CN117369066A

CN117369066A - Optical module

Info

Publication number: CN117369066A
Application number: CN202311255248.8A
Authority: CN
Inventors: 张加傲; 王欣南; 邵宇辰
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2024-01-09
Also published as: CN114035283A; CN114035283B

Abstract

The application discloses optical module includes: a cavity formed by covering the upper shell and the lower shell; the circuit board is arranged in the cavity and fixedly connected with the lower shell; the sub-circuit board is arranged above the circuit board. The fixing frame comprises a base and a bracket which are detachably connected. The support includes support column and clamp plate, and the one end and the clamp plate of support column are connected, and the other end and the base of support column are connected. The base includes: and the fixing part is hoisted below the inner wall of the upper shell, and the sub-circuit board is arranged below the fixing part. The light source installation part is arranged above the circuit board and is positioned at one side of the fixing part. The light source emitter is arranged between the light source installation part and the pressing plate and emits light which does not carry signals. According to the light source module, the sub-circuit board is fixed on the upper shell through the fixing part, the light source emitter is fixed on the fixing frame, and the fixing frame is fixed on the lower surface of the upper shell, so that the light source emitter is installed and fixed inside the light module.

Description

Optical module

This application is a divisional application, the filing number of the original application is 202111342027.5, the filing date of the original application is 2021, 11, 12, and the entire contents of the original application are incorporated herein by reference.

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

Along with the miniaturization of devices, all photoelectric devices inside the optical module are distributed more tightly and occupy smaller space.

Disclosure of Invention

The application provides an optical module to achieve a reduction in space of internal components of the optical module.

In order to solve the technical problems, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, including:

an upper housing;

the lower shell is covered with the upper shell to form a wrapping cavity;

the circuit board is arranged in the wrapping cavity and fixedly connected with the lower shell; the circuit board is provided with an optical modulation chip;

the sub-circuit board is arranged above the circuit board;

the fixing frame comprises a base and a bracket, and the bracket is detachably connected with the base; the support comprises a support column and a pressing plate, one end of the support column is connected with the pressing plate, and the other end of the support column is connected with the base;

The base includes:

the fixing part is hung below the inner wall of the upper shell, and the sub-circuit board is arranged below the fixing part; and

the light source installation part is arranged above the circuit board and is positioned at one side of the fixing part;

the light source emitter is arranged between the light source installation part and the pressing plate, the side wall of the light source emitter is provided with pins, and the pins are connected with the sub-circuit board; wherein the pressing plate is fixedly connected with the support column; the light source emitter is positioned above the circuit board, the light source emitter emits light which does not carry signals, and the light modulation chip loads signals to the light to form signal light.

Compared with the prior art, the beneficial effect that this application exists:

the application discloses optical module includes: the upper shell and the lower shell are covered to form a wrapping cavity; the circuit board is arranged in the wrapping cavity and fixedly connected with the lower shell; the sub-circuit board is arranged above the circuit board. The fixing frame comprises a base and a bracket which are detachably connected. The support includes support column and clamp plate, and the one end and the clamp plate of support column are connected, and the other end and the base of support column are connected. The base includes: and the fixing part is hoisted below the inner wall of the upper shell, and the sub-circuit board is arranged below the fixing part. The light source installation part is arranged above the circuit board and is positioned at one side of the fixing part. The light source emitter is arranged between the light source installation part and the pressing plate and emits light which does not carry signals. The sub-circuit board is fixed on the upper shell through the fixing part, and the light source emitter is connected with the upper shell through the fixing frame. Finally, the light source emitter is fixed on the fixing frame, the fixing frame is fixed on the lower surface of the upper shell, the light source emitter is fixed in the optical module, the light source emitter is connected with the upper shell through the base, and heat emitted by the light source emitter is transferred to the upper shell through the base, so that the heat dissipation effect is improved. When the light source is disassembled, the connection between the light source emitter and the base can be released only by unscrewing the screw for connecting the support column and the base for a plurality of circles. Therefore, when the light source emitter is maintained and replaced, the light source emitter can be taken out only by unscrewing the screw connected with the support column and the base, and the light source emitter is convenient and quick.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an exploded schematic view of a light source emitter and a circuit board according to an embodiment of the present application;

fig. 6 is a partial cross-sectional view of an optical module according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of an upper housing and a light emitting component according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an upper housing according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a light source emitter according to an embodiment of the present application;

FIG. 10 is a schematic view of another angle structure of a light source emitter according to an embodiment of the present disclosure;

FIG. 11 is a schematic diagram of an exploded structure of a light source emitter according to an embodiment of the present disclosure;

fig. 12 is a schematic diagram of an exploded structure of a sub-circuit board and a light source according to an embodiment of the present disclosure;

fig. 13 is an exploded view of a fixing frame according to an embodiment of the present disclosure;

FIG. 14 is an exploded view of another angle of a mount according to an embodiment of the present disclosure;

fig. 15 is a schematic view of another angle structure of the upper housing according to the embodiment of the present application;

FIG. 16 is a schematic view of the upper housing and the mounting bracket in an exploded configuration;

FIG. 17 is a schematic diagram of the upper housing, light source emitter and fiber optic adapter provided in an embodiment of the present application;

fig. 18 is a schematic structural diagram of a circuit board and a lower housing according to an embodiment of the present disclosure;

fig. 19 is an exploded view of a circuit board and a lower housing according to an embodiment of the present disclosure;

fig. 20 is a schematic structural diagram of a fixing frame, an optical fiber support and a circuit board according to an embodiment of the present application;

fig. 21 is a schematic diagram of a split structure of an optical fiber support and a circuit board according to an embodiment of the present disclosure;

FIG. 22 is a schematic view of another angle structure of an optical fiber holder according to an embodiment of the present disclosure;

fig. 23 is a second schematic partial structure of the optical module according to the embodiment of the present application;

Fig. 24 is a schematic cross-sectional view of a local structure of an optical module according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (left end of fig. 3) and opening 205 is also located at the end of light module 200 (right end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver device inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-in member that mates with the cage of the host computer (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), limiting amplifier (limiting amplifier), clock data recovery chip (Clock and Data Recovery, CDR), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

The optical transceiver device comprises an optical transmitting sub-module and an optical receiving sub-module.

Fig. 5 is an exploded schematic diagram of a light source emitter and a circuit board according to an embodiment of the present application. Fig. 6 is a partial cross-sectional view of an optical module according to an embodiment of the present application. As shown in fig. 5 and 6, a light source emitter 410 is disposed in the optical module and above the circuit board 300, for emitting light, and one end is connected to the outgoing optical fiber. The sub-circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through the flexible circuit board 440. The light source emitter 410 is electrically connected to the sub-circuit board 420, and the sub-circuit board 420 drives the electro-optical devices within the light source emitter 410. The fixing frame 430 is disposed above the circuit board 300, and is used for fixing the light source emitter 410. The light source emitter 410 is fixed on the fixing frame 430, and one side of the light source emitter is provided with a plurality of pins connected with the sub-circuit board 420. The fixing frame 430 is further connected to the upper housing, and the light source emitter 410 is fixed on the upper housing through the fixing frame 430, so that heat emitted by the light source emitter can be directly transferred to the upper housing through the fixing frame, and the heat dissipation function of the optical module is improved.

In this embodiment of the present application, the light source emitter may be a light source, emits light without a signal, and the light modulation chip receives a light loading signal emitted by the light source to form signal light.

In the embodiment of the application, the light source emitter is arranged above the circuit board and is used for emitting light. The sub-circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through the flexible circuit board. The light source is electrically connected to the sub-circuit board 420, and the sub-circuit board 420 drives the light source. The fixing frame 430 is disposed above the circuit board, and is used for fixing the light source. The fixing frame 430 is further connected with the upper housing 201, and the light source emitter 410 is fixed on the upper housing 201 through the fixing frame 430, so that heat emitted by the light source emitter can be directly transferred to the upper housing by the fixing frame, and the heat dissipation function of the optical module is improved.

Fig. 7 is a schematic structural diagram of an upper housing and a light emitting component provided in an embodiment of the present application, fig. 8 is a schematic structural diagram of an upper housing provided in an embodiment of the present application, and fig. 9 is a schematic structural diagram of a light source emitter provided in an embodiment of the present application, where, as shown in fig. 7, fig. 8 and fig. 9, an upper housing 201 includes: the cover 2011, and two first upper side plates 2012 and two second upper side plates 2013 which are positioned at two sides of the cover 2011 and are perpendicular to the cover. The cover 2011 is provided with a bracket mounting groove 2014 recessed with respect to a lower surface of the cover 2011. The bracket mounting groove 2014 is matched with the upper surface of the fixing frame, and the fixing frame 430 is mounted inside the bracket mounting groove 2014. The bracket mounting groove 2014 is provided with a first fixing hole 2015, which is positioned at one corner of the bracket mounting groove 2014 and corresponds to the first connecting hole 4311 on the fixing frame 430; the bracket mounting groove 2014 is also provided with a second fixing hole 2016, which is positioned at the other corner of the bracket mounting groove 2014 and corresponds to the position of the second connecting through hole 4312 on the base.

In order to facilitate connection and fixation of the fixing frame 430 to the upper case 201 and to improve connection stability, the first and second fixing holes 2015 and 2016 are positioned at diagonal positions of the bracket mounting groove, so that installation and stability are facilitated.

The fixing frame 430 includes: a base and a bracket. The base is of a rectangular plate structure, one side surface of the base is of a plane structure, and the base is connected with the upper shell and used for fixing; the other side is provided with a plurality of avoidance grooves for the fixed installation of the light source and the sub-circuit board 420. The support includes: the support column and clamp plate, the support column sets up in the base below, and one end is connected with the base, and the other end is connected with the clamp plate. One side of the pressing plate is connected with the light source, and the light source is fixed between the pressing plate and the base.

In the embodiment of the present application, the light source emitter 410 may be a casing with a common cuboid structure, in which the light source emitter is disposed, and one end is connected with an outgoing optical fiber. The upper surface of the light source emitter 410 is connected to the lower surface of the base, and the lower surface is connected to the upper surface of the platen. A plurality of metal pins are arranged on one side surface of the light source emitter 410 and connected with the sub-circuit board 420, so that the fixation and electric connection of the light source and the sub-circuit board 420 are realized, the metal pins are arranged towards one side of the sub-circuit board 420, the distance between the pins and the sub-circuit board 420 is reduced, and the connection stability is improved.

Fig. 10 is another schematic view of an angle structure of a light source emitter according to an embodiment of the present application, and fig. 11 is an exploded schematic view of a light source emitter according to an embodiment of the present application. Referring to fig. 10 and 11, in the embodiment of the present application, the fixing frame 430 includes: a base 431 and a bracket 432. The base 431 is of a rectangular plate structure, one side surface of the base is of a plane structure, and the base is connected with the upper shell and used for fixing; the other side is used for the fixed mounting of the light source emitter 410 and the sub-circuit board 420. The bracket 432 includes: the support column 4321 and clamp plate 4322, support column 4321 sets up in the base 431 below, and one end is connected with base 431, and the other end is connected with clamp plate 4322. One side of the pressing plate 4322 is connected with a light source, and the light source is fixed between the pressing plate 4322 and the base 431.

To facilitate the limitation of the light source on the base 431, one side of the lower surface of the base 431 includes a light source mounting portion 4313, which is mounted in a matching manner with the light source. The base 431 includes a fixing portion 4314 fixedly connected to the sub-circuit board 420. The fixing portion 4314 is provided on one side of the light source mounting portion 4313.

The upper surface of the base 431 is connected with the upper housing 201, and the lower surface is provided with a light source emitter 410 and a sub-circuit board 420, wherein the light source emitter 410 is arranged between the pressing plate 4322 and the base 431, and the sub-circuit board 420 is arranged at one side of the light source emitter 410 and is connected with the sub-circuit board 420 through pins. The heat generated by the light source emitter 410 is directly conducted to the upper housing 201 through the mount 431 and then transferred to the cage for heat dissipation.

To achieve the fixed connection of the base 431 and the upper case 201, the base 431 is provided with a plurality of connection through holes, and is connected to the upper case 201 by screws. The upper case 201 is provided with fixing holes at opposite positions corresponding to the connection through holes, and is connected to the connection through holes by screws passing through the fixing holes when connected. The connection through-hole may be a threaded hole having threads, and the screw is connected to the connection through-hole.

The optical module is provided with a plurality of photoelectric devices, and a plurality of optical fibers are arranged for realizing the light transmission among the photoelectric devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is far longer than the distance between photoelectric components. In order to improve the stability of the optical fiber, the optical module is also provided with an optical fiber bracket which is arranged above the circuit board, an optical fiber groove is arranged above the optical fiber bracket, and the optical fiber is fixed in the optical fiber groove.

The upper surface and the lower surface of the sub-circuit board 420 are respectively provided with a plurality of electronic components, the sizes, the heights and the like of the electronic components are not completely consistent, in order to facilitate the setting of the emergent optical fiber angle of the light source emitter 410, the fixing part 4314 is provided with a plurality of avoiding recesses 43141 for avoiding and mounting the electronic components, so that the sub-circuit board 420 and the circuit board 300 are kept parallel or basically parallel after mounting.

For fixing between the base 431 and the sub-circuit board 420, the base 431 is provided with a third connection through hole 4315 located at one side of the fixing portion 4314 for fixing with the sub-circuit board 420. The base 431 further has a fourth connection through hole 4316 located at the other side of the fixing portion 4314 for fixing with the sub-circuit board 420. The sub-circuit board 420 is provided with a third fixing hole 421, which is matched with the third connecting hole 4315 in position. The third fixing hole 421 and the third connection through hole 4315 are connected by a screw. The sub-circuit board 420 is provided with a fourth fixing hole 422, which is matched with the fourth connection through hole 4316 in position. The fourth fixing hole 422 is connected to the fourth connection through hole 4316 by a screw.

Specifically, the third fixing hole 421 and the fourth fixing hole 422 are disposed at diagonal positions of the circuit board, so as to realize positioning between the sub-circuit board 420 and the base 431 in a direction parallel to the plane of the circuit board. The third fixing hole 421 is disposed adjacent to the bracket 432, and may be a circular through hole or an escape hole.

Fig. 12 is a schematic diagram of an exploded structure of a sub-circuit board and a light source according to an embodiment of the present application. As shown in fig. 11 and 12, the sub-circuit board 420 is provided with a mounting relief 424, and the light source emitter 410 is disposed at the mounting relief 424. The upper surface of the light source emitter 410 contacts the base, one end of the light source emitter 410 near the light port contacts the bracket 432, and the other end is connected to the corner position of the installation avoidance portion 424. One side of the light source emitter 410 is connected to the sub-circuit board 420 through a plurality of pins 411. Specifically, one side of the light source emitter 410 is connected to the upper surface of the sub-circuit board 420 through pins.

Fig. 13 is an exploded view of a fixing frame according to an embodiment of the present application. Fig. 14 is an exploded view of another angle of a holder according to an embodiment of the present disclosure. As shown in connection with fig. 12 and 13, in some embodiments of the present application, the mount 431 and the bracket 432 may be an integrally formed structure, and an upper surface of the pressing plate 4322 is connected with a lower surface of the light source emitter 410. Alternatively, the base 431 and the bracket 432 are separate structures, as shown. The bracket 432 includes a support column 4321 and a pressing plate 4322, wherein the support column 4321 is disposed below the base 431, one end of the support column is connected to the base 431, and the other end of the support column is connected to the pressing plate 4322. The upper surface of the pressing plate 4322 is connected to the light source emitter 410, and the light source emitter 410 is fixed between the pressing plate 4322 and the base 431. The support column 4321 is provided with a fixing threaded hole 43211, and a connecting hole 4317 is arranged at a corresponding position of the base 431.

In the mounting process, the third connection through hole 4315 is connected with the third fixing hole 421 by using a screw connection, and the third connection through hole 4315 is connected with the third fixing hole 421, so that the connection and the fixation of the sub-circuit board 420 and the base 431 are realized. Then, the light source emitter 410 is mounted between the pressing plate 4322 and the light source emitter 410 mounting groove of the base 431, the supporting column 4321 is connected with the base 431 by using a screw, and the light source emitter 410 is fixed on the base 431 by using the pressing plate 4322. The mount 431 is placed in the mounting groove of the bracket 432, and the first connection through hole is connected with the first fixing hole, and the second connection through hole is connected with the second fixing hole by using screw connection, so that the connection between the fixing frame 430 of the light source emitter 410 and the upper case 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, the light source emitter 410 is installed and fixed in the light module, the light source emitter 410 is connected with the upper shell 201 through the base 431, and heat emitted by the light source emitter 410 is transferred to the upper shell 201 through the base 431, so that the heat dissipation effect is improved.

To facilitate heat transfer, the material of the mount 431 includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, cold rolled carbon steel), copper, etc., to facilitate transfer of heat generated by the optoelectronic device to the mount 431. In the present application, the light source emitter 410 is disposed on the base 431, and the heat generated by the light source emitter 410 is conveniently directly conducted to the upper housing 201 through the base 431 and the upper housing 201 by the base 431. The outer portion of the upper case 201 is connected to the cage, and has a heat dissipation path to increase heat transfer efficiency.

In some embodiments of the present application, for ease of maintenance, a spacer 4323 is provided between the platen 4322 and the light source emitter 410. The upper surface of the pressing plate 4322 is provided with a bearing portion 43221 and a bearing portion 43222, and the bearing portion 43222 is arranged between the bearing portion 43221 and the support column 4321 to realize connection between the bearing portion 43221 and the support column 4321. The upper surface of the pressure-receiving portion 43221 is connected to the lower surface of the spacer 4323, and the upper surface of the spacer 4323 is connected to the light source emitter 410. The upper surface of the bearing portion 43221 is lower than the upper surface of the receiving portion 43222, so that a step surface exists between the bearing portion 43221 and the receiving portion 43222, and one end of the gasket 4323 contacts with the step surface to position the gasket 4323.

Optionally, the upper surface of the spacer 4323 is not lower than the upper surface of the socket 43222. For convenient maintenance and disassembly, the upper surface of the spacer 4323 is higher than the upper surface of the receiving portion 43222, so that the light source emitter 410 is connected with the upper surface of the spacer 4323, a certain gap exists between the light source emitter 410 and the receiving portion 43222, excessive stress of screws between the support column 4321 and the base 431 during installation is avoided, excessive pressure of the pressing plate 4322 on the light source emitter 410 is avoided, and breakage of the pressing plate 4322 is avoided.

In the mounting process, the third connection through hole 4315 is connected with the third fixing hole 421 by using a screw connection, and the third connection through hole 4315 is connected with the third fixing hole 421, so that the connection and the fixation of the sub-circuit board 420 and the base 431 are realized. The light source emitter 410 is installed between the pressing plate 4322 and the light source emitter 410 installation groove of the base 431, the gasket 4323 is installed between the pressing plate 4322 and the light source emitter 410, the supporting column 4321 is connected with the base 431 by using a screw, and the light source emitter 410 is fixed on the base 431 by using the pressing plate 4322. The mount 431 is placed in the mounting groove of the bracket 432, and the first connection through hole is connected with the first fixing hole, and the second connection through hole is connected with the second fixing hole by using screw connection, so that the connection between the fixing frame 430 of the light source emitter 410 and the upper case 201 is realized. Finally, the light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, then the light source emitter 410 fixing frame 430 is fixed on the lower surface of the upper shell 201, the light source emitter 410 is installed and fixed in the light module, the light source emitter 410 is connected with the upper shell 201 through the base 431, and heat emitted by the light source emitter 410 is transferred to the upper shell 201 through the base 431, so that the heat dissipation effect is improved. When the light source emitter is detached, the gasket 4323 can be taken out only by unscrewing the screw for connecting the support column 4321 and the base 431 for a plurality of circles, and the gasket 4323 is loosened between the pressing plate 4322 and the light source emitter 410, so that the connection between the light source emitter 410 and the base 431 can be released. Therefore, when the light source emitter 410 is maintained and replaced, the light source emitter 410 can be taken out simply by unscrewing the screw of the support column 4321 connected with the base 431, thereby being convenient and quick.

To achieve the electrical connection between the sub-circuit board 420 and the circuit board 300, a first connector is disposed on the sub-circuit board 420 and located on the lower surface of the sub-circuit board 420, and the opening is toward the side far from the light source emitter 410. The circuit board 300 is provided with a second connector, and the opening orientation is identical to that of the first connector. The first connector and the second connector are connected by adopting a flexible circuit board. One end of the circuit board 300 is provided with a golden finger, the golden finger is connected with an upper computer, receives an electric signal of the upper computer, transmits the electric signal to the sub-circuit board 420 through the flexible circuit board, and is connected with an external pin of the light source emitter 410 through an electrifying pin of the sub-circuit board 420 to realize signal transmission.

The heat generated by the light source emitter 410 is transferred to the upper housing 201 through the base 431, and then is connected with the upper housing 201 through the base 431, and the heat emitted by the light source emitter 410 is transferred to the upper housing 201 through the base 431, so that the heat dissipation effect is improved. To achieve heat dissipation from the light source emitter 410, the material of the housing of the light source emitter 410 includes, but is not limited to, tungsten copper, raft alloy, SPCC (Steel Plate Cold rolled Commercial, cold rolled carbon steel), copper, etc., to facilitate transfer of heat generated by the optoelectronic device to the mount 431.

Fig. 15 is a schematic view of another angle structure of the upper housing provided in the embodiment of the present application, fig. 16 is a schematic view of an exploded structure of the upper housing and the fixing frame, and fig. 17 is a schematic view of the upper housing, the light source emitter and the optical fiber adapter provided in the embodiment of the present application. As shown in fig. 15, 16 and 17, in order to facilitate connection and fixation of the fixing frame 430 with the upper case 201 and improve connection stability, the fixing frame 430 is mounted inside the bracket mounting groove 2014, and an upper surface of the base contacts a lower surface of the bracket mounting groove 2014. The first and second fixing holes 2015 and 2016 are positioned at diagonal positions of the bracket mounting groove, so that the mounting and the stabilization are facilitated. First fixed orifices 2015 and second fixed orifices 2016 are the counter bore setting at apron 2011 upper surface, make things convenient for the screw head to sink, do not bulge in apron 2011 surface for the optical module outward appearance is more clean and tidy, the convenience is connected with the structure of host computer. The cover 2011 is further provided with a third fixing hole penetrating through the upper surface and the lower surface of the cover 2011 for fixing the upper housing 201 and the lower housing 202. In this embodiment, countersunk screws are screwed into the optical module from the lower surface of the upper case 201, and the fixing frame 430 is attached to the lower surface of the upper case 201.

In mounting, the sub-circuit board 420 and the base 431 are fixed by screws through the third fixing hole 421 and the third connecting through hole 4315, and the fourth fixing hole 422 and the fourth connecting through hole 4316, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the support column 4321 is connected with the base 431 by screws. The light source emitter 410 and the sub-circuit board 420 are fixed to the fixing frame 430. Then, the fixing frame 430 with the light source emitter 410 and the sub-circuit board 420 mounted thereon is connected to the upper case 201 by screwing the screws from the lower surface of the upper case 201 into the optical module, connecting the first fixing hole 2015 to the first connecting hole 4311, and connecting the second fixing hole 2016 to the second connecting hole 4312 on the base.

The fifth fixing hole 2017 is disposed at one side of the bracket mounting groove 2014 and near the light port. In order to achieve uniform stress on the upper and lower shells, the distance from the fifth fixing hole to the first upper side plate 2012 is consistent with the distance from the fifth fixing hole to the second upper side plate 2013.

In order to realize light transmission, a first optical fiber adapter 206 and a second optical fiber adapter 207 are arranged in the optical module and are arranged at the optical port 205, the first optical fiber adapter 206 is arranged close to the light source emitter 410, and for facilitating installation of the first optical fiber adapter 206, an adaptation avoiding groove 4324 is arranged on the support column 4321, and the first optical fiber adapter 206 and the second optical fiber adapter 207 are arranged between the fixing frame and the circuit board 300. The edge of the first optical fiber adapter 206 contacts with the adapting avoidance groove 4324, so that the avoidance installation of the first optical fiber adapter 206 can be realized, and meanwhile, the positioning of the first optical fiber adapter 206 is realized, thereby being beneficial to the stability of the first optical fiber adapter. The first fiber optic adapter 206 is connected to the optical modulation chip by an optical fiber for transmitting an optical signal to the outside of the optical module.

Fig. 18 is a schematic structural diagram of a circuit board and a lower housing provided in an embodiment of the present application, and fig. 19 is an exploded schematic structural diagram of a circuit board and a lower housing provided in an embodiment of the present application. As shown in fig. 18 and 19, the lower case 202 includes a bottom plate 2021, two lower side plates disposed on both sides of the bottom plate and perpendicular to the bottom plate, a first lower side plate 2022, and a second lower side plate 2023. The upper case 201 is covered on the lower case 202 by combining two side walls with two side plates. To achieve positioning of the circuit board in the lower housing, the lower housing 202 is provided with a plurality of fixing tables 2024, and the fixing tables 2024 have the same top surface height for supporting the circuit board. The supporting top surface of the fixing table 2024 is used for contacting the lower surface of the circuit board 300, so as to support the circuit board 300 and position the optical module in the height direction. In the embodiment of the present application, the fixing table may be a structure protruding on the inner sidewall of the lower housing 202 and having a supporting top surface. The shape of each fixed table can be the same or different.

Further, to ensure the accuracy of the mounting of the circuit board 300, a first spacing post 2025 and a second spacing post 2026 are further provided on the side wall of the lower housing 202. The first and second spacing columns 2025 and 2026 not only can realize the installation and positioning of the circuit board 300, but also can realize the fixation of the circuit board 300 in the length direction of the optical module. The positions of the first and second stopper posts 2025, 2026 in the longitudinal direction of the optical module may be different or may be the same.

The side of the circuit board 300 is provided with a first limiting opening 301, the first limiting opening 301 is clamped and connected with a first limiting column 2025, the second side of the circuit board 300 is provided with a second limiting opening 302, and the second limiting opening 302 is clamped and connected with a second limiting column 2026. In the embodiment of the present application, the first spacing post 2025 and the second spacing post 2026 correspond to the first spacing port 301 and the second spacing port 302.

In order to fix the circuit board 300 to the lower case, a fifth mounting hole 20211 is formed in the middle of the bottom plate 2021, and a seventh fixing hole 310 is formed in the circuit board 300. The fifth mounting through hole 20211 is connected to the upper surface of the circuit board 300 through the seventh fixing hole 310 by a screw. Since the lower surface of the circuit board 300 is also provided with a plurality of electronic components, in order to support the circuit board, a through hole stage 20212 is provided in the middle of the bottom plate 2021, and the fifth mounting through hole 20211 is located on the through hole stage 20212. The lower surface of the circuit board 300 is in contact connection with the through hole stage 20212, so that the support and positioning of the circuit board 300 are realized. The through hole stage 20212 protrudes with respect to the inner side wall of the bottom plate 2021 and has a supporting top surface.

Further, in order to facilitate the installation of the circuit board 300 and achieve uniform stress of the circuit board 300, the through hole stage 20212 is disposed in the middle of the bottom plate 2021, and the distance from the through hole stage 20212 to the first lower side plate 2022 is the same as the distance from the through hole stage 20212 to the second lower side plate 2023. The distance from the end surface of the through hole stage 20212 to the lower surface of the bottom plate 2021 is greater than the distance from the upper surface to the lower surface of the bottom plate 2021, i.e., the thickness of the through hole stage 20212 is greater than the thickness of the bottom plate 2021. The screws penetrate from the upper part of the seventh fixing hole 310 on the circuit board 300 and are connected with the fifth mounting through hole 20211, but do not protrude out of the lower end surface of the fifth mounting through hole 20211, so that the integrity of the lower surface of the bottom plate 2021 is maintained, and the connection of the optical module and the upper computer is facilitated.

The optical module is provided with a plurality of photoelectric devices, and a plurality of optical fibers are arranged for realizing the light transmission among the photoelectric devices. In order to facilitate the installation of the optical fiber and reduce the optical loss, the length of the optical fiber is far longer than the distance between photoelectric components. In order to improve the stability of the optical fiber, the optical module is further provided with an optical fiber bracket 500 disposed above the circuit board 300, and an optical fiber groove is disposed above the optical fiber bracket, and the optical fiber is fixed in the optical fiber groove.

Fig. 20 is a schematic structural diagram of a fixing frame, an optical fiber support and a circuit board according to an embodiment of the present application, and fig. 21 is a schematic structural diagram of a separation structure of the optical fiber support and the circuit board according to an embodiment of the present application. Fig. 22 is a schematic view of another angle structure of an optical fiber support according to an embodiment of the present application. As shown in fig. 20, 21 and 22, to realize positioning and mounting of the optical fiber holder 500 and the circuit board 300, a first limiting portion 501 and a second limiting portion 502 are disposed at one end of the bottom surface of the optical fiber holder 500. The circuit board 300 is provided with a third limiting opening 303, and the first limiting portion 501 is clamped and connected with the third limiting opening 303. The circuit board 300 is provided with a fourth limiting opening 304, and the second limiting portion 502 is clamped and connected with the fourth limiting opening 304. The first limiting part 501 and the second limiting part 502 not only can realize the installation and positioning of the optical fiber support 500 on the circuit board 300, but also can realize the fixation of the optical fiber support 500 in the height direction of the optical module.

Further, the first limiting portion 501 is provided with a first clamping portion 5011, is embedded into the third limiting port 303, and is clamped with the circuit board 300, so that the optical fiber bracket 500 is fixed in the length direction of the optical module. The first clamping portion 5011 protrudes downward relative to the first supporting surface 5012, and the first supporting surface 5012 contacts with the upper surface of the circuit board 300, so that the optical fiber bracket 500 is mounted and positioned on the circuit board 300, and the optical fiber bracket 500 is fixed in the height direction of the optical module. The first clamping connection part 5011 is embedded into the third limiting port 303, so that the optical fiber bracket 500 is fixed in the length direction of the optical module.

The second limiting portion 502 is provided with a second clamping portion 5021, is embedded into the fourth limiting opening 304 and is clamped with the circuit board 300, so that the optical fiber support 500 is fixed in the length direction of the optical module. The second clamping portion 5021 protrudes downwards relative to the second supporting surface 5022, the second supporting surface 5022 is in contact with the upper surface of the circuit board 300, and accordingly the optical fiber support 500 is mounted and positioned on the circuit board 300, and the optical fiber support 500 is fixed in the height direction of the optical module. The second clamping connection part 5021 is embedded into the fourth limiting port 304, so that the optical fiber bracket 500 is fixed in the length direction of the optical module.

Further, to improve the stability of the optical fiber bracket 500 on the circuit board 300, the lower surface of the optical fiber bracket 500 is further provided with a first supporting portion 503 and a second supporting portion 504, which are in contact connection with the upper surface of the circuit board 300, so as to fix the optical fiber bracket 500 in the height direction of the optical module. The first support portion 503 and the second support portion 504 have a flat support top surface for contact connection with the upper surface of the circuit board 300. In the embodiment of the present application, in order to facilitate the installation of the circuit board optoelectronic device, the ends of the first support portion 503 and the second support portion 504 are identical in height. And the ends of the first supporting portion 503 and the second supporting portion 504 are at the same height as the first supporting surface 5012 and the second supporting surface 5022.

In this application, the first support portion 503 and the second support portion 504 are in contact connection with the upper surface of the circuit board 300, so that the optical fiber bracket 500 is fixed in the height direction of the optical module. The first limiting part 501 and the second limiting part 502 are clamped with the third limiting port 303 and the fourth limiting port 304, so that the optical fiber bracket 500 is fixedly connected with the circuit board 300.

During installation, the first supporting part 503 and the second supporting part 504 are in contact connection with the upper surface of the circuit board 300, and the first clamping connection part 5011 is embedded into the third limiting port 303 and is clamped with the circuit board 300; the second clamping connection part 5021 is embedded into the fourth limiting port 304 and is clamped with the circuit board 300, so that the optical fiber bracket 500 is fixed in the height direction of the optical module. The first support portion 503 and the second support portion 504 are in contact connection with the upper surface of the circuit board 300; the first support portion 503 and the second support portion 504 are in contact connection with the upper surface of the circuit board 300, so as to fix the optical fiber bracket 500 in the height direction of the optical module. The optical fiber holder 500 is fixed to the circuit board 300.

One end of the side edge of the optical fiber bracket 500 is provided with a first mounting clamping groove 505, which corresponds to the position of the first limiting opening 301 on the circuit board 300 and is clamped and connected with the first limiting column 2025. A second mounting slot 506 is disposed at one end of the other side of the optical fiber support 500, and corresponds to the position of the second limiting opening 302 on the circuit board 300, and is in clamping connection with the second limiting post 2026. The first mounting groove 505 and the second mounting groove 506 are configured to position the optical fiber support 500 in the longitudinal direction in the lower housing 202.

Further, the circuit board 300 is provided with a plurality of photoelectric chips such as a DSP, so that the optical fiber support 500 is convenient to fixedly mount, space occupation is reduced, the lower surface of the optical fiber support 500 is provided with a photoelectric avoidance groove, and the chips such as the DSP are arranged in the photoelectric avoidance groove. The optical fiber bracket 500 is covered above the DSP, the distance between the optical fiber bracket 500 and the circuit board 300 is small, the space is reduced, and the miniaturized arrangement of the optical module is facilitated.

The lower surface of the optical fiber holder 500 is provided with an optical fiber groove for fixing the outgoing optical fiber of the light source emitter 410. The optical fiber support 500 and the fixing frame 430 are both disposed above the circuit board 300, and the optical fiber support 500 is located at one side of the fixing frame 430, so that the projection of the optical fiber support 500 on the circuit board 300 does not overlap with the projection of the fixing frame 430 on the circuit board 300. In this application, the holder 430 is near the light port 205 side and the fiber holder 500 is near the light port 205 side.

In order to facilitate the installation of the circuit board 300 on the lower housing, the seventh fixing hole 310 and the fifth installation through hole 20211 are located outside the projection of the optical fiber holder 500 on the circuit board 300, near the optical port 205 side.

Fig. 23 is a second schematic partial structure of the optical module according to the embodiment of the present application; fig. 24 is a schematic cross-sectional view of a local structure of an optical module according to an embodiment of the present application. As shown in fig. 23 and 24, in order to achieve electrical connection between the sub-circuit board 420 and the circuit board 300, a first connector 423 is provided on the sub-circuit board 420 at a lower surface of the sub-circuit board 420, and is opened toward one side of the light source emitter 410. The circuit board 300 is provided with a second connector 305 having an opening facing in line with the opening facing of the first connector. The first connector 423 and the second connector 305 are connected by a flexible circuit board 440. One end of the circuit board 300 is provided with a golden finger, the golden finger is connected with an upper computer, receives an electric signal of the upper computer, transmits the electric signal to the sub-circuit board 420 through the flexible circuit board 440, and is connected with an external pin of the light source emitter 410 through an electrifying pin of the sub-circuit board 420 to realize signal transmission.

Further, for easy installation, the first connector 423 is located outside the fixing frame, and the projection of the first connector 423 on the circuit board 300 is consistent with the position of the projection of the second connector 305 on the circuit board 300 in the length direction of the optical module.

The lower surface of the sub-circuit board 420 is adjacent to the upper surface of the circuit board 300, and a gap between the lower surface of the sub-circuit board 420 and the upper surface of the circuit board 300 after mounting is small, which is not beneficial to the arrangement of the electrical connector. Therefore, the second connector 305 is disposed on the lower surface of the circuit board 300, the first connector 423 is disposed on the upper surface of the sub-circuit board 420, and the flexible circuit board 440 is wrapped on the outer side of the light source emitter 410. Specifically, the flexible circuit board 440 is wrapped around the outside of the fiber optic connector of the light source transmitter 410. The flexible circuit board 440 has better flexibility and is convenient to install.

In mounting, the sub-circuit board 420 and the base 431 are fixed by screws through the third fixing hole 421 and the third connecting through hole 4315, and the fourth fixing hole 422 and the fourth connecting through hole 4316, the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, and the support column 4321 is connected with the base 431 by screws. The light source emitter 410 and the sub-circuit board 420 are fixed to the fixing frame 430. Then, the fixing frame 430 with the light source emitter 410 and the sub-circuit board 420 mounted thereon is connected to the upper case 201 by screwing the screws from the lower surface of the upper case 201 into the optical module, connecting the first fixing hole 2015 to the first connecting hole 4311, and connecting the second fixing hole 2016 to the second connecting hole 4312 on the base. The first supporting part 503 and the second supporting part 504 are connected with the upper surface of the circuit board 300 in a contact way, and the first clamping connection part 5011 is embedded into the third limiting port 303 and is clamped with the circuit board 300; the second clamping connection part 5021 is embedded into the fourth limiting port 304 and is clamped with the circuit board 300, so that the optical fiber bracket 500 is fixed in the height direction of the optical module. The first support portion 503 and the second support portion 504 are in contact connection with the upper surface of the circuit board 300; the first support portion 503 and the second support portion 504 are in contact connection with the upper surface of the circuit board 300, so as to fix the optical fiber bracket 500 in the height direction of the optical module. The optical fiber holder 500 is fixed to the circuit board 300. The screw is inserted from above the seventh fixing hole 310 on the circuit board 300, and connected to the fifth mounting through hole 20211, thereby fixing the circuit board 300 inside the lower case. One end of the flexible circuit board 440 is connected with the second connector of the lower surface of the circuit board 300, and the other end bypasses the light source emitter 410 and is connected with the first connector of the upper surface of the sub circuit board 420, thereby realizing the electrical connection between the circuit board 300 and the sub circuit board 420. The upper housing is then connected to the lower housing.

The application discloses optical module includes: the light source emitter 410 is disposed above the circuit board and is used for emitting light. The sub-circuit board 420 is disposed above the circuit board 300 and electrically connected to the circuit board 300 through the flexible circuit board. The light source emitter 410 is electrically connected to the sub-circuit board 420, and the sub-circuit board 420 drives the light source emitter 410. The light source emitter 410 fixing frame 430 is disposed above the circuit board, and is used for fixing the light source emitter 410. The light source emitter 410 is fixed on the light source emitter 410 fixing frame 430, and one side of the light source emitter 410 is provided with a plurality of pins connected with the sub-circuit board 420. The light source emitter 410 fixing frame 430 is also connected with the upper case 201, the light source emitter 410 is fixed on the upper case 201 through the light source emitter 410 fixing frame 430, and the heat emitted by the light source emitter 410 is directly transferred to the upper case 201 through the light source emitter 410 fixing frame 430, so that the heat dissipation function of the light module is improved. The bracket 432 includes: the support column 4321 and clamp plate 4322, support column 4321 sets up in the base 431 below, and one end is connected with base 431, and the other end is connected with clamp plate 4322. The upper surface of the pressing plate 4322 is connected with the light source emitter 410, and the light source emitter 410 is fixed between the pressing plate 4322 and the base 431, so that the light source emitter 410 is fixed. The heat generated by the light source emitter 410 is directly conducted to the upper housing 201 through the mount 431 and then transferred to the cage for heat dissipation.

Since the foregoing embodiments are all described in other modes by reference to the above, the same parts are provided between different embodiments, and the same and similar parts are provided between the embodiments in the present specification. And will not be described in detail herein.

It should be noted that in this specification, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the statement "comprises" or "comprising" a … … "does not exclude that an additional identical element is present in a circuit structure, article or apparatus that comprises the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application are not intended to limit the scope of the present application.

Claims

1. An optical module, comprising:

an upper housing;

the lower shell is covered with the upper shell to form a cavity;

the circuit board is arranged in the cavity and fixedly connected with the lower shell;

the sub-circuit board is arranged above the circuit board and is electrically connected with the circuit board;

the mount includes:

The light source emitter is connected with the light source installation part, the light source emitter is positioned above the circuit board, the side wall of the light source emitter is provided with pins, the pins are connected with the sub-circuit board, and the light source emitter emits light which does not carry signals;

the optical modulation chip is connected with the light source emitter through optical fibers, and the optical modulation chip loads signals on the light to form signal light.

2. The optical module of claim 1, further comprising: the optical fiber bracket is positioned above the circuit board; the optical fiber bracket is positioned at one side of the sub-circuit board;

the bottom surface of the optical fiber bracket is provided with a first limit part and a second limit part;

the circuit board is provided with a third limit opening and a fourth limit opening,

the first limiting part is clamped with the third limiting opening; the second limiting part is clamped with the fourth limiting opening.

3. The optical module of claim 2, wherein the first limiting portion comprises: the first clamping connection part protrudes downwards relative to the first supporting surface, and the first supporting surface is in contact with the upper surface of the circuit board; the first clamping connection part is embedded into the third limit opening;

The second limiting portion includes: the second clamping connection part protrudes downwards relative to the second supporting surface, and the second supporting surface is in contact with the upper surface of the circuit board; the second clamping connection part is embedded into the fourth limit opening.

4. The optical module of claim 2, wherein the lower surface of the optical fiber holder is further provided with a first supporting portion and a second supporting portion, and the first supporting portion and the second supporting portion are in contact connection with the upper surface of the circuit board.

5. The light module of claim 2 wherein the ends of the first and second support portions are at the same elevation as the first and second support surfaces.

6. The light module of claim 1, wherein the mount comprises a base and a bracket, the bracket being detachably connected to the base; the support comprises a support column and a pressing plate, one end of the support column is connected with the pressing plate, and the other end of the support column is connected with the base;

the base includes: the fixing portion and the light source mounting portion.

7. The optical module of claim 6, further comprising: a spacer positioned between the platen and the light source emitter;

The upper surface of the pressing plate is provided with a pressure-bearing part and a bearing part, and the bearing part is arranged between the pressure-bearing part and the support column;

the upper surface of the pressure-bearing part is connected with the lower surface of the gasket, and the upper surface of the gasket is connected with the light source emitter;

the upper surface of the pressure-bearing part is lower than the upper surface of the bearing part.

8. The optical module of claim 1, wherein a lower surface of the circuit board is provided with a second connector;

the upper surface of the sub-circuit board is provided with a first connector; the first connector is connected with the second connector through a flexible circuit board.

9. The optical module according to claim 1, wherein the upper housing inner wall is provided with a bracket mounting groove for positioning an upper surface of the fixing portion; a first fixing hole and a second fixing hole are formed in the diagonal position of the bracket mounting groove; the fixing part is provided with a first connecting through hole and a second connecting through hole; the first connecting through hole is connected with the first fixing hole through a screw; the second connecting through hole is connected with the second fixing hole through a screw.

10. The light module of claim 1, wherein the support column is disposed below the light source mounting portion, and one end thereof is connected to the light source mounting portion; the sub-circuit board is provided with an installation avoidance part for positioning the light source emitter.