CN117377208A - Ultrathin rigid flexible board uncovering process - Google Patents
Ultrathin rigid flexible board uncovering process Download PDFInfo
- Publication number
- CN117377208A CN117377208A CN202311281559.1A CN202311281559A CN117377208A CN 117377208 A CN117377208 A CN 117377208A CN 202311281559 A CN202311281559 A CN 202311281559A CN 117377208 A CN117377208 A CN 117377208A
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- CN
- China
- Prior art keywords
- layer
- glue
- blocking
- resisting
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000003292 glue Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 239000013039 cover film Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims abstract description 5
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 90
- 238000010586 diagram Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of circuit board production, in particular to an ultrathin rigid flexible board uncovering process, which comprises the following steps: providing a PP layer and a glue-resisting PI layer, pressing the PP layer and the glue-resisting PI layer, cutting two sides of the PP layer and two sides of the glue-resisting PI layer, removing two sides of the glue-resisting PI layer along the through groove, providing a flexible substrate, forming a first circuit layer on the surface of the flexible substrate, pressing a covering film on the surface of the first circuit layer, placing one end of the glue-resisting PI layer far away from the PP layer on the surface of the covering film, attaching copper foil on the surface of the PP layer, forming a second circuit layer with the copper foil, prying the PP glue overflow at a gap of a non-effective area, and removing the glue-resisting PI layer and the PP layer. According to the invention, the PP glue overflow cutter is pried at the gap of the non-effective area, so that the glue blocking PI layer and the whole PP layer on the top of the glue blocking PI layer are removed, the cover opening can be completed, the cover opening is not required to be cut by laser, and the cover film can be effectively protected.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to an ultrathin rigid flexible board uncovering process.
Background
The printed circuit board is developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is continuously developed towards high precision, high density and high reliability, the volume is continuously reduced, the cost is reduced, the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products, and the development trend of the production and manufacturing technology of the printed circuit board in the future is the development towards the performance towards the directions of high density, high precision, fine pore diameter, fine wires, small spacing, high reliability, multilayering, high-speed transmission, light weight and thin type.
For an ultrathin rigid flexible board, in the manufacturing process, the PP layer needs to be subjected to uncovering treatment so as to expose the flexible region, but the thickness of the PP layer of the ultrathin rigid flexible board is ultrathin due to the thinner thickness of the ultrathin rigid flexible board, and in the uncovering process of laser cutting, the cover film of the flexible region is easily damaged after passing through the PP layer.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide an ultrathin rigid flexible board uncovering process for preventing the rigid flexible board from being damaged.
The aim of the invention is achieved by the following technical scheme: an ultrathin rigid flexible board uncovering process comprises the following steps:
s1, providing a PP layer and a glue-blocking P I layer, and pressing the PP layer and the glue-blocking P I layer;
s2, cutting two sides of the PP layer and two sides of the glue-resisting P I layer, cutting two sides of the glue-resisting P I layer into penetrating through grooves, and cutting two sides of the PP layer into non-penetrating gaps;
s3, removing two sides of the glue blocking P I layer along the through grooves;
s4, providing a flexible substrate, and forming a first circuit layer on the surface of the flexible substrate;
s5, laminating a cover film on the surface of the first circuit layer;
s6, placing one end of the glue blocking P I layer far away from the PP layer on the surface of the covering film, pressing the PP layer, and filling PP glue overflow in a gap after pressing;
s7, attaching copper foil on the surface of the PP layer;
s8, forming a second circuit layer by the copper foil;
s9, prying the PP glue overflow at the gap of the non-effective area, so that the PP layer on the top of the glue-blocking P I layer and the glue-blocking P I layer is removed.
The invention is further arranged to, between step S8 and step S9, further comprise the steps of: coating ink on the surface of the second circuit layer; and the ink on top of the resist P I layer is removed.
The invention further provides that in step S2, the PP layer and the resist P I layer are cut by a UV laser machine.
The invention is further arranged that the top and bottom of the flexible substrate are of the same structure.
The invention is further arranged that one end of the glue-blocking P I layer close to the PP layer is provided with adhesiveness; the end of the glue-blocking P I layer far away from the PP layer is not sticky.
The invention is further arranged that, between the step S7 and the step S8, the method further comprises the following steps: drilling holes, shading, electroplating and etching circuits are sequentially carried out on the copper foil.
The invention is further arranged such that the width of the gap gradually decreases from the end closer to the layer of resist P I to the end farther from the layer of resist P I.
The invention has the beneficial effects that: according to the invention, the PP glue overflowing cutter is pried at the gap of the non-effective area, so that the whole PP layer at the top of the glue blocking P I layer and the glue blocking P I layer is removed, the cover opening can be completed, the cover opening is not required to be cut by laser, and the cover film can be effectively protected.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
Fig. 1 is a schematic structural diagram of the present invention after cutting the resist P I layer and the PP layer;
FIG. 2 is a schematic diagram of the structure of the present invention after the ineffective resist P I layer is removed;
FIG. 3 is a schematic view of the structure of the present invention after the resist P I layer is placed on the cover film;
FIG. 4 is a schematic diagram of the structure of the present invention after copper foil lamination;
FIG. 5 is a schematic diagram of the structure of the second circuit layer according to the present invention;
FIG. 6 is a schematic diagram of the structure of the present invention after ink application;
FIG. 7 is a schematic diagram of the structure of the present invention after removal of the resist P I layer and the PP layer;
wherein: 1. a PP layer; 11. a slit; 12. PP overflows the glue; 2. a glue blocking P I layer; 21. a through groove; 3. a flexible substrate; 31. a first circuit layer; 4. a cover film; 5. copper foil; 51. a second circuit layer; 6. and (3) printing ink.
Detailed Description
The invention will be further described with reference to the following examples.
As can be seen from fig. 1 to 7, the process for uncovering an ultrathin rigid flexible board according to the embodiment comprises the following steps:
s1, providing a PP layer 1 and a glue-blocking P I layer 2, and pressing the PP layer 1 and the glue-blocking P I layer 2, wherein one surface of the glue-blocking P I layer 2 has micro-adhesiveness;
s2, cutting two sides of the PP layer 1 and two sides of the glue-blocking P I layer 2, cutting two sides of the glue-blocking P I layer 2 into penetrating through grooves 21, and cutting two sides of the PP layer 1 into non-penetrating gaps 11; thereby forming the state shown in fig. 1;
s3, removing two sides of the photoresist P I layer 2 along the through groove 21; thereby forming the state shown in fig. 2
S4, providing a flexible substrate 3, and forming a first circuit layer 31 on the surface of the flexible substrate 3;
s5, laminating a cover film 4 on the surface of the first circuit layer 31;
s6, placing one end of the glue-blocking P I layer 2 away from the PP layer 1 on the surface of the covering film 4, so as to form a state shown in fig. 3; pressing the PP layer 1, and filling PP glue overflow 12 in the gap 11 after pressing;
s7, attaching a copper foil 5 on the surface of the PP layer 1; thereby forming the state shown in fig. 4;
s8, forming a second circuit layer 51 by the copper foil 5; thereby forming the state shown in fig. 5;
s9, prying the PP overflow glue 12 at the gap 11 of the non-effective area, so that the PP layer 1 on the top of the glue-blocking P I layer 2 and the glue-blocking P I layer 2 is removed; thereby forming the state shown in fig. 7.
Specifically, in the ultrathin rigid flexible board uncapping process described in the embodiment, the PP layer 1 and the glue-blocking PI layer 2 are pressed together, and then cut by a laser cutting machine at the same time, so that the through groove 21 and the slit 11 can be cut at one time, and the production is efficient and reliable; after the waste areas on the two sides of the glue-blocking PI layer 2 are removed, the rest of the glue-blocking PI layer 2 is placed on the cover film 4, and in the lamination process of the PP layer 1, gaps 11 are filled with PP glue overflows 12 by utilizing the glue flowing characteristic of the lamination PP layer 1, so that the liquid medicine in the flexible area is prevented from being produced after lamination; finally, the PP overflow glue 12 is pried by a cutter at the gap 11 of the non-effective area, so that the glue-blocking PI layer 2 and the whole PP layer 1 at the top of the glue-blocking PI layer 2 are removed, the cover opening can be completed, the cover opening is not required to be cut by laser, and the cover film 4 can be effectively protected.
The process for uncovering the ultrathin rigid flexible board in the embodiment further comprises the following steps between the step S8 and the step S9: coating ink 6 on the surface of the second circuit layer 51; thereby forming the state shown in fig. 6; and the ink 6 on top of the resist P I layer 2 is removed. The second wiring layer 51 can be protected by the above arrangement.
In the process for uncovering an ultrathin rigid flexible board, in step S2, the PP layer 1 and the glue-blocking PI layer 2 are cut by a UV laser machine. Through the arrangement, the through groove 21 and the gap 11 can be cut at one time, and the production is efficient and reliable.
In the ultrathin rigid flexible board uncovering process described in the embodiment, the top and bottom structures of the flexible substrate 3 are the same. Through the arrangement, the top structure and the bottom structure of the ultrathin rigid flexible board can be identical.
In the ultrathin rigid flexible board uncovering process, one end of the glue-resistant PI layer 2, which is close to the PP layer 1, has viscosity; one end of the adhesive-resistant PI layer 2 far away from the PP layer 1 is not sticky. Through the arrangement, when the PP layer 1 is pried, the glue-blocking P I layer 2 can be simultaneously taken out.
The process for uncovering the ultrathin rigid flexible board in the embodiment further comprises the following steps between the step S7 and the step S8: the copper foil 5 is sequentially drilled, blackened, plated, and etched.
In the process for uncovering an ultrathin rigid flexible board according to the embodiment, the width of the gap 11 gradually decreases from one end close to the glue-blocking PI layer 2 to one end far away from the glue-blocking PI layer 2. Through the arrangement, the PP layer 1 is convenient to pry.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (7)
1. An ultrathin rigid flexible board uncovering process is characterized in that: the method comprises the following steps:
s1, providing a PP layer (1) and a glue-resistant PI layer (2), and laminating the PP layer (1) and the glue-resistant PI layer (2);
s2, cutting two sides of the PP layer (1) and two sides of the glue-resisting PI layer (2), cutting two sides of the glue-resisting PI layer (2) into penetrating through grooves (21), and cutting two sides of the PP layer (1) into non-penetrating gaps (11);
s3, removing two sides of the photoresist PI layer (2) along the through groove (21);
s4, providing a flexible substrate (3), and forming a first circuit layer (31) on the surface of the flexible substrate (3);
s5, laminating a cover film (4) on the surface of the first circuit layer (31);
s6, placing one end, far away from the PP layer (1), of the glue-blocking PI layer (2) on the surface of the covering film (4), pressing the PP layer (1), and filling PP glue overflow (12) in a gap (11) after pressing;
s7, attaching a copper foil (5) on the surface of the PP layer (1);
s8, forming a second circuit layer (51) by the copper foil (5);
s9, prying the PP overflow glue (12) at a gap (11) of the non-effective area, so that the glue-blocking PI layer (2) and the PP layer (1) on the top of the glue-blocking PI layer (2) are removed.
2. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: between step S8 and step S9, the method further comprises the steps of: coating ink (6) on the surface of the second circuit layer (51); and removing the ink (6) on the top of the photoresist PI layer (2).
3. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: in step S2, the PP layer (1) and the resist PI layer (2) are cut by a UV laser.
4. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: the top and bottom of the flexible substrate (3) are of the same structure.
5. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: one end of the glue-blocking PI layer (2) close to the PP layer (1) is sticky; one end of the glue-blocking PI layer (2) far away from the PP layer (1) is not sticky.
6. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: between step S7 and step S8, the method further comprises the following steps: drilling, shading, electroplating and etching circuits are sequentially performed on the copper foil (5).
7. The ultra-thin rigid flex board uncapping process according to claim 1, wherein: the width of the gap (11) gradually decreases from one end close to the glue-resisting PI layer (2) to one end far away from the glue-resisting PI layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311281559.1A CN117377208A (en) | 2023-09-28 | 2023-09-28 | Ultrathin rigid flexible board uncovering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311281559.1A CN117377208A (en) | 2023-09-28 | 2023-09-28 | Ultrathin rigid flexible board uncovering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117377208A true CN117377208A (en) | 2024-01-09 |
Family
ID=89403321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311281559.1A Pending CN117377208A (en) | 2023-09-28 | 2023-09-28 | Ultrathin rigid flexible board uncovering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117377208A (en) |
-
2023
- 2023-09-28 CN CN202311281559.1A patent/CN117377208A/en active Pending
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |