CN111047547A - Combined defect quantification method based on multi-view TFM - Google Patents

Combined defect quantification method based on multi-view TFM Download PDF

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CN111047547A
CN111047547A CN201911300912.XA CN201911300912A CN111047547A CN 111047547 A CN111047547 A CN 111047547A CN 201911300912 A CN201911300912 A CN 201911300912A CN 111047547 A CN111047547 A CN 111047547A
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韩晓丽
吴文焘
曹政
周二磊
肖灵
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Abstract

The invention discloses a joint defect quantification method based on multi-view TFM, which comprises the following steps: respectively calculating TFM image intensities under the selected multiple TFM views; in each mode, according to the known shape and structure of the workpiece, analyzing and identifying image features directly related to the workpiece structure and artifacts of other modes in different views, and identifying image features related to defects; segmenting different TFM view images, extracting possible defect imaging areas, and obtaining the image intensity only containing the defect imaging areas; superposing and summing the image intensities of different TFM views, which only contain a defect imaging area, to obtain a multi-view combined TFM image; in the multi-view joint TFM image, a defect extension trend and an equivalent size are determined using a defect quantification method according to imaging characteristics related to defects. The method can better evaluate the damage degree and risk of the material, the workpiece or the system by comprehensively utilizing the defect information carried by the TFM imaging under various visual angles.

Description

Combined defect quantification method based on multi-view TFM
Technical Field
The invention relates to the technical field of ultrasonic quantitative nondestructive testing, in particular to a joint defect quantification method based on multi-view TFM.
Background
Nondestructive testing is continuously developing towards quantitative nondestructive testing. It is far from sufficient to find defects in Non-destructive testing (NDT), and further knowledge of specific information of the defects, such as defect characteristics of size, shape, extension direction, etc., is required, which helps to evaluate the damage degree of the material, workpiece or system and better estimate the risk level.
There are many methods of defect characterization. The quantification method based on ultrasonic imaging has the advantage of intuitive image. The Total Focusing imaging Technology (TFM) utilizes a Full array data set (FMC) to realize point-by-point Focusing at any observation point, and can realize higher resolution compared with other conventional beam forming methods, thereby becoming a golden standard of imaging quality. Based on the difference between the transmitting path and the receiving path during the ultrasonic transmission, the method is divided into 3 types of direct, half-skip and full-skip TFM. Depending on whether there is a conversion of bulk wave modes in different modes during transmission, the division into different modes or views can be continued. TFM imaging is now emerging in commercial settings, as is multimode TFM imaging. However, TFM-based defect quantification is still limited to imaging using only a single path or mode. When a family of defects or defects of relatively large extent occur in the workpiece or when the acoustic beam accessibility of the detection range is poor, different defects or different defect sites may be detected in some different TFM views and weak or hardly visible in other TFM views. TFM imaging of different paths and different wave modes is comprehensively used, full-array echo signals can be fully utilized to image different parts of the defect, information related to the size or orientation of the defect is mined to the maximum extent, and the possibility of under-quantification or missing detection during defect quantification is effectively avoided. From the above, when a certain extension range exists in the thickness direction of the workpiece or a defect group exists in a target region or the defect orientation is difficult to detect, the quantitative method based on a single TFM view can only obtain partial defect information, the defect trend is difficult to judge, the quantitative result is often lower than the actual value, sometimes even the defect cannot be found, and the misjudgment of the detection result is easy to cause.
Disclosure of Invention
The invention aims to obtain more characteristic information of a defect area in a workpiece or material and perform more accurate quantitative estimation on defect trend or extension range, such as determining the length, extension direction and even shape of a defect, and overcome the defects and limitations in defect quantification based on a single TFM view.
The invention provides a joint defect quantification method based on multi-view TFM. The method combines TFM imaging of different views to image and characterize the defect morphology for the detection of the presence of a defect group or defect with a large extended range in the vertical direction of the workpiece or material. Selecting and utilizing several main TFM views to carry out TFM imaging to obtain a B scanning image; forming a corresponding sub-view image through defect feature identification, segmentation and extraction; combining the sub-view images into a combined TFM image; the trend, shape or size of the defect in the vertical direction is estimated using a basic quantitative method using the combined TFM image.
In order to achieve the above object, the present invention provides a multi-view TFM-based joint defect quantification method, including:
respectively calculating TFM image intensities under the selected multiple TFM views;
in each mode, according to the known shape and structure of the workpiece, analyzing and identifying image features directly related to the workpiece structure and artifacts of other modes in different views, and identifying image features related to defects;
segmenting different TFM view images, extracting possible defect imaging areas, and obtaining the image intensity only containing the defect imaging areas;
superposing and summing the image intensities of different TFM views, which only contain a defect imaging area, to obtain a multi-view combined TFM image;
in the multi-view joint TFM image, a defect extension trend and an equivalent size are determined using a defect quantification method according to imaging characteristics related to defects.
As an improvement of the above method, the method further comprises: selecting a plurality of TFM views; wherein, a TFM view is a combination of different bulk wave modes in a transmitting path and a receiving path, and the transmitting path and the receiving path; i.e. possibly shear or longitudinal or shear only or longitudinal.
As an improvement of the above method, the TFM image intensities under the selected multiple TFM views are calculated respectively; the method specifically comprises the following steps:
TFM image intensity I of kth TFM viewk(r) is:
Figure BDA0002321746890000021
wherein, aij(r) represents an amplitude apodization weighting factor; t is tij(r) represents the propagation time of the ultrasonic wave in the path from the ith array element to the current target pixel point r and then returning to the jth array element for receiving, wherein N is the total number of the array elements;
Figure BDA0002321746890000031
representing an echo signal fij(t) is an analytic signal of fij(t) Hilbert transform.
As an improvement of the above process, the process is carried out for L-L, S-S, S-L,TFM view of L-S transmit and receive paths both direct type paths, tijThe formula (1) and (2) are used for calculating (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure BDA0002321746890000032
wherein d isDiRepresenting a direct type path sound path from a transmitting array element i to a target point; dDjRepresenting a direct type path sound path from a target point to a receiving array element j; c. C1And c2Depending on the bulk wave mode, the value is longitudinal wave sound velocity cL or transverse wave sound velocity cS。
As an improvement to the above method, TFM views of the interface reflection process are included in the transmit and receive paths for LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL; t is tijThe formula (1) and the formula (3) are adopted in the calculation of (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure BDA0002321746890000033
wherein d isiF1、diF2Two sections of a full-span type transmitting path of a transmitting array element i are shown, namely the distance from the transmitting array element i to a workpiece interface reflecting point and the distance from the workpiece interface reflecting point to a target point; djF1、djF2Two sections of a full-span receiving path of a receiving array element j are shown, namely the distance from a workpiece interface reflection point to the receiving array element j and the distance from a target point to the workpiece interface reflection point; c. Ci1And ci2、cj1And cj2Depending on the bulk wave mode, the value is the longitudinal sound velocity cLOr transverse wave sound velocity cS。
As an improvement to the above method, TFM views of the interface reflection process are included in the transmit and receive paths for LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL; t is tijThe formula (1) and the formula (4) are adopted in the calculation of (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure BDA0002321746890000034
the invention has the advantages that:
the invention aims at the situation that a defect or a target area with a certain extension range along the thickness direction of a workpiece or a material has a defect group, different areas of the defect or different defects are imaged by combining a multi-view TFM, and defect information such as extension tendency, shape, size and the like of the defect area is further determined on the basis. The method combines a plurality of view TFMs, combines different try TFM images by using the advantage that different view TFMs carry information of different defects at different parts of the defects or in a defect group to obtain richer defect information, and can quantify the defects more accurately, so that workers can further evaluate and process workpieces or materials according to the defect quantification result.
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FIG. 1 is a flow chart of the multi-view TFM-based joint defect quantification method of the present invention;
FIG. 2 is a schematic view of the transmit or receive path of the transducer in direct contact with the workpiece;
FIG. 3 is a view of different TFMs corresponding to different regions of a detected defect;
FIG. 4 is a schematic diagram of an array, test blocks and defects in an embodiment of the invention;
FIG. 5(a) is an imaging of TFM views of L-L of the present invention;
FIG. 5(b) is an imaging of a TFM view of LL-LL of the present invention;
FIG. 5(c) is an imaging of a TFM view of the L-LL of the present invention;
FIG. 6(a) is the segmentation and extraction result of the defect-related image region of the TFM view of L-L of the present invention;
FIG. 6(b) is the segmentation and extraction result of the defect-related image area of the TFM view of LL-LL of the present invention;
FIG. 6(c) is the segmentation and extraction result of the defect-related image area of the TFM view of the L-LL of the present invention;
FIG. 7(a) is a schematic of defect quantification for a combined multi-view TFM;
FIG. 7(b) is a schematic diagram showing the quantification of the defect extension length.
Detailed Description
The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.
Aiming at the detection situation that a defect group or a defect with a larger extension range exists in the vertical direction of a workpiece or a material, the invention selects and utilizes a plurality of main TFM views to carry out TFM imaging to obtain a B scanning image; forming a corresponding sub-view image through defect feature identification, segmentation and extraction; combining the sub-view images into a combined TFM image; the trend, shape or size of the defect in the vertical direction is estimated using a basic quantitative method using the combined TFM image. The defect information carried by TFM imaging under various visual angles is comprehensively utilized, and the accuracy of defect quantification is improved.
As shown in fig. 1, the present invention provides a joint defect quantification method based on multi-view TFM, taking the situation that a transducer directly contacts the surface of a workpiece as an example during detection, specifically including the following steps:
step 1) several major TFM paths and views are analyzed, determined and selected.
According to actual detection conditions and situations, analyzing and selecting which are the main possible sound propagation view modes, and selecting representative ones from the sound propagation view modes for defect quantification. The shape and size of the workpiece, the relative position between the workpiece and the transducer, the position and depth of an actual system in the workpiece, the shape and orientation of a defect expected to be detected and the like are comprehensively considered during selection. One view refers to a combination of different bulk wave modes in the transmit and receive paths, and the transmit and receive paths. The transmitting path refers to the path of the ultrasonic wave from the array element i to the surface of the defect, and the receiving path refers to the path of the ultrasonic wave from the surface of the defect to the array element j. Both the transmission and reception paths can be further divided into two cases, one in which the sound wave does not pass through during propagation, as shown in fig. 2The reflection passing through the surface of the workpiece directly reaches the defect from the array element or directly returns to the array element from the defect, and is called a direct path, and the sound velocity on the path is c. The other is reflection from the surface of the workpiece, which may cause the conversion of bulk wave modes, where the transmission or reception path is divided into two sections, one between the array element and the workpiece interface and one between the workpiece interface and the defect, called a cross-over path. The sound velocities of the two sections may be different, respectively by c1And c2And (4) showing. In the first case, if the sound wave is reflected at the defect surface, the sound velocity in the transmit path and the sound velocity in the receive path may also be different. c. c. C1And c2Depending on the bulk wave mode, the value may be the longitudinal wave (Longitudinalwave) sound velocity cLOr transverse wave (shear) sound velocity cS。
When the transmit or receive paths are different, different regions of the defect or different defects in a defect population can be imaged as shown in fig. 3. The TFM of a certain view is recorded by adopting a mode of 'transmitting path wave mode-receiving path wave mode'. For example, when the transmission path is a direct type and is a longitudinal wave, the reception path is a cross type, and the first-segment acoustic path is a longitudinal wave, and the second-segment acoustic path is a transverse wave, the corresponding TFM view is marked as L-LS; when the transmission path is cross-over, and the first and second acoustic paths are both longitudinal waves, the reception path is cross-over, and the first and second segments are both transverse waves, the corresponding TFM view is denoted as LL-SS.
Which of the main possible acoustic propagation paths and modes are analyzed and selected according to the actual detection conditions and situations. The shape and size of the workpiece, the relative position between the workpiece and the transducer, the position and depth of an actual system in the workpiece, the shape and orientation of a defect expected to be detected and the like are comprehensively considered during selection. For the situation shown in fig. 4, three main views L-L, LL-LL and L-LL are selected for joint TFM imaging, because the ultrasonic echo signals in the three views are relatively strong, and the overall detection depth range can be covered. Other TFM views may additionally be selected for association.
Step 2) calculating in step 1) respectivelyDetermined TFM image intensities I of several primary viewsk。
Step 201) calculating the delay rule t under different viewsijI.e. the delay in transmission by element i and reception by element j, includes the delay t in the transmission pathiAnd delay t on the receive pathj。
For TFM views where the transmit and receive paths, L-L, S-S, S-L, L-S, etc., are both direct-type paths, tijThe formula (1) and (2) are used for calculating (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure BDA0002321746890000061
wherein d isDiRepresenting a direct type path sound path from a transmitting array element i to a target point; dDjRepresenting a direct type path sound path from a target point to a receiving array element j; c. C1And c2Depending on the bulk wave mode, the value may be the longitudinal sound velocity cLOr transverse wave sound velocity cS。
For TFM views, t, containing interfacial reflection processes in the transmit and receive paths of LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL, etcijThe formula (1) and the formula (3) are adopted for calculation:
Figure BDA0002321746890000062
wherein d isiF1、diF2Two sections of a full-span type transmitting path of a transmitting array element i are shown, namely the distance from the transmitting array element i to a workpiece interface reflecting point and the distance from the workpiece interface reflecting point to a target point; djF1、djF2Two sections of the full-span receiving path of the receiving array element j are shown, namely the distance from the workpiece interface reflection point to the receiving array element j and the distance from the target point to the workpiece interface reflection point. c. Ci1And ci2、cj1And cj2Depending on the bulk wave mode, the value may be the longitudinal sound velocity cLOr transverse wave sound velocity cS。
For TFM views, t, where only one and only one of the transmit and receive paths LL-L, LS-L, LL-S, LS-S, L-SL, L-LL, L-SS, L-LS, etc. contains interfacial reflection processesijThe formula (1) and the formula (4) are adopted for calculation:
Figure BDA0002321746890000063
wherein d isDiRepresenting a direct type path sound path from a transmitting array element i to a target point; djF1、djF2Two sections of the full-span receiving path of the receiving array element j are shown, namely the distance from the workpiece interface reflection point to the receiving array element j and the distance from the target point to the workpiece interface reflection point. c. Ci、cj1And cj2Depending on the bulk wave mode, the value may be the longitudinal sound velocity cLOr transverse wave sound velocity cS。
Step 202) intensity I of the TFM image for each viewkCan be expressed as follows:
Figure BDA0002321746890000071
where k denotes a certain TFM view format, three modes are selected in this embodiment, and k is 1, 2, and 3. a isij(r) represents the amplitude apodization weighting factor, let aij(r) ═ 1 (rectangular window function), in practice aij(r) other window function forms may be selected; t is tij(r) represents the propagation time of the ultrasonic wave in the path from the ith array element to the current target pixel point r and then returning to the jth array element for receiving, and the calculation process refers to step 201).
Figure BDA0002321746890000072
(tij(r)) represents the echo signal fij(t) is an analytic signal of fij(t) Hilbert transform. The main difference in the calculation process of each TFM view is tij(r), there are two main reasons for this difference: firstly, different sound propagation paths in different modes lead to different sound paths; secondly, different acoustic propagation wave modes under different modes are guidedResulting in different speeds of sound.
Step 3) identification of defect signals, different pattern artifacts, other interference signals related to workpiece shape and structure.
In each mode, image features directly related to the workpiece structure itself and artifacts of other modes in different views are analytically identified based on known workpiece shape and structure, identifying the imaging associated with the defect.
From the shape and structural characteristics of the workpiece, it can be estimated that the echo signal at the depth of 20mm corresponds to the bottom surface of the workpiece and is an image feature directly related to the structure of the workpiece itself, and as shown in fig. 5(a) to 5(c), the echo signal is marked by a rectangular dashed frame. Other signals are suspicious signals related to the defect, as indicated by the dashed oval boxes in fig. 5(a) -5 (c), and these image features that may be related to the defect are identified.
Step 4) edge extraction is carried out on the images of different views, segmentation processing is carried out on possible defect imaging areas, and an image I 'only containing the defect imaging areas is extracted'kAnd displays are performed in accordance with the specific dynamic range, as shown in fig. 6(a) to 6 (c).
Step 5) preparing an image I'kAnd superposing and summing to obtain a combined multi-view TFM image I:
I＝∑kI’k(6)
as shown in fig. 7 (a).
And 6) determining the defect extension trend and the possible equivalent size in the combined multi-view TFM image I by using a specific defect quantification method, such as an equivalent defect quantification method and the like, according to the imaging characteristics related to the defects.
The uppermost and lowermost end points of the defect in the image are found as shown in fig. 7 (b). The vertical distance between the two is the possible longitudinal extension of the defect in the depth direction, here determined to be 9.6 mm.
The invention aims at the detection situation that the workpiece or the material has extended defects in the vertical direction and a defect group or a defect with a larger extension range exists in a target area, longitudinal waves are mainly considered in a waveform, the TFM of three views is combined to image the defect area, and then a special quantitative method is utilized to determine the defect information such as the size, the extension trend and the like of the defect area. The method combines different imaging characteristics of three views TFM to obtain more defect related information, and can quantify the defects more accurately, so that workers can accurately estimate and process workpieces or materials according to the defect quantification result.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (6)

1. A method for joint defect quantification based on multi-view TFM, the method comprising:
respectively calculating TFM image intensities under the selected multiple TFM views;
in each mode, according to the known shape and structure of the workpiece, analyzing and identifying image features directly related to the workpiece structure and artifacts of other modes in different views, and identifying image features related to defects;
segmenting different TFM view images, extracting possible defect imaging areas, and obtaining the image intensity only containing the defect imaging areas;
superposing and summing the image intensities of different TFM views, which only contain a defect imaging area, to obtain a multi-view combined TFM image;
in the multi-view joint TFM image, a defect extension trend and an equivalent size are determined using a defect quantification method according to imaging characteristics related to defects.
2. The multi-view TFM-based joint defect quantification method of claim 1, further comprising: selecting a plurality of TFM views; wherein, a TFM view is a combination of different bulk wave modes in a transmitting path and a receiving path, and the transmitting path and the receiving path; i.e. possibly shear or longitudinal or shear only or longitudinal.
3. The method according to claim 2, wherein the TFM image intensities under the selected TFM views are calculated respectively; the method specifically comprises the following steps:
TFM image intensity I of kth TFM viewk(r) is:
Figure FDA0002321746880000011
wherein, aij(r) represents an amplitude apodization weighting factor; t is tij(r) represents the propagation time of the ultrasonic wave in the path from the ith array element to the current target pixel point r and then returning to the jth array element for receiving, wherein N is the total number of the array elements;
Figure FDA0002321746880000012
representing an echo signal fij(t) is an analytic signal of fij(t) Hilbert transform.
4. The multi-view TFM-based joint defect quantification method of claim 3, wherein t is the TFM view of the L-L, S-S, S-L, L-S transmit path and receive path which are both direct type pathsijThe formula (1) and (2) are used for calculating (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure FDA0002321746880000013
wherein d isDiRepresenting a direct type path sound path from a transmitting array element i to a target point; dDjRepresenting a direct type path sound path from a target point to a receiving array element j; c. C1And c2Depending on the bulk wave mode, the value is the longitudinal sound velocity cLOr transverse wave sound velocity cS。
5. The multi-view TFM-based joint defect quantification method of claim 4, wherein TFM views comprising interfacial reflection processes in both the transmit and receive paths are included for LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL; t is tijThe formula (1) and the formula (3) are adopted in the calculation of (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure FDA0002321746880000021
wherein d isiF1、diF2Two sections of a full-span type transmitting path of a transmitting array element i are shown, namely the distance from the transmitting array element i to a workpiece interface reflecting point and the distance from the workpiece interface reflecting point to a target point; djF1、djF2Two sections of a full-span receiving path of a receiving array element j are shown, namely the distance from a workpiece interface reflection point to the receiving array element j and the distance from a target point to the workpiece interface reflection point; c. Ci1And ci2、cj1And cj2Depending on the bulk wave mode, the value is the longitudinal sound velocity cLOr transverse wave sound velocity cS。
6. The multi-view TFM-based joint defect quantification method of claim 5, wherein for TFM views comprising an interfacial reflection process in both the transmit path and the receive path, LL-SL, LL-SS, LL-LS, LL-LL, LS-LL, LS-LS, LS-SS, LS-SL; t is tijThe formula (1) and the formula (4) are adopted in the calculation of (r), and the following formula is adopted:
tij(r)＝ti+tj(1)
Figure FDA0002321746880000022
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