CN115188732A - SOP300mil6L isolation structure frame packaging part and manufacturing method - Google Patents

SOP300mil6L isolation structure frame packaging part and manufacturing method Download PDF

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Publication number
CN115188732A
CN115188732A CN202210862022.3A CN202210862022A CN115188732A CN 115188732 A CN115188732 A CN 115188732A CN 202210862022 A CN202210862022 A CN 202210862022A CN 115188732 A CN115188732 A CN 115188732A
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CN
China
Prior art keywords
chip
base island
lead frame
island
isolation
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Pending
Application number
CN202210862022.3A
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Chinese (zh)
Inventor
马志明
崔卫兵
陈志祥
郑永富
邓旭东
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Tianshui Huatian Technology Co Ltd
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Tianshui Huatian Technology Co Ltd
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Priority to CN202210862022.3A priority Critical patent/CN115188732A/en
Publication of CN115188732A publication Critical patent/CN115188732A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

The invention discloses an SOP300mil6L isolation structure frame packaging piece and a manufacturing method thereof, wherein the SOP300mil6L isolation structure frame packaging piece comprises an SOP300mil6L lead frame unit; the SOP300mil6L lead frame unit is provided with a plurality of lead frame units; the plurality of lead frame units are arranged in a matrix form, every two lead frame units in the transverse direction form a one-filling-two structure, a flow channel flushing groove is arranged between every two lead frame units in each group, internal force eliminating grooves are arranged on two sides of each lead frame unit in the transverse direction, and process grooves are arranged on two sides of each lead frame unit in the longitudinal direction; the lead frame unit comprises a first base island and a second base island which are sequentially arranged from top to bottom, and inner pins for electrical connection are arranged on the first base island and the second base island; the first base island and the second base island are both provided with a coplanarity balance table and base island support ribs; the middle areas of the first base island and the second base island are chip mounting areas, and the first digital isolation chip, the second digital isolation chip and the IC chip are coated with plastic packaging bodies outside the first base island and the second base island.

Description

SOP300mil6L isolation structure frame packaging part and manufacturing method
Technical Field
The invention belongs to the field of integrated circuit packaging application, and particularly relates to an SOP300mil6L isolation structure frame packaging piece and a manufacturing method thereof.
Background
The integrated circuit device is manufactured from the transistor of a single component to the large-scale and ultra-large-scale integration of a plurality of components, the integrated circuit has higher and higher integration level and more complex functions, accordingly, the semiconductor package gradually develops and changes towards the direction of high integration level, high performance, high reliability, small volume, low cost and multi-chip combination, the semiconductor package density is higher and higher, the volume is smaller and higher, the weight is lighter and lower, and the cost is lower and higher. From the viewpoint of package development, semiconductor packages are gradually developed toward isolator product packages in consideration of the characteristic requirements of electronic products, such as volume, processing speed, product isolation, and the like.
Most of the traditional isolators adopt optical coupling isolators, and with the continuous progress of CMOS technology, the digital isolation technology starts to advance greatly, so that the reliability and the high speed are high, and the limit of the traditional optical coupling technology is far exceeded; the isolation product has the remarkable characteristics of protecting operators and low-voltage circuits from being influenced by high voltage, processing the grounding potential difference between communication subsystems and improving the noise resistance; meanwhile, the digital isolation chip manufactured by taking silicon dioxide as an isolation technology is superior to an optical coupler isolator in the aspects of the polymer with the highest dielectric strength, the service life of the silicon dioxide, the stability, the temperature and humidity resistant environment and the like.
At present, due to factors such as creepage of an isolation product, pressure resistance of a base island, coplanarity of the base island, high material utilization rate, unreasonable production process flow and the like in the conventional SOP300mil6L product, the isolation product has the problems of poor product quality, low reliability, low production efficiency and complex process flow.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an SOP300mil6L isolation structure frame packaging piece and a manufacturing method thereof, which can improve the production efficiency of products, reduce the packaging cost of the products and improve the quality and reliability of the products.
In order to achieve the purpose, the invention provides the following technical scheme:
an SOP300mil6L isolated structure frame package comprises an SOP300mil6L lead frame unit;
the SOP300mil6L lead frame unit is provided with a plurality of lead frame units;
the plurality of lead frame units are arranged in a matrix form, every two lead frame units in the transverse direction form a one-filling-two structure, a flow channel flushing groove is arranged between every two lead frame units in each group, internal force eliminating grooves are arranged on two sides of each lead frame unit in the transverse direction, and process grooves are arranged on two sides of each lead frame unit in the longitudinal direction;
the lead frame unit comprises a first base island and a second base island which are sequentially arranged from top to bottom, and inner pins for electrical connection are arranged on the first base island and the second base island; the first base island and the second base island are both provided with a coplanarity balance table and base island support ribs;
the middle areas of the first base island and the second base island are chip mounting areas, and the chip mounting areas are provided with a first digital isolation chip, a second digital isolation chip and an IC chip; the first digital isolation chip, the second digital isolation chip and the IC chip are electrically connected with the corresponding inner pins;
the first digital isolation chip, the second digital isolation chip and the IC chip are wrapped with plastic packaging bodies outside the first base island and the second base island.
Preferably, the inner pin is in a shape of snake head, horseshoe, L, T, duckbill, strip or shovel.
Preferably, the inner pins are provided with inner pin locking holes.
Preferably, the top of the SOP300mil6L lead frame unit is provided with an anti-reflection hole.
Preferably, the first base island and the second base island are both provided with base island silver plating layers, the inner pins are provided with inner pin silver plating layers, and the corresponding base island silver plating layers and the inner pin silver plating layers are connected through welding wires.
Preferably, the first base island and the second base island are both provided with base island locking holes.
Preferably, internal force eliminating grooves are arranged between every four groups of lead frame units in the transverse direction.
Preferably, the first digital isolation chip, the second digital isolation chip and the IC chip are mounted in the chip mounting area by chip bonding glue.
Preferably, the base island support rib is of a trapezoidal structure, and a back U-shaped groove or a back V-shaped groove is formed in the back of the base island support rib.
A method for manufacturing an SOP300mil6L isolation structure frame package comprises the following steps,
step 1, thinning and scribing the wafers of the IC chip, the first digital isolation chip and the second digital isolation chip;
step 2, bonding the IC chip, the first digital isolation chip and the second digital isolation chip at corresponding positions of a first base island and a second base island in an SOP300mil6L lead frame unit;
step 3, electrically connecting the IC chip, the first digital isolation chip and the second digital isolation chip with corresponding inner pins through bonding wires;
and 4, carrying out plastic package on the welded IC chip, the first digital isolation chip, the second digital isolation chip, the first base island and the second base island by wrapping plastic package bodies outside, carrying out tinning treatment and cutting off inner pins to form the SOP300mil6L isolation structure frame package.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides an SOP300mil6L isolated structure frame packaging piece, wherein coplanarity balance tables are respectively arranged in the left and right side areas of a first base island and a second base island in the transverse direction of a lead frame, and base island support rib structures are respectively arranged in the corresponding upper and lower side areas of the first base island and the second base island in the longitudinal direction of the lead frame, so that the coplanarity of the base islands of the lead frame is ensured, the deformation and the like of the lead frame in the aspects of production, manufacturing, transmission, transportation and the like are controlled, the process stability of products at bonding sheets and bonding wire stations is also ensured, and the product quality is ensured. When the product is used for welding wires, the wire welding clamp presses the frame base island, so that the problem of the wire welding process is solved; the corresponding process problems of products caused by links such as a lead frame transmission process, core feeding, pressure welding and the like are solved, and the product quality and reliability are improved;
according to the invention, the digital isolation chips and the IC chips with different functions are bonded on different base islands of the lead frame unit, the length of the bonding wire is shorter, so that the resistance of an SOP300mil6L packaging piece product is smaller, the conduction current is increased, the heating of the product is reduced, the electrical property number inhibition of the product can be improved, the packaging requirement of the product for outputting larger current can be met, the application performance and the application range of the SOP300mil6L packaging piece product are improved, and the packaging cost of the SOP300mil6L product is reduced.
Furthermore, the locking holes are formed in the inner pins, so that the plastic package material penetrates through the locking holes during plastic package, the plastic package body can be firmly combined with the base island, moisture can be prevented from permeating into the carrier, and the reliability of the product is improved.
Furthermore, the inner pin at one end of the lead frame unit is designed into a snake head shape, a horseshoe shape, an L shape, a T shape, a duckbill shape (a circular locking hole is arranged on the inner pin) or a strip shape or a shovel shape (connected with the base island), on one hand, the inner pin can be firmly fixed by the plastic package material, the movement of the inner pin due to the stress of thermal expansion is reduced, and the inner pin is prevented from being pulled out of the plastic package body when the outer pin is punched and formed in the rib cutting forming die, so that the damage of a product colloid is prevented, and the encapsulation performance and the reliability of the product are greatly improved; on the other hand, the bonding force between the lead frame copper alloy substrate and the plastic package material is enhanced, and the sealing property and the waterproof and moistureproof performance of the SOP300mil6L lead frame package product are improved.
Furthermore, a special isolation structure design is carried out on the base island ground wire area, the base island ground wire is designed to be an isolated island shape, corresponding C-shaped, L-shaped, concave, inverted buckle-shaped and long elliptical hole-shaped locking hole structures are added in the ground wire base island area, silver layer electroplating treatment is only carried out on the area, needing weld lines, of the whole lead frame base island structure, and bare copper in the other areas is subjected to coarsening treatment, so that the safety of base island ground wire welding is guaranteed, and the quality and the reliability of products are guaranteed.
Furthermore, the supporting rib structure of the coplanar balance table positioned near the plastic package body is trapezoidal, and a U groove or a V groove is additionally arranged at the back of the supporting rib structure, so that the problems of product creepage, product high-voltage discharge and product abnormity brought on the middle rib are thoroughly solved, and the product quality and the reliability are improved.
Drawings
FIG. 1 is a schematic diagram of a matrix structure of an SOP300mil6L leadframe of the present invention;
FIG. 2 is a schematic diagram of an SOP300mil6L leadframe unit structure according to the present invention;
FIG. 3 is a schematic diagram of a second SOP300mil6L leadframe unit structure according to the present invention;
FIG. 4 is a schematic diagram of a SOP300mil6L lead frame unit structure according to the present invention;
FIG. 5 is a back structure diagram of SOP300mil6L base island supporting ribs and a back dimple of the base island;
FIG. 6 is a schematic diagram of an electroplated silver layer of the SOP300mil6L lead frame unit structure of the present invention;
FIG. 7 is a schematic diagram of a second electro-plated silver layer of the SOP300mil6L lead frame unit structure of the present invention;
FIG. 8 is a schematic diagram of three electroplated silver layers of the SOP300mil6L lead frame unit structure of the present invention;
FIG. 9 is a schematic diagram of a chip attach film of the SOP300mil6L package of the present invention;
FIG. 10 is a schematic diagram of a two-chip bonding pad of the SOP300mil6L package of the present invention;
FIG. 11 is a schematic diagram of a three-die bond pad of the SOP300mil6L package of the present invention;
FIG. 12 is a schematic diagram of a wire bond for an SOP300mil6L leadframe package in accordance with the present invention;
FIG. 13 is a schematic diagram of two bonding wires of an SOP300mil6L lead frame package according to the present invention;
FIG. 14 is a schematic diagram of three bond wires for an SOP300mil6L leadframe package in accordance with the present invention;
FIG. 15 is a schematic diagram of bonding wires for the interconnection lines of the SOP300mil6L package digital isolation chip of the present invention;
FIG. 16 is a flow chart of the SOP300mil6L process of the present invention.
In the drawings: 1 is SOP300mil6L lead frame unit; 2 is a runner groove; 3 is an internal force eliminating groove; 4 is a process groove; 5 is an anti-reverse hole; 6, a plastic package body; 7 is a first left base island; 8 is a left second base island; 9 is the first right base island; 10 is the second right base island; 11 is a coplanarity balancing table; 12 is a first ground wire isolation island of the base island; 13 is a second ground isolation island of the base island; 14 is a third ground wire isolation island of the base island; 15 is the base island isolation spacing; 16 is a first inner pin; 17 is a second inner pin; 18 is a third inner pin; 19 is a base island supporting rib; 20 is an inner pin locking hole; 21 is an oval base island locking hole; 22 is a circular base island locking hole; 23 is a C-shaped base island locking hole; 24 is an L-shaped base island locking hole; 25 is an inner pin silver plating layer; 26 is a basal island silver plating layer; 27 is an IC chip; 28 is a first digital isolator chip; 29 is a second digital isolation chip; 30 is chip bonding glue; 31 is a first bonding wire; 32 is a second bonding wire; 33 is a third bonding wire; 34 is a first welding point; 35 is a second solder joint; 36 is a first inflection point; 37 is a second inflection point; 38 is the wire platen length; 39 is a back U-shaped groove; 40 is a back V-shaped groove; 41 is the wine pit on the back of the island.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
Examples
As shown in FIG. 1, the SOP300mil6L isolation structure frame package comprises an SOP300mil6L lead frame unit 1, and a multi-row multi-base-island multi-chip package structure arranged in a matrix high-density manner is arranged on the SOP300mil6L lead frame unit 1.
The SOP300mil6L lead frame unit 1 is used for a digital isolation chip, and an IC chip is electrically connected with an external pin; the SOP300mil6L lead frame unit 1 includes 5 rows of 32 columns for a total of 160 lead frame units.
As shown in fig. 2 to 8, the lead frame includes a plurality of lead frame units of a first filling and second structure arranged in a matrix form, the first filling and second structure means that two lead frame units are respectively arranged on the left and right of the horizontal direction of the flow channel, namely, two packages are respectively arranged on the left and right of the plastic package of the product; the first base island and the second base island refer to an upper base island and a lower base island in one lead frame unit. Every two transverse lead frame units form a group, a runner channel 2 is arranged between every two transverse lead frame units, and an internal force eliminating groove 3 is arranged between every two transverse lead frame units.
The frame size length × width × thickness of the SOP300mil6L lead frame unit 1: 269.6000 × 83.0000 × 0.2540mm, large unit pitch: 33.7500mm, small unit pitch: 16.8750mm, cumulative unit step: 253.1250mm, and the distance between the centers of the two plastic packages: 6.2300mm, locating hole to lead frame sheet corner trim distance, 3.8525mm at the beginning and 12.6225mm at the end.
Many bases of SOP300mil6L small and wide body isolation lead frame unit vertically includes from last first base island and the second base island of arranging in proper order down, this lead frame first base island and second base island are a set of, constitute a complete SOP300mil6L lead frame base island constitutional unit in proper order, as shown in FIG. 2, FIG. 3, FIG. 4 shows, be equipped with internal force between every lead frame unit and eliminate groove 3, be equipped with towards runner groove 2 between every group lead frame unit, transversely be equipped with internal force between every two sets of lead frame units 1 and eliminate groove 3, the pin both sides are equipped with the same technology groove 4 of structure and internal force elimination groove 3 about every group lead frame unit.
The SOP300mil6L lead frame comprises 6 inner pins and 2 base island support ribs 19, wherein the 6 inner pins are arranged on the upper side and the lower side of the first base island and the second base island; silver plating layers are arranged on the head part of the inner pin of the lead frame, the first base island and the second base island (partial areas).
Inner pin locking holes 20 are formed in 6 inner pins on two sides of the SOP300mil6L lead frame unit, wherein the upper right inner pin and the lower right inner pin are respectively connected with the corresponding base island on the SOP300mil6L lead frame unit; each base island support rib 19 on the SOP300mil6L lead frame unit is respectively connected with the corresponding base island on the lead frame unit; the coplanarity balancing tables 11 are respectively arranged in the left and right side areas of the first and second base islands of each SOP300mil6L lead frame unit, circular, oval, L-shaped and C-shaped locking holes are respectively arranged on the upper and lower base islands (partial areas), and isolated islands are isolated by the ground wires of the base islands.
According to the SOP300mil6L multi-base-island isolation structure lead frame sealing piece, the coplanarity balance tables 11 are respectively arranged in the left and right side areas of the first and second transverse base islands of the lead frame, and the base island support rib structures are respectively arranged in the corresponding upper and lower side areas of the first and second longitudinal base islands of the lead frame.
The first base island of SOP300mil6L many base island lead frame unit and second base island middle part region are the chip installation area, first base island is respectively through upper left, upper right a set of technology groove 4 and an internal force of upper end eliminate groove 3 and lead frame connection, the second base island is respectively through lower left, lower right a set of technology groove 4 and an internal force of lower extreme eliminate groove 3 and lead frame connection, whole lead frame unit does not have base island even muscle structural design, first base island and second base island back are equipped with base island back dimple 41 respectively, and whole lead frame is the alligatoring technology processing, thereby provide the safety guarantee to product quality and reliability.
Each group of lead frame units at the top of the SOP300mil6L lead frame body are provided with anti-reverse holes 5 at corresponding positions, so that the lead frames are prevented from being mixed and sealed during production, and packaged products are prevented from being scrapped.
The SOP300mil6L lead frame unit 1 comprises a first left base island 7, a second left base island 8, a first right base island 9 and a second right base island 10; each base island is connected with an inner pin which is a first inner pin 16, a second inner pin 17 and a third inner pin 18; the inner pin can be in a snake head shape, a horseshoe shape, an L shape, a T shape and a long strip shape. The upper side and the lower side of the first base island and the second base island are provided with 6 inner pins, and the inner pins distributed on the lower side of the second base island can be in a snake head shape, a horseshoe shape, a T shape or an H shape.
The inner pin is provided with a round locking hole 20, a base island supporting rib 19 connected with a frame base island, the head of the base island supporting rib positioned beside the plastic package body 6 is trapezoidal, and the back part of the base island supporting rib is additionally provided with a back U-shaped groove 39 or a back V-shaped groove 40;
the first inner pins 16 are respectively separated from the first base islands, and the second inner pins 17 and the third inner pins 18 are respectively connected with the first base islands; the head of the island supporting rib 19 connected with the frame island, which is positioned beside the plastic package body 6, is trapezoidal, and the back of the island supporting rib is additionally provided with a U groove 39 or a V groove 40; the first inner pins 16 are separated from the second base islands, respectively, and the second inner pins 17 and the third inner pins 18 are connected to the second base islands, respectively.
As shown in fig. 2, a group of elliptical base island locking holes 21, C-shaped base island locking holes 23, a base island second ground isolation island 13, a base island third ground isolation island 14 distributed on the second inner pin 17 are respectively arranged in the right region of the first base island bearing area, a group of circular base island locking holes 22, a base island first ground isolation island 12, and a first base island coplanar balancing table 11 are arranged in the left region; a group of oval base island locking holes 21 are formed in the right area of the second base island bearing area, base island third ground wire isolation isolated islands 14 distributed on the inner pins of the 17, a second base island coplanarity balancing table 11, and base island isolation gaps 15 are formed between the first base island and the second base island.
As shown in fig. 3, a group of L-shaped base island locking holes 24 and a first base island coplanarity balancing stand 11 are arranged in the right region of the first base island bearing area, a group of inverted L-shaped base island locking holes 24 and a second base island coplanarity balancing stand 11 are arranged in the right region of the second base island bearing area, and a base island isolation gap 15 is arranged between the first base island and the second base island.
As shown in fig. 4, the ground isolation islands 14 are provided through the third inner pins 18 connected to the first base island, the first base island coplanarity balance stands 11 are provided on the left and right sides of the base island, the third base island isolation islands 14 are provided through the inner pins 18 connected to the second base island, a group of oval base island locking holes 21 are provided in the left region of the second base island bearing area, the second base island coplanarity balance stands 11 are provided on the left and right sides of the base island, and the base island isolation gap 15 is provided between the first base island and the second base island.
Through the structural design, the base island silver plating layers 26 are respectively arranged on the ground wire isolation isolated islands of the first base island and the second base island in the figures 6, 7 and 8 and beside the base island locking holes, and the inner pin silver plating layers 25 are arranged at the heads of the inner pins; the ground wire isolation area is an area where the periphery of the ground wire isolation island is separated from the frame base island, and aims to improve the reliability and quality of the ground wire and prevent the diffusion of bonding glue to cause the desoldering of the welded ground wire; the surfaces of other areas of the base island and the inner pin are bare copper, the back of the base island is provided with a corresponding base island back dimple 41, the central areas of the first base island and the second base island are chip mounting areas, the whole lead frame structure is a flat plate structure without bending, meanwhile, the whole lead frame is subjected to roughening process, and the special structural design is combined with a corresponding electroplated silver layer, so that the coplanarity of the multi-base island lead frame and the safety of the base island ground wire and the inner pin welding wire are ensured, and the quality and the reliability of the product are also ensured. Meanwhile, the first base island is connected with the SOP300mil6L lead frame unit 1 through the process groove 4 and the internal force elimination groove 3 respectively, the second base island is connected with the SOP300mil6L lead frame unit 1 through the process groove 4 and the internal force elimination groove 3 respectively, and the left side and the right side of the base island of the whole lead frame unit are not provided with base island connecting rib structural designs; therefore, the packaging process flow and the product creepage distance requirement of the SOP300mil6L multi-base island lead frame package are met.
As shown in fig. 9 to 14, an SOP300mil6L multi-base-island isolated lead frame package includes an SOP300mil6L lead frame unit 1, an IC chip 27, a first digital isolated chip 28, and a second digital isolated chip 29, where according to the chip bonding positions in the chip bonding diagrams of fig. 9, 10, and 11, chip bonding glue 30 is respectively sprayed on the chip mounting areas in the middle of the first base island and the second base island of the lead frame, and the IC chip 27, the first digital isolated chip 28, and the second digital isolated chip 29 are respectively bonded on the chip mounting areas in the middle of the first base island and the second base island of the lead frame; a first surface bonding pad of the IC chip 27 is connected with the inner pin silver plating layers 25 on the first inner pin 16 and the second inner pin 17 through a first bonding wire 31, is connected with a chip interconnection bonding pad on the first surface of the first digital isolation chip 28 through a third bonding wire 33, the first surface of the first digital isolation chip 28 is connected with a first ground isolation island 12 on a first ground isolation island 7 on the left side and a silver plating layer 26 on a second ground isolation island 13 on the left side through a second bonding wire 32, is connected with a chip interconnection bonding pad on the first surface of the second digital isolation chip 29 through a third bonding wire 33, and a chip bonding pad on the first surface of the second digital isolation chip 29 is connected with the inner pin silver plating layers 25 on the first inner pin 16 and the second inner pin 17 through the first bonding wire 31; the second surfaces of the SOP300mil6L lead frame unit 1, the IC chip 27, the first digital isolation chip 28 and the second digital isolation chip 29 are externally coated with the plastic package body 6.
The first surface bonding pad of the first digital isolation chip 28 is connected with the inner pin silver plating layer 25 on the first inner pin 16 through a first bonding wire 31, is connected with the base island silver plating layer 26 beside the L-shaped base island locking hole 24 on the right first base island 9 through a second bonding wire 32, is connected with the chip interconnection bonding pad on the first surface of the first digital isolation chip 28 and the chip interconnection bonding pad on the first surface of the second digital isolation chip 29 through a third bonding wire 33, is communicated with the inner pin silver plating layer 25 on the first inner pin 16, the second inner pin 17 and the base island silver plating layer 26 through the first bonding wire 31 and the second bonding wire 32, and is covered with the plastic package body 6 outside the second surface of the first digital isolation chip 28 and the second digital isolation chip 29.
The first surface bonding pad of the first digital isolation chip 28 is connected with the inner pin silver plating layer 25 on the first inner pin 16 and the third inner pin 18 through a first bonding wire 31, the chip interconnection bonding pads on the first surface of the first digital isolation chip 28 and the second digital isolation chip 29 are connected through a third bonding wire 33, the island silver plating layer 26 on the left side area of the oval island locking hole 21 on the second island 10 on the right side is communicated through a second bonding wire 32, the chip bonding pad on the first surface of the second digital isolation chip 29 is communicated with the inner pin silver plating layer 25 on the first inner pin 16 and the third inner pin 18 through the first bonding wire 31, and the plastic package body 6 is coated outside the second surface of the first digital isolation chip 28 and the second digital isolation chip 29.
Compared with the existing SOP300mil6L multi-base-island isolation structure lead frame package, the SOP300mil6L multi-base-island isolation structure lead frame has the advantages that the inner pin at one end of the lead frame unit is designed into a snake head shape, a horseshoe shape, an L shape, a T shape, a duckbill shape (a circular locking hole is formed in the inner pin) or a long strip shape or a shovel shape (connected with a base island), on one hand, the inner pin can be firmly fixed by a plastic package material, the movement of the inner pin due to the stress of thermal expansion is reduced, the outer pin is punched in a rib cutting forming die, and the inner pin is prevented from being pulled out of the plastic package body during forming, so that the damage of a product colloid is prevented, and the package performance and the reliability of a product are greatly improved; on the other hand, the bonding force between the lead frame copper alloy substrate and the plastic package material is enhanced, and the sealing property and the waterproof and moistureproof performance of the SOP300mil6L lead frame package product are improved.
According to the SOP300mil6L multi-base-island isolation structure lead frame packaging piece, digital isolation chips and IC chips with different functions are bonded on different base islands of a lead frame unit, bonding wires after bonding of the chips, ground wire isolation islands and inner pins are carried out by gold wires, copper wires or silver alloy wires are short in length, so that the resistance of an SOP300mil6L packaging piece product is smaller, the conduction current is increased, the heating of the product is reduced, the electrical property number inhibition of the product can be improved, meanwhile, the matching of product performance requirements from one channel to three channels of an SOP300mil6L packaging piece product interconnection channel and the operation of a multi-channel product is realized by increasing the number of interconnection bonding wires among the chips, the packaging requirement of the product for outputting larger current is met, the application performance and the application range of the SOP300mil6L packaging piece product are improved, and the packaging cost of the SOP300mil6L product is reduced.
According to the SOP300mil6L multi-base-island isolation structure lead frame sealing piece, the locking holes are formed in the inner pins connected with the base islands, and during plastic packaging, plastic packaging materials penetrate through the locking holes, so that the plastic packaging body and the base islands can be firmly combined, moisture can be prevented from penetrating into a carrier, and the reliability of products is improved.
According to the SOP300mil6L lead frame packaging piece with the multi-island isolation structure, a special isolation structure design is carried out on an island ground wire area, the island ground wire is designed to be an isolated island, corresponding C-shaped, L-shaped, concave, inverted buckle-shaped and long elliptical hole-shaped locking hole structures are added in the ground wire island area, only areas needing bonding wires on the whole lead frame island structure are subjected to silver electroplating layer treatment, and bare copper in the rest areas is subjected to coarsening treatment, so that the safety of island ground wire welding is guaranteed, and the quality and reliability of products are guaranteed.
As shown in fig. 15, according to the wire bonding method for the digital isolation chip interconnection line of the SOP300mil6L multi-island isolation structure lead frame package of the present invention, according to the wire bonding diameter requirement of the package product, firstly, a solder ball is planted on the pad of the interconnection bonding wire on the first surface of the chip of the second digital isolation chip 29, the height of the solder ball is controlled to be 5 μm ± 2 μm, then, the first bonding pad 34 is arranged on the pad of the interconnection bonding wire on the first surface of the chip of the first digital isolation chip 28, then, the first inflection point 36 of the wire bonding arc is arranged, the height of the wire bonding arc is controlled to be 150 μm ± 30 μm, then, the length 38 of the wire bonding platform is arranged, the length of the wire bonding platform is controlled to be 70% 1-2 times of the base island distance 15 of the SOP300mil6L multi-island isolation structure lead frame, the second inflection point 37 of the wire bonding arc is arranged, the height of the wire bonding arc is controlled to be 150 μm ± 30 μm, and finally, the second bonding wire of the interconnection bonding wire of the digital isolation chip is arranged according to the wire, and the wire interconnection bonding wire is finally, the third interconnection line 33 is formed according to the wire required by the wire diameter requirement of the SOP300mil6L multi-island isolation structure lead frame package product lead frame of the multi-island isolation structure lead frame of the SOP300mil6L multi-island isolation structure lead frame.
Compared with the conventional SOP300mil6L base island isolation lead frame, the SOP300mil6L base island isolation lead frame has the advantages of high-density arrangement, the utilization rate of copper materials is high, the production efficiency of the conventional product can be greatly improved, a large amount of manpower and material resources are saved, the size of a colloid of the SOP300mil6L product is small, the utilization rate of the material of the whole product is high, the SOP300mil6L base island isolation lead frame can meet the functions of the SOP300mil6L product in product application, and the SOP300mil6L base island isolation lead frame can replace the conventional SOP300mil6L package. Meanwhile, optimization innovation is conducted on the SOP300mil6L multi-base-island lead frame structure design, the non-base-island connecting rib structure design on the left side and the right side of a base island is kept, meanwhile, a base-island support rib structure located near a plastic package body is set to be trapezoidal, and a U groove or a V groove is additionally arranged on the back of the base-island support rib structure, so that the problems of product creepage and product abnormity of high-voltage discharge of a product and a middle rib are thoroughly solved, meanwhile, the product quality and the reliability are also improved, the product has greater advantages in the aspects of low cost, high cost performance, use and the like, and the market application prospect is wider. The relevant dimensional comparison of the lead frame is detailed in table 1.
TABLE 1 comparison of the dimensions of the inventive frame with respect to the existing frame profile
Figure BDA0003756336890000121
As shown in fig. 16, the multi-chip sealed package production process flow of the SOP300mil6L multi-base-island isolated lead frame of the present invention starts with the inspection of the incoming wafer material, and passes through multiple manufacturing stations such as scribing thinning, chip mounting and bonding, and finally completes the product packaging and shipment, the stations to be passed through in the middle and the corresponding process flow requirements, so as to form a complete production process flow.
The invention discloses a multi-chip combined package of an SOP300mil6L multi-base-island isolation lead frame, which is produced by the following steps:
firstly, carrying out corresponding wafer inspection on customer incoming wafers according to wafer inspection standards and requirements, and inputting the qualified customer wafers after the wafer inspection to a packaging part thinning scribing site; the thinning scribing station carries out automatic chip mounting on an IC chip 27 wafer, a first digital isolation chip 28 wafer and a second digital isolation chip 29 wafer to 8-inch or 12-inch film-breaking rings respectively by using a full-automatic chip mounter; according to the requirement that the thickness of a chip of an SOP300mil6L product is controlled to be 200 mu m +/-10 mu m packaging thickness, a full-automatic thinning machine is used for sequentially thinning an IC chip 27 wafer, a first digital isolation chip 28 wafer and a second digital isolation chip 29 wafer, the thickness of 725 mu m +/-20 mu m of the thickness of the supplied materials of the wafers is automatically thinned according to the requirement of 200 mu m +/-10 mu m thickness control, then a full-automatic chip mounting and film uncovering machine is used for sequentially carrying out automatic chip mounting and film uncovering on the thinned IC chip 27 wafer, the first digital isolation chip 28 wafer and the second digital isolation chip 29 wafer, and the wafers are sequentially placed in an oven at the temperature of 60 +/-5 ℃ for baking for 5-10 mins after the chip mounting and the film uncovering are finished; after baking, the IC chip 27 wafer, the first digital isolation chip 28 wafer and the second digital isolation chip 29 wafer are respectively cut into single IC chips 27, first digital isolation chips 28 and second digital isolation chips 29 in sequence by using a full-automatic scribing machine; and then flushing and blowing off waste residues and water stains on the cut IC chip 27, the first digital isolation chip 28 and the second digital isolation chip 29 by using a high-pressure air gun, and then sequentially carrying out two-light% inspection, wherein the IC chip with the product quality defect, the first digital isolation chip and the second digital isolation chip are correspondingly marked during inspection so as to be accurately identified by a later station during product packaging, and after the inspection, the qualified IC chip 27, the first digital isolation chip 28 and the second digital isolation chip 29 are conveyed to a core feeding station.
And secondly, a one-to-three or one-to-two full-automatic core feeding machine with three or two bonding head functions is utilized by a core feeding station to automatically suck an SOP300mil6L multi-island isolated lead frame of the invention to be arranged on a conveying guide rail of the core feeding machine, and the lead frame is automatically transmitted to the center of a worktable of the core feeding and bonding machine through an automatic transmission system of the core feeding and bonding machine and is automatically clamped. For the package of the lead frame with the SOP300mil6L multi-base-island isolation structure, a dispensing manipulator of a chip-on die bonder sequentially dots a proper amount of bonding glue on chip mounting areas on a first base island and a second base island of an SOP300mil6L multi-base-island isolation lead frame unit 1 according to the position requirements of bonding sheets in the figures 9, 10 and 11, respectively, a full-automatic chip-on die bonder with three or two bonding heads is used, 1 IC chip 27 is respectively bonded and placed on the bonding glue 30 through the first bonding head according to a set chip-on-bonding program in front of the chip-on-bonding sheet and the bonding requirements of the figures 9, 10 and 11, the 1 chip in the second digital isolation chip 29 is respectively bonded and placed on the bonding glue 30 through the second bonding head, the number of the bonding sheets of the required products is completed according to the sequence, then, the chip-on-bonding sheets is cured once through the chip-on-bonding process to achieve the purpose that bonding wires are firmly bonded on the chip-on the anti-bonding layer at a high temperature, and then the chip-on-bonding wire is baked to complete the chip-on-bonding-pad product.
And thirdly, for the SOP300mil6L multi-island isolation structure lead frame packaging part product, performing plasma cleaning before pressing and welding wires, cleaning pollutants on the multi-island isolation structure lead frame and the IC chip, the first digital isolation chip and the second digital isolation chip, and improving the quality and reliability of product welding wires, then bonding the IC chip, the first surface bonding pad of the first digital isolation chip and the second digital isolation chip with corresponding welding wires according to the SOP300mil6L lead frame packaging part wire welding schematic diagram 12, FIG. 13, FIG. 14 and related welding wire requirements, and bonding the first surface bonding pads of the IC chip, the first digital isolation chip and the second digital isolation chip with the lead frame inner pin, the ground wire isolation island and the silver plating layer of the lead frame base island isolation area by using a full-automatic ultrasonic welding machine, according to the mode, completing the product welding wires with the required quantity of the SOP300mil6L, after the product welding wires are completed, checking is performed through three-optical% checking, marking products with quality defects beside the lead frame, facilitating post-station identification, and then sending the products to a plastic package station for product packaging.
And fourthly, performing plasma cleaning treatment before plastic packaging on the product before plastic packaging, eliminating pollutants on a lead frame with a multi-base island isolation structure and an IC chip, a first digital isolation chip and a second digital isolation chip, and oxides and other substances on a base island of the lead frame, so as to improve the quality and reliability of the packaged product, then using a full-automatic packaging machine, selecting plastic packaging materials with corresponding specifications to complete packaging of the SOP300mil6L product, then sending the SOP300mil6L product subjected to plastic packaging into a post-curing high-temperature oven for curing, setting the temperature of the oven at 170 +/-10 ℃, controlling the baking time at 8 +/-0.5 h, sending the SOP300mil6L product into a reflow soldering furnace for one-time reflow soldering process treatment after the SOP300mil6L product is subjected to post-curing baking, selecting the SOP300mil6L product with abnormal quality, selecting the SOP300mil6L product and marking the product on the surface of a product colloid, so that a post-station is separated from the SOP300mil6L product, and removing the lead frame according to produce tin packages, thereby ensuring the quality of the packaged product and the tin package.
Fifthly, the SOP300mil6L lead frame packaging piece product finished at the last station is subjected to flash removing treatment by utilizing a hot boiling softening process, then tinning and post-tinning baking process flow treatment are carried out, and the product is sent to a printing station to be printed after the completion.
And sixthly, the printing station utilizes a full-automatic laser printer to print the product on the SOP300mil6L lead frame packaging part which is subjected to tinning treatment according to the corresponding printing specification and the requirement of a customer on the product, and the product is sent to the rib cutting station after the printing is finished.
Seventhly, utilizing full-automatic rib cutting and forming integrated machine equipment at a rib cutting station, adding a pre-cutting station in the operation action of the equipment, firstly utilizing a rib cutting die to perform pre-cutting action on an SOP300mil6L lead frame packaging part product, cutting a base island support rib structure on a lead frame base island from a U groove or a V groove at the back of the base island support rib structure, then utilizing the SOP300mil6L rib cutting die to perform rib cutting and processing in the product, then performing product forming and separating processing according to four steps, firstly performing pre-forming processing on pins of the SOP300mil6L lead frame packaging part product, secondly performing forming processing on the pins of the product, thirdly cutting off six pins of the SOP300mil6L lead frame packaging part product, fourthly cutting off pins connected with the SOP300mil6L lead frame packaging part product processing groove 4 and internal force eliminating grooves 11 and 14, completing separation of the SOP300mil6L lead frame packaging part product, then performing packaging before packaging to obtain a finished product, and finally baking the whole SOP 300L lead frame packaging.
Compared with the existing production method of the SOP300mil6L lead frame packaging part, the production method provided by the invention can reduce the requirement of a secondary light inspection% inspection flow added in a scribing station, and ensure the quality and reliability of products in the scribing station.
The chip mounting and adhering station utilizes a one-to-three or one-to-two full-automatic chip mounting machine with three or two bonding head functions, and a one-time curing and baking process shortens the chip mounting and adhering time of a product, improves the working efficiency of the chip mounting and adhering, reduces the packaging cost of the product, and more importantly, the chip mounting station adopts the one-time curing and baking process, so that the problems of contamination, oxidation and the like of an IC chip, a first digital isolation chip, a second digital isolation chip and a multi-base-island isolation lead frame caused by chip mounting and baking are solved, and the product quality and reliability after the chip mounting and adhering are ensured.
Plasma cleaning is adopted before pressure welding, and three-light% inspection is carried out after pressure welding and wire welding are finished, so that the quality and the reliability of products at a pressure welding station after wire welding are ensured.
The plasma cleaning process before plastic packaging is adopted to treat the product after the welding line, so that the factors of a multi-island isolated lead frame and an IC chip, first and second digital isolated pollutants, frame island oxidation and the like which influence the quality and reliability of the product are eliminated, the quality and reliability of the product after plastic packaging are strongly ensured, meanwhile, a reflow soldering one-step process is additionally arranged after the product is solidified, the tinning adopts the hot boiling softening process treatment requirement, the quality and reliability of the product are fully ensured, and the quality and reliability of the product are more favorable.
The series of processing steps not only effectively solve the problems that the base island support rib structure of the lead frame packaging part with the multi-base island isolation structure cannot be cut off at the bar cutting station and the risk of the middle rib is brought, but also meet the process requirements of the bar cutting station product, meet the process requirements of the lead frame with the multi-base island isolation structure without base island connection rib special structural design when the bar is cut and formed, and fully ensure the product quality and reliability of the bar cutting station.

Claims (10)

1. An SOP300mil6L isolation structure frame package is characterized by comprising an SOP300mil6L lead frame unit (1);
the SOP300mil6L lead frame unit (1) is provided with a plurality of lead frame units;
the plurality of lead frame units are arranged in a matrix form, every two lead frame units in the transverse direction form a one-filling-two structure, a runner channel (2) is arranged between every two lead frame units in each group, internal force eliminating grooves (3) are arranged on two sides of each lead frame unit in the transverse direction, and process grooves (4) are arranged on two sides of each lead frame unit in the longitudinal direction;
the lead frame unit comprises a first base island and a second base island which are sequentially arranged from top to bottom, and inner pins for electrical connection are arranged on the first base island and the second base island; a coplanarity balance table (11) and a base island supporting rib (19) are arranged on the first base island and the second base island;
the middle areas of the first base island and the second base island are chip mounting areas, and a first digital isolation chip (28), a second digital isolation chip (29) and an IC chip (27) are mounted in the chip mounting areas; the first digital isolation chip (28), the second digital isolation chip (29) and the IC chip (27) are electrically connected with the corresponding inner pins;
the first digital isolation chip (28), the second digital isolation chip (29) and the IC chip (27) are covered with a plastic package body (6) outside the first base island and the second base island.
2. The SOP300mil6L spacer structural frame package of claim 1, wherein the inner leads are serpentine, horseshoe, L, T, duckbill, elongated, or scoop shaped.
3. The SOP300mil6L isolation structure frame package of claim 1, wherein said inner leads are each provided with an inner lead locking hole (20).
4. The SOP300mil6L isolation structure frame package of claim 1, wherein the top of the SOP300mil6L lead frame unit (1) is provided with an anti-reflection hole (5).
5. The SOP300mil6L isolating structural frame package of claim 1, wherein the first and second islands are each provided with an island silver-plated layer (26), the inner leads are provided with inner lead silver-plated layers (25), and the corresponding island silver-plated layers (26) and the inner lead silver-plated layers (25) are connected by bonding wires.
6. The SOP300mil6L isolation structural frame package of claim 1, wherein said first and second base islands each have a base island locking hole disposed thereon.
7. The SOP300mil6L spacer structure frame package of claim 1, wherein an internal force relief groove (3) is formed between every four sets of lead frame units in the transverse direction.
8. The SOP300mil6L isolation structural frame package of claim 1, wherein the first digital isolation chip (28), the second digital isolation chip (29), and the IC chip (27) are mounted to the chip mounting area by a chip attach adhesive (30).
9. The SOP300mil6L isolation structural frame package of claim 1, wherein the island support ribs (19) are in a trapezoid structure, and back U-shaped grooves (39) or back V-shaped grooves (40) are formed in the back of the island support ribs (19).
10. A method for manufacturing an SOP300mil6L isolation structure frame package is characterized by comprising the following steps of,
step 1, carrying out thinning and scribing treatment on wafers of an IC chip (27), a first digital isolation chip (28) and a second digital isolation chip (29);
step 2, bonding an IC chip (27), a first digital isolation chip (28) and a second digital isolation chip (29) at corresponding positions of a first base island and a second base island in an SOP300mil6L lead frame unit (1);
step 3, electrically connecting the IC chip (27), the first digital isolation chip (28) and the second digital isolation chip (29) with corresponding inner pins through bonding wires;
and 4, carrying out plastic package on the welded IC chip (27), the first digital isolation chip (28), the second digital isolation chip (29), the first base island and the second base island, and the outer coating plastic package body (6), carrying out tinning treatment and cutting off inner pins to form the SOP300mil6L isolation structure frame package part.
CN202210862022.3A 2022-07-20 2022-07-20 SOP300mil6L isolation structure frame packaging part and manufacturing method Pending CN115188732A (en)

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Application Number Priority Date Filing Date Title
CN202210862022.3A CN115188732A (en) 2022-07-20 2022-07-20 SOP300mil6L isolation structure frame packaging part and manufacturing method

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