CN115020312A - Multi-plane suction nozzle - Google Patents
Multi-plane suction nozzle Download PDFInfo
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- CN115020312A CN115020312A CN202210659448.9A CN202210659448A CN115020312A CN 115020312 A CN115020312 A CN 115020312A CN 202210659448 A CN202210659448 A CN 202210659448A CN 115020312 A CN115020312 A CN 115020312A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a multi-plane suction nozzle, and relates to the technical field of semiconductor device packaging. The stacking type chip sucking device is used for solving the problem that in the sucking process of the existing stacking type chip, due to the fact that a suction nozzle cannot be in contact with other planes in the stacking type chip, vacuum leakage is caused or the problem that normal picking cannot be achieved due to the fact that the contact area is too small is solved. The method comprises the following steps: the upper end of the multi-surface mounting hole is fixed on the chip bonding equipment, the lower end of the multi-surface mounting hole is at least provided with a first air circulation hole and a second air circulation hole side by side, and gas is introduced into the first air circulation hole and the second air circulation hole through the multi-surface mounting hole; the first air circulation holes extend to the first adsorption plane, the second air circulation holes extend to the second adsorption plane, and the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole; the first adsorption plane and the second adsorption plane are contacted to form a first step.
Description
Technical Field
The invention relates to the technical field of semiconductor device packaging, in particular to a multi-plane suction nozzle.
Background
In general power semiconductor packaging, a wafer from a previous process is cut into small chips (Die) after being subjected to a scribing process, then the individual chips are bonded to a frame carrier by bonding materials such as solder, soldering paste and high-thermal-conductivity silver paste on a bonding device through a bonding head, then a chip bonding pad is connected with a corresponding frame pin by using a metal wire to form a circuit meeting requirements, then a plastic shell or a ceramic shell is used for packaging and protecting the chip, and the packaging is completed through processes such as curing, tinning, rib cutting and the like.
In the prior art, as shown in fig. 1, 2 and 3, a common die bonding process is to successfully pick up a single chip 30 by a common nozzle 101 with a nozzle air flow through hole 102 included in a die bonding apparatus. The welding head, the nozzle airflow through hole 102 and the steel nozzle are further arranged between the wafer sticking equipment and the common nozzle 101, specifically, the nozzle airflow through hole 102 is arranged on the welding head, and the common nozzle 101 is arranged on the steel nozzle. With the continuous expansion of packaging technology, stacked chips come into operation, because stacked chips may be on different planes, and a common suction nozzle only includes one plane, when sucking chips, the suction nozzle can only contact with one plane in the stacked chips, so that the problems of vacuum leakage or abnormal pickup caused by too small contact area due to the fact that the common suction nozzle cannot contact with other planes in the stacked chips exist.
In summary, in the process of sucking the conventional stacked chip, the suction nozzle cannot contact with other planes in the stacked chip, which causes the problems of vacuum leakage or abnormal pickup due to an excessively small contact area.
Disclosure of Invention
The embodiment of the invention provides a multi-plane suction nozzle device, which is used for solving the problem that in the suction process of the existing stacked chip, the suction nozzle cannot be in contact with other planes in the stacked chip, so that vacuum leakage is caused or normal pickup cannot be caused due to the fact that the contact area is too small.
The embodiment of the invention provides a multi-plane suction nozzle, which comprises:
the upper end of the multi-surface mounting hole is fixed on the wafer sticking equipment, the lower end of the multi-surface mounting hole is at least provided with a first air circulation hole and a second air circulation hole side by side, and air is introduced into the first air circulation hole and the second air circulation hole through the multi-surface mounting hole;
the first air circulation holes extend to the first adsorption plane, the second air circulation holes extend to the second adsorption plane, and the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole;
the first adsorption plane and the second adsorption plane are contacted to form a first step.
Preferably, the first and second airflow holes are both circular in cross section;
the diameter of the first air flow hole is larger than that of the second air flow hole; or
The diameter of the first air flow hole is smaller than or equal to that of the second air flow hole.
Preferably, the cross-sectional shapes of the first air flow hole and the second air flow hole are consistent and are rectangular.
Preferably, an angle of a first step formed where the first adsorption plane and the second adsorption plane are contacted is 90 degrees.
Preferably, the areas of the first suction plane and the second suction plane match the area of the stacked chip to be sucked;
the area of the first adsorption plane is larger than that of the second adsorption plane; or
The area of the first adsorption plane is less than or equal to the area of the second adsorption plane; or
The area of the first adsorption plane is equal to the area of the second adsorption plane.
Preferably, the height of the first step matches the height difference of the stacked chips to be sucked.
Preferably, the mounting structure further comprises a third air flow through hole, and air is introduced into the third air flow through hole through the multi-surface mounting hole;
the third airflow through hole extends to a third adsorption plane, and the distance between the third adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole; or is smaller than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole; or is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole and is smaller than the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole;
and a second step is formed at the contact position of the third adsorption plane and the first adsorption plane, or a second step is formed at the contact position of the third adsorption plane and the second adsorption plane.
The embodiment of the invention provides a multi-plane suction nozzle, which comprises: the upper end of the multi-surface mounting hole is fixed on the wafer sticking equipment, the lower end of the multi-surface mounting hole is provided with a first air circulation hole and a second air circulation hole side by side, and air is introduced into the first air circulation hole and the second air circulation hole through the multi-surface mounting hole; the first air circulation holes extend to the first adsorption plane, the second air circulation holes extend to the second adsorption plane, and the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole; the contact part of the first adsorption plane and the second adsorption plane forms a step. The multi-plane suction nozzle provided by the embodiment of the invention can be contacted with a plurality of planes included by stacked chips to be adsorbed, and each adsorption plane is correspondingly provided with one air flow through hole, namely each adsorption plane can be contacted with the stacked chips to be adsorbed, and the problem of air leakage or small contact area does not exist, so that the problem that the stacked chips with different planes cannot be normally picked up due to air leakage or small contact area in the adsorption process of the existing common suction nozzle is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a conventional suction nozzle provided in the prior art;
FIG. 2 is a schematic view of a bottom view of a conventional suction nozzle in accordance with the prior art;
FIG. 3 is a schematic view illustrating a usage status of a common suction nozzle provided in the prior art;
FIG. 4 is a schematic view of a multi-purpose flat suction nozzle according to an embodiment of the present invention;
FIG. 5 is a schematic bottom view of a multi-purpose flat suction nozzle according to an embodiment of the present invention;
fig. 6 is a schematic view of a use state of a multi-purpose flat suction nozzle according to an embodiment of the present invention.
101-a common suction nozzle, 102-a suction nozzle airflow through hole, 30-a single chip, 201-a first adsorption plane, 202-a second adsorption plane, 203-a first airflow hole, 204-a second airflow through hole, 205-a multi-surface mounting hole, 206-a first step, 401-a stacked chip first plane, and 402-a stacked chip second plane.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 4 is a schematic view of a multi-purpose flat suction nozzle according to an embodiment of the present invention; FIG. 5 is a schematic view of a bottom view of a multi-purpose flat suction nozzle in accordance with an embodiment of the present invention; fig. 6 is a schematic view of a usage state of the plane suction nozzle according to the embodiment of the present invention. The multi-plane nozzle provided by the embodiment of the invention is described in detail below by taking fig. 4 to 6 as an example.
The multi-plane suction nozzle provided by the embodiment of the invention mainly comprises a multi-plane mounting hole 205, a first air flow hole 203, a second air flow hole 204, a first adsorption plane 201, a second adsorption plane 202 and a first step 206. Specifically, the upper end of the multi-surface mounting hole 205 is fixed on the die bonding equipment and is used for being fixed with the die bonding equipment; the lower end of the air inlet is provided with at least two air flow through holes which are distributed into a first air flow hole 203 and a second air flow hole 204. In the embodiment of the present invention, the multi-surface mounting hole 205 has two functions, one is used for fixing with the sheet sticking device, and the other is used for introducing gas into the gas flow through hole.
Further, the first air flow holes 203 extend to the first adsorption plane 201 in the opposite direction to the multi-face mounting holes 205, and correspondingly, the second air flow holes 204 extend to the second adsorption plane 202 in the opposite direction to the multi-face mounting holes 205. In the embodiment of the present invention, in order to solve the problem that the chip pickup failure is caused by air leakage or a small contact area when the existing ordinary suction nozzle sucks the chip having different planes, it is preferable that the first suction plane 201 and the second suction plane 202 have different heights, and specifically, the distance between the first suction plane 201 and the lower surface of the multi-surface mounting hole 205 is greater than the distance between the second suction plane 202 and the lower surface of the multi-surface mounting hole 205. Through the arrangement, the problem that when the existing common suction nozzle adsorbs planes with different heights, air leakage or small contact area exists to cause failure in picking up a chip can be solved.
Further, since there is a height difference between the first suction plane 201 and the second suction plane 202, the stacked chips in the related art include chips having different heights, for example, a stacked chip first plane 401 and a stacked chip second plane 402. In the embodiment of the present invention, in order to avoid the problem that when the first suction plane 201 and the second suction plane 202 contact with chips of different heights, a contact area is small or air leaks due to the existence of a continuous inclined plane at the contact position of the first suction plane 201 and the second suction plane 202, preferably, a first step 206 is formed at the contact position of the first suction plane 201 and the second suction plane 202.
The multi-plane suction nozzle provided by the embodiment of the invention can be contacted with a plurality of planes included by stacked chips to be adsorbed, and each adsorption plane is correspondingly provided with one air flow through hole, namely each adsorption plane can be contacted with the stacked chips to be adsorbed, and the problem of air leakage or small contact area does not exist, so that the problem that the stacked chips with different planes cannot be normally picked up due to air leakage or small contact area in the adsorption process of the existing common suction nozzle is solved.
Illustratively, the first air flow holes 203 and the second air flow holes 204 provided by the embodiment of the present invention are used for air flow provided to the first adsorption plane 201 and the second adsorption plane 202. One of the situations is: the cross sections of the first air flow holes 203 and the second air flow holes 204 are both circular, and specifically, when the area of the first adsorption plane is larger than that of the second adsorption plane 202, the diameter of the first air flow holes 203 is larger than that of the second air flow holes 204; when the area of the first adsorption plane 201 is smaller than that of the second adsorption plane 202, the diameter of the first air flow hole 203 is smaller than that of the second air flow hole 204; when the area of the first suction plane is equal to the area of the second suction plane 202, the diameter of the first air flow hole 203 is equal to the diameter of the second air flow hole 204.
In another case, when the cross-sectional shapes of the first air flow hole 203 and the second air flow hole 204 are the same, the shapes thereof may be rectangular, that is, the shape of the first air flow hole 203 is rectangular, and the shape of the second air flow hole 204 is also rectangular.
Illustratively, in the embodiment of the present invention, the first step 206 is formed at the contact position of the first suction plane 201 and the second suction plane 202, and the angle thereof is 90 degrees.
Illustratively, in the embodiment of the present invention, since the first suction plane 201 and the second suction plane 202 need to be in contact with the stacked-chip first plane 401 and the stacked-chip second plane 402 included in the stacked chips to be sucked, respectively, the areas of the first suction plane 201 and the second suction plane 202 match the areas of the stacked-chip first plane 401 and the stacked-chip second plane 402, respectively.
Specifically, when the areas of two planes included in the stacked chips to be sucked are not uniform, the area of the first suction plane 201 may be larger than the area of the second suction plane 202; the area of the first adsorption plane 201 may be smaller than the area of the second adsorption plane 202. For example, when the area of the stacked-chip first plane 401 is larger than the stacked-chip second plane 402, the area of the first suction plane 201 is larger than the area of the second suction plane 202; when the area of the stacked chip first plane 401 is smaller than the stacked chip second plane 402, the area of the first adsorption plane 201 is smaller than the area of the second adsorption plane 202;
further, when the areas of the two planes included in the stacked chips to be suctioned are equal, the area of the first suction plane 201 is equal to the area of the second suction plane 202. For example, when the area of the stacked chip first plane 401 is equal to the stacked chip second plane 402, the area of the first suction plane 201 is equal to the area of the second suction plane 202.
Further, since the first step 206 is formed by the contact of the first suction plane 201 and the second suction plane 202, the height of the first step 206 matches the difference in height of the two planes included in the stacked chip to be sucked. For example, the height of the first step 206 matches the difference in height between the stacked-chip first plane 401 and the stacked-chip second plane 402 included in the stacked chips to be suctioned.
It should be noted that, when the stacked chip to be adsorbed includes three planes, the multi-plane suction nozzle provided by the embodiment of the present invention may also include three air flow through holes, which are the first air flow hole 203, the second air flow hole 204 and the third air flow hole. Further, the multi-surface mounting hole 205 also simultaneously introduces air into the third airflow through hole.
When the multi-plane nozzle comprises three air flow holes, the third air flow hole is the same as the first air flow hole 203 and the second air flow hole 204, and the third air flow hole extends to the third adsorption plane. Further, the interval between the third suction plane and the lower surface of the multi-face mounting hole 205 may be greater than the interval between the first suction plane 201 and the lower surface of the multi-face mounting hole 205; a distance between the third suction plane and the lower surface of the multi-surface mounting hole 205 may be smaller than a distance between the second suction plane 202 and the lower surface of the multi-surface mounting hole 205; the interval between the third suction plane and the lower surface of the multi-face mounting hole 205 may be greater than the interval between the second suction plane 202 and the lower surface of the multi-face mounting hole 205 and less than the interval between the first suction plane 201 and the lower surface of the multi-face mounting hole 205. In the embodiment of the present invention, the distance between the third suction plane and the lower surface of the multi-surface mounting hole 205 is not particularly limited.
When the multi-plane nozzle comprises three air flow through holes, a second step can be formed at the contact part of the third adsorption plane and the first adsorption plane 201; a second step may also be formed where the third suction plane and the second suction plane 202 contact. In the embodiment of the present invention, the specific position of the second step is not limited.
It should be noted that, when the stacked chip to be adsorbed includes four planes, the multi-plane suction nozzle provided in the embodiment of the present invention may also include four air flow through holes, which include the fourth air flow through hole, the fourth adsorption plane, and the third step, which may be referred to the above embodiments and will not be described herein again.
For more detailed description of the multi-plane nozzle provided by the embodiment of the present invention, the usage of the multi-plane nozzle is described as follows:
step 1: flatly installing a multi-surface installation hole which is included by the multi-surface suction nozzle on a welding head steel nozzle of the equipment according to the long edge and the short edge which correspond to the chip direction;
step 2: the position of the multi-plane nozzle in the direction X, Y is adjusted to ensure that the center point of the multi-plane nozzle is aligned with the center point of the DCC of the device and that the first step is not in contact with the second plane of the stacked chips by calibrating the position of the multi-plane nozzle.
And step 3: the contact height of the multi-plane suction nozzle in the Z direction is adjusted, namely the height between the first suction plane and the first plane of the stacked chips and the height between the second suction plane and the second plane 402 of the stacked chips are adjusted.
And 4, step 4: the device ejector pins separate the stacked chips to be adsorbed, the first adsorption plane flows out of airflow from the first airflow through hole, the second adsorption plane flows out of airflow from the second airflow through hole, the first adsorption plane adsorbs the first plane of the stacked chips onto the first adsorption plane, and the second adsorption plane adsorbs the second plane of the stacked chips onto the second adsorption plane.
And 5: after the stacked chips to be adsorbed are placed at the position of the carrier through the movement of the welding head, the equipment switches off vacuum through the electromagnetic valve, opens the weak air blowing function, weak air blowing is conducted to the first adsorption plane through the first air flow holes, weak air blowing is conducted to the second adsorption plane through the second air flow holes, the first plane of the stacked chips to be adsorbed is separated from the first adsorption plane, and the second plane of the stacked chips is separated from the second adsorption plane.
Step 6: and finishing picking and loading the stacked chips to be adsorbed.
In summary, the embodiment of the present invention provides a multi-plane nozzle, including: the upper end of the multi-surface mounting hole is fixed on the wafer sticking equipment, the lower end of the multi-surface mounting hole is provided with a first air circulation hole and a second air circulation hole side by side, and air is introduced into the first air circulation hole and the second air circulation hole through the multi-surface mounting hole; the first air circulation holes extend to the first adsorption plane, the second air circulation holes extend to the second adsorption plane, and the distance between the first adsorption plane and the lower surfaces of the multi-surface mounting holes is larger than the distance between the second adsorption plane and the lower surfaces of the multi-surface mounting holes; the contact part of the first adsorption plane and the second adsorption plane forms a step. The multi-plane suction nozzle provided by the embodiment of the invention can be contacted with a plurality of planes included by stacked chips to be adsorbed, and each adsorption plane is correspondingly provided with one air flow through hole, namely each adsorption plane can be contacted with the stacked chips to be adsorbed, and the problem of air leakage or small contact area does not exist, so that the problem that the stacked chips with different planes cannot be normally picked up due to air leakage or small contact area in the adsorption process of the existing common suction nozzle is solved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. A multi-planar suction nozzle, comprising:
the upper end of the multi-surface mounting hole is fixed on the wafer sticking equipment, the lower end of the multi-surface mounting hole is at least provided with a first air circulation hole and a second air circulation hole side by side, and air is introduced into the first air circulation hole and the second air circulation hole through the multi-surface mounting hole;
the first air circulation holes extend to the first adsorption plane, the second air circulation holes extend to the second adsorption plane, and the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole;
the first adsorption plane and the second adsorption plane are contacted to form a first step.
2. The multi-planar mouthpiece of claim 1 wherein said first airflow aperture and said second airflow aperture are both circular in cross-section;
the diameter of the first air flow hole is larger than that of the second air flow hole; or
The diameter of the first air flow hole is smaller than or equal to that of the second air flow hole.
3. The multi-planar mouthpiece of claim 1 wherein said first airflow aperture and said second airflow aperture are uniform in cross-sectional shape and are both rectangular.
4. The multi-plane suction nozzle as claimed in claim 1, wherein an angle of a first step formed where said first suction plane and said second suction plane are contacted is 90 degrees.
5. The multi-plane nozzle as set forth in claim 1, wherein the first suction plane and the second suction plane have areas matching areas of the stacked chips to be sucked;
the area of the first adsorption plane is larger than that of the second adsorption plane; or
The area of the first adsorption plane is smaller than that of the second adsorption plane; or
The area of the first adsorption plane is equal to the area of the second adsorption plane.
6. The multi-plane nozzle as set forth in claim 5, wherein the first step has a height matching a height difference of the stacked chips to be sucked.
7. The multi-planar suction nozzle of claim 1, further comprising a third airflow aperture, said multi-faceted mounting hole passing air to said third airflow aperture;
the third airflow through hole extends to a third adsorption plane, and the distance between the third adsorption plane and the lower surface of the multi-surface mounting hole is larger than the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole; or is smaller than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole; or is larger than the distance between the second adsorption plane and the lower surface of the multi-surface mounting hole and is smaller than the distance between the first adsorption plane and the lower surface of the multi-surface mounting hole;
and a second step is formed at the contact position of the third adsorption plane and the first adsorption plane, or a second step is formed at the contact position of the third adsorption plane and the second adsorption plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659448.9A CN115020312A (en) | 2022-06-10 | 2022-06-10 | Multi-plane suction nozzle |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659448.9A CN115020312A (en) | 2022-06-10 | 2022-06-10 | Multi-plane suction nozzle |
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| CN115020312A true CN115020312A (en) | 2022-09-06 |
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| CN202210659448.9A Pending CN115020312A (en) | 2022-06-10 | 2022-06-10 | Multi-plane suction nozzle |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116031169A (en) * | 2023-03-30 | 2023-04-28 | 华羿微电子股份有限公司 | Control method for thickness flatness of small chip solder |
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2022
- 2022-06-10 CN CN202210659448.9A patent/CN115020312A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116031169A (en) * | 2023-03-30 | 2023-04-28 | 华羿微电子股份有限公司 | Control method for thickness flatness of small chip solder |
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