CN111047547B - Combined defect quantification method based on multi-view TFM - Google Patents
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/50—Image enhancement or restoration by the use of more than one image, e.g. averaging, subtraction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
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- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
- G06T2207/20221—Image fusion; Image merging
Abstract
The invention discloses a combined defect quantification method based on multi-view TFM, which comprises the following steps: respectively calculating TFM image intensities under the selected multiple TFM views; in each mode, according to the known shape and structure of the workpiece, image features directly related to the structure of the workpiece and artifacts of other modes in different views are analyzed and identified, and image features related to defects are identified; dividing different TFM view images, extracting possible defect imaging areas, and obtaining image intensity only containing the defect imaging areas; overlapping and summing the image intensities of different TFM views only comprising the defect imaging area to obtain a multi-view combined TFM image; in the multi-view combined TFM image, defect propagation trends and equivalent sizes are determined using a defect quantification method based on imaging features associated with the defects. The method can better evaluate the damage degree and risk of materials, workpieces or systems by comprehensively utilizing defect information carried by TFM imaging under various visual angles.
Description
Technical Field
The invention relates to the technical field of ultrasonic quantitative nondestructive testing, in particular to a combined defect quantification method based on multi-view TFM.
Background
Nondestructive testing is continually evolving towards quantitative nondestructive testing. Only defects are found to be far from sufficient in Non-destructive testing (Non-destructive testing, NDT), and specific information about the defects, such as size, shape, direction of extension, etc., is further needed to assess the extent of damage to the material, workpiece or system and to better estimate the risk.
There are many methods of defect characterization. The quantitative method based on ultrasonic imaging has the advantage of visual appearance. The full focus imaging technique (Total Focusing Method, TFM) utilizes a full array dataset (Full Matrix Capture, FMC) to achieve point-by-point focusing at any observation point, and can achieve higher resolution than other conventional beam forming methods, becoming a gold standard for imaging quality. Based on the difference of the transmitting path and the receiving path during ultrasonic transmission, the method is divided into 3 types of direct, half-skip and full-skip TFM. Depending on whether there is a bulk wave mode conversion in different modes during transmission, it is possible to continue to divide into different modes or views. Currently, TFM imaging is evolving in commercial settings, and multi-mode TFM imaging is also a new corner of the head. However, TFM-based defect quantification is still limited to imaging using only a single path or mode. When a defect family or a defect of a relatively large extension is present in the workpiece or when the beam accessibility of the detection range is not good, different defects or different defect sites may be detected in some different TFM views, while the intensity is very weak or hardly visible in other TFM views. TFM imaging with different paths and different wave modes is comprehensively used, full-array echo signals can be fully utilized to image different parts of the defect, information about the size or orientation of the defect is furthest mined, and the possibility of underquantification or missed detection during defect quantification is effectively avoided. From the above, it is known that when there is a certain extension range in the thickness direction of the workpiece or there is a defect group in the target area or the defect orientation is difficult to detect, only partial defect information can be obtained based on the single TFM view quantification method, the defect trend is difficult to judge, the quantification result is often lower than the actual value, sometimes even the defect cannot be found, and the misjudgment of the detection result is easy to cause.
Disclosure of Invention
The invention aims to obtain more characteristic information of a defect area in a workpiece or material and more accurately and quantitatively estimate the defect trend or extension range, such as determining the length, extension direction and even shape of the defect, and overcome the defects and limitations when defect quantification is performed based on a single TFM view.
The invention provides a joint defect quantification method based on multi-view TFM. The method combines TFM imaging from different views to image and characterize the defect morphology for the detection case of one defect set or a large extended range of defects in the vertical direction of the workpiece or material. Selecting and utilizing several main TFM views to perform TFM imaging to obtain a B scanning image; forming corresponding sub-view images through defect feature identification, segmentation and extraction; combining the sub-view images into a combined TFM image; using the combined TFM images, the underlying quantitative method is used to estimate the defect's trend, shape or size in the vertical direction.
To achieve the above object, the present invention provides a joint defect quantification method based on multi-view TFM, the method comprising:
respectively calculating TFM image intensities under the selected multiple TFM views;
in each mode, according to the known shape and structure of the workpiece, image features directly related to the structure of the workpiece and artifacts of other modes in different views are analyzed and identified, and image features related to defects are identified;
dividing different TFM view images, extracting possible defect imaging areas, and obtaining image intensity only containing the defect imaging areas;
overlapping and summing the image intensities of different TFM views only comprising the defect imaging area to obtain a multi-view combined TFM image;
in the multi-view combined TFM image, defect propagation trends and equivalent sizes are determined using a defect quantification method based on imaging features associated with the defects.
As an improvement of the above method, the method further comprises: selecting a plurality of TFM views; wherein one TFM view is a combination of a transmit path and a receive path, and different bulk wave modes in the transmit and receive paths; i.e. either transverse or longitudinal or only transverse or only longitudinal.
As an improvement of the above method, the calculating unit calculates TFM image intensities under the selected plurality of TFM views; the method specifically comprises the following steps:
TFM image intensity I for kth TFM view k (r) is:
wherein a is ij (r) represents an amplitude apodization weighting factor; t is t ij (r) represents the propagation time of ultrasonic waves in a path received by the ith array element from reaching the current target pixel point r and returning to the jth array element, and N is the total number of the array elements;representing echo signal f ij The analysis signal of (t) is f ij Hilbert transform of (t).
As an improvement of the method, for the TFM view of the direct path, t, for both the L-L, S-S, S-L, L-S transmit path and the receive path ij The calculation of (r) uses equations (1), (2) as follows:
t ij (r)＝t i +t j (1)
wherein d Di Representing a direct path sound path from the transmitting array element i to the target point; d, d Dj Representing a direct path from a target point to a receiving array element j; c 1 And c 2 The value is longitudinal wave sound velocity cL or transverse wave sound velocity c depending on the bulk wave mode S 。
As an improvement to the above method, for LL-SL, LL-SS, LL-LS, LL-LL, LS-LS, LS-SS, LS-SL transmit and receive paths each contain a TFM view of the interface reflection process; t is t ij The calculation of (r) uses the formulas (1), (3) as follows:
t ij (r)＝t i +t j (1)
wherein d iF1 、d iF2 Representing two sections in a full-span type transmitting path of the transmitting array element i, namely the distance from the transmitting array element i to the workpiece interface reflecting point and the distance from the workpiece interface reflecting point to the target point; d, d jF1 、d jF2 Representing two sections in a full-span receiving path of the receiving array element j, namely the distance from the workpiece interface reflecting point to the receiving array element j and the distance from the target point to the workpiece interface reflecting point; c i1 And c i2 、c j1 And c j2 The value is the longitudinal wave sound velocity c depending on the bulk wave mode L Or transverse wave sound velocity c S 。
As an improvement to the above method, for LL-SL, LL-SS, LL-LS, LL-LL, LS-LS, LS-SS, LS-SL transmit and receive paths each contain a TFM view of the interface reflection process; t is t ij The calculation of (r) uses the formulas (1), (4) as follows:
t ij (r)＝t i +t j (1)
the invention has the advantages that:
aiming at the situation that a defect group exists in a defect or a target area with a certain extending range along the thickness direction of a workpiece or a material, different areas of the defect or different defects are imaged by combining the multi-view TFM, and defect information such as extending trend, shape, size and the like of the defect area is further determined on the basis. The method combines various view TFM, combines different TFM images to obtain richer defect information by utilizing the advantages that different view TFM carries information of different defects in different positions or defect groups of defects, and can more accurately quantify the defects, so that a worker can further evaluate and process workpieces or materials according to defect quantification results.
Drawings
FIG. 1 is a flow chart of a joint defect quantification method based on multi-view TFM of the present invention;
FIG. 2 is a schematic diagram of the transmit or receive path of the transducer when in direct contact with the workpiece;
FIG. 3 is a view of different TFMs corresponding to different areas of detected defects;
FIG. 4 is a schematic diagram of an array, test block and defect in an embodiment of the invention;
FIG. 5 (a) is an imaging of a TFM view of L-L of the invention;
FIG. 5 (b) is an imaging of a TFM view of LL-LL of the present invention;
FIG. 5 (c) is an imaging of a TFM view of the L-LL of the present invention;
FIG. 6 (a) is a segmentation and extraction result of a defect-related image region of the TFM view of L-L of the present invention;
FIG. 6 (b) is a segmentation and extraction result of defect-related image regions of the TFM view of LL-LL of the present invention;
FIG. 6 (c) is a segmentation and extraction result of a defect-related image region of the TFM view of L-LL of the present invention;
FIG. 7 (a) is a schematic diagram of defect quantification in combination with multi-view TFM;
fig. 7 (b) is a schematic diagram of defect extension length quantification.
Detailed Description
The technical scheme of the invention is described in detail below with reference to the accompanying drawings.
Aiming at the detection situation that a defect group exists in the vertical direction of a workpiece or a material or the defect with a larger expansion range exists, a plurality of main TFM views are selected and utilized for TFM imaging to obtain a B scanning image; forming corresponding sub-view images through defect feature identification, segmentation and extraction; combining the sub-view images into a combined TFM image; using the combined TFM images, the underlying quantitative method is used to estimate the defect's trend, shape or size in the vertical direction. And the accuracy of defect quantification is improved by comprehensively utilizing defect information carried by TFM imaging under various visual angles.
As shown in fig. 1, the present invention provides a joint defect quantification method based on multi-view TFM, taking a situation that a transducer directly contacts a workpiece surface during detection as an example, specifically including the following steps:
step 1) analyze, determine and select several main TFM paths and views.
Depending on the actual detection conditions and conditions, which of the main possible acoustic propagation view modes are is analyzed and selected, and from these several are selected typically for defect quantification. The characteristics of the shape and the size of the workpiece, the relative position between the workpiece and the transducer, the reachable position and depth of the ultrasonic beam in the workpiece, the expected detectable defect shape and orientation and the like are comprehensively considered during selection. One view refers to one transmit path and receive path, and a combination of different bulk wave modes in the transmit and receive paths. The transmitting path refers to the path of the ultrasonic wave from the array element i to the defect surface, and the receiving path refers to the path of the ultrasonic wave from the defect surface to the array element j. The transmitting or receiving path can be further divided into two cases, as shown in fig. 2, one is that the sound wave does not pass through the reflection of the surface of the workpiece during the propagation, and the sound wave directly reaches the defect by the array element or directly returns to the array element by the defect, which is called a direct path, and the sound velocity on the path is c. The other is the reflection from the surface of the workpiece during which the reflection process may cause a change in bulk wave mode, where the transmit or receive path is split into two segments, one segment between the element and the workpiece interface and one segment between the workpiece interface and the defect, referred to as a crossover path. The sound speeds of the two sections may be different, respectively using c 1 And c 2 And (3) representing. In the first case, if the acoustic wave is reflected at the defective surface, the sound speed of the transmitting path and the sound speed in the receiving path may also be different. c. c 1 And c 2 Depending on the bulk wave mode, the value may be the longitudinal wave (Longitudinal wave) sound velocity c L Or transverse wave sound velocity c S 。
When the transmit or receive paths are different, different defects in different areas of the defect or groups of defects can be imaged as shown in fig. 3. The TFM of a certain view is recorded in a mode of 'transmitting path wave mode-receiving path wave mode'. For example, when the transmitting path is direct, the receiving path is longitudinal wave, the first sound path is longitudinal wave, the second sound path is transverse wave, the corresponding TFM view is L-LS; when the transmission path is spanned, the first and second segments of sound paths are longitudinal waves, the receiving path is spanned, and the first and second segments are transverse waves, the corresponding TFM view is denoted LL-SS.
Depending on the actual detection conditions and conditions, which of the main possible acoustic propagation paths and modes are is analyzed and selected. The characteristics of the shape and the size of the workpiece, the relative position between the workpiece and the transducer, the reachable position and depth of the ultrasonic beam in the workpiece, the shape and the orientation of the defect expected to be detected and the like are comprehensively considered during selection. For the case shown in fig. 4, three main views L-L, LL-LL and L-LL are selected for joint TFM imaging, because the ultrasound echo signals in these three views are relatively strong, and the overall depth of detection range that can be covered is relatively large. Other TFM views may be selected for association.
Step 2) calculating the TFM image intensities I of the several principal views determined in step 1), respectively k 。
Step 201) calculate the delay law t under different views ij I.e. the delay in transmission by element i, reception by element j, including the delay t on the transmit path i And delay t on the receive path j 。
TFM view, t, for both transmit and receive paths, L-L, S-S, S-L, L-S, etc., as direct path ij The calculation of (r) uses equations (1), (2) as follows:
t ij (r)＝t i +t j (1)
wherein d Di Representing a direct path sound path from the transmitting array element i to the target point; d, d Dj Representing a direct path from a target point to a receiving array element j; c 1 And c 2 Depending on the bulk wave mode, the value may be the longitudinal wave sound velocity c L Or transverse wave sound velocity c S 。
For a TFM view of the interface reflection process contained in the transmit and receive paths of LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL, etc., t ij The calculation of (r) adopts the formulas (1) and (3):
wherein d iF1 、d iF2 Representing two sections in a full-span type transmitting path of the transmitting array element i, namely the distance from the transmitting array element i to the workpiece interface reflecting point and the distance from the workpiece interface reflecting point to the target point; d, d jF1 、d jF2 And two sections in the full-span receiving path of the receiving array element j are represented, namely, the distance from the workpiece interface reflection point to the receiving array element j and the distance from the target point to the workpiece interface reflection point. c i1 And c i2 、c j1 And c j2 Depending on the bulk wave mode, the value may be the longitudinal wave sound velocity c L Or transverse wave sound velocity c S 。
For TFM views, t, of the transmission and reception paths of LL-L, LS-L, LL-S, LS-S, L-SL, L-LL, L-SS, L-LS, etc. with only one path containing an interface reflection process ij The calculation of (r) adopts the formulas (1) and (4):
wherein d Di Representing a direct path sound path from the transmitting array element i to the target point; d, d jF1 、d jF2 Representing the full reception array element jAnd two sections in the straddle type receiving path, namely the distance from the workpiece interface reflecting point to the receiving array element j and the distance from the target point to the workpiece interface reflecting point. c i 、c j1 And c j2 Depending on the bulk wave mode, the value may be the longitudinal wave sound velocity c L Or transverse wave sound velocity c S 。
Step 202) for each view, intensity I of TFM image k Can be expressed as follows:
where k represents a certain TFM view form, three modes are selected in this embodiment, and k=1, 2, and 3.a, a ij (r) represents an amplitude apodization weighting factor, let a here ij (r) =1 (rectangular window function), in practice a ij (r) other forms of window functions may be selected; t is t ij (r) represents the propagation time of the ultrasonic wave in the path received from the ith element to the current target pixel point r and back to the jth element, and the calculation process is referred to step 201.(t ij (r)) represents the echo signal f ij The analysis signal of (t) is f ij Hilbert transform of (t). Each TFM view differs mainly in the calculation process in t ij (r) the reason for this difference is mainly two: firstly, different sound propagation paths in different modes can lead to different sound paths; and secondly, the sound velocity is caused by different sound propagation wave modes under different modes.
Step 3) identification of defect signals, different pattern artifacts, other interference signals related to the shape and structure of the workpiece.
In each mode, image features and other modes directly related to the workpiece structure itself in the various views are identified by analysis based on known workpiece shapes and structures, and imaging related to the defect is identified.
According to the shape and structural characteristics of the workpiece, it can be presumed that the echo signal at the depth of 20mm corresponds to the bottom surface of the workpiece, and is an image feature directly related to the structure of the workpiece itself, as shown in fig. 5 (a) to 5 (c), and marked with a rectangular dotted line frame. The other signals are suspicious signals related to the defect, and are marked by oval dotted boxes in fig. 5 (a) to 5 (c), so that the image features possibly related to the defect are identified.
Step 4) extracting edges of images of different views, and segmenting possible defect imaging areas to extract an image I 'only containing the defect imaging areas' k And displays the images in accordance with a specific dynamic range as shown in fig. 6 (a) to 6 (c).
Step 5) image I' k Superposition and summation are carried out, and a combined multi-view TFM image I is obtained:
I＝∑ k I’ k (6)
as shown in fig. 7 (a).
Step 6) in the combined multi-view TFM image I, determining the defect extension trend and possible equivalent size using specific defect quantification methods, such as equivalent defect quantification methods, etc., based on the imaging characteristics associated with the defect.
The uppermost and lowermost endpoints of the defect in the image are found as shown in fig. 7 (b). The vertical distance between the two is the possible longitudinal extension of the defect in the depth direction, which is determined to be 9.6mm.
Aiming at the detection situation that a defect group exists in the vertical direction of a workpiece or a material and a defect with a large expansion range exists in a target area, longitudinal waves are mainly considered in the waveform, the defect area is imaged by combining TFM (thin film transistor) of three views, and then the defect information such as the size, the expansion trend and the like of the defect area is determined by a special quantitative method. The method combines the different imaging characteristics of three view TFM to obtain more relevant defect information, and can more accurately quantify the defects, so that a worker can accurately estimate and process workpieces or materials according to the defect quantification result.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and are not limiting. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the appended claims.
Claims (6)
1. A joint defect quantification method based on multi-view TFM, the method comprising:
respectively calculating TFM image intensities under the selected multiple TFM views;
in each mode, according to the known shape and structure of the workpiece, image features directly related to the structure of the workpiece and artifacts of other modes in different views are analyzed and identified, and image features related to defects are identified;
dividing different TFM view images, extracting possible defect imaging areas, and obtaining image intensity only containing the defect imaging areas;
overlapping and summing the image intensities of different TFM views only comprising the defect imaging area to obtain a multi-view combined TFM image;
in the multi-view combined TFM image, defect propagation trends and equivalent sizes are determined using a defect quantification method based on imaging features associated with the defects.
2. The joint defect quantification method of claim 1, wherein the method further comprises: selecting a plurality of TFM views; wherein one TFM view is a combination of a transmit path and a receive path, and different bulk wave modes in the transmit and receive paths; i.e. either transverse or longitudinal or only transverse or only longitudinal.
3. The joint defect quantification method based on multi-view TFM of claim 2, wherein the separately computing TFM image intensities under the selected plurality of TFM views; the method specifically comprises the following steps:
TFM image intensity I for kth TFM view k (r) is:
wherein a is ij (r) represents an amplitude apodization weighting factor; t is t ij (r) represents the propagation time of ultrasonic waves in a path received by the ith array element from reaching the current target pixel point r and returning to the jth array element, and N is the total number of the array elements;representing echo signal f ij The analysis signal of (t) is f ij Hilbert transform of (t).
4. The joint defect quantification method of claim 3, wherein for TFM views, t, for both the L-L, S-S, S-L, L-S transmit path and the receive path are direct paths ij The calculation of (r) uses equations (1), (2) as follows:
t ij (r)＝t i +t j (1)
wherein d Di Representing a direct path sound path from the transmitting array element i to the target point; d, d Dj Representing a direct path from a target point to a receiving array element j; c 1 And c 2 The value is the longitudinal wave sound velocity c depending on the bulk wave mode L Or transverse wave sound velocity c S 。
5. A joint defect quantification method based on multi-view TFM according to claim 3, wherein for LL-SL, LL-SS, LL-LS, LL-LL, LS-LS, LS-SS, LS-SL transmit and receive paths each contain a TFM view of the interfacial reflection process; t is t ij The calculation of (r) uses the formulas (1), (3) as follows:
t ij (r)＝t i +t j (1)
wherein d iF1 、d iF2 Representing two sections in a full-span type transmitting path of the transmitting array element i, namely the distance from the transmitting array element i to the workpiece interface reflecting point and the distance from the workpiece interface reflecting point to the target point; d, d jF1 、d jF2 Representing two sections in a full-span receiving path of the receiving array element j, namely the distance from the workpiece interface reflecting point to the receiving array element j and the distance from the target point to the workpiece interface reflecting point; c i1 And c i2 、c j1 And c j2 The value is the longitudinal wave sound velocity c depending on the bulk wave mode L Or transverse wave sound velocity c S 。
6. A joint defect quantification method based on multi-view TFM according to claim 3, wherein for TFM views of the interface reflection process, one and only one of the transmit and receive paths of LL-L, LS-L, LL-S, LS-S, L-SL, L-LL, L-SS, L-LS; t is t ij The calculation of (r) uses the formulas (1), (4) as follows:
t ij (r)＝t i +t j (1)
wherein d Di Representing a direct path sound path from the transmitting array element i to the target point; d, d jF1 、d jF2 Representing two sections in a full-span receiving path of the receiving array element j, namely the distance from the workpiece interface reflecting point to the receiving array element j and the distance from the target point to the workpiece interface reflecting point; c i 、c j1 And c j2 The value is the longitudinal wave sound velocity c depending on the bulk wave mode L Or transverse wave sound velocity c S 。
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