CN117381088A - Circuit soldering method based on data identification and control system - Google Patents

Circuit soldering method based on data identification and control system Download PDF

Info

Publication number
CN117381088A
CN117381088A CN202311384363.5A CN202311384363A CN117381088A CN 117381088 A CN117381088 A CN 117381088A CN 202311384363 A CN202311384363 A CN 202311384363A CN 117381088 A CN117381088 A CN 117381088A
Authority
CN
China
Prior art keywords
soldering
tin
spraying
soldering flux
spraying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311384363.5A
Other languages
Chinese (zh)
Inventor
莫皓森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan Hengdao Zhiji Technology Co ltd
Original Assignee
Foshan Hengdao Zhiji Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan Hengdao Zhiji Technology Co ltd filed Critical Foshan Hengdao Zhiji Technology Co ltd
Priority to CN202311384363.5A priority Critical patent/CN117381088A/en
Publication of CN117381088A publication Critical patent/CN117381088A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention belongs to the technical field of circuit board soldering, and particularly relates to a circuit soldering method and a control system based on data identification; comprises an operation body, a soldering flux spraying device, a tin spraying and soldering device, a mechanical arm and a microprocessor; arranging a soldering flux spraying device and a tin spraying device on selective wave soldering equipment, so that the distance between a soldering flux spray head of the soldering flux spraying device and a tin spraying spray head of the tin spraying device can be matched with the size of a circuit board; the pins of the device on the circuit board are positioned through corresponding electronic document leading-in equipment or a computer of the device for leading-in the picture of the circuit board, and the coordinates of the solder to be soldered are marked through the computer; accurate alignment is performed by using a manual or rotatable and translatable tin spraying manipulator; after the alignment, spraying soldering flux and spraying tin; the on-line quick positioning tin spraying treatment can be realized; the tin spraying efficiency of the circuit board is improved, and intelligent tin soldering control is realized through the control system.

Description

Circuit soldering method based on data identification and control system
Technical Field
The invention belongs to the technical field of circuit board soldering, and particularly relates to a circuit soldering method and a control system based on data identification.
Background
Along with the development of the SMT electronic industry, the production and manufacture are more and more refined at present, the automation is the current industrial core, and the selective wave soldering, also called selective soldering, is a PCB circuit board plug-in through hole soldering technology. When the selective wave soldering is used for soldering, the soldering parameters of each soldering point can be precisely controlled, so that the method is commonly used for soldering multilayer PCB through holes with high soldering requirements and complex process, such as military electronics, spaceship electronics, automobile electronics, digital cameras, printers and the like. However, for quantitatively produced circuit boards, the production modes in the manufacturing enterprises at present are as follows: a selective crest welder can only perform one operation on a circuit board, namely spraying soldering flux and then soldering tin, and the operation is performed sequentially, so that synchronous work of spraying the soldering flux and spraying the soldering tin can not be realized, the circuit board can not be automatically identified by the conventional crest welder, the production efficiency is seriously reduced, and the energy is wasted.
Disclosure of Invention
The invention provides a circuit soldering method and a control system based on data identification, and aims to solve the problems that traditional wave soldering in the SMT industry is large in energy consumption, various in fixture clamps and low in efficiency, and automation cannot be realized.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: a circuit soldering method based on data identification comprises the following steps:
step 1, arranging a soldering flux spraying device and a tin spraying device on selective wave soldering equipment, so that the distance between a soldering flux spray head of the soldering flux spraying device and a tin spraying spray head of the tin spraying device can be matched with the size of a circuit board;
step 2, the pin positions of the devices on the circuit board are led into the wave soldering equipment through corresponding electronic documents, or the photo of the circuit board is led into a microprocessor of the wave soldering equipment, and the microprocessor extracts the devices needing soldering tin in the photo;
step 3, dividing the device from the background by the picture, extracting a target contour line, thus obtaining a contour line diagram of the target, and marking coordinates of the solder to be soldered;
step 4, manually placing the circuit board on a positioning fixture with initial coordinates or accurately aligning by using a rotatable and translatable mechanical arm;
and 5, after accurate alignment, the cloud processor controls the wave soldering equipment to automatically spray soldering flux and spray tin.
Further, in step 1, the positional relationship between the soldering flux spraying device and the tin spraying device is one of the following three types: (1) The soldering flux spraying device is arranged on one side of the wave soldering equipment, and the tin spraying device is arranged in the wave soldering equipment; (2) The soldering flux spraying devices are arranged on two sides of the wave soldering equipment, and the tin spraying device is arranged at the midpoint between the soldering flux spraying devices on two sides; (3) The tin spraying device is arranged at the center of the wave soldering equipment, and the soldering flux spraying device is arranged at the diagonal position of the wave soldering equipment.
Further, a picture target coordinate path is obtained for a device needing soldering tin in the picture, a target contour diagram is obtained, curve fitting is carried out by using a least square method, a track path is generated, a faster R-CNN (computer numerical network) algorithm is adopted for identification, a corresponding coordinate relation is established between a picture component and a motion coordinate system, and the picture track is converted into track coordinates.
A control system for the data identification-based circuit soldering method, the control system comprising an operation body, a soldering flux spraying device, a soldering tin spraying device, a mechanical arm and a cloud processor; the operation body is provided with a tin spraying device and a soldering flux spraying device, and the tin spraying device and the soldering flux spraying device are correspondingly provided with a soldering flux spray head and a tin spraying spray head.
Further, a strip-shaped hole is formed in the top of the operation body, a soldering flux nozzle of the soldering flux spraying device extends out of the strip-shaped hole, and a linear module used for driving the soldering flux spraying device to reciprocate along the length direction of the strip-shaped hole is arranged in the operation body; the tin spraying device is fixedly arranged in the operation body, a hole is formed in the top of the operation body, and a tin spraying nozzle of the tin spraying device extends out of the hole; and the first driving mechanism is used for driving the circuit board sprayed with the soldering flux to move up and down, left and right and back and forth, and is arranged above the tin spraying and soldering nozzle.
Further, a tin spraying and soldering device is arranged in the middle of the operation body, and a tin spraying and soldering nozzle of the tin spraying and soldering device extends out of the top of the operation body; the soldering flux spraying device is provided with two groups, the two groups of soldering flux spraying devices are respectively arranged at two ends of the operation body, a soldering flux nozzle of the soldering flux spraying device extends out of the top of the operation body, and the upper ends of the two groups of soldering flux spraying devices are respectively provided with a first driving mechanism for driving the circuit board to move up and down, left and right and back and forth.
Further, the operation body is provided with two groups of soldering flux spraying devices and mechanical arms, the two groups of soldering flux spraying devices and the mechanical arms are arranged at diagonal positions, the soldering flux spraying devices are installed in the operation body, holes are formed in the diagonal positions of the top of the operation body, soldering flux spray heads of the soldering flux spraying devices extend out of the holes, the mechanical arms are fixedly installed at the top of the operation body, and a circuit board clamp is fixedly installed at the bottom of a lifting arm of the mechanical arm through a connecting seat; the tin spraying device is arranged in the middle of the operation body, a second round hole is formed in the center of the top of the operation body, and a tin spraying nozzle of the tin spraying device extends out of the second round hole.
Further, the first driving mechanism lifting assembly, the back-and-forth movement assembly and the left-and-right movement assembly.
Further, the mechanical arm is a SCARA mechanical arm, the rotation radius is 700mm, and the rotation center of the base is 475mm plus or minus 20mm away from the tin spraying and soldering nozzle.
Furthermore, the soldering path of the mechanical arm must first start from the nearest external position close to the other mechanical arm, so as to avoid interference when the two arms simultaneously run.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the pins of the device on the circuit board are positioned through corresponding electronic document leading-in equipment or a cloud processor of the leading-in equipment for taking pictures of the circuit board, and the cloud processor marks the coordinates of solder to be soldered through an image recognition algorithm; can realize the quick positioning of the tin spraying part on line.
2. According to the invention, the rotatable and translatable tin spraying mechanical arm is utilized for accurate alignment; after the alignment, the soldering flux is sprayed and tin is sprayed, so that the tin spraying efficiency of the circuit board is improved, and intelligent tin soldering control is realized through a control system.
3. According to the invention, the soldering flux spraying device and the tin spraying device are arranged on the selective wave soldering equipment, so that the distance between the soldering flux spray head of the soldering flux spraying device and the tin spraying spray head of the tin spraying device exceeds 450mm, and the soldering flux spraying and the tin spraying are respectively and independently carried out synchronously, and the invention does not interfere with each other.
4. According to the invention, the two groups of soldering flux spraying devices and the tin spraying and soldering device are matched with the two groups of moving modules, so that soldering flux spraying and tin spraying operations can be performed simultaneously, and the soldering flux spraying and tin spraying operations are not mutually interfered; the circuit board sprayed by the soldering flux spraying device is sequentially moved to the tin spraying device through two groups or multiple groups of moving modules to spray tin, so that the tin spraying device is in an uninterrupted continuous working state, the soldering flux is sprayed while the soldering flux is sprayed, the soldering efficiency of the circuit board is effectively improved, and meanwhile, the energy consumption is saved.
Drawings
FIG. 1 is a flow chart of a circuit soldering method of the present invention;
FIG. 2 is a schematic structural diagram of embodiment 1 of the present invention;
FIG. 3 is a schematic diagram of a first driving structure according to embodiment 1 of the present invention;
FIG. 4 is a schematic structural diagram of embodiment 2 of the present invention;
FIG. 5 is a schematic structural diagram of embodiment 3 of the present invention;
reference numerals illustrate:
1. an operation body; 101. a bar-shaped hole; 2. a flux head; 3. a tin spraying and soldering nozzle; 4. a first driving mechanism; 401. a linear motor; 402. a vertical plate; 403. a moving plate; 404. a cross plate; 405. a slide rail; 406. a first driving motor; 407. a support block; 408. a transmission rod; 409. a first synchronous pulley; 410. a second synchronous pulley; 411. a first synchronization belt; 412. a first clamping plate; 413. a circuit board clamp; 414. a limit sliding block; 415. a limit chute body; 5. a linear module; 6. a circuit board clamp; 7. a guide rail; 8. a second driving motor; 9. a second clamping plate; 10. a third timing belt; 11. a fifth synchronous pulley; 12. and (5) a mechanical arm.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
As shown in fig. 1, a circuit soldering method based on data identification includes the following steps:
step 1, arranging a soldering flux spraying device and a tin spraying device on selective wave soldering equipment, so that the distance between a soldering flux spray head of the soldering flux spraying device and a tin spraying spray head of the tin spraying device exceeds 450mm, and if the soldering flux spraying device is used for a circuit board with small specification and size, the distance between a soldering flux spray head 2 and a tin spraying spray head 3 can also be adaptively reduced;
step 2, the pins of the devices on the circuit board are positioned and led into the wave soldering equipment through corresponding electronic documents, or the photo of the circuit board is led into a microprocessor of the wave soldering equipment, and the microprocessor extracts the devices needing soldering tin in the photo;
step 3, dividing the device from the background by the picture, extracting a target contour line, thus obtaining a contour line diagram of the target, and marking coordinates of the solder to be soldered;
step 4, manually placing the circuit board on a positioning fixture with initial coordinates or accurately aligning by using a rotatable and translatable mechanical arm;
and 5, after accurate alignment, the cloud processor controls the wave soldering equipment to automatically spray soldering flux and spray tin.
Separating the circuit board device from the background, and extracting a target contour line to obtain a target contour line diagram; after a target contour map is obtained, curve fitting is carried out by using a least square method, and then a master R-CNN (computer numerical control) algorithm is adopted, wherein the algorithm process is specifically as follows:
(1) Firstly, zooming the photo to a fixed size M x N, and then sending the photo into a network;
(2) Extracting a feature map through a VGG network, initializing anchors and finding out effective anchors;
(3) The feature map obtains effective Anchor confidence and coordinate coefficients of the prediction frame through an RPN network. 2K (positive and negative samples x K Anchor coefficients) score and 4K (coordinate offset coefficient x K Anchor coefficients) coredinates;
(4) And obtaining a predicted target feature map with a fixed size by the Propos calculated by the feature map and the prediction frame through the ROI Pooling, namely taking out the target buckle from the feature map by using the prediction frame, so as to mark the coordinates of the required soldering tin.
After the pins of the devices on the circuit board are positioned and led into wave soldering equipment through corresponding electronic documents or the coordinates of the required soldering tin are marked, the cloud processor controls the wave soldering equipment to automatically spray soldering flux and spray soldering tin.
A control system for the data identification-based circuit soldering method, the control system comprising an operation body, a soldering flux spraying device, a soldering tin spraying device, a mechanical arm and a cloud processor; the operation body is provided with a tin spraying device and a soldering flux spraying device, and the tin spraying device and the soldering flux spraying device are correspondingly provided with a soldering flux spray head and a tin spraying spray head; 4. according to the invention, the two groups of soldering flux spraying devices and the tin spraying and soldering device are matched with the two groups of moving modules, so that soldering flux spraying and tin spraying operations can be performed simultaneously, and the soldering flux spraying and tin spraying operations are not mutually interfered; the circuit board sprayed by the soldering flux spraying device is sequentially moved to the tin spraying device through two groups or multiple groups of moving modules to spray tin, so that the tin spraying device is in an uninterrupted continuous working state, the soldering flux is sprayed while the soldering flux is sprayed, the soldering efficiency of the circuit board is effectively improved, and meanwhile, the energy consumption is saved. The invention provides the following examples:
example 1: as shown in fig. 2 and 3, the top of the operation body 1 is provided with a bar hole 101, and a soldering flux nozzle 2 of the soldering flux spraying device extends out from the bar hole 101, a driving assembly for driving the soldering flux spraying device to reciprocate along the length direction of the bar hole 101 comprises a linear module 5, the soldering flux spraying device is fixedly mounted on a sliding table of the linear module 5, the linear module 5 is fixedly mounted in the operation body 1, and the soldering flux spraying device can be driven to move left and right by controlling the sliding table on the linear module 5 to move left and right.
The soldering tin spraying device is fixedly arranged in the operation body 1, a round hole is formed in the top of the operation body 1, a soldering tin spraying nozzle 3 of the soldering tin spraying device extends out of the round hole, the distance between the soldering flux nozzle 2 and the soldering tin spraying nozzle 3 is not less than 450mm, and the soldering flux nozzle 2 and the soldering tin spraying nozzle 3 are arranged at intervals of 500mm, so that soldering flux spraying operation and soldering tin spraying operation are not mutually interfered.
The first driving mechanism 4 comprises a lifting assembly and a front-back moving assembly, the lifting assembly comprises a vertical plate 402, a moving plate 403 is connected to the vertical plate 402 in a sliding and inserting mode, a linear motor 401 is fixedly arranged at the bottom of the vertical plate 402, a sliding table on the linear motor 401 is fixedly connected with one side of the moving plate 403, a transverse plate 404 is fixedly arranged at the top of the moving plate 403, the vertical plate 402 on the second driving mechanism 6 is fixedly arranged in the operation body 1, and when the movable plate is used, the moving plate 403 can be driven to move up and down by controlling the sliding table on the linear motor 401 to move up and down.
The first driving mechanism 4 further comprises a front-back moving component, the front-back moving component comprises two sliding rails 405 and a first driving motor 406, the two sliding rails 405 are arranged above the operation body 1 in parallel, one ends of the two sliding rails 405 are all fixed on the top of the transverse plate 404, one ends of the two sliding rails 405 are fixedly connected with supporting blocks 407, a transmission rod 408 is rotationally connected between the two supporting blocks 407, two ends of the transmission rod 408 are fixedly connected with a first synchronous pulley 409, one end, far away from the first synchronous pulley 409, of the sliding rail 405 is rotationally connected with a second synchronous pulley 410 through a fixed block, the first synchronous pulley 409 and the second synchronous pulley 410 which are positioned on the same sliding rail 405 are in transmission connection through a first synchronous belt 411, the output end of the first driving motor 406 is in transmission connection with the transmission rod 408 through the transmission component, the transmission component comprises a third synchronous pulley and a fourth synchronous pulley, the third synchronous pulley is fixedly connected with a rotating shaft of the first driving motor 406, the fourth synchronous pulley is fixedly sleeved on the transmission rod, the first synchronous pulley and the first synchronous pulley are fixedly connected with the second synchronous pulley 411 through the second synchronous belt transmission connection, one end, which is far away from the first synchronous pulley 409 is fixedly connected with the first synchronous pulley 412, the first synchronous pulley 412 is rotationally connected with the first synchronous pulley 412 through the first synchronous pulley 412, the first synchronous pulley 412 is rotationally connected with the first synchronous pulley 412 or the first synchronous pulley is rotationally connected with the first synchronous pulley 411 through the first synchronous pulley and the second synchronous pulley 411, the first synchronous pulley is rotationally and the second synchronous pulley 411 is rotationally connected with the first synchronous pulley 405, the second synchronous pulley 405 is rotationally and the second synchronous pulley 405 is fixedly connected with the first synchronous pulley 405 through the first synchronous pulley and the first driving pulley 405 and the first drive pulley and the first drive mechanism and the first drive mechanism 4.
The first driving mechanism 4 further comprises a left-right moving assembly, the left-right moving assembly comprises a second driving motor 8, a fifth synchronous pulley 11 and a second clamping plate 9, the second driving motor 8 is fixedly installed inside the operation body 1, the fifth synchronous pulley 11 is rotatably installed on one side inner wall of the operation body 1, a sixth synchronous pulley is fixedly sleeved on a rotating shaft of the second driving motor 8, the sixth synchronous pulley is in transmission connection with the fifth synchronous pulley 11 through a third synchronous belt 10, the second clamping plate 9 is fixedly clamped on the third synchronous belt 10, one side of the second clamping plate 9 is fixedly connected with a vertical plate 402 on the first driving mechanism 4, the second clamping plate 9 is further driven to move left and right through controlling the rotating shaft of the second driving motor 8, a circuit board clamp 413 in the first driving mechanism 4 is further driven to move left and right, a limit sliding groove body 415 is fixedly installed on one side of the operation body 1, a limit sliding block 414 is fixedly connected to one side of the vertical plate 402 on the first driving mechanism 4, the limit sliding block 414 is fixedly arranged on the limit sliding block 414, and the limit sliding block 415 is fixedly arranged on one side of the limit sliding block 415.
When the coordinates of the solder to be soldered are marked, the tin spraying manipulator is precisely aligned, the cloud processor controls the soldering flux spray head to spray in a left-right direction through the first linear module 6, and the circuit board placing and positioning clamp 413 can drag the circuit board to spray in a front-back direction, so that the soldering flux spray of the device on the circuit board at the position where the solder is required is realized. The tin spraying nozzle is arranged on the opposite side of the spray soldering flux nozzle, the distance is approximately 500mm, after the tin spraying is started, the tin spraying nozzle is not interfered and influenced with a soldering flux spraying mechanism, a circuit board sprayed with soldering flux is transferred onto a tool fixture of the tin spraying soldering tin through a manipulator (the circuit board with the tin spraying tin being completed is taken down), the tin spraying nozzle circularly operates according to the cycle, and the tin spraying mechanism drags the circuit board of the soldering tin to do left-right, front-back and up-down movements, so that the automatic tin spraying and soldering task is realized.
Example 2: as shown in fig. 4, the soldering flux spraying device is provided with two groups, the two groups of soldering flux spraying devices are respectively arranged at two ends of the operation body 1, a soldering flux nozzle 2 of the soldering flux spraying device extends out of the top of the operation body 1, a tin spraying device is arranged in the middle of the operation body 1, a tin spraying nozzle 3 of the tin spraying device extends out of the top of the operation body 1, and in order to ensure that the tin spraying operation and the soldering flux spraying operation can be simultaneously carried out without mutual interference, the distance between the soldering flux nozzle 2 and the tin spraying nozzle 3 is not low by 450mm.
The device is provided with a group of first driving mechanisms which are respectively arranged at the left side and the right side, the front side, the rear side, the upper side and the lower side, the circuit board is firstly placed on the fixture after the device is started, the tin spraying manipulator is accurately aligned, the cloud processor controls the module mechanism which is firstly placed at one side of the circuit board, the soldering flux of pins of the circuit board device and the tin spraying tin are carried out, the circuit board can be placed at the other side to carry out the soldering flux spraying when the device is operated, the tin spraying tin is returned to the upper plate position after the tin spraying tin of the front circuit board is finished, the tin spraying tin is immediately carried out by the module mechanism which is prepared with the soldering flux spraying, and the new circuit board to be subjected to tin spraying tin can be replaced by the module mechanism module which is finished with the front tin soldering tin, so that the soldering flux spraying tin is carried out firstly, and the circulation operation is carried out.
Example 3: as shown in fig. 5, 2 groups of soldering flux spraying devices and mechanical arms 12 are arranged at the diagonal positions of the operation body 1, the mechanical arms 12 are SCARA mechanical arms, the rotation radius of the mechanical arms 12 is 700mm, the soldering flux spraying devices are arranged in the operation body 1, the soldering flux spraying heads 2 of the soldering flux spraying devices extend out of round holes, the mechanical arms 12 are fixedly arranged at the top of the operation body 1, circuit board clamps 6 are fixedly arranged at the bottoms of lifting arms of the mechanical arms 12 through connecting seats, the soldering tin spraying devices are arranged in the middle of the operation body 1, and the soldering tin spraying heads 3 of the soldering tin spraying devices extend out of the round holes.
Wherein, the two mechanical arms 12 are arranged at the installation positions for avoiding the operation blind area; the midpoint of the rearmost surface of the mounting base of the mechanical arm 12 is aligned with the midpoint of the tin spraying and soldering nozzle 3, and the mechanical arm 12 is turned left or right by an included angle of 30 degrees by taking the midpoint as a rotation center, namely: if one of the mechanical arms 12 is set to be turned left by 30 degrees, the other mechanical arm 12 is set to be turned right by 30 degrees, the distance from the center of the base of the mechanical arm 12 to the center of the tin spraying nozzle 3 is 475mm plus or minus 20mm, a starting button is arranged on the mechanical arm 12, and the starting button can be arranged at other positions convenient to start.
During operation, path electronic documents are led into the two mechanical arms 12, a circuit board needing tin spraying soldering tin is placed into the circuit board clamp 6, one mechanical arm 12 sprays soldering flux according to the led-in path of the electronic documents, meanwhile, the other mechanical arm 12 is in a waiting area, the soldering flux spraying is completed, the mechanical arm 12 automatically rotates to a soldering tin position to carry out soldering tin, meanwhile, the other mechanical arm 12 is also placed into the circuit board, the soldering flux spraying is carried out from far to near according to the tin spraying tin nozzle 3, when the tin spraying of the mechanical arm 12 is completed to the discharging position, the tin spraying soldering tin starts after the soldering flux spraying is carried out, the mechanical arm 12 at the front takes down the soldered circuit board, and then the circuit board which is not soldered is put in the circuit board, and the cycle is carried out; the solder path of the arm 12 must first start from the nearest external position close to the other arm 12 in order to avoid interference when both arms are simultaneously operating.
The foregoing describes specific embodiments of the present invention. It is to be understood that the invention is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the invention. The embodiments of the present application and features in the embodiments may be combined with each other arbitrarily without conflict.

Claims (10)

1. The circuit soldering method based on data identification is characterized by comprising the following steps of:
step 1, arranging a soldering flux spraying device and a tin spraying device on selective wave soldering equipment, so that the distance between a soldering flux spray head of the soldering flux spraying device and a tin spraying spray head of the tin spraying device can be matched with the size of a circuit board;
step 2, leading the pin positioning information of the device on the circuit board into the wave soldering equipment;
step 3, placing the circuit board on a positioning fixture with initial coordinates by using a mechanical arm or manually or accurately aligning by using a rotatable and translatable mechanical arm;
and 4, after accurate alignment, controlling the wave soldering equipment to automatically spray soldering flux and spray tin by the microprocessor.
2. The method for circuit soldering based on data identification of claim 1, wherein:
the device pin positioning information on the circuit board is obtained by the following steps:
shooting a circuit board, guiding the shot picture of the circuit board into a microprocessor of wave soldering equipment, extracting features of a device needing soldering tin in the picture by the microprocessor, marking coordinates needing soldering tin, dividing the device from a background by the picture, extracting a target contour line, thus obtaining a contour line diagram of the target, and marking the coordinates needing soldering tin, thus obtaining pin positioning information of the device on the circuit board.
3. The method for circuit soldering based on data identification of claim 1, wherein:
in the step 1, the positional relationship between the soldering flux spraying device and the tin spraying device is one of the following three types:
(1) The soldering flux spraying device is arranged on one side of the wave soldering equipment, and the tin spraying device is arranged in the wave soldering equipment;
(2) The soldering flux spraying devices are arranged on two sides of the wave soldering equipment, and the tin spraying device is arranged at the midpoint between the soldering flux spraying devices on two sides;
(3) The tin spraying device is arranged at the center of the wave soldering equipment, and the soldering flux spraying device is arranged at the diagonal position of the wave soldering equipment;
the method for circuit soldering based on data identification of claim 1, wherein: and acquiring a picture target coordinate path of a device needing soldering tin in the picture, thereby obtaining a target contour diagram, performing curve fitting by using a least square method, generating a track path, identifying by using a faster R-CNN (computer numerical network) algorithm, establishing a corresponding coordinate relationship between the picture device and a motion coordinate system, and converting the picture track into track coordinates.
4. A control system for application to the data recognition-based circuit solder method of any one of claims 1-2, characterized in that: the control system comprises an operation body, a soldering flux spraying device, a tin spraying device, a driving assembly, a mechanical arm and a microprocessor;
the operation body is provided with a tin spraying device and a soldering flux spraying device, and the tin spraying device and the soldering flux spraying device are correspondingly provided with a soldering flux spray head and a tin spraying spray head.
5. The control system of a circuit soldering method based on data recognition according to claim 4, wherein: the top of the operation body is provided with a hole, a soldering flux spray head of the soldering flux spraying device extends out of the hole, and a linear module used for driving the soldering flux spraying device to move along the length direction of the hole is arranged in the operation body; the tin spraying device is fixedly arranged in the operation body, a hole is formed in the top of the operation table, and a tin spraying nozzle of the tin spraying device extends out of the round hole; and the first driving mechanism is used for driving the circuit board sprayed with the soldering flux to move up and down, left and right and back and forth, and is arranged above the tin spraying and soldering nozzle.
6. The control system of a circuit soldering method based on data recognition according to claim 4, wherein: a tin spraying and soldering device is arranged in the middle of the operation body, and a tin spraying and soldering nozzle of the tin spraying and soldering device extends out of the top of the operation body; the soldering flux spraying device is provided with two groups, the two groups of soldering flux spraying devices are respectively arranged at two ends of the operation body, a soldering flux nozzle of the soldering flux spraying device extends out of the top of the operation body, and the upper ends of the two groups of soldering flux spraying devices are respectively provided with a first driving mechanism for driving the circuit board to move up and down, left and right and back and forth.
7. The control system of a circuit soldering method based on data recognition according to claim 4, wherein: the operation body is provided with two groups of soldering flux spraying devices and a mechanical arm, the two groups of soldering flux spraying devices and the mechanical arm are arranged at diagonal positions, the soldering flux spraying devices are installed in the operation body, holes are formed in the diagonal positions of the top of the operation body, soldering flux spray heads of the soldering flux spraying devices extend out of the holes, the mechanical arm is fixedly installed at the top of the operation body, and a circuit board clamp is fixedly installed at the bottom of a lifting arm of the mechanical arm through a connecting seat; the tin spraying device is arranged in the middle of the operation body, a second round hole is formed in the center of the top of the operation body, and a tin spraying nozzle of the tin spraying device extends out of the second round hole.
8. The control system of a circuit soldering method based on data recognition according to claim 5, wherein: the first driving mechanism lifting assembly, the front-back moving assembly and the left-right moving assembly.
9. The control system of a circuit soldering method based on data recognition according to claim 7, wherein: the mechanical arm is a SCARA mechanical arm, the rotation radius is 700mm, and the distance between the rotation center of the base and the tin spraying and soldering nozzle is 475mm plus or minus 20mm.
10. The system of claim 9, wherein the arm solder path is started from the nearest external position close to the other arm to avoid interference when the two arms are simultaneously operated.
CN202311384363.5A 2023-10-25 2023-10-25 Circuit soldering method based on data identification and control system Pending CN117381088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311384363.5A CN117381088A (en) 2023-10-25 2023-10-25 Circuit soldering method based on data identification and control system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311384363.5A CN117381088A (en) 2023-10-25 2023-10-25 Circuit soldering method based on data identification and control system

Publications (1)

Publication Number Publication Date
CN117381088A true CN117381088A (en) 2024-01-12

Family

ID=89469796

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311384363.5A Pending CN117381088A (en) 2023-10-25 2023-10-25 Circuit soldering method based on data identification and control system

Country Status (1)

Country Link
CN (1) CN117381088A (en)

Similar Documents

Publication Publication Date Title
US9457605B2 (en) Screen printing machine
CN103841764B (en) FPC reinforcing chips intelligence placement equipment
US9398696B2 (en) Screen printing machine
CN102548240B (en) Double-arm multi-head chip mounting system for light-emitting diode (LED) chip mounter
US20180303016A1 (en) System for performing work on substrate and insertion method
CN109561603B (en) Paster attaching method and device
CN111703217A (en) PCB jet printing machine
CN109332840A (en) A kind of Intelligent welding system and method
EP3361852B1 (en) Cutting/bending device and cutting device
CN112045268A (en) Full-automatic selective wave soldering device
CN117381088A (en) Circuit soldering method based on data identification and control system
CN215931685U (en) Printed circuit board front end golden finger detection device
CN202488893U (en) LED chip mounter double-arm multi-head mount system
CN115988773A (en) Automatic alignment plugging system and method
CN106530357B (en) Visual alignment control device and calibration method
CN101054014A (en) Serial multi-axis stepper control method and system for tin paste printing machine
CN211997769U (en) Uninterrupted efficient automatic material receiving mechanism based on visual positioning
CN212577735U (en) Full-automatic selective wave soldering device
CN212949751U (en) PCB jet printing machine
CN207140567U (en) A kind of pre- folded ink jet numbering machine
CN110113878B (en) Multilayer circuit board processing technology and equipment
CN102621914A (en) Automatic control method for LED surface mounting machine
JP2014022427A (en) Component-mounting apparatus and component-mounting method
CN117425289B (en) Tin spraying technology for circuit board
JP3026853B2 (en) Component mounting device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination