembly in step (1) is 50-240 mm, such as 50mm, 60mm, 70mm, 80mm, 100mm, 120mm, 150mm, 180mm, 200mm, 220mm, or 240mm, and the step size of the water immersion ultrasonic flaw detection is 0.2-0.9 mm, such as 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, or 0.9mm, and preferably 0.5 mm.
Preferably, the diameter of the copper target assembly is 250 to 350mm, for example, 250mm, 260mm, 270mm, 280mm, 290mm, 300mm, 310mm, 320mm, 330mm, 340mm or 350mm, and the step size of the water immersion ultrasonic flaw detection is 1.0 to 1.5mm, for example, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm or 1.5mm, and preferably 1.0 mm.
Preferably, the diameter of the copper target assembly is 360-500 mm, for example, 360mm, 370mm, 380mm, 400mm, 420mm, 450mm, 480mm or 500mm, etc., and the step size of the water immersion type ultrasonic flaw detection is 1.2-2.0 mm, for example, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.8mm or 2.0mm, etc., preferably 1.5 mm.
Preferably, the diameter of the copper target assembly is 1 to 4m, such as 1m, 1.2m, 1.5m, 1.8m, 2m, 2.2m, 2.5m, 2.8m, 3m, 3.2m, 3.5m, 3.8m or 4m, and the step size of the water immersion ultrasonic flaw detection is 2.0 to 2.8mm, such as 2.0mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm or 2.8mm, and preferably 2.5 mm.
The invention selects different step lengths for copper target components with different sizes, and can simultaneously ensure the detection efficiency and the detection precision.
Preferably, the distance between the ultrasonic probe used for the water immersion type ultrasonic flaw detection in the step (1) and the upper surface of the copper target assembly is 50-65 mm, and may be, for example, 50mm, 51mm, 52mm, 53mm, 54mm, 55mm, 56mm, 57mm, 58mm, 59mm, 60mm, 61mm, 62mm, 63mm, 64mm, or 65 mm.
Preferably, the calculation in step (2) comprises a 3sigma calculation.
Preferably, the method comprises: firstly, detecting the defect rate of a standard sample of the copper target assembly until the defect rate of the standard sample is within a preset range, and then detecting the defect rate of the sample to be detected, otherwise, adjusting the parameters of the water immersion type ultrasonic flaw detection to detect the defect rate of the standard sample of the copper target assembly again.
Preferably, the parameters include any one or a combination of at least two of the frequency of the ultrasonic probe, the frequency of the filter, the length of the ultrasonic probe extending into the water, the step size, or the focal length, wherein typical non-limiting combinations are the frequency of the filter and the frequency of the ultrasonic probe, the frequency of the filter and the step size, the frequency of the ultrasonic probe and the focal length, the step size and the focal length, and the length of the ultrasonic probe extending into the water.
Preferably, the preset range is 10.62-12.32%.
The water immersion type ultrasonic flaw detection method comprises the steps of firstly carrying out water immersion type ultrasonic flaw detection on a copper target assembly of a standard sample, obtaining defect rate data of the standard sample through calculation, judging whether the defect rate data is within a preset range, adjusting parameters of an ultrasonic flaw detection instrument if the defect rate data is not within the preset range, repeatedly detecting the standard sample, carrying out water immersion type ultrasonic flaw detection on a sample to be detected after the defect rate is determined to be within the preset range, and judging whether the sample meets the welding requirement through calculating the defect rate.
The preset range is 10.62-12.32%, because a certain defect originally exists in the welding process of the copper target and the back plate, the preset range is set to be 10.62-12.32%, the welding process is more beneficial to judging whether the welding of the copper target assembly is qualified, and the welding product detection can be better carried out by adjusting the parameters of the ultrasonic flaw detection instrument by taking the preset range as a standard.
As a preferred technical scheme of the invention, the method comprises the following steps:
(1) polishing the surface of the copper target component to ensure that the roughness Ra of the surface of the copper target component is less than 1.5 mu m; after the copper target assembly is placed in water, the polished copper target assembly is wiped on the upper surface of the copper target assembly, an ultrasonic probe used for water immersion type ultrasonic flaw detection extends into the water for detection, the ultrasonic probe extending into the water is wiped on the surface, and then the water immersion type ultrasonic flaw detection is carried out on the copper target assembly;
the frequency of the ultrasonic probe used for water immersion type ultrasonic flaw detection is 1-12 MHz, the frequency of the filter is 1-12 MHz, the step length is 0.5-2.8 mm, the focal length of the ultrasonic probe is 95-105 mm, and the distance between the ultrasonic probe used for water immersion type ultrasonic flaw detection and the upper surface of the copper target assembly is 50-65 mm;
(2) calculating the defect rate of a welding layer in the copper target assembly according to the water immersion type ultrasonic flaw detection diagram in the step (1);
performing defect rate detection on a standard sample of the copper target assembly in the steps (1) and (2), and performing defect rate detection on the sample to be detected when the defect rate of the standard sample is within a preset range, or adjusting parameters of water immersion type ultrasonic flaw detection to perform defect rate detection on the standard sample of the copper target assembly again;
the parameters comprise any one or the combination of at least two of the frequency of the ultrasonic probe, the frequency of the filter, the length of the ultrasonic probe extending into water, the step length or the focal length;
the preset range is 10.62-12.32%.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) the method for detecting the defect rate of the welding layer in the copper target assembly can realize the detection of the large-area welding layer without damaging a sample to be detected, can better obtain the evaluation of the position, the size and the shape of the welded defect, and improves the objectivity of quality detection after welding;
(2) the method for detecting the defect rate of the welding layer in the copper target assembly polishes the surface and then detects the surface, so that the detection accuracy is improved;
(3) the method for detecting the defect rate of the welding layer in the copper target assembly combines selection of the probe with specific frequency, the filter and the step length, can give consideration to detection efficiency and detection effect for copper target assemblies with different sizes, and has great industrial application value.
Drawings
Fig. 1 is a schematic diagram of a method for detecting a defect rate of a solder layer in a copper target assembly according to the present invention.
FIG. 2 is a water immersion type ultrasonic testing chart of a standard specimen in example 1 of the present invention.
FIG. 3 is a diagram showing the detection and calculation of the first five groups of water immersion ultrasonic flaw detection of the standard sample in example 1 of the present invention.
Fig. 4 is a diagram showing the detection and calculation of five sets of water immersion type ultrasonic flaw detection for the standard sample in example 1 of the present invention.
In the figure: 1-an ultrasonic probe; 2-a probe frame; 3-a sample; 4-water.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
The method for detecting the defect rate of the welding layer in the copper target assembly is shown in figure 1, in the method, a sample 3 is placed in water 4, an ultrasonic probe 1 is placed on a probe frame 2 and extends into the water 4, the distance between the upper surface of the sample 3 and the probe frame 2 is h, and the h is 50-65 mm; the ultrasonic probe 1 transmits ultrasonic waves into the sample 3 with the water 4 as a medium and reflects the ultrasonic waves to be received by the ultrasonic probe 1, thereby detecting large-area welding and defect size.
First, an embodiment
Example 1
The embodiment provides a method for detecting a defect rate of a welding layer in a copper target assembly, which comprises the following steps:
(1) the surface of a copper target component (copper-aluminum alloy A6061 welding, copper target diameter 400mm) is polished to ensure that the roughness of the surface of the copper target component is 0.5 mu m;
after the copper target assembly is placed in water, the polished copper target assembly is wiped on the upper surface of the copper target assembly, an ultrasonic probe used for water immersion type ultrasonic flaw detection extends into the water for detection, the ultrasonic probe extending into the water is wiped on the surface, and then the water immersion type ultrasonic flaw detection is carried out on the copper target assembly;
the frequency of the ultrasonic probe used for the water immersion type ultrasonic flaw detection is 10MHz, the frequency of the filter is 10MHz, the step length is 1.5mm, the focal length of the ultrasonic probe is 101.6mm, and the distance between the ultrasonic probe used for the water immersion type ultrasonic flaw detection and the upper surface of the copper target assembly is 55 mm;
(2) and (3) calculating the defect rate of a welding layer in the copper target assembly by using 3sigma according to the water immersion type ultrasonic flaw detection diagram in the step (1).
Example 2
The embodiment provides a method for detecting a defect rate of a welding layer in a copper target assembly, which comprises the following steps:
(1) performing surface polishing treatment on a copper target assembly (copper-aluminum alloy A6061 welding, the diameter of a copper target is 100mm) to enable the roughness Ra of the surface of the copper target assembly to be 1.4 mu m;
after the copper target assembly is placed in water, the polished copper target assembly is wiped on the upper surface of the copper target assembly, an ultrasonic probe used for water immersion type ultrasonic flaw detection extends into the water for detection, the ultrasonic probe extending into the water is wiped on the surface, and then the water immersion type ultrasonic flaw detection is carried out on the copper target assembly;
the frequency of the ultrasonic probe used for the water immersion type ultrasonic flaw detection is 10MHz, the frequency of the filter is 10MHz, the step length is 0.5mm, the focal length of the ultrasonic probe is 95mm, and the distance between the ultrasonic probe used for the water immersion type ultrasonic flaw detection and the upper surface of the copper target assembly is 60 mm;
(2) and (3) calculating the defect rate of a welding layer in the copper target assembly by using 3sigma according to the water immersion type ultrasonic flaw detection diagram in the step (1).
Example 3
The embodiment provides a method for detecting a defect rate of a welding layer in a copper target assembly, which comprises the following steps:
(1) the surface of a copper target assembly (copper-aluminum alloy A6061 welding, copper target diameter 3m) was subjected to surface polishing treatment so that the roughness Ra of the surface of the copper target assembly was 1.0. mu.m
After the copper target assembly is placed in water, the polished copper target assembly is wiped on the upper surface of the copper target assembly, an ultrasonic probe used for water immersion type ultrasonic flaw detection extends into the water for detection, the ultrasonic probe extending into the water is wiped on the surface, and then the water immersion type ultrasonic flaw detection is carried out on the copper target assembly;
the frequency of an ultrasonic probe used for water immersion type ultrasonic flaw detection is 2MHz, the frequency of a filter is 2MHz, the step length is 2.5mm, the focal length of the ultrasonic probe is 105mm, and the distance between the ultrasonic probe used for water immersion type ultrasonic flaw detection and the upper surface of the copper target assembly is 50 mm;
(2) and (3) calculating the defect rate of a welding layer in the copper target assembly by using 3sigma according to the water immersion type ultrasonic flaw detection diagram in the step (1).
Example 4
The embodiment provides a method for detecting the defect rate of a welding layer in a copper target assembly, which is the same as the embodiment 1 except that the step length in the step (1) is 1.0 mm.
Example 5
The embodiment provides a method for detecting the defect rate of a welding layer in a copper target assembly, which is the same as the embodiment 1 except that the step length in the step (1) is 2.3 mm.
Example 6
The embodiment provides a method for detecting the defect rate of a welding layer in a copper target assembly, which is the same as that in the embodiment 1 except that the frequency of an ultrasonic probe in the step (1) is 10MHz, and the frequency of a filter is 12 MHz.
Example 7
The embodiment provides a method for detecting a defect rate of a welding layer in a copper target assembly, which is the same as that in embodiment 1 except that the upper surface of the copper target assembly is not wiped in step (1).
Example 8
The embodiment provides a method for detecting the defect rate of a welding layer in a copper target assembly, which is the same as the embodiment 1 except that the ultrasonic probe extending into water is not wiped in the step (1).
Example 9
The embodiment provides a method for detecting the defect rate of a welding layer in a copper target assembly, which is the same as the embodiment 1 except that the roughness of the surface of the copper target assembly in the step (1) is 2.5 μm.
Second, comparative example
Comparative example 1
The comparative example provides a method for detecting the defect rate of a welding layer in a copper target assembly, and the method is the same as the method in the embodiment 1 except that the surface polishing treatment is not performed on the copper target assembly in the step (1).
Comparative example 2
The comparative example provides a method for detecting the defect rate of a welding layer in a copper target assembly, and the method is the same as the method in the example 1 except that the frequency of the ultrasonic probe in the step (1) is 14MHz, and the frequency of the filter is 14 MHz.
When the sample to be detected is detected in the embodiment and the comparative example, the standard sample is detected to determine that the defect rate of the standard sample is within the preset range, and then the sample to be detected is detected, wherein the defect rate of the standard sample is within the preset range of 10.62-12.32%, and the defect rate and the qualification rate of the sample are determined by comparing the standard sample with the sample to be detected.
Third, test results
Taking example 1 as an example, the detection of the welding layer in the copper target assembly is performed on a copper target assembly with a target diameter of 400mm, the ultrasonic detection of the standard sample is shown in fig. 2-4, fig. 2 is a standard sample diagram, the ultrasonic detection diagrams and the calculation result diagrams of 10 groups of standard samples are shown in fig. 3 and 4, and the calculation is performed by using a 3sigma method. In the figure, the upper row is a detection diagram, the lower row is a calculation diagram, and A-E represent different sample numbers.
The calculated defect rates are shown in table 1.
TABLE 1
As can be seen from table 1, the method for detecting the defect rate of the welding layer in the copper target assembly provided by the invention can better detect the welding condition of the copper target assembly, and can quantify the defect rate through calculation, thereby improving the objectivity and reliability of quality inspection.
It can be seen from the comprehensive examples 1 and 4-5 that, for a copper target assembly with a diameter of 400mm, the step length is selected to be 1.5mm in example 1, the time consumption is 8min, and the detection effect is good; in the embodiment 4, the step length is 1.0mm, the time consumption is 11min, the time consumption is obviously longer than that in the embodiment 1, and the detection efficiency is greatly reduced; in example 5, the step size is 2.3mm, which results in that the defect rate of the welding layer cannot be detected well and accurately, and therefore, the method provided by the invention can give consideration to both the detection efficiency and the detection effect by selecting a specific step size for the copper target assembly with a specific size.
By combining the embodiment 1, the embodiment 6 and the comparative example 2, it can be seen that in the comparative example 2, the frequency of the ultrasonic probe is adjusted to 14MHz, and the same filter frequency is selected at the same time, but the frequency is too high, the near-field area is long, the medium attenuation is large, and the flaw detection is not facilitated; in embodiment 6, although the original frequency of the ultrasonic probe is maintained, the frequency of the filter is higher than that of the ultrasonic probe, so that the obtained detection result is fuzzy, the interference is large, and the detection result is inaccurate.
It can be seen from the combination of the embodiment 1 and the embodiments 7 to 9 that in the embodiments 7 to 9, the surface of the copper target assembly or the ultrasonic probe extending into the water is not wiped, and the bubbles remaining on the surface reduce the effect of ultrasonic flaw detection and cause serious interference, thereby indicating that the wiping treatment step is added in the invention to improve the detection effect.
By combining example 1 with comparative example 1 and example 9, it can be seen that the roughness of the surface of the copper target assembly is 0.5 μm after polishing treatment in example 1, compared with the roughness of 2.5 μm in example 9 and the roughness of no polishing treatment in comparative example 1, the defect point with the diameter of 0.5mm can be detected in example 1, while the defect point with the diameter of 1.0mm can be detected in example 9, and the defect point with the diameter of 1.0mm can be detected in comparative example 1, thereby showing that the detection accuracy is improved by adding the step of polishing treatment to the surface of the copper target assembly.
In summary, the method for detecting the defect rate of the welding layer in the copper target assembly, provided by the invention, has the advantages that the surface of the copper target assembly is polished and then subjected to water immersion type ultrasonic flaw detection, so that the surface roughness of the copper target assembly can be reduced, the influence of the copper target assembly on the ultrasonic flaw detection is reduced, and the detection effect is improved; and further matching the step length, the frequency of the ultrasonic probe and the frequency of the filter, improving the detection efficiency and better determining the welding effect of the copper target.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A method for detecting the defect rate of a welding layer in a copper target assembly is characterized by comprising the following steps:
(1) placing the copper target assembly subjected to surface polishing treatment in water, and carrying out water immersion type ultrasonic flaw detection on the copper target assembly, wherein the frequency of an ultrasonic probe used for the water immersion type ultrasonic flaw detection is 1-12 MHz;
(2) and (3) calculating the defect rate of a welding layer in the copper target assembly according to the ultrasonic flaw detection diagram obtained in the step (1).
2. The method of claim 1, wherein the roughness Ra of the surface of the copper target assembly after the polishing treatment in step (1) is less than 1.5 μm.
3. The method according to claim 1 or 2, wherein the frequency of the ultrasonic probe used for the water immersion type ultrasonic flaw detection in the step (1) is 10 MHz;
preferably, the frequency of the filter used for the water immersion type ultrasonic flaw detection in the step (1) is 1-12 MHz, and preferably 10 MHz;
preferably, the frequency of the filter used for the water immersion type ultrasonic flaw detection is the same as that of the ultrasonic probe.
4. The method according to any one of claims 1 to 3, wherein the upper surface of the copper target assembly is wiped after the copper target assembly is placed in water in the step (1);
preferably, the ultrasonic probe used for the water immersion type ultrasonic flaw detection is extended into water for detection;
preferably, the ultrasonic probe after being inserted into water is subjected to surface wiping treatment.
5. The method according to any one of claims 1 to 4, wherein the step size of the water immersion type ultrasonic flaw detection in the step (1) is 0.5 to 2.8 mm;
preferably, the focal length of the ultrasonic probe used for the water immersion type ultrasonic flaw detection in the step (1) is 95-105 mm, and preferably 101.6 mm.
6. The method according to claim 5, wherein the diameter of the copper target assembly in the step (1) is 50-240 mm, and the step size of the water immersion type ultrasonic flaw detection is 0.2-0.9 mm, preferably 0.5 mm;
preferably, the diameter of the copper target assembly is 250-350 mm, and the step length of the water immersion type ultrasonic flaw detection is 1.0-1.5 mm, preferably 1.0 mm;
preferably, the diameter of the copper target assembly is 360-500 mm, and the step length of the water immersion type ultrasonic flaw detection is 1.2-2.0 mm, preferably 1.5 mm;
preferably, the diameter of the copper target assembly is 1-4 m, and the step length of the water immersion type ultrasonic flaw detection is 2.0-2.8 mm, preferably 2.5 mm.
7. The method according to any one of claims 1 to 6, wherein the distance between the ultrasonic probe used in the water immersion type ultrasonic flaw detection in step (1) and the upper surface of the copper target assembly is 50 to 65 mm.
8. The method of any one of claims 1 to 7, wherein the calculating in step (2) comprises a 3sigma calculation.
9. The method according to any one of claims 1 to 8, characterized in that it comprises: firstly, detecting the defect rate of a standard sample of a copper target assembly until the defect rate of the standard sample is within a preset range, and then detecting the defect rate of a sample to be detected; otherwise, adjusting parameters of water immersion type ultrasonic flaw detection to detect the defect rate of the standard sample of the copper target assembly again;
preferably, the parameter includes any one or a combination of at least two of the frequency of the ultrasonic probe, the frequency of the filter, the length of the ultrasonic probe extending into the water, the step length or the focal length;
preferably, the preset range is 10.62-12.32%.
10. A method according to any one of claims 1 to 9, characterized in that the method comprises the steps of:
(1) polishing the surface of the copper target component to ensure that the roughness Ra of the surface of the copper target component is less than 1.5 mu m; after the copper target assembly is placed in water, the polished copper target assembly is wiped on the upper surface of the copper target assembly, an ultrasonic probe used for water immersion type ultrasonic flaw detection extends into the water for detection, the ultrasonic probe extending into the water is wiped on the surface, and then the water immersion type ultrasonic flaw detection is carried out on the copper target assembly;
the frequency of the ultrasonic probe used for water immersion type ultrasonic flaw detection is 1-12 MHz, the frequency of the filter is 1-12 MHz, the step length is 0.5-2.8 mm, the focal length of the ultrasonic probe is 95-105 mm, and the distance between the ultrasonic probe used for water immersion type ultrasonic flaw detection and the upper surface of the copper target assembly is 50-65 mm;
(2) calculating the defect rate of a welding layer in the copper target assembly according to the water immersion type ultrasonic flaw detection diagram in the step (1);
performing defect rate detection on a standard sample of the copper target assembly in the steps (1) and (2), and performing defect rate detection on the sample to be detected when the defect rate of the standard sample is within a preset range, or adjusting parameters of water immersion type ultrasonic flaw detection to perform defect rate detection on the standard sample of the copper target assembly again;
the parameters comprise any one or the combination of at least two of the frequency of the ultrasonic probe, the frequency of the filter, the length of the ultrasonic probe extending into water, the step length or the focal length;
the preset range is 10.62-12.32%.
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| CN113579544A (en) * | 2021-08-11 | 2021-11-02 | 宁波江丰电子材料股份有限公司 | Method for detecting welding bonding rate of silicon carbide carbon target material assembly |
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