CN117393531A - Cushion block and semiconductor packaging method - Google Patents
Cushion block and semiconductor packaging method Download PDFInfo
- Publication number
- CN117393531A CN117393531A CN202311427565.3A CN202311427565A CN117393531A CN 117393531 A CN117393531 A CN 117393531A CN 202311427565 A CN202311427565 A CN 202311427565A CN 117393531 A CN117393531 A CN 117393531A
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- lead frame
- wire
- cushion block
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000003466 welding Methods 0.000 claims abstract description 117
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 58
- 239000004033 plastic Substances 0.000 claims description 55
- 238000012360 testing method Methods 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 14
- 239000005022 packaging material Substances 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 11
- 230000006698 induction Effects 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 235000014820 Galium aparine Nutrition 0.000 claims description 3
- 240000005702 Galium aparine Species 0.000 claims description 3
- 229910001432 tin ion Inorganic materials 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 15
- 239000002184 metal Substances 0.000 abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OLXNZDBHNLWCNK-UHFFFAOYSA-N [Pb].[Sn].[Ag] Chemical compound [Pb].[Sn].[Ag] OLXNZDBHNLWCNK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 238000003909 pattern recognition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
The cushion block comprises a top surface for supporting a lead frame, a side surface capable of sliding along a press bridge of a base of a wire welding machine and a bottom surface capable of sliding along a sliding table of the base of the wire welding machine; the top surface is a cambered surface with a high middle and two low sides, and comprises a convex part for supporting pins of the lead frame; the side surface of the cushion block is provided with a first clamping groove, and the shape of the first clamping groove is matched with the shape of the pressure bridge; the bottom surface of cushion has seted up the second draw-in groove, the shape of second draw-in groove with the matching of slip table. The cushion block is applicable to the welding process in the semiconductor packaging, when the pressure finger of the wire bonding machine acts on the lead frame, the arc top surface of the cushion block can be better attached to the lead frame, so that the center position of the arc top surface of the lead frame and the cushion block is free from gaps, the relative stability of the bonding part in the lead frame is ensured, the energy cannot be lost in the bonding process of the metal wire and the chip, and the generation of the cold joint is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductor device packaging, in particular to a cushion block and a semiconductor packaging method.
Background
The semiconductor power device packaging refers to a process of processing a wafer passing through a test to obtain an independent chip according to a product model and a function requirement.
The packaging process of the semiconductor power device generally adopts an ultrasonic cold welding mode, so that a eutectic layer is formed on the metal surface through friction. The bonding process is that the metal wire is pressed on the metal on the surface of the semiconductor chip, ultrasonic vibration acts on the welding device through a welding tool, the aluminum wire is softened under the action of pressure and ultrasonic vibration, and the aluminum wire and the metal atoms on the surface of the chip are mutually diffused to form bonding. Bonding is completed when the metal atoms on the chip surface and the metal atoms on the aluminum wire share electrons with each other and form a metal covalent bond.
Along with the increase of market use demands, the power device is required to meet higher power, namely, high voltage and high current can be borne, so that chips and frame carriers of part of the power device are larger and larger, a plurality of thick aluminum wires are required to be bonded to meet the current demands, the center welding point of a large chip product is farther and farther from the position of a pressing finger, and the lead frame is unstable during bonding, so that energy loss in the bonding process is caused, and the bonded product is subjected to cold joint.
The dummy bond is essentially a separation layer between the bond wires and the die, which are not fully in contact with each other, and the state thereof is generally not visible to the naked eye. However, the electrical characteristics thereof are not conducted or poor in conduction, and the circuit characteristics are affected. Because the cold joint is in a connection state with contact resistance, the circuit works abnormally, the phenomenon of instability is good and bad when the circuit appears, noise is increased without regularity, and great hidden trouble is brought to debugging, use and maintenance of the circuit. The contact resistance of the cold solder joint can also cause local heating, the local temperature rise further worsens the condition of the solder joint which is not completely contacted, and finally even the solder joint drops off, so that the circuit can not work normally at all.
Therefore, how to avoid the cold joint generated in the bonding process of the high-power device is a problem to be solved under the condition that the power device chip and the frame carrier are larger and larger.
Disclosure of Invention
The embodiment of the invention provides a cushion block and a semiconductor packaging method, which are used for solving the problem of cold joint in the packaging process of a high-power device.
The first aspect of the embodiment of the invention provides a cushion block and a semiconductor packaging method, wherein the cushion block is used for packaging a semiconductor and comprises a top surface for supporting a lead frame, a side surface capable of sliding along a press bridge of a welding wire machine base and a bottom surface capable of sliding along a sliding table of the welding wire machine base;
The top surface is a cambered surface with a middle high side and two sides low, and comprises a protruding part for supporting pins of the lead frame;
a first clamping groove is formed in the side face of the cushion block, and the shape of the first clamping groove is matched with that of the pressure bridge;
the bottom surface of cushion has seted up the second draw-in groove, the shape of second draw-in groove with the shape matching of slip table.
Optionally, the number of the protruding parts is two, and the protruding parts are respectively located at two sides of the top surface.
A second aspect of an embodiment of the present invention provides a semiconductor packaging method, including:
a layer of blue film is stuck on the back surface of a wafer carrying a plurality of chips, and a dicing blade is used for dicing the wafer from a preset chip dicing channel to obtain a plurality of chips stuck on the blue film;
melting solder on a first carrier plate of a lead frame, sucking up the chip by using a welding head suction nozzle, and placing the chip on the melted solder, so that the chip and the first carrier plate are combined through the solder to obtain an empty frame; the empty frame is a lead frame on which the chip is attached to the first carrier plate;
the first clamping groove and the second clamping groove of the cushion block are clamped on a base of the wire welding machine, the first clamping groove is matched with a press bridge on the base, and the second clamping groove is matched with a sliding table on the base; the cushion block is the cushion block of the first aspect;
Mounting a plurality of shifting pins on a shifting pin arm of the wire bonding machine; the plurality of poking pins are used for being inserted into the holes of the lead frame; the needle shifting arm is used for controlling the plurality of needle shifting to drive the lead frame to move parallel to the track of the wire bonding machine; the track is used for clamping and transmitting the lead frame;
placing a first material box provided with the empty frame on a feeding objective table of the wire welding machine, grabbing the first material box and placing the first material box on a feeding end of the track; pushing a single empty frame in the first material box into the track, and moving the single empty frame to a first position determined in advance under the drive of the plurality of poking needles;
a plurality of pressing fingers are arranged on a pressing plate of the wire bonding machine, the pressing plate is arranged on a pressing plate base of the wire bonding machine, and the pressing plate base can control the pressing plate to drive the pressing fingers to vertically move up and down;
adjusting the welding wire machine base to enable the cushion block to vertically move upwards to a first preset height, and adjusting the pressing plate base to vertically move downwards to enable the pressing fingers to move to a second preset height; at this time, the plurality of pressing fingers are respectively pressed on the edges of the first carrier plate of the empty frame and the first pin of the empty frame, so that the first carrier plate is clung to the top surface of the cushion block, and the first pin is clung to the protruding part;
Presetting a first welding point and a second welding point on the surface of the chip and a third welding point of a pin of the lead frame in a wire bonding procedure; starting a wire welding procedure, and connecting the three welding spots through welding wires according to a preset path to obtain a lead frame to be molded;
placing the lead frame to be molded in a plastic packaging die, and performing plastic packaging to obtain a plastic packaging body; the plastic package body is provided with a connecting rib pin part, a pin connecting rib and a lead frame which are not arranged between the plastic package materials;
placing the part, which is not wrapped by the plastic packaging material, of the plastic packaging body in a plating tank filled with tin ion solution for plating to obtain a plating body;
and cutting off the connecting ribs between the pin parts which are not wrapped by the plastic packaging material in the electroplating body and the lead frame through rib cutting forming equipment to obtain the plastic packaged first semiconductor.
Optionally, the method for determining the first position includes:
placing a second material box provided with a machine adjusting frame on a feeding objective table of the wire welding machine; the machine adjusting frame is a model frame with the same size and shape as the lead frame;
the needle shifting arms are used for controlling the plurality of needle shifting to put the machine frame into a track of a wire welding machine; adjusting the width and the height of the track according to the adjuster frame; sliding the cushion block along the press bridge to enable the protruding portion on the cushion block to correspond to the pin position of the machine adjusting frame, and enabling the cambered surface of the top surface of the cushion block to correspond to the carrier plate position of the machine adjusting frame; the position of the modulator frame in the track at this time is noted as a first position.
Optionally, the method for determining the first height and the second height includes:
determining the height of the position of the cushion block according to the first position, and adjusting the height of the base of the wire welding machine according to the height of the position of the cushion block, so that the carrier plate of the wire welding machine frame is contacted with the top surface, and the pins of the wire welding machine frame are contacted with the protruding part; taking the height of the position where the cushion block is located at the moment as a first height;
a plurality of pressing fingers are arranged on a pressing plate of the wire welding machine, each pressing finger is respectively pressed on the edges of the second carrier plate and the second pin according to the positions of the second carrier plate and the second pin in the wire welding machine frame, the second carrier plate is tightly attached to the top surface of the cushion block, the second pin is tightly attached to the protruding part, and the pressing fingers are fixed; the height of the plurality of pressing fingers at this time is taken as a second height.
Optionally, the first material box with the empty frame is placed on a loading object stage of the wire bonding machine, and the first material box is grabbed and placed at a loading end of the track; pushing a single empty frame in the first material box into the track, and moving the single empty frame to the first position under the drive of a plurality of poking needles specifically comprises:
Placing a first magazine provided with a plurality of empty frames on a loading object stage of the wire bonding machine, wherein the empty frames are layered in the magazine; the feeding object stage transmits a material box to a material box induction position, the material box induction position transmits a signal to a mechanical arm arranged on the wire welding machine and used for grabbing the material box, and the mechanical arm receives the signal to grab the material box and is placed at the feeding end of the track; the feeding end is provided with a push rod for pushing the empty frame in the material box onto the track; the needle shifting arm drives the plurality of needle shifting devices to be inserted into the gaps of the empty frame, and drives the empty frame to horizontally move to the first position along the track.
Optionally, before the starting the wire bonding procedure, connecting the three welding spots through the wire bonding according to the preset path, the method further includes:
and installing corresponding welding wires according to the wire diameter requirement of the welding wires, and installing corresponding cleavers, cutters and conduits.
Optionally, placing the lead frame to be molded in a molding die for molding, and obtaining the molded body specifically includes:
placing the lead frame to be molded in a mold of a plastic packaging machine, injecting a plastic packaging material into the mold of the plastic packaging machine until the plastic packaging material uniformly wraps the chip, the carrier plate, the bonding wires and part of pins, and obtaining the plastic packaging body after plastic packaging and molding in a high-temperature and high-pressure system.
Optionally, the cutting the connecting ribs between the pin parts of the electroplated body, which are not wrapped by the plastic package material, and the frame of the lead frame through the rib cutting forming device, after obtaining the first semiconductor after plastic package, further includes:
the sorting machine automatically conveys the first semiconductors to a testing station one by one, and pins of the tested semiconductors are connected with a functional module of the testing machine through a base and a special connecting wire on the testing station;
the testing machine applies an input signal to the semiconductor and collects an output signal, wherein the output signal comprises chip function and performance information, judges whether the chip function and performance meet the design specification requirements, and generates test result information;
and the testing machine feeds back the testing result information to the sorting machine, and the sorting machine marks and sorts the tested chips according to the testing result information to obtain qualified second semiconductors.
The embodiment of the invention has at least the following beneficial effects:
the cushion block is used for supporting the top surface of the lead frame, the side surface capable of sliding along the press bridge of the welding wire machine base and the bottom surface capable of sliding along the sliding table of the welding wire machine base; the top surface is a cambered surface with a high middle and two low sides, and comprises a protruding part for supporting pins of the lead frame; a first clamping groove is formed in the side face of the cushion block, and the shape of the first clamping groove is matched with that of the pressure bridge; the bottom surface of cushion has seted up the second draw-in groove, the shape of second draw-in groove with the shape matching of slip table. The cushion block is applicable to the welding process in the semiconductor packaging, when the pressure finger of the wire bonding machine acts on the lead frame, the arc top surface of the cushion block can be better attached to the lead frame, so that the center position of the arc top surface of the lead frame and the cushion block is free from gaps, the relative stability of the bonding part in the lead frame is ensured, the energy loss of a metal wire and a chip in the bonding process is avoided, and the generation of cold joint is avoided.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a pad according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a pad and lead frame according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating cooperation between a pad and a wire bonding machine according to an embodiment of the present invention;
fig. 4 is a flowchart of a semiconductor packaging method according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a bonding wire path according to an embodiment of the present invention.
Reference numerals:
1-a cushion block; 2-a first clamping groove; 3-a second clamping groove; 4-top surface; 5-a boss; 6-pressing a bridge; 7-a sliding table; 8-finger pressing; 9-pressing plates; 10-a pressing plate base; 11-a welding wire machine base; 12-a lead frame; 13-a first pin; 14-a first carrier plate; 15-solder; 16-chip; 17-a first welding spot; 18-a second welding spot; 19-a third welding spot; 20-aluminum wire.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Fig. 1 is a schematic diagram of a pad 1 according to an embodiment of the present invention. As shown in fig. 1, the pad 1 includes a top surface for supporting a lead frame 12, a side surface slidable along a press bridge 6 of a wire bonding machine base 11, and a bottom surface slidable along a slide table 7 of the wire bonding machine base 11;
wherein, the top surface 4 is a cambered surface with a middle high side and two sides low, and the top surface 4 comprises a protruding part 5 for supporting pins of the lead frame 12;
a first clamping groove 2 is formed in the side face of the cushion block 1, and the shape of the first clamping groove 2 is matched with the shape of the pressure bridge 6;
the bottom surface of cushion 1 has seted up second draw-in groove 3, the shape of second draw-in groove 3 with the shape matching of slip table 7.
Specifically, the wire bonding machine in the application can be a KNS Power fusion (kurarefaction wire bonding machine), and the kurarefaction wire bonding machine has a powerful direct driving power system and enhanced pattern recognition capability, and can meet the requirements of complex welding processes such as larger bonding area, higher precision and the like in the future development process of the power device.
The lead frame is suitable for semiconductors packaged in a TOLL (TO-leadless) mode, the TOLL package can save space efficiently and support large current, and the lead frame is mainly applied TO the automobile industry, so that the corresponding lead frame is larger and more welding spots need TO be drilled.
When the wire bonding machine is used for TOLL semiconductor packaging, the cushion block 1 is mainly used for supporting the lead frame 12, the top surface 4 of the cushion block 1 is contacted with the lead frame 12, and the top surface 4 of the cushion block 1 is arc-shaped with high middle and low two sides.
Fig. 2 is a schematic diagram of a pad and lead frame according to an embodiment of the present invention.
As shown in fig. 2, the lead frame is located on the pad 1, the carrier plate of the lead frame 12 contacts the top surface 4 of the pad 1, and the pin portions of the lead frame 12 contact the protruding portions 5 of the pad 1, respectively.
Fig. 3 is a schematic diagram illustrating cooperation of a pad and a wire bonding machine according to an embodiment of the present invention.
As shown in fig. 3, the first clamping groove 2 on the side surface of the cushion block 1 is matched with the press bridge 6 in the wire bonding machine, and the second clamping groove 3 on the bottom surface of the cushion block 1 is matched with the sliding table 7 on the wire bonding machine. The cushion block 1 can be matched with the sliding table 7 through the second clamping groove 3, and the position on the sliding table 7 can be adjusted by moving left and right along the horizontal direction of the sliding table 7. The height of the wire bonding machine base 11 may also be adjusted by screws on the wire bonding machine base 11.
In the wire bonding process, the press finger 8 of the wire bonding machine presses the lead frame 12 on the cushion block 1, and the press finger 8 acts on the periphery of a part of the lead frame 12 needing bonding due to the large size of the lead frame 12, so that the bow phenomenon occurs at the center of the bottom surface of the frame. Because the top surface 4 of the cushion block 1 is arc-shaped with high middle and low two sides, namely, the center is convex, the top surface can be well matched with the 'bowing' position of the center of the lead frame 12, and the center of the lead frame 12 is supported and fixed. In the wire bonding process, the bonding part of the lead frame 12 is supported and fixed by the arc-shaped top surface 4 of the cushion block 1, bonding energy is not lost, and the condition of cold joint is avoided.
In summary, the cushion block provided by the embodiment of the invention is used for supporting the top surface of the lead frame, the side surface capable of sliding along the press bridge of the welding wire machine base and the bottom surface capable of sliding along the sliding table of the welding wire machine base; the top surface is a cambered surface with a high middle and two low sides, and comprises a protruding part for supporting pins of the lead frame; a first clamping groove is formed in the side face of the cushion block, and the shape of the first clamping groove is matched with that of the pressure bridge; the bottom surface of cushion has seted up the second draw-in groove, the shape of second draw-in groove with the shape matching of slip table. The cushion block is applicable to the welding process in the semiconductor packaging, when the pressure finger of the wire bonding machine acts on the lead frame, the arc top surface of the cushion block can be better attached to the lead frame, so that the center position of the arc top surface of the lead frame and the cushion block is free from gaps, the relative stability of the bonding part in the lead frame is ensured, the energy loss of a metal wire and a chip in the bonding process is avoided, and the generation of cold joint is avoided.
In one possible embodiment, the two protrusions are located on two sides of the top surface.
Specifically, since the two rows of pins of the lead frame 12 in the present application are located on both sides of the lead frame 12, the bottom pad 1 is also required to support when the pins in the lead frame 12 are soldered. In this application, the plane where the position where spot welding is needed is located in the pins of the lead frame 12 is higher than the plane where the bonding position is needed to be located in the lead frame 12 in the vertical direction, so two protruding portions 5 are correspondingly arranged on two sides of the top surface 4 of the cushion block 1, and are respectively used for supporting the pins on two sides of the lead frame 12.
Fig. 4 is a flowchart of a semiconductor packaging method according to an embodiment of the present invention.
In order to more clearly describe the pad 1 provided in the embodiment of the present invention, the application of the pad 1 in the semiconductor packaging method will be described in detail with reference to fig. 4.
As shown in fig. 4, the semiconductor packaging method includes the steps of:
and 101, sticking a layer of blue film on the back surface of a wafer carrying a plurality of chips, and scribing the wafer from a preset chip scribing channel by using a scribing cutter to obtain the plurality of chips stuck on the blue film.
Specifically, a blue film is first attached to the back of the wafer, so that the resulting individual chips 16 will not scatter even after the wafer is diced. The wafer with the blue film attached is sent to a die 16 dicing machine for dicing, so that the die 16 on the wafer is diced and separated into a plurality of dies 16 by the dicing machine, and the blue film is still intact. The chip 16 on the blue film is cleaned to remove dust generated during dicing.
Step 102, melting solder on a first carrier plate of a lead frame, sucking up the chip by a welding head suction nozzle, and placing the chip on the melted solder, so that the chip and the first carrier plate are combined through the solder to obtain an empty frame; the empty frame is a lead frame on which the chip is attached to the first carrier plate.
Specifically, the solder 15 is mainly distinguished according to the melting point temperature of the solder, and is generally called a soft solder 15 having a melting point of 450 ℃ or less; the soft solder 15 in the application is mainly tin-lead-silver alloy, has good heat conduction and electric conduction performance, low on-resistance, high welding strength and vibration resistance.
The soft solder 15 is melted onto the carrier plate of the lead frame 12 by a chip bonding machine, then the single chip 16 on the blue film is sucked up by a suction nozzle by a welding head of the chip bonding machine, and then a certain acting force is applied to place the chip 16 onto the melted solder, so that the combination of the single chip 16 and the carrier plate of the lead frame 12 is completed, and the lead frame 12 with the chip 16 attached to the carrier plate is called an empty frame.
Step 103, clamping a first clamping groove and a second clamping groove of the cushion block on a base of the wire welding machine, wherein the first clamping groove is matched with a press bridge on the base, and the second clamping groove is matched with a sliding table on the base; the cushion block is any one of the cushion blocks shown in fig. 1-3.
Specifically, the pad 1 in the present application is mounted on a wire bonding machine. The two sides of the sliding table 7 on the base 11 of the wire welding machine are provided with press bridges 6, the second clamping grooves 3 of the cushion block 1 are clamped on the sliding table 7 of the wire welding machine, the first clamping grooves 2 on the two sides of the cushion block 1 are respectively clamped on the press bridges 6 on the two sides of the sliding table 7, screws on the press bridges 6 are adjusted, and the press bridges 6 are fixed so as to fix the cushion block 1 on the sliding block.
104, mounting a plurality of poking pins on a poking pin arm of the wire bonding machine; the plurality of poking pins are used for being inserted into the holes of the lead frame; the needle shifting arm is used for controlling the plurality of needle shifting to drive the lead frame to move parallel to the track of the wire bonding machine; the rails are used to hold and transfer the lead frames.
Specifically, a plurality of pins are mounted on the pin arms of the wire bonding machine, the pins being sized to pass through the apertures in the lead frame 12. The wire bonding machine is also provided with a track for clamping and transferring the lead frame.
Step 105, placing a first material box with the empty frame on a feeding stage of the wire bonding machine, grabbing the first material box and placing the first material box on a feeding end of the track; pushing a single empty frame in the first material box into the track, and moving the single empty frame to a first position determined in advance under the driving of the plurality of poking needles.
Specifically, after the chip 16 is attached to the carrier board of the lead frame 12, the lead frame is placed in the first material box, so that the frame can be automatically transported in the subsequent wire bonding process, the loading end of the track of the wire bonding machine is connected with the objective table, and the track is located above the cushion block 1. The first material box is placed on a feeding objective table of the wire welding machine, the objective table of the wire welding machine is in a conveyor belt mode, and a mechanical arm on the wire welding machine grabs the first material box and places the first material box at a track feeding end. A single empty frame in the first magazine is pushed into the track, and then the dial needle moves the empty frame to the first position. Since the height of the track is constant, the first position is mainly the position of the lead frame 12 in the horizontal direction of the track, when the empty frame is in the first position, the empty frame corresponds to the arc-shaped top surface 4 of the cushion block 1, and the position of the pin of the empty frame, which needs spot welding, corresponds to the protruding part 5 of the cushion block 1.
Step 106, a plurality of pressing fingers are arranged on a pressing plate of the wire bonding machine, the pressing fingers are arranged on the pressing plate of the wire bonding machine, the pressing plate is arranged on a pressing plate base of the wire bonding machine, and the pressing plate base can control the pressing plate to drive the pressing fingers to vertically move up and down.
Specifically, the pressing finger 8 is mounted on the pressing plate 9 of the wire bonding machine, then the pressing plate 9 with the pressing finger 8 mounted thereon is mounted on the pressing plate base 10 of the wire bonding machine, and then the fixing screw of the pressing plate 9 is locked. The wire bonding machine controls the movement of the press finger 8 on the press plate 9 in the vertical direction by controlling the press plate 9.
Step 107, adjusting the welding wire machine base to enable the cushion block to vertically move upwards to a preset first height, and adjusting the pressing plate base to vertically move downwards to enable the pressing fingers to move to a preset second height; at this time, the plurality of pressing fingers are respectively pressed on the edges of the first carrier plate of the empty frame and the first pin of the empty frame, so that the first carrier plate is tightly attached to the top surface of the cushion block, and the first pin is tightly attached to the protruding part.
Specifically, the first height is the height of the wire bonding machine base 11 at which the top surface 4 of the pad 1 contacts the wire bonding machine base 11 with the empty frame in the rail above the pad 1. The welding wire machine base 11 is adjusted to a first height, at the moment, the top surface 4 of the cushion block 1 is in contact with the lead frame 12, then the pressing plate base 10 is controlled to vertically move downwards in the procedure of the welding wire machine, and meanwhile, the pressing fingers 8 on the pressing plate 9 are driven to vertically move downwards, so that the height of the pressing fingers 8 in the vertical direction reaches a second height, when the pressing fingers 8 are at the second height, the pressing fingers 8 respectively press the edges of the first carrier plate 14 of the empty frame and the first pins 13 of the empty frame, the first carrier plate 14 of the empty frame is tightly attached to the top surface 4 of the cushion block 1, and the first pins 13 of the empty frame are tightly attached to the protruding part 5.
Step 108, presetting a first welding point and a second welding point on the surface of the chip and a third welding point of a pin of the lead frame in a wire bonding procedure; and starting a wire welding procedure, and connecting the three welding spots through the welding wires according to a preset path to obtain the lead frame to be molded.
Fig. 5 is a schematic diagram of a bonding wire path according to an embodiment of the present invention.
Specifically, as shown in fig. 5, during the wire bonding process, the first carrier plate 14 of the lead frame 12 is attached to the top surface 4 of the pad 1, and the chip 16 is attached to the first carrier plate 14 by solder 15. Presetting welding spots in a system program of a wire bonding machine: the positions of a first welding spot 17 and a second welding spot 18 are preset on the chip 16 in sequence, the position of a third welding spot 19 is preset on a pin, then a wire welding procedure is started, spot welding is performed on the positions of the three welding spots in sequence, and the aluminum wire 18 is pulled according to a wire welding path preset by a system. The purpose of the wire bonds is to connect the wire bonds on the die 16 to the pins of the leadframe 12 with aluminum wires 18, thereby transmitting the circuit signals on the die 16 to the outside world.
Step 109, placing the lead frame 12 to be molded in a molding die for molding to obtain a molded body; the plastic package body is provided with a pin part which is not wrapped by the plastic package material, a pin connecting rib and a frame of the lead frame 12.
Specifically, the plastic package mainly protects the chip 16 and the bonding wires, and the raw materials for plastic package mainly comprise epoxy resin and various additives. And placing the lead frame after the bonding wires in a plastic packaging die for plastic packaging. And exposing a part of each pin of the lead frame after plastic packaging outside the plastic packaging body for transmitting signals. In addition, the connecting ribs of the pins of the lead frame and the frames around the lead frame are exposed outside the plastic package body.
And 110, placing the part, which is not wrapped by the plastic packaging material, of the plastic packaging body in a plating tank filled with tin ion solution for plating to obtain a plated body.
Specifically, the electroplating is also called tin plating, namely tin plating is a process of plating a metal layer of tin on the surface of the integrated circuit lead frame 12 by using an electrochemical principle and plating metal as an anode and plating metal as a cathode in a solution containing metal cations under the action of direct current, wherein the aim is to resist oxidation and corrosion, improve the weldability of a product, facilitate the subsequent soldering process, reduce the contact resistance of a joint, and well inhibit high-frequency interference, shield static electricity and the like when being used for braiding shielding.
And 111, cutting off the connecting ribs between the pin parts which are not wrapped by the plastic packaging material in the electroplating body and the lead frame through rib cutting forming equipment to obtain the plastic-packaged first semiconductor.
Specifically, the electroplating body is placed in a rib cutting forming device, and under the drive of a servo motor of a rib cutting system, a metal cutter made of hard alloy is used for cutting off the connecting ribs between the outer pins of the lead frame 12 and the frame connected with the lead frame 12 in the plastic seal, so that a single independent device is formed. The forming refers to bending the outer pins of the device into a certain shape so as to meet the requirements of industry standard assembly.
In one possible implementation manner, the method for determining the first position includes:
placing a second material box provided with a machine adjusting frame on a feeding objective table of the wire welding machine; the machine adjusting frame is a model frame with the same size and shape as the lead frame;
the needle shifting arms are used for controlling the plurality of needle shifting to put the machine frame into a track of a wire welding machine; adjusting the width and the height of the track according to the adjuster frame; sliding the cushion block along the sliding table to enable the protruding portion on the cushion block to correspond to the second pin position of the machine adjusting frame, and enabling the cambered surface of the top surface of the cushion block to correspond to the second carrier plate position of the machine adjusting frame; and taking the position of the modulator frame in the track at the moment as a first position.
Specifically, the dispatching frame is placed in a second material box special for the dispatching frame, and the second material box provided with the dispatching frame is placed on a conveyor belt of a feeding object stage of the wire welding machine.
After the second material box reaches the track feed opening, the machine-adjusting frame is pushed out from the material box, at the moment, the needle-shifting arm is controlled to insert a plurality of needle-shifting pairs on the needle-shifting arm into the holes in the machine-adjusting frame, the machine-adjusting frame is driven to gradually enter the track, the width and the height of the wire welding machine track are adjusted according to the width and the height of the machine-adjusting frame, so that the machine-adjusting frame just falls into the track from the material box without large drop, and the track width enables the machine-adjusting frame to smoothly move in the track. The cushion block 1 slides along the sliding table 7 on the welding wire machine base 11 until the protruding part 5 corresponds to the second pin position of the machine adjusting frame, the top surface 4 corresponds to the second carrier plate position of the machine adjusting frame, and the height of the machine adjusting frame at the moment and the horizontal position in the track are taken as the first position. The modulator frame is a model frame, the size and shape of the modulator frame are the same as those of the lead frame 12, and the modulator frame is used for preliminary determination of the first position so as to improve the yield of products and avoid damage to the lead frame 12 in the position determination process.
In one possible embodiment, the method for determining the first height and the second height includes:
determining the height of the position of the cushion block according to the first position, and adjusting the height of the base of the wire welding machine according to the height of the position of the cushion block, so that the carrier plate of the wire welding machine frame is contacted with the top surface, and the pins of the wire welding machine frame are contacted with the protruding part; taking the height of the position where the cushion block is located at the moment as a first height;
a plurality of pressing fingers are arranged on a pressing plate of the wire welding machine, each pressing finger is respectively pressed on the edges of the second carrier plate and the second pin according to the positions of the second carrier plate and the second pin in the wire welding machine frame, the second carrier plate is tightly attached to the top surface of the cushion block, the second pin is tightly attached to the protruding part, and the pressing fingers are fixed; the height of the plurality of pressing fingers at this time is taken as a second height.
Specifically, after the boss 5 and the top surface 4 of the pad 1 correspond to the second pin and the second carrier plate of the dispenser frame, respectively, the horizontal position of the pad 1 on the wire bonding machine base 11 is determined. After the horizontal position is determined, the height of the welding wire machine base 11 is adjusted according to the height of the machine frame in the track, and meanwhile, the height of the cushion block 1 is driven to change, so that the second carrier plate of the machine frame is contacted with the top surface 4 of the cushion block 1, and the second pin of the machine frame is contacted with the protruding part 5 of the cushion block 1; the height of the cushion block 1 at this time is taken as a first height.
According to the positions of the second carrier plate and the second pins in the dispatching frame, each pressing finger 8 on the welding wire machine pressing plate 9 is respectively pressed on the edges of the second carrier plate and the second pins of the dispatching frame, so that the second carrier plate of the dispatching frame is tightly attached to the top surface 4 of the cushion block 1, the second pins of the dispatching frame are tightly attached to the protruding parts 5, then the height and the position of the pressing finger 8 are fixed, and the height of the pressing finger 8 at the moment is taken as a second height.
In one possible embodiment, the first magazine with the empty frame is placed on a loading stage of the wire bonding machine, and the first magazine is grabbed and placed on a loading end of the rail; pushing a single empty frame in the first material box into the track, and moving the single empty frame to the first position under the drive of a plurality of poking needles specifically comprises:
placing a first magazine provided with a plurality of empty frames on a loading object stage of the wire bonding machine, wherein the empty frames are layered in the magazine; the feeding object stage transmits a material box to a material box induction position, the material box induction position transmits a signal to a mechanical arm arranged on the wire welding machine and used for grabbing the material box, and the mechanical arm receives the signal to grab the material box and is placed at the feeding end of the track; the feeding end is provided with a push rod for pushing the empty frame in the material box onto the track; the needle shifting arm drives the plurality of needle shifting devices to be inserted into the gaps of the empty frame, and drives the empty frame to horizontally move to the first position along the track.
Specifically, the lead frames 12 on which the chips 16 are attached on the carrier board are collectively housed in the first magazine and placed in layers. The first material box is placed on a feeding objective table of the wire welding machine, and is driven by an objective table conveying belt to gradually approach the induction zone. After the first material box reaches the sensing area, a mechanical arm on the wire welding machine receives signals of the arrival of the material box, grabs the first material box and places the first material box at a track feeding opening. The push rod arranged at the track feeding hole pushes out a single empty frame in the first material box, so that the empty frame enters the track. After entering the track, the needle shifting arm drives the plurality of needle shifting pins to be inserted into the holes of the empty frame, drives the empty frame to horizontally move to a first position along the track, enables the position of the empty frame attached with the chip 16 to correspond to the top surface 4 of the cushion block 1, and enables pins on two sides of the empty frame to correspond to the two protruding parts 5 of the cushion block 1 respectively.
In one possible implementation manner, before the starting the wire bonding procedure, the three welding points are connected through the wire bonding according to the preset path, so as to obtain the lead frame to be molded, the method further includes:
and installing corresponding welding wires according to the wire diameter requirement of the welding wires, and installing corresponding cleavers, cutters and conduits.
Specifically, before the wire bonding process is started, a proper wire is required to be mounted according to the wire diameter requirement of the wire before the wire is bonded to the chip 16 and the pin, and a corresponding chopper, cutter and conduit are mounted according to the wire. Wherein, the chopper is the main welding tool of ultrasonic welding, and the bonding tool applies certain power and force to the chopper to finish the welding, and the model corresponds to the aluminum wire 18. The conduit is used to fix the position of the aluminum wire 18 on the welding head so that the aluminum wire 18 will not deviate from the riving knife slot during the movement and welding of the welding head. The cutter is used to cut the aluminum wire 18 after the welding is completed.
In one possible implementation manner, the placing the lead frame to be molded in a molding mold for molding, and obtaining the molded body specifically includes:
placing the lead frame to be molded in a mold of a plastic packaging machine, injecting a plastic packaging material into the mold of the plastic packaging machine until the plastic packaging material uniformly wraps the chip, the carrier plate, the bonding wires and part of pins, and obtaining the plastic packaging body after plastic packaging and molding in a high-temperature and high-pressure system.
Specifically, the lead frame 12 after bonding wires is preheated and then placed in a mold of a plastic packaging machine, and then semi-melted plastic packaging material, namely epoxy resin, is extruded into the mold, so that the chip 16, the carrier plate, the bonding wires and part of pins are wrapped by the epoxy resin, and a system where the mold is located is controlled to be in a high-temperature and high-pressure state, so that the plastic packaging material in the mold is solidified and formed.
In one possible implementation manner, after cutting the connecting ribs between the pin parts of the electroplating body, which are not wrapped by the plastic package material, and the lead frame through a rib cutting forming device, the method further includes:
the sorting machine automatically conveys the first semiconductors to a testing station one by one, and pins of the tested semiconductors are connected with a functional module of the testing machine through a base and a special connecting wire on the testing station;
The testing machine applies an input signal to the semiconductor and collects an output signal, wherein the output signal comprises chip function and performance information, judges whether the chip function and performance meet the design specification requirements, and generates test result information;
and the testing machine feeds back the testing result information to the sorting machine, and the sorting machine marks and sorts the tested chips according to the testing result information to obtain qualified second semiconductors.
Specifically, the obtained first semiconductors after connecting ribs are cut off are placed in a sorting machine, the sorting machine conveys the first semiconductors to a testing station one by one, and the first semiconductors are connected with a testing module of the testing machine through a base and a special connecting wire on the testing station to perform parameter testing and function testing. The parameter test uses AC/DC parameter test detection performance and defect degree of the chip, the function test adopts logic fault to model the defects, and test vectors aiming at the logic faults are automatically generated through an algorithm to detect manufacturing defects, and the test function is not only limited in judging whether the tested device is qualified, but also can provide useful information in the manufacturing process, thereby being beneficial to improving the yield, and can also provide weak link information in the design scheme, thereby being beneficial to detecting the design problem.
The testing module of the testing machine applies input signals to the connected semiconductors, collects the output signals, judges the defect information of the chips and whether the chips are qualified according to the chip function and performance information in the output signals, generates testing result information, then the sorting machine separates qualified products from unqualified products according to the testing result, and further subdivides the qualified products according to different conditions.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (9)
1. The cushion block is used for packaging semiconductors, and comprises a top surface for supporting a lead frame, a side surface capable of sliding along a press bridge of a welding wire machine base and a bottom surface capable of sliding along a sliding table of the welding wire machine base;
The top surface is a cambered surface with a middle high side and two sides low, and comprises a protruding part for supporting pins of the lead frame;
a first clamping groove is formed in the side face of the cushion block, and the shape of the first clamping groove is matched with that of the pressure bridge;
the bottom surface of cushion has seted up the second draw-in groove, the shape of second draw-in groove with the shape matching of slip table.
2. The head block of claim 1 wherein there are two of said protrusions on each side of said top surface.
3. A method of packaging a semiconductor, the method comprising:
a layer of blue film is stuck on the back surface of a wafer carrying a plurality of chips, and a dicing blade is used for dicing the wafer from a preset chip dicing channel to obtain a plurality of chips stuck on the blue film;
melting solder on a first carrier plate of a lead frame, sucking up the chip by using a welding head suction nozzle, and placing the chip on the melted solder, so that the chip and the first carrier plate are combined through the solder to obtain an empty frame; the empty frame is a lead frame on which the chip is attached to the first carrier plate;
the first clamping groove and the second clamping groove of the cushion block are clamped on a base of the wire welding machine, the first clamping groove is matched with a press bridge on the base, and the second clamping groove is matched with a sliding table on the base; the cushion block is the cushion block of any one of claims 1-2;
Mounting a plurality of shifting pins on a shifting pin arm of the wire bonding machine; the plurality of poking pins are used for being inserted into the holes of the lead frame; the needle shifting arm is used for controlling the plurality of needle shifting to drive the lead frame to move parallel to the track of the wire bonding machine; the track is used for clamping and transmitting the lead frame;
placing a first material box provided with the empty frame on a feeding objective table of the wire welding machine, grabbing the first material box and placing the first material box on a feeding end of the track; pushing a single empty frame in the first material box into the track, and moving the single empty frame to a first position determined in advance under the drive of the plurality of poking needles;
a plurality of pressing fingers are arranged on a pressing plate of the wire bonding machine, the pressing plate is arranged on a pressing plate base of the wire bonding machine, and the pressing plate base can control the pressing plate to drive the pressing fingers to vertically move up and down;
adjusting the welding wire machine base to enable the cushion block to vertically move upwards to a first preset height, and adjusting the pressing plate base to vertically move downwards to enable the pressing fingers to move to a second preset height; at this time, the plurality of pressing fingers are respectively pressed on the edges of the first carrier plate of the empty frame and the first pin of the empty frame, so that the first carrier plate is clung to the top surface of the cushion block, and the first pin is clung to the protruding part;
Presetting a first welding point and a second welding point on the surface of the chip and a third welding point of a pin of the lead frame in a wire bonding procedure; starting a wire welding procedure, and connecting the three welding spots through welding wires according to a preset path to obtain a lead frame to be molded;
placing the lead frame to be molded in a plastic packaging die, and performing plastic packaging to obtain a plastic packaging body; the plastic package body is provided with a pin part, a pin connecting rib and a lead frame outside which are not wrapped by the plastic package material;
placing the part, which is not wrapped by the plastic packaging material, of the plastic packaging body in a plating tank filled with tin ion solution for plating to obtain a plating body;
and cutting off the connecting ribs between the pin parts which are not wrapped by the plastic packaging material in the electroplating body and the lead frame through rib cutting forming equipment to obtain the plastic packaged first semiconductor.
4. A method as claimed in claim 3, wherein the method of determining the first position comprises:
placing a second material box provided with a machine adjusting frame on a feeding objective table of the wire welding machine; the machine adjusting frame is a model frame with the same size and shape as the lead frame;
the needle shifting arms are used for controlling the plurality of needle shifting to put the machine frame into a track of a wire welding machine; adjusting the width and the height of the track according to the adjuster frame; sliding the cushion block along the sliding table to enable the protruding portion on the cushion block to correspond to the second pin position of the machine adjusting frame, and enabling the cambered surface of the top surface of the cushion block to correspond to the second carrier plate position of the machine adjusting frame; the position of the modulator frame in the track at this time is noted as a first position.
5. The method of claim 4, wherein the determining of the first height and the second height comprises:
determining the height of the position of the cushion block according to the first position, and adjusting the height of the base of the wire welding machine according to the height of the position of the cushion block, so that the carrier plate of the wire welding machine frame is contacted with the top surface, and the pins of the wire welding machine frame are contacted with the protruding part; taking the height of the position where the cushion block is located at the moment as a first height;
a plurality of pressing fingers are arranged on a pressing plate of the wire welding machine, each pressing finger is respectively pressed on the edges of the second carrier plate and the second pin according to the positions of the second carrier plate body and the second pin in the wire welding machine frame, the second carrier plate is tightly attached to the top surface of the cushion block, the second pin is tightly attached to the protruding part, and the pressing fingers are fixed; the height of the plurality of pressing fingers at this time is taken as a second height.
6. The method of claim 3 wherein said placing a first magazine with said empty frame on a loading stage of said wire bonding machine, said grasping said first magazine and placing it on a loading end of said track; pushing a single empty frame in the first material box into the track, and moving the single empty frame to the first position under the drive of a plurality of poking needles specifically comprises:
Placing a first magazine provided with a plurality of empty frames on a loading object stage of the wire bonding machine, wherein the empty frames are layered in the magazine; the feeding object stage transmits a material box to a material box induction position, the material box induction position transmits a signal to a mechanical arm arranged on the wire welding machine and used for grabbing the material box, and the mechanical arm receives the signal to grab the material box and is placed at the feeding end of the track; the feeding end is provided with a push rod for pushing the empty frame in the material box onto the track; the needle shifting arm drives the plurality of needle shifting devices to be inserted into the gaps of the empty frame, and drives the empty frame to horizontally move to the first position along the track.
7. The method of claim 3, wherein before the starting the wire bonding process, the three solder joints are connected by the wire bonding according to the preset path, and the lead frame to be molded is obtained further comprises:
and installing corresponding welding wires according to the wire diameter requirement of the welding wires, and installing corresponding cleavers, cutters and conduits.
8. The method of claim 3, wherein placing the leadframe to be encapsulated in an encapsulation mold for encapsulation specifically comprises:
Placing the lead frame to be molded in a mold of a plastic packaging machine, injecting a plastic packaging material into the mold of the plastic packaging machine until the plastic packaging material uniformly wraps the chip, the carrier plate, the bonding wires and part of pins, and obtaining the plastic packaging body after plastic packaging and molding in a high-temperature and high-pressure system.
9. The method of claim 3, wherein the removing the connection ribs between the pin portions of the plating body that are not covered by the molding compound and the leadframe frame by the rib cutting molding device to obtain the molded first semiconductor further comprises:
the sorting machine automatically conveys the first semiconductors to a testing station one by one, and pins of the tested semiconductors are connected with a functional module of the testing machine through a base and a special connecting wire on the testing station;
the testing machine applies an input signal to the semiconductor and collects an output signal, wherein the output signal comprises chip function and performance information, judges whether the chip function and performance meet the design specification requirements, and generates test result information;
and the testing machine feeds back the testing result information to the sorting machine, and the sorting machine marks and sorts the tested chips according to the testing result information to obtain qualified second semiconductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311427565.3A CN117393531A (en) | 2023-10-31 | 2023-10-31 | Cushion block and semiconductor packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311427565.3A CN117393531A (en) | 2023-10-31 | 2023-10-31 | Cushion block and semiconductor packaging method |
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| CN117393531A true CN117393531A (en) | 2024-01-12 |
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| CN202311427565.3A Pending CN117393531A (en) | 2023-10-31 | 2023-10-31 | Cushion block and semiconductor packaging method |
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- 2023-10-31 CN CN202311427565.3A patent/CN117393531A/en active Pending
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