CN117344309B - Metal etching liquid recovery control system and control method - Google Patents
Metal etching liquid recovery control system and control method Download PDFInfo
- Publication number
- CN117344309B CN117344309B CN202311648392.8A CN202311648392A CN117344309B CN 117344309 B CN117344309 B CN 117344309B CN 202311648392 A CN202311648392 A CN 202311648392A CN 117344309 B CN117344309 B CN 117344309B
- Authority
- CN
- China
- Prior art keywords
- liquid
- cation exchange
- temporary storage
- etching
- control valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 186
- 238000005530 etching Methods 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000011084 recovery Methods 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 title claims abstract description 29
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 84
- 239000002699 waste material Substances 0.000 claims abstract description 65
- 238000005341 cation exchange Methods 0.000 claims abstract description 56
- 238000001914 filtration Methods 0.000 claims abstract description 17
- 239000003729 cation exchange resin Substances 0.000 claims description 17
- 239000010808 liquid waste Substances 0.000 claims description 12
- 229940023913 cation exchange resins Drugs 0.000 claims description 11
- 238000004064 recycling Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000003912 environmental pollution Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
The invention provides a metal etching liquid recovery control system and a control method, and relates to the technical field of semiconductors. The recovery control system comprises an etching process cavity, a metal ion concentration analyzer, a temporary storage tank, a waste liquid recovery tank, a circulating tank, a cation exchange device, a filter, an etching liquid supply device and a control valve. After the etching process, recovering etching liquid, filtering the etching liquid, detecting the etching liquid in a temporary storage tank through a metal ion concentration analyzer, and if the metal ion concentration detection is not out of standard, introducing the etching liquid into a circulation tank for reuse after filtering; if the concentration of the metal ions exceeds the standard, the metal ions are replaced by a cation exchange device until the concentration meets the standard, and the metal ions are pumped into a circulation tank and finally filtered for reuse. The invention can effectively reduce the consumption of etching liquid and recycle metal, thereby saving cost; and the metal ion concentration of the etching liquid is kept stable, and the etching is uniform; and meanwhile, the waste liquid discharge is reduced, and the environmental pollution is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a metal etching liquid recovery control system and a control method.
Background
The wet etching is to remove the part uncovered by the photoresist by using a specific solution to chemically react with the film, and keep the photoresist protection part to form a pattern, thereby achieving the purpose of etching. Wet etching is widely used in microelectronic fabrication because of its low cost, high reliability, high throughput, and superior etch selectivity. The metal etching liquid is a solution for etching metal in an etching process.
At present, in the actual production process, the waste liquid generated by wet etching is not reused, so that the consumption of etching liquid is large, the cost is increased, and the problems of high cost, environmental pollution and the like of subsequent wastewater treatment are further caused.
Disclosure of Invention
In view of this, the embodiment of the application provides a metal etching solution recycling control system and a control method, so as to achieve the purposes of reducing the etching solution consumption, saving the cost, keeping the metal ion concentration of the etching solution stable, and etching uniformly.
The embodiment of the application provides the following technical scheme: a metal etching liquid recovery control system, comprising:
the etching process cavity is used for carrying out an etching process;
the liquid inlet of the temporary storage tank is communicated with the liquid outlet of the etching process cavity and is used for storing the liquid waste generated by the etching process, and a metal ion concentration analyzer is arranged in the temporary storage tank and is used for collecting the concentration of metal ions in the liquid waste;
the liquid outlet of the circulating groove is communicated with the etching liquid inlet of the etching process cavity, and the liquid outlet of the circulating groove is used for leading the waste liquid with the metal ion concentration lower than the standard value in the temporary storage groove into the etching process cavity again for etching process;
the liquid inlet of the cation exchange device is communicated with the liquid outlet of the temporary storage tank, and a second control valve is arranged on the communicating pipeline and used for introducing the waste liquid with the metal ion concentration higher than the standard value but lower than 5 times of the standard value in the temporary storage tank into the cation exchange device; the cation exchange device is internally provided with a metal ion concentration analyzer which is used for collecting the concentration of metal ions in the waste liquid after cation exchange; the liquid outlet of the cation exchange device is communicated with the liquid inlet of the circulating tank, and a third control valve is arranged on the communicating pipe and used for introducing the waste liquid with the metal ion concentration lower than the standard value in the cation exchange device into the circulating tank;
the liquid inlet of the liquid waste recovery tank is communicated with the liquid outlet of the temporary storage tank, and a fourth control valve is arranged on the communicating pipeline and used for introducing the liquid waste with the metal ion concentration higher than the standard value by 5 times in the temporary storage tank into the liquid waste recovery tank.
According to an embodiment of the application, a first filtering device is arranged on a communicating pipe between a liquid inlet of the temporary storage groove and a liquid outlet of the etching process cavity, and a pressure sensor is arranged in the first filtering device.
According to an embodiment of the application, a second filtering device is arranged on a communicating pipeline between a liquid outlet of the circulating tank and an etching liquid inlet of the etching process cavity, and a pressure sensor is arranged in the second filtering device.
According to an embodiment of the application, the device further comprises an etching liquid supply device, a liquid outlet of the etching liquid supply device is communicated with a liquid inlet of the circulating groove, and a fifth control valve is arranged on the communicating pipe.
According to one embodiment of the application, the temporary storage device further comprises a sixth control valve, and the sixth control valve is arranged on the liquid outlet of the temporary storage groove.
According to one embodiment of the application, a circulating pipeline is arranged in the cation exchange device, and two groups of cation exchange resins are sequentially arranged in the circulating pipeline in the flowing direction of liquid; and a group of cation exchange resins are also arranged on the liquid outlet of the cation exchange device.
According to one embodiment of the present application, the circulation pipeline further comprises a buffer tank, and the buffer tank is arranged on a pipeline between two groups of cation exchange resins.
The application also provides a control method of the metal etching liquid recovery control system, which comprises the following steps:
etching liquid is etched in the etching process cavity, then is discharged into the temporary storage groove through the waste liquid outlet, and is detected by the metal ion concentration analyzer in the temporary storage groove;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is lower than a standard value, a first control valve is opened, and the waste liquid in the temporary storage tank is introduced into the circulating tank;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is higher than the standard value but lower than the standard value by 5 times, closing the first control valve, opening the second control valve, and introducing the waste liquid in the temporary storage tank into a cation exchange device for cation exchange;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is 5 times higher than the standard value, the second control valve is closed, the fourth control valve is opened, and the waste liquid in the temporary storage tank is introduced into the waste liquid recovery tank.
According to one embodiment of the present application, further comprising: and after the waste liquid enters the cation exchange device for cation exchange, if the concentration of the metal ions collected by the metal ion concentration analyzer in the cation exchange device is lower than a standard value, continuing to perform at least 3 cycles, opening a third control valve and a first control valve, and introducing the waste liquid into the circulation tank.
According to one embodiment of the present application, further comprising: in the process of cation exchange of the waste liquid in the cation exchange device, the second control valve and the third control valve are both in a closed state.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least: according to the embodiment of the invention, the etching liquid is recycled, so that metal etching is a clean production process, and the metal etching process is more stable, even if the concentration of metal ions in the etching liquid is kept at a low level and the etching speed is uniform; meanwhile, the total material consumption is greatly reduced, only part of cation exchange resin is consumed in the regeneration cycle process, and the total material consumption is reduced by more than 96 percent; the metal adsorbed by the whole cation exchange resin is convenient for centralized recovery, so that the total cost (including adding etching liquid, electric power and the like) of the etching process is reduced by more than 75 percent compared with the original process (etching liquid consumption, electric power, water and wastewater treatment cost and the like), and the process which is concerned and generates dangerous waste liquid of the etching process is changed into a clean production process.
The embodiment of the invention can effectively reduce the consumption of etching liquid, recover metal and save cost; the metal ion concentration of the etching liquid is kept stable, so that the etching is uniform; and meanwhile, the waste liquid discharge is reduced, and the environmental pollution is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a metal etching solution recovery control system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a cation exchange arrangement in accordance with an embodiment of the present invention;
the device comprises a 1-etching process cavity, a 2-temporary storage tank, a 3-circulation tank, a 4-cation exchange device, a 5-waste liquid recovery tank, a 6-etching liquid supply device, a 7-first control valve, an 8-second control valve, a 9-third control valve, a 10-fourth control valve, an 11-fifth control valve, a 12-sixth control valve, a 13-first filtering device, a 14-second filtering device, 15-cation exchange resin, a 16-buffer tank and a 17-circulation pump.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
As shown in fig. 1, an embodiment of the present invention provides a metal etching solution recovery control system, including:
the etching process cavity 1 is used for carrying out an etching process;
the liquid inlet of the temporary storage tank 2 is communicated with the liquid outlet of the etching process cavity 1 and is used for storing the liquid waste generated by the etching process, and a metal ion concentration analyzer is arranged in the temporary storage tank 2 and is used for collecting the metal ion concentration in the liquid waste;
the liquid inlet of the circulating tank 3 is communicated with the liquid outlet of the temporary storage tank 2, a first control valve 7 is arranged on the communicating pipeline, the liquid outlet of the circulating tank 3 is communicated with the etching liquid inlet of the etching process cavity 1, and the liquid outlet is used for re-introducing the waste liquid with the metal ion concentration lower than the standard value in the temporary storage tank 2 into the etching process cavity 1 for etching process;
the liquid inlet of the cation exchange device 4 is communicated with the liquid outlet of the temporary storage tank 2, and a second control valve 8 is arranged on the communicating pipeline and is used for introducing the waste liquid with the metal ion concentration higher than the standard value but lower than the standard value by 5 times in the temporary storage tank 2 into the cation exchange device 4; the cation exchange device 4 is internally provided with a metal ion concentration analyzer which is used for collecting the concentration of metal ions in the waste liquid after cation exchange; the liquid outlet of the cation exchange device 4 is communicated with the liquid inlet of the circulating tank 3, and a third control valve 9 is arranged on the communicating pipeline and is used for introducing the waste liquid with the metal ion concentration lower than the standard value in the cation exchange device 4 into the circulating tank 3;
the waste liquid recovery tank 5, the inlet of waste liquid recovery tank 5 with the liquid outlet intercommunication of temporary storage tank 2, and this communicating pipe is gone up and is set up fourth control valve 10, be used for with the waste liquid that metal ion concentration is higher than 5 times of standard value in the temporary storage tank 2 lets in waste liquid recovery tank 5.
The metal etching liquid recovery control system mainly comprises an etching process cavity 1, a metal ion concentration analyzer, a temporary storage tank 2, a waste liquid recovery tank 5, a circulation tank 3, a cation exchange device 4, a control valve and the like. After the etching process, the etching liquid (waste liquid) is recovered, detected by a metal ion concentration analyzer in a temporary storage tank 2, and if the metal ion concentration detection is not out of standard, the metal ion is introduced into a circulating tank 3 for reuse after filtration; if the concentration of the metal ions exceeds the standard, the metal ions are replaced by a cation exchange device 4 until the concentration meets the standard, and then the metal ions are pumped into a circulation tank 3, and finally the metal ions are filtered and reused; if the metal ion concentration detection is seriously out of standard, directly introducing the waste liquid into a waste liquid recovery tank 5 for subsequent recovery treatment. The control system can effectively reduce the consumption of etching liquid, recover metal and save cost; the stable operation of the system can keep the metal ion concentration of the etching liquid stable, and further ensures the etching uniformity; and meanwhile, the waste liquid discharge is reduced, and the environmental pollution is reduced.
In a further preferred embodiment, a first filtering device 13 is disposed on a communicating pipe between the liquid inlet of the temporary storage tank 2 and the waste liquid outlet of the etching process chamber 1, and a pressure sensor is disposed in the first filtering device 13. After the etching process, the etching liquid is recovered, and the etching liquid is filtered and then enters the temporary storage tank 2.
In a further preferred embodiment, a second filtering device 14 is disposed on a communicating pipe between the liquid outlet of the circulation tank 3 and the etching liquid inlet of the etching process chamber 1, and a pressure sensor is disposed in the second filtering device 14. The etching liquid flows out of the circulating groove 3, is filtered and then reenters the etching process cavity 1 for etching process. The accuracy of the first filter device 13 and the second filter device 14 in this embodiment is 0.1 μm, and pressure sensors are respectively disposed in the first filter device 13 and the second filter device 14, and are used for collecting the pressure values in the filter devices, and when the pressure sensors exceed 100psi, the filter replacement is prompted.
In order to ensure that the metal etching process is performed normally and stably, the embodiment further comprises an etching liquid supply device 6, wherein a liquid outlet of the etching liquid supply device 6 is communicated with a liquid inlet of the circulation tank 3, and a fifth control valve 11 is arranged on the communication pipeline and is used for supplying etching liquid to the circulation tank 3 through the etching liquid supply device 6 when the waste liquid in the circulation tank 3 is insufficient.
In this embodiment, the apparatus further includes a sixth control valve 12, where the sixth control valve 12 is disposed on the liquid outlet of the temporary storage tank 2, and the liquid outlet of the temporary storage tank 2 can be closed by the sixth control valve 12 to stop discharging the etching liquid.
In a preferred embodiment, as shown in fig. 2, a circulation pipeline is disposed in the cation exchange device 4, and two groups of cation exchange resins 15 are sequentially disposed in the circulation pipeline in the flowing direction of the liquid, so that the front and rear groups of cation exchange resins 15 can ensure that the displacement reaction in the device can be efficiently and thoroughly performed. In addition, the circulating pipeline also comprises a buffer tank 16, and the buffer tank 16 is arranged on the pipeline between the two groups of cation exchange resins 15; and a group of cation exchange resins are also arranged on the liquid outlet of the cation exchange device. In the specific implementation, after the data of the metal ion concentration analyzer is abnormal, the liquid can be discharged from the liquid outlet according to the capacity of the circulating pump 17 for at least 3 cycles, and the liquid passes through a group of cation exchange resins again during the liquid discharging, so that the data is ensured to be abnormal.
In this embodiment, the adsorption capacity of the metal ion of the cation exchange resin 15 is 0.02 ppm, and in the actual process, if the concentration of the metal ion of the etching solution does not change after multiple cycles, the cation exchange resin 15 is prompted to be replaced, and the used cation exchange resin 15 is intensively treated to recover the metal.
In this embodiment, in the process of recovering the waste liquid, the control valves at the liquid inlet and the liquid outlet of the cation exchange device 4 are both in a closed state, the inlet is closed to ensure no new waste liquid is introduced, the concentration in the cation exchange device 4 is not affected by the introduction of the new waste liquid, and after the single concentration reaches the standard, the outlet is opened for recycling to the recycling tank 3 after the continuous circulation for a fixed number of times.
In this embodiment, the temporary storage tank 2 and the cation exchange device 4 are both provided with metal ion concentration analyzers, and since the recovered waste liquid is a metal etching liquid, the recovered waste liquid needs to reach a level of 10 μg/L of metal ion concentration. The analysis accuracy of the metal concentration analyzer in this embodiment is 10 ppb.
Among them, the first control valve 7, the second control valve 8, the third control valve 9, the fourth control valve 10, the fifth control valve 11, and the sixth control valve 12 in the present embodiment are preferably pneumatic valves.
In this embodiment, the temporary storage tank 2 is gravity-guided, and the circulation tank 3, the etching liquid supply device 6 and the waste liquid recovery tank 5 are pneumatically controlled, and negative pressure liquid suction and positive pressure liquid discharge are performed.
The application also provides a control method of the metal etching liquid recovery control system, which comprises the following steps:
etching liquid is etched in the etching process cavity 1 and then discharged into the temporary storage tank 2 through a waste liquid outlet, and is detected by a metal ion concentration analyzer in the temporary storage tank 2;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank 2 is lower than a standard value, a first control valve 7 is opened, and the waste liquid in the temporary storage tank 2 is introduced into the circulating tank 3;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank 2 is higher than the standard value but lower than the standard value by 5 times, closing the first control valve 7, opening the second control valve 8, and introducing the waste liquid in the temporary storage tank 2 into the cation exchange device 4 for cation exchange;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank 2 is 5 times higher than the standard value, the second control valve 8 is closed, the fourth control valve 10 is opened, and the waste liquid in the temporary storage tank 2 is led into the waste liquid recovery tank 5.
In one embodiment, the control method further comprises: after the waste liquid enters the cation exchange device 4 for cation exchange, if the concentration of the metal ions collected by the metal ion concentration analyzer in the cation exchange device 4 is lower than a standard value, the third control valve 9 and the first control valve 7 are opened, and the waste liquid is introduced into the circulation tank 3.
In one embodiment, the control method further comprises: in the process of cation exchange of the waste liquid in the cation exchange device 4, the second control valve 8 and the third control valve 9 are in a closed state, no new waste liquid is guaranteed to enter, the concentration in the cation exchange device 4 is not affected by the new waste liquid, and after the single concentration reaches the standard, the outlet is opened for recycling to the recycling tank 3 after the continuous circulation for a fixed number of times.
According to the control method provided by the embodiment of the invention, after an etching process, etching liquid is recovered in the temporary storage tank 2, the etching liquid is detected in the temporary storage tank 2 by a metal ion concentration analyzer, and if the metal ion concentration detection is not out of standard, the etching liquid is introduced into the circulation tank 3 and is reused after being filtered; if the concentration of the metal ions exceeds the standard, the metal ions are replaced by a cation exchange device 4 until the concentration meets the standard, and then the metal ions are pumped into a circulation tank 3, and finally the metal ions are filtered and reused; if the metal ion concentration detection is seriously out of standard, directly introducing the waste liquid into a waste liquid recovery tank 5 for subsequent recovery treatment. The invention can effectively reduce the consumption of etching liquid and recycle metal, thereby saving cost; keeping the metal ion concentration of the etching liquid stable and etching uniformly; and meanwhile, the waste liquid discharge is reduced, and the environmental pollution is reduced.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. A metal etching liquid recovery control system, characterized by comprising:
the etching process cavity is used for carrying out an etching process;
the liquid inlet of the temporary storage tank is communicated with the liquid outlet of the etching process cavity and is used for storing the liquid waste generated by the etching process, and a metal ion concentration analyzer is arranged in the temporary storage tank and is used for collecting the concentration of metal ions in the liquid waste;
the liquid outlet of the circulating groove is communicated with the etching liquid inlet of the etching process cavity, and the liquid outlet of the circulating groove is used for leading the waste liquid with the metal ion concentration lower than the standard value in the temporary storage groove into the etching process cavity again for etching process;
the liquid inlet of the cation exchange device is communicated with the liquid outlet of the temporary storage tank, and a second control valve is arranged on the communicating pipeline and used for introducing the waste liquid with the metal ion concentration higher than the standard value but lower than 5 times of the standard value in the temporary storage tank into the cation exchange device; the cation exchange device is internally provided with a metal ion concentration analyzer which is used for collecting the concentration of metal ions in the waste liquid after cation exchange; the liquid outlet of the cation exchange device is communicated with the liquid inlet of the circulating tank, and a third control valve is arranged on the communicating pipe and used for introducing the waste liquid with the metal ion concentration lower than the standard value in the cation exchange device into the circulating tank;
the liquid inlet of the liquid waste recovery tank is communicated with the liquid outlet of the temporary storage tank, and a fourth control valve is arranged on the communicating pipeline and used for introducing the liquid waste with the metal ion concentration higher than the standard value by 5 times in the temporary storage tank into the liquid waste recovery tank;
a first filtering device is arranged on a communicating pipe between a liquid inlet of the temporary storage groove and a waste liquid outlet of the etching process cavity, and a pressure sensor is arranged in the first filtering device;
a second filtering device is arranged on a communicating pipe between a liquid outlet of the circulating groove and an etching liquid inlet of the etching process cavity, and a pressure sensor is arranged in the second filtering device;
the cation exchange device is internally provided with a circulating pipeline, and two groups of cation exchange resins are sequentially arranged in the circulating pipeline in the flowing direction of liquid; the liquid outlet of the cation exchange device is also provided with a group of cation exchange resins;
the circulating pipeline also comprises a buffer tank, and the buffer tank is arranged on the pipeline between the two groups of cation exchange resins;
the control method of the metal etching liquid recovery control system comprises the following steps:
etching liquid is etched in the etching process cavity, then is discharged into the temporary storage groove through the waste liquid outlet, and is detected by the metal ion concentration analyzer in the temporary storage groove;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is lower than a standard value, a first control valve is opened, and the waste liquid in the temporary storage tank is introduced into the circulating tank;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is higher than the standard value but lower than the standard value by 5 times, closing the first control valve, opening the second control valve, and introducing the waste liquid in the temporary storage tank into a cation exchange device for cation exchange;
when the concentration of the metal ions collected by the metal ion concentration analyzer in the temporary storage tank is 5 times higher than the standard value, closing the second control valve, opening the fourth control valve, and introducing the waste liquid in the temporary storage tank into the waste liquid recovery tank;
further comprises: and after the waste liquid enters the cation exchange device for cation exchange, if the concentration of the metal ions collected by the metal ion concentration analyzer in the cation exchange device is lower than a standard value, continuing to perform at least 3 cycles, opening a third control valve and a first control valve, and introducing the waste liquid into the circulation tank.
2. The metal etching liquid recovery control system according to claim 1, further comprising an etching liquid supply device, wherein a liquid outlet of the etching liquid supply device is communicated with a liquid inlet of the circulation tank, and a fifth control valve is arranged on the communicating pipeline.
3. The metal etching solution recycling control system according to claim 1, further comprising a sixth control valve, wherein the sixth control valve is disposed on a liquid outlet of the temporary storage tank.
4. The metal etching liquid recovery control system according to claim 1, wherein the control method further comprises:
in the process of cation exchange of the waste liquid in the cation exchange device, the second control valve and the third control valve are both in a closed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311648392.8A CN117344309B (en) | 2023-12-05 | 2023-12-05 | Metal etching liquid recovery control system and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311648392.8A CN117344309B (en) | 2023-12-05 | 2023-12-05 | Metal etching liquid recovery control system and control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117344309A CN117344309A (en) | 2024-01-05 |
| CN117344309B true CN117344309B (en) | 2024-03-01 |
Family
ID=89357924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311648392.8A Active CN117344309B (en) | 2023-12-05 | 2023-12-05 | Metal etching liquid recovery control system and control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117344309B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122024A (en) * | 2006-05-18 | 2008-02-13 | 住友精密工业株式会社 | Processing device for processing fluid and substrate processing device having the same |
| KR20100044397A (en) * | 2008-10-22 | 2010-04-30 | 주식회사 에스씨티 | Recycling method and apparatus of waste etching solution |
| CN102127765A (en) * | 2011-01-14 | 2011-07-20 | 广州有色金属研究院 | Circularly regenerating system for acidic waste etching solution |
| CN109023375A (en) * | 2018-08-30 | 2018-12-18 | 深圳市华星光电技术有限公司 | Etch fluid circulation and Etaching device |
| CN113046563A (en) * | 2021-03-11 | 2021-06-29 | 苏州晶洲装备科技有限公司 | Etching liquid regeneration device, etching system device and etching method |
| CN115449793A (en) * | 2021-06-09 | 2022-12-09 | 三福化工股份有限公司 | Metal layer etching solution and recovery equipment thereof |
-
2023
- 2023-12-05 CN CN202311648392.8A patent/CN117344309B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122024A (en) * | 2006-05-18 | 2008-02-13 | 住友精密工业株式会社 | Processing device for processing fluid and substrate processing device having the same |
| KR20100044397A (en) * | 2008-10-22 | 2010-04-30 | 주식회사 에스씨티 | Recycling method and apparatus of waste etching solution |
| CN102127765A (en) * | 2011-01-14 | 2011-07-20 | 广州有色金属研究院 | Circularly regenerating system for acidic waste etching solution |
| CN109023375A (en) * | 2018-08-30 | 2018-12-18 | 深圳市华星光电技术有限公司 | Etch fluid circulation and Etaching device |
| CN113046563A (en) * | 2021-03-11 | 2021-06-29 | 苏州晶洲装备科技有限公司 | Etching liquid regeneration device, etching system device and etching method |
| CN115449793A (en) * | 2021-06-09 | 2022-12-09 | 三福化工股份有限公司 | Metal layer etching solution and recovery equipment thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117344309A (en) | 2024-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2023071826A1 (en) | Wet etching device and wet etching method | |
| KR20010071297A (en) | Apparatus and method for recovering photoresist developers and strippers | |
| CN117344309B (en) | Metal etching liquid recovery control system and control method | |
| CN101417943B (en) | Simple method and system for refining mother liquor by high efficiency recovery and utilization of PTA apparatus | |
| CN211112736U (en) | Washing machine system capable of realizing water quality monitoring and reclaimed water recycling | |
| CN204685622U (en) | A kind of silicon wafer cleaner pure water recovery system | |
| CN110818168A (en) | Smoke washing wastewater zero-discharge technical treatment system and method | |
| CN216764602U (en) | PA6 polymerization extract water's processing apparatus and system | |
| CN108911287A (en) | Cleaning solution process of regenerating and device for IC manufacturing | |
| CN104743638A (en) | Resuscitation treatment equipment for iron poisoning of cation exchange resin | |
| CN115028283A (en) | Nuclear power station condensate fine treatment system and control method thereof | |
| JPH1167715A (en) | Bubble separator for manufacture of semiconductor device, processing-solution supply apparatus for manufacture of semiconductor device using separator, and drive method therefor | |
| CN207986892U (en) | A kind of nitrate treatment device in pickling waste waters processing system rich in nitrate | |
| CN112174439A (en) | LED chip manufacturing industry wastewater treatment engineering process | |
| KR100578553B1 (en) | Apparatus and process for regeneration by electricity the ion change resin : ree?? system | |
| CN219950598U (en) | Reverse osmosis water treatment system | |
| CN220467658U (en) | Passivation solution waste water recycling integrated treatment equipment | |
| CN211920947U (en) | Adsorb dechlorination system | |
| KR200370586Y1 (en) | Exhaust control system of installation production | |
| CN214243860U (en) | Wastewater circulating treatment system | |
| US20230090558A1 (en) | Pre-wet system having pneumatic circulation | |
| CN211688637U (en) | Dicing knife cleaning cooling liquid recycling device | |
| CN220597663U (en) | Water saving system for electrophoresis process | |
| CN218969018U (en) | High recovery rate pure water treatment device | |
| CN217676937U (en) | Developer solution waste liquid cyclic utilization device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |