CN116031169B - Control method for thickness flatness of small chip solder - Google Patents
Control method for thickness flatness of small chip solder Download PDFInfo
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- CN116031169B CN116031169B CN202310323657.0A CN202310323657A CN116031169B CN 116031169 B CN116031169 B CN 116031169B CN 202310323657 A CN202310323657 A CN 202310323657A CN 116031169 B CN116031169 B CN 116031169B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention discloses a control method for the thickness flatness of a small chip solder, which aims to solve the problem of uneven solder thickness in the existing die bonding technology, and comprises the following steps: providing a frame carrier, wherein the surface of the frame carrier is covered with a sticky sheet material, and the sticky sheet material is soft solder; the single side of the target chip is smaller than 4000um; the soft solder die bonder comprises a welding head, wherein the welding head performs vacuum, weak blowing, strong blowing and airless conversion through an electromagnetic valve, and the welding head is connected with a suction nozzle; and blowing off the target chip from the suction nozzle through the welding head at a certain height, and blowing off the target chip onto the frame carrier to adhere the target chip. The method uses a high polishing process, and uses a higher welding height and a certain weak blowing to adhere the chip, so that the solder can flow back completely after the chip is adhered, the thickness of the four-pin solder of the chip can be basically consistent, the flatness after the chip is adhered is ensured, and the difficulty of influencing the subsequent process processing due to uneven thickness of the solder can be greatly reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor device packaging, in particular to a control method for thickness flatness of a small chip solder.
Background
The general power semiconductor package is that after the wafer from the previous process is diced into small chips (Die), then the individual chips are adhered to the frame carrier by using adhesive materials, then the bonding pads of the chips are connected with corresponding frame pins by using metal wires to form a circuit meeting the requirements, then the circuit is packaged and protected by using a plastic shell or other shells, and then the packaging is completed by processes of solidification, tin-plating, rib cutting and the like.
The current common bonding process is to bond a single chip to a carrier covered with a bonding material through bonding equipment, wherein the bonding equipment comprises a welding head, a vacuum tube and a steel nozzle are connected to the welding head, a common suction nozzle is arranged on the steel nozzle, the welding head is used for switching among vacuum, weak blowing, strong blowing and no air through an electromagnetic valve, the welding head is used for controlling vacuum through the electromagnetic valve, the chip is picked up through the suction nozzle, the vacuum is converted into weak blowing through the electromagnetic valve to separate the chip from the suction nozzle, and the chip is bonded to the carrier covered with the bonding material by utilizing the welding strength and the welding height of the welding head. The soft solder is used as a bonding sheet material for packaging the power semiconductor chip, has high-efficiency heat dissipation and high conductivity, and a product packaged by the soft solder has higher reliability. However, in the actual bonding process, the soft solder works at high temperature, so that the fluidity and reflux property of the soft solder are not stable enough, the setting for ensuring the welding height of the cavity is low, the flatness of the solder is difficult to ensure after bonding, and the soft solder is particularly remarkable for small chips. The uneven solder not only can affect the subsequent wiring, but also can reduce the reliability of the product, shorten the service life of the product and reduce the packaging yield of the product.
Disclosure of Invention
The invention provides a control method for the thickness flatness of a small chip solder, which aims to solve the problem of the thickness flatness of the solder in the background technology.
The technical scheme provided by the invention is as follows:
the invention provides a control method for the thickness flatness of a small chip solder, which comprises the following steps:
providing a frame carrier, wherein the surface of the frame carrier is covered with a sticky sheet material, and the sticky sheet material is soft solder;
the single side of the target chip is smaller than 4000um;
the soft solder die bonder comprises a welding head, wherein the welding head performs vacuum, weak blowing, strong blowing and airless conversion through an electromagnetic valve, and the welding head is connected with a suction nozzle;
and blowing off the target chip from the suction nozzle at a certain height through the welding head, and blowing off the target chip onto the frame carrier to adhere the chip.
Further, the blowing the target chip away from the suction nozzle by the bonding head at a certain height includes:
adjusting the heights of the suction nozzle and the surface of the target chip;
converting the suction nozzle into a vacuum state through the electromagnetic valve, and adsorbing the target chip;
measuring the welding height at the welding window;
and transferring the chip to the upper part of the frame carrier through the welding head, switching the vacuum state to a weak blowing state through an electromagnetic valve, and blowing off the target chip from the suction nozzle at a certain height.
Further, before the adjusting the height between the suction nozzle and the target chip surface, the method further includes:
correspondingly mounting the suction nozzle on the welding head according to the direction of the target chip;
and adjusting the position of the suction nozzle in the X/Y direction to ensure that the center point of the suction nozzle and the center point of the DCC of the soft solder die bonder are in the same straight line.
Further, before the transferring the chip over the frame carrier by the bonding tool, the method further comprises:
the flow is regulated to 0.03 MPa-0.06 MPa through a weak blowing air flow regulating valve of the welding head.
Further, in the process of sticking the sheet, the temperature is 340-360 ℃.
Further, before the transferring the chip over the frame carrier by the bonding tool, the method further comprises:
and setting parameters of the soft solder die bonder, setting a welding height compensation value BLT to be 100 um-600 um, setting the time delay of the bonding sheet to be 10 ms-30 ms, and setting the bonding strength to be 60 g-80 g.
Further, the chip is transferred to the upper part of the frame carrier through the welding head, the vacuum state is switched to a weak blowing state through the electromagnetic valve, and the target chip and the suction nozzle are blown off at a certain height, specifically:
clicking the automatic welding function of the soft solder die bonder, carrying out tin drawing on the frame carrier according to set parameters, conveying the frame carrier to a welding window after the tin drawing is finished, transferring the target chip to a target position through the welding head, switching into a weak blowing state through closing a vacuum state of the electromagnetic valve, and blowing off the target chip and the suction nozzle.
Further, parameter setting is carried out on the soft solder die bonder, the flow is regulated to 0.04MPa through a weak blowing air flow regulating valve of the welding head, a welding height compensation value BLT is set to 300um, the bonding temperature is set to 350 ℃, the bonding delay is set to 20ms, and the bonding strength is set to 70g.
Further, the welding head is further connected with a vacuum tube, the vacuum tube is connected with an electromagnetic valve, the electromagnetic valve is a two-position three-way electromagnetic conversion valve, the electromagnetic valve is connected with a compressed air input tube, a nitrogen-hydrogen mixed gas input tube and a vacuum air flow input tube, the nitrogen-hydrogen mixed gas input tube provides weak blowing and is connected with a flow regulating valve, the size of the weak blowing is regulated through the flow regulating valve, the compressed air input tube provides strong blowing, the vacuum air flow input tube provides vacuum, and the welding head is switched among a vacuum state, a weak blowing state, a strong blowing state and an airless state through the electromagnetic valve.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a control method for the thickness flatness of a small chip solder, which uses a high-polishing process in the process of sticking the chip, namely, a higher welding height and a certain weak blowing are utilized to stick the chip, the solder can be completely reflowed after the chip is stuck, the thickness of the solder at four corners of the chip can be basically consistent, the height difference is not more than 45 mu m, the flatness after the chip is stuck is ensured, and the processing difficulty affecting the subsequent working procedure due to the uneven thickness of the solder can be greatly reduced.
Drawings
FIG. 1 is a flow chart of a method for controlling the thickness flatness of a microchip solder in an embodiment of the present invention;
FIG. 2 is a schematic view of a bonding tool according to an embodiment of the present invention;
FIG. 3 illustrates various temperature control zones of a soft solder die bonder track in accordance with an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a suction nozzle according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a suction nozzle after picking up a chip according to an embodiment of the present invention.
The reference numerals are as follows:
1-welding head; 2-a flow regulating valve; 3-electromagnetic switching valve; 4-vacuum tube; a 5-nitrogen-hydrogen mixed gas input pipe; 6-an equipment air supply system; 7-a vacuum air flow input pipe; 8-compressed air input pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the embodiments described below are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Accordingly, the following detailed description of the embodiments of the present application, taken in conjunction with the accompanying drawings, is intended to represent only selected embodiments of the present application, and not to limit the scope of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific circumstances.
Fig. 1 is a flow chart of a method for controlling thickness flatness of a small chip solder in an embodiment of the invention, fig. 2 is a schematic structural diagram of a soldering head in an embodiment of the invention, fig. 3 is a schematic diagram of each temperature control area of a track of a soft solder die bonder in an embodiment of the invention, fig. 4 is a schematic sectional view of a suction nozzle in an embodiment of the invention, and fig. 5 is a schematic diagram after the suction nozzle picks up a chip in an embodiment of the invention.
The invention provides a control method for the thickness flatness of a small chip solder, which comprises the following steps:
providing a frame carrier, wherein the surface of the frame carrier is covered with a sticky sheet material, and the sticky sheet material is soft solder;
the single side of the target chip is smaller than 4000um;
the soft solder die bonder comprises a welding head, wherein the welding head performs vacuum, weak blowing, strong blowing and airless conversion through an electromagnetic valve, and the welding head is connected with a suction nozzle;
and blowing off the target chip from the suction nozzle at a certain height through the welding head, and blowing off the target chip onto the frame carrier to adhere the chip.
Wherein the frame carrier surface is provided with leads. The chiplet referred to in the present invention is a chip with a single side smaller than 4000 um. By adopting the method for sticking the chip, the solder can be completely reflowed after the chip is stuck, the thicknesses of the solder at four corners of the chip can be basically consistent, the height difference is small, and the flatness after the chip is stuck is ensured.
Referring to fig. 1, the process of blowing the target chip from the suction nozzle by the bonding head at a certain height includes the following steps:
and step 101, adjusting the heights of the suction nozzle and the surface of the target chip.
And 102, converting the suction nozzle into a vacuum state through the electromagnetic valve, and adsorbing the target chip.
And 104, transferring the chip to the upper part of the frame carrier through the welding head, switching the vacuum state to a weak blowing state through an electromagnetic valve, and blowing off the target chip from the suction nozzle at a certain height.
Preferably, before adjusting the height between the suction nozzle and the target chip surface, the method further includes:
correspondingly mounting the suction nozzle on the welding head according to the direction of the target chip;
and adjusting the position of the suction nozzle in the X/Y direction to ensure that the center point of the suction nozzle and the center point of the DCC of the soft solder die bonder are in the same straight line.
Preferably, before the chip is transferred over the frame carrier by the bonding tool, the method further comprises:
the flow is regulated to 0.03 MPa-0.06 MPa through a weak blowing air flow regulating valve of the welding head.
Preferably, the temperature is 340-360 ℃ in the process of sticking the sheet.
Preferably, before the chip is transferred over the frame carrier by the bonding tool, the method further comprises:
and setting parameters of the soft solder die bonder, setting a welding height compensation value BLT to be 100 um-600 um, setting the time delay of the bonding sheet to be 10 ms-30 ms, and setting the bonding strength to be 60 g-80 g.
Preferably, the chip is transferred to the upper part of the frame carrier through the welding head, the vacuum state is switched to a weak blowing state through the electromagnetic valve, and the target chip and the suction nozzle are blown off at a certain height, specifically:
clicking the automatic welding function of the soft solder die bonder, carrying out tin drawing on the frame carrier according to set parameters, conveying the frame carrier to a welding window after the tin drawing is finished, transferring the target chip to a target position through the welding head, switching into a weak blowing state through closing a vacuum state of the electromagnetic valve, and blowing off the target chip and the suction nozzle.
Preferably, the soft solder die bonder is subjected to parameter setting, a weak blowing flow regulating valve of the welding head is used for regulating the flow to 0.04MPa, a welding height compensation value BLT is set to 300um, the die bonding temperature is set to 350 ℃, the die bonding time delay is set to 20ms, and the die bonding force is set to 70g.
As shown in fig. 2, the welding head 1 is further connected with a vacuum tube 4, the vacuum tube 4 is connected with a solenoid valve, the solenoid valve is an electromagnetic conversion valve 3, the solenoid valve is connected with a compressed air input tube 8, a nitrogen-hydrogen mixed gas input tube 5 and a vacuum air flow input tube 7, the nitrogen-hydrogen mixed gas input tube 5 provides weak air and is connected with a flow regulating valve 2, the size of the weak air is regulated by the flow regulating valve 2, the compressed air input tube 8 provides strong air, the vacuum air input tube 7 provides a vacuum state, and the welding head 1 performs conversion among a vacuum state, a weak air state, a strong air state and an airless state by the solenoid valve. In use, the device is supplied by the appliance air supply system 6.
Example 1
In this embodiment, a BLG3040 chip is taken as an example, and the soft solder die bonder is of the type SD8312 from ASM company, and the electromagnetic switching valve 3 is specifically a two-position three-way electromagnetic switching valve. The specific structure of the soldering head of the soft solder die bonder is shown in fig. 2.
A control method for the thickness flatness of a small chip solder comprises the following specific steps:
step 201, the suction nozzle is flatly arranged on a steel nozzle of the welding head 1 according to the long side and the short side corresponding to the chip direction.
Step 202, adjusting the position of the suction nozzle in the X/Y direction to ensure that the center point of the suction nozzle and the center point of the DCC of the soft solder die bonder are in the same straight line.
And 203, adjusting the contact height of the mounted suction nozzle in the Z direction, namely the height of the suction nozzle contacting the surface of the chip.
Step 204, the chip is separated by the ejector pin, the suction nozzle converts the airless state into a vacuum state transferred to the suction nozzle by the vacuum air flow input pipe 7 through the electromagnetic conversion valve 3, and the vacuum adsorbs the chip to the suction nozzle;
step 205, setting technological parameters according to the requirements of a die bonding technology, and setting left tin dripping, right tin dripping and welding temperature to 350 ℃ so as to effectively solve the problem of cavities; the flow regulating valve regulates the flow to 0.04MPa, sets the welding height compensation value BLT to 300um, sets the sticking delay to 20ms, and sets the sticking force to 70g.
And 206, clicking an automatic welding function of the soft solder die bonder, carrying out tin drawing according to the arrangement on the frame carrier when the frame carrier is conveyed and heated to the left tin drop and the right tin drop through the track conveyor, conveying to a welding window after the tin drawing is finished, transferring a chip to the upper part of the frame carrier through the welding head 1, switching to a weak blowing state through switching to a vacuum state by switching to the electromagnetic switching valve 3, effectively separating the chip from a suction nozzle through the set weak blowing flow at a certain height, namely, the set welding height compensation value 300um by the vacuum tube 4, and bonding the chip.
In this embodiment, the weak blowing flow and the soldering height bias BLT may be fine-tuned to meet our quality requirements by inspecting the solder cavities and solder flatness after bonding. The temperature control areas of the soft solder die bonder track are shown in fig. 3, the soft solder die bonder is high-temperature equipment, the track temperature can reach 450 ℃, the track temperature is controlled by a temperature control box, and the temperature of each temperature control area can be adjusted. In the embodiment, the schematic cross-section of the suction nozzle is shown in fig. 4, a plane is arranged below the suction nozzle and is used for sucking the chip, and the schematic diagram after the suction nozzle picks up the chip is shown in fig. 5.
In step 203, the measurement of the soldering height is performed after the chip is picked up by the auto calibration function of the apparatus.
It should be noted that all the apparatuses mentioned herein are soft solder bonders equipped with heatable conveyor rails, bonding heads 1, wafer stages, loading mechanisms, unloading mechanisms, conveyor mechanisms, temperature controllers, air flow control valves, etc.
The method provided by the invention uses a high-polishing process in the bonding process, namely, a higher welding height and a certain weak blowing are used for bonding the chip, the solder can be completely reflowed after bonding, the thickness of the solder at four corners of the chip can be basically consistent, the height difference is not more than 45 mu m, the flatness after bonding is ensured, and the processing difficulty affecting the subsequent process due to uneven thickness of the solder can be greatly reduced.
The foregoing is merely a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A method for controlling thickness flatness of a die solder, comprising:
providing a frame carrier, wherein the surface of the frame carrier is covered with a sticky sheet material, and the sticky sheet material is soft solder;
the single side of the target chip is smaller than 4000um;
the soft solder die bonder comprises a welding head, wherein the welding head performs vacuum, weak blowing, strong blowing and airless conversion through an electromagnetic valve, and the welding head is connected with a suction nozzle;
blowing off the target chip from the suction nozzle at a certain height through the welding head, and blowing off the target chip onto the frame carrier for sticking; the certain height is 100 um-600 um.
2. The method of claim 1, wherein said blowing off said target chip from said suction nozzle by said soldering tip at a height, comprising:
adjusting the heights of the suction nozzle and the surface of the target chip;
converting the suction nozzle into a vacuum state through the electromagnetic valve, and adsorbing the target chip;
measuring the welding height at the welding window;
and transferring the chip to the upper part of the frame carrier through the welding head, switching the vacuum state to a weak blowing state through an electromagnetic valve, and blowing off the target chip from the suction nozzle at a certain height.
3. The method of claim 2, further comprising, prior to adjusting the height of the suction nozzle and the target chip surface:
correspondingly mounting the suction nozzle on the welding head according to the direction of the target chip;
and adjusting the position of the suction nozzle in the X/Y direction to ensure that the center point of the suction nozzle and the center point of the DCC of the soft solder die bonder are in the same straight line.
4. The method of claim 2, further comprising, prior to transferring the die over the frame carrier by the soldering tip:
the flow is regulated to 0.03 MPa-0.06 MPa through a weak blowing air flow regulating valve of the welding head.
5. The method for controlling thickness flatness of die solder according to claim 1, characterized in that:
in the process of sticking the sheet, the temperature of the sticking sheet is set to 340-360 ℃.
6. The method of claim 2, further comprising, prior to transferring the die over the frame carrier by the soldering tip:
and setting parameters of the soft solder die bonder, setting a welding height compensation value BLT to be 100 um-600 um, setting the time delay of the bonding sheet to be 10 ms-30 ms, and setting the bonding strength to be 60 g-80 g.
7. The method for controlling thickness flatness of small chip solder according to claim 6, wherein the chip is transferred to above the frame carrier by the soldering head, the vacuum state is switched to a weak blowing state by the electromagnetic valve, and the target chip is blown off from the suction nozzle at a certain height, specifically:
clicking the automatic welding function of the soft solder die bonder, carrying out tin drawing on the frame carrier according to set parameters, conveying the frame carrier to a welding window after the tin drawing is finished, transferring the target chip to a target position through the welding head, switching into a weak blowing state through closing a vacuum state of the electromagnetic valve, and blowing off the target chip and the suction nozzle.
8. The method for controlling thickness flatness of die solder of claim 6, wherein:
and setting parameters of the soft solder die bonder, adjusting the flow of the weak blowing air flow adjusting valve of the welding head to 0.04MPa, setting a welding height compensation value BLT to 300um, setting the bonding temperature to 350 ℃, setting the bonding delay to 20ms, and setting the bonding strength to 70g.
9. The method for controlling thickness flatness of die solder according to claim 1, characterized in that:
the welding head is further connected with a vacuum tube, the vacuum tube is connected with an electromagnetic valve, the electromagnetic valve is a two-position three-way electromagnetic conversion valve, the electromagnetic valve is connected with a compressed air input tube, a nitrogen-hydrogen mixed gas input tube and a vacuum air flow input tube, the nitrogen-hydrogen mixed gas input tube provides weak blowing and is connected with a flow regulating valve, the size of the weak blowing is regulated through the flow regulating valve, the compressed air input tube provides strong blowing, the vacuum air flow input tube provides vacuum, and the welding head is switched among a vacuum state, a weak blowing state, a strong blowing state and an airless state through the electromagnetic valve.
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| CN202310323657.0A CN116031169B (en) | 2023-03-30 | 2023-03-30 | Control method for thickness flatness of small chip solder |
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| CN202310323657.0A CN116031169B (en) | 2023-03-30 | 2023-03-30 | Control method for thickness flatness of small chip solder |
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| CN216686417U (en) * | 2021-12-16 | 2022-06-07 | 翼龙半导体设备(无锡)有限公司 | Double-rail conveying device for soft solder die bonding equipment |
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| CN102332506A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Chip attaching method |
| CN106292525B (en) * | 2015-05-14 | 2019-09-10 | 广东木几智能装备有限公司 | A kind of control system of chip mounting machine and method of the visual identity of both arms bull |
| CN109865932B (en) * | 2018-12-06 | 2021-08-17 | 上海赛科利汽车模具技术应用有限公司 | Friction stir welding device and method |
| CN115020312A (en) * | 2022-06-10 | 2022-09-06 | 华羿微电子股份有限公司 | Multi-plane suction nozzle |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004114136A (en) * | 2002-09-27 | 2004-04-15 | Sony Corp | Ultrasonic welding equipment |
| CN208513860U (en) * | 2018-06-11 | 2019-02-19 | 清远市尚泰超硬工具有限公司 | A kind of full-automatic saw blade laser soldering device |
| CN216686417U (en) * | 2021-12-16 | 2022-06-07 | 翼龙半导体设备(无锡)有限公司 | Double-rail conveying device for soft solder die bonding equipment |
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